Infineon IPB065N06LG Optimosâ ¢ power-transistor features for fast switching converters and sync. rectification Datasheet

IPB065N06L G
OptiMOS™ Power-Transistor
IPP065N06L G
Product Summary
Features
• For fast switching converters and sync. rectification
• N-channel enhancement - logic level
V DS
60
V
R DS(on),max
6.5
mΩ
ID
80
A
• 175 °C operating temperature
• Avalanche rated
• Pb-free lead plating, RoHS compliant
• Halogen-free according to IEC61249-2-21
Type
IPB065N06L G
Type
IPP065N06L G
Package
Marking
IPB063N06L G
Package
P-TO263-3-2
PG-TO263-3-2
063N06L
PG-TO220-3-1
IPP063N06L G
Marking
PP-TO220-3-1
065N06L
063N06L
065N06L
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
ID
Value
T C=25 °C1)
80
T C=100 °C
80
Pulsed drain current
I D,pulse
T C=25 °C2)
320
Avalanche energy, single pulse
E AS
I D=80 A, R GS=25 Ω
530
Reverse diode dv /dt
dv /dt
I D=80 A, V DS=48 V,
di /dt =200 A/µs,
T j,max=175 °C
6
Gate source voltage
V GS
Power dissipation
P tot
Operating and storage temperature
T j, T stg
T C=25 °C
IEC climatic category; DIN IEC 68-1
A
mJ
kV/µs
±20
V
250
W
-55 ... 175
°C
55/175/56
1)
Current is limited by bondwire; with an R thJC=0.6 K/W the chip is able to carry 125 A.
2)
See figure 3
Rev. 1.5
Unit
page 1
2010-01-18
IPB065N06L G
Parameter
IPP065N06L G
Values
Symbol Conditions
Unit
min.
typ.
max.
-
-
0.6
minimal footprint
-
-
62
6 cm2 cooling area3)
-
-
40
60
-
-
Thermal characteristics
Thermal resistance, junction - case
R thJC
SMD version, device on PCB
R thJA
K/W
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
Gate threshold voltage
V GS(th)
V DS=V GS, I D=180 µA
1.2
1.6
2
Zero gate voltage drain current
I DSS
V DS=60 V, V GS=0 V,
T j=25 °C
-
0.01
1
V DS=60 V, V GS=0 V,
T j=125 °C
-
1
100
V
µA
Gate-source leakage current
I GSS
V GS=20 V, V DS=60 V
-
1
100
nA
Drain-source on-state resistance
R DS(on)
V GS=10 V, I D=80 A
-
5.4
6.5
mΩ
V GS=4.5 V, I D=53 A
-
6.5
8.4
V GS=10 V, I D=80 A,
SMD version
5.1
6.2
V GS=4.5 V, I D=53 A,
SMD version
6.2
8.1
-
2.2
-
Ω
63
126
-
S
Gate resistance
RG
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=80 A
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 1.5
page 2
2010-01-18
IPB065N06L G
Parameter
IPP065N06L G
Values
Symbol Conditions
Unit
min.
typ.
max.
-
3800
5100
-
890
1200
Dynamic characteristics
Input capacitance
C iss
Output capacitance
C oss
Reverse transfer capacitance
C rss
-
220
330
Turn-on delay time
t d(on)
-
11
17
Rise time
tr
-
21
32
Turn-off delay time
t d(off)
-
60
90
Fall time
tf
-
20
30
Gate to source charge
Q gs
-
13
18
Gate charge at threshold
Q g(th)
-
6
8
Gate to drain charge
Q gd
-
42
63
Switching charge
Q sw
-
49
72
Gate charge total
Qg
-
118
157
Gate plateau voltage
V plateau
-
3.5
-
Output charge
Q oss
-
35
47
-
-
80
-
-
320
-
0.95
1.3
V
-
60
76
ns
-
92
115
nC
V GS=0 V, V DS=30 V,
f =1 MHz
V DD=30 V, V GS=4.5V,
I D=80 A, R G=1.6 Ω
pF
ns
Gate Charge Characteristics 4)
V DD=30 V, I D=80 A,
V GS=0 to 10 V
V DD=30 V, V GS=0 V
nC
V
Reverse Diode
Diode continous forward current
IS
Diode pulse current
I S,pulse
Diode forward voltage
V SD
Reverse recovery time
t rr
Reverse recovery charge
Q rr
4)
Rev. 1.5
T C=25 °C
V GS=0 V, I F=80 A,
T j=25 °C
V R=30 V, I F=I S,
