NCP59300, NCV59300 Series 3.0 A, Very Low-Dropout (VLDO) Fast Transient Response Regulator series The NCP59300 series are high precision, very low dropout (VLDO), low ground current positive voltage regulators that are capable of providing an output current in excess of 3.0 A with a typical dropout voltage lower than 300 mV at 3.0 A load current. The devices are stable with ceramic output capacitors. This series consists of fixed voltage versions. The NCP59300 series can withstand up to 18 V max input voltage. Internal protection features consist of output current limiting, built−in thermal shutdown and reverse output current protection. Logic level enable and error flag pins are available on the 5−pin version. The NCP59300 series fixed voltage devices are available in D2PAK−5 package, with devices in D2PAK−3 package planned in the future. http://onsemi.com D2PAK 5 CASE 936A D2PAK CASE 936 MARKING DIAGRAMS D2PAK TAB Features y 59301−xx AWLYWWG 1 D2PAK3 TAB Applications Consumer and Industrial Equipment Point of Regulation Servers and Networking Equipment FPGA, DSP and Logic Power supplies Switching Power Supply Post Regulation Battery Chargers Functional Replacement for Industry Standard MIC29300, MIC39300, MIC37300 Fixed Voltage Devices 1 VIN xx y A WL Y WW G VOUT y 59300−xx AWLYWWG GND Output Current in Excess of 3.0 A 300 mV Typical Dropout Voltage at 3.0 A Fixed Output Voltage Options Low Ground Current Fast Transient Response Stable with Ceramic Output Capacitor Logic Compatible Enable and Error Flag Pins Current Limit, Reverse Current and Thermal Shutdown Protection Operation up to 13.5 V Input Voltage NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These are Pb−Free Devices EN VIN GND VOUT FLG = Voltage Version = P (NCP), V (NCV) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. Semiconductor Components Industries, LLC, 2013 May, 2013 − Rev. 4 1 Publication Order Number: NCP59300/D NCP59300, NCV59300 Series TYPICAL APPLICATIONS VIN = 3.0 V + CIN NCP59301 VIN VOUT EN FLG VOUT = 2.5 V VIN = 3.0 V + 100k + COUT 47 mF, Ceramic GND CIN NCP59300 VIN VOUT = 2.5 V VOUT + COUT 47 mF, Ceramic GND Figure 2. Fixed 2.5 V Regulator in D2PAK−3 Package Figure 1. Fixed 2.5 V Regulator with Error Flag PIN FUNCTION DESCRIPTION Pin Number D2PAK−5 Pin Number D2PAK−3 Pin Name 1 − EN Enable Input: CMOS and TTL logic compatible. Logic high = enable; Logic low = shutdown. 2 1 VIN Input voltage which supplies both the internal circuitry and the current to the output load 3 2 GND Ground TAB TAB TAB TAB is connected to ground. 4 3 VOUT 5 − FLG Pin Function Linear Regulator Output. Error Flag Open collector output. Active−low indicates an output fault condition. ABSOLUTE MAXIMUM RATINGS Symbol Rating Value Unit VIN Supply Voltage 0 to 18 V VEN Enable Input Voltage 0 to 18 V VFLG Error Flag Open Collector Output Maximum Voltage 0 to 18 V VOUT – VIN Reverse VOUT – VIN Voltage (EN = Shutdown or VIN = 0 V) (Note 1) 0 to 6.5 V PD Power Dissipation (Notes 2 and 3) Internally Limited TJ Junction Temperature –40 v TJ v +125 C TS Storage Temperature –65 v TJ v +150 C 2000 200 V ESD Rating (Notes 4 and 5) Human Body Model Machine Model Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: All voltages are referenced to GND pin unless otherwise noted. 1. The ENABLE pin input voltage must be 0.8 V or VIN must be connected to ground potential. 2. PD(max) = (TJ(max) – TA) / RqJA, where RqJA depends upon the printed circuit board layout. 3. This protection is not guaranteed outside the Recommended Operating Conditions. 4. Devices are ESD sensitive. Handling precautions recommended.. 5. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model (HBM) tested per AEC*Q100*002 (EIA/JESD22*A114C) ESD Machine Model (MM) tested per AEC*Q100*003 (EIA/JESD22*A115C) This device contains latch*up protection and exceeds 100 mA per JEDEC Standard JESD78. http://onsemi.com 2 NCP59300, NCV59300 Series RECOMMENDED OPERATING CONDITIONS (Note 6) Symbol Rating Value Unit 2.24 to 13.5 V Enable Input Voltage 0 to 13.5 V VFLG Error Flag Open Collector Voltage 0 to 13.5 V TJ Junction Temperature –40 v TJ v +125 C VIN Supply Voltage VEN 6. The device is not guaranteed to function outside it’s Recommended operating conditions. ELECTRICAL CHARACTERISTICS (TJ = 25C with VIN = VOUT nominal + 1 V; VEN = VIN; IL = 10 mA; bold values indicate –40C < TJ < +125C, unless noted.) Parameter Output Voltage Accuracy Conditions Min IL = 10 mA −1.5 10 mA < IOUT < 3 A , VOUT nominal + 1 v VIN v 13.5 V −2.5 Typ Max Unit +1.5 % +2.5 % Output Voltage Line Regulation VIN = VOUT nominal + 1.0 V to 13.5 V; IL = 10 mA 0.02 0.5 % Output Voltage Load Regulation IL = 10 mA to 3 A 0.2 1 % VIN – VOUT Dropout Voltage (Note 7) IL = 1.5 A 175 350 mV IL = 3 A 300 500 mV Ground Pin Current (Note 8) IL = 3 A 60 90 120 mA Ground Pin Current in Shutdown VEN v 0.5 V 1.0 5 mA Overload Protection Current Limit VOUT = 0 V 3.5 5 A Output Voltage Start−up Slope VEN = VIN, IOUT = 10 mA, COUT = 47 mF (Note 9) 40 200 ms/V ENABLE INPUT Enable Input Signal Levels Regulator enable V 1.8 Regulator shutdown Enable pin Input Current VEN v 0.8 V (Regulator shutdown) 6.5 V > VEN w 1.8 V (Regulator enable) 1 15 0.8 V 2 4 mA 30 40 mA 1 2 mA 400 500 mV FLAG OUTPUT Iflg(leak) Voh = 6 V VFLG(LO) VIN = 2.24 V, IFLG = 250 mA VFLG Low Threshold, % of VOUT 210 93 95 % Hysteresis 2 % High Threshold, % of VOUT 97 99.2 % 7. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1 V. For output voltages below 1.74 V, dropout voltage specification does not apply due to a minimum input operating voltage of 2.24 V. 8. IIN = IGND + IOUT. 9. Fixed Voltage Device Start−up Time = Output Voltage Start−up Slope x VOUT Nominal. Package Conditions / PCB Footprint D2PAK–3, Junction−to−Case Thermal Resistance RqJC = 2.1C/W D2PAK–5, Junction−to−Case RqJC = 2.1C/W mm2 D2PAK–3, Junction−to−Air PCB with 100 2.0 oz Copper Heat Spreading Area RqJA = 52C/W D2PAK–5, Junction−to−Air PCB with 100 mm2 2.0 oz Copper Heat Spreading Area RqJA = 52C/W http://onsemi.com 3 NCP59300, NCV59300 Series TYPICAL CHARACTERISTICS TJ = 25C if not otherwise noted 100 100 90 90 80 80 70 COUT = 100 mF Ceramic 60 PSRR (dB) PSRR (dB) 70 50 40 COUT = 47 mF Ceramic 30 COUT = 100 mF Ceramic 60 50 40 COUT = 47 mF Ceramic 30 20 20 VIN = 3.5 V 10 VOUT = 2.5 V, IOUT = 3 A, CIN = 0 0 10 100 1000 10k FREQUENCY (Hz) 100k VIN = 3.5 V 10 VOUT = 2.5 V, IOUT = 1 A, CIN = 0 0 10 100 1000 10k FREQUENCY (Hz) 1M Figure 3. Power Supply Rejection Ratio 450 VOUTnom = 2.5 V 450 350 350 DROPOUT (mV) DROPOUT (mV) VOUTnom = 2.5 V IOUT = 3 A 400 400 300 250 200 150 300 250 200 150 100 100 50 50 0 0.0 0.5 1.0 1.5 2.0 2.5 0 −50 3.0 −30 −10 10 30 50 70 90 110 OUTPUT CURRENT (A) TEMPERATURE (C) Figure 5. Dropout Voltage vs. Output Current Figure 6. Dropout Voltage vs. Temperature 3.0 130 2.5 10 mA 2.0 GROUND CURRENT (mA) 2.5 OUTPUT VOLTAGE (V) 1M Figure 4. Power Supply Rejection Ratio 500 10 mA 1A 3A 1.5 1.0 2A 0.5 0.0 100k 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 SUPPLY VOLTAGE (V) 2.8 2 1.5 1 0.5 0 3 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 SUPPLY VOLTAGE (V) Figure 7. Dropout Characteristics (2.5 V) Figure 8. Ground Current vs. Supply Voltage (2.5 V) http://onsemi.com 4 5 NCP59300, NCV59300 Series TYPICAL CHARACTERISTICS TJ = 25C if not otherwise noted 120 1.2 GROUND CURRENT (mA) 1.4 GROUND CURRENT (mA) 140 100 3A 80 60 40 2A 20 1A 0 0 1 2 3 SUPPLY VOLTAGE (V) 4 1 0.8 0.6 0.4 0.2 0 −50 5 35 80 GROUND CURRENT (mA) GROUND CURRENT (mA) 90 30 25 20 15 10 VIN = 3.5 V VOUT = 2.5 V, IOUT = 1.5 A −30 −10 90 110 10 30 50 70 90 110 130 70 60 50 40 30 20 10 10 30 50 70 TEMPERATURE (C) −10 Figure 10. Ground Current vs. Temperature 40 0 −50 −30 TEMPERATURE (C) Figure 9. Ground Current vs. Supply Voltage (2.5 V) 5 VIN = 3.5 V VOUT = 2.5 V, IOUT = 10 mA 0 −50 130 Figure 11. Ground Current vs. Temperature VIN = 3.5 V VOUT = 2.5 V, IOUT = 3 A −30 −10 10 30 50 70 TEMPERATURE (C) 90 110 130 Figure 12. Ground Current vs. Temperature 2.6 22 ENABLE CURRENT (mA) OUTPUT VOLTAGE (V) 20 