HD49335F/HF CDS/PGA & 10-bit A/D TG Converter REJ03F0100-0100Z Rev.1.0 Feb.25.2004 Description The HD49335F/HF is a CMOS IC that provides CDS-PGA analog processing (CDS/PGA) suitable for CCD camera digital signal processing systems together with a 10-bit A/D converter and timing generator in a single chip. There are address map and timing generator charts besides this specification. May be contacted to our sales department if examining the details. Functions • • • • • • • Correlated double sampling PGA Serial interface control 10-bit ADC Timing generator Operates using only the 3 V voltage Corresponds to switching mode of power dissipation and operating frequency Power dissipation: 220 mW (Typ), maximum frequency: 36 MHz (HD49335HF) Power dissipation: 150 mW (Typ), maximum frequency: 25 MHz (HD49335F) • ADC direct input mode • QFP 64-pin package Features • Suppresses low-frequency noise, which output from CCD by the correlated double sampling. • The S/H response frequency characteristics for the reference level can be adjusted using values of external parts and registers. • High sensitivity is achieved due to the high S/N ratio and a wide dynamic range provided by a PG amplifier. • PGA, pulse timing, standby mode, etc., is achieved via a serial interface. • High precision is provided by a 10-bit-resolution A/D converter. • Difference encoded gray code can be selected as an A/D output code. It is effective in suppression of solarization (wave pattern). It is patented by Renesas. • Timing generator generates the all of pulse which are needed for CCD driving. Rev.1.0, Feb.25.2004, page 1 of 29 HD49335F/HF VRM VRT VRB BIAS ADC_in AVSS DVSS3 STROB SUB_PD SUB_SW XSUB CH4 CH3 CH2 CH1 XV4 Pin Arrangement 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 49 31 50 30 51 29 52 28 53 27 54 26 55 25 56 24 57 23 58 22 59 21 60 20 61 19 62 18 63 17 64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 XV3 XV2 XV1 DVDD3 DVDD4 1/4clk_o H2A DVSS4 DVSS4 1/2clk_o H1A DVDD4 DVDD3 RG Reset VD_in ID DVSS1,2 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DVDD2 DVSS3 CLK_in HD_in AVDD BLKC CDS_in AVDD BLKFB BLKSH AVSS Test2 Test1 DLL_C DVDD1 MON 41cont CS SDATA SCK (Top view) Pin Description Pin No. Symbol Description I/O Analog(A) or Digital(D) Remarks 1 ID Odd/even number line detecting pulse output pin O D 2 mA/10 pF 2 DVSS1,2 CDS Digital ground + ADC output buffer ground (0 V) — D 3 to 12 D0 to D9 Digital output (D0; LSB, D9; MSB) O D 13 DVDD2 ADC output buffer power supply (3 V) — D 14 DVSS3 General ground for TG (0 V) — D 15 CLK_in CLK input (max 72 MHz) I D 16 HD_in HD input I/O D 17 VD_in VD input I/O D 18 Reset Hardware reset (for DLL reset) I D Schmitt trigger 19 RG Reset gate pulse output O D 3 mA/10 pF 20 DVDD3 General power supply for TG (3 V) — D 21 DVDD4 H1 buffer power supply (3 V) — D 22 H1A H.CCD transfer pulse output-1A O D 30 mA/165 pF 23 1/2clk_o CLK_in 2 divided output. 3 divided output at 3 divided mode O D 2 mA/10 pF 24 DVSS4 H1 buffer ground (0 V) — D 25 DVSS4 H1 buffer ground (0 V) — D 26 H2A H.CCD transfer pulse output-2A O D 30 mA/165 pF 27 1/4clk_o CLK_in 4 divided output. 6 divided output at 3 divided mode O D 2 mA/10 pF 28 DVDD4 H2 buffer power supply (3 V) — D 29 DVDD3 General power supply for TG (3 V) — D Rev.1.0, Feb.25.2004, page 2 of 29 2 mA/10 pF HD49335F/HF Pin Description (cont.) Pin No. Symbol Description I/O Analog(A) or Digital(D) 30 XV1 V.CCD transfer pulse output-1 O D 2 mA/10 pF 31 XV2 V.CCD transfer pulse output-2 O D 2 mA/10 pF 32 XV3 V.CCD transfer pulse output-3 O D 2 mA/10 pF 33 XV4 V.CCD transfer pulse output-4 O D 2 mA/10 pF 34 CH1 Read out pulse output-1 O D 2 mA/10 pF 35 CH2 Read out pulse output-2 O D 2 mA/10 pF 36 CH3 Read out pulse output-3 O D 2 mA/10 pF 37 CH4 Read out pulse output-4/XV6 at stripe mode O D 2 mA/10 pF 38 XSUB Pulse output for electronic shutter O D 2 mA/10 pF 39 SUB_SW SUB voltage control output-1. ADCK input I/O D 2 mA/10 pF 40 SUB_PD SUB voltage control output-2/ XV5 at stripe mode O D 2 mA/10 pF 2 mA/10 pF 41 STROB Flash control output. Input Vgate at Hi of pin 61 I/O D 42 DVSS3 General ground for TG (0 V) — D 43 AVSS Analog ground (0 V) — A 44 ADC_in AD converter input pin I A 45 BIAS Bias standard resistance — A 46 VRB ADC bottom standard voltage (0.1 µF for GND) — A 47 VRT ADC top standard voltage (0.1 µF for GND) — A 48 VRM ADC middle standard voltage (0.1 µF for GND) — A 49 AVDD Analog power supply (3 V) — A 50 BLKC Black level C pin (1000 pF for GND) — A 51 CDS_in CDS input pin I A 52 AVDD Analog power supply (3 V) — A 53 BLKFB Black level FB pin (1 µF between BLKFB and BLKSH) I A 54 BLKSH Black level S/H pin O A 55 AVSS Analog ground (0 V) — A 56 Test2 H: Normal operation, L: CDS single operation mode Input 36; PBLK at testing, Input 37; OBP, Input 38; CPDM, Input 39; ADCK, Input 40; SP2, Input 41; SP1 I D 57 Test1 L: Slave mode, H: Master mode I D 58 DLL_C Analog delay DLL external C pin (100 pF for GND) O A 59 DVDD1 Digital power supply (3 V) CDS, PAG, ADC part — D 60 MON Pulse monitor (SP1, SP2, ADCK, OBP, CPDM, PBLK input) O D 61 41cont Input STROB = pin 41, Input SUB_SW = pin 39 at Low Input Vgate = pin 41, Input ADCK = pin 39 at Hi I D 62 CS Serial data CS at CDS part I D 63 SDATA Input serial data I D 64 SCK Input serial clock I D Rev.1.0, Feb.25.2004, page 3 of 29 Remarks 2 mA/10 pF HD49335F/HF Input/Output Equivalent Circuit Pin Name Digital output Equivalent Circuit D0 to D9, HD_in, VD_in, H1A, H2A, 1/2clk_o, 1/4clk_o, 41cont, SUB_SW, SUB_PD DVDD DIN Digital output ENABLE DVDD ID, RG, MON, XV1 to XV4, CH1 to CH4, XSUB Digital output DIN Digital input DVDD CLK_in, HD_in, VD_in, ADCLK, OBP, SPBLK, SPSIG, CS, SCK, SDATA, PBLK, OEB, Reset, Test1, Test2, SUB_SW, STROB