ON MC10EP195FAR2 3.3v ecl programmable delay chip Datasheet

MC10EP195, MC100EP195
3.3V ECL Programmable
Delay Chip
The MC10/100EP195 is a Programmable Delay Chip (PDC)
designed primarily for clock deskewing and timing adjustment. It
provides variable delay of a differential NECL/PECL input transition.
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The delay section consists of a programmable matrix of gates and
multiplexers as shown in the logic diagram, Figure 3. The delay
increment of the EP195 has a digitally selectable resolution of about
MARKING
DIAGRAM*
10 ps and a net range of up to 10.2 ns. The required delay is selected by
the 10 data select inputs D[9:0] values and controlled by the LEN
(pin 10). A LOW level on LEN allows a transparent LOAD mode of
MCXXX
real time delay values by D[9:0]. A LOW to HIGH transition on LEN
EP195
will LOCK and HOLD current values present against any subsequent
AWLYYWWG
changes in D[10:0]. The approximate delay values for varying tap
32
LQFP−32
numbers correlating to D0 (LSB) through D9 (MSB) are shown in
FA SUFFIX
Table 6 and Figure 4.
1
CASE 873A
Because the EP195 is designed using a chain of multiplexers it has a
fixed minimum delay of 2.2 ns. An additional pin D10 is provided for
controlling Pins 14 and 15, CASCADE and CASCADE, also latched
by LEN, in cascading multiple PDCs for increased programmable
1
range. The cascade logic allows full control of multiple PDCs.
MCXXX
1 32
Switching devices from all “1” states on D[0:9] with SETMAX LOW
EP195
QFN32
AWLYYWWG
to all “0” states on D[0:9] with SETMAX HIGH will increase the
MN SUFFIX
G
delay equivalent to “D0”, the minimum increment.
CASE 488AM
Select input pins D[10:0] may be threshold controlled by
combinations of interconnects between VEF (pin 7) and VCF (pin 8)
XXX
= 10 or 100
for LVCMOS, ECL, or LVTTL level signals. For LVCMOS input
A
= Assembly Location
levels, leave VCF and VEF open. For ECL operation, short VCF and
WL, L = Wafer Lot
VEF (Pins 7 and 8). For LVTTL level operation, connect a 1.5 V
YY, Y
= Year
supply reference to VCF and leave open VEF pin. The 1.5 V reference
WW, W = Work Week
G or G = Pb−Free Package
voltage to VCF pin can be accomplished by placing a 2.2 kW resistor
(Note: Microdot may be in either location)
between VCF and VEE for a 3.3 V power supply.
*For additional marking information, refer to
The VBB pin, an internally generated voltage supply, is available to
Application Note AND8002/D.
this device only. For single−ended input conditions, the unused
differential input is connected to VBB as a switching reference voltage.
ORDERING INFORMATION
VBB may also rebias AC coupled inputs. When used, decouple VBB
See detailed ordering and shipping information in the package
and VCC via a 0.01 mF capacitor and limit current sourcing or sinking
dimensions section on page 17 of this data sheet.
to 0.5 mA. When not used, VBB should be left open.
The 100 Series contains temperature compensation.
• Maximum Input Clock Frequency >1.2 GHz Typical
• Open Input Default State
• Programmable Range: 0 ns to 10 ns
• Safety Clamp on Inputs
• Delay Range: 2.2 ns to 12.2 ns
• A Logic High on the EN Pin Will Force Q to Logic
Low
• 10 ps Increments
• D[10:0] Can Accept Either ECL, LVCMOS, or LVTTL
• PECL Mode Operating Range:
Inputs
VCC = 3.0 V to 3.6 V with VEE = 0 V
• VBB Output Reference Voltage
• NECL Mode Operating Range:
• Pb−Free Packages are Available
VCC = 0 V with VEE = −3.0 V to −3.6 V
© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 16
1
Publication Order Number:
MC10EP195/D
MC10EP195, MC100EP195
VEE
D3
28
27
D1
D4
29
1
25
24
VEE
D9
2
23
D0
D10
3
22
VCC
IN
4
21
Q
20
Q
19
VCC
18
VCC
17
NC
IN
5
VBB
6
VEF
7
VCF
8
31
D2
D5
D6
D7
32
30
D8
26
MC10EP195
MC100EP195
9
10
11
12
13
14
16
15
EN
CASCADE
CASCADE
VCC
SETMAX
SETMIN
LEN
VEE
Figure 1. 32−Lead LQFP Pinout (Top View)
D5
D4
VEE
D3
30
29
28
27
26
D1
D6
31
D2
D7
32
25
D8
1
24
VEE
D9
2
23
D0
D10
3
22
VCC
IN
4
21
Q
IN
5
20
Q
VBB
6
19
VCC
VEF
7
18
VCC
VCF
8
17
NC
11
12
13
14
15
16
SETMIN
SETMAX
VCC
CASCADE
CASCADE
EN
VEE
10
LEN
9
Figure 2. 32−Lead QFN (Top View)
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2
Exposed Pad (EP)
MC10EP195, MC100EP195
Table 1. PIN DESCRIPTION
Pin
Name
I/O
Default State
Description
23, 25, 26, 27,
29, 30, 31, 32,
1, 2
D[0:9]
LVCMOS, LVTTL,
ECL Input
Low
Single−Ended Parallel Data Inputs [0:9]. Internal 75 kW to VEE.