2.55 2.5 2.45 2.4 −50 VOUTNOM = 2.5 V IOUT = 10 mA −30 −10 10 18 VEN = 6.5 V 16 14 12 10 8 6 4 VEN = 1.8 V 2 30 50 70 90 110 0 −50 130 −30 −10 10 30 50 70 90 110 TEMPERATURE (C) TEMPERATURE (C) Figure 13. Output Voltage vs. Temperature Figure 14. Enable Pin Input Current vs. Temperature http://onsemi.com 5 130 NCP59300, NCV59300 Series FUNCTIONAL CHARACTERISTICS Figure 15. Load Transient Response Figure 16. Line Transient Response Figure 17. Enable Transient Response http://onsemi.com 6 NCP59300, NCV59300 Series APPLICATIONS INFORMATION Output Capacitor and Stability Overcurrent and Reverse Output Current Protection The NCP59300 series requires an output capacitor for stable operation. The NCP59300 series is designed to operate with ceramic output capacitors. The recommended output capacitance value is 47 mF or greater. Such capacitors help to improve transient response and noise reduction at high frequency. The NCP59300 regulator is fully protected from damage due to output current overload conditions. When NCP59300 output is overloaded, Output Current limiting is provided. This limiting is linear; output current during overload conditions is constant. These features are advantageous for powering FPGAs and other ICs having current consumption higher than nominal during their startup. Thermal shutdown disables the NCP59300 device when the die temperature exceeds the maximum safe operating temperature. When NCP59300 is disabled and (VOUT – VIN) voltage difference is less than 6.5 V in the application, the output structure of these regulators is able to withstand output voltage (backup battery as example) to be applied without reverse current flow. Of course the additional current flowing through the Feedback resistor divider inside the NCP59300 Fixed voltage devices (30 mA typically at nominal output voltage) needs to be included in the backup battery discharging calculations. Input Capacitor An input capacitor of 1.0 mF or greater is recommended when the device is more than 4 inches away from the bulk supply capacitance, or when the supply is a battery. Small, surface−mount chip capacitors can be used for the bypassing. The capacitor should be place within 1 inch of the device for optimal performance. Larger values will help to improve ripple rejection by bypassing the input of the regulator, further improving the integrity of the output voltage. Minimum Load Current The NCP59300 regulator is specified between finite loads. A 10 mA minimum load current is necessary for proper operation. Thermal Considerations The power handling capability of the device is limited by the maximum rated junction temperature (125C). The PD total power dissipated by the device has two components, Input to output voltage differential multiplied by Output current and Input voltage multiplied by GND pin current. Error Flag Some NCP59300 series members feature an error flag circuit that monitors the output voltage and signals an error condition when the voltage is 5% below the nominal output voltage. The error flag is an open−collector output that can sink up to 5 mA typically during a VOUT fault condition. The FLG output is overload protected when a short circuit of the pullup load resistor occurs in the application. This is guaranteed in the full range of FLG output voltage Max ratings (see Max Ratings table). Please be aware operation in this mode is not recommended, power dissipated in the device can impact on output voltage precision and other device characteristics. P D + ǒV IN * V OUTǓ @ I OUT ) V IN @ I GND (eq. 1) The GND pin current value can be found in Electrical Characteristics table and in Typical Characteristics graphs. The Junction temperature TJ is T J + T A ) P D @ R qJA (eq. 2) where TA is ambient temperature and RqJA is the Junction to Ambient Thermal Resistance of the NCP/NCV59300 device mounted on the specific PCB. To maximize efficiency of the application and minimize thermal power dissipation of the device it is convenient to use the Input to output voltage