CY7C1370D CY7C1372D 18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL™ Architecture Features Functional Description • Pin-compatible and functionally equivalent to ZBT™ • Supports 250-MHz bus operations with zero wait states — Available speed grades are 250, 200 and 167 MHz • Internally self-timed output buffer control to eliminate the need to use asynchronous OE • Fully registered (inputs and outputs) for pipelined operation • Byte Write capability • 3.3V core power supply (VDD) • 3.3V/2.5V I/O power supply(VDDQ) • Fast clock-to-output times — 2.6 ns (for 250-MHz device) • Clock Enable (CEN) pin to suspend operation • Synchronous self-timed writes • Available in JEDEC-standard lead-free 100-pin TQFP, lead-free and non-lead-free 119-Ball BGA and 165-Ball FBGA package • IEEE 1149.1 JTAG-Compatible Boundary Scan • Burst capability—linear or interleaved burst order • “ZZ” Sleep Mode option and Stop Clock option The CY7C1370D and CY7C1372D are 3.3V, 512K x 36 and 1M x 18 Synchronous pipelined burst SRAMs with No Bus Latency™ (NoBL™) logic, respectively. They are designed to support unlimited true back-to-back Read/Write operations with no wait states. The CY7C1370D and CY7C1372D are equipped with the advanced (NoBL) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data in systems that require frequent Write/Read transitions. The CY7C1370D and CY7C1372D are pin compatible and functionally equivalent to ZBT devices. All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Write operations are controlled by the Byte Write Selects (BWa–BWd for CY7C1370D and BWa–BWb for CY7C1372D) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry. Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. In order to avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence. Logic Block Diagram-CY7C1370D (512K x 36) A0, A1, A ADDRESS REGISTER 0 A1 A1' D1 Q1 A0 A0' BURST D0 Q0 LOGIC MODE CLK CEN ADV/LD C C WRITE ADDRESS REGISTER 1 WRITE ADDRESS REGISTER 2 S E N S E ADV/LD BWa BWb BWc BWd WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC WRITE DRIVERS MEMORY ARRAY A M P S WE O U T P U T R E G I S T E R S E INPUT REGISTER 1 OE CE1 CE2 CE3 ZZ Cypress Semiconductor Corporation Document #: 38-05555 Rev. *F E O U T P U T D A T A S T E E R I N G INPUT REGISTER 0 B U F F E R S DQs DQPa DQPb DQPc DQPd E E READ LOGIC SLEEP CONTROL • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised June 28, 2006 CY7C1370D CY7C1372D Logic Block Diagram-CY7C1372D (1M x 18) ADDRESS REGISTER 0 A0, A1, A A1 A1' D1 Q1 A0 A0' BURST D0 Q0 LOGIC MODE CLK CEN ADV/LD C C WRITE ADDRESS REGISTER 1 WRITE ADDRESS REGISTER 2 ADV/LD BWa WRITE REGISTRY AND DATA COHERENCY CONTROL LOGIC WRITE DRIVERS MEMORY ARRAY BWb WE S E N S E A M P S O U T P U T R E G I S T E R S D A T A S T E E R I N G E INPUT REGISTER 1 E OE CE1 CE2 CE3 ZZ O U T P U T B U F F E R S DQs DQPa DQPb E INPUT REGISTER 0 E READ LOGIC Sleep Control Selection Guide Maximum Access Time Maximum Operating Current Maximum CMOS Standby Current Document #: 38-05555 Rev. *F 250 MHz 200 MHz 167 MHz Unit 2.6 350 70 3.0 300 70 3.4 275 70 ns mA mA Page 2 of 28 CY7C1370D CY7C1372D Pin Configurations 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 CY7C1372D (1M × 18) 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A NC NC VDDQ VSS NC DQPa DQa DQa VSS VDDQ DQa DQa VSS NC VDD ZZ DQa DQa VDDQ VSS DQa DQa NC NC VSS VDDQ NC NC NC A A A A A A A DQb DQb DQb DQb VSS VDDQ DQb DQb DQb DQb NC VSS VDD NC NC VDD VSS ZZ DQb DQa DQa DQb VDDQ VDDQ VSS VSS DQa DQb DQa DQb DQa DQPb NC DQa VSS VSS VDDQ VDDQ NC DQa DQa NC DQPa NC NC(36) VDDQ VSS NC NC DQb DQb VSS VDDQ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 NC(72) NC NC NC VSS VDD A A A A A A A NC(72) NC(36) VSS VDD NC(288) NC(144) MODE A A A A A1 A0 Document #: 38-05555 Rev. *F DQPb DQb DQb VDDQ VSS NC(288) NC(144) CY7C1370D (512K × 36) 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 DQc DQc NC VDD NC VSS DQd DQd VDDQ VSS DQd DQd DQd DQd VSS VDDQ DQd DQd DQPd 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VSS DQc DQc DQc DQc VSS VDDQ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 MODE A A A A A1 A0 DQPc DQc DQc VDDQ A A A A CE1 CE2 NC NC BWb BWa CE3 VDD VSS CLK WE CEN OE ADV/LD A A A A 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE1 CE2 BWd BWc BWb BWa CE3 VDD VSS CLK WE CEN OE ADV/LD A A 100-pin TQFP Pinout Page 3 of 28 CY7C1370D CY7C1372D Pin Configurations (continued) 119-Ball BGA Pinout CY7C1370D (512K x 36) 1 2 3 4 5 6 7 A VDDQ A A A A A VDDQ B C D E F G H J K L M N P NC/576M NC/1G DQc CE2 A DQPc A A VSS ADV/LD VDD NC A A VSS CE3 A DQPb NC NC DQb R T U DQc DQc VSS CE1 VSS DQb DQb VDDQ DQc VSS VSS DQb VDDQ DQc DQc BWb DQb DQb DQc VDDQ DQc VDD BWc VSS NC OE A WE VDD VSS NC DQb VDD DQb VDDQ DQd DQd DQd DQd VSS BWd CLK NC DQa DQa VDDQ DQd VSS DQd DQd DQd BWa DQa DQa VSS DQa VDDQ VSS CEN A1 VSS DQa DQa DQPd VSS A0 VSS DQPa DQa NC/144M A MODE VDD NC/288M NC NC/72M A A NC A A NC/36M ZZ VDDQ TMS TDI TCK TDO NC VDDQ VSS CY7C1372D (1M x 18) A B C D E F G H J K L M N P R T U Document #: 38-05555 Rev. *F 1 2 3 4 5 6 7 VDDQ A A A A A VDDQ NC/576M CE2 A A A ADV/LD VDD A NC/1G A CE3 A NC DQb NC VSS NC VSS DQPa NC NC NC DQb VSS CE1 VSS NC DQa VDDQ NC VSS VSS DQa VDDQ NC DQb VDDQ DQb NC VDD BWb VSS NC OE A WE VDD NC VSS NC NC DQa VDD DQa NC VDDQ VSS NC DQa BWa VSS DQa NC NC VDDQ NC DQb VSS CLK DQb NC NC NC VDDQ DQb VSS DQb NC VSS CEN A1 VSS DQa NC NC DQPb VSS A0 VSS NC DQa NC/144M A MODE VDD NC A NC/288M NC/72M A A NC/36M A A ZZ VDDQ TMS TDI TCK TDO NC VDDQ Page 4 of 28 CY7C1370D CY7C1372D Pin Configurations (continued) 165-Ball FBGA Pinout CY7C1370D (512K x 36) 1 2 3 4 5 6 7 8 9 10 A B C D E F G H J K L M N P NC/576M