(Note 1)
3
D[10]
LVCMOS, LVTTL,
ECL Input
Low
Single−Ended CASCADE/CASCADE Control Input. Internal 75 kW
to VEE. (Note 1)
4
IN
ECL Input
Low
Noninverted Differential Input. Internal 75 kW to VEE.
5
IN
ECL Input
High
Inverted Differential Input. Internal 75 kW to VEE and 36.5 kW to
VCC.
6
VBB
−
−
ECL Reference Voltage Output
7
VEF
−
−
Reference Voltage for ECL Mode Connection
8
VCF
−
−
LVCMOS, ECL, OR LVTTL Input Mode Select
9, 24, 28
VEE
−
−
Negative Supply Voltage. All VEE Pins must be Externally
Connected to Power Supply to Guarantee Proper Operation.
(Note 2)
13, 18, 19, 22
VCC
−
−
Positive Supply Voltage. All VCC Pins must be externally
Connected to Power Supply to Guarantee Proper Operation.
(Note 2)
10
LEN
ECL Input
Low
Single−ended D pins LOAD / HOLD input. Internal 75 kW to VEE.
11
SETMIN
ECL Input
Low
Single−ended Minimum Delay Set Logic Input. Internal 75 kW to
VEE. (Note 1)
12
SETMAX
ECL Input
Low
Single−ended Maximum Delay Set Logic Input. Internal 75 kW to
VEE. (Note 1)
14
CASCADE
ECL Output
−
Inverted Differential Cascade Output for D[10]. Typically Terminated
with 50 W to VTT = VCC − 2 V.
15
CASCADE
ECL Output
−
Noninverted Differential Cascade Output. for D[10] Typically
Terminated with 50 W to VTT = VCC − 2 V.
16
EN
ECL Input
Low
17
NC
−
−
No Connect. The NC Pin is Electrically Connected to the Die and
”MUST BE” Left Open
21
Q
ECL Output
−
Noninverted Differential Output. Typically Terminated with 50 W to
VTT = VCC − 2 V.
20
Q
ECL Output
−
Inverted Differential Output. Typically Terminated with 50 W to
VTT = VCC − 2 V.
Single−ended Output Enable Pin. Internal 75 kW to VEE.
1. SETMIN will override SETMAX if both are high. SETMAX and SETMIN will override all D[0:10] inputs.
2. All VCC and VEE pins must be externally connected to Power Supply to guarantee proper operation.
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3
MC10EP195, MC100EP195
Table 2. CONTROL PIN
Pin
State
EN
LOW (Note 3)
Function
HIGH
LEN
Output Holds Logic Low State
LOW (Note 3)
HIGH
SETMIN
SETMAX
D10
Input Signal is Propagated to the Output
Transparent or LOAD mode for real time delay values present on D[0:10].
LOCK and HOLD mode for delay values on D[0:10]; further changes on D[0:10]
are not recognized and do not affect delay.
LOW (Note 3)
Output Delay set by D[0:10]
HIGH
Set Minimum Output Delay
LOW (Note 3)
Output Delay set by D[0:10]
HIGH
Set Maximum Output Delay
LOW (Note 3)
CASCADE Output LOW, CASCADE Output HIGH
HIGH
CASCADE Output LOW, CASCADE Output HIGH
3. Internal pulldown resistor will provide a logic LOW if pin is left unconnected.
Table 3. CONTROL D[0:10] INTERFACE
VCF
VEF Pin (Note 4)
VCF
No Connect
VCF
1.5 V $ 100 mV
ECL Mode
LVCMOS Mode
LVTTL Mode (Note 5)
4. Short VCF (pin 8) and VEF (pin 7).
5. When Operating in LVTTL Mode, the reference voltage can be provided by connecting an external resistor, RCF (suggested resistor value
is 2.2 kW $5%), between VCF and VEE pins.
