The following document contains information on Cypress products. Although the document is marked with the name “Broadcom”, the company that originally developed the specification, Cypress will continue to offer these products to new and existing customers. CONTINUITY OF SPECIFICATIONS There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made are the result of normal document improvements and are noted in the document history page, where supported. Future revisions will occur when appropriate, and changes will be noted in a document history page. CONTINUITY OF ORDERING PART NUMBERS Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed in this document. FOR MORE INFORMATION Please visit our website at www.cypress.com or contact your local sales office for additional information about Cypress products and services. OUR CUSTOMERS Cypress is for true innovators – in companies both large and small. Our customers are smart, aggressive, out-of-the-box thinkers who design and develop game-changing products that revolutionize their industries or create new industries with products and solutions that nobody ever thought of before. ABOUT CYPRESS Founded in 1982, Cypress is the leader in advanced embedded system solutions for the world’s most innovative automotive, industrial, home automation and appliances, consumer electronics and medical products. Cypress’s programmable systems-on-chip, general-purpose microcontrollers, analog ICs, wireless and USB-based connectivity solutions and reliable, high-performance memories help engineers design differentiated products and get them to market first. Cypress is committed to providing customers with the best support and engineering resources on the planet enabling innovators and out-of-the-box thinkers to disrupt markets and create new product categories in record time. To learn more, go to www.cypress.com. Cypress Semiconductor Corporation Document Number: 002-14806 Rev. *B 198 Champion Court San Jose, CA 95134-1709 408-943-2600 Revised July 1, 2016 Preliminary Data Sheet BCM20713 Single-Chip Bluetooth Transceiver and Baseband Processor GE NE R AL DE S C RI PT ION F E A T U RE S ® The Broadcom BCM20713 is a monolithic, singlechip, Bluetooth 4.0 compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. Manufactured using the industry's most advanced 65 nm CMOS low-power process, the BCM20713 employs the highest level of integration, eliminating all critical external components, and thereby minimizing the device’s footprint and costs associated with the implementation of Bluetooth solutions. The BCM20713 brings the latest mobile connectivity technology to automotive radio and industrial Bluetooth applications. Offering automotive Grade 3 (–40°C to +85°C) temperature performance, the BCM20713 is tested to AECQ100 environmental stress guidelines and manufactured in ISO9001 and TS16949 certified facilities. • • • • • • • • • • • Bluetooth 4.0 + EDR compliant. Class 1 capable with built-in PA. Programmable output power control meets Class 1, Class 2, or Class 3 requirements. Use supply voltages up to 5.5V.Supports Broadcom SmartAudio®, wide-band speech, SBC codec, and packet loss concealment. Fractional-N synthesizer supports frequency references from 12 MHz to 52 MHz. Automatic frequency detection for standard crystal and TCXO values when an external 32.768 kHz reference clock is provided. Ultra-low power consumption. Supports serial flash interfaces. Available in 42-bump WLBGA and 50-ball FPBGA packages. ARM7TDMI-S–based microprocessor with integrated ROM and RAM. Supports patch RAM download without external memory. A P P L IC AT IO N S • • • Automotive handsfree radios Automotive data communication Industrial appliances Figure 1: System Block Diagram PCM BCM20713 UART GPIO Memory High-Speed Peripheral Transport Unit (PTU) Radio Transceiver Microprocessor and Memory Unit (uPU) Bluetooth Baseband Core (BBC) SPI I2S TCXO LPO 20713-DS102-R 5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203 December 21, 2015 Revision History Revision Date Change 20713-DS102-R 12/22/15 Added: 20713-DS101-R 10/16/14 20713-DS100-R 08/14/14 • “I2S Interface” on page 57. Updated: • General description on page 1. Initial release Broadcom Corporation 5300 California Avenue Irvine, CA 92617 © 2015 by Broadcom Corporation All rights reserved Printed in the U.S.A. Broadcom®, the pulse logo, Connecting everything®, the Connecting everything logo, and SmartAudio® are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners. This data sheet (including, without limitation, the Broadcom component(s) identified herein) is not designed, intended, or certified for use in any military, nuclear, medical, mass transportation, aviation, navigations, pollution control, hazardous substances management, or other high-risk application. BROADCOM PROVIDES THIS DATA SHEET “AS-IS,” WITHOUT WARRANTY OF ANY KIND. BROADCOM DISCLAIMS ALL WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NONINFRINGEMENT. BCM20713 Preliminary Data Sheet Table of Contents Table of Contents About This Document .................................................................................................................................. 8 Purpose and Audience ............................................................................................................................ 8 Acronyms and Abbreviations................................................................................................................... 8 Document Conventions ........................................................................................................................... 8 Technical Support ........................................................................................................................................ 8 Section 1: Overview ............................................................................................................ 9 Major Features .............................................................................................................................................. 9 Block Diagram ............................................................................................................................................ 11 Usage Model ............................................................................................................................................... 11 Section 2: Integrated Radio Transceiver......................................................................... 13 Transmitter Path ......................................................................................................................................... 13 Digital Modulator ................................................................................................................................... 13 Power Amplifier ..................................................................................................................................... 13 Receiver Path.............................................................................................................................................. 14 Digital Demodulator and Bit Synchronizer............................................................................................. 14 Receiver Signal Strength Indicator........................................................................................................ 14 Local Oscillator Generation....................................................................................................................... 14 Calibration................................................................................................................................................... 14 Internal LDO Regulator .............................................................................................................................. 15 Section 3: Bluetooth Baseband Core .............................................................................. 16 Transmit and Receive Functions .............................................................................................................. 16 Bluetooth 4.0 + EDR Features ................................................................................................................... 16 Frequency Hopping Generator.................................................................................................................. 17 Link Control Layer...................................................................................................................................... 17 Test Mode Support ..................................................................................................................................... 17 Power Management Unit............................................................................................................................ 18 RF Power Management ........................................................................................................................ 18 Host Controller Power Management ..................................................................................................... 18 Bluetooth Baseband Core Power Management .................................................................................... 20 Backdrive Protection ...................................................................................................................... 20 Adaptive Frequency Hopping.................................................................................................................... 21 Collaborative Coexistence......................................................................................................................... 21 Serial Enhanced Coexistence Interface ................................................................................................... 21 SECI Advantages .................................................................................................................................. 22 SECI I/O ................................................................................................................................................ 22 Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 3 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Table of Contents Section 4: Microprocessor Unit ....................................................................................... 23 NVRAM Configuration Data and Storage ................................................................................................. 23 Serial Interface ...................................................................................................................................... 23 EEPROM ...................................................................................................................................................... 23 External Reset............................................................................................................................................. 24 One-Time Programmable Memory ............................................................................................................ 24 Contents ................................................................................................................................................ 24 Programming......................................................................................................................................... 25 Section 5: Peripheral Transport Unit ............................................................................... 26 PCM Interface.............................................................................................................................................. 26 System Diagram.................................................................................................................................... 26 Slot Mapping ......................................................................................................................................... 27 Wideband Speech ................................................................................................................................. 27 Frame Synchronization ......................................................................................................................... 27 Data Formatting..................................................................................................................................... 28 HCI Transport Detection Configuration.................................................................................................... 28 UART Interface............................................................................................................................................ 28 HCI 3-Wire Transport (UART H5) ......................................................................................................... 29 SPI................................................................................................................................................................ 29 Section 6: Frequency References.................................................................................... 30 Crystal Interface and Clock Generation ................................................................................................... 30 Crystal Oscillator........................................................................................................................................ 31 External Frequency Reference.................................................................................................................. 31 TCXO Clock Request Support .............................................................................................................. 