differential as low as possible. The static typical dropout characteristics for various output voltage and output current can be found in the Typical Characteristics graphs. Enable Input Some NCP59300 series members also feature an enable input for on/off control of the device. It’s shutdown state draws “zero” current from input voltage supply (only microamperes of leakage). The enable input is TTL/CMOS compatible for simple logic interface, but can be connected up to VIN. http://onsemi.com 7 NCP59300, NCV59300 Series ORDERING INFORMATION Output Current Output Voltage Junction Temp. Range Package Shipping† NCP59300DS18R4G 3.0 A 1.8 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCP59300DS25R4G 3.0 A 2.5 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCP59300DS28R4G 3.0 A 2.8 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCP59300DS30R4G 3.0 A 3.0 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCP59300DS33R4G 3.0 A 3.3 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCP59300DS50R4G 3.0 A 5.0 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCV59300DS18R4G* 3.0 A 1.8 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCV59300DS25R4G* 3.0 A 2.5 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCV59300DS28R4G* 3.0 A 2.8 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCV59300DS30R4G* 3.0 A 3.0 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCV59300DS33R4G* 3.0 A 3.3 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCV59300DS50R4G* 3.0 A 5.0 V −40C to +125C D2PAK−3 (Pb−Free) Under Development Contact Sales Office NCP59301DS18R4G 3.0 A 1.8 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCP59301DS25R4G 3.0 A 2.5 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCP59301DS28R4G 3.0 A 2.8 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCP59301DS30R4G 3.0 A 3.0 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCP59301DS33R4G 3.0 A 3.3 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCP59301DS50R4G 3.0 A 5.0 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59301DS18R4G* 3.0 A 1.8 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59301DS25R4G* 3.0 A 2.5 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59301DS28R4G* 3.0 A 2.8 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59301DS30R4G* 3.0 A 3.0 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59301DS33R4G* 3.0 A 3.3 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel NCV59301DS50R4G* 3.0 A 5.0 V −40C to +125C D2PAK−5 (Pb−Free) 800 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. http://onsemi.com 8 NCP59300, NCV59300 Series PACKAGE DIMENSIONS D2PAK CASE 936−03 ISSUE D T C A K S B J 2 ES DETAIL C DETAIL C 3 F G SIDE VIEW 2X TOP VIEW D 0.010 (0.254) N M P R C OPTIONAL CHAMFER V H 1 U ED OPTIONAL CHAMFER T TERMINAL 4 L SIDE VIEW BOTTOM VIEW DUAL GAUGE CONSTRUCTION NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 6. SINGLE GAUGE DESIGN WILL BE SHIPPED AFTER FPCN EXPIRATION IN OCTOBER 2011. SINGLE GAUGE CONSTRUCTION T M T SEATING PLANE BOTTOM VIEW DETAIL C OPTIONAL CONSTRUCTIONS SOLDERING FOOTPRINT* 10.490 8.380 16.155 2X 3.504 2X 1.016 5.080 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 DIM A B C D ED ES F G H J K L M N P R S U V INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.018 0.026 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 0.457 0.660 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN NCP59300, NCV59300 Series PACKAGE DIMENSIONS D2PAK 5 CASE 936A−02 ISSUE C −T− OPTIONAL CHAMFER A TERMINAL 6 E U S K B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. V H 1 2 3 4 5 M D 0.010 (0.254) M T INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN DIM A B C D E G H K L M N P R S U V P N G L R C SOLDERING FOOTPRINT 8.38 0.33 MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN 1.702 0.067 10.66 0.42 16.02 0.63 3.05 0.12 SCALE 3:1 1.016 0.04 mm Ǔ ǒinches 5−LEAD D2PAK ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 10 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP59300/D