HGTG11N120CND Data Sheet January 2000 43A, 1200V, NPT Series N-Channel IGBT with Anti-Parallel Hyperfast Diode The HGTG11N120CND is a Non-Punch Through (NPT) IGBT design. This is a new member of the MOS gated high voltage switching IGBT family. IGBTs combine the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on-state conduction loss of a bipolar transistor. The IGBT used is the development type TA49291. The Diode used is the development type TA49189. The IGBT is ideal for many high voltage switching applications operating at moderate frequencies where low conduction losses are essential, such as: AC and DC motor controls, power supplies and drivers for solenoids, relays and contactors. File Number 4580.2 Features • 43A, 1200V, TC = 25oC • 1200V Switching SOA Capability • Typical Fall Time. . . . . . . . . . . . . . . . 340ns at TJ = 150oC • Short Circuit Rating • Low Conduction Loss • Thermal Impedance SPICE Model www.intersil.com Packaging JEDEC STYLE TO-247 E C G Formerly Developmental Type TA49303. Ordering Information PART NUMBER HGTG11N120CND PACKAGE TO-247 BRAND 11N120CND NOTE: When ordering, use the entire part number. Symbol C G E INTERSIL CORPORATION IGBT PRODUCT IS COVERED BY ONE OR MORE OF THE FOLLOWING U.S. PATENTS 4,364,073 4,598,461 4,682,195 4,803,533 4,888,627 4,417,385 4,605,948 4,684,413 4,809,045 4,890,143 4,430,792 4,620,211 4,694,313 4,809,047 4,901,127 1 4,443,931 4,631,564 4,717,679 4,810,665 4,904,609 4,466,176 4,639,754 4,743,952 4,823,176 4,933,740 4,516,143 4,639,762 4,783,690 4,837,606 4,963,951 4,532,534 4,641,162 4,794,432 4,860,080 4,969,027 4,587,713 4,644,637 4,801,986 4,883,767 CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000 HGTG11N120CND Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified HGTG11N120CND UNITS 1200 V At TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC25 43 A At TC = 110oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IC110 22 A Collector Current Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ICM 80 A Gate to Emitter Voltage Continuous. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGES ±20 V Gate to Emitter Voltage Pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGEM ±30 V Switching Safe Operating Area at TJ = 150oC (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . SSOA 55A at 1200V Power Dissipation Total at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD 298 W Power Dissipation Derating TC > 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.38 W/oC Operating and Storage Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 150 oC Maximum Lead Temperature for Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL 260 oC Short Circuit Withstand Time (Note 2) at VGE = 15V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 8 µs Short Circuit Withstand Time (Note 2) at VGE = 12V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tSC 15 µs Collector to Emitter Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .BVCES Collector Current Continuous CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. Pulse width limited by maximum junction temperature. 