ON MC33765 Very low dropout/ultra low noise 5 outputs voltage regulator Datasheet

MC33765
Very Low Dropout/Ultra Low
Noise 5 Outputs Voltage
Regulator
The MC33765 is an ultra low noise, very low dropout voltage
regulator with five independent outputs which is available in
TSSOP−16 surface mount package.
The MC33765 is available in 2.8 V. The output voltage is the same
for all five outputs but each output is capable of supplying different
currents up to 150 mA for output 4. The device features a very low
dropout voltage (0.11 V typical for maximum output current), very
low quiescent current (5.0 mA maximum in OFF mode, 130 mA typical
in ON mode) and one of the output (output 3) exhibits a very low noise
level which allows the driving of noise sensitive circuitry. Internal
current and thermal limiting protections are provided.
Additionally, the MC33765 has an independent Enable input pin for
each output. It includes also a common Enable pin to shutdown the
complete circuit when not used. The Common Enable pin has the
highest priority over the five independent Enable input pins.
The voltage regulators VR1, VR2 and VR3 have a common input
voltage pin VCC1. The other voltage regulators VR4 and VR5 have a
common input voltage pin VCC2.
http://onsemi.com
MARKING
DIAGRAM
16
MC33
765
ALYW G
G
TSSOP−16
DTB SUFFIX
CASE 948F
1
1
A = Assembly Location
L
= Wafer Lot
Y = Year
W = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
Features
•
•
•
•
•
•
•
•
Five Independent Outputs at 2.8V Typical, Based Upon Voltage Version
Internal Trimmed Voltage Reference
Vout Tolerance ±3.0% over the Temperature Range −40°C to +85°C
Enable Input Pin (Logic−Controlled Shutdown) for Each of the Five
Outputs
Common Enable Pin to Shutdown the Whole Circuit
Very Low Dropout Voltage (0.11 V Typical for Output 1, 2, 3 and 5;
0.17 V Typical for Output 4 at Maximum Current)
Very Low Quiescent Current (Maximum 5.0 mA in OFF Mode,
130 mA Typical in ON Mode)
Ultra Low Noise for VR3 (30 mV RMS Max, 100 Hz < f < 100 kHz)
Internal Current and Thermal Limit
100 nF for VR1, VR2, VR4 and VR5 and 1.0 mF for VR3 for Stability
Supply Voltage Rejection: 60 dB (Typical) @ f = 1.0 kHz
These are Pb−Free Devices*
MAXIMUM RATINGS
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
Rating
PIN CONNECTIONS
Bypass
Common Enable
1
16 Not Connected
2
15 VCC1
14 Output V−Reg. 1
On/Off V−Reg. 1
3
On/Off V−Reg. 2
4
On/Off V−Reg. 3
5
On/Off V−Reg. 4
6
On/Off V−Reg. 5
7
10 VCC2
GND
8
9 Output V−Reg. 5
MC33765
•
•
•
•
13 Output V−Reg. 2
12 Output V−Reg. 3
11 Output V−Reg. 4
(Top View)
ORDERING INFORMATION
Package*
Shipping †
MC33765DTB
TSSOP−16
96 Units/Rail
MC33765DTBG
TSSOP−16
96 Units/Rail
MC33765DTBR2
TSSOP−16 2500 Tape & Reel
Device
Symbol
Value
Unit
Power Supply Voltage
VCC
5.3
V
Thermal Resistance Junction−to−Air
RqJA
140
°C/W
Operating Ambient Temperature
TA
−40 to +85
°C
MC33765DTBR2G TSSOP−16 2500 Tape & Reel
Maximum Operating Junction Temperature
TJ
125
°C
TJmax
150
°C
Tstg
−60 to +150
°C
*This package is inherently Pb−Free.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Maximum Junction Temperature
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
June, 2006 − Rev. 4
1
Publication Order Number:
MC33765/D
MC33765
Simplified Block Diagram
VCC1
(15)
CE
(2)
(10)
VCC2
330 nF
Common
Enable
(3)
ON/OFF 1
Current
Limit
Enable
VCC1
−
Voltage
Reference
BYPASS
1.25 V
+
100 nF
(14)
VOUT1
Temp.
Shut.
(4)
ON/OFF 2
Current
Limit
Enable
100 nF
VCC1
−
+
(13)
VOUT2
Temp.
Shut.
100 nF
(5)
ON/OFF 3
Current
Limit
Enable
VCC1
−
+
(12)
VOUT3
Temp.
Shut.