Digital input *1 Note: Only OEB is pulled down to about 70 kΩ. Analog Internally connected to VRT CDS_in AVDD CDS_in ADC_in AVDD Internally connected to VRT ADC_in BLKSH, BLKFB, BLKC AVDD + − BLKFB BLKSH BLKC VRT, VRM, VRB + − VRT VRB AVDD BIAS Rev.1.0, Feb.25.2004, page 4 of 29 AVDD + − + − BIAS VRM HD49335F/HF SUB_SW SUB_PD AVSS Timing generator DLL DVSS1 to 4 STROB SP1 SP2 ADCLK OBP CPDM PBLK Reset ADC_in BLKSH D9 D8 CDS 10bit ADC PGA Output latch circuit CDS_in BLKC BLKFB DVDD1 to 4 AVDD CLK_in HD_in VD_in RG H1A 1/2clk_o H2A 1/4clk_o XV1 XV2 XV3 XV4 CH1 CH2 CH3 CH4 XSUB Block Diagram DC offset compensation circuit Serial interface Bias generator D7 D6 D5 D4 D3 D2 D1 Rev.1.0, Feb.25.2004, page 5 of 29 VRB VRM VRT BIAS CS SDATA SCK DLL_C MON ID D0 HD49335F/HF Internal Functions Functional Description • CDS input CCD low-frequency noise is suppressed by CDS (correlated double sampling). The signal level is clamped at 14 LSB to 76 LSB by resister during the OB period. *1 Gain can be adjusted using 8 bits of register (0.132 dB steps) within the range from –2.36 dB to 31.40 dB. *2 • ADC input The center level of the input signal is clamped at 512 LSB (Typ). Gain can be adjusted using 8 bits of register (0.01784 times steps, register settings) within the range from 0.57 times (–4.86 dB) to 5.14 times (14.22 dB). *2 • Automatic offset calibration of PGA and ADC • DC offset compensation feedback for CCD and CDS • Pre-blanking Digital output is fixed at clamp level • Digital outputs enable function Note: 1. It is not covered by warranty when 14LSB settings 2. Full-scale digital output is defined as 0 dB (one time) when 1 V is input. Operating Description Figure 1 shows CDS/PGA + ADC function block. ADC_in SP2 PG AMP CDS AMP C2 CDS_in SP1 SP1 SH C1 AMP Gain setting (register) Current DAC VRT D0 to D9 10bit ADC DAC Clamp data (register) Offset calibration logic DC offset feedback logic BLKC BLKFB BLKSH C4 C3 OBP Figure 1 CDS/PGA Functional Block Diagram 1. CDS (Correlated Double Sampling) Circuit The CDS circuit extracts the voltage differential between the black level and a signal including the black level. The black level is directly sampled at C1 by using the SP1 pulse, buffered by the SHAMP, then provided to the CDSAMP. The signal level is directly sampled at C2 by using the SP2 pulse, and then provided to CDSAMP (see figure 1). The difference between these two signal levels is extracted by the CDSAMP, which also operates as a programmable gain amplifier at the previous stage. The CDS input is biased with VRT (2 V). During the PBLK period, the above sampling and bias operation are paused. 2. PGA Circuit The PGAMP is the programmable gain amplifier for the latter stage. The PGAMP and the CDSAMP set the gain using 8 bits of register. The equation below shows how the gain changes when register value N is from 0 to 255. In CDSIN mode: Gain = (–2.36 dB + 0.033 dB) × N (LOG linear). In ADCIN mode: Gain = (0.57 times + 0.001784 times) × N (linear). Full-scale digital output is defined as 0 dB (one time) when 1 V is input. Rev.1.0, Feb.25.2004, page 6 of 29 HD49335F/HF 3. Automatic Offset Calibration Function and Black-Level Clamp Data Settings The DAC DC voltage added to the output of the PGA amplifier is adjusted by automatic offset calibration. The data, which cancels the output offset of the PGA amplifier and the input offset of the ADC, and the clamp data (14 LSB to 76 LSB) set by register are added and input to the DAC. The automatic offset calibration starts automatically after the RESET mode set by register is cancelled and terminates after 40000 clock cycles (when fclk = 20 MHz, 2 ms). 4. DC Offset Compensation Feedback Function Feedback is done to set the black signal level input during the OB period to the DC standard, and all offsets (including the CCD offset and the CDSAMP offset) are compensated for. The offset from the ADC output is calculated during the OB period, and SHAMP feedback capacitor C3 is charged by the current DAC (see figure 1). The open-loop differential gain (∆Gain/∆H) per 1 H of the feedback loop is given by the following equation. 1H is the one cycle of the OBP. ∆Gain/∆H = 0.078/(fclk × C3) (fclk: ADCLK frequency, C3: SHAMP external feedback capacitor) Example: When fclk = 20 MHz and C3 = 1.0 µF, ∆Gain/∆H = 0.0039 When the PGAMP gain setting is changed, the high-speed lead-in operation state is entered, and the feedback loop gain is increased by a multiple of N. Loop gain multiplication factor N can be selected from 2 times, 4 times, 8 times, or 16 times by changing the register settings (see table 1). Note that the open-loop differential gain (∆Gain/∆H) must be one or lower. If it is two or more, oscillation occurs. The time from the termination of high-speed lead-in operation to the return of normal loop gain operation can be selected from 1 H, 2 H, 4 H, or 8 H. If the offset error is over 16 LSB, the high-speed lead-in operation continues, and when the offset error is 16 LSB or less, the operation returns to the normal loop-gain operation after 1 H, 2 H, 4 H, or 8 H depending on the register settings. (Refer to table 2.) Table 1 Loop Gain Multiplication Factor during High-Speed Lead-In Operation HGain-Nsel (register settings) [0] [1] L L H L L H H H Multiplication Factor N 4 8 16 32 Table 2 High-Speed Lead-In Operation Cancellation Time HGstop-Hsel (register settings) [0] [1] L L H L L H H H Cancellation Time 1H 2H 4H 8H 5. Pre-Blanking Function During the PBLK input period, the CSD input operation is separated and protected from the large input signal. The ADC digital output is fixed to clamp data (14 to 76 LSB). Rev.1.0, Feb.25.2004, page 7 of 29 HD49335F/HF