NC/1G A CE1 BWc A CE2 DQPc DQc NC DQc VDDQ DQc BWb CE3 A A NC BWa VSS OE A A NC VSS VSS VSS VSS VSS VSS VDD VDDQ VDDQ BWd VSS VDD CEN WE ADV/LD CLK VDDQ NC DQb DQPb DQb DQc VDDQ VDD VSS VSS VSS VDD VDDQ DQb DQb DQc DQc VDDQ VDD VSS VSS VSS VDD VDDQ DQb DQb DQc NC DQd DQc NC DQd VDDQ NC VDDQ VDD VDD VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD VDD VDD VDDQ NC VDDQ DQb NC DQa DQb ZZ DQa DQd DQd VDDQ VDD VSS VSS VSS VDD VDDQ DQa DQa DQd DQd VDDQ VDD VSS VSS VSS VDD VDDQ DQa DQa DQd DQPd DQd NC VDDQ VDDQ VDD VSS VSS NC VSS NC VSS NC VDD VSS VDDQ VDDQ DQa NC DQa DQPa A A TDI A1 TDO A A A NC/288M R MODE A A TMS A0 TCK A A A A 6 7 8 9 10 11 CEN ADV/LD A A A A A NC NC/144M NC/72M NC/36M 11 CY7C1372D (1M x 18) A B C D E F G H J K L M N P R 1 2 3 4 NC/576M NC/1G A CE1 BWb NC CE3 A CE2 NC BWa CLK NC NC NC DQb VDDQ VSS VSS VSS VSS WE VSS VSS OE VSS VDD VDDQ VDDQ VSS VDD VDDQ NC NC DQPa DQa NC DQb VDDQ VDD VSS VSS VSS VDD VDDQ NC DQa NC DQb VDDQ VDD VSS VSS VSS VDD VDDQ NC DQa NC NC DQb DQb NC NC VDDQ NC VDDQ VDD VDD VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD VDD VDD VDDQ NC VDDQ NC NC DQa DQa ZZ NC DQb NC VDDQ VDD VSS VSS VSS VDD VDDQ DQa NC DQb NC VDDQ VDD VSS VSS VSS VDD VDDQ DQa NC DQb DQPb NC NC VDDQ VDDQ VDD VSS VSS NC VSS NC VSS NC VDD VSS VDDQ VDDQ DQa NC NC NC NC/144M NC/72M A A TDI A1 TDO A A A NC/36M A A TMS A0 TCK A A A MODE Document #: 38-05555 Rev. *F 5 NC/288M A Page 5 of 28 CY7C1370D CY7C1372D Pin Definitions Pin Name I/O Type Pin Description A0 A1 A InputAddress Inputs used to select one of the address locations. Sampled at the rising edge of Synchronous the CLK. BWa BWb BWc BWd InputByte Write Select Inputs, active LOW. Qualified with WE to conduct writes to the SRAM. Synchronous Sampled on the rising edge of CLK. BWa controls DQa and DQPa, BWb controls DQb and DQPb, BWc controls DQc and DQPc, BWd controls DQd and DQPd. WE InputWrite Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This Synchronous signal must be asserted LOW to initiate a write sequence. ADV/LD InputAdvance/Load Input used to advance the on-chip address counter or load a new address. Synchronous When HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new address can be loaded into the device for an access. After being deselected, ADV/LD should be driven LOW in order to load a new address. CLK InputClock Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK is only recognized if CEN is active LOW. CE1 InputChip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with Synchronous CE2 and CE3 to select/deselect the device. CE2 InputChip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction Synchronous with CE1 and CE3 to select/deselect the device. CE3 InputChip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with Synchronous CE1 and CE2 to select/deselect the device. OE InputOutput Enable, active LOW. Combined with the synchronous logic block inside the device to Asynchronous control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE is masked during the data portion of a write sequence, during the first clock when emerging from a deselected state and when the device has been deselected. CEN InputClock Enable Input, active LOW. When asserted LOW the clock signal is recognized by the Synchronous SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN does not deselect the device, CEN can be used to extend the previous cycle when required. DQS I/OBidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered Synchronous by the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by A[17:0] during the previous clock rise of the read cycle. The direction of the pins is controlled by OE and the internal control logic. When OE is asserted LOW, the pins can behave as outputs. When HIGH, DQa–DQd are placed in a tri-state condition. The outputs are automatically tri-stated during the data portion of a write sequence, during the first clock when emerging from a deselected state, and when the device is deselected, regardless of the state of OE. DQPX I/OBidirectional Data Parity I/O lines. Functionally, these signals are identical to DQs. During write Synchronous sequences, DQPa is controlled by BWa, DQPb is controlled by BWb, DQPc is controlled by BWc, and DQPd is controlled by BWd. MODE Input Strap Pin Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst order. Pulled LOW selects the linear burst order. MODE should not change states during operation. When left floating MODE will default HIGH, to an interleaved burst order. TDO JTAG serial Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. output Synchronous TDI JTAG serial Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK. input Synchronous TMS Test Mode This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK. Select Synchronous TCK JTAG-Clock Clock input to the JTAG circuitry. VDD Power Supply Power supply inputs to the core of the device. Document #: 38-05555 Rev. *F Page 6 of 28 CY7C1370D CY7C1372D Pin Definitions (continued) Pin Name VDDQ VSS NC NC/(36M,72M, 144M, 288M, 576M, 1G) ZZ I/O Type I/O Power Supply Ground – – Pin Description Power supply for the I/O circuitry. Ground for the device. Should be connected to ground of the system. No connects. This pin is not connected to the die. These pins are not connected. They will be used for expansion to the 36M, 72M, 144M, 288M, 576M and 1G densities. InputZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition Asynchronous with data integrity preserved. During normal operation, this pin can be connected to VSS or left floating. ZZ pin has an internal pull-down. Introduction Functional Overview The CY7C1370D and CY7C1372D are synchronous-pipelined Burst NoBL SRAMs designed specifically to eliminate wait states during Write/Read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. All data outputs pass through output registers controlled by the rising edge of the clock. Maximum access delay from the clock rise (tCO) is 2.6 ns (250-MHz device). Accesses can be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If Clock Enable (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device will be latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). BWX can be used to conduct byte write operations. Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self-timed write circuitry. Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (Reads, Writes, and Deselects) are pipelined. ADV/LD should be driven LOW once the device has been deselected in order to load a new address for the next operation. Single Read Accesses A read access is initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, (3) the Write Enable input signal WE is deasserted HIGH, and (4) ADV/LD is asserted LOW. The address presented to the address inputs is latched into the Address Register and presented to the memory core and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the input of the output register. At the rising edge of the next clock the requested data is allowed to propagate through the output register and onto the data bus within 2.6 ns (250-MHz device) provided OE is active LOW. After the first clock of the read access the output buffers are controlled by OE and the internal control logic. OE must be driven LOW in order for the device to drive out the requested data. During the Document #: 38-05555 Rev. *F second clock, a subsequent operation (Read/Write/Deselect) can be initiated. Deselecting the device is also pipelined. Therefore, when the SRAM is deselected at clock rise by one of the chip enable signals, its output will tri-state following the next clock rise. Burst Read Accesses The CY7C1370D and CY7C1372D have an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four Reads without reasserting the address inputs. ADV/LD must be driven LOW in order to load a new address into the SRAM, as described in the Single Read Access section above. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and will wrap-around when incremented sufficiently. A HIGH input on ADV/LD will increment the internal burst counter regardless of the state of chip enables inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (Read or Write) is maintained throughout the burst sequence. Single Write Accesses Write access are initiated when the following conditions are satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2, and CE3 are ALL asserted active, and (3) the write signal WE is asserted LOW. The address presented is loaded into the Address Register. The write signals are latched into the Control Logic block. On the subsequent clock rise the data lines are automatically tri-stated regardless of the state of the OE input signal. This allows the external logic to present the data on DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370D and DQa,b/DQPa,b for CY7C1372D). In addition, the address for the subsequent access (Read/Write/Deselect) is latched into the Address Register (provided the appropriate control signals are asserted). On the next clock rise the data presented to DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370D & DQa,b/DQPa,b for CY7C1372D) (or a subset for byte write operations, see Write Cycle Description table for details) inputs is latched into the device and the write is complete. The data written during the write operation is controlled by BW (BWa,b,c,d for CY7C1370D and BWa,b for CY7C1372D) signals. The CY7C1370D/CY7C1372D provides byte write capability that is described in the Write Cycle Description table. Page 7 of 28 CY7C1370D CY7C1372D Asserting the Write Enable input (WE) with the selected Byte Write Select (BW) input will selectively write to only the desired bytes. Bytes not selected during a byte write operation will remain unaltered. A synchronous self-timed write mechanism has been provided to simplify the write operations. Byte write capability has been included in order to greatly simplify Read/Modify/Write sequences, which can be reduced to simple byte write operations. Because the CY7C1370D and CY7C1372D are common I/O devices, data should not be driven into the device while the outputs are active. The Output Enable (OE) can be deasserted HIGH before presenting data to the DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370D and DQa,b/DQPa,b for CY7C1372D) inputs. Doing so will tri-state the output drivers. As a safety precaution, DQ and DQP (DQa,b,c,d/DQPa,b,c,d for CY7C1370D and DQa,b/DQPa,b for CY7C1372D) are automatically tri-stated during the data portion of a write cycle, regardless of the state of OE. Sleep Mode The ZZ input pin is an asynchronous input. Asserting ZZ places the SRAM in a power conservation “sleep” mode. Two clock cycles are required to enter into or exit from this “sleep” mode. While in this mode, data integrity is guaranteed. Accesses pending when entering the “sleep” mode are not considered valid nor is the completion of the operation guaranteed. The device must be deselected prior to entering the “sleep” mode. CE1, CE2, and CE3, must remain inactive for the duration of tZZREC after the ZZ input returns LOW. Interleaved Burst Address Table (MODE = Floating or VDD) Burst Write Accesses The CY7C1370D/CY7C1372D has an on-chip burst counter that allows the user the ability to supply a single address and conduct up to four write operations without reasserting the address inputs. ADV/LD must be driven LOW in order to