(6)
ON/OFF 4
Current
Limit
Enable
1.0 mF
VCC2
−
+
(11)
VOUT4
Temp.
Shut.
(7)
ON/OFF 5
Current
Limit
Enable
100 nF
VCC2
−
+
(9)
Temp.
Shut.
(8)
GND
http://onsemi.com
2
VOUT5
100 nF
MC33765
CONTROL ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA = −40°C to +85°C/ Max TJ = 125°C)
Symbol
Characteristics
Pin #
Min
Typ
Max
Unit
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
INDEPENDENT ENABLE PINS
Input Voltage Range
VON/OFF(1−5)
Control Input Impedance
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
VON/OFF(1−5)
−
0
−
VCC
V
−
100
−
−
2.0
−
−
kW
−
−
0.5
−
V
COMMON ENABLE PIN
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁ
ÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁ
ÁÁÁÁÁÁÁ
ÁÁÁ
Input Voltage Range
VCE
Control Input Impedance
Logic “0”, i.e. OFF State
Logic “1”, i.e. ON State
VCE
2
0
−
VCC
V
2
100
−
−
kW
2
−
2.0
−
−
0.3
−
V
−
−
5.0
−
470
−
−
130
−
CURRENT CONSUMPTION WITH NO LOAD
Current Consumption at Logic “0” for the complete device,
i.e. Common Enable and All Independent Enable pins at OFF State
IQOFF
Current Consumption at Logic “1” for the complete device,
i.e. Common Enable and All Independents Enable pins at ON State
IQON1
Current Consumption at Logic “1”, Common Enable at ON State
and All Independents Enable pins at OFF State
IQON2
mA
mA
mA
SUPPLY AND OUTPUT VOLTAGES, DROPOUT AND LOAD REGULATION
Supply Voltage VCC
MC33765 (2.8V)
VCC1, VCC2
15, 10
3.0
3.6
5.3
V
Regulator Output Voltage for VR1, VR2, VR3, VR4 and VR5
MC33765 (2.8V)
VOUT(1−5)
14, 13, 12,
11, 9
2.7
2.8
2.85
Dropout Voltage for VR1, VR2, VR3, VR5 (Note 1)
VCC−VOUT
14, 13, 12,
9
−
0.11
0.17
V
Dropout Voltage for VR4 (Note 1)
VCC−VOUT4
11
−
0.17
0.30
V
Load Regulation (TA = 25°C)
Regload(1−5)
9, 11, 12,
13, 14
−
−
0.5
mV/mA
V
MAX POWER DISSIPATION AND TOTAL DC OUTPUT CURRENT (VR1 + VR2 + VR3 + VR4 + VR5) (Note 2)
Max Power Dissipation at VCC = 5.3 V (TA = 85°C)
Max. Total RMS Output Current at VCC = 5.3 V (TA = 85°C)
Pdmax
IRMS
−
−
−
−
−
285
130
mW
mA
Max Power Dissipation at VCC = 5.3 V (TA = 25°C)
Max. Total RMS Output Current at VCC = 5.3 V (TA = 25°C)
Pdmax
IRMS
−
−
−
−
−
700
250
mW
mA
1. Typical dropout voltages have been measured at currents: Output1: 25 mA, Output2: 35 mA, Output3: 40 mA, Output4: 140 mA, Output5: 40 mA
Maximum value of dropout voltages are measured at maximum specified current.