Table 4. DATA INPUT ALLOWED OPERATING VOLTAGE MODE TABLE
CONTROL DATA SELECT INPUTS PINS (D [0:10])
POWER SUPPLY
LVCMOS
LVTTL
LVPECL
LVNECL
PECL Mode Operating Range
YES
YES
YES
N/A
NECL Mode Operating Range
N/A
N/A
N/A
YES
Table 5. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
ESD Protection
(R1)
75 kW
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 6)
> 2 kV
> 100 V
> 2 kV
Pb Pkg
Pb−Free Pkg
LQFP−32
Level 2
Level 2
QFN−32
−
Level 1
Flammability Rating Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
1217 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
6. For additional information, see Application Note AND8003/D.
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4
5
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Figure 3. Logic Diagram
VEE
VEF
VCF
VBB
EN
IN
IN
R1
LEN
R1
SET MAX
SET MIN
R1
R1
R1
512
GD*
D9
R1
1
0
D10
Latch
R1
1
D8
R1
256
GD*
0
D7
1
CASCADE
CASCADE
R1
128
GD*
0
R1
64
GD*
D6
1
0
16
GD*
1
R1
D4
10 BIT LATCH
D5
1
0
R1
8
GD*
D3
1
0
R1
4
GD*
D2
1
0
R1
2
GD*
D1
1
0
*GD = (GATE DELAY) APPROXIMATELY 10 ps DELAY PER GATE
(MINIMUM FIXED DELAY APPROX. 2.2 ns)
R1
32
GD*
0
D0
R1
1
GD*
R1
1
0
1
GD*
1
0
Q
Q
MC10EP195, MC100EP195
MC10EP195, MC100EP195
Table 6. THEORETICAL DELAY VALUES
D(9:0) Value
SETMIN
SETMAX
Programmable Delay*
XXXXXXXXXX
H
L
0 ps
0000000000
L
L
0 ps
0000000001
L
L
10 ps
0000000010
L
L
20 ps
0000000011
L
L
30 ps
0000000100
L
L
40 ps
0000000101
L
L
50 ps
0000000110
L
L
60 ps
0000000111
L
L
70 ps
0000001000
L
L
80 ps
0000010000
L
L
160 ps
0000100000
L
L
320 ps
0001000000
L
L
640 ps
0010000000
L
L
1280 ps
0100000000
L
L
2560 ps
1000000000
L
L
5120 ps
1111111111
L
L
10230 ps
XXXXXXXXXX
L
H
10240 ps
*Fixed minimum delay not included.
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6
MC10EP195, MC100EP195
14000.0
13000.0
85°C
12000.0
11000.0
25°C
−40°C
DELAY ( ps)
10000.0
9000.0
VCC = 0 V
8000.0
VEE = −3.3 V
7000.0
6000.0
5000.0
4000.0
3000.0
2000.0
1000.0
0.0
0.0
100.0
200.0
300.0
400.0
500.0
600.0
700.0
800.0
900.0
1000.0
Decimal Value of Select Inputs (D[9:0])
Figure 4. Measured Delay vs. Select Inputs
Table 7. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
6
V
−6
V
6
−6
V
V
50
100
mA
mA
±0.5
mA
−40 to +85
°C
VCC
Positive Mode Power Supply
VEE = 0 V
VEE
Negative Mode Power Supply
VCC = 0 V
VI
Positive Mode Input Voltage
Negative Mode Input Voltage
VEE = 0 V
VCC = 0 V
Iout
Output Current
Continuous
Surge
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
LQFP−23
LQFP−23
80
55
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
LQFP−23
12 to 17
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
QFN−32
QFN−32
31
27
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
2S2P
QFN−32
12
°C/W
Tsol
Wave Solder
265
265
°C
Pb
Pb−Free
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
VI ≤ VCC
VI ≥ VEE
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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7
MC10EP195, MC100EP195
Table 8. 10EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 7)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Negative Power Supply Current
100
145
175
100
150
180
100
150
180
mA
VOH
Output HIGH Voltage (Note 8)
2165
2290
2415
2230
2355
2480
2290
2415
2540
mV
VOL
Output LOW Voltage (Note 8)
1365
1490
1615
1430
1555
1680
1490
1615
1740
mV
VIH
Input HIGH Voltage (Single−Ended)
VIL
Input LOW Voltage (Single−Ended)
VBB
ECL Output Voltage Reference
VCF
LVTTL Mode Input Detect Voltage
VEF
Reference Voltage for ECL Mode Connection
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 9)
IIH
Input HIGH Current (@ VIH)
IIL
Input LOW Current (@ VIL)
LVPECL
LVCMOS
LVTTL
2090
2000
2000
2415
3300
3300
2155
2000
2000
2480
3300
3300
2215
2000
2000
2540
3300
3300
LVPECL
LVCMOS
LVTTL
1365
0
0
1690
800
800
1430
0
0
1755
800
800
1490
0
0
1815
800
800
mV
1790
1890
1990
1855
1955
2055
1915
2015
2115
mV
1.4
1.5
1.6
1.4
1.5
1.6
1.4
1.5
1.6
V
1900
2020
2150
1875
2080
2150
1850
2130
2150
mV
3.3
2.0
3.3
2.0
3.3
V
150
mA
2.0
150
IN
IN
mV
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
7. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −0.3 V.