PBLK MINV X L LINV TEST0 H L TEST1 STBY 6. ADC Digital Output Control Function The ADC digital output includes the functions output enable, code conversion, and test mode. Tables 3, 4 and 5 show the output functions and the codes. Table 3 ADC Digital Output Functions D9 D8 ADC Digital Output D7 D6 D5 D4 X X X Hi-Z L L L Same as in table 4. L H L D9 is inverted in table 4. H L L D8 to D0 are inverted in table 4. H H L D9 to D0 are inverted in table 4. X X H Output code is set up to Clamp Level. H L L L Same as in table 5. L H L D9 is inverted in table 5. H L L D8 to D0 are inverted in table 5. H H L D9 to D0 are inverted in table 5. X X H Output code is set up to Clamp Level. H L H L H H X L L X L L H L H L H X H H L H L H L X L H L H L H H X Note: 1. STBY, TEST, LINV, and MINV are set by register. Table 4 D2 D1 D0 Operating Mode Low-power wait state Normal operation Pre-blanking Normal operation L L H H H H L L L L H H H H L L L L H H Pre-blanking Test mode ADC Output Code (Binary) Output Pin Output Steps codes Table 5 D3 X L 3 4 5 6 D9 L L L L D8 L L L L D7 L L L L D6 L L L L D5 L L L L D4 L L L L D3 L L L L D2 L H H H D1 H L L H D0 H L H L 511 512 L H H L H L H L H L H L H L H L H L H L 1020 1021 1022 1023 H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H H L L H H L H L H 3 4 5 6 D9 L L L L D8 L L L L D7 L L L L D6 L L L L D5 L L L L D4 L L L L D3 L L L L D2 L H H H D1 H H H L D0 L L H H 511 512 L H H H L L L L L L L L L L L L L L L L 1020 1021 1022 1023 H H H H L L L L L L L L L L L L L L L L L L L L L L L L L L L L H H L L L H H L ADC Output Code (Gray) Output Pin Output Steps codes Rev.1.0, Feb.25.2004, page 8 of 29 HD49335F/HF 7. Adjustment of Black-Level S/H Response Frequency Characteristics The CR time constant that is used for sampling/hold (S/H) at the black level can be adjusted by changing the register settings, as shown in table 6. Table 6 SHSW CR Time Constant Setting SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L L H L L L L H L L H H L L L L H L H L H L L H H L H H H L CR Time Constant (Typ) 2.20 nsec 2.30 nsec 2.51 nsec 2.64 nsec 2.93 nsec 3.11 nsec 3.52 nsec 3.77 nsec (cutoff frequency conversion) (72 MHz) (69 MHz) (63 MHz) (60 MHz) (54 MHz) (51 MHz) (45 MHz) (42 MHz) SHSW-fsel (Register setting) [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] [0] [1] [2] [3] L L L H H L L H L H L H H H L H L L H H H L H H L H H H H H H H CR Time Constant (Typ) 4.40 nsec 4.80 nsec 5.87 nsec 6.60 nsec 8.80 nsec 10.6 nsec 17.6 nsec 26.4 nsec (cutoff frequency conversion) (36 MHz) (33 MHz) (27 MHz) (24 MHz) (18 MHz) (15 MHz) (9 MHz) (6 MHz) 8. The SHAMP frequency characteristics can be adjusted by changing the register settings and the C4 value of the external pin. The settings are shown in table 7. Values other than those shown in the table 7 cannot be used. BLKC 31 C Recommendation value of C is 1000 pF Table 7 SHAMP Frequency Characteristics Setting LoPwr (Register setting) "Lo" [0] L [1] L SHA-fsel (Register setting) [1] [0] [1] L L H 116 MHz 75 MHz 10000 pF 13000 pF (270 pF) (300 pF) 32 MHz 49 MHz 22000 pF 15000 pF (750 pF) (620 pF) [0] H 230 MHz 6800 pF (240 pF) "Hi" 100 MHz 10000 pF (560 pF) Note: Upper line : SHAMP cutoff frequency (Typ) Middle line : Standard value of C4 (maximum value is not defined) Lower line : Minimum value of C4 (do not set below this value) Rev.1.0, Feb.25.2004, page 9 of 29 [0] H [1] H 56 MHz 18000 pF (360 pF) 24 MHz 27000 pF (820 pF) HD49335F/HF Timing Chart Figure 2 shows the timing chart when CDSIN and ADCIN input modes are used. 0 1 2 ~ 9 10 11 • When CDS_in input mode is used CDS_in N N+1 N+2 N+9 N+10 N−10 N−9 N−8 N−1 N N+11 SP1 SP2 ADCLK D0 to D9 • When ADC_in input mode is used N+1 N ADC_in N+11 N+10 N+2 N+9 N+8 ADCLK D0 to D9 N−9 N−8 N−1 N N+1 Figure 2 Output Timing Chart when CDSIN and ADCIN Input Modes are Used • The ADC output (D0 to D9) is output at the rising edge of the ADCLK in both modes. • Pipe-line delay is ten clock cycles when CDSIN is used and nine when ADCIN is used. • In ADCIN input mode, the input signal is sampled at the rising edge of the ADCLK. Rev.1.0, Feb.25.2004, page 10 of 29 HD49335F/HF Detailed Timing Specifications Detailed Timing Specifications when CDSIN Input Mode is Used Figure 3 shows the detailed timing specifications when the CDSIN input mode is used, and table 8 shows each timing specification. Black level Signal level CDS_in (2) (3) (1) SP1 Vth (5) (4) SP2 Vth (6) (7) (8) ADCLK Vth (9) (10) D0 to D9 (11) (12) (13) H1 Figure 3 Detailed Timing Chart when CDSIN Input Mode is Used Table 8 No. (1) (2) (3) (4) (5) (6) (7), (8) (9) (10) (11) (12) (13) Timing Specifications when the CDSIN Input Mode is Used Timing Black-level signal fetch time SP1 ‘Hi’ period Signal-level fetch time SP2 ‘Hi’ period SP1 falling to SP2 falling time SP1 falling to ADCLK rising inhibit time ADCLK tWH min./tWL min ADCLK rising to digital output holding time ADCLK rising to digital output delay time H1 rising to ADCLK rising time H1 rising to SPSIG falling time H1 rising to SPBLK falling time Symbol tCDS1 tCDS2 tCDS3 tCDS4 tCDS5 tCDS6 tCDS7, 8 tCHLD9 tCOD10 tCDS11 tCDS12 tCDS13 Min — Typ × 0.8 — Typ × 0.8 Typ × 0.85 — 11 — — — — — Typ (1.5) 1/4fCLK (1.5) 1/4fCLK 1/2fCLK (5) — (7) (16) (1/4fCLK) (1/fCLK) (1/2fCLK) Max — Typ × 1.2 — Typ × 1.2 Typ × 1.15 — — — — — — — OBP Detailed Timing Specifications Figure 4 shows the OBP detailed timing specifications. The OB period is from the fifth to the twelfth clock cycle after the OB pulse is inputted. The average of the black signal level is taken for eight input cycles during the OB period and it becomes the clamp level (DC standard). OB period *1 CDS_in N N+1 N+5 N+12 OBP OB pulse > 2 clock cycles Note: 