2. See package power dissipation and thermal protection.
http://onsemi.com
3
MC33765
REGULATOR ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS (For typical values TA = 25°C, for min/max values TA = −40°C to +85°C/ Max TJ = 125°C)
Characteristics
Pin #
Symbol
Min
Typ
Max
Unit
Regulator VR1 Output Current
14
IOUT1
10
−
30
mA
Regulator VR2 Output Current
13
IOUT2
10
−
40
mA
Regulator VR3 Output Current
12
IOUT3
0
−
50
mA
Regulator VR4 Output Current
11
IOUT4
10
−
150
mA
OUTPUT CURRENTS (Note 3)
Regulator VR5 Output Current
9
IOUT5
10
−
60
mA
14, 13, 12,
11, 9
IMAX
−
2 X IOUT
(1−5)
−
mA
14, 13, 11, 9
C(1−2, 4−5)
0.10
−
1.0
mF
External Compensation Capacitors for VR3
12
C4
1.0
−
−
mF
External Compensation Capacitors ESR
−
−
0.05
1.0
3.0
W
50
60
−
dB
40
45
−
dB
50
60
−
dB
40
45
−
dB
18
22
−
dB
Current Limit for VR1, VR2, VR3, VR4, VR5
[Twice the max Output Current for each output]
EXTERNAL CAPACITORS
External Compensation Capacitors for VR1, VR2, VR4, VR5
RIPPLE REJECTIONS
Ripple Rejection VR1, VR2, VR4, VR5
(at Max. Current, 1.0 kHz, C = 100 nF)
14, 13, 11, 9
(DV
OUT
(DV
CC
Ripple Rejection VR1, VR2, VR4, VR5
(at Max. Current, f = 10 kHz, C = 100 nF)
)
14, 13, 11, 9 (DV
OUT
(DV
CC
Ripple Rejection of VR3
(at Max. Current, f = 1.0 kHz, C = 1.0 mF)
12
OUT
CC
Ripple Rejection of VR3
(at Max. Current, f = 10 kHz, C = 1.0 mF)
12
OUT
CC
Ripple Rejection of VR3
(at Max. Current, f = 100 kHz, C = 1.0 mF)
12
(DV
CC
)
)
OUT
(DV
)
)
(DV
(DV
)
)
(DV
(DV
)
)
)
DYNAMIC PARAMETERS
Rise Time (1% → 99%) Common Enable at ON state, Cbypass = 10 nF, Iout at max. current
VR1, VR2, VR4, VR5 with COUT = 100 nF, TA = 25°C
VR3 with COUT = 1.0 mF, TA = 25°C
ton
−
−
−
−
30
150
ms
ms
Fall Time (99% → 1%) [COUT = 100 nF, IOUT = 30 mA] (Note 4)
toff
−
100
−
ms
Overshoot (COUT = 100 nF for VR1, VR2, VR4, VR5 and COUT = 1.0 mF for VR3) at
TA = 25°C Common Enable at ON state, independent enable from OFF to ON state
−
−
5
8
%
Settling Time (to ±0.1% of nominal) at TA = 25°C
Common Enable at ON state, independent enable from OFF to ON state
−
−
95
−
ms
NOISE AND CROSSTALKS
Noise Voltage (100 Hz < f < 100 kHz) with Cbypass = 100 nF
VR1, VR2, VR4, VR5 with COUT = 100 nF; VR3 with COUT = 1.0 mF
−
−
−
40
25
−
30
mV RMS
Static crosstalk (DC shift) between the Regulator Output, TA = 25°C (Note 5)
−
−
150
200
mV
Dynamic CrossTalk Attenuation between the Regulator Outputs (f = 10 kHz),
TA = 25°C (Note 6)
−
30
35
−
dB
−
−
160
−
°C
THERMAL SHUTDOWN
Thermal Shutdown
3. Maximum Output Currents are peak values. Total DC current have to be set upon maximum power dissipation specification. Only Output
3 has been designed to be stable at minimum current of 0 mA.
4. The Fall time is highly dependent on the load conditions, i.e. load current for a specified value of COUT.
5. Static Crosstalk is a DC shift caused by switching ON one of the outputs through independent enable to all other outputs. This parameter
is highly dependent on overall PCB layout and requires the implementation of low−noise GROUND rules (e.g. Ground plane).
6. Dynamic crosstalk is the ratio between a forced output signal to signal transferred to other outputs. This requires special device configuration
to be measured.