8. All loading with 50 W to VCC − 2.0 V.
9. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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8
MC10EP195, MC100EP195
Table 9. 10EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −3.3 V to −3.0 V (Note 10)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Negative Power Supply Current
100
145
175
100
150
180
100
150
180
mA
VOH
Output HIGH Voltage (Note 11)
−1135
−1010
−885
−1070
−945
−820
−1010
−885
−760
mV
VOL
Output LOW Voltage (Note 11)
−1935
−1810
−1685
−1870
−1745
−1620
−1810
−1685
−1560
mV
VIH
Input HIGH Voltage (Single−Ended)
LVNECL
−1210
−885
−1145
−820
−1085
−760
VIL
Input LOW Voltage (Single−Ended)
LVNECL
−1935
−1610
−1870
−1545
−1810
−1485
VBB
ECL Output Voltage Reference
−1510
−1410
−1310
−1445
−1345
−1245
−1385
−1285
−1185
mV
VEF
Reference Voltage for ECL Mode
Connection
−1400
−1280
−1250
−1425
−1220
−1250
−1450
−1170
−1250
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 12)
0.0
V
IIH
Input HIGH Current (@ VIH)
150
mA
IIL
Input LOW Current (@ VIL)
VEE+2.0
0.0
VEE+2.0
150
IN
IN
0.5
−150
0.0
VEE+2.0
150
0.5
−150
0.5
−150
mV
mV
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
10. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −0.3 V.
11. All loading with 50 W to VCC − 2.0 V.
12. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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9
MC10EP195, MC100EP195
Table 10. 100EP DC CHARACTERISTICS, PECL VCC = 3.3 V, VEE = 0 V (Note 13)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Negative Power Supply Current
100
135
160
100
140
170
100
145
175
mA
VOH
Output HIGH Voltage (Note 14)
2155
2280
2405
2155
2280
2405
2155
2280
2405
mV
VOL
Output LOW Voltage (Note 14)
1355
1480
1605
1355
1480
1605
1355
1480
1605
mV
VIH
Input HIGH Voltage (Single−Ended)
VIL
Input LOW Voltage (Single−Ended)
VBB
ECL Output Voltage Reference
VCF
LVTTL Mode Input Detect Voltage
VEF
Reference Voltage for ECL Mode Connection
VIHCMR
Input HIGH Voltage Common Mode Range
(Differential Configuration) (Note 15)
IIH
Input HIGH Current (@ VIH)
IIL
Input LOW Current (@ VIL)
LVPECL
CMOS
TTL
2075
2000
2000
2420
3300
3300
2075
2000
2000
2420
3300
3300
2075
2000
2000
2420
3300
3300
LVPECL
CMOS
TTL
1355
0
0
1675
800
800
1490
0
0
1675
800
800
1490
0
0
1675
800
800
mV
1775
1875
1975
1775
1875
1975
1775
1875
1975
mV
1.4
1.5
1.6
1.4
1.5
1.6
1.4
1.5
1.6
V
1900
2020
2150
1875
2080
2150
1850
2130
2150
mV
3.3
2.0
3.3
2.0
3.3
V
150
mA
2.0
150
IN
IN
mV
0.5
−150
150
0.5
−150
0.5
−150
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
13. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −0.3 V.