1. Shifts ±1 clock cycle depending on the OBP input timing. Figure 4 OBP Detailed Timing Specifications Rev.1.0, Feb.25.2004, page 11 of 29 N+13 Unit ns ns ns ns ns ns ns ns ns ns ns ns HD49335F/HF Detailed Timing Specifications at Pre-Blanking Figure 5 shows the pre-blanking detailed timing specifications. PBLK Vth VOH Digital output (D0 to D9) ADC data ADC data Clamp Level VOL ADCLK × 2 clock ADCLK × 10 clock Figure 5 Detailed Timing Specifications at Pre-Blanking Detailed Timing Specifications when ADCIN Input Mode is Used Figure 6 shows the detailed timing chart when ADCIN input mode is used, and table 9 shows each timing specification. ADC_in (1) (2) (3) ADCLK Vth (4) (5) D0 to D9 VDD/2 Figure 6 Detailed Timing Chart when ADCIN Input Mode is Used Table 9 Timing Specifications when ADCIN Input Mode is Used No. Timing Symbol Min Typ Max Unit (1) (2), (3) Signal fetch time ADCLK tWH min./tWL min. tADC1 tADC2, 3 — Typ × 0.85 (6) 1/2fADCLK — Typ × 1.15 ns ns (4) (5) ADCLK rising to digital output hold time ADCLK rising to digital output delay time tAHLD4 tAOD5 — — (14.5) (23.5) — — ns ns Rev.1.0, Feb.25.2004, page 12 of 29 HD49335F/HF Dummy Clamp It adjusts the mis-clamp which occurs when taking the photo under the highlight conditions. (Like a sun) Normally it woks with the OB clamp, however when black level is out of the range caused by hightlight enter to OB part, it changes to clamp processing by dummy bit level. Resister settings are follows. D12, D11, D10 of address H'F7 (Dummy CP) 0, 0, 0 ; OFF 0, 0, 1 ; +32 0, 1, 0 ; +64 0, 1, 1 ; +96 : : 1, 1, 1 ; +224 The amount of offset are changes automatically depends on PGA gain in the LSI. D8, D8 of address H'F7 (DMCG) The amount of feed back current can be reduced with only dummy clamp. Data = 0:1/4 1:1/8 2:1/16 3:1/32 SP2 CDS_in CDS AGC SP1 SP1 SH AMP BLKFB ADC D8 to D9 of address H'F7 Current cell VRT BLKSH Detect 8clk from OBP edge Digital output − + )−( Dummy Detect 4clk DET from OPDM edge )+( + − + on/off Clamp level D10 to D12 of address H'F7 Note: OB/Dummy switching part has 1/8 hysteresis of threshold value. Figure 7 Internal Bias Circuitry Rev.1.0, Feb.25.2004, page 13 of 29 OB DET HD49335F/HF Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Power supply voltage Analog input voltage VDD VIN 4.1 –0.3 to AVDD +0.3 V V Digital input voltage Operating temperature range VI Ta –0.3 to DVDD +0.3 –20 to +85 V °C Power dissipation Storage temperature Pt Tstg 590 –55 to +125 mW °C Power supply voltage Vopr 2.70 to 3.30 V Note: AVDD, AVSS are analog power source systems of CDS, PGA, and ADC. DVDD1, DVSS1 are digital power source systems of CDS, PGA and ADC. DVDD2, DVSS2 are buffer power source systems of ADC output. DVDD3, DVSS3 are general digital power source systems of TG. DVDD4, DVSS4 are buffer power source systems of H1 and H2. • Pin 2 multi bonds the DVSS1 and DVSS2 • When pin 64 is set to Low, pin 41 = STROB output, pin 39 = SUB_SW output When Hi, pin 41 = Vgate input, pin 39 = ADCK input Electrical Characteristics (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items Common to CDSIN and ADCIN Input Modes Item Symbol Min Typ Max Unit Power supply voltage range VDD 2.70 3.00 3.30 V Conversion frequency fCLK hi 20 — 36 MHz LoPwr = low *2 HD49335HF fCLK low 5.5 — 25 MHz LoPwr = high *2 HD49335F VIH2 DVDD 2.25 × 3.0 — DVDD V VIL2 0 — DVDD 0.6 × 3.0 V VOH DVDD –0.5 — — V IOH = –1 mA VOL — — 0.5 V IOL = +1 mA Digital input current IIH — — 50 µA VIH = 3.0 V IIL –50 — — µA VIL = 0 V ADC resolution RES 10 10 10 bit Digital input voltage Digital output voltage Test Conditions Remarks CS, SCK, SDATA ADC integral linearity INL — (2) — LSBp-p fCLK = 25 MHz ADC differential linearity+ DNL+ — 0.3 0.99 LSB fCLK = 25 MHz *1 ADC differential linearity– DNL– –0.99 –0.3 — LSB fCLK = 25 MHz *1 Sleep current ISLP –100 0 100 µA Digital input pin is set to 0 V, output pin is open Standby current ISTBY — 3 5 mA Digital I/O pin is set to 0 V Notes: 1. Differential linearity is the calculated difference in linearity errors between adjacent codes. 2. 2 divided mode: fCLK = 1/2CLK_in 3 divided mode: fCLK = 1/3CLK_in 3. Values within parentheses ( ) are for reference. Rev.1.0, Feb.25.2004, page 14 of 29 HD49335F/HF Electrical Characteristics (cont.) (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items for CDSIN Input Mode Item Symbol Min Typ Max Unit Test Conditions Remarks Consumption current (1) IDD1 — 84 96.6 mA fCLK = 36 MHz CDSIN mode LoPwr = low Consumption current (2) IDD2 — 58 66.7 mA fCLK = 20 MHz CDSIN mode LoPwr = high CCD offset tolerance range VCCD (–100) — (100) mV Timing specifications (1) tCDS1 — (1.5) — ns Timing specifications (2) tCDS2 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (3) tCDS3 — (1.5) — ns Timing specifications (4) tCDS4 Typ × 0.8 1/4fCLK Typ × 1.2 ns Timing specifications (5) tCDS5 Typ × 0.85 1/2fCLK Typ × 1.15 ns Timing specifications (6) tCDS6 1 5 9 ns Timing specifications (7) tCDS7 — 1/2fCLK — ns Timing specifications (8) tCDS8 — 1/2fCLK — ns Timing specifications (9) tCHLD9 — (7) — ns CL = 10 pF Timing specifications (10) tCOD10 — (16) — ns CL = 10 pF Timing specifications (11) tCDS11 — (1/4fCLK) — ns Timing specifications (12) tCDS12 — (1/fCLK) — ns Timing specifications (13) tCDS13 — (1/2fCLK) — ns Clamp level CLP(00) — (14) — LSB CLP(09) — (32) — LSB CLP(31) — (76) — LSB AGC(0) –4.4 –2.4 –0.4 dB AGC(63) 4.1 6.1 8.1 dB AGC(127) 12.5 14.5 16.5 dB AGC(191) 21.0 23.0 25.0 dB AGC(255) 29.4 31.4 33.4 dB DLL_2 11 — 25 MHz *2 DLL_3 7 — 11 MHz *3 DLL_4 5.5 — 7 MHz *4 T/G 3/1divided operation frequency range CLK_in3 28.6 — 28.6 MHz fCLK = 1/3CLK_in3 H Buffer output voltage VOH 2.94 2.97 — V 30 mA Buff, IOH = –5 mA VOL — 22 47 MV 30 mA Buff, IOL = +5 mA VOH 2.89 2.94 — V 14 mA Buff, IOH = –5 mA VOL — 50 112 MV 14 mA Buff, IOL = +5 mA VOH 2.91 2.96 — V 10 mA Buff, IOH = –3 mA VOL — 36 78 MV 10 mA Buff, IOL = +3 mA VOH 2.85 2.93 — V 4 mA Buff, IOH = –2 mA VOL — 60 129 MV 4 mA Buff, IOL = +2 mA VOH 2.69 2.86 — V 2 mA Buff, IOH = –2 mA VOL — 115 262 mV 2 mA Buff, IOL = +2 mA VOH 2.81 2.90 — V IOH = –2 mA VOL — 78 141 mV IOL = +2 mA PGA gain at CDS input DLL operation frequency RG output voltage Notes: 1. 