2. VCE(PK) = 840V, TJ = 125oC, RG = 10Ω. TC = 25oC, Unless Otherwise Specified Electrical Specifications PARAMETER SYMBOL Collector to Emitter Breakdown Voltage Collector to Emitter Leakage Current Collector to Emitter Saturation Voltage Gate to Emitter Threshold Voltage BVCES ICES VCE(SAT) VGE(TH) TEST CONDITIONS IC = 250µA, VGE = 0V VCE = BVCES IC = 11A, VGE = 15V TC = 25oC TC = 125oC TC = 150oC TC = 25oC TC = 150oC IC = 90µA, VCE = VGE MIN TYP MAX UNITS 1200 - - V - - 250 µA - 300 - µA - - 3.5 mA - 2.1 2.4 V - 2.9 3.5 V 6.0 6.8 - V - - ±250 nA 55 - - A IGES VGE = ±20V Switching SOA SSOA TJ = 150oC, RG = 10Ω, VGE = 15V, L = 400µH, VCE(PK) = 1200V Gate to Emitter Plateau Voltage VGEP IC = 11A, VCE = 0.5 BVCES - 10.4 - V IC = 11A, VCE = 0.5 BVCES VGE = 15V - 100 120 nC VGE = 20V - 130 150 nC - 23 26 ns - 12 16 ns - 180 240 ns - 190 220 ns - 0.95 1.3 mJ - 1.3 1.6 mJ Gate to Emitter Leakage Current On-State Gate Charge QG(ON) Current Turn-On Delay Time td(ON)I Current Rise Time trI Current Turn-Off Delay Time td(OFF)I Current Fall Time tfI Turn-On Energy EON Turn-Off Energy (Note 3) EOFF 2 IGBT and Diode at TJ = 25oC, ICE = 11A, VCE = 0.8 BVCES , VGE = 15V, RG = 10Ω, L = 2mH, Test Circuit (Figure 20) HGTG11N120CND TC = 25oC, Unless Otherwise Specified (Continued) Electrical Specifications PARAMETER SYMBOL Current Turn-On Delay Time td(ON)I Current Rise Time trI Current Turn-Off Delay Time td(OFF)I Current Fall Time tfI Turn-On Energy EON Turn-Off Energy (Note 3) EOFF Diode Forward Voltage VEC Diode Reverse Recovery Time trr Thermal Resistance Junction To Case RθJC TEST CONDITIONS MIN TYP MAX UNITS - 21 24 ns - 12 16 ns - 210 280 ns - 360 400 ns - 1.9 2.5 mJ - 2.1 2.5 mJ IEC = 11A - 2.6 3.2 V IEC = 11A, dlEC/dt = 200A/µs - 60 70 ns IEC = 1A, dlEC/dt = 200A/µs - 32 40 ns IGBT - - 0.42 oC/W Diode - - 1.25 oC/W IGBT and Diode at TJ = 150oC, ICE = 11A, VCE = 0.8 BVCES , VGE = 15V, RG = 10Ω, L = 2mH, Test Circuit (Figure 20) NOTE: 3. Turn-Off Energy Loss (EOFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (ICE = 0A). All devices were tested per JEDEC Standard No. 24-1 Method for Measurement of Power Device Turn-Off Switching Loss. This test method produces the true total Turn-Off Energy Loss. Unless Otherwise Specified ICE , DC COLLECTOR CURRENT (A) 45 VGE = 15V 40 35 30 25 20 15 10 5 0 25 50 75 100 125 TC , CASE TEMPERATURE (oC) FIGURE 1. DC COLLECTOR CURRENT vs CASE TEMPERATURE 3 150 ICE, COLLECTOR TO EMITTER CURRENT (A) Typical Performance Curves 60 50 TJ = 150oC, RG = 10Ω, VGE = 15V, L = 400µH 40 30 20 10 0 0 200 400 600 800 1000 1200 1400 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 2. MINIMUM SWITCHING SAFE OPERATING AREA HGTG11N120CND TJ = 150oC, RG = 10Ω, L = 2mH, V CE = 960V TC = 75oC, VGE = 15V, IDEAL DIODE 100 50 fMAX1 = 0.05 / (td(OFF)I + td(ON)I) TC VGE fMAX2 = (PD - PC)/(EON + EOFF) 75oC 15V o 10 PC = CONDUCTION DISSIPATION 75 C 12V 110oC 15V (DUTY FACTOR = 50%) 110oC 12V RØJC = 0.42oC/W, SEE NOTES 5 5 10 2 ICE, COLLECTOR TO EMITTER CURRENT (A) 20 25 20 200 tSC 150 10 100 5 12 ICE, COLLECTOR TO EMITTER CURRENT (A) ICE, COLLECTOR TO EMITTER CURRENT (A) 40 30 TC = 150oC 20 10 DUTY CYCLE < 0.5%, VGE = 12V PULSE DURATION = 250µs 0 6 2 4 VCE, COLLECTOR TO EMITTER VOLTAGE (V) 50 16 15 50 TC = 25oC 40 TC = -55oC 30 TC = 150oC 20 10 DUTY CYCLE < 0.5%, VGE = 15V PULSE DURATION = 250µs 0 0 8 2 4 6 8 