14. All loading with 50 W to VCC − 2.0 V.
15. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
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MC10EP195, MC100EP195
Table 11. 100EP DC CHARACTERISTICS, NECL VCC = 0 V, VEE = −3.3 V (Note 16)
−40°C
Symbol
Characteristic
25°C
85°C
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
IEE
Negative Power Supply Current
(Note 17)
100
135
160
100
140
170
100
145
175
mA
VOH
Output HIGH Voltage (Note 18)
−1145
−1020
−895
−1145
−1020
−895
−1145
−1020
−895
mV
VOL
Output LOW Voltage (Note 18)
−1945
−1820
−1695
−1945
−1820
−1695
−1945
−1820
−1695
mV
VIH
Input HIGH Voltage (Single−Ended)
LVNECL
−1225
−880
−1225
−880
−1225
−880
VIL
Input LOW Voltage (Single−Ended)
LVNECL
−1945
−1625
−1945
−1625
−1945
−1625
VBB
ECL Output Voltage Reference
−1525
−1425
−1325
−1525
−1425
−1325
−1525
−1425
−1325
mV
VEF
Reference Voltage for ECL Mode Connection
−1400
−1280
−1250
−1425
−1220
−1250
−1450
−1170
−1250
mV
VIHCMR
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 19)
0.0
V
IIH
Input HIGH Current (@ VIH)
150
mA
IIL
Input LOW Current (@ VIL)
VEE+2.0
0.0
VEE+2.0
150
IN
IN
0.5
−150
0.0
VEE+2.0
150
0.5
−150
0.5
−150
mV
mV
mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
16. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −0.3 V.
17. Required 500 lfpm air flow when using +5 V power supply. For (VCC − VEE) > 3.3 V, 5 W to 10 W in line with VEE required for maximum thermal
protection at elevated temperatures. Recommend VCC − VEE operation at ≤ 3.8 V.
18. All loading with 50 W to VCC − 2.0 V.
19. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential
input signal.
http://onsemi.com
11
MC10EP195, MC100EP195
Table 12. AC CHARACTERISTICS VCC = 0 V; VEE = −3.0 V to −3.6 V or VCC = 3.0 V to 3.6 V; VEE = 0 V (Note 20)
−40°C
Min
Characteristic
Symbol
Typ
25°C
Max
fmax
Maximum Frequency
tPLH
tPHL
Propagation Delay
IN to Q; D(0−10) = 0
IN to Q; D(0−10) = 1023
EN to Q; D(0−10) = 0
D0 to CASCADE
1650
9500
1600
300
2050
11500
2150
420
tRANGE
Programmable Range
tPD (max) − tPD (min)
7850
9450
Dt
Step Delay (Note 21)
Min
1.2
mono
Monotonicity (Note 27)
tSKEW
Duty Cycle Skew (Note 22)
ts
Setup Time
th
Hold Time
tR
Release Time
tjitter
RMS Random Clock Jitter @ 1.2 GHz
IN to Q; D(0:10) = 0 or SETMIN
IN to Q; D(0:10) = 1023 or SETMAX
VPP
Input Voltage Swing
(Differential Configuration)
tr
tf
Output Rise/Fall Time @ 50 MHz
20−80% (Q)
20−80% (CASCADE)
85°C
Max
Min
1.2
2450
13500
2600
500
1800
10000
1800
350
2200
12200
2300
450
8200
10000
13
27
44
90
130
312
590
1100
2250
4500
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
D7 High
D8 High
D9 High
Typ
Typ
Max
1.2
2600
14000
2800
550
1950
10800
2000
425
2350
13300
2500
525
8850
10950
Unit
GHz
2750
15800
3000
625
ps
ps
ps
14
30
47
97
140
335
650
1180
2400
4800
41
100
145
360
690
1300
2650
5300
TBD
25
|tPHL−tPLH|
25
D to LEN
D to IN (Note 23)
EN to IN (Note 24)
200
300
300
0
140
150
200
300
300
0
160
170
200
300
300
0
180
180
LEN to D
IN to EN (Note 25)
200
400
60
250
200
400
100
280
200
400
80
300
EN to IN (Note 26)
SET MAX to LEN
SET MIN to LEN
150
400
350
−25
200
275
150
400
350
−75
250
200
150
400
350
−50
300
225
0.86
0.89
ps
25
1.16
1.09
ps
ps
ps
ps
1.12
1.02
150
800
1200
150
800
1200
150
800
1200
85
100
100
140
135
200
85
110
110
150
135
200
95
130
125
170
155
220
mV
ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.
21. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations
of asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
22. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
23. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
24. This setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than
±75 mV to that IN/IN transition.
25. This hold time is the minimum time that EN must remain asserted after a negative going IN or positive going IN to prevent an output response
greater than ±75 mV to that IN/IN transition.