load the initial address, as described in the Single Write Access section above. When ADV/LD is driven HIGH on the subsequent clock rise, the chip enables (CE1, CE2, and CE3) and WE inputs are ignored and the burst counter is incremented. The correct BW (BWa,b,c,d for CY7C1370D and BWa,b for CY7C1372D) inputs must be driven in each cycle of the burst write in order to write the correct bytes of data. First Address Second Address Third Address Fourth Address A1,A0 A1,A0 A1,A0 A1,A0 00 01 10 11 01 00 11 10 10 11 00 01 11 10 01 00 Linear Burst Address Table (MODE = GND) First Address Second Address Third Address Fourth Address A1,A0 A1,A0 A1,A0 A1,A0 00 01 10 11 01 10 11 00 10 11 00 01 11 00 01 10 ZZ Mode Electrical Characteristics Parameter Description IDDZZ Sleep mode standby current Test Conditions tZZS Device operation to ZZ ZZ > VDD − 0.2V tZZREC ZZ recovery time ZZ < 0.2V tZZI ZZ active to sleep current This parameter is sampled tRZZI ZZ Inactive to exit sleep current This parameter is sampled Document #: 38-05555 Rev. *F Min. ZZ > VDD − 0.2V Max. Unit 80 mA 2tCYC ns 2tCYC ns 2tCYC 0 ns ns Page 8 of 28 CY7C1370D CY7C1372D Truth Table[1, 2, 3, 4, 5, 6, 7] Operation Address Used CE ZZ ADV/LD WE BWx Deselect Cycle None H L L X X X OE L CEN L-H CLK Tri-State DQ Continue Deselect Cycle None X L H X X X L L-H Tri-State Read Cycle (Begin Burst) External L L L H X L L L-H Data Out (Q) Read Cycle (Continue Burst) Next X L H X X L L L-H Data Out (Q) NOP/Dummy Read (Begin Burst) External L L L H X H L L-H Tri-State Dummy Read (Continue Burst) Next X L H X X H L L-H Tri-State Write Cycle (Begin Burst) External L L L L L X L L-H Data In (D) Write Cycle (Continue Burst) Next X L H X L X L L-H Data In (D) NOP/Write Abort (Begin Burst) None L L L L H X L L-H Tri-State Write Abort (Continue Burst) Next X L H X H X L L-H Tri-State Ignore Clock Edge (Stall) Current X L X X X X H L-H – Sleep Mode None X H X X X X X X Tri-State Notes: 1. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip Enables active. BWx = L signifies at least one Byte Write Select is active, BWx = Valid signifies that the desired byte write selects are asserted, see Write Cycle Description table for details. 2. Write is defined by WE and BWX. See Write Cycle Description table for details. 3. When a write cycle is detected, all I/Os are tri-stated, even during byte writes. 4. The DQ and DQP pins are controlled by the current cycle and the OE signal. 5. CEN = H inserts wait states. 6. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE. 7. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles.During a read cycle DQs and DQPX = Three-state when OE is inactive or when the device is deselected, and DQs = data when OE is active. Document #: 38-05555 Rev. *F Page 9 of 28 CY7C1370D CY7C1372D Partial Write Cycle Description[1, 2, 3, 8] WE BWd BWc BWb BWa Read Function (CY7C1370D) H X X X X Write – No bytes written L H H H H Write Byte a – (DQa and DQPa) L H H H L Write Byte b – (DQb and DQPb) L H H L H Write Bytes b, a L H H L L Write Byte c – (DQc and DQPc) L H L H H Write Bytes c, a L H L H L Write Bytes c, b L H L L H Write Bytes c, b, a L H L L L Write Byte d – (DQd and DQPd) L L H H H Write Bytes d, a L L H H L Write Bytes d, b L L H L H Write Bytes d, b, a L L H L L Write Bytes d, c L L L H H Write Bytes d, c, a L L L H L Write Bytes d, c, b L L L L H Write All Bytes L L L L L Function (CY7C1372D) WE BWb BWa Read H x x Write – No Bytes Written L H H Write Byte a – (DQa and DQPa) L H L Write Byte b – (DQb and DQPb) L L H Write Both Bytes L L L Note: 8. Table only lists a partial listing of the byte write combinations. Any Combination of BWX is valid Appropriate write will be done based on which byte write is active. Document #: 38-05555 Rev. *F Page 10 of 28 CY7C1370D CY7C1372D IEEE 1149.1 Serial Boundary Scan (JTAG) Test Data-In (TDI) The CY7C1370D/CY7C1372D contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register. The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See Tap Controller Block Diagram.) Disabling the JTAG Feature Test Data-Out (TDO) It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are internally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device. The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See Tap Controller State Diagram.) The CY7C1370D/CY7C1372D incorporates a serial boundary scan test access port (TAP). This part is fully compliant with 1149.1. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels. TAP Controller Block Diagram 0 Bypass Register TAP Controller State Diagram 1 2 1 0 TDI TEST-LOGIC RESET Selection Circuitry 31 30 29 . . . 2 1 0 0 0 RUN-TEST/ IDLE Instruction Register 1 SELECT DR-SCAN 1 SELECT IR-SCAN 0 1 CAPTURE-DR 0 SHIFT-IR 1 0 TCK 1 EXIT1-DR 1 EXIT1-IR 0 1 TMS TAP CONTROLLER 0 PAUSE-DR 0 PAUSE-IR 1 0 Performing a TAP Reset 1 EXIT2-DR 0 EXIT2-IR 1 1 UPDATE-DR 1 Boundary Scan Register 0 SHIFT-DR 0 x . . . . . 2 1 0 CAPTURE-IR 0 TDO Identification Register 1 0 1 Selection Circuitry 0 UPDATE-IR 1 0 A Reset is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This Reset does not affect the operation of the SRAM and may be performed while the SRAM is operating. At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state. TAP Registers The 0/1 next to each state represents the value of TMS at the rising edge of TCK. Test Access Port (TAP) Test Clock (TCK) The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK. Test Mode Select (TMS) The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level. Document #: 38-05555 Rev. *F Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK. Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the Tap Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section. Page 11 of 28 CY7C1370D CY7C1372D When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board-level serial test data path. Bypass Register To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between the TDI and TDO balls. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed. the IDCODE to be shifted out of the device when the TAP controller enters the Shift-DR state. The IDCODE instruction is loaded into the instruction register upon power-up or whenever the TAP controller is given a test logic reset state. SAMPLE Z The SAMPLE Z instruction causes the boundary scan register to be connected between the TDI and TDO balls when the TAP controller is in a Shift-DR state. It also places all SRAM outputs into a High-Z state. Boundary Scan Register SAMPLE/PRELOAD The boundary scan register is connected to all the input and bidirectional balls on the SRAM. SAMPLE/PRELOAD is a 1149.1-mandatory instruction. When the SAMPLE/PRELOAD instructions are loaded into the instruction register and the TAP controller is in the Capture-DR state, a snapshot of data on the inputs and output pins is captured in the boundary scan register. The boundary scan register is loaded with the contents of the RAM I/O ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO balls when the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the I/O ring. The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI and the LSB is connected to TDO. Identification (ID) Register The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table. TAP Instruction Set Overview Eight different instructions are possible with the three bit instruction register. All combinations are listed in the Instruction Codes table. Three of these instructions are listed as RESERVED and should not be used. The other five instructions are described in detail below. Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO balls. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state. EXTEST The EXTEST instruction enables the preloaded data to be driven out through the system output pins. This instruction also selects the boundary scan register to be connected for serial access between the TDI and TDO in the shift-DR controller state. IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO balls and allows Document #: 38-05555 Rev. *F The user must be aware that the TAP controller clock can only operate at a frequency up to 20 MHz, while the SRAM clock operates more than an order of magnitude faster. Because there is a large difference in the clock frequencies, it is possible that during the Capture-DR state, an input or output will undergo a transition. The TAP may then try to capture a signal while in transition (metastable state). This will not harm the device, but there is no guarantee as to the value that will be captured. Repeatable results may not be possible. To guarantee that the boundary scan register will capture the correct value of a signal, the SRAM signal must be stabilized long enough to meet the TAP controller's capture set-up plus hold times (tCS and tCH). The SRAM clock input might not be captured correctly if there is no way in a design to stop (or slow) the clock during a SAMPLE/PRELOAD instruction. If this is an issue, it is still possible to capture all other signals and simply ignore the value of the CK and CK captured in the boundary scan register. Once the data is captured, it is possible to shift out the data by putting the TAP into the Shift-DR state. This places the boundary scan register between the TDI and TDO pins. PRELOAD allows an initial data pattern to be placed at the latched parallel outputs of the boundary scan register cells prior to the selection of another boundary scan test operation. The shifting of data for the SAMPLE and PRELOAD phases can occur concurrently when required—that is, while data captured is shifted out, the preloaded data can be shifted in. BYPASS When the BYPASS instruction is loaded in the instruction register and the TAP is placed in a Shift-DR state, the bypass register is placed between the TDI and TDO balls. The advantage of the BYPASS instruction is that it shortens the boundary scan path when multiple devices are connected together on a board. EXTEST Output Bus Tri-State IEEE Standard 1149.1 mandates that the TAP controller be able to put the output bus into a tri-state mode. The boundary scan register has a special bit located at bit #85 (for 119-BGA package) or bit #89 (for 165-FBGA package). When this scan cell, called the “extest output bus tri-state,” is latched into the preload register during the “Update-DR” state Page 12 of 28 CY7C1370D CY7C1372D in the TAP controller, it will directly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will enable the output buffers to drive the output bus. When LOW, this bit will place the output bus into a High-Z condition. register. When the EXTEST instruction is entered, this bit will directly control the output Q-bus pins. Note that this bit is preset HIGH to enable the output when the device is powered-up, and also when the TAP controller is in the “Test-Logic-Reset” state. This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the “Shift-DR” state. During “Update-DR,” the value loaded into that shift-register cell will latch into the preload Reserved These instructions are not implemented but are reserved for future use. Do not use these instructions. TAP Timing 1 2 3 Test Clock (TCK) t TH t TMSS t TMSH t TDIS t TDIH t TL 4 5 6 t CYC Test Mode Select (TMS) Test Data-In (TDI) t TDOV t TDOX Test Data-Out (TDO) DON’T CARE UNDEFINED TAP AC Switching Characteristics Over the Operating Range[9, 10] Parameter Description Min. Max. Unit Clock tTCYC TCK Clock Cycle Time tTF TCK Clock Frequency tTH TCK Clock HIGH time 20 ns tTL TCK Clock LOW time 20 ns 50 ns 20 MHz Output Times tTDOV TCK Clock LOW to TDO Valid tTDOX TCK Clock LOW to TDO Invalid 10 ns 0 ns Set-up Times tTMSS TMS Set-up to TCK Clock Rise 5 ns tTDIS TDI Set-up to TCK Clock Rise 5 ns tCS Capture Set-up to TCK Rise 5 ns tTMSH TMS Hold after TCK Clock Rise 5 ns tTDIH TDI Hold after Clock Rise 5 ns tCH Capture Hold after Clock Rise 5 ns Hold Times Notes: 9. tCS and tCH refer to the set-up and hold time requirements of latching data from the boundary scan register. 