ON MBR3100RL Schottky barrier rectifier 3.0 amperes 100 volt Datasheet

MBR3100
Preferred Device
Axial Lead Rectifier
. . . employing the Schottky Barrier principle in a large area
metal-to-silicon power diode. State-of-the-art geometry features
epitaxial construction with oxide passivation and metal overlap
contact. Ideally suited for use as rectifiers in low- voltage,
high- frequency inverters, free wheeling diodes, and polarity
protection diodes.
• Low Reverse Current
• Low Stored Charge, Majority Carrier Conduction
• Low Power Loss/High Efficiency
• Highly Stable Oxide Passivated Junction
• Guard-Ring for Stress Protection
• Low Forward Voltage
• 150°C Operating Junction Temperature
• High Surge Capacity
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SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERES
100 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 1.1 gram (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
•
•
220°C Max. for 10 Seconds, 1/16″ from case
Shipped in plastic bags, 500 per bag
Available Tape and Reeled, 1500 per reel, by adding a “RL’’ suffix to
the part number
Polarity: Cathode indicated by Polarity Band
Marking: B3100
AXIAL LEAD
CASE 267-05
(DO-201AD)
STYLE 1
MARKING DIAGRAM
MBR
3100
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100
V
Average Rectified Forward Current
TA = 100°C (RJA = 28°C/W,
P.C. Board Mounting, see Note 2)
IO
3.0
A
Non-Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, Single
Phase, 60 Hz)
IFSM
MBR3100 = Device Code
ORDERING INFORMATION
Device
Operating and Storage Junction
Temperature Range
(Reverse Voltage Applied)
Voltage Rate of Change (Rated VR)
 Semiconductor Components Industries, LLC, 2003
April, 2003 - Rev. 3
TJ, Tstg
150
Package
Shipping
MBR3100
Axial Lead
500 Units/Bag
MBR3100RL
Axial Lead
1500/Tape & Reel
A
°C
-65 to +150
Preferred devices are recommended choices for future use
and best overall value.
dv/dt
10
V/ns
1
Publication Order Number:
MBR3100/D
MBR3100
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient (see Note 2, Mounting Method 3)
Symbol
Max
Unit
RθJA
28
°C/W
Symbol
Max
Unit
ELECTRICAL CHARACTERISTICS (TL = 25°C unless otherwise noted)
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 3.0 Amps, TL = 25°C)
(iF = 3.0 Amps, TL = 100°C)
vF
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 1)
TL = 25°C
TL = 100°C
iR
V
0.79
0.69
mA
0.6
20
50
30
20
1
0.5
I , REVERSE CURRENT (mA)
R
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
1. Pulse Test: Pulse Width = 300 µs, Duty Cycle = 2.0%.
TJ = 150°C
10
100°C
5
3
2
25°C
1
0.5
0.3
0.2
0.1
125°C
0.05
0.02
0.01
100°C
0.005
0.002
0.001
0.0005
0.1
0.05
TJ = 150°C
0.2
25°C
0.0002
0.0001
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3
vF, INSTANTANEOUS VOLTAGE (VOLTS)
0
10
20
70
30
40
50
60
80
VR REVERSE VOLTAGE (VOLTS)
90
100
Figure 2. Typical Reverse Current*
Figure 1. Typical Forward Voltage
8
P
, AVERAGE POWER DISSIPATION (WATTS)
F (AV)
I
F (AV)
, AVERAGE FORWARD CURRENT (AMPS)
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficient below rated VR.
7
6
5
dc
4
SQUARE
WAVE
3
2
1
0
20
40
60
80
100
120
140
160
180
4
3.5
3
2.5
SQUARE
WAVE
2
1.5
1
0.5
0
TA, AMBIENT TEMPERATURE (°C)
Figure 3. Current Derating
(Mounting Method #3 per Note 2)
1.0
2.0
3.0
4.0
IF (AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Power Dissipation
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2
dc
5.0
MBR3100
400
C, CAPACITANCE (pF)
300
200
TJ = 25°C
f = 1 MHz
100
80
50
40
0
20
40
60
80
VR, REVERSE VOLTAGE (VOLTS)
Figure 5. Typical Capacitance
NOTE 2 — MOUNTING DATA
Data shown for thermal resistance junction-to-ambient
(RθJA) for the mountings shown is to be used as typical
guideline values for preliminary engineering, or in case the
tie point temperature cannot be measured.
TYPICAL VALUES FOR RθJA IN STILL AIR
Mounting
Method
Lead Length, L (in)
1/8
1/4
1/2
3/4
RθJA
1
50
51
53
55
°C/W
2
58
59
61
63
°C/W
3
°C/W
28
Mounting Method 1
Mounting Method 2
P.C. Board where available
copper surface is small.
Vector Push-In
Terminals T-28
L
ÉÉÉÉÉÉÉÉÉÉÉÉÉ
L
L
ÉÉÉÉÉÉÉÉÉÉÉ
Mounting Method 3
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
P.C. Board with
2-1/2 ″ X 2-1/2″
copper surface.
L = 1/2’’
Board Ground Plane
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3
L
MBR3100
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267-05
(DO-201AD)
ISSUE G
K
D
A
1
2
B
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
D
K
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
−−−
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
−−−
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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4
MBR3100/D
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