http://onsemi.com
4
MC33765
MC33765 TYPICAL OSCILLOSCOPE SHOTS
X: 5ms/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C
Enable of
Out4
X: 100ms/div
Y1: 1V/div
Y2: 60mV/div
Vin = 4.0V
Ta = 23°C
Y1
Y1
CE
Out3
Y2
Y2
Vout5
Figure 1. Crosstalk response of MC33765 showing
extremely weak interaction between outputs
Output 4 is banged from 0 to 150mA
X: 500ms/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C
Figure 2. Repetitive Common Enable response time
Y1
CE
Out3
Y1
Vout5 Enable
Y2
Y2
Vout5
X: 5ms/div
Y1: 500mV/div
Y2: 500mV/div
Vin = 3.8V
Ta = 23°C
Figure 3. Single Common Enable response time
(Cbypass discharged)
Vout4
Figure 4. Output response from seperate Enable
Y1
Y1
Vout5
X: 500ms/div
Y1: 10mV/div
Vin = 3.8V
Ta = 23°C
X: 500ms/div
Y1: 10mV/div
Vin = 3.8V
Ta = 23°C
Figure 5. Output 4 is banged from 3mA to 150mA
Figure 6. Output 5 is banged from 3mA to 50mA
http://onsemi.com
5
MC33765
Vin
Vin
Y1
Y1
Y2
Vout2
Y2
Vout3
X: 200ms/div
Y1: 2V/div
Y2: 10mV/div
Vin = variable
Ta = 23°C
X: 200ms/div
Y1: 2V/div
Y2: 10mV/div
Vin = variable
Ta = 23°C
Figure 8. Typical input voltage rejection (Cout = 1mF)
160
8.0
140
7.0
GROUND CURRENT (mA)
DROPOUT VOLTAGE (mV)
Figure 7. Typical input voltage rejection (Cout = 100nF)
OUT5
120
100
OUT4
OUT3
OUT2
OUT1
80
60
40
20
OUT4
6.0
OUT2
5.0
4.0
OUT3
3.0
2.0
OUT1
OUT5
1.0
0
0
20
40
60
80
100
120
140
0
−60
160
−40
−20
OUTPUT CURRENT (mA)
400
40
60
80
100
160
350
140
DROPOUT VOLTAGE (mV)
MAXIMUM OUTPUT CURRENT (mA)
20
Figure 10. Ground Current versus Individual Output
Figure 9. Dropout Voltage versus Output Current
OUT4
300
250
OUT5
200
OUT3
150
100
0
TEMPERATURE (°C)
OUT2
120
100
30 mA
80
20 mA
60
10 mA
40
OUT1
50
0
−60
20
−40
−20
0
20
40
60
80
0
−60
100
TEMPERATURE (°C)
−40
−20
0
20
40
60
80
TEMPERATURE (°C)
Figure 11. Maximum Output Current versus Temperature
Figure 12. Dropout Voltage versus Operating
Temperature: OUT1
http://onsemi.com
6
100
160
160
140
140
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
MC33765
120
100
80
60
40
30 mA
20 mA
10 mA
20
120
100
50 mA
80
30 mA
60
40
10 mA
20
0
−60
−40
−20
0
20
40
60
80
0
−60
100
−40
−20
TEMPERATURE (°C)
0
20
40
60
80
100
TEMPERATURE (°C)
Figure 13. Dropout Voltage versus Operating
Temperature: OUT2
Figure 14. Dropout Voltage versus Operating
Temperature: OUT3
200
160
DROPOUT VOLTAGE (mV)
DROPOUT VOLTAGE (mV)
140
150
150 mA
100
100 mA
60 mA
50
10 mA
120
100
60 mA
80
35 mA
60
40
10 mA
20
0
−60
−40
−20
0
20
40
60
80
0
−60
100
TEMPERATURE (°C)
−40
−20
0
20
40
60
80
TEMPERATURE (°C)
Figure 15. Dropout Voltage versus Operating
Temperature: OUT4
Figure 16. Dropout Voltage versus Operating
Temperature: OUT5
http://onsemi.com
7
100
MC33765
DEFINITIONS
Load Regulation − The change in output voltage for a
change in load current at constant chip temperature.
Dropout Voltage − The input/output differential at which
the regulator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100 mV below its nominal value (which is
measured at 1.0 V differential input/output), dropout voltage
is affected by junction temperature, load current and
minimum input supply requirements.
Output Noise Voltage − The RMS AC voltage at the
output with a constant load and no input ripple, measured
over a specified frequency range.
As the device can be switched ON/OFF through
independent Enable (ON/OFF pin) or Common Enable, the
output signal could be, for example, a square wave. Let’s
assume that the device is ON during TON on a signal period
T. The RMS current will be given by:
I
out
RMS
+I
P
ǸD
T
D + ON
T
where
Ton
MC33765 Output noise performances
Ip
300
Vin = 3.6V
Iout = typical
Cbyp = 10nF
250
nV/sqrt(Hz)
200
T, period
150
OUT1, 2, 3, 4, 5
100
Depending on ambient temperature, it is possible to
calculate the maximum power dissipation and so the
maximum RMS current as following:
OUT3
50
T –T
Pd + J A
R
qJA
0
10
100
1000
10000
100000
1000000
Frequency (Hz)
The maximum operating junction temperature TJ is
specified at 125°C, if TA = 25°C, then PD = 700 mW. By
neglecting the quiescent current, the maximum power
dissipation can be expressed as:
Maximum Power Dissipation − The maximum total
dissipation for which the regulator will operate within
specifications.
Quiescent Current − Current which is used to operate the
regulator chip with no load current.
Line Regulation − The change in input voltage for a
change in the input voltage. The measurement is made under
conditions of low dissipation or by using pulse techniques
such that the average chip temperature is not significantly
affected.