2. 3. 4. 5. Define digital output full scall with 1 V input as 0 dB. Number of master steps: 60 steps, DLL current High Number of master steps: 40 steps, DLL current Low Number of master steps: 60 steps, DLL current Low Values within parentheses ( ) are for reference. Rev.1.0, Feb.25.2004, page 15 of 29 Refer to table 8 *1 HD49335F/HF Electrical Characteristics (cont.) (Unless othewide specified, Ta = 25°C, AVDD = 3.0 V, DVDD = 3.0 V, and RBIAS = 33 kΩ) • Items for ADCIN Input Mode Item Symbol Min Typ Max Unit Test Conditions Remarks Consumption current (3) IDD3 — 32 38.4 mA fCLK = 36 MHz ADCIN mode LoPwr = low Consumption current (4) IDD4 — 22 27.5 mA fCLK = 25 MHz ADCIN mode LoPwr = high Timing specifications (14) tADC1 — (6) — ns Timing specifications (15) tADC2 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (16) tADC3 Typ × 0.85 1/2fADCLK Typ × 1.15 ns Timing specifications (17) tAHLD4 — (14.5) — ns CL = 10 pF Timing specifications (18) tAOD5 — (23.5) — ns CL = 10 pF Input current at ADC input IINCIN –110 — 110 µA VIN = 1.0 to 2.0 V Clamp level at ADC input OF2 — (512) — LSB PGA gain at ADC input GSL(0) 0.45 0.57 0.72 Times GSL(63) 1.36 1.71 2.16 Times GSL(127) 2.27 2.86 3.60 Times GSL(191) 3.18 4.00 5.04 Times GSL(255) 4.08 5.14 6.47 Times Note : Values within parentheses ( ) are for reference. Rev.1.0, Feb.25.2004, page 16 of 29 Refer to table 9 HD49335F/HF Serial Interface Specifications Timing Specifications Data is determined at CS rising edge tINT2 tINT1 Latches SDATA at SCK rising edge CS fSCK SCK tsu SDATA tho D8 D9 D10 D11 D12 D13 D14 D15 D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7 STD2(Upper data) STD1(Lower data) address(address) Figure 8 Serial Interface Timing Specifications Item Min Max fSCK tINT1,2 — 50 ns 5 MHz — tsu tho 50 ns 50 ns — — Notes: 1. 2. 3. 4. 5. 3 byte continuous communications. Input SCK with 24 clock when CS is Low. It becomes invalid when data communications are stopped on the way. Data becomes a default with hardware reset. Input more than double frequency of SCK to the CLK_in when transfer the serial data. The Kind of Data Data address has 256 type. H’00 to H’FF H’00 : : H’EF Data at timing generator part H’F0 : : H’FF Data at CDS part Address map of each data referred to other sheet. Details of timing generator refer to the timing chart on the other sheet together with this specification. This specification only explains about the data of CDS part. Rev.1.0, Feb.25.2004, page 17 of 29 HD49335F/HF Explanation of Serial Data of CDS Part Serial data of CDS part are assigned to address H’F0 to H’F8. Functions are follows. 1 1 1 Address 1 0 0 0 0 STD1[7:0] (L) STD2[15:8] (H) D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 PGA gain test_I1 • PGA gain (D0 to D7 of address H’F0) Details are referred to page 5 block diagram. At CDS_in mode: –2.36 dB + 0.132 dB × N (Log linear) At ADC_in mode: 0.57 times + 0.01784 times × N (Times linear) ∗: Full-scale digital output is defined as 0 dB when 1 V is input. Above PGA gain definition means input signal 1 Vp-p to CDS_in, and set N = 18 (correspond 2.36 dB), and then PGA outputs the 2 V full-range, and also ADC out puts the full code (1023). This mean offset gain of PGA has 6 dB – 2.36 dB = 3.64 dB, therefore it should be decided that how much dB add on. (1.0 V) (1023) (2.0 V) (1.0 V) CDS PGA ADC 0 dB when set N = 18 which correspond to 2.36 dB (1) Level dia explain 2V CDS PGA 1023 ADC (CDS = 0 dB) 3.64 dB + 0.132 dB × N (2) Level dia on the circuit Figure 9 Level Dia of PGA • Test_I1 (D13 to D15 of address H’F0) It controls the standard current of analog amplifier systems of CDS, PGA. Use data = 4 (D15 = 1) normally. When data = 0, 50% current value with default When data = 4, default When data = 7, 150% current value with default SLP 1 STBY 0 LINV 0 MINV 1 STD1[7:0] (L) STD2[15:8] (H) D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 test0 1 Address 1 1 0 test_I2 SHSW_fsel SHA_fsel • SLP and STBY (D0, D1 of address H’F1) SLP: Stop the all circuit. Consumption current of CDS part is less than 10 µA. Start up from offset calibration when recover is needed. STBY: Only the standard voltage generating circuit is operated. Consumption current of CDS part is about 3 mA. Allow 50 H time for feedback clamp is stabilized until recover. Rev.1.0, Feb.25.2004, page 18 of 29 HD49335F/HF • Output mode (D2 to D4 of address H’F1 and address H’F4 of D6) It is a test mode. Combination details are table 3 to 5. Normally set to all 0. • SHA-fsel (D8 to D9 of address H’F1) It is a LPF switching of SH amplifier. Frequency characteristics are referred to page 8. To get rough idea, set the double cut off frequency point with using. • SHSW-fsel (D10 to D13 of address H’F1) It is a time constant which sampling the black level of SH amplifier. Frequency characteristics are referred to page 8. To get rough idea, set the double cut off frequency point with using. S/N changes by this data, so find the appropriate point with set data to up/down. • Test_I2 (D14 to D15 of address H’F1) Current of ADC analog part can be set minutely. Normally use data = 0. 