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 5. COLLECTOR TO EMITTER ON-STATE VOLTAGE FIGURE 6. COLLECTOR TO EMITTER ON-STATE VOLTAGE 3.5 5 RG = 10Ω, L = 2mH, VCE = 960V EOFF, TURN-OFF ENERGY LOSS (mJ) EON , TURN-ON ENERGY LOSS (mJ) 14 FIGURE 4. SHORT CIRCUIT WITHSTAND TIME TC = 25oC 4 TJ = 150oC, VGE = 12V, VGE = 15V 3 2 1 TJ = 25oC, VGE = 12V, VGE = 15V 0 13 VGE , GATE TO EMITTER VOLTAGE (V) 50 0 ISC 15 FIGURE 3. OPERATING FREQUENCY vs COLLECTOR TO EMITTER CURRENT TC = -55oC 250 VCE = 840V, RG = 10Ω, TJ = 125oC ISC, PEAK SHORT CIRCUIT CURRENT (A) fMAX, OPERATING FREQUENCY (kHz) 200 Unless Otherwise Specified (Continued) tSC , SHORT CIRCUIT WITHSTAND TIME (µs) Typical Performance Curves 0 5 10 15 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 7. TURN-ON ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT 4 20 RG = 10Ω, L = 2mH, VCE = 960V 3.0 2.5 TJ = 150oC, VGE = 12V OR 15V 2.0 1.5 1.0 TJ = 25oC, VGE = 12V OR 15V 0.5 0 0 5 10 15 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 8. TURN-OFF ENERGY LOSS vs COLLECTOR TO EMITTER CURRENT 20 HGTG11N120CND Typical Performance Curves Unless Otherwise Specified (Continued) 40 50 RG = 10Ω, L = 2mH, VCE = 960V TJ = 25oC, TJ = 150oC, VGE = 12V 35 30 25 20 15 TJ = 25oC, TJ = 150oC, VGE = 12V 40 trI , RISE TIME (ns) tdI , TURN-ON DELAY TIME (ns) RG = 10Ω, L = 2mH, VCE = 960V 30 20 10 TJ = 25oC OR TJ = 150oC, VGE = 15V TJ = 25oC, TJ = 150oC, VGE = 15V 0 5 15 10 0 20 0 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 9. TURN-ON DELAY TIME vs COLLECTOR TO EMITTER CURRENT 700 RG = 10Ω, L = 2mH, VCE = 960V RG = 10Ω, L = 2mH, VCE = 960V 450 600 400 tfI , FALL TIME (ns) td(OFF)I , TURN-OFF DELAY TIME (ns) 20 FIGURE 10. TURN-ON RISE TIME vs COLLECTOR TO EMITTER CURRENT 500 VGE = 12V, VGE = 15V, TJ = 150oC 350 300 250 500 TJ = 150oC, VGE = 12V OR 15V 400 300 200 200 150 100 TJ = 25oC, VGE = 12V OR 15V VGE = 12V, VGE = 15V, TJ = 25oC 100 10 15 5 ICE , COLLECTOR TO EMITTER CURRENT (A) 0 0 20 10 5 15 20 ICE , COLLECTOR TO EMITTER CURRENT (A) FIGURE 11. TURN-OFF DELAY TIME vs COLLECTOR TO EMITTER CURRENT FIGURE 12. FALL TIME vs COLLECTOR TO EMITTER CURRENT 20 100 DUTY CYCLE < 0.5%, VCE = 20V PULSE DURATION = 250µs VGE, GATE TO EMITTER VOLTAGE (V) ICE, COLLECTOR TO EMITTER CURRENT (A) 5 10 15 ICE , COLLECTOR TO EMITTER CURRENT (A) 80 60 TC = 25oC 40 20 TC = 150oC 0 7 8 9 TC = -55oC 11 10 12 13 VGE, GATE TO EMITTER VOLTAGE (V) FIGURE 13. TRANSFER CHARACTERISTIC 5 14 15 IG(REF) = 1mA, RL = 54.5Ω, TC = 25oC 15 VCE = 1200V VCE = 800V 10 VCE = 400V 5 0 0 20 60 80 40 QG , GATE CHARGE (nC) 100 FIGURE 14. GATE CHARGE WAVEFORMS 120 HGTG11N120CND Unless Otherwise Specified (Continued) ICE, COLLECTOR TO EMITTER CURRENT (A) Typical Performance Curves 4 C, CAPACITANCE (nF) FREQUENCY = 1MHz 3 CIES 2 1 COES 0 CRES 0 5 10 15 20 25 15 DUTY CYCLE < 0.5%, TC = 110oC PULSE DURATION = 250µs 12 VGE = 15V 9 VGE = 10V 6 3 0 0 1 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 15. CAPACITANCE vs COLLECTOR TO EMITTER VOLTAGE ZθJC , NORMALIZED THERMAL RESPONSE 2 3 4 VCE, COLLECTOR TO EMITTER VOLTAGE (V) FIGURE 16. COLLECTOR TO EMITTER ON-STATE VOLTAGE 100 0.5 0.2 10-1 t1 0.1 PD 0.05 t2 0.02 DUTY FACTOR, D = t1 / t2 0.01 PEAK TJ = (PD X ZθJC X RθJC) + TC SINGLE PULSE 