Thermal Protection − Internal thermal shutdown
circuitry is provided to protect the integrated circuit in the
event that the maximum junction temperature is exceeded.
When activated, typically 160°C, the regulator turns off.
This feature is provided to prevent catastrophic failures from
accidental overheating.
Maximum Package Power Dissipation and RMS
Current − The maximum package power dissipation is the
power dissipation level at which the junction temperature
reaches its maximum value i.e. 125°C. The junction
temperature is rising while the difference between the input
power (VCC X ICC) and the output power (Vout X Iout) is
increasing.
As MC33765 device exhibits five independent outputs
Iout is specified as the maximum RMS current combination
of the five output currents.
I out +
P
D
V – Vout
CC
So that in the more drastic conditions:
VCC = 5.3 V, Vout = 2.7 V then the maximum RMS value of
Iout is 269 mA.
The maximum power dissipation supported by the device
is a lot increased when using appropriate application design.
Mounting pad configuration on the PCB, the board material
and also the ambient temperature are affected the rate of
temperature rise. It means that when the IC has good thermal
conductivity through PCB, the junction temperature will be
“low” even if the power dissipation is great.
The thermal resistance of the whole circuit can be
evaluated by deliberately activating the thermal shutdown
of the circuit (by increasing the output current or raising the
input voltage for example).
Then you can calculate the power dissipation by subtracting
the output power from the input power. All variables are then
well known: power dissipation, thermal shutdown temperature
(160°C for MC33765) and ambient temperature.
R
http://onsemi.com
8
qJA
T –T
+ J A
P
D
MC33765
DESIGN HINTS
Reducing the cross−talk between the MC33765 outputs
One of the origin of the DC shift finds its seat in the layout
surrounding the integrated circuit. Particular care has to be
taken when routing the output ground paths. Star grounding
or a ground plane are the absolute conditions to reduce the
noise or shift associated to common impedance situations,
as depicted by Figure 17.
1
16
15
2
15
3
14
3
14
WRONG
MC33765
16
2
MC33765
1
13
4
12
5
11
6
7
10
7
10
8
9
8
9
4
5
6
CORRECT
13
12
11
Load1
Load1
Load2
Star cabling
Load2
common impedance shift
Rlayout
Figure 17. Star Cabling Avoids Coupling by Common Ground Impedance
The first left cabling will generate a voltage shift which will
superimpose on the output voltages, thus creating an
undesirable offset. By routing the return grounds to a single
low impedance point, you naturally shield the circuit against
common impedance disturbances. Figure 18 portraits the text
fixture implemented to test the response of the MC33765.
VCC
10nF
10k
1
16
2
15
3
14
4
5
10k
MC33765
10k
470nF
13
12
6
11
7
10
8
9
Output 3
+
56
1mF
Output 4
18
100nF
Figure 18. DC Shift Text Fixture
http://onsemi.com
9
MC33765
DESIGN HINTS (cont.)
Output 4 was banged from 0 to 150mA via its dedicated
control pin, while output 3 fixed at 50mA was monitored. The
circuit has been implemented on a PCB equipped with a
ground plane and routed with short copper traces. The results
are shown hereafter, revealing the excellent behavior of the
MC33765 when crosstalks outputs is at utmost importance.
Y1, output 3
Y1, output 3
Figure 20. Vin = 5V, Y1 = 1mV/div
Figure 19. Vin = 4V, Y1 = 62.5mV/div, F = 200Hz
http://onsemi.com
10
MC33765
TECHNICAL TERMS
Rise Time − Common Enable being in ON state, the
device is switched on by ON/OFF pin control.
Let’s call t1 the time when ON/OFF signal reaches 1% of its
nominal value.
Overshoot, Settling Time − As regulators are based on
regulation loop through an error amplifier, this type of
device requires a certain time to stabilize and reach its
nominal value.
The overshoot is defined as the voltage difference
between the peak voltage and steady state when switching
ON the regulator.
The settling time is equal to the time required by the
regulator to stabilize to its nominal value (±0.5%) after peak
value when switching ON the regulator.
Let’s call t2 the time when output signal reaches 99% of its
nominal value.
The rise time for this device is specified as:
t
ON
+ t1 * t2
Fall Time − The fall time is highly dependent on the
output capacitor and so device design is not impacting at all
this parameter.
Settling Time
Rise Time
Overshoot
Output Voltage
Vnom
99%
ON
Chip Enable is ON
ON/OFF pin signal
OFF
1%
http://onsemi.com
11
MC33765
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE A
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
K
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
DETAIL E
G
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
12
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MC33765/D