26. This release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets
the specified IN to Q propagation delay and transition times.
27. The monotonicity indicates the increasing delay value for each binary count increment on the control inputs D[9:0].
http://onsemi.com
12
MC10EP195, MC100EP195
IN
VINPP = VIH(D) − VIL(D)
IN
Q
VOUTPP = VOH(Q) − VOL(Q)
Q
tPHL
tPLH
Figure 5. AC Reference Measurement
Cascading Multiple EP195s
To increase the programmable range of the EP195,
internal cascade circuitry has been included. This circuitry
allows for the cascading of multiple EP195s without the
need for any external gating. Furthermore, this capability
requires only one more address line per added E195.
Obviously, cascading multiple programmable delay chips
will result in a larger programmable range: however, this
increase is at the expense of a longer minimum delay.
Figure 6 illustrates the interconnect scheme for cascading
two EP195s. As can be seen, this scheme can easily be
expanded for larger EP195 chains. The D10 input of the
EP195 is the CASCADE control pin. With the interconnect
scheme of Figure 6 when D10 is asserted, it signals the need
for a larger programmable range than is achievable with a
single device and switches output pin CASCADE HIGH and
pin CASCADE LOW. The A11 address can be added to
generate a cascade output for the next EP195. For a 2−device
configuration, A11 is not required.
Need if Chip #3 is used
ADDRESS BUS
A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
D7
D6
D5
D4
VEE
D3
D2
D7
D6
D5
D4
VEE
D3
D2
D1
VEE
D8
VEE
D9
D0
D9
D0
VCC
D10
Q
VCC
VEF
NC
VCF
CHIP #1
VCC
Figure 6. Cascading Interconnect Architecture
http://onsemi.com
VCC
NC
EN
VBB
CASCADE
VCC
13
Q
CASCADE
IN
VCC
CASCADE
CASCADE
VCC
SETMAX
LEN
VEE
VCF
SETMIN
VEF
Q
EN
CHIP #2
VBB
IN
SETMAX
IN
Q
SETMIN
IN
VCC
EP195
LEN
EP195
VEE
D10
INPUT
D1
D8
OUTPUT
MC10EP195, MC100EP195
(1111111111 on the A0—A9 address bus) D10 will be
asserted to signal the need to cascade the delay to the next
EP195 device. When D10 is asserted, the SET MIN pin of
chip #2 will be deasserted and SET MAX pin asserted
resulting in the device delay to be the maximum delay.
Table 13 shows the delay time of two EP195 chips in
cascade.
To expand this cascading scheme to more devices, one
simply needs to connect the D10 pin from the next chip to
the address bus and CASCADE outputs to the next chip in
the same manner as pictured in Figure 6. The only addition
to the logic is the increase of one line to the address bus for
cascade control of the second programmable delay chip.
An expansion of the latch section of the block diagram is
pictured in Figure 7. Use of this diagram will simplify the
explanation of how the cascade circuitry works. When D10
of chip #1 in Figure 6 is LOW this device’s
CASCADE output will also be low while the CASCADE
output will be high. In this condition the SET MIN pin of
chip #2 will be asserted HIGH and thus all of the latches of
chip #2 will be reset and the device will be set at its minimum
delay.
