AVAGO HLMP-CW70-LP0XX T-1 3/4 precision optical performance white led Datasheet

HLMP-CW70, HLMP-CW72
T-1 3/4 Precision Optical Performance White LED
Data Sheet
Description
Applications
This high intensity white LED lamp is based on InGaN
material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is
described by the coordinates x = 0.32, y = 0.32 using the
1931 CIE Chromaticity Diagram.
• Electronic Signs and Signals
This T- 1 3/4 lamp is untinted, diffused, and incorporate
precise optics which produce well defined spatial radiation patterns at specific viewing cone angle.
Features
• Small Area Illumination
• Legend Backlighting
• General Purpose Indicators
• Highly Luminous White Emission
• 70° viewing angle
Benefit
• Reduced Power Consumption, Higher Reliability, and
Increased Optical/Mechanical Design Flexibility Compared to Incandescent Bulbs and Other Alternative
White Light Sources
Package Dimensions
.35 max
.093
A.
1.1±0.0
.05±.008
0.50±0.10 sq. typ.
.00±.00
0.70 max
.08
ø
5.80±0.0
.8±.008
.5±0.38
.100±.015
5.00±0.0 note#1
.197±.008
cathode
lead
8.71±0.0
.33±.008
1.00 min
.039
cathode
flat
31.60 min
1.
B.
1.1±0.0
.05±.008
NOTES:
1. MEASURED JUST ABOVE FLANGE.
8.71±0.0
.33±.008
1.50±0.15
.059±.006
ø
0.70 max
.08
0.50±0.10 sq. typ.
.00±.00
5.80±0.0
.8±.008
.5±0.38
.100±.015
5.00±0.0 note#1
.197±.008
cathode
lead
1.5±0.5
.93±.010
31.60 min
1.
1.00 min
.039
cathode
flat
Notes:
1. All dimensions are in millimeters /
inches.
2. Expoxy meniscus may extend about
1mm (0.040”) down the leads.
CAUTION : These devices are Class 1 ESD sensitive. Please observe appropriate precautions during handling
and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Device Selection Guide
Part Number
Min Luminous Intensity
Iv (mcd) @ 20mA
Max Luminous Intensity
Iv (mcd) @ 20mA
Standoff
Option
Package
Dimension
HLMP-CW70-LP0xx
400
1150
No
A
HLMP-CW72-LP0xx
400
1150
Yes
B
Tolerance for intensity limit is ± 15%
Part Numbering System
HLMP – CW7x - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Option
0: Full color bin distribution
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle and Standoff Option
70 : 70 without standoffs
7 : 70 with standoffs
Absolute Maximum Ratings (TA = 25°C)
Parameters
Value
Unit
DC forward current [1]
30
mA
Peak forward current [2]
100
mA
Power dissipation
120
mW
Reverse Voltage (IR = 10µA)
5
V
LED junction temperature
110
oC
Operating temperature range
-40 to +85
oC
Storage temperature range
-40 to +100
oC
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty factor 10%, 1 KHz.
Electrical Characteristics (TA = 25°C)
Forward Voltage,
VF (V) @ IF = 20 mA
Reverse Breakdown,
VR (V) @ IR = 10mA
Capacitance,
C (pF), VF = 0,f = 1 MHz
Thermal Resistance
RqJ-PIN (°C/W)
Typ.
Max.
Min.
Typ.
Typ.
3.6
4.0
5
70
240
Optical Characteristics (TA = 25°C)
Typical Chromaticity Coordinates [1]
X
0.32
Viewing Angle 2q1/2 (Degrees) [2] Typ.
Y
0.32
70
Notes:
1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
2. 1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.
30
0.8
Forward Current (mA)
Relative Luminous Intensity
1.0
0.6
0.
0.
0.0
380
80
580
Wavelength (nm)
680
0.05
1.
0.00
1.0
0.015
0.8
0.6
0.
0.