32 Clock Request Output .................................................................................................................... 32 TCXO OR Option ........................................................................................................................... 32 Package Options and TCXO Mode................................................................................................ 33 Frequency Selection .................................................................................................................................. 33 Frequency Trimming .................................................................................................................................. 34 LPO Clock Interface ................................................................................................................................... 35 Section 7: Pin Information ................................................................................................ 36 Pin Descriptions ......................................................................................................................................... 36 Ball Maps..................................................................................................................................................... 38 Section 8: Electrical Characteristics ............................................................................... 40 Electrostatic Discharge Specifications .................................................................................................... 42 RF Specifications ....................................................................................................................................... 46 Timing and AC Characteristics ................................................................................................................. 49 Startup Timing ....................................................................................................................................... 49 Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 4 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Table of Contents UART Timing......................................................................................................................................... 51 PCM Interface Timing............................................................................................................................ 52 BSC Interface Timing ............................................................................................................................ 56 2S I Interface................................................................................................................................................. 57 I2S Timing.............................................................................................................................................. 58 Section 9: Mechanical Information .................................................................................. 60 Tape, Reel, and Packing Specification ..................................................................................................... 62 Section 10: Ordering Information .................................................................................... 63 Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 5 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet List of Figures List of Figures Figure 1: System Block Diagram ....................................................................................................................... 1 Figure 2: Functional Block Diagram................................................................................................................. 11 Figure 3: Usage Model..................................................................................................................................... 12 Figure 4: LDO Functional Block Diagram ........................................................................................................ 15 Figure 5: PCM Interface with Linear PCM Codec ............................................................................................ 26 Figure 6: Recommended Oscillator Configuration ........................................................................................... 31 Figure 7: Recommended TCXO Connection ................................................................................................... 32 Figure 8: 50-Ball 4.5 x 4 x 0.6 mm (FPBGA) Array .......................................................................................... 38 Figure 9: 42-Bump 2.97 x 2.46 x 0.5 mm Array (Top View)............................................................................. 39 Figure 10: Startup Timing from RST_N ........................................................................................................... 50 Figure 11: Startup Timing from Power-on Reset ............................................................................................. 50 Figure 12: UART Timing .................................................................................................................................. 51 Figure 13: PCM Interface Timing (Short Frame Synchronization, Master Mode) ............................................ 52 Figure 14: PCM Interface Timing (Short Frame Synchronization, Slave Mode) .............................................. 53 Figure 15: PCM Interface Timing (Long Frame Synchronization, Master Mode)............................................. 54 Figure 16: PCM Interface Timing (Long Frame Synchronization, Slave Mode)............................................... 55 Figure 17: BSC Interface Timing Diagram ....................................................................................................... 56 Figure 18: I2S Transmitter Timing .................................................................................................................... 59 Figure 19: I2S Receiver Timing........................................................................................................................ 59 Figure 20: BCM20713A1KUFBXG Mechanical Drawing ................................................................................. 60 Figure 21: 42-Bump BCM20713A1KUBG Mechanical Drawing ...................................................................... 61 Figure 22: Reel, Labeling, and Packing Specification...................................................................................... 62 Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 6 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet List of Tables List of Tables Table 1: Power Control Pin Summary.............................................................................................................. 19 Table 2: PCM Interface Time Slotting Scheme ................................................................................................ 27 Table 3: Crystal Interface Signal Characteristics ............................................................................................. 30 Table 4: Truth Table......................................................................................................................................... 33 Table 5: Package Options................................................................................................................................ 33 Table 6: External LPO Signal Requirements ................................................................................................... 35 Table 7: BCM20713 Signal Descriptions ......................................................................................................... 36 Table 8: Ball Map for the 50-Ball BCM20713A1KUFBXG ............................................................................... 38 Table 9: Ball Map for the 42-Bump BCM20713A1KUBG................................................................................. 39 Table 10: Absolute Maximum Ratings ............................................................................................................. 40 Table 11: Power Supply................................................................................................................................... 41 Table 12: High-Voltage Regulator (HV LDO) Electrical Specifications ............................................................ 41 Table 13: Main Regulator (Main LDO) Electrical Specifications ...................................................................... 41 Table 14: Digital I/O Characteristics ................................................................................................................ 42 Table 15: ESD Specifications .......................................................................................................................... 42 Table 16: Pad I/O Characteristics .................................................................................................................... 43 Table 17: Current Consumption—Class 1(10 dBm) ........................................................................................ 44 Table 18: Current Consumption—Class 2 (2 dBm) ......................................................................................... 45 Table 19: Operating Conditions ....................................................................................................................... 46 Table 20: Receiver RF Specifications, ............................................................................................................ 46 Table 21: Transmitter RF Specifications , ....................................................................................................... 48 Table 22: UART Timing Specifications ............................................................................................................ 51 Table 23: PCM Interface Timing Specifications (Short Frame Synchronization, Master Mode) ...................... 52 Table 24: PCM Interface Timing Specifications (Short Frame Synchronization, Slave Mode) ........................ 53 Table 25: PCM Interface Timing Specifications (Long Frame Synchronization, Master Mode)....................... 54 Table 26: PCM Interface Timing Specifications (Long Frame Synchronization, Slave Mode)......................... 55 Table 27: BSC Interface Timing Specifications................................................................................................ 56 Table 28: Timing for I2S Transmitters and Receivers ...................................................................................... 58 Table 29: Part Ordering Information ................................................................................................................ 63 Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 7 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet About This Document About This Document Purpose and Audience The Broadcom® BCM20713 is a monolithic, single-chip, Bluetooth 4.0 compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver. This data sheet provides detailed information on the features, functionality, and operational specifications of the BCM20713. Acronyms and Abbreviations In most cases, acronyms and abbreviations are defined on first use. For a comprehensive list of acronyms and other terms used in Broadcom documents, go to: http://www.broadcom.com/press/glossary.php. Document Conventions The following conventions may be used in this document: Convention Description Bold User input and actions: for example, type exit, click OK, press Alt+C Monospace Code: #include <iostream> HTML: <td rowspan = 3> Command line commands and parameters: wl [-l] <command> <> Placeholders for required elements: enter your <username> or wl <command> [] Indicates optional command-line parameters: wl [-l] Indicates bit and byte ranges (inclusive): [0:3] or [7:0] Technical Support Broadcom provides customer access to a wide range of information, including technical documentation, schematic diagrams, product bill of materials, PCB layout information, and software updates through its customer support portal (https://support.broadcom.com). For a CSP account, contact your Sales or Engineering support representative. In addition, Broadcom provides other product support through its Downloads and Support site (http://www.broadcom.com/support/). Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 8 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Overview Section 1: Overview The Broadcom® BCM20713 complies with the Bluetooth Core Specification, version 4.0 and is designed for use with a standard host controller interface (HCI) UART. The combination of the Bluetooth baseband core (BBC), a Peripheral Transport Unit (PTU), and an ARM-based microprocessor with on-chip ROM provides a complete lower layer Bluetooth protocol stack, including the link controller (LC), link manager (LM), and HCI. Major Features Major features of the BCM20713 include: • Support for Bluetooth 4.0 + EDR, including the following options: – Whitelist size of 25 – Enhanced Power Control – HCI Read Encryption Key Size command • Full support for Bluetooth 2.1 + EDR additional features: – Secure simple pairing (SSP) – Encryption pause resume (EPR) – Enhance inquiry response (EIR) – Link supervision time out (LSTO) – Sniff subrating (SSR) – Erroneous data (ED) – Packet boundary flag (PBF) • Built-in low drop-out (LDO) regulators (2) – 1.63 to 5.5V input voltage range – 1.8 to 3.3V intermediate programmable output voltage • Integrated RF section – Single-ended, 50 ohm RF interface – Built-in TX/RX switch functionality – TX Class 1 output power capability – -88 dBm RX sensitivity basic rate • Supports maximum Bluetooth data rates over HCI UART and SPI interfaces • Multipoint operation, with up to seven active slaves – Maximum of seven simultaneous active ACL links – Maximum of three simultaneous active SCO and eSCO links, with Scatternet support • Scatternet operation, with up to four active piconets (with background scan and support for ScatterMode) • High-speed HCI UART transport support – H4 five-wire UART (four signal wires, one ground wire) – H5 three-wire UART (two signal wires, one ground wire) Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 9 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Major Features – Maximum UART baud rates of 4 Mbps – Low-power out-of-band BT_WAKE and HOST_WAKE signaling – VSC from host transport to UART – Proprietary compressing scheme (allows more than two simultaneous A2DP packets and up to five devices at a time) • Channel quality-driven data rate (CQDDR) and packet type selection • Standard Bluetooth test modes • Extended radio and production test mode features • Full support for power savings modes: – Bluetooth standard hold and sniff – Deep sleep modes and regulator shutdown • Supports wideband speech (WBS) over PCM and packet loss concealment (PLC) for better audio quality • 2-, 3-, and 4-wire coexistence • Power amplifier (PA) shutdown for externally controlled coexistence, such as WIMAX • Built-in LPO clock or operation using an external LPO clock • TCXO input and auto-detection of all standard handset clock frequencies (supports low-power crystal, which can be used during Power Saving mode with better timing accuracy) • OR gate for combining a host clock request with a Bluetooth clock request (operates even when the Bluetooth core logic is powered off) • Larger patch RAM space to support future enhancements • Serial flash Interface with native support for devices from several manufacturers • One-time programmable (OTP) memory Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 10 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Block Diagram Block Diagram Figure 2 on page 11 shows the interconnect of the major BCM20713 physical blocks and associated external interfaces. Figure 2: Functional Block Diagram ARM7TDMI-S DMA Scan JTAG Address Decoder Trap & Patch 32-bit AHB BI AHB2APB WD Timer Remap & Pause GPIO+Aux SW Timers OTP 128 bytes) Bus Arb AHB2MEM AHB2MEM PMU Control ROM 384 KB RAM 112 KB Interrupt Controller JTAG Master Digital Demod Bit Sync Buffer APU Debug UART Blue RF I/F SPI/EMPSPI (Spiffy) Low Power Scan Blue RF Registers BT Clk/ Hopper I2C_Master Rx/Tx Buffer FIFO 1 COEX U LPO PCM UART Digital Modulator Bluetooth Radio USB LCU 32-bit APB Calibration & Control SPIM FIFO 2 SECI POR PTU Usage Model The BCM20713 is designed to provide a direct interface to industrial systems, as shown in Figure 3. The device has flexible PCM and UART interfaces, enabling it to transparently connect to existing circuits. The device incorporates a number of unique features to accommodate integration into industrial systems. • The PCM interface provides multiple modes of operation to support both master and slave, as well as hybrid interfacing to one or more external codec devices. • The UART interface supports hardware flow control with tight integration to power control sideband signaling to support the lowest power operation. • Few external components are required for integration. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 11 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Usage Model Figure 3: Usage Model Voice Codec PCM UART BCM20713 Host 1.63V to 5.5V Battery BT_WAKE HOST_WAKE 20 or 26 MHz crystal oscillator* LPO Clock LPO_INPUT * An external LPO clock is required if the main clock is not 20 MHz. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 12 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Integrated Radio Transceiver S e c t i o n 2 : I n t e g ra t e d R a d i o Tra n s c e i v e r The BCM20713 has an integrated radio transceiver that has been optimized for use in 2.4 GHz Bluetooth wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4 GHz unlicensed ISM band. The BCM20713 is fully compliant with the Bluetooth Radio Specification and enhanced data rate specification and meets or exceeds the requirements to provide the highest communication link quality of service. Transmitter Path The BCM20713 features a fully integrated zero IF transmitter. The baseband transmitted data is digitally modulated in the modem block and up-converted to the 2.4 GHz ISM band in the transmitter path. The transmitter path consists of signal filtering, I/Q up-conversion, a high-output power amplifier (PA), and RF filtering. The BCM20713 also incorporates modulation schemes to support enhanced data rates. • /4-DQPSK for 2 Mbps • 8-DPSK for 3 Mbps Digital Modulator The digital modulator performs the data modulation and filtering required for the GFSK, /4-DQPSK, and 8-DPSK signals. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much more stable than direct VCO modulation schemes. Power Amplifier The BCM20713 has an integrated PA that can be configured for Class 2 operation, transmitting up to +4 dBm. The PA can also be configured for Class 1 operation, transmitting up +10 dBm at the chip in gFSK mode, when a minimum supply voltage of 2.5V is applied to VDDTF. Because of the linear nature of the PA, combined with integrated filtering, minimal external filtering is required to meet Bluetooth and regulatory harmonic and spurious requirements. Using a highly linearized, temperature compensated design, the PA can transmit +10 dBm for basic rate and +8 dBm for enhanced data rates (2 to 3 Mbps). A flexible supply voltage range allows the PA to operate from 1.2V to 3.3V. A minimum supply voltage of 2.5V is required at VDDTF to achieve +10 dBm of transmit power. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 13 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Receiver Path Receiver Path The receiver path uses a low IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology, with built-in out-of-band attenuation, enables the device to be used in most applications without off-chip filtering. For integrated handset operation where the Bluetooth function is integrated close to the cellular transmitter, minimal external filtering is required to eliminate the desensitization of the receiver by the cellular transmit signal. Digital Demodulator and Bit Synchronizer The digital demodulator and bit synchronizer uses the low IF received signal to perform an optimal frequency tracking and bit synchronization algorithm. Receiver Signal Strength Indicator The BCM20713 radio provides a Receiver Signal Strength Indicator (RSSI) signal to the baseband so that the controller can take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the transmitter should increase or decrease its output power. Local Oscillator Generation Local Oscillator (LO) generation provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. The LO generation subblock employs an architecture for high immunity to LO pulling during PA operation. The device uses fully-integrated PLL loop filters. Calibration The radio transceiver features an automated calibration scheme that is fully self-contained in the radio. User interaction is not required during normal operation or during manufacturing to provide the optimal performance. Calibration optimizes the performance of all major blocks in the radio, including gain and phase characteristics of filters, matching between key components, and key gain blocks. Calibration, which takes process and temperature variations into account, occurs transparently during the settling time of the hops, adjusting for temperature variations as the device cools and heats during normal operation. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 14 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Internal LDO Regulator Internal LDO Regulator Two internal Low Drop-Out (LDO) voltage regulators eliminate the need for external voltage regulators and therefore reduce the BOM. The first LDO is a preregulator (HV LDO). The second LDO (Main LDO) supplies the main power to the BCM20713 (see Figure 2 on page 11). The HV LDO has an input voltage range of 2.3V to 5.5V. The input VBAT is ideal for batteries. The VREGHV output is programmable from 1.8V to 3.3V, in 100 mV steps. The dropout voltage is 200 mV. The HV LDO can supply up to 95 mA, which leaves spare power for external circuitry such as an RF power amp for higher transmit power. If the HV LDO is not used, to turn off the HV LDO and minimize current consumption, connect the VBAT input to the VREGHV output. Firmware can then disable the HV LDO, saving the quiescent current. The HV LDO default output voltage is 2.9V, allowing this regulator to be used to power external NV memory devices, as well as the VDDO rail. The firmware can then adjust this output to as low as 1.8V, if desired, to power VDDTF. The main LDO has a 1.22V output (VREG) and is used to supply main power to the BCM20713. The input of this LDO (VREGHV) has an input voltage range of from 1.63V to 3.63V. The output of the HV LDO is internally connected to the input to the main LDO. Power can be applied to VREGHV when the HV LDO is not used. The main LDO supplies power to the entire device for Class 2 operation. The main LDO can drive up to 60 mA, which leaves spare power for external circuitry. The main LDO is bypassed by not connecting anything to its output (VREG) and driving 1.12V–1.32V directly to VDDC and VDDRF. REG_EN provides a control signal for the host to control power to the BCM20713. When power is enabled, the BCM20713 will require complete initialization. Figure 4: LDO Functional Block Diagram BCM20713 HV LDO REG_EN Broadcom® December 21, 2015 • 20713-DS102-R VBAT Main LDO VREGHV VREG Single-Chip Bluetooth Transceiver and Baseband Processor Page 15 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Bluetooth Baseband Core Section 3: Bluetooth Baseband Core The Bluetooth baseband core (BBC) implements the time critical functions required for high-performance Bluetooth operation. The BBC manages buffering, segmentation, and data routing for all connections. It also buffers data that passes through it, handles data flow control, schedules SCO/ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it independently handles HCI event types and HCI command types. Transmit and Receive Functions The following transmit and receive functions are implemented in the BBC hardware to increase the reliability and security of the TX/RX data before sending the data over the air: In the transmitter: • Data framing • Forward error correction (FEC) generation • Header error control (HEC) generation • Cyclic redundancy check (CRC) generation • Key generation • Data encryption • Data whitening In the receiver: • Symbol timing recovery • Data deframing • FEC • HEC • CRC • Data decryption • Data dewhitening Bluetooth 4.0 + EDR Features The BCM20713 supports Bluetooth 4.0 + EDR, including the following options: • Whitelist size of 25 • Enhanced Power Control • HCI Read Encryption Key Size command Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 16 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Frequency Hopping Generator The BCM20713 provides full support for Bluetooth 2.1 + EDR additional features: • Secure simple pairing (SSP) • Encryption pause resume (EPR) • Enhance inquiry response (EIR) • Link supervision time out (LSTO) • Sniff subrating (SSR) • Erroneous data (ED) • Packet boundary flag (PBF) Frequency Hopping Generator The frequency hopping sequence generator selects the correct hopping channel number, based on the link controller state, Bluetooth clock, and device address. Link Control Layer The link control layer is part of the Bluetooth link control functions implemented in dedicated logic in the link control unit (LCU). This layer consists of the Command Controller that takes commands from the software and other controllers that are activated or configured by the Command Controller to perform the link control tasks. There are two major states–standby and connection. Each task establishes a different state in the Bluetooth link controller. In addition, there are eight substates—page, page scan, inquiry, inquiry scan, park, sniff subrate, and hold. Test Mode Support The BCM20713 fully supports Bluetooth Test Mode, including the transmitter tests, normal and delayed Loopback tests, and the reduced hopping sequence. In addition to the standard Bluetooth Test mode, the device supports enhanced testing features to simplify RF debugging and qualification and type approval testing. These test features include: • Fixed frequency carrier wave (unmodulated) transmission – Simplifies some type approval measurements (Japan) – Aids in transmitter performance analysis • Fixed frequency constant receiver mode – Directs receiver output to I/O pin – Allows for direct BER measurements using standard RF test equipment – Facilitates spurious emissions testing for receive mode Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 17 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet • Power Management Unit Fixed frequency constant bit stream transmission – Unmodulated, 8-bit fixed pattern, PRBS-9, or PRBS-15 – Enables modulated signal measurements with standard RF test equipment • Packetized connectionless transmitter test – Hopping or fixed frequency – Multiple packet types supported – Multiple data patterns supported • Packetized connectionless receiver test – Fixed frequency – Multiple packet types supported – Multiple data patterns supported Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked through power management registers