Chip #1, on the other hand, will have both SET MIN and
SET MAX deasserted so that its delay will be controlled
entirely by the address bus A0—A9. If the delay needed is
greater than can be achieved with 1023 gate delays
TO SELECT MULTIPLEXERS
SET
MIN
BIT 0
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
BIT 9
D0 Q0
D1 Q1
D2 Q2
D3 Q3
D4 Q4
D5 Q5
D6 Q6
D7 Q7
D8 Q8
D9 Q9
LEN
LEN
LEN
LEN
LEN
LEN
LEN
LEN
LEN
LEN
Set Reset
Set Reset
Set Reset
Set Reset
Set Reset
Set Reset
Set Reset
Set Reset
Set Reset
Set Reset
SET
MAX
Figure 7. Expansion of the Latch Section of the EP195 Block Diagram
http://onsemi.com
14
MC10EP195, MC100EP195
Table 13. Delay Value of Two EP195 Cascaded
VARIABLE INPUT TO CHIP #1 AND SETMIN FOR CHIP #2
INPUT FOR CHIP #1
Total
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Delay Value
Delay Value
0
0
0
0
0
0
0
0
0
0
0
0 ps
4400 ps
0
0
0
0
0
0
0
0
0
0
1
10 ps
4410 ps
0
0
0
0
0
0
0
0
0
1
0
20 ps
4420 ps
0
0
0
0
0
0
0
0
0
1
1
30 ps
4430 ps
0
0
0
0
0
0
0
0
1
0
0
40 ps
4440 ps
0
0
0
0
0
0
0
0
1
0
1
50 ps
4450 ps
0
0
0
0
0
0
0
0
1
1
0
60 ps
4460 ps
0
0
0
0
0
0
0
0
1
1
1
70 ps
4470 ps
0
0
0
0
0
0
0
1
0
0
0
80 ps
4480 ps
0
0
0
0
0
0
1
0
0
0
0
160 ps
4560 ps
0
0
0
0
0
1
0
0
0
0
0
220 ps
4720 ps
0
0
0
0
1
0
0
0
0
0
0
640 ps
5040 ps
0
0
0
1
0
0
0
0
0
0
0
1280 ps
5680 ps
0
0
1
0
0
0
0
0
0
0
0
2560 ps
6960 ps
0
1
0
0
0
0
0
0
0
0
0
5120 ps
9520 ps
0
1
1
1
1
1
1
1
1
1
1
10230 ps
14630 ps
VARIABLE INPUT TO CHIP #1 AND SETMAX FOR CHIP #2
INPUT FOR CHIP #1
Total
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
1
0
0
0
0
0
0
0
0
0
0
10240 ps
14640 ps
1
0
0
0
0
0
0
0
0
0
1
10250 ps
14650 ps
1
0
0
0
0
0
0
0
0
1
0
10260 ps
14660 ps
1
0
0
0
0
0
0
0
0
1
1
10270 ps
14670 ps
1
0
0
0
0
0
0
0
1
0
0
10280 ps
14680 ps
1
0
0
0
0
0
0
0
1
0
1
10290 ps
14690 ps
1
0
0
0
0
0
0
0
1
1
0
10300 ps
14700 ps
1
0
0
0
0
0
0
0
1
1
1
10310 ps
14710 ps
1
0
0
0
0
0
0
1
0
0
0
10320 ps
14720 ps
1
0
0
0
0
0
1
0
0
0
0
10400 ps
14800 ps
1
0
0
0
0
1
0
0
0
0
0
10560 ps
14960 ps
1
0
0
0
1
0
0
0
0
0
0
10880 ps
15280 ps
1
0
0
1
0
0
0
0
0
0
0
11520 ps
15920 ps
1
0
1
0
0
0
0
0
0
0
0
12800 ps
17200 ps
1
1
0
0
0
0
0
0
0
0
0
15360 ps
19760 ps
1
1
1
1
1
1
1
1
1
1
1
20470 ps
24870 ps
http://onsemi.com
15
Delay Value
Delay Value
MC10EP195, MC100EP195
Multi−Channel Deskewing
be sent through each EP195 as shown in Figure 8. One signal
channel can be used as reference and the other EP195s can be
used to adjust the delay to eliminate the timing skews. Nearly
any high−speed system can be fine−tuned (as small as 10 ps)
to reduce the skew to extremely tight tolerances.
The most practical application for EP195 is in multiple
channel delay matching. Slight differences in impedance and
cable length can create large timing skews within a high−speed
system. To deskew multiple signal channels, each channel can
EP195
IN
IN
Q
Q
#1
EP195
IN
IN
Q
Q
#2
EP195
IN
IN
Q
Q
#N
Control
Logic
Digital
Data
Figure 8. Multiple Channel Deskewing Diagram
Measure Unknown High Speed Device Delays
If the programmed delay through the second EP195 is too
long, the flip−flop output will be at logic high. On the other
hand, if the programmed delay through the second EP195 is
too short, the flip−flop output will be at a logic low. If the
programmed delay is correctly fine−tuned in the second
EP195, the flip−flop will bounce between logic high and logic
low. The digital code in the second EP195 can be directly
correlated into an accurate device delay.
EP195s provide a possible solution to measure the
unknown delay of a device with a high degree of precision.
By combining two EP195s and EP31 as shown in Figure 9,
the delay can be measured. The first EP195 can be set to
SETMIN and its output is used to drive the unknown delay
device, which in turn drives the input of a D flip−flop of
EP31. The second EP195 is triggered along with the first
EP195 and its output provides a clock signal for EP31.
The programmed delay of the second EP195 is varied to
detect the output edge from the unknown delay device.
