Material Content Data Sheet Sales Product Name BBY 66-05W H6327 MA# MA000850034 Package PG-SOT323-3-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip noble metal non noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% gold arsenic silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-57-5 7440-38-2 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 19. December 2014 Weight [mg] 5.98 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.005 0.09 0.000 0.00 895 0.091 1.53 0.001 0.01 0.003 0.04 440 0.008 0.13 1319 2.617 43.79 43.97 437914 439761 0.013 0.22 0.22 2207 2207 0.031 0.52 0.665 11.14 2.399 40.14 51.80 401421 517963 0.133 2.22 2.22 22206 22206 0.010 0.17 0.17 1675 9 1.62 15284 2. 3. 5180 111362 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 16188 88 Important Remarks: 1. Sum [ppm] 1675 1000000