MC10H115 Quad Line Receiver Description The MC10H115 is a quad differential amplifier designed for use in sensing differential signals over long lines. This 10H part is a functional/ pinout duplication of the standard MECL 10K™ family part, with 100% improvement in counting frequency and no increase in power supply current. The base bias supply (VBB) is made available at Pin 9 to make the device useful as a Schmitt trigger, or in other applications where a stable reference voltage is necessary. Active current sources provide the MC10H115 with excellent common mode rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to VBB (Pin 9) to prevent upsetting the current source bias network. The MC10H115 is designed to be used in sensing differential signals over long lines. The bias supply (VBB) is made available to make the device useful as a Schmitt trigger, or in other applications where a stable reference voltage is necessary. Active current sources provide these receivers with excellent common−mode noise rejection. If any amplifier in a package is not used, one input of that amplifier must be connected to VBB to prevent unbalancing the current source bias network. The MC10H115 does not have internal input pulldown resistors. This provides high impedance to the amplifier input and facilitates differential connections. http://onsemi.com MARKING DIAGRAMS* 16 MC10H115L AWLYYWW 16 MC10H115P AWLYYWWG 16 1 PDIP−16 P SUFFIX CASE 648 Features • Propagation Delay, 1.0 ns Typical • Power Dissipation 110 mW Typ/Pkg (No Load) • Improved Noise Margin 150 mV (Over Operating Voltage and • • Temperature Range) Voltage Compensated MECL 10K Compatible 1 10H115 ALYWG SOEIAJ−16 CASE 966 1 20 Applications • • • • 1 CDIP−16 L SUFFIX CASE 620A 10H115G AWLYYWW 20 1 Low Level Receiver Voltage Level Interface Schmitt Trigger Pb−Free Packages are Available* PLLC−20 FN SUFFIX CASE 775 A WL, L YY, Y WW, W G *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MC10H115/D MC10H115 4 5 7 6 10 11 13 12 2 3 14 VBB* VCC1 = Pin 1 VCC2 = Pin 16 VEE = Pin 8 *VBB to be used to supply bias to the MC10H115 only and bypassed (when used) with 0.01 mF to 0.1 mF capacitor to ground (0 V). VBB can source < 1.0 mA. When input pin with bubble goes positive its respective output pin with bubble goes positive. VCC1 1 16 VCC2 Aout 2 15 Dout Bout 3 14 Cout Ain 4 13 Din Ain 5 12 Din Bin 6 11 Cin Bin 7 10 Cin VEE 8 9 15 9 VBB Pin assignment is for Dual−in−Line Package. Figure 2. Pin Assignment Figure 1. Logic Diagram Table 1. MAXIMUM RATINGS Symbol Characteristic Rating Unit VEE Power Supply (VCC = 0) −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range −55 to +150 −55 to +165 °C °C Continuous Surge Plastic Ceramic Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 2) 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit 26 − 29 mA IE Power Supply Current − 29 − IinH Input Current High − 150 − 95 − 95 mA ICBO Input Leakage Current − 1.5 − 1.0 − 1.0 mA VBB Reference Voltage −1.38 −1.27 −1.35 −1.25 −1.31 −1.19 Vdc VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage (Note 1) −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage (Note 1) −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc VCMR Common Mode Range (Note 3) − − −2.85 to −0.8 − − Vdc VPP Input Sensitivity (Note 4) − − 150 typ − − mVPP 1. When VBB is used as the reference voltage. 2. Each MECL 10H™ series circuit has been designed to meet the specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50 W resistor to −2.0 V. 3. Differential input not to exceed 1.0 Vdc. 4. 150 mVp−p differential input required to obtain full logic swing on output. http://onsemi.com 2 MC10H115 Table 3. AC PARAMETERS 0° Symbol Characteristic 25° 75° Min Max Min Max Min Max Unit tpd Propagation Delay 0.4 1.3 0.4 1.3 0.45 1.45 ns tr Rise Time 0.5 1.4 0.5 1.5 0.5 1.6 ns tf Fall Time 0.5 1.4 0.5 1.5 0.5 1.6 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. ORDERING INFORMATION Package Shipping † MC10H115FN PLLC−20 46 Units / Rail MC10H115FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H115FNR2 PLLC−20 500 / Tape & Reel MC10H115FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H115L CDIP−16 25 Unit / Rail MC10H115M SOEIAJ−16 50 Unit / Rail MC10H115MG SOEIAJ−16 (Pb−Free) 50 Unit / Rail MC10H115MEL SOEIAJ−16 2000 / Tape & Reel MC10H115MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H115P PDIP−16 25 Unit / Rail MC10H115PG PDIP−16 (Pb−Free) 25 Unit / Rail Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 3 MC10H115 PACKAGE DIMENSIONS 20 LEAD PLLC CASE 775−02 ISSUE E 0.007 (0.180) M T L−M B Y BRK −N− U N S 0.007 (0.180) M T L−M S S N S D −L− −M− Z W 20 D 1 V 0.007 (0.180) M T L−M S N S R 0.007 (0.180) M T L−M S N S Z T L−M S N H J 0.007 (0.180) M T L−M S −T− VIEW S SEATING PLANE F 0.007 (0.180) M T L−M S VIEW S N S N S K 0.004 (0.100) G S S K1 E G1 0.010 (0.250) S T L−M S VIEW D−D A C 0.010 (0.250) G1 X NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). http://onsemi.com 4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 −−− 0.025 −−− 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 −−− 0.020 2_ 10 _ 0.310 0.330 0.040 −−− MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 −−− 0.64 −−− 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 −−− 0.50 2_ 10 _ 7.88 8.38 1.02 −−− N S MC10H115 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 9 Q1 E HE 1 M_ L 8 Z DETAIL P D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c 0.10 (0.004) M CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O B A A 16 9 1 8 B M L 16X 0.25 (0.010) E F C K T N SEATING PLANE G 16X 0.25 (0.010) M D T A http://onsemi.com 5 M J T B MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.031 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 −−− 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 −−− 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01 MC10H115 PACKAGE DIMENSIONS PDIP−16 P SUFFIX PLASTIC DIP PACKAGE CASE 648−08 ISSUE R −A− 16 9 1 8 B F C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. L S −T− H SEATING PLANE K G D M J 16 PL 0.25 (0.010) M T A M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 MECL 10H and MECL 10K are trademarks of Motorola, Inc. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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