Freescale MPXV2010GP 10 kpa on-chip temperature compensated & calibrated silicon pressure sensor Datasheet

Freescale Semiconductor
Technical Data
MPX2010
Rev 11, 11/2006
10 kPa On-Chip Temperature
Compensated & Calibrated
Silicon Pressure Sensors
MPX2010
MPXV2010G
SERIES
The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors
provide a very accurate and linear voltage output directly proportional to the
applied pressure. These sensors house a single monolithic silicon die with the
strain gauge and thin film resistor network integrated on each chip. The sensor is
laser trimmed for precise span, offset calibration and temperature compensation.
COMPENSATED
PRESSURE SENSOR
0 to 10 kPa (0 to 1.45 psi)
FULL SCALE SPAN: 25 mV
Features
• Temperature Compensated over 0°C to +85°C
• Ratiometric to Supply Voltage
• Differential and Gauge Options
SMALL OUTLINE PACKAGES
Typical Applications
• Respiratory Diagnostics
• Air Movement Control
• Controllers
• Pressure Switching
ORDERING INFORMATION
Device
Type
Options
Case No.
MPX Series
Order No.
Packing
Options
Device
Marking
MPXV2010GP
CASE 1369-01
MPXV2010DP
CASE 1351-01
SMALL OUTLINE PACKAGE (MPXV2010G SERIES)
Ported
Elements
Gauge, Side
Port, SMT
1369
MPXV2010GP
Trays
MPXV2010G
Differential,
Dual Port,
SMT
1351
MPXV2010DP
Trays
MPXV2010G
UNIBODY PACKAGE (MPX2010 SERIES)
Basic
Element
Differential
344
Ported
Elements
Differential,
Dual Port
SMALL OUTLINE PACKAGE
PIN NUMBERS
1
GND(1)
5
N/C
2
+VOUT
6
N/C
3
VS
7
N/C
4
–VOUT
8
N/C
MPX2010D
—
MPX2010D
344C
MPX2010DP
—
MPX2010DP
Gauge
344B
MPX2010GP
—
MPX2010GP
1
GND(1)
3
VS
Gauge, Axial
344E
MPX2010GS
—
MPX2010D
2
+VOUT
4
–VOUT
344F
MPX2010GSX
—
MPX2010D
1. Pin 1 in noted by the notch in the lead.
Gauge, Axial
PC Mount
UNIBODY PACKAGE PIN NUMBERS
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX2010GP
CASE 344-15
MPX2010GP
CASE 344B-01
MPX2010DP
CASE 344C-01
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MPX2010GS
CASE 344E-01
MPX2010GSX
CASE 344F-01
VS
3
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
2
4
+VOUT
–VOUT
1
GND
Figure 1. Temperature Compensated and Calibrated
Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a block diagram of the internal circuitry on
the stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
75
kPa
Storage Temperature
TSTG
–40 to +125
°C
TA
–40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2010
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Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
10
kPa
VS
—
10
16
VDC
IO
—
6.0
—
mAdc
VFSS
24
25
26
mV
Offset(4)
VOFF
–1.0
—
1.0
mV
Sensitivity
∆V/∆Ρ
—
2.5
—
mV/kPa
—
–1.0
—
1.0
%VFSS
—
—
±0.1
—
%VFSS
—
—
±0.5
—
%VFSS
TCVFSS
–1.0
—
1.0
%VFSS
TCVOFF
–1.0
—
1.0
mV
ZIN
1000
—
2550
W
ZOUT
1400
—
3000
W
tR
—
1.0
—
ms
—
—
2.0
—
ms
—
—
±0.5
—
%VFSS
Pressure Range(1)
Supply Voltage
(2)
Supply Current
Full Scale Span
(3)
Linearity(5)
Pressure Hysteresis
(5)
(0 to 50 kPa)
Temperature Hysteresis(5) (–40°C to +125°C)
Temperature Effect on Full Scale Span
(5)
Temperature Effect on Offset(5)
Input Impedance
Output Impedance
Response Time
(6)
(10% to 90%)
Warm-Up Time
Offset
Stability(7)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2010
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3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
VS = 10 Vdc
TA = 25°C
P1 > P2
30
25
TYP
Output (mVdc)
20
a
15
MAX
Span
Range
(Typical)
10
5
MIN
0
–5
kPa
PSI
2.5
0.362
5
0.725
7.5
1.09
10
1.45
Offset
(Typical)
Figure 2. Output vs. Pressure Differential
Figure 2 shows the output characteristics of the MPX2010/
MPXV2010G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
Silicone
Die Coat
This performance over temperature is achieved by having
both the shear stress strain gauge and the thin-film resistor
circuitry on the same silicon diaphragm. Each chip is
dynamically laser trimmed for precise span and offset
calibration and temperature compensation.