or packet handling in the baseband core. This section contains descriptions of the PMU features. RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz transceiver. The transceiver then processes the power-down functions, accordingly. Host Controller Power Management The host can place the device in a sleep state, in which all nonessential blocks are powered off and all nonessential clocks are disabled. Power to the digital core is maintained so that the state of the registers and RAM is not lost. In addition, the LPO clock is applied to the internal sleep controller so that the chip can wake automatically at a specified time or based on signaling from the host. The goal is to limit the current consumption to a minimum, while maintaining the ability to wake up and resume a connection with minimal latency. If a scan or sniff session is enabled while the device is in Sleep mode, the device automatically will wake up for the scan/sniff event, then go back to sleep when the event is done. In this case, the device uses its internal LPObased timers to trigger the periodic wake up. While in Sleep mode, the transports are idle. However, the host can signal the device to wake up at any time. If signaled to wake up while a scan or sniff session is in progress, the session continues but the device will not sleep between scan/sniff events. Once Sleep mode is enabled, the wake signaling mechanism can also be thought of as a sleep signaling mechanism, since removing the wake status will often cause the device to sleep. In addition to a Bluetooth device wake signaling mechanism, there is a host wake signaling mechanism. This feature provides a way for the Bluetooth device to wake up a host that is in a reduced power state. There are two mechanisms for the device and the host to signal wake status to each other: Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 18 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Power Management Unit Bluetooth WAKE (BT_WAKE) and Host WAKE (and HOST_WAKE) signaling The BT_WAKE pin (GPIO_0) allows the host to wake the BT device, and HOST_WAKE (GPIO_1) is an output that allows the BT device to wake the host. In-band UART signaling The CTS and RTS signals of the UART interface are used for BT wake (CTS) and Host wake (RTS) functions in addition to their normal function on the UART interface. Note that this applies for both H4 and H5 protocols. When running in SPI mode, the BCM20713 has a mode where it enters Sleep mode when there is no activity on the SPI interface for a specified (programmable) amount of time. Idle mode is detected when the SPI_CSN is left deasserted. Whether to sleep on an idle interface and the amount of time to wait before entering Sleep mode can be programed by the host. Once the BCM20713 enters sleep, the host can wake it by asserting SPI_CSN. If the host decides to sleep, the BCM20713 will wake up the host by asserting SPI_INT when it has data for it. Note: Successful operation of the power management handshaking signals requires coordinated support between the device firmware and the host software. Table 1: Power Control Pin Summary Pin Direction Description BT_WAKE (GPIO_0) Host output BT input Bluetooth device wake-up: Signal from the host to the Bluetooth device that the host requires attention. • Asserted = Bluetooth device must wake up or remain awake. • Deasserted = Bluetooth device may sleep when sleep criteria are met. The polarity of this signal is software configurable and can be asserted high or low. By default, BT_WAKE is active-low (if BT-WAKE is low it requires the device to wake up or remain awake). HOST_WAKE BT output (GPIO_1) Host input Host wake-up. Signal from the Bluetooth device to the host indicating that Bluetooth device requires attention. • Asserted = Host device must wake up or remain awake. • Deasserted = Host device may sleep when sleep criteria are met. The polarity of this signal is software configurable and can be asserted high or low. CLK_REQ (GPIO_5) BT output Clock request • Asserted = External clock reference required • Deasserted = External clock reference may be powered down The polarity of CLK_REQ is software configurable and can be set to active high (TM0 = 1) or active low (TM0 = 0). REG_EN BT input Enables the internal preregulator and main regulator outputs. REG_EN is active-high. • 1 = Enabled • 0 = Disabled Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 19 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Power Management Unit Bluetooth Baseband Core Power Management The device provides the following low-power operations for the Bluetooth Baseband Core (BBC): • Physical layer packet handling turns RF on and off dynamically within packet TX and RX. • Bluetooth specified low-power connection modes—Sniff, Hold, and Park. While in these low-power connection modes, the device runs on the Low Power Oscillator and wakes up after a predefined time period. Backdrive Protection The BCM20713 provides a backdrive protection feature that allows the device to be turned off while the host and other devices in the system remain operational. When the device is not needed in the system, VDD_RF and VDDC are shut down and VDDO remains powered. This allows the device to be effectively off, while keeping the I/O pins powered so that they do not draw extra current from other devices connected to the I/O. Note: VDD_RF collectively refers to the VDDTF, VDDIF, VDDLNA, VDDPX, and VDDRF RF power supplies. Note: Never apply voltage to I/O pins if VDDO is not applied. During the low power shutdown state and as long as VDDO remains applied to the device, all outputs are tristated and all digital and analog clocks are disabled. Input voltages must remain within the limits defined for normal operation. This is done to either prevent current draw and back loading on digital signals in the system. It also enables the device to be fully integrated in an embedded device and take full advantage of the lowest power savings modes. If VDDC is powered up externally (not connected to VREG), VDDC requires 750K ohms to ground during low-power shutdown. If VDDC is powered up by VREG, VDDC does not require 750K ohms to ground because the internal main LDO has about 750 K ohms to ground when turned off. Several signals, including the frequency reference input (XTAL_IN) and external LPO input (LPO_IN), are designed to be high-impedance inputs that will not load down the driving signal, even if VDDO power is not applied to the chip. The other signals with back drive prevention are RST_N, COEX_OUT0, COEX_OUT1, COEX_IN, PCM_SYNC, PCM_CLK, PCM_OUT, PCM_IN, UART_RTS_N, UART_CTS_N, UART_RXD, UART_TXD, GPIO_0, GPIO_1, GPIO_2, GPIO_4, GPIO_7, CFG_SEL, and OTP_DIS. All other IO signals must remain at VSS until VDDO is applied. Failing to do this can result in unreliable startup behavior. When powered on, using REG_EN is the same as applying power to the BCM20713. The device does not have information about its state before being powered-down. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 20 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Adaptive Frequency Hopping Adaptive Frequency Hopping The BCM20713 supports host channel classification and dynamic channel classification Adaptive Frequency Hopping (AFH) schemes, as defined in the Bluetooth specification. Host channel classification enables the host to set a predefined hopping map for the device to follow. If dynamic channel classification is enabled, the device gathers link quality statistics on a channel-by-channel basis to facilitate channel assessment and channel map selection. To provide a more accurate frequency hop map, link quality is determined using both RF and baseband signal processing. Collaborative Coexistence The BCM20713 provides extensions and collaborative coexistence to the standard Bluetooth AFH for direct communication with WLAN devices. Collaborative coexistence enables WLAN and Bluetooth to operate simultaneously in a single device. The device supports industry-standard coexistence signaling, including 802.15.2, and supports Broadcom and third-party WLAN solutions. Using a multi-tiered prioritization approach, relative priorities between data types and applications can be set. This approach maximizes the performance-WLAN data throughput vs. voice quality vs. link performance. A PA shutdown pin is available to allow full external control of the RF output for other types of coexistence, such as WIMAX. Serial Enhanced Coexistence Interface The Serial Enhanced Coexistence Interface (Serial ECI or SECI) is a proprietary Broadcom interface between Broadcom WLAN devices and Bluetooth devices. It is an optional replacement to the legacy 3- or 4-wire coexistence feature, which is also available. The following key features are associated with the interface: • Enhanced coexistence data can be exchanged over SECI_IN and SECI_OUT. • It supports generic UART communication between WLAN and Bluetooth devices. • To conserve power, it is disabled when inactive. • It supports automatic resynchronizaton upon waking from sleep mode. • It supports a baud rate of up to 4 Mbps. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 21 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Serial Enhanced Coexistence Interface SECI Advantages The advantages of the SECI over the legacy 3-wire coexistence interface are: • Only two wires are required: SECI_IN and SECI_OUT. • Up to 48-bits of coexistence data can be exchanged. Previous Broadcom stand-alone Bluetooth devices such as the BCM2070 supported only a 3-wire or 4-wire coexistence interface. Previous Broadcom WLAN and Bluetooth combination devices such as the BCM4325, BCM4329, and BCM4330 support an internal parallel enhanced coexistence interface for more efficient WLAN and Bluetooth information exchange. The SECI allows enhanced coexistence information to be passed to a companion Broadcom WLAN chip through a serial interface using fewer I/O than the 3-wire coexistence scheme. The 48-bits of the SECI significantly enhance WLAN and Bluetooth coexistence by sharing such information as frequencies used and radio usage times. The exact contents of the SECI are Broadcom confidential. SECI I/O The BCM20713 does not have dedicated SECI_IN or SECI_OUT pins, but the two pin functions can be mapped to the following digital I/O: the UART, GPIO, SPIM (or BSC), PCM, and COEX pins. Pin function mapping is controlled by the config file that is either stored in NVRAM or downloaded directly into on-chip RAM from the host. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 22 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Microprocessor Unit S e c t i o n 4 : M i c ro p r o c e s s o r U n i t The BCM20713 microprocessor unit runs software from the link control (LC) layer up to the host controller interface (HCI). The microprocessor is based on the ARM7TDMIS 32-bit RISC processor with embedded ICERT debug and JTAG interface units. The microprocessor also includes 384 KB of ROM memory for program storage and boot ROM, 112 KB of RAM for data scratch-pad, and patch RAM code. The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations, including automatic host transport selection from SPI or UART, with or without external NVRAM. At power-up, the lower layer protocol stack is executed from the internal ROM. External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patches can be downloaded from the host to the device through the SPI or UART transports, or using external NVRAM. The device can also support the integration of user applications and profiles using an external serial flash memory. NVRAM Configuration Data and Storage Serial Interface The BCM20713 includes an SPI master controller that can be used to access serial flash memory. The SPI master contains an AHB slave interface, transmit and receive FIFOs, and the SPI core PHY logic. Data is transferred to and from the module by the system CPU. DMA operation is not supported. The BCM20713 supports serial flash vendors Atmel, MXIC, and Numonyx. The most commonly used parts from two of these vendors are: • AT25BCM512B, manufactured by Atmel • MX25V512ZUI-20G, manufactured by MXIC EEPROM The BCM20713 includes a Broadcom Serial Control (BSC) master interface. The BSC interface supports lowspeed and fast mode devices and is compatible with I2C slave devices. Multiple I2C master devices and flexible wait state insertion by the master interface or slave devices are not supported. The BCM20713 provides 400 kHz, full speed clock support. The BSC interface is programmed by the CPU to generate the following BSC transfer types on the bus: • Read-only • Write-only • Combined read/write • Combined write-read Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 23 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet External Reset NVRAM may contain configuration information about the customer application, including the following: • Fractional-N information • BD_ADDR • UART baud rate • SDP service record • File system information used for code, code patches, or data External Reset The BCM20713 has an integrated power-on reset circuit which completely resets all circuits to a known power on state. This action can also be driven by an external reset signal, which can be used to externally control the device, forcing it into a power-on reset state. The RST_N signal input is an active-low signal for all versions of the BCM20713. The BCM20713 requires an external pull-up resistor on the RST_N input. Alternatively, the RST_N input can be connected to REG_EN or driven directly by a host GPIO. One-Time Programmable Memory The BCM20713 includes a One-Time Programmable (OTP) memory, allowing manufacturing customization and avoiding the need for an on-board NVRAM.If customization is not required, then the OTP does not need to be programmed. Whether the OTP is programmed or not, it is disabled after the boot process completes to save power. The OTP size is 128 bytes. The OTP is designed to store a minimal amount of information. Aside from OTP data, most user configuration information will be downloaded into RAM after the BCM20713 boots up and is ready for host transport communication. The OTP contents are limited to: • Parameters required prior to downloading user configuration to RAM. • Parameters unique to a customer design. Contents The following are typical parameters programmed into the OTP memory: • BD_ADDR • Software license key • Output power calibration • Frequency trimming • Initial status LED drive configuration The OTP contents also include a static error correction table to improve yield during the programming process as well as forward error correction codes to eliminate any long-term reliability problems. The OTP contents associated with error correction are not visible by customers. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 24 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet One-Time Programmable Memory Programming OTP memory programming takes place through a combination of Broadcom software integrated with the manufacturing test software and code embedded in BCM20713 firmware. Programming the OTP requires a 3.3V supply. The OTP programming supply comes from the VDDO pin. The OTP power supply can be as low as 1.8V in order to read the OTP contents. OTP_DIS is brought out to a pin on the WLBGA package but not on the FPBGA package, and is internally pulled low. If the OTP_DIS pin is left floating or externally pulled low, then the OTP will be enabled. if the OTP_DIS pins is externally pulled high, then the OTP will be disabled. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 25 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Peripheral Transport Unit S e c t i o n 5 : P e r i p h e r a l Tra n s p o r t U n i t This section discusses the PCM, UART, and SPI peripheral interfaces. The BCM20713 has a 1040 byte transmit and receive FIFO, which is large enough to hold the entire payload of the largest EDR BT packet (3-DH5). PCM Interface The BCM20713 PCM interface can connect to linear PCM codec devices in master or slave mode. In master mode, the device generates the PCM_BCLK and PCM_SYNC signals. In slave mode, these signals are provided by another master on the PCM interface as inputs to the device. The device supports up to three SCO or eSCO channels through the PCM interface and each channel can be independently mapped to any available slot in a frame. The host can adjust the PCM interface configuration using vendor-specific HCI commands or it can be setup in the configuration file. System Diagram Figure 5 shows options for connecting the device to a PCM codec device as a master or a slave. Figure 5: PCM Interface with Linear PCM Codec PCM Codec (Master) PCM_IN PCM_OUT PCM_BCLK PCM_SYNC BCM20713 (Slave) PCM Interface Slave Mode PCM Codec (Slave) PCM_IN PCM_OUT PCM_BCLK PCM_SYNC BCM20713 (Master) PCM Interface Master Mode PCM Codec (Hybrid) PCM_IN PCM_OUT PCM_BCLK PCM_SYNC BCM20713 (Hybrid) PCM Interface Hybrid Mode Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 26 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet PCM Interface Slot Mapping The device supports up to three simultaneous, full-duplex SCO or eSCO channels. These channels are timemultiplexed onto the PCM interface using a time slotting scheme based on the audio sampling rate, as described in Table 2. Table 2: PCM Interface Time Slotting Scheme Audio Sample Rate Time Slotting Scheme 8 kHz The number of slots depends on the selected interface rate, as follows: Interface rate Slot 128 1 256 2 512 4 1024 8 2048 16 16 kHz The number of slots depends on the selected interface rate, as follows: Interface rate Slot 256 1 512 2 1024 4 2048 8 Transmit and receive PCM data from an SCO channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to allow other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the PCM clock during the last bit of the slot. Wideband Speech The BCM20713 provides support for wideband speech (WBS) in two ways: • Transparent mode: The host encodes WBS packets and the encoded packets are transferred over the PCM bus for SCO or eSCO voice connections. In Transparent mode, the PCM bus is typically configured in master mode for a 4 kHz sync rate with 16-bit samples, resulting in a 64 kbps bit rate. • On-chip SmartAudio® technology: The BCM20713 can perform Subband-Codec (SBC) encoding and decoding of linear 16 bits at 16 kHz (256 kbps rate) transferred over the PCM bus. Frame Synchronization The device supports both short and long frame synchronization types in both master and slave configurations. In short frame synchronization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio frame rate (which is a single bit period in width) and synchronized to the rising edge of the bit clock. The PCM slave expects PCM_SYNC to be high on the falling edge of the bit clock and the first bit of the first slot to start at the next rising edge of the clock. In the long frame synchronization mode, the frame synchronization signal is an active-high pulse at the 8 kHz audio frame rate. However, the duration is 3-bit periods and the pulse starts coincident with the first bit of the first slot. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 27 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet HCI Transport Detection Configuration Data Formatting The device can be configured to generate and accept several different data formats. The device uses 13 of the 16 bits in each PCM frame. The location and order of these 13 bits is configurable to support various data formats on the PCM interface. The remaining three bits are ignored on the input, and may be filled with zeros, ones, a sign bit, or a programmed value on the output. The default format is 13-bit two’s complement data, left justified, and clocked most significant bit first. HCI Transport Detection Configuration The BCM20713 supports the following interface types for the HCI transport from the host: • UART (H4 and H5) • SPI Only one host interface can be active at a time. The firmware performs a transport detect function at boot-time to determine which host is the active transport. It can auto-detect the UART interface, but the SPI interface must be selected by strapping the SCL pin to 0. The complete algorithm is summarized as follows: 1. Determine if SCL is pulled low. If it is, select SPI as HCI host transport. 2. Determine if any local NVRAM contains a valid configuration file. If it does and a transport configuration entry is present, select the active transport according to entry, and then exit the transport detection routine. 3. Look for CTS_N = 0 on the UART interface. If it is present, select UART. 4. Repeat Step 3 until transport is determined. UART Interface The UART physical interface is a standard, 4-wire interface (RX, TX, RTS, CTS) with adjustable baud rates from 9600 bps to 4.0 Mbps. The interface features an automatic baud rate detection capability that returns a baud rate selection. Alternatively, the baud rate can be selected via a vendor-specific UART HCI command. The interface supports Bluetooth UART HCI (H4) specifications. The default baud rate for H4 is 115.2 Kbaud. The following baud rates are supported: • 9600 • 115200 • 2000000 • 14400 • 230400 • 3000000 • 19200 • 460800 • 3250000 • 28800 • 921600 • 3692000 • 38400 • 1444444 • 4000000 • 57600 • 1500000 Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 28 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet SPI Normally, the UART baud rate is set by a configuration record downloaded after reset or by automatic baud rate detection. The host does not need to adjust the baud rate. Support for changing the baud rate during normal HCI UART operation is provided through a vendor-specific command. The BCM20713 UART operates with the host UART correctly, provided the combined baud rate error of the two devices is within ±2%. HCI 3-Wire Transport (UART H5) The BCM20713 supports H5 UART transport for serial UART communications. H5 reduces the number of signal lines required by eliminating CTS and RTS, when compared to H4. In addition, in-band sleep signaling is supported over the same interface so that the 4-wire UART and the 2-wire sleep signaling interface can be reduced to a 2-wire UART interface, saving four I/Os on the host. H5 requires the use of an external LPO. CTS must be pulled low. SPI The BCM20713 supports a slave SPI HCI transport with an input clock range of up to 16 MHz. Higher clock rates may be possible. The physical interface between the SPI master and the BCM20713 consists of the four SPI signals (SPI_CSB, SPI_CLK, SPI_SI, and SPI_SO) and one interrupt signal (SPI_INT). The BCM20713 can be configured to accept active-low or active-high polarity on the SPI_CSB chip select signal. It can also be configured to drive an active-low or active-high SPI_INT interrupt signal. Bit ordering on the SPI_SI and SPI_SO data lines can be configured as either little-endian or big-endian. Additionally, proprietary sleep mode, halfduplex handshaking is implemented between the SPI master and the BCM20713. SPI_INT is required to negotiate the start of a transaction. The SPI interface does not require flow control in the middle of a payload. The FIFO is large enough to handle the largest packet size. Only the SPI master can stop the flow of bytes on the data lines, since it controls SPI_CSB and SPI_CLK. Flow control should be implemented in higher layer protocols. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 29 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Frequency References S e c t i o n 6 : F re q u e n c y R e f e r e n c e s The BCM20713 uses two different frequency references for normal and low-power operational modes. An external crystal or frequency reference driven by a Temperature Compensated Crystal Oscillator (TCXO) signal is used to generate the radio frequencies and normal operation clocking. Either an external 32.768 kHz or fully integrated internal Low-Power Oscillator (LPO) is used for low-power mode timing. Crystal Interface and Clock Generation The BCM20713 uses a fractional-N synthesizer to generate the radio frequencies, clocks, and data/packet timing, enabling it to operate from any of a multitude of frequency sources. The source can be external, such as a TCXO, or a crystal interfaced directly to the device. The default frequency reference setting is for a 20 MHz crystal or TCXO. The signal characteristics for the crystal interface are listed in Table 3 on page 30. Table 3: Crystal Interface Signal Characteristics Parameter Crystal External Frequency Reference a Acceptable frequencies 12–52 MHz in 2 ppm steps Crystal load capacitance ESR a Units 12–52 MHz in 2 ppm steps – 12 (typical) N/A pF 60 (max) – Ω Power dissipation 200 (max) – W Input signal amplitude N/A 400 to 2000 mVp-p 2000 to 3300 (requires a 10 pF DC blocking capacitor to attenuate the signal) Signal type N/A Square-wave or sine-wave – Input impedance N/A 1 2 MΩ pF Phase noise @ 1 kHz @ 10 kHz @ 100 kHz @ 1 MHz N/A N/A N/A N/A N/A – < –120b < –131b < –136b < –136b – dBc/Hz dBc/Hz dBc/Hz dBc/Hz Auto-detection frequencies when using external LPOc 12, 13, 14.4, 15.36, 16.2, 16.8, 12, 13, 14.4, 15.36, 16.2, 16.8, 18, MHz 18, 19.2, 19.44, 19.68, 19.8, 20, 19.2, 19.44, 19.68, 19.8, 20, 24, 24, 26, 33.6, 37.4, and 38.4 26, 33.6, 37.4, and 38.4 Tolerance without frequency trimmingd ±20 ±20 ppm Initial frequency tolerance trimming range ±50 ±50 ppm a. The frequency step size is approximately 80 Hz resolution. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 30 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet b. c. d. Crystal Oscillator With a 26 MHz reference clock. For a 13 MHz clock, subtract 6 dB. For a 52 MHz clock, add 6 dB. Auto-detection of the frequency requires the crystal or external frequency reference to have less than ±50 ppm of variation and also requires an external LPO frequency which has less than ±250 ppm of variation at the time of detection. AT-Cut crystal or TXCO recommended. Crystal Oscillator The BCM20713 can use an external crystal to provide a frequency reference. The recommended configuration for the crystal oscillator, including all external components, is shown in Figure 6. Figure 6: Recommended Oscillator Configuration XIN 0 to 18 pF* Crystal Oscillator XOUT 0 to 18 pF* *Capacitor value range depends on the manufacturer of the XTAL as well as board layout. External Frequency Reference An external frequency reference generated by a TCXO signal that may be directly connected to the crystal input pin on the BCM20713, as shown in Figure 7. The external frequency reference input is designed to not change loading on the TCXO when the BCM20713 is powered up or powered down. When using the BCM20713 with the TXCO OR gate option, GPIO 6 must be driven active high or active low. Excessive leakage current results if GPIO6 is allowed to float. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 31 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet External Frequency Reference Figure 7: Recommended TCXO Connection TCXO XIN 10–1000 pF* No Connection XOUT * Recommended value is 100 pF. Higher values produce a longer startup time. Lower values have greater isolation. Larger values help small signal swings. TCXO Clock Request Support If the application utilizes an external TCXO as a clock reference, the BCM20713 provides a clock request output to allow the system to power off the TCXO when not in use. Optionally, some packages support a TCXO OR function that allows a clock request in the system to be combined with the BCM20713 clock request output, without requiring an extra component on the board. Clock Request Output The CLK_REQ signal on the GPIO_5 lead is asserted whenever the BCM20713 is in the Awake state. It is deasserted when in Sleep state. When the BCM20713 is sleeping, it uses an LPO clock (external or internal) as the timing reference. The TM0 lead controls the polarity of the CLK_REQ output on GPIO_5 as follows: TM0 = 0 CLK_REQ is active low TM0 = 1 CLK_REQ is active high If the clock request feature is not desired, GPIO_5 can be configured for other functions. TCXO OR Option The BCM20713 has an optional feature that allows the application to perform a logical OR function on a system TCXO clock request signal and the BCM20713 clock request to form one clock request output to the TCXO device. This logical OR function is embedded in the pad ring so that it is available at any time, as long as the pad ring is receiving a VDDO supply. The function works even if the BCM20713’s digital core is sleeping or completely powered off. To use this feature, the TCXO_MODE lead must be tied high. In this mode, the GPIO_6 lead functions as the external clock request input. Without TCXO_MODE asserted, GPIO_5 functions as the clock request output (based only on the internal clock requirements of the BCM20713) and the state of GPIO_6 is ignored. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 32 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Frequency Selection As mentioned earlier, the TM0 lead controls the polarity of the CLK_REQ output on GPIO_5. However, it assumes that GPIO_6 input polarity is already consistent with the desired polarity on GPIO_5/CLK_REQ. Therefore, when TM0 is 1 for an active high output, the function is a simple OR between the external GPIO_6 and the internal clock request state. However, when TM0 is 0 for an active low output, the logic inverts the internal clock request signal and performs an AND between it and the GPIO_6 input. Even though it is using an OR gate, it still provides a logical AND on the two clock request states. Since the logic assumes that it is also active low (similar to GPIO_5 output), it does not invert the GPIO_6 input first. Table 4 on page 33 shows the truth table. Table 4: Truth Table GPIO_6 GPIO_5 CLK_REQ_IN Internal Clock Request State TM0 (0 = sleep) (0 = active low output) 0 0 0 0 0 1 0 0 1 0 0 1 1 1 0 0 0 0 1 0 0 1 1 1 1 0 1 1 1 1 1 1 CLK_REQ Package Options and TCXO Mode Only a few package options bring out TM0 to balls, allowing the application to configure them. In most packages, these pins are already configured. Table 5 lists available package options. Table 5: Package Options Part Number Package Description TM0 BCM20713A1KUFBXG 50-ball FPBGA Brought to ball BCM20713A1KUBG 42-bump WLBGA 1 Frequency Selection Any frequency within the range specified for the crystal and TCXO reference can be used. These frequencies include standard handset reference frequencies (12, 13, 14.4, 15.36, 16.2, 16.8, 18, 19.2, 19.44, 19.68, 19.8, 20, 24, 26, 33.6, 37.4, and 38.4 MHz) and any frequency between these reference frequencies, as desired by the system designer. Since bit timing is derived from the reference frequency, the BCM20713 must have the reference frequency set correctly in order for the UART and PCM interfaces to function properly. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 33 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Frequency Trimming The BCM20713 reference frequency can be set in one of three ways. • Use the default 20 MHz frequency • Designate the reference frequency in external NVRAM • Auto-detect the standard handset reference frequencies using an external LPO clock The BCM20713 is set to a default frequency of 20 MHz at the factory. For a typical design using a crystal, it is recommended that the default frequency be used, since this simplifies the design by removing the need for either external NVRAM or external LPO clock. If the application requires a frequency other than the default, the value can be stored in an external NVRAM. Programming the reference frequency in NVRAM provides the maximum flexibility in the selection of the reference frequency, since any frequency within the specified range for crystal and external frequency reference can be used. During power-on reset (POR), the device downloads the parameter settings stored in NVRAM, which can be programmed to include the reference frequency and frequency trim values. Typically, this is how a PC Bluetooth application is configured. For applications such as handsets and portable smart communication devices, where the reference frequency is one of the standard frequencies commonly used, the BCM20713 automatically detects the reference frequency and programs itself to the correct reference frequency. In order for auto-frequency detection to work properly, the BCM20713 must have a valid and stable 32.768 kHz external LPO clock present during POR. This eliminates the need for NVRAM in applications where the external LPO clock is available and an external NVRAM is typically not used. Frequency Trimming The BCM20713 uses a fractional-N synthesizer to digitally fine-tune the frequency reference input to within ±2 ppm tuning accuracy. This trimming function can be applied to either the crystal or an external frequency source such as a TCXO. Unlike the typical crystal-trimming methods used, the BCM20713 changes the frequency using a fully digital implementation and is much more stable and unaffected by crystal characteristics or temperature. Input impedance and loading characteristics remain unchanged on the TCXO or crystal during the trimming process and are unaffected by process and temperature variations. The option to use or not use frequency trimming is based on the system designer’s cost trade-off between billof-materials (BOM) cost of the crystal and the added manufacturing cost associated with frequency trimming. The frequency trimming value can either be stored in the host and written to the BCM20713 as a vendor-specific HCI command or stored in NVRAM and subsequently recalled during POR. Frequency trimming is not a substitute for the poor use of tuning capacitors at an crystal oscillator (XTAL). Occasionally, trimming can help alleviate hardware changes. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 34 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet LPO Clock Interface LPO Clock Interface The LPO clock is the second frequency reference that the BCM20713 uses to provide low-power mode timing for park, hold, and sniff. The LPO clock can be provided to the device externally, from a 32.768 kHz source or the BCM20713 can operate using the internal LPO clock. The LPO can be internally driven from the main clock. However, sleep current will be impacted. The accuracy of the internal LPO limits the maximum park, hold, and sniff intervals. Table 6: External LPO Signal Requirements Parameter External LPO Clock Units Nominal input frequency 32.768 kHz Frequency accuracy ±250 ppm Input signal amplitude 200 to 3600 mVp-p Signal type Square-wave or sine-wave – Input impedance (when power is applied or power is off) >100 <5 kΩ pF Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 35 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Pin Information Section 7: Pin Information Pin Descriptions Table 7: BCM20713 Signal Descriptions FPBGA 50-Ball WLBGA 42-Bump I/O Power Domain RES G4 D6 O VDD_RF External calibration resistor, 15 kΩ @ 1% RFP D1 C7 I/O VDD_RF RF I/O antenna port XIN G2 F5 I VDD_RF Crystal or reference input XOUT G3 E5 O VDD_RF Crystal oscillator output A4 B4 I VDDRF External LPO input B2 B5 I VDDO HV LDO and main enable Signal Description Radio Analog LPO_IN Voltage Regulators REG_EN VBAT A3 A5 I N/A HV LDO input VREGHV A2 A6 I/O N/A HV LDO output: main LDO input VREG A1 A7 O N/A Main LDO output RST_N B4 C5 I VDDO Active-low reset input TM0 C4 – I VDDO Clock request polarity select TM1 – – I VDDO Internally connected to ground TM2 F3 C6 I VDDO Reserved: connect to ground. GPIO_0 B5 C3 I/O VDDO GPIO/BT_WAKE GPIO_1 B3 B3 I/O VDDO GPIO/HOST_WAKE GPIO_2 – – I/O VDDO GPIO GPIO_3 – – I/O VDDO GPIO/LINK_IND Note: Can be configured for active high or low as well as open drain. GPIO_4 – – I/O VDDO GPIO GPIO_5 E6 F4 I/O VDDO GPIO/CLK_REQ TCXO-OR Function Out available on some packages. See Section 10: “Ordering Information,” on page 63. GPIO_6 E3 D5 I/O VDDO GPIO TCXO-OR Function In available on some packages. See Section 10: “Ordering Information,” on page 63. Straps Digital I/O Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 36 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Pin Descriptions Table 7: BCM20713 Signal Descriptions (Cont.) Signal FPBGA 50-Ball WLBGA 42-Bump I/O Power Domain Description GPIO_7 B7 – I/O VDDO DETATCH/CARD_DETECT UART_RXD D8 D2 I/O VDDO UART receive data UART_TXD C8 C2 I/O VDDO UART transmit data UART_RTS_N D7 F2 I/O VDDO UART request to send output UART_CTS_N E8 E3 I/O VDDO UART clear to send input SCL F7 E1 I/O VDDO I2C clock SDA E7 D1 I/O VDDO I2C data SPIM_CLK A8 C1 I/O VDDO Serial flash SPI clock SPIM_CS_N C7 E2 I/O VDDO Serial flash active-low chip select PCM_IN F6 D4 I/O VDDO PCM/I2S data input PCM_OUT G6 E4 I/O VDDO PCM/I2S data output PCM_CLK F4 C4 I/O VDDO PCM/I2S clock PCM_SYNC F5 A4 I/O VDDO PCM sync/I2S word select COEX_IN B6 – I/O VDDO Coexistence input COEX_OUT0 E4 – I/O VDDO Coexistence output COEX_OUT1 E5 – I/O VDDO Coexistence output – A2 I/O VDDO OTP disable pin. By default, leave this pin floating. VDDIF B1 – I N/A VDDTF C1 B7 I N/A Radio PA supply VDDLNA E1 – I N/A Radio LNA supply VDDRF F1 E7 I N/A Radio supply VDDPX G1 F7 I N/A Radio RF PLL supply VDDC A5 A3 I N/A Core logic supply VDDC B8 F1 I N/A Core logic supply VDDC F8 – I N/A Core logic supply VDDO G5 D3 I N/A Digital I/O supply voltage OTP_DIS Supplies Radio IF PLL supply VDDO A6 – I N/A Digital I/O supply voltage VDDO G8 – I N/A Digital I/O supply voltage NC – B1 I N/A No connect VSS C2 D7 – N/A Ground VSS D2 B6 – N/A Ground VSS F2 E6 – N/A Ground VSS D3 F6 – N/A Ground VSS C6 F3 – N/A Ground VSS A7 A1 – N/A Ground VSS G7 – – N/A Ground VSS – B2 – N/A Ground Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 37 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Ball Maps Ball Maps Figure 8 shows the top view of the 50-ball 4.5 x 4 x 0.6 mm (FPBGA). Figure 8: 50-Ball 4.5 x 4 x 0.6 mm (FPBGA) Array 1 2 3 4 5 6 7 8 A B C D E F G Table 8: Ball Map for the 50-Ball BCM20713A1KUFBXG 1 2 3 4 5 6 7 8 VREG VREGHV VBAT LPO_IN VDDC VDDO VSS SPIM_CLK B VDDIF REG_EN GPIO_1 RST_N GPIO_0 COEX_IN GPIO_7 VDDC C VDDTF VSS – TM0 – VSS SPIM_CS_N UART_TXD D RFP VSS VSS – – – UART_RTS_N UART_RXD E VDDLNA – GPIO6 COEX_OUT0 COEX_OUT1 GPIO_5 SDA UART_CTS_N F VDDRF VSS TM2 PCM_CLK PCM_SYNC PCM_IN SCL VDDC G VDDPX XIN XOUT RES VDDO PCM_OUT VSS VDDO A Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 38 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Ball Maps Figure 9 shows the top view of the 42-bump, 2.97 x 2.46 x 0.5 mm array. Figure 9: 42-Bump 2.97 x 2.46 x 0.5 mm Array (Top View) 1 2 3 4 5 6 7 A B C D E F Table 9: Ball Map for the 42-Bump BCM20713A1KUBG 1 2 3 4 A VSS B N/C C D 5 6 7 OTP_DIS VDDC VSS GPIO_1 PCM_SYNC VBAT VREGHV VREG LPO_IN REG_EN VSS VDDTF SPIM_CLK UART_TXD GPIO_0 PCM_CLK RST_N TM2 RFP SDA UART_RXD VDDO PCM_IN GPIO_6 RES VSS E SCL SPIM_CS_N UART_CTS_N PCM_OUT XOUT VSS VDDRF F VDDC UART_RTS_N VSS GPIO_5 XIN VSS VDDPX Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 39 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Electrical Characteristics Section 8: Electrical Characteristics Note: All voltages listed in Table 10 are referenced to VDD. Table 10: Absolute Maximum Ratings Rating Signal/Parameter DC supply voltage for RF VDD_RF a Value Unit 1.32 V DC supply voltage for core VDDC 1.32 V DC supply voltage for I/O VDDOb 3.6 V DC supply voltage for PA VDDTF 3.3 V Maximum voltage on input or output pins VIMAX VDDO + 0.3 V Minimum voltage on input or output pins VIMIN VSS – 0.3 V Storage temperature TSTG –40 to 125 °C a. b. VDD_RF collectively refers to the VDDIF, VDDLNA, VDDPX, and VDDRF RF power supplies. If VDDO is not applied, voltage should never be applied to any digital I/O pins (I/O pins should never be driven or pulled high). The list of digital I/O pins includes the following (these pins are listed in Section 7: “Pin Information,” on page 36 with VDDO shown as their power domain): GPIO[3], GPIO[5], GPIO[6] SCL, SDA N_MODE SPIM_CS_N, SPIM_CLK Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 40 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Electrical Characteristics Table 11: Power Supply Parameter Symbol DC supply voltage for RF DC supply noise for RF, from 100 kHz to 1 MHz DC supply voltage for core DC supply voltage for I/O DC supply a. b. c. Minimum Typical Maximum Unit VDD_RF VDD_RF b 1.159 – 1.22 – 1.281 150 V V rms VDDC VDDO VDDTF c 1.159 1.7 1.12 1.22 – – 1.281 3.6 3.3 V V V a VDD_RF collectively refers to the VDDIF, VDDLNA, VDDPX, VDDLNA, VDDRF RF power supplies. Overall performance defined using integrated regulation. VDDTF for Class 2 must be connected to VREG (main LDO output). VDDTF for Class 1 must be connected to VREGHV (HV LDO output) or an external voltage source. Refer to the Broadcom compatibility guide for configuration details. VDDTF requires a capacitor to ground. The value of the capacitor must be tuned to ensure optimal RF RX sensitivity. The typical capacitor value is 10 pF for both packages. The value may depend on board layout. Table 12: High-Voltage Regulator (HV LDO) Electrical Specifications Parameter Minimum Typical Maximum Unit Input voltage Output