10. Test conditions are specified using the load in TAP AC test Conditions. tR/tF = 1 ns. Document #: 38-05555 Rev. *F Page 13 of 28 CY7C1370D CY7C1372D 3.3V TAP AC Test Conditions 2.5V TAP AC Test Conditions Input pulse levels ................................................ VSS to 3.3V Input pulse levels................................................. VSS to 2.5V Input rise and fall times ................................................... 1 ns Input rise and fall time .....................................................1 ns Input timing reference levels ...........................................1.5V Input timing reference levels......................................... 1.25V Output reference levels...................................................1.5V Output reference levels ................................................ 1.25V Test load termination supply voltage...............................1.5V Test load termination supply voltage ............................ 1.25V 3.3V TAP AC Output Load Equivalent 2.5V TAP AC Output Load Equivalent 1.5V 1.25V 50Ω 50Ω TDO TDO Z O= 50Ω Z O= 50Ω 20pF 20pF TAP DC Electrical Characteristics And Operating Conditions (0°C < TA < +70°C; VDD = 3.3V ±0.165V unless otherwise noted)[11] Parameter Description Test Conditions IOH = –4.0 mA, VDDQ = 3.3V Min. Max. Unit VOH1 Output HIGH Voltage 2.4 IOH = –1.0 mA, VDDQ = 2.5V 2.0 V VOH2 Output HIGH Voltage IOH = –100 µA VDDQ = 3.3V 2.9 V VDDQ = 2.5V 2.1 VOL1 Output LOW Voltage IOL = 8.0 mA, VDDQ = 3.3V 0.4 V IOL = 8.0 mA, VDDQ = 2.5V 0.4 V VOL2 Output LOW Voltage IOL = 100 µA 0.2 V VIH Input HIGH Voltage VDDQ = 3.3V VIL Input LOW Voltage VDDQ = 2.5V IX Input Load Current VDDQ = 3.3V VDDQ = 2.5V V V 0.2 V 2.0 VDD + 0.3 V VDDQ = 2.5V 1.7 VDD + 0.3 V VDDQ = 3.3V –0.5 0.7 V –0.3 0.7 V –5 5 µA GND < VIN < VDDQ Note: 11.All voltages referenced to VSS (GND). Document #: 38-05555 Rev. *F Page 14 of 28 CY7C1370D CY7C1372D Identification Register Definitions Instruction Field Revision Number (31:29) Cypress Device ID (28:12)[12] CY7C1372D CY7C1370D 000 000 01011001000100101 Description Reserved for version number. 01011001000010101 Reserved for future use. Cypress JEDEC ID (11:1) 00000110100 00000110100 ID Register Presence (0) 1 1 Allows unique identification of SRAM vendor. Indicate the presence of an ID register. Scan Register Sizes Register Name Bit Size (x18) Bit Size (x36) Instruction 3 3 Bypass 1 1 ID 32 32 Boundary Scan Order (119-ball BGA package) 85 85 Boundary Scan Order (165-ball FBGA package) 89 89 Identification Codes Instruction Code Description EXTEST 000 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. This operation does not affect SRAM operations. SAMPLE Z 010 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Forces all SRAM output drivers to a High-Z state. RESERVED 011 Do Not Use: This instruction is reserved for future use. SAMPLE/PRELOAD 100 Captures I/O ring contents. Places the boundary scan register between TDI and TDO. Does not affect SRAM operation. RESERVED 101 Do Not Use: This instruction is reserved for future use. RESERVED 110 Do Not Use: This instruction is reserved for future use. BYPASS 111 Places the bypass register between TDI and TDO. This operation does not affect SRAM operations. Note: 12. Bit #24 is “1” in the Register Definitions for both 2.5Vand 3.3V versions of this device. Document #: 38-05555 Rev. *F Page 15 of 28 CY7C1370D CY7C1372D 119-Ball BGA Boundary Scan Order [13, 14] Bit # Ball ID Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 H4 23 F6 45 G4 67 L1 2 T4 24 E7 46 A4 68 M2 3 T5 25 D7 47 G3 69 N1 4 T6 26 H7 48 C3 70 P1 5 R5 27 G6 49 B2 71 K1 6 L5 28 E6 50 B3 72 L2 7 R6 29 D6 51 A3 73 N2 8 U6 30 C7 52 C2 74 P2 9 R7 31 B7 53 A2 75 R3 10 T7 32 C6 54 B1 76 T1 11 P6 33 A6 55 C1 77 R1 12 N7 34 C5 56 D2 78 T2 13 M6 35 B5 57 E1 79 L3 14 L7 36 G5 58 F2 80 R2 15 K6 37 B6 59 G1 81 T3 16 P7 38 D4 60 H2 82 L4 17 N6 39 B4 61 D1 83 N4 18 L6 40 F4 62 E2 84 P4 19 K7 41 M4 63 G2 85 Internal 20 J5 42 A5 64 H1 21 H6 43 K4 65 J3 22 G7 44 E4 66 2K Notes: 13. Balls which are NC (No Connect) are pre-set LOW. 14. Bit# 85 is pre-set HIGH. Document #: 38-05555 Rev. *F Page 16 of 28 CY7C1370D CY7C1372D 165-Ball BGA Boundary Scan Order [13, 15] Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 N6 31 D10 61 G1 2 N7 32 C11 62 D2 3 N10 33 A11 63 E2 4 P11 34 B11 64 F2 5 P8 35 A10 65 G2 6 R8 36 B10 66 H1 7 R9 37 A9 67 H3 8 P9 38 B9 68 J1 9 P10 39 C10 69 K1 10 R10 40 A8 70 L1 11 R11 41 B8 71 M1 12 H11 42 A7 72 J2 13 N11 43 B7 73 K2 14 M11 44 B6 74 L2 15 L11 45 A6 75 M2 16 K11 46 B5 76 N1 17 J11 47 A5 77 N2 18 M10 48 A4 78 P1 19 L10 49 B4 79 R1 20 K10 50 B3 80 R2 21 J10 51 A3 81 P3 22 H9 52 A2 82 R3 23 H10 53 B2 83 P2 24 G11 54 C2 84 R4 25 F11 55 B1 85 P4 26 E11 56 A1 86 N5 27 D11 57 C1 87 P6 28 G10 58 D1 88 R6 29 F10 59 E1 89 Internal 30 E10 60 F1 Note: 15. Bit# 89 is pre-set HIGH. Document #: 38-05555 Rev. *F Page 17 of 28 CY7C1370D CY7C1372D Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. –65°C to +150°C Ambient Temperature with Power Applied............................................. –55°C to +125°C Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage.......................................... > 2001V (per MIL-STD-883, Method 3015) Latch-up Current.................................................... > 200 mA Operating Range Supply Voltage on VDD Relative to GND........ –0.5V to +4.6V Supply Voltage on VDDQ Relative to GND ...... –0.5V to +VDD Range DC to Outputs in Tri-State ................... –0.5V to VDDQ + 0.5V Commercial DC Input Voltage....................................–0.5V to VDD + 0.5V Industrial Electrical Characteristics Over the Operating Range Parameter Description VDD Power Supply Voltage VDDQ I/O Supply Voltage VOH VOL VIH VIL IX Output HIGH Voltage Output LOW Voltage Input HIGH Input LOW Voltage[16] Voltage[16] Input Leakage Current except ZZ and MODE Ambient Temperature VDD 0°C to +70°C 3.3V–5%/+10% 2.5V –5% to VDD –40°C to +85°C [16, 17] Test Conditions Min. Max. Unit 3.135 3.6 V for 3.3V I/O 3.135 VDD V for 2.5V I/O 2.375 2.625 V for 3.3V I/O, IOH = –4.0 mA 2.4 V for 2.5V I/O, IOH = –1.0 mA 2.0 V for 3.3V I/O, IOL = 8.0 mA 0.4 V for 2.5V I/O, IOL = 1.0 mA 0.4 V for 3.3V I/O 2.0 VDD + 0.3V V for 2.5V I/O 1.7 VDD + 0.3V V for 3.3V I/O –0.3 0.8 V for 2.5V I/O –0.3 0.7 V –5 5 µA GND ≤ VI ≤ VDDQ Input Current of MODE Input = VSS 5 Input = VSS 30 IOZ Output Leakage Current GND ≤ VI ≤ VDDQ, Output Disabled IDD VDD Operating Supply Automatic CE Power-down Current—TTL Inputs µA µA –5 Input = VDD ISB1 µA –30 Input = VDD Input Current of ZZ VDDQ µA 5 µA 4-ns cycle, 250 MHz 350 mA 5-ns cycle, 200 MHz 300 mA 6-ns cycle, 167 MHz 275 mA Max. VDD, Device Deselected, 4-ns cycle, 250 MHz VIN ≥ VIH or VIN ≤ VIL, f = fMAX = 5-ns cycle, 200 MHz 1/tCYC 6-ns cycle, 167 MHz 160 mA 150 mA VDD = Max., IOUT = 0 mA, f = fMAX = 1/tCYC –5 140 mA ISB2 Automatic CE Max. VDD, Device Deselected, All speed grades Power-down VIN ≤ 0.3V or VIN > VDDQ − 0.3V, Current—CMOS Inputs f = 0 70 mA ISB3 Automatic CE Max. VDD, Device Deselected, 4-ns cycle, 250 MHz Power-down VIN ≤ 0.3V or VIN > VDDQ − 0.3V, 5-ns cycle, 200 MHz Current—CMOS Inputs f = fMAX = 1/tCYC 6-ns cycle, 167 MHz 135 mA 130 mA 125 mA Automatic CE Power-down Current—TTL Inputs 80 mA ISB4 Max. VDD, Device Deselected, VIN ≥ VIH or VIN ≤ VIL, f = 0 All speed grades Notes: 16. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2). 17. TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD. Document #: 38-05555 Rev. *F Page 18 of 28 CY7C1370D CY7C1372D Capacitance[18] Parameter Test Conditions 100 TQFP Max. TA = 25°C, f = 1 MHz, VDD = 3.3V. VDDQ = 2.5V 5 8 9 pF 5 8 9 pF 5 8 9 pF 100 TQFP Package 119 BGA Package 165 FBGA Package Unit 28.66 23.8 20.7 °C/W 4.08 6.2 4.0 °C/W Description CIN Input Capacitance CCLK Clock Input Capacitance CI/O Input/Output Capacitance 119 BGA Max. 165 FBGA Max. Unit Thermal Resistance[18] Parameter Description ΘJA Thermal Resistance (Junction to Ambient) ΘJC Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51. AC Test Loads and Waveforms 3.3V I/O Test Load R = 317Ω 3.3V OUTPUT ALL INPUT PULSES VDDQ OUTPUT RL = 50Ω Z0 = 50Ω 10% 90% 10% 90% GND 5 pF R = 351Ω ≤ 1 ns ≤ 1 ns VT = 1.5V INCLUDING JIG AND SCOPE (a) (c) (b) 2.5V I/O Test Load R = 1667Ω 2.5V OUTPUT Z0 = 50Ω 10% R = 1538Ω VT = 1.25V INCLUDING JIG AND SCOPE 90% 10% 90% GND 5 pF (a) ALL INPUT PULSES VDDQ OUTPUT RL = 50Ω (b) ≤ 1 ns ≤ 1 ns (c) Note: 18. Tested initially and after any design or process change that may affect these parameters. Document #: 38-05555 Rev. *F Page 19 of 28 CY7C1370D CY7C1372D Switching Characteristics Over the Operating Range [23, 24] –250 –200 Parameter Description Min. [19] VCC (typical) to the first access read or write 1 1 1 ms 4.0 5 6 ns tPower Max. Min. –167 Max. Min. Max. Unit Clock tCYC Clock Cycle Time FMAX Maximum Operating Frequency tCH Clock HIGH 1.7 2.0 2.2 ns tCL Clock LOW 1.7 2.0 2.2 ns 250 200 167 MHz Output Times tCO Data Output Valid After CLK Rise tEOV OE LOW to Output Valid tDOH Data Output Hold After CLK Rise tCHZ Clock to High-Z[20, 21, 22] tCLZ Low-Z[20, 21, 22] Clock to 2.6 2.6 1.0 1.0 OE HIGH to Output tEOLZ OE LOW to Output Low-Z[20, 21, 22] 3.4 3.0 1.3 2.6 High-Z[20, 21, 22] tEOHZ 3.0 3.4 1.3 3.0 1.3 2.6 ns ns 3.4 1.3 3.0 ns ns ns 3.4 ns 0 0 0 ns Set-up Times tAS Address Set-up Before CLK Rise 1.2 1.4 1.5 ns tDS Data Input Set-up Before CLK Rise 1.2 1.4 1.5 ns tCENS CEN Set-up Before CLK Rise 1.2 1.4 1.5 ns tWES WE, BWx Set-up Before CLK Rise 1.2 1.4 1.5 ns tALS ADV/LD Set-up Before CLK Rise 1.2 1.4 1.5 ns tCES Chip Select Set-up 1.2 1.4 1.5 ns tAH Address Hold After CLK Rise 0.3 0.4 0.5 ns tDH Data Input Hold After CLK Rise 0.3 0.4 0.5 ns Hold Times tCENH CEN Hold After CLK Rise 0.3 0.4 0.5 ns tWEH WE, BWx Hold After CLK Rise 0.3 0.4 0.5 ns tALH ADV/LD Hold after CLK Rise 0.3 0.4 0.5 ns tCEH Chip Select Hold After CLK Rise 0.3 0.4 0.5 ns Notes: 19. This part has a voltage regulator internally; tPower is the time power needs to be supplied above VDD minimum initially, before a Read or Write operation can be initiated. 20. tCHZ, tCLZ, tEOLZ, and tEOHZ are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage. 21. At any given voltage and temperature, tEOHZ is less than tEOLZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions. 22. This parameter is sampled and not 100% tested. 