Stainless Steel
Metal Cover
Die
P1
Wire Bond
Lead Frame
P2
Epoxy
Case
RTV Die
Bond
Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2010/MPXV2010G series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
MPX2010
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Freescale Semiconductor
LINEARITY
Least
Square
Deviation
Least Squares Fit
Relative Voltage Output
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or
(2) a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Exaggerated
Performance
Curve
Straight Line
Deviation
End Point Straight
Line Fit
Offset
50
Pressure (% Full Scale)
0
100
Figure 4. Linearity Specification Comparison
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Freescale MPX
pressure sensor is designed to operate with positive
differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table.
Table 3. Pressure (P1) Side Delineation
Part Number
MPX2010D
Case Type
344
Pressure (P1) Side Identifier
Stainless Steep Cap
MPX2010DP
344C
Side with Part Marking
MPX2010GP
344B
Side with Port Attached
MPX2010GS
344E
Side with Port Attached
MPX2010GSX
344F
Side with Port Attached
MPXV2010GP
1369
Side with Port Attached
MPXV2010DP
1351
Side with Part Marking
MPX2010
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
C
R
M
1
B
-A-
2
3
Z
4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
Y
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2010
6
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Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
C
PORT #1
POSITIVE
PRESSURE
(P1)
-B-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
BACK SIDE
VACUUM
(P2)
DIM
A
B
C
D
F
G
J
K
N
R
S
V
V
4 3
2 1
PIN 1
K
J
N
R
SEATING
PLANE
S
-T-
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.690
0.720 17.53
18.28
0.245
0.255 6.22
6.48
0.780
0.820 19.81
20.82
0.016
0.020 0.41
0.51
0.048
0.064 1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016 0.36
0.41
0.345
0.375 8.76
9.53
0.300
0.310 7.62
7.87
0.178
0.186 4.52
4.72
0.220
0.240 5.59
6.10
0.182
0.194 4.62
4.93
G
F
D 4 PL
0.13 (0.005)
M
T B
M
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344E-01
ISSUE B
UNIBODY PACKAGE
MPX2010
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
-TC
A
E
-Q-
U
N
V
B
R
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-P0.25 (0.010)
M
T Q
M
4
3
2
1
S
K
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.080
1.120 27.43
28.45
0.740
0.760 18.80
19.30
0.630
0.650 16.00
16.51
0.016
0.020
0.41
0.51
0.160
0.180
4.06
4.57
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.220
0.240
5.59
6.10
0.070
0.080
1.78
2.03
0.150
0.160
3.81
4.06
0.150
0.160
3.81
4.06
0.440
0.460 11.18
11.68
0.695
0.725 17.65
18.42
0.840
0.860 21.34
21.84
0.182
0.194
4.62
4.92
G
D 4 PL
0.13 (0.005)
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
V (+) OUT
V SUPPLY
V (-) OUT
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2010
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2010
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2010
10
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2010
Sensors
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2010
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NOTES
MPX2010
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13
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MPX2010
Rev. 11
11/2006
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