EDI8F32512C 512Kx32 Static RAM CMOS, High Speed Module FEATURES DESCRIPTION 512Kx32 bit CMOS Static Random Access Memory The EDI8F32512C is a high speed 16 megabit Static RAM module organized as 512K words by 32 bits. This module is constructed from four 512Kx8 Static RAMs in SOJ packages on an epoxy laminate (FR4) board. Access Times: 15, 20, and 25ns Individual Byte Selects Fully Static, No Clocks TTL Compatible I/O Four chip enables (EØ-E3) are used to independently enable the four bytes. Reading or writing can be executed on individual bytes or any combination of multiple bytes through proper use of selects. High Density Package 72 Pin ZIP, No. 173 72 lead SIMM, No. 174 (Gold Option) Common Data Inputs and Outputs The EDI8F32512C is offered in 72 pin ZIP and 72 lead SIMM packages, which enable 16 megabits of memory to be placed in less than 1.3 square inches of board space. All inputs and outputs are TTL compatible and operate from a single 5V supply. Fully asynchronous circuitry requires no clocks or refreshing for operation and provides equal access and cycle times for ease of use. Single +5V (±10%) Supply Operation Note: Consult factory for availability of: • RoHS compliant products • Vendor source control options • Industrial temperature option Pins PD1- PD4, are used to identify module memory density in applications where alternate modules can be interchanged. FIG. 1 Pin Names A0-A18 E0#-E3# W# G# DQ0-DQ31 Pin Configurations and Block Diagram NC PD3 PD0 DQ0 DQ1 DQ2 DQ3 VCC A7 A8 A9 DQ4 DQ5 DQ6 DQ7 W# A14 E0# 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 E2# A16 VSS DQ16 DQ17 DQ18 DQ19 A10 A11 A12 A13 DQ20 DQ21 DQ22 DQ23 VSS NC NC 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 NC PD2 VSS PD1 DQ8 DQ9 DQ10 DQ11 A0 A1 A2 DQ12 DQ13 DQ14 DQ15 VSS A15 E1# 37 39 41 43 45 47 49 51 53 55 57 59 61 63 65 67 69 71 E3# A17 G# DQ24 DQ25 DQ26 DQ27 A3 A4 A5 VCC A6 DQ28 DQ29 DQ30 DQ31 A18 NC VCC VSS NC Address Inputs Chip Enables Write Enable Output Enable Common Data Input/Output Power (+5V±10%) Ground No Connectiona A0-A18 W# G# 512K X 8 DQ0-DQ7 512K X 8 DQ8-DQ15 512K X 8 DQ16-DQ23 512K X 8 DQ24-DQ31 E0# E1# E2# PD0, PD1, PD3= OPEN PD2= VSS E3# 8G32512C Pin Config. 8G32512C Blk Dia. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C ABSOLUTE MAXIMUM RATINGS* Voltage on any pin relative to VSS Operating Temperature TA (Ambient) Commercial Industrial Storage Temperature, Plastic Power Dissipation Output Current RECOMMENDED DC OPERATING CONDITIONS -0.5V to 7.0V Parameter Supply Voltage Supply Voltage Input High Voltage Input Low Voltage 0°C to +70°C -40°C to +85°C -55°C to +125°C 5.0 Watts 20 mA *Stress greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Sym VCC VSS VIH VIL Min 4.5 0 2.2 -0.3 Typ 5.0 0 --- Max 5.5 0 6.0 0.8 Units V V V V AC TEST CONDITIONS Input Pulse Levels Input Rise and Fall Times Input and Output Timing Levels Output Load VSS to 3.0V 5ns 1.5V 1TTL, CL = 30pF (Note: For TEHQZ,TGHQZ and TWLQZ, CL = 5pF) DC ELECTRICAL CHARACTERISTICS Parameter Sym ICC1 ICC2 ICC3 Operating Power Supply Current Standby (TTL) Power Supply Current Full Standby Power Supply Current CMOS Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage ILI ILO VOH VOL Conditions W#, E# = VIL, II/O = 0mA, Min Cycle E > VIH, VIN > VIL or VIN > VIH E > VCC-0.2V VIN > VCC=0.2V or VIN > 0.2V VIN = 0V to VCC V I/O = 0V TO VCC IOH = -4.0mA IOL = 8.0mA Min Typ* Max 800 300 80 Units mA mA mA --2.4 -- ----- ±20 ±20 -0.4 µA µA V V *Typical: TA = 25°C, VCC = 5.0V CAPACITANCE TRUTH TABLE E# H L L L W# X H L H G# X L X H Mode Standby Read Write Output Deselect Output HIGH Z DOUT DIN HIGH Z (f=1.0MHz, VIN=VCC or VSS) Parameter Address Lines Data Lines Chip Enable Line Write Line Power ICC2/ICC3 ICC1 ICC1 ICC1 Sym CI CD/Q CC CN Max 45 20 20 45 Unit pF pF pF pF These parameters are sampled, not 100% tested. White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C AC CHARACTERISTICS READ CYCLE Symbol Parameter JEDEC tAVAV