di F/dt =100 A/µs
A
See figure 16 for gate charge parameter definition
page 3
2010-01-18
IPB065N06L G
1 Power dissipation
2 Drain current
P tot=f(T C)
I D=f(T C); V GS≥10 V
300
IPP065N06L G
100
250
75
I D [A]
P tot [W]
200
150
50
100
25
50
0
0
0
50
100
150
200
0
50
T C [°C]
100
150
200
T C [°C]
3 Safe operating area
4 Max. transient thermal impedance
I D=f(V DS); T C=25 °C; D =0
Z thJC=f(t p)
parameter: t p
parameter: D =t p/T
103
100
1 µs
limited by on-state
resistance
10 µs
100 µs
102
0.5
1 ms
Z thJC [K/W]
DC
I D [A]
10 ms
10
1
0.2
10
-1
0.1
0.05
0.02
100
0.01
10-1
10
10-2
-1
10
0
10
1
10
2
V DS [V]
Rev. 1.5
single pulse
10-5
10-4
10-3
10-2
10-1
100
t p [s]
page 4
2010-01-18
IPB065N06L G
IPP065N06L G
5 Typ. output characteristics
6 Typ. drain-source on resistance
I D=f(V DS); T j=25 °C
R DS(on)=f(I D); T j=25 °C
parameter: V GS
parameter: V GS
300
10 V 5.5 V
20
5.5 V
3V
250
3.5 V
4V
16
4.5 V
R DS(on) [mΩ]
I D [A]
200
150
4V
12
8
4.5 V
5V
100
5.5 V
10 V
3.5 V
4
50
3V
0
0
0
0
1
2
3
4
0
5
50
V DS [V]
100
150
200
60
80
I D [A]
7 Typ. transfer characteristics
8 Typ. forward transconductance
I D=f(V GS); |V DS|>2|I D|R DS(on)max
g fs=f(I D); T j=25 °C
parameter: T j
180
150
150
120
120
g fs [S]
I D [A]
90
90
60
60
30
30
175 °C
25 °C
0
0
0
1
2
3
4
5
Rev. 1.5
0
20
40
I D [A]
V GS [V]
page 5
2010-01-18
IPB065N06L G
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
R DS(on)=f(T j); I D=80 A; V GS=10 V
V GS(th)=f(T j); V GS=V DS
IPP065N06L G
parameter: I D
16
2.5
2
12
V GS(th) [V]
R DS(on) [mΩ]
1800 µA
98 %
8
1.5
180 µA
1
typ
4
0.5
0
0
-60
-20
20
60
100
140
180
-60
-20
20
60
100
140
180
T j [°C]
T j [°C]
11 Typ. capacitances
12 Forward characteristics of reverse diode
C =f(V DS); V GS=0 V; f =1 MHz
I F=f(V SD)
parameter: T j
104
103
Ciss
25 °C
I F [A]
C [pF]
102
Coss
103
175°C 98%
175 °C
25°C 98%
101
100
Crss
102
10-1
0
10
20
30
40
50
V DS [V]
Rev. 1.5
0
0.5
1
1.5
2
V SD [V]
page 6
2010-01-18
IPB065N06L G
13 Avalanche characteristics
14 Typ. gate charge
I AS=f(t AV); R GS=25 Ω
V GS=f(Q gate); I D=80 A pulsed
parameter: T j(start)
parameter: V DD
102
IPP065N06L G
12
25 °C
100 °C
30 V
10
12V
150 °C
48 V
V GS [V]
I AV [A]
8
101
6
4
2
100
0
100
101
102
103
0
40
t AV [µs]
80
120
Q gate [nC]
15 Drain-source breakdown voltage
16 Gate charge waveforms
V BR(DSS)=f(T j); I D=1 mA
74
V GS
Qg
70
V BR(DSS) [V]
66
62
V g s(th)
58
54
Q g(th)
Q sw
Q gs
50
-60
-20
20
60
100
140
Q g ate
Q gd
180
T j [°C]
Rev. 1.5
page 7
2010-01-18
IPB065N06L G
IPP065N06L G
PG-TO-263 (D²-Pak)
Rev. 1.5
page 8
2010-01-18
IPB065N06L G
IPP065N06L G
PG-TO220-3: Outline
Rev. 1.5
page 9
2010-01-18
IPB065N06L G
IPP065N06L G
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information given in this data sheet shall in no event be regarded as a guarantee of conditions o
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
non-infringement of intellectual property rights of any third party
Information
For further information on technology, delivery terms and conditions and prices please contact your neares
Infineon Technologies Office (www.infineon.com ).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Rev. 1.5
page 10
2010-01-18
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