Forward Voltage (V)
3
10
0
Forward Current (mA)
1mA
5mA
0.010
10mA
0.005
15mA
0
-0.005
0mA
5mA
30mA
-0.010
-0.00
30
Figure 3. Relative Iv vs. Forward Current
-0.00
0
X-Coordinates
0.00
0.00
Figure 4. Chromaticity shift vs. current
30
1.0
Relative Luminous Intensity
RqJ-A=585˚C/W
5
0
RqJ-A=780˚C/W
15
10
5
0
1
(X,Y) VALUES @ 0mA REFERENCE TO (0,0)
Y-Coordinates
Relative Luminous Intensity
1.
0
Maximum Forward Current (mA)
0
Figure 2. Forward Current vs Forward Voltage
0.0
0
0
0
60
80
Ambient Temperature (˚C)
Figure 5. Maximum Fwd. Current vs Temperature
10
0
780
Figure 1. Relative Intensity vs Wavelength
0
100
0.5
0.0
-90
-60
-30
0
30
60
Angular Displacement (Degree)
Figure 6. Spatial Radiation Pattern
90
Intensity Bin Limits (mcd at 20 mA)
Bin
Color Bin Limit Tables
Limits (Chromaticity Coordinates)
Intensity (mcd) at 20 mA
Min
Max
K
310
400
L
400
520
M
520
680
N
680
880
P
880
1150
Q
1150
1500
R
1500
1900
S
1900
2500
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
1
2
3
4
X
0.330
0.330
0.356
0.361
Y
0.360
0.318
0.351
0.385
X
0.287
0.296
0.330
0.330
Y
0.295
0.276
0.318
0.339
X
0.264
0.280
0.296
0.283
Y
0.267
0.248
0.276
0.305
X
0.283
0.287
0.330
0.330
Y
0.305
0.295
0.339
0.360
Tolerance for each bin limit is ± 0.01
Tolerance for each bin limit is ± 15%.
Color Bin Limits with Respect to CIE 1931 Chromaticity Diagram
0.0
Y-coordinate
0.35
0.30
1
Black Body Curve
3
0.5
0.0
0.6
0.3
0.3
0.38
X-coordinate
Note:
1. Bin categories are established for classification of products. Products may not be available in all bin categories.
Please contact your Avago Technologies representative for information on currently available
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care
must be taken to avoid any excessive mechanical
stress induced to LED package. Otherwise, cut the
leads of LED to length after soldering process at
room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from
traveling to the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely
upon hand operation.
Soldering Condition:
• Care must be taken during PCB assembly and soldering process to prevent damage to LED component.
• The closest LED is allowed to solder on board is
1.59mm below the body (encapsulant epoxy) for
those parts without standoff.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
-
Preheat time
30 sec Max
-
Peak temperature
250 °C Max.
260 °C Max.
Dwell time
3 sec Max.
5 sec Max
• Wave soldering parameter must be set and maintain
according to recommended temperature and dwell
time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through holes size
for LED component leads.
LED component
lead size
Diagonal
Plated through
hole diameter
0.457 x 0.457mm
(0.025 inch)
0.646 mm
(0.038 to 0.042 inch)
(0.018 x 0.018inch)
0.976 to 1.078 mm
0.508 x 0.508mm
(0.028 inch)
0.718 mm
(0.041 to 0.045 inch
(0.020 x 0.020inch)
1.049 to 1.150mm
Note: Refer to application note AN1027 for more information on soldering LED components.
Recommended Wave Soldering Profile
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
50
00
TEMPERATURE - ˚C
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
150
FLUXING
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 5 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.5 IN.)
AIR KNIFE ANGLE = 0
SOLDER: SN63; FLUX: RMA
100
50
30
0
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE
EXERTING MECHANICAL FORCE.
PREHEAT
10
0
30
0
50
TIME - SECONDS
60
70
80
90
100
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-4123EN - May 9, 2006
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