10-2 10-5 10-4 10-3 10-2 10-1 100 t1 , RECTANGULAR PULSE DURATION (s) FIGURE 17. NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE 70 TC = 25oC, dIEC / dt = 200A/µs 60 t, RECOVERY TIMES (ns) IF, FORWARD CURRENT (A) 100 150oC 10 25oC 50 trr 40 30 ta 20 -55oC 1 1 2 3 4 5 VF, FORWARD VOLTAGE (V) FIGURE 18. DIODE FORWARD CURRENT vs FORWARD VOLTAGE DROP 6 6 10 tb 1 2 5 10 IF, FORWARD CURRENT (A) FIGURE 19. RECOVERY TIMES vs FORWARD CURRENT 20 HGTG11N120CND Test Circuit and Waveforms HGTG11N120CND 90% 10% VGE EON EOFF L = 2mH VCE RG = 10Ω 90% + - ICE VDD = 960V 10% td(OFF)I trI tfI td(ON)I FIGURE 20. INDUCTIVE SWITCHING TEST CIRCUIT FIGURE 21. SWITCHING TEST WAVEFORMS Handling Precautions for IGBTs Operating Frequency Information Insulated Gate Bipolar Transistors are susceptible to gate-insulation damage by the electrostatic discharge of energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge. IGBTs can be handled safely if the following basic precautions are taken: Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (ICE) plots are possible using the information shown for a typical unit in Figures 5, 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows fMAX1 or fMAX2; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature. 1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as “ECCOSORBD™ LD26” or equivalent. 2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means - for example, with a metallic wristband. 3. Tips of soldering irons should be grounded. 4. Devices should never be inserted into or removed from circuits with power on. 5. Gate Voltage Rating - Never exceed the gate-voltage rating of VGEM. Exceeding the rated VGE can result in permanent damage to the oxide layer in the gate region. 6. Gate Termination - The gates of these devices are essentially capacitors. Circuits that leave the gate opencircuited or floating should be avoided. These conditions can result in turn-on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup. 7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended. fMAX1 is defined by fMAX1 = 0.05/(td(OFF)I+ td(ON)I). Deadtime (the denominator) has been arbitrarily held to 10% of the on-state time for a 50% duty factor. Other definitions are possible. td(OFF)I and td(ON)I are defined in Figure 21. Device turn-off delay can establish an additional frequency limiting condition for an application other than TJM. td(OFF)I is important when controlling output ripple under a lightly loaded condition. fMAX2 is defined by fMAX2 = (PD - PC)/(EOFF + EON). The allowable dissipation (PD) is defined by PD = (TJM - TC)/RθJC . The sum of device switching and conduction losses must not exceed PD. A 50% duty factor was used (Figure 3) and the conduction losses (PC) are approximated by PC = (VCE x ICE)/2. EON and EOFF are defined in the switching waveforms shown in Figure 21. EON is the integral of the instantaneous power loss (ICE x VCE) during turn-on and EOFF is the integral of the instantaneous power loss (ICE x VCE) during turn-off. All tail losses are included in the calculation for EOFF; i.e., the collector current equals zero (ICE = 0). All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 7 ECCOSORBD™ is a trademark of Emerson and Cumming, Inc.