tAVQV tELQV tELQX tEHQZ tAVQX tGLQV tGLQX tGHQZ Read Cycle Time Address Access Time Chip Enable Access Chip Enable to Output in Low Z (1) Chip Disable to Output in High Z (1) Output Hold from Address Change Output Enable to Output Valid Output Enable to Output in Low Z (1) Output Disable to Output in High (1) 15ns Alt. TRA TAA TACS TCLZ TCHZ TOH TOE TOLZ TOHZ Min 15 20ns Max Min 20 15 15 25ns Max Min 25 20 20 3 3 25 25 3 6 10 3 3 12 3 6 8 0 Max 0 10 0 620 8 10 Units ns ns ns ns ns ns ns ns ns Notes: 1. Parameter guaranteed, but not tested. FIG. 2 READ CYCLE 1 - W# HIGH, G#, E# LOW tAVAV A E# tELWH tWHAX tAVWH tWLWH W# tAVWL tDVWH D tWHDX DATA VALID tWHQX tWLQZ HIGH Z Q 8F32512C Write Cyc1 FIG. 3 READ CYCLE 2 - W# HIGH tAVAV A tAVQV E# tELQV tEHQZ tELQX G# tGLQV tGHQZ tGLQX Q 8F32512C Rd Cyc2 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C AC CHARACTERISTICS WRITE CYCLE Symbol Parameter JEDEC tAVAV tELWH tWLEH tAVWL tAVEL tAVWH tAHEH tWLWH tELEH tWHAX tEHAX tWHDX tEHDX tWLQZ tDVWH tDVEH tWHQX Write Cycle Time Chip Enable to End of Write Address Setup Time Address Valid to End of Write Write Pulse Width Write Recovery Time Data Hold Time Write to Output in High Z (1) Data to Write Time Output Active from End of Write (1) 15ns Alt. TWC TCW TCW TAS TAS TAW TAW TWP TWP TWR TWR TDH TDH TWHZ TDW TDW TWLZ Min 15 8 8 0 0 8 8 10 10 0 0 0 0 0 7 7 3 20ns Max Min 20 15 15 0 0 15 15 15 15 0 0 0 0 0 9 9 3 6 25ns Max 8 Min 25 20 20 0 0 15 15 15 15 0 0 0 0 0 10 10 3 Max 12 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Notes: 1. Parameter guaranteed, but not tested. FIG. 4 WRITE CYCLE 1 - W# CONTROLLED tAVAV A E# tELWH tWHAX tAVWH tWLWH W# tAVWL tDVWH D tWHDX DATA VALID tWHQX tWLQZ HIGH Z Q 8F32512C Write Cyc1 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C FIG. 5 WRITE CYCLE 2 - E# CONTROLLED tAVAV A tAVEL tELEH E# tAVEH tEHAX tWLEH W# tDVEH D tEHDX DATA VALID HIGH Z Q 8F32512C Write Cyc2 White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C ORDERING INFORMATION Part Number Speed (ns) 15 20 25 EDI8F32512C15MMC EDI8F32512C20MMC EDI8F32512C25MMC Package No. 174 174 174 Part Number EDI8F32512C15MZC EDI8F32512C20MZC EDI8F32512C25MZC Speed (ns) 15 20 25 Package No. 173 173 173 NOTES: • Consult Factory for availability of RoHS compliant products. (indicated with "G" at the end of the part number) • Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to be replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others) • Consult factory for availability of industrial temperature (-40°C to 85°C) option • To order gold SIMM option, change from "EDI8F" to "EDI8G". PACKAGE DESCRPTION PACKAGE NO. 173: 72 PIN ZIP .032 E NOT R .060 MAX. RN FO D E D EN COMM .022 .018 S IGN S E D EW 3.865 MAX. .032 0.600 MAX. .100 TYP. .100 TYP. .050 TYP. .273 MAX. PACKAGE NO. 174: 72 LEAD SIMM .125 DIA. TYP. (2 PLCS.) 4.255 MAX. 3.984 .213 MAX. 1.992 .625 MAX. .250 P1 .050 TYP. R.062 .250 R.062 2.045 .400 .125 MIN. 3.730 ALL DIMENSIONS ARE IN INCHES White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C PART NUMBERING GUIDE EDI 8 F 32 512 C 20 MM C -G PREFIX PRODUCT GROUP 8 = SRAM SUBSTRATE F = FR4 with Tin Lead Contacts G = FR4 with Gold Contacts DATA BUS WIDTH 32 = 32 Bit DENSITY 512 = 512K TECHNOLOGY C = CMOS (5.0V) SPEED 15 = 15ns 20 = 20ns 25 = 25ns PACKAGE MM = Straight SIMM MZ = ZIP TEMPERATURE RANGE C = Commercial 0°C to +70°C I = Industrial -40°C to +85°C G = RoHS COMPLIANT White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com EDI8F32512C Document Title 512Kx32 Static Ram CMOS, High Speed Module Revision History Rev # Rev 9 History Release Date Status 9.1 Added RoHS compliance option March 2006 Final 9.2 Offer vendor source control 9.3 Provide industrial temperature option 9.4 Added part number guide 9.5 Added document title page White Electronic Designs Corp. reserves the right to change products or specifications without notice. March 2006 Rev. 9 8 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com