0: Default (100%) 1: 150% 2: 50% 3: 80% 0 1 STD1[7:0] (L) D4 D3 D2 0 D1 Clamp level STD2[15:8] (H) D0 D15 D14 D13 D12 D11 D10 D9 Low_pwr Address 1 0 CDS_buff 1 AD_sel 1 Reset 1 D8 HGain-Nsel HGstop-Hsel • Clamp (D0 to D4 of address H’F2) Determine the OB part level with digital code of ADC output. Clamp level = setting data × 2 + 14 Default data is 9 = 32 LSB. • HGstop-Hsel, HGain-Nsel (D8 to D11 of address H’F2) Determine the lead-in speed of OB clamp. Details are referred to page 7. PGA gain need to be changed for switch the high speed leading mode. Transfer the gain +1/–1 to previous field, its switch to high speed leading mode. • Low_PWR (D12 of address H’F2) Switch circuit current and frequency characteristic. Data = 0: 36 MHz guarantee Data = 1: 25 MHz guarantee • ADSEL (D14 of address H’F2) Data = 0: Select CDS_in Data = 1: Select ADC_in • Reset (D15 of address H’F2) Software reset. Data = 1: Normal Data = 0: Reset Offset calibration should be done when starting up with using this bit. Details are referred to page 23. 1 1 1 Address 1 0 0 1 1 STD1[7:0] (L) STD2[15:8] (H) D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 • Address H'F3 are all testing data. Normally set to all 0., or do not transfer the data. Rev.1.0, Feb.25.2004, page 19 of 29 HD49335F/HF 1 1 1 Address 1 0 1 0 STD1[7:0] (L) D7 D6 D5 D4 D3 D2 D1 D0 0 VD latch H12_Buff MON • MON (D0 to D2 of address H’F4) Select the pulse which output to pin MON (pin 60). When D0 to D2: 0, Fix to Low When 1, ADCLK When 2, SP1 When 3, SP2 When 4, OBP When 5, PBLK When 6, CPDM When 7, DLL_test • H12Baff (D3 to D6 of address H’F4) Select the buffer size which output to pin H1A, H2A (pin 22, 26). D3: 2 mA buffer D4: 4 mA buffer D5: 10 mA buffer D6: 14 mA buffer Above data can be on/off individually. Default is D6 can be on only. (18 mA buffer) • VD latch (D7 of address H’F4) Data = 0: Gain data is determined when CS rising Data = 1: Gain data is determined when VD falling Differential Code and Gray Code (D8 to D12 of address H’F4) • Gray code (D8 to D9 of address H’F4) DC output code can be change to following type. Gray Code [1] Gray Code [0] Output Code 0 0 0 1 Binary code Gray code 1 1 0 1 Differential encoded binary Differential encoded gray • Serial data setting items (D10 to D12 of address H’F4) Setting Bit Setting Contents Gray_test[0] Gray_test[1] Standard data output timing control signal (Refer to the following table) Gray_test[2] ADCLK polar with OBP. (Lo→Positive edge, HI→Negative edge) • Standard data output timing Gray_test[1] Gray_test[0] Standard Data Output Timing Low Low Third and fourth Low High Fourth and fifth High High Low High Fifth and sixth Sixth and seventh Rev.1.0, Feb.25.2004, page 20 of 29 STD2[15:8] (H) D12 D11 D10 D9 D8 Gray_test Gray code HD49335F/HF Ripple (pseudo outline made by quantized error) occurres on the point which swithing the ADC output multiple bit in parallel. When switching the several of ADC output at the same time, ripple (pseudo outline caused by miss quantization) occurs to the image. Differential code and gray code are recommended for this countermeasure. Figure 10 indicates circuit block. When luminance signal changes are smoothly, the number of bit of switching digital output bit can be reduced and easily to reduce the ripple using this function. This function is especially effective for longer the settings of sensor more than clk = 30 kHz, and ADC output. Figure 11 indicates the timing specifications. 10 Differential SW(D9) ADC + − 2clk_DL Carry bit round Standard data control signal (D12,D11,D10) Gray SW(D8) Standard data selector 10-bit output Gray→Binary conversion Figure 10 Differential Code, Gray Code Circuit (In case of select the positive edge of ADCLK with D12) ADCLK OBP (In case of select the positive polar) (Beginning edge of OBP and standard edge of ADCLK should be exept ±5 ns) 1 Digital output 2 Differential data 3 4 5 6 Standard data 7 8 9 10 11 Differential data Figure 11 Differential Code Timing Specifications To use differential code, complex circuit is necessary at DSP side. From ADC Gray → Binary D11 Carry bit round Standard data selector Standard data control signal 2clk_DL D10 D11 D10 D9 D9 D0 D0 (2) Gray → Binary conversion (1) Differential coded Figure 12 Complex Circuit Example 1 1 1 Address 1 0 1 0 1 STD1[7:0] (L) D7 D6 D5 D4 D3 D2 D1 D0 P_RG 1 1 1 Address 1 1 0 0 0 D6 P_ADCLK STD1[7:0] (L) D5 D4 D2 P_SP2 Rev.1.0, Feb.25.2004, page 21 of 29 P_SP2 P_SP1 D1 STD2[15:8] (H) D12 D11 D10 D9 D8 DLL current DLL steps STD2[15:8] (H) D0 D15 D14 D13 D12 D10 D9 D8 P_SP1 2,3 divided select P_RG P_ADCLK HD49335F/HF • Address H’F5 sets the DLL delay time and selects the 1/4 phase. Details are on the next page. And D15 of address H’F8 can switch 2/3 divided mode but ensure that this address data relative to valid/invalid. D15 of address H’F8 = 0 D15 of address H’F8 = 1 Divided mode 2 divided, 1/4 phase select 3 divided, 1/6 phase select D0 to D7 of address H’F5 Valid Invalid D0 to D14 of address H’F8 Invalid Valid • Phase settings of high speed pulse (address H’F5 to H’F8) (1) Select the 1/4 phase from figure 13 at 2 divided mode (D15 = 0 of address H’F8). Select the 1/6 phase from figure 14 at 3 divided mode (D15 = 1 of address H’F8). ·····P_SP1, P_SP2, P_ADCLK, P_RG (2) Then select the necessary delay time from figure 15. ·····DL_SP1, DL_SP2, DL_RG, DL_ADCLK RG can be set both of rising / falling edge optionally. H1 H1 Data = 0 Data = 1 P_SP1 P_SP2 Data = 2 Data = 0 Data = 1 P_ADCLK P_RG Data = 2 Data = 3 Data = 3 Figure 13 2 Divided Mode, 1/4 Phase Select (Valid at D15 = 0 of address H’F8) H1 H1 Data = 5 Data = 0 Data = 0 Data = 1 Data = 1 P_SP1 P_SP2 Data = 2 Data = 2 P_ADCLK P_RG Data = 3 Data = 3 Data = 4 Data = 4 Data = 5 Figure 14 3 Divided Mode, 1/6 Phase Select (Valid at D15 = 1 of address H’F8) Default Value