I605 Series 5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS Applications: Product Features: Small Surface Mount Package Based Output for many frequencies CMOS/TTL Compatible Logic Levels Compatible with Leadfree Processing SD/HD Video Wireless Base Stations Sonet /SDH VoIP T1/E1, T3/E3 5.0 0.2 7.0 0.3 Frequency 1 MHz to 170.000 MHz Output Level HC-MOS TTL Duty Cycle ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. 50% ±5% Rise / Fall Time 10.0 nS Max. Output Load 15pF, Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 TTL Frequency Stability 50 ppm Max. Start-up Time 10 mS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % Control Voltage 1.65 VDC ±1.5 VDC for 3.3 VDC, 2.5 VDC ±2.0 VDC for 5.0 VDC Pull Range See Pullability Table Current 50 mA Max** Linearity 10% Max. 2.0 Max. 5.08 Recommended Pad Layout 5.08 4.2 Bypass =0.01 uF Temperature Operating Storage See Operating Temperature Table in Part Number Guide -55 C to +125 C Phase Jitter <3 pS RMS Pin 1 2 3 4 5 6 2.0 Connection Control Voltage Enable / Disable Ground Output N.C. Vdd Dimension Units: mm Part Number Guide Package I605 - Operating Temperature Sample Part Number: I605-1BC3H-20.000 Stability Pullability (in ppm) Supply Voltage Enable / Disable Frequency H = Enable - 20.000 MHz 1 = 0 C to +70 C *D = 15 B = 50 PPM Min. 5 = 5.0 VDC 6 = -10 C to +70 C A = 25 C = 100 PPM Min. 3 = 3.3 VDC 3 = -20 C to +70 C B = 50 4 = -30 C to +75 C C = 100 2 = -40 C to +85 C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available at all frequencies. ** Frequency, supply, and load related parameters. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/10_C Specifications subject to change without notice Page 1 I605 Series 5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 12/10_C Specifications subject to change without notice Page 2