EP195
CLOCK
IN
IN
CLOCK
Q
Q
Unknown Delay
Device
#1
D
Q
EP31
CLK
EP195
IN
IN
Q
Q
#2
Control
Logic
Figure 9. Multiple Channel Deskewing Diagram
http://onsemi.com
16
Q
MC10EP195, MC100EP195
Zo = 50 W
Q
D
Receiver
Device
Driver
Device
Q
D
Zo = 50 W
50 W
50 W
VTT
VTT = VCC − 2.0 V
Figure 10. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
ORDERING INFORMATION
Package
Shipping†
MC10EP195FA
LQFP−32
250 Units / Tray
MC10EP195FAG
LQFP−32
(Pb−Free)
250 Units / Tray
MC10EP195FAR2
LQFP−32
2000 / Tape & Reel
MC10EP195FAR2G
LQFP−32
(Pb−Free)
2000 / Tape & Reel
MC10EP195MNG
QFN−32
(Pb−Free)
74 Units / Rail
MC10EP195MNR4G
QFN−32
(Pb−Free)
1000 / Tape & Reel
MC100EP195FA
LQFP−32
250 Units / Tray
MC100EP195FAG
LQFP−32
(Pb−Free)
250 Units / Tray
MC100EP195FAR2
LQFP−32
2000 / Tape & Reel
MC100EP195FAR2G
LQFP−32
(Pb−Free)
2000 / Tape & Reel
MC100EP195MNG
QFN−32
(Pb−Free)
74 Units / Rail
MC100EP195MNR4G
QFN−32
(Pb−Free)
1000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
17
MC10EP195, MC100EP195
Resource Reference of Application Notes
AN1405/D
− ECL Clock Distribution Techniques
AN1406/D
− Designing with PECL (ECL at +5.0 V)
AN1503/D
− ECLinPSt I/O SPiCE Modeling Kit
AN1504/D
− Metastability and the ECLinPS Family
AN1568/D
− Interfacing Between LVDS and ECL
AN1672/D
− The ECL Translator Guide
AND8001/D
− Odd Number Counters Design
AND8002/D
− Marking and Date Codes
AND8020/D
− Termination of ECL Logic Devices
AND8066/D
− Interfacing with ECLinPS
AND8090/D
− AC Characteristics of ECL Devices
http://onsemi.com
18
MC10EP195, MC100EP195
PACKAGE DIMENSIONS
32
A1
A
−T−, −U−, −Z−
32 LEAD LQFP
CASE 873A−02
ISSUE C
4X
25
0.20 (0.008) AB T−U Z
1
AE
−U−
−T−
B
P
V
17
8
BASE
METAL
DETAIL Y
V1
AC T−U Z
AE
DETAIL Y
ÉÉ
ÉÉ
ÉÉ
9
−Z−
S1
4X
0.20 (0.008) AC T−U Z
F
S
8X
J
R
D
DETAIL AD
G
−AB−
SECTION AE−AE
C E
−AC−
H
W
K
X
DETAIL AD
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE −AB− IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS −T−, −U−, AND −Z− TO BE
DETERMINED AT DATUM PLANE −AB−.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE −AC−.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE −AB−.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
http://onsemi.com
19
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.450
0.750
12_ REF
0.090
0.160
0.400 BSC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.018
0.030
12_ REF
0.004
0.006
0.016 BSC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Q_
0.250 (0.010)
0.10 (0.004) AC
GAUGE PLANE
SEATING
PLANE
M_
M
N
9
0.20 (0.008)
B1
MC10EP195, MC100EP195
PACKAGE DIMENSIONS
QFN32 5*5*1 0.5 P
CASE 488AM−01
ISSUE O
PIN ONE
LOCATION
2X
ÉÉ
ÉÉ
0.15 C
2X
A
B
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
TOP VIEW
0.15 C
(A3)
0.10 C
A
32 X
0.08 C
C
L
32 X
9
D2
SEATING
PLANE
A1
SIDE VIEW
MILLIMETERS
MIN
NOM MAX
0.800 0.900 1.000
0.000 0.025 0.050
0.200 REF
0.180 0.250 0.300
5.00 BSC
2.950 3.100 3.250
5.00 BSC
2.950 3.100 3.250
0.500 BSC
0.200
−−−
−−−
0.300 0.400 0.500
SOLDERING FOOTPRINT*
EXPOSED PAD
16
K
5.30
32 X
17
3.20
8
32 X
E2
1
0.63
24
32
25
32 X b
0.10 C A B
e
3.20 5.30
0.05 C
BOTTOM VIEW
32 X
0.28
28 X
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ECLinPS is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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MC10EP195/D