of Each Phases P_SP1 P_SP2 P_ADCLK P_RG 2 divided mode 1 2 1 0 3 divided mode 0 3 1 5 Note: 50% of duty pulse makes tr, tf of RG by DLL. 1 1 1 Address 1 0 1 1 0 STD1[7:0] (L) D7 D6 D5 D4 D3 D2 D1 D0 DL_SP2 1 1 1 Address 1 0 1 1 1 STD1[7:0] (L) D7 D6 D5 D4 D3 D2 D1 D0 DL_RG_f Rev.1.0, Feb.25.2004, page 22 of 29 DL_SP1 DL_RG_r STD2[15:8] (H) D12 D11 D10 D9 D8 CDS_test DL_ADCLK STD2[15:8] (H) D12 D11 D10 D9 D8 Dummy clamp th Dummy clamp current HD49335F/HF (3) Setting method of DLL 1. DLL step decides the how many divide the 1 cycle of sensor CLK. For reference, set 1 ns(when 2 ns DLL_current bit = 0, ADCLK(0) when 1 set to 1 ns) (In phase with H1) Can be set 16 to 64 steps by 4 steps. Steps = 4 + (4 × N); possible to set N = 3 to 15 Recommended steps is clk_in = when 11 to 14 MHz: H'0E(60 steps) when 14 to 22MHz: H'09(40 steps) when 22 to 50MHz: H'1E(60 steps) P_ADCLK when 50 to 72MHz: H'19(40 steps) 2. Can be change each 4 type of pulse 0 to 15 steps with 1 step. (1 ns or 2 ns divide) 3. Select the 2 ns divide when sensor CLK is less than 15 MHz. P_SP1 Control voltage DLL = 64 steps PC DLL = 15 steps DL_ADCLK DLL = 15 steps H1 DL_SP1 DL_RG P_SP2 10 DL_SP1 DLL = 15 steps DL_SP2 DL_SP2 ADCLK (0, 0) DL_ADCLK 0 14 42 28 ∗Default DLL = 15 steps (Falling) 56 (Rising) Figure 15 Analog Delay (DLL) Circuit Block. • CDS_test (D12 of address H’F6) It is testing data. Normally set to 0. • Dummy clamp current (D9 to 8 of address H’F7) Data = When 0, 1/4 When 1, 1/8 When 2, 1/16 When 3, 1/32 Details are refer to page 12. • Dummy clamp threshold (D12 to 10 of address H’F7) Data = When 0, off When 1, +32 When 2, +64 When 3, +96 When 4, +128 When 5, +160 When 6, +192 When 7, +224 Details are refer to page 12. Rev.1.0, Feb.25.2004, page 23 of 29 AND DL_RG DLL_C HD49335F/HF Operation Sequence at Power On Must be stable within the operating power supply voltage range VDD CLK_in 3clk or more Hardware Reset Note: At 2 divided mode: ADCLK = 1/2CLK_in At 3 divided mode: ADCLK = 1/3CLK_in 6clk or more HD49335 serial data transfer 2ms or more (Charge of external C) (1) (2) (3) 40,000ADCLK or more (offset calibration) (5) (4) SP1 Start control SP2 ADCLK of TG and camera DSP OBP etc. RESET bit Automatic offset calibration CDS_Reset = Low Automatic adjustment taking 40,000ADCLK period after Reset cancellation The following describes the above serial data transfer. For details of resistor settings are referred to serial data function table. (1) Resistor transfer of TG part : Wait more than 6clk after release the hardware Reset and then transfer the necessary data to TG part. (2) DLL data transfer of CDS part : Transfer the phase data of RG, SP1, SP2, ADCLK of CDS part. (3) Reset=L of CDS part : Transfer Reset bit = 0 of address H'F2. (4) Reset=H of CDS part : Transfer Reset bit = 1 of address H'F2. (Reset release) (5) Other data of CDS part : Transfer the SH_SW_fsel and other PGA. ∗ Before transfer the Reset bit = 0, TG series pulse need to be settled, so address H'00 to H'EF of TG part and H'F4 to H7F7 of CDS part should transfer in advance. Rev.1.0, Feb.25.2004, page 24 of 29 HD49335F/HF Timing Specifications of High Speed Pulse • H1, H2, RG waveform tr twh tf H2 90% 50% 10% H1 two tr twh twl tf tH1DL 90% 50% 10% RG twl twh twl tr tf Load Unit capacitance min typ max min typ max min typ max min typ max H1/H2 14 20 — 14 20 — — 8.0 14 — 8.0 14 ns 165 pF RG 7 10 — — 37 — — 4.0 — — 4.0 — ns 15 pF XV1 to 4 — — — — — — — 20 — — 20 — ns 15 pF CH1 to 4 — — — — — — — 20 — — 20 — ns 15 pF XSUB/SUB_SW — — — — — — — 20 — — 20 — ns 15 pF Item two Item H1/H2 overlap min typ max Unit 12 20 — ns Rev.1.0, Feb.25.2004, page 25 of 29 Power supply specification of H1, H2, RG are 3.0 V to 3.3 V. Values are sensor CLK = when 18 MHz. HD49335F/HF Notice for Use 1. Careful handling is necessary to prevent damage due to static electricity. 2. This product has been developed for consumer applications, and should not be used in non-consumer applications. 3. As this IC is sensitive to power line noise, the ground impedance should be kept as small as possible. Also, to prevent latchup, a ceramic capacitor of 0.1 µF or more and an electrolytic capacitor of 10 µF or more should be inserted between the ground and power supply. 4. Common connection of AVDD and DVDD should be made off-chip. If AVDD and DVDD are isolated by a noise filter, the phase difference should be 0.3 V or less at power-on and 0.1 V or less during operation. 5. If a noise filter is necessary, make a common connection after passage through the filter, as shown in the figure below. Analog +3.0V Digital +3.0V Noise filter AVDD DVDD1 to 4 Noise filter DVDD1 to 4 HD49335 AVSS Example of noise filter AVDD HD49335 DVSS DVSS AVSS 100 µH 0.01 µF 0.01 µF 6. Connect AVSS and DVSS off-chip using a common ground. If there are separate analog system and digital system set grounds, connect to the analog system. 7. When VDD is specified in the data sheet, this indicates AVDD and DVDD. 8. No Connection (NC) pins are not connected inside the IC, but it is recommended that they be connected to power supply or ground pins or left open to prevent crosstalk in adjacent analog pins. 9. To ensure low thermal resistance of the package, a Cu-type lead material is used. As this material is less tolerant of bending than Fe-type lead material, careful handling is necessary. 10. The infrared reflow soldering method should be used to mount the chip. Note that general heating methods such as solder dipping cannot be used. 11. Serial communication should not be performed during the effective video period, since this will result in degraded picture quality. Also, use of dedicated ports is recommended for the SCK and SDATA signals used in the HD49330AF. If ports are to be shared with another IC, picture quality should first be thoroughly checked. 