voltage Max current load Load capacitance Load capacitor ESR PSRR Turn-on time (Cload = 2.2 F) Dropout voltage 2.3 1.8 – 1 0.01 20 – – – – – – – – – – 5.5 3.3 95 10 2 40 200 200 V V mA F Ω dB s mV Table 13: Main Regulator (Main LDO) Electrical Specifications Parameter Minimum Typical Maximum Unit Input voltage Output voltage Load current Load capacitance ESR Turn-on time PSRR Dropout voltage 1.63 1.159 – 1 0.1 – 15 – – 1.22 – – – – – – 3.63 1.281 60 2.2 0.5 300 – 200 V V mA F Ω s dB mV Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 41 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Electrostatic Discharge Specifications Note: By default, the drive strength settings specified in Table 14 are for 3.3V. To achieve the required drive strength for a VDDIO of 2.5V or 1.8V, contact a Broadcom technical support representative (see “Technical Support” on page 8 for contact information). Table 14: Digital I/O Characteristics Characteristics Symbol Minimum Typical Maximum Unit Input low voltage (VDDO = 3.3V) VIL – – 0.8 V Input high voltage (VDDO = 3.3V) VIH 2.0 – – V Input low voltage (VDDO = 1.8V) VIL – – 0.6 V Input high voltage (VDDO = 1.8V) VIH 1.1 – – V Output low voltage VOL – – 0.4 V Output high voltage VOH VDDO – 0.4V – – V Input low current IIL – – 1.0 A Input high current IIH – – 1.0 A Output low current (VDDO = 3.3V, VOL = 0.4V) IOL – – 3.0 mA Output high current (VDDO = 3.3V, VOH = 2.9V) IOH – – 3.0 mA Output low current (VDDO = 1.8V, VOL = 0.4V) IOL – – 3.0 mA Output high current (VDDO = 1.8V, VOH = 1.4V) IOH – – 3.0 mA Input capacitance CIN – – 0.4 pF Electrostatic Discharge Specifications Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist and heel grounding straps to discharge static electricity is required when handling these devices. Always store unused material in its antistatic packaging. Table 15: ESD Specifications Types Symbol Conditions ESD Rating Units Human body model ESD_HAND_HBM Human body model contact discharge per AEC-Q100-002 3.5 kV Machine model ESD_HAND_MM Machine model contact discharge 150 per AEC-Q100-003 Charged device model ESD_HAND_CDM Charged device model contact discharge per AEC-Q100-011 Broadcom® December 21, 2015 • 20713-DS102-R V 500 V (750V on corner pins) Single-Chip Bluetooth Transceiver and Baseband Processor Page 42 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Electrostatic Discharge Specifications Table 16: Pad I/O Characteristicsa I/O Pad Characteristics Pad Name Pull-Up/Pull-Down Fail-Safe COEX_OUT0 Y Y COEX_OUT1 Y Y COEX_IN Y Y PCM_CLK Y Y PCM_OUT Y Y PCM_IN Y Y PCM_SYNC Y Y UART_RTS_N Y Y UART_CTS_N Y Y UART_RXD Y Y UART_TXD Y Y GPIO_0 Y Y GPIO_1 Y Y GPIO_2 Y Y GPIO_4 Y Y GPIO_7 Y Y RST_N N/A Y OTP_DIS Y N a. All digital I/O internal pull-up or pull-down values are around 60 kΩ. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 43 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Electrostatic Discharge Specifications Table 17: Current Consumption—Class 1(10 dBm) Operational Mode Conditions Typical Units Receive (1 Mbps) Current level during receive of a basic rate packet 31 mA Transmit (1 Mbps) Current level during transmit of a basic rate packet, GFSK output power = 10 dBm 65 mA Receive (EDR) Current level during receive of a 2 or 3 Mbps rate packet 32 mA Transmit (EDR) Current level during transmit of a 2 or 3 Mbps rate packet, GFSK output power = 10 dBm 59 mA DM1/DH1 Average current during basic rate max throughput connection which includes only this packet type. 45 mA DM3/DH3 Average current during basic rate max throughput connection which includes only this packet type. 46 mA DM5/DH5 Average current during max basic rate throughput connection which includes only this packet type. 48 mA HV1 Average current during SCO voice connection consisting of only this packet type. ACL channel is in 500 ms sniff. 38 mA HV2 Average current during SCO voice connection consisting of only this packet type. ACL channel is in 500 ms sniff. 23 mA HV3 Average current during SCO voice connection consisting of only this packet type. ACL channel is in 500 ms sniff. 17 mA HCI only active Average current when waiting for HCI command UART or SPI transports. 4.8 mA Sleep UART transport active, external LPO clock available. 55 A Sleep, HV Reg Bypass UART transport active, external LPO clock available, HV LDO disabled and in bypass mode. 45 A Inquiry Scan (1.28 sec) Periodic scan rate is 1.28 sec. 350 A Page Scan (R1) Periodic scan rate is R1 (1.28 sec). 350 A Inquiry Scan + Page Scan (R1) Both inquiry and page scans are interlaced together at 1.28 sec periodic scan rate. 630 A Sniff master (500 ms) Attempt and timeout parameters set to 4. Quality connection which rarely requires more than minimum packet exchange. 175 A Sniff slave (500 ms) Attempt and timeout parameters set to 4. Quality connection which rarely requires more than minimum packet exchange. Sniff master follows optimal sniff protocol of BCM20713 master. 160 A Sniff (500 ms) + Inquiry/ Same conditions as Sniff master and Page Scan (R1). Scan maybe 455 Page Scan (R1) either Inquiry Scan or Page Scan at 1.28 sec periodic scan rate. A Sniff (500ms) + Inquiry Scan + Page Scan (R1) A Same conditions as Sniff master and Inquiry Scan + Page Scan. Broadcom® December 21, 2015 • 20713-DS102-R 760 Single-Chip Bluetooth Transceiver and Baseband Processor Page 44 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Electrostatic Discharge Specifications Table 18: Current Consumption—Class 2 (2 dBm) Operational Mode Conditions Typical Unit Receive (1 Mbps) Current level during receive of a basic rate packet 31 mA Transmit (1 Mbps) Current level during transmit of a basic rate packet, GFSK output power = 2 dBm 44 mA Receive (EDR) Current level during receive of a 2 or 3 Mbps rate packet 32 mA Transmit (EDR) Current level during transmit of a 2 or 3 Mbps rate packet, GFSK output power = 2 dBm 41 mA DM1/DH1 Average current during basic rate max throughput connection, which includes only this packet type. 35 mA DM3/DH3 Average current during basic rate max throughput connection, which includes only this packet type. 36 mA DM5/DH5 Average current during max basic rate throughput connection, which includes only this packet type. 37 mA HV1 Average current during SCO voice connection consisting of only this packet type. ACL channel is in 500 ms sniff. 28 mA HV2 Average current during SCO voice connection consisting of only this packet type. ACL channel is in 500 ms sniff. 17 mA HV3 Average current during SCO voice connection consisting of only this packet type. ACL channel is in 500 ms sniff. 13 mA HCI only active Average current when waiting for HCI command UART or SPI transports. 4.8 mA Sleep UART transport active, external LPO clock available. 55 A Sleep, HV Reg Bypass UART transport active, external LPO clock available, HV LDO disabled and in bypass mode. 45 A Inquiry Scan (1.28 sec) Periodic scan rate is 1.28 sec. 350 A Page Scan (R1) Periodic scan rate is R1 (1.28 sec). 350 A Inquiry Scan + Page Scan (R1) Both inquiry and page scans are interlaced together at 1.28 sec periodic scan rate. 630 A Sniff master (500 ms) Attempt and timeout parameters set to 4. Quality connection which rarely requires more than minimum packet exchange. 145 A Sniff slave (500 ms) Attempt and timeout parameters set to 4. Quality connection which rarely requires more than minimum packet exchange. Sniff master follows optimal sniff protocol of BCM20713 master. 135 A Sniff (500 ms) + Inquiry/ Page Scan (R1) Same conditions as Sniff master and Page Scan (R1). Scan can be either Inquiry Scan or Page Scan at 1.28 sec periodic scan rate. 425 A Sniff (500 ms) + Inquiry Scan + Page Scan (R1) Same conditions as Sniff master and Inquiry Scan + Page Scan. 730 A Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 45 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet RF Specifications Table 19: Operating Conditions Parameter Conditions Minimum Typical Maximum Unit Temperature Industrial –40.0 – 85 °C Power supply RF, Core 1.14 1.22 1.32 V PA supply (VDDTF) – 1.14 2.9 3.3 V RF Specifications Table 20: Receiver RF Specificationsa, b Conditions Minimum Typical c Maximum Unit – 2402 – 2480 MHz GFSK, 0.1% BER, 1 Mbps, FPBGA package – –89e –85 dBm GFSK, 0.1% BER, 1 Mbps, WLBGA package – –88e –84 dBm /4-DQPSK, 0.01% BER, – –91e –85 dBm 8-DPSK, 0.01% BER, 3 Mbps FPBGA package – –86e –81 dBm 8-DPSK, 0.01% BER, 3 Mbps, WLBGA package – –85e –80 dBm Maximum input GFSK, 1 Mbps – – –20 dBm Maximum input /4-DQPSK, 8-DPSK, – – –20 dBm C/I cochannel GFSK, 0.1% BER – – 11 dB C/I 1 MHz adjacent channel GFSK, 0.1% BER – – 0 dB C/I 2 MHz adjacent channel GFSK, 0.1% BER – – –30.0 dB C/I > 3 MHz adjacent channel GFSK, 0.1% BER – – –40.0 dB C/I image channel GFSK, 0.1% BER – – –9.0 dB C/I 1 MHz adjacent to image channel GFSK, 0.1% BER – – –20.0 dB C/I cochannel – – 13 dB – – 0 dB C/I 2 MHz adjacent channel /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER – – –30.0 dB C/I > 3 MHz adjacent channel 8-DPSK, 0.1% BER – – –40.0 dB C/I image channel /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER – – –7.0 dB – – –20.0 dB 8-DPSK, 0.1% BER – – 21 dB Parameter General Frequency range RX sensitivity d 2 Mbps 2/3 Mbps Interference Performance C/I 1 MHz adjacent channel C/I 1 MHz adjacent to image channel C/I cochannel Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 46 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet RF Specifications Table 20: Receiver RF Specificationsa, b (Cont.) Parameter Conditions Minimum Typical c Maximum Unit C/I 1 MHz adjacent channel 8-DPSK, 0.1% BER – – 5 dB C/I 2 MHz adjacent channel 8-DPSK, 0.1% BER – – –25.0 dB C/I > 3 MHz adjacent channel 8-DPSK, 0.1% BER – – –33.0 dB C/I Image channel 8-DPSK, 0.1% BER – – 0 dB C/I 1 MHz adjacent to image channel 8-DPSK, 0.1% BER – – –13.0 dB Out-of-Band Blocking Performance (CW) f 30–2000 MHz 0.1% BER – –10.0 – dBm 2000–2399 MHz 0.1% BER – –27 – dBm 2498–3000 MHz 0.1% BER – –27 – dBm 3000 MHz–12.75 GHz 0.1% BER – –10.0 – dBm Out-of-Band Blocking Performance, Modulated Interferer 776–764 MHz CDMA – –15 – dBm 824–849 MHz CDMA – –15 – dBm 1850–1910 MHz CDMA – –20 – dBm 824–849 MHz EDGE/GSM – –10 – dBm 880–915 MHz EDGE/GSM – –10 – dBm 1710–1785 MHz EDGE/GSM – –15 – dBm 1850–1910 MHz EDGE/GSM – –15 – dBm 1850–1910 MHz WCDMA – –25 – dBm 1920–1980 MHz WCDMA – –25 – dBm – –39.0 – – dBm Intermodulation Performance g BT, Df = 5 MHz Spurious Emissions h 30 MHz to 1 GHz – – – –57 dBm 1 GHz to 12.75 GHz – – – –47 dBm 65 MHz to 108 MHz FM Rx – –145 – dBm/Hz 746 MHz to 764 MHz CDMA – –145 – dBm/Hz 851–894 MHz CDMA – –145 – dBm/Hz 925–960 MHz EDGE/GSM – –145 – dBm/Hz 1805–1880 MHz EDGE/GSM – –145 – dBm/Hz 1930–1990 MHz PCS – –145 – dBm/Hz 2110–2170 MHz WCDMA – –145 – dBm/Hz a. b. c. d. e. f. All specifications are single ended. Unused inputs are left open. All specifications, except typical, are for industrial temperatures. For details see Table 19 on page 46. Typical operating conditions are 1.22V operating voltage and 25°C ambient temperature. The receiver sensitivity is measured at BER of 0.1% on the device interface. Measured with the dirty transmitter OFF. Typically, there is approximately 1 dB less in Rx sensitivity when the dirty transmitter is ON. Meets this specification using front-end band pass filter. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 47 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet g. h. RF Specifications f0 = -64 dBm Bluetooth-modulated signal, f1 = –39 dBm sine wave, f2 = –39 dBm Bluetooth-modulated signal, f0 = 2f1 – f2, and |f2 – f1| = n*1 MHz, where n is 3, 4, or 5. For the typical case, n = 5. Includes baseband radiated emissions. Table 21: Transmitter RF Specifications a, b Parameter Conditions Minimum Typical Maximum Unit – 2402 – 2480 MHz – 6.5 10 – dBm General Frequency range Class1: GFSK Tx power c d – 4.5 8 – dBm Class 2: GFSK Tx power – –1.5 2 – dBm Power control step – 2 4 6 dB – –10 – 10 kHz – – – 20 % – – – 35 % – – – 30 % Class1: EDR Tx power Modulation Accuracy /4-DQPSK Frequency Stability /4-DQPSK RMS DEVM /4-QPSK Peak DEVM /4-DQPSK 99% DEVM 8-DPSK frequency stability – –10 – 10 kHz 8-DPSK RMS DEVM – – – 13 % 8-DPSK Peak DEVM – – – 25 % 8-DPSK 99% DEVM – – – 20 % +500 kHz – – – –20 dBc 1.0 MHz < |M – N| < 1.5 MHz – – – –26 dBc 1.5 MHz < |M – N| < 2.5 MHz – – – –20 dBm |M – N| > 2.5 MHz – – – –40 dBm – – –36.0 e In-Band Spurious Emissions Out-of-Band Spurious Emissions 30 MHz to 1 GHz – –30.0 e, f dBm 1 GHz to 12.75 GHz – – – 1.8 GHz to 1.9 GHz – – – –47.0 dBm 5.15 GHz to 5.3 GHz – – – –47.0 dBm –150 –127 dBm/Hz dBm GPS Band Noise Emission (without a front-end band pass filter) 1572.92 MHz to 1577.92 MHz – – Out-of-Band Noise Emissions (without a front-end band pass filter) 65 MHz to 108 MHz FM Rx – –145 – dBm/Hz 746 MHz to 764 MHz CDMA – –145 – dBm/Hz 869 MHz to 960 MHz CDMA – –145 – dBm/Hz 925 MHz to 960 MHz EDGE/GSM – –145 – dBm/Hz 1805 MHz to 1880 MHz EDGE/GSM – –145 – dBm/Hz 1930 MHz to 1990 MHz PCS – –145 – dBm/Hz 2110 MHz to 2170 MHz WCDMA – –145 – dBm/Hz Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 48 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet a. b. c. d. e. f. Timing and AC Characteristics All specifications are for industrial temperatures. For details, see Table 19 on page 46. All specifications are single-ended. Unused input are left open. +10 dBm output for GFSK measured with VDDTF = 2.9 V. +8 dBm output for EDR measured with VDDTF = 2.9 V. Maximum value is the value required for Bluetooth qualification. Meets this spec using a front-end band-pass filter. Timing and AC Characteristics In this section, use the numbers listed in the reference column to interpret the timing diagrams. Startup Timing There are two basic startup scenarios. In one scenario, the chip startup and firmware boot is held off while the RST_N pin is asserted. In the second scenario, the chip startup and firmware boot is directly triggered by the chip power-up. In this case, an internal power-on reset (POR) is held for a few ms, after which the chip commences startup. The global reset signal in the BCM20713 is a logical OR (actually a wired AND, since the signals are active low) of the RST_N input and the internal POR signals. The last signal to be released determines the time at which the chip is released from reset. The POR is typically asserted for 3 ms after VDDC crosses the 0.8V threshold, but it may be as soon as 1.5 ms after this event. After the chip is released from reset, both startup scenarios follow the same sequence, as follows: 1. After approximately 120 s, the CLK_REQ (GPIO_5) signal is asserted. 