12. At power-on, automatic adjustment of the offset voltage generated from PGA, ADC, etc., must be implemented in accordance with the power-on operating sequence (see page 24). 13. Ripple noise of DC/DC converter which generates the voltage of analog part should set under –50 dB with power supply voltage. Rev.1.0, Feb.25.2004, page 26 of 29 HD49335F/HF Example of Recommended External Circuit Pin 57 • Slave mode Pin 57(Test1 = Low) to CCD 47µ 3.0V 47µ 47/6 + Specification Mode Low Slave mode CLK, HD, VD input from SSG. Hi Master mode HD, VD output ∗ Pin 56 = Low: TESTIN mode. Please do not use. Reset(Normally Hi) 0.1 0.1 33 XV4 to V.Baff 34 CH1 XV2 XV1 DVDD3 DVDD4 1/4clk_o H2A DVSS4 DVSS4 1/2clk_o H1A DVDD4 DVDD3 RG Reset 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 XV3 35 CH2 36 CH3 37 CH4 38 XSUB 39 SUB_SW/ADCK_in to CCD 40 SUB_PD HD49335 41 STROB/Vgate 42 DVSS3 43 AVSS 33k 45 BIAS 0.1 46 VRB 0.1 47 VRT 0.1 48 VRM AVDD BLKC CDS_in AVDD BLKFB BLKSH AVSS Test2 Test1 DLL_C DVDD1 MON 41pin_cont CS Sdata 44 ADC_in VD_in HD_in CLK_in DVSS3 DVDD2 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DVSS1,2 ID from Pulse generator 16 15 14 13 12 11 10 9 7 6 5 4 3 2 ID pulse 1 SCK 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 ∗ 61pin = Low: Pin 41 is STROB output Pin 39 is SUB_SW output 61pin = Hi: Pin 41 is Vgate output 47/6 Pin 39 is Hiz + 47µ to Camera signal processor 8 + 47/6 0.1 1µ 1µ 1000p CCD signal input 0.1 100p Serial data input • Master mode Pin 57(Test1 = Hi) to CCD 47µ 3.0V 47µ 47/6 + Reset(Normally Hi) 0.1 0.1 to Camera signal processor 33 XV4 to V.Baff 34 CH1 XV2 XV1 DVDD3 DVDD4 1/4clk_o H2A DVSS4 DVSS4 1/2clk_o H1A DVDD4 DVDD3 RG Reset 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 XV3 35 CH2 36 CH3 37 CH4 38 XSUB 39 SUB_SW/ADCK_in to CCD 40 SUB_PD HD49335 41 STROB/Vgate 42 DVSS3 43 AVSS 33k 45 BIAS 0.1 46 VRB 0.1 47 VRT 0.1 48 VRM AVDD HD_in CLK_in DVSS3 DVDD2 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DVSS1,2 ID BLKC CDS_in AVDD BLKFB BLKSH AVSS Test2 Test1 DLL_C DVDD1 MON 41pin_cont CS Sdata 44 ADC_in VD_in 16 from Pulse generator 15 14 13 12 11 10 9 to Camera signal processor 8 7 6 5 4 3 2 ID pulse 1 SCK 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 + 47µ 0.1 + 47/6 CCD signal input 1000p 1µ 1µ 0.1 100p Serial data input Rev.1.0, Feb.25.2004, page 27 of 29 47/6 ∗ 61pin = Low: Pin 41 is STROB output Pin 39 is SUB_SW output 61pin = Hi: Pin 41 is Vgate output Pin 39 is Hiz Unit: R: Ω C: F HD49335F/HF • CDS single operating mode Pin 56(Test2 = Low) ∗Pin 57 is "Don't care" in this mode. 47µ 3.0V + 47/6 47µ Reset(Normally Hi) 0.1 0.1 Reset DVDD4 DVDD3 33 DVSS4 DVSS4 DVDD3 DVDD4 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 34 15 DVSS3 DVDD2 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 DVSS1,2 35 36 PBLK 37 OBP 38 CP_DM 39 ADCK 40 SP2 HD49335 41 SP1 42 DVSS3 43 AVSS 33k 45 BIAS 0.1 46 VRB 0.1 47 VRT 0.1 48 VRM AVDD BLKC CDS_in AVDD BLKFB BLKSH AVSS Test2 Test1 DLL_C DVDD1 MON 41pin_cont CS Sdata 44 ADC_in ADC_in 14 13 12 11 10 9 to Camera signal processor 8 7 6 5 4 3 2 1 SCK 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 + 47µ 0.1 + 47/6 CCD signal input 1µ 1µ 0.1 1000p ∗Pin changes are not effective with pin61. 47/6 100p Unit: R: Ω C: F Serial data input Serial data when CDS single operation mode are following resister specifications. (Latch timing specification is same as normal mode) CS fsck tINT1 tINT2 SCK tsu SDATA Resister 0 tho D00 D01 D02 D03 D04 D05 D06 D07 D08 D09 D10 D11 D12 D13 D14 D15 Resister 1 Resister 2 Resister 3 Resister 4 Resister 5 Resister 6 Resister 7 D00 Low 0 High 1 Low 0 High 1 Low 0 High 1 Low 0 High 1 D01 Low 0 Low 0 High 1 High 1 Low 0 Low 0 High 1 High 1 D02 Low 0 Low 0 Low 0 Low 0 High 1 High 1 High 1 High 1 D03 X Normal 0 SLP Low: High: Sleep 0 Clamp(0) 1 0 MON(0) 0 P_SP1(0) 1 DL_SP1(0) 0 DL_RG_r(0) 0 D04 X Normal 0 STBY Low: High: Standby 0 Clamp(1) 0 0 MON(1) 0 P_SP1(1) 0 DL_SP1(1) 0 DL_RG_r(1) 0 D05 PGA(0) LSB 0 Output mode(LINV) 0 Clamp(2) 0 0 MON(2) 0 P_SP2(0) 1 DL_SP1(2) 0 DL_RG_r(2) 0 D06 PGA(1) 0 Output mode(MINV) 0 Clamp(3) 1 0 H12Baff(0) 0 P_SP2(1) 1 DL_SP1(3) 0 DL_RG_r(3) 0 D07 PGA(2) 0 Output mode(Test0) 0 Clamp(4) 0 0 H12Baff(1) 0 P_ADCLK(0) 1 DL_SP2(0) 0 DL_RG_f(0) 0 D08 PGA(3) 0 SHA-fsel(0) 0 HGstop-Hsel(0) 0 0 H12Baff(2) 0 P_ADCLK(1) 0 DL_SP2(1) 0 DL_RG_f(1) 1 D09 PGA(4) 0 SHA-fsel(1) 0 HGstop-Hsel(1) 0 0 H12Baff(3) 1 P_RG(0) 0 DL_SP2(2) 0 DL_RG_f(2) 0 D10 PGA(5) 0 SHSW-fsel(0) 0 HGain-Nsel(0) 0 0 VD latch 0 P_RG(1) 0 DL_SP2(3) 0 DL_RG_f(3) 1 D11 PGA(6) 0 SHSW-fsel(1) 0 HGain-Nsel(1) 0 0 Gray1 0 DLL_CK(0) 1 DL_ADCLK(0) 0 DMCG(0) 0 D12 PGA(7) MSB 0 SHSW-fsel(2) 0 Gray2 0 DLL_CK(1) 0 DL_ADCLK(1) 0 DMCG(1) 0 D13 Test_I1 (0) 0 SHSW-fsel(3) Normal 0 LoPwr Low: High: Low power 1 0 X 0 0 Gray_ts(0) 0 DLL_CK(2) 1 DL_ADCLK(2) 0 Dummy CP(0) 0 D14 Test_I1 (1) 0 Test_I2 (0) 0 ADSEL Low:CDSin High:ADin 0 0 Gray_ts(1) 0 DLL_CK(3) 1 DL_ADCLK(3) 0 Dummy CP(1) 0 D15 Test_I1 (2) 1 Test_I2 (1) Reset 1 0 Reset Low: High: Normal 0 Gray_ts(2) 0 DLL_current 1 CDS_test Rev.1.0, Feb.25.2004, page 28 of 29 test 0 Dummy CP(2) 0 HD49335F/HF Package Dimensions As of January, 2003 Unit: mm 32 64 17 0.5 49 *0.21 ± 0.05 0.19 ± 0.04 0.08 M 1.25 *0.17 ± 0.05 0.15 ± 0.04 16 1.20 Max 1 1.0 12.0 ± 0.2 12.0 ± 0.2 10.0 48 33 1.25 1.0 +0.03 0.07 -0.06 0˚ – 8˚ 0.10 *Dimension including the plating thickness Base material dimension Rev.1.0, Feb.25.2004, page 29 of 29 0.50 ± 0.1 Package Code JEDEC JEITA Mass (reference value) TFP-64C — Conforms 0.4 g Sales Strategic Planning Div. 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