2. The chip remains in sleep state for a minimum of 4.2 ms. 3. If present, the TCXO and LPO clocks must be oscillating by the end of the 4.2 ms period. If a TCXO clock is not in the system, a crystal is assumed to be present at the XIN and XOUT pins. If an LPO clock is not used, the firmware will detect the absence of a clock at the LPO_IN lead and use the internal LPO clock instead. Figure 10 and Figure 11 on page 50 illustrate the two startup timing scenarios. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 49 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics Figure 10: Startup Timing from RST_N trampmax = 200 μs VDDIO, VBAT, REG_EN* VDDC > 0.8V VREG t = 300 μs RST_N t = 64 to 171 μs GPIO5 (CLK_REQ) tmax = 4.2 ms TCXO LPO Figure 11: Startup Timing from Power-on Reset trampmax = 200 µs VDDIO, VBAT, REG_EN* VDDC > 0.8V VREG t = 300 µs tmin = 1.5 ms Internal POR t = 64 to 171 µs GPIO5 (CLK_REQ) tmax = 4.2 ms TCXO LPO Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 50 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics UART Timing Table 22: UART Timing Specifications Reference Characteristics 1 2 3 Minimum Maximum Unit Delay time, UART_CTS_N low to UART_TXD valid – 24 Baudout cycles Setup time, UART_CTS_N high before midpoint of – stop bit 10 ns Delay time, midpoint of stop bit to UART_RTS_N high 2 Baudout cycles – Figure 12: UART Timing UART_CTS_N 2 1 UART_TXD Midpoint of STOP bit Midpoint of STOP bit UART_RXD 3 UART_RTS_N Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 51 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics PCM Interface Timing Table 23: PCM Interface Timing Specifications (Short Frame Synchronization, Master Mode) Reference Characteristics Minimum Maximum Unit 1 PCM bit clock frequency 128 2048 kHz 2 PCM bit clock HIGH time 128 – ns 3 PCM bit clock LOW time 209 – ns 4 Delay from PCM_BCLK rising edge to PCM_SYNC high – 50 ns 5 Delay from PCM_BCLK rising edge to PCM_SYNC low – 50 ns 6 Delay from PCM_BCLK rising edge to data valid on PCM_OUT – 50 ns 7 Setup time for PCM_IN before PCM_BCLK falling edge 50 – ns 8 Hold time for PCM_IN after PCM_BCLK falling edge 10 – ns 9 Delay from falling edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance – 50 ns Figure 13: PCM Interface Timing (Short Frame Synchronization, Master Mode) 2 1 3 PCM_BCLK 4 5 PCM_SYNC 6 PCM_OUT Bit 15 (Previous Frame) 9 Bit 15 Bit 0 HIGH IMPEDENCE 7 8 PCM_IN Bit 15 (Previous Frame) Broadcom® December 21, 2015 • 20713-DS102-R Bit 0 Bit 15 Single-Chip Bluetooth Transceiver and Baseband Processor Page 52 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics Table 24: PCM Interface Timing Specifications (Short Frame Synchronization, Slave Mode) Reference Characteristics Minimum Maximum Unit 1 PCM bit clock frequency 128 2048 kHz 2 PCM bit clock HIGH time 209 – ns 3 PCM bit clock LOW time 209 – ns 4 Setup time for PCM_SYNC before falling edge of PCM_BCLK 50 – ns 5 Hold time for PCM_SYNC after falling edge of PCM_BCLK 10 – ns 6 Hold time of PCM_OUT after PCM_BCLK falling edge – 175 ns 7 Setup time for PCM_IN before PCM_BCLK falling edge 50 – ns 8 Hold time for PCM_IN after PCM_BCLK falling edge 10 – ns 9 Delay from falling edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance – 100 ns Figure 14: PCM Interface Timing (Short Frame Synchronization, Slave Mode) 2 1 3 PCM_BCLK 4 5 PCM_SYNC 6 PCM_OUT Bit 15 (Previous Frame) 9 Bit 0 Bit 15 HIGH IMPEDENCE 7 8 PCM_IN Bit 15 (Previous Frame) Broadcom® December 21, 2015 • 20713-DS102-R Bit 0 Bit 15 Single-Chip Bluetooth Transceiver and Baseband Processor Page 53 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics Table 25: PCM Interface Timing Specifications (Long Frame Synchronization, Master Mode) Reference Characteristics Minimum Maximum Unit 1 PCM bit clock frequency 128 2048 kHz 2 PCM bit clock HIGH time 209 – ns 3 PCM bit clock LOW time 209 – ns 4 Delay from PCM_BCLK rising edge to PCM_SYNC HIGH during first bit time – 50 ns 5 Delay from PCM_BCLK rising edge to PCM_SYNC LOW during third bit time – 50 ns 6 Delay from PCM_BCLK rising edge to data valid on PCM_OUT – 50 ns 7 Setup time for PCM_IN before PCM_BCLK falling edge 50 – ns 8 Hold time for PCM_IN after PCM_BCLK falling edge 10 – ns 9 Delay from falling edge of PCM_BCLK during last bit period – to PCM_OUT becoming high impedance 50 ns Figure 15: PCM Interface Timing (Long Frame Synchronization, Master Mode) 2 1 3 PCM_BCLK 4 5 PCM_SYNC 6 PCM_OUT Bit 0 Bit 1 9 Bit 2 Bit 15 Bit 2 Bit 15 HIGH IMPEDENCE 7 8 PCM_IN Bit 0 Broadcom® December 21, 2015 • 20713-DS102-R Bit 1 Single-Chip Bluetooth Transceiver and Baseband Processor Page 54 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics Table 26: PCM Interface Timing Specifications (Long Frame Synchronization, Slave Mode) Reference Characteristics Minimum Maximum Unit 1 PCM bit clock frequency. 128 2048 2 PCM bit clock HIGH time. 209 – ns 3 PCM bit clock LOW time. 209 – ns 4 Setup time for PCM_SYNC before falling edge of PCM_BCLK during first bit time. 50 – ns 5 Hold time for PCM_SYNC after falling edge of PCM_BCLK 10 during second bit period. (PCM_SYNC may go low any time from second bit period to last bit period). – ns 6 Delay from rising edge of PCM_BCLK or PCM_SYNC (whichever is later) to data valid for first bit on PCM_OUT. – 50 ns 7 Hold time of PCM_OUT after PCM_BCLK falling edge. – 175 ns 8 Setup time for PCM_IN before PCM_BCLK falling edge. 50 – ns 9 Hold time for PCM_IN after PCM_BCLK falling edge. 10 – ns 10 Delay from falling edge of PCM_BCLK or PCM_SYNC (whichever is later) during last bit in slot to PCM_OUT becoming high impedance. – 100 ns kHz Figure 16: PCM Interface Timing (Long Frame Synchronization, Slave Mode) 1 2 PCM_BCLK 3 4 5 PCM_SYNC 7 6 PCM_OUT Bit 0 Bit 1 10 Bit 15 HIGH IMPEDENCE 8 9 PCM_IN Bit 0 Broadcom® December 21, 2015 • 20713-DS102-R Bit 1 Bit 15 Single-Chip Bluetooth Transceiver and Baseband Processor Page 55 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Timing and AC Characteristics BSC Interface Timing Table 27: BSC Interface Timing Specifications Reference Characteristics Minimum Maximum Unit 1 Clock frequency – 100 400 800 1000 kHz 2 START condition setup time 650 – ns 3 START condition hold time 280 – ns 4 Clock low time 650 – ns 5 Clock high time 280 – ns 0 – ns timea 6 Data input hold 7 Data input setup time 100 – ns 8 STOP condition setup time 280 – ns 9 Output valid from clock – 400 ns 10 timeb 650 – ns Bus free a. b. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions Time that the CBUS must be free before a new transaction can start. Figure 17: BSC Interface Timing Diagram 1 5 SCL 2 3 4 7 6 SDA IN 8 10 9 SDA OUT Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 56 BROADCOM CONFIDENTIAL I2S Interface BCM20713 Preliminary Data Sheet I2S Interface The BCM20713 supports two independent I2S digital audio ports. The I2S interface supports both master and slave modes. The I2S signals are: • • • • I2S clock: I2S SCK I2S Word Select: I2S WS I2S Data Out: I2S SDO I2S Data In: I2S SDI I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an output. The channel word length is 16 bits and the data is justified so that the MSB of the left-channel data is aligned with the MSB of the I2S bus, per the I2S specification. The MSB of each data word is transmitted one bit clock cycle after the I2S WS transition, synchronous with the falling edge of bit clock. Left-channel data is transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is high. Data bits sent by the BCM20713 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on the rising edge of I2S_SCK. The clock rate in master mode is either of the following: 48 kHz x 32 bits per frame = 1.536 MHz 48 kHz x 50 bits per frame = 2.400 MHz The master clock is generated from the input reference clock using a N/M clock divider. In the slave mode, any clock rate is supported to a maximum of 3.072 MHz. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 57 BROADCOM CONFIDENTIAL I2S Interface BCM20713 Preliminary Data Sheet I2S Timing Timing values specified in Table 28 are relative to high and low threshold levels. Table 28: Timing for I2S Transmitters and Receivers Transmitter Clock Period T Receiver Lower LImit Upper Limit Lower Limit Upper Limit Notes Min. Max. Min. Max. Min. Max. Min. Max. Ttr – – – Tr – – – a Master Mode: Clock generated by transmitter or receiver HIGH tHC 0.35Ttr – – – 0.35Ttr – – – b LOWtLC 0.35Ttr – – – 0.35Ttr – – – b Slave Mode: Clock accepted by transmitter or receiver HIGH tHC – 0.35Ttr – – – 0.35Ttr – – c LOW tLC – 0.35Ttr – – – 0.35Ttr – – c Rise time tRC – – 0.15Ttr – – – – d Delay tdtr – – – 0.8T – – – – e Hold time thtr 0 – – – – – – – d Setup time tsr – – – – – 0.2Tr – – f Hold time thr – – – – – 0 – – f Transmitter Receiver a. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be able to handle the data transfer rate. b. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio. For this reason, tHC and tLC are specified with respect to T. c. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that they can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the requirements can be used. d. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore, the transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr. e. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the clock signal and T, always giving the receiver sufficient setup time. f. The data setup and hold time must not be less than the specified receiver setup and hold time. The time periods specified in Figure 18 and Figure 19 are defined by the transmitter speed. The receiver specifications must match transmitter performance. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 58 BROADCOM CONFIDENTIAL I2S Interface BCM20713 Preliminary Data Sheet Figure 18: I2S Transmitter Timing T tRC* tLC > 0.35T tHC > 0.35T VH = 2.0V SCK VL = 0.8V thtr > 0 totr < 0.8T SD and WS T = Clock period Ttr = Minimum allowed clock period for transmitter T = Ttr * tRC is only relevant for transmitters in slave mode. Figure 19: I2S Receiver Timing T tLC > 0.35T tHC > 0.35 VH = 2.0V SCK VL = 0.8V tsr > 0.2T thr > 0 SD and WS T = Clock period Tr = Minimum allowed clock period for transmitter T > Tr Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 59 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Mechanical Information Section 9: Mechanical Information Figure 20: BCM20713A1KUFBXG Mechanical Drawing Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 60 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Mechanical Information Figure 21: 42-Bump BCM20713A1KUBG Mechanical Drawing Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 61 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Tape, Reel, and Packing Specification Tape, Reel, and Packing Specification ESD Warning Figure 22: Reel, Labeling, and Packing Specification Bro Ba adco rco m de Device Orientation/Mix Lot Number Each reel may contain up to three lot numbers, independent of the date code. Individual lots must be labeled on the box, moisture barrier bag, and the reel. Pin 1 Top-right corner toward sprocket holes. Moisture Barrier Bag Contents/Label Desiccant pouch (minimum 1) Humidity indicator (minimum 1) Reel (maximum 1) Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 62 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Ordering Information S e c t i o n 1 0 : O rd e r i n g I n f o r m a t i o n Table 29 lists available part numbers and describes differences in package type, available I/O, and functional configuration. See the referenced figures and tables for mechanical drawings and package I/O information. All packages are rated from –40°C to +85°C. Table 29: Part Ordering Information Part Number Package Type Functional I/O Features BCM20713A1KUFBXG 50-ball FPBGA, 4.5 mm x 4.0 mm x 0.6 mm. See Figure 20 on page 60. Dedicated Coexa, more GPIO, TM0b Table 8 on page 38 BCM20713A1KUBG 42-bump WLBGA, Table 9 on page 39 3.02 mm x 2.51 mm x 0.55 mm. See Figure 21 on page 61. a. b. Strapped Configuration TCXO AND/OR mode enabled TCXO AND/OR mode enabled All packages support coexistence features through the ability to re-purpose most digital I/O based on the desired user configuration. Package include balls coexistence functionality (default). TM0 allows configuration of CLK_REQ output polarity. Broadcom® December 21, 2015 • 20713-DS102-R Single-Chip Bluetooth Transceiver and Baseband Processor Page 63 BROADCOM CONFIDENTIAL BCM20713 Preliminary Data Sheet Broadcom® Corporation reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom Corporation is believed to be accurate and reliable. However, Broadcom Corporation does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. ® Broadcom Corporation 5300 California Avenue Irvine, CA 92617 © 2015 by BROADCOM CORPORATION. All rights reserved. 20713-DS102-R December 21, 2015 Phone: 949-926-5000 Fax: 949-926-5203 E-mail: [email protected] Web: www.broadcom.com