23. Timing reference is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V. 24. Test conditions shown in (a) of AC Test Loads unless otherwise noted. Document #: 38-05555 Rev. *F Page 20 of 28 CY7C1370D CY7C1372D Switching Waveforms Read/Write/Timing[25, 26, 27] 1 2 3 t CYC 4 5 6 A3 A4 7 8 9 A5 A6 A7 10 CLK tCENS tCENH tCH tCL CEN tCES tCEH CE ADV/LD WE BWx A1 ADDRESS A2 tCO tAS tDS tAH Data In-Out (DQ) tDH D(A1) tCLZ D(A2) D(A2+1) tDOH Q(A3) tOEV Q(A4) tCHZ Q(A4+1) D(A5) Q(A6) tOEHZ tDOH tOELZ OE WRITE D(A1) WRITE D(A2) BURST WRITE D(A2+1) READ Q(A3) READ Q(A4) DON’T CARE BURST READ Q(A4+1) WRITE D(A5) READ Q(A6) WRITE D(A7) DESELECT UNDEFINED Notes: 25. For this waveform ZZ is tied LOW. 26. When CE is LOW, CE1 is LOW, CE2 is HIGH and CE3 is LOW. When CE is HIGH,CE1 is HIGH or CE2 is LOW or CE3 is HIGH. 27. Order of the Burst sequence is determined by the status of the MODE (0 = Linear, 1 = Interleaved).Burst operations are optional. Document #: 38-05555 Rev. *F Page 21 of 28 CY7C1370D CY7C1372D Switching Waveforms (continued) NOP,STALL and DESELECT Cycles[25, 26, 28] 1 2 A1 A2 3 4 5 A3 A4 6 7 8 9 10 CLK CEN CE ADV/LD WE BWx ADDRESS A5 tCHZ D(A1) Data Q(A2) D(A4) Q(A3) Q(A5) In-Out (DQ) WRITE D(A1) READ Q(A2) STALL READ Q(A3) WRITE D(A4) STALL DON’T CARE NOP READ Q(A5) DESELECT CONTINUE DESELECT UNDEFINED ZZ Mode Timing[29, 30] CLK t ZZ ZZ I t ZZREC t ZZI SUPPLY I DDZZ t RZZI ALL INPUTS (except ZZ) Outputs (Q) DESELECT or READ Only High-Z DON’T CARE Notes: 28. The Ignore Clock Edge or Stall cycle (Clock 3) illustrated CEN being used to create a pause. A write is not performed during this cycle. 29. Device must be deselected when entering ZZ mode. See cycle description table for all possible signal conditions to deselect the device. 30. I/Os are in High-Z when exiting ZZ sleep mode. Document #: 38-05555 Rev. *F Page 22 of 28 CY7C1370D CY7C1372D Ordering Information Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. Speed (MHz) 167 Ordering Code CY7C1370D-167AXC Package Diagram Part and Package Type 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Operating Range Commercial CY7C1372D-167AXC CY7C1370D-167BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-167BGC CY7C1370D-167BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1372D-167BGXC CY7C1370D-167BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1372D-167BZC CY7C1370D-167BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1372D-167BZXC CY7C1370D-167AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Industrial CY7C1372D-167AXI CY7C1370D-167BGI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-167BGI CY7C1370D-167BGXI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1372D-167BGXI CY7C1370D-167BZI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1372D-167BZI CY7C1370D-167BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1372D-167BZXI 200 CY7C1370D-200AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Commercial CY7C1372D-200AXC CY7C1370D-200BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-200BGC CY7C1370D-200BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1372D-200BGXC CY7C1370D-200BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1372D-200BZC CY7C1370D-200BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1372D-200BZXC CY7C1370D-200AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Industrial CY7C1372D-200AXI CY7C1370D-200BGI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-200BGI CY7C1370D-200BGXI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1372D-200BGXI CY7C1370D-200BZI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1372D-200BZI CY7C1370D-200BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1372D-200BZXI Document #: 38-05555 Rev. *F Page 23 of 28 CY7C1370D CY7C1372D Ordering Information (continued) Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or visit www.cypress.com for actual products offered. 250 CY7C1370D-250AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Commercial CY7C1372D-250AXC CY7C1370D-250BGC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-250BGC CY7C1370D-250BGXC 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1372D-250BGXC CY7C1370D-250BZC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1372D-250BZC CY7C1370D-250BZXC 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1372D-250BZXC CY7C1370D-250AXI 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free Industrial CY7C1372D-250AXI CY7C1370D-250BGI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) CY7C1372D-250BGI CY7C1370D-250BGXI 51-85115 119-ball Ball Grid Array (14 x 22 x 2.4 mm) Lead-Free CY7C1372D-250BGXI CY7C1370D-250BZI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) CY7C1372D-250BZI CY7C1370D-250BZXI 51-85180 165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead-Free CY7C1372D-250BZXI Document #: 38-05555 Rev. *F Page 24 of 28 CY7C1370D CY7C1372D Package Diagrams 100-Pin Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) (51-85050) 16.00±0.20 1.40±0.05 14.00±0.10 81 100 80 1 20.00±0.10 22.00±0.20 0.30±0.08 0.65 TYP. 30 12°±1° (8X) SEE DETAIL A 51 31 50 0.20 MAX. R 0.08 MIN. 0.20 MAX. 0.10 1.60 MAX. 0° MIN. SEATING PLANE STAND-OFF 0.05 MIN. 0.15 MAX. 0.25 NOTE: 1. JEDEC STD REF MS-026 GAUGE PLANE 0°-7° R 0.08 MIN. 0.20 MAX. 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH 3. DIMENSIONS IN MILLIMETERS 0.60±0.15 0.20 MIN. 51-85050-*B 1.00 REF. DETAIL Document #: 38-05555 Rev. *F A Page 25 of 28 CY7C1370D CY7C1372D Package Diagrams (continued) 119-Ball BGA (14 x 22 x 2.4 mm) (51-85115) Ø0.05 M C Ø0.25 M C A B A1 CORNER Ø0.75±0.15(119X) Ø1.00(3X) REF. 1 2 3 4 5 6 7 7 6 5 4 3 2 1 A A B B C D 1.27 C D E E F F H 19.50 J K L 20.32 G H 22.00±0.20 G J K L M 10.16 M N P N P R R T T U U 1.27 0.70 REF. A 3.81 7.62 30° TYP. 14.00±0.20 0.15(4X) 0.15 C 2.40 MAX. B 0.90±0.05 0.25 C 12.00 51-85115-*B C Document #: 38-05555 Rev. *F 0.60±0.10 0.56 SEATING PLANE Page 26 of 28 CY7C1370D CY7C1372D Package Diagrams (continued) 165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180) BOTTOM VIEW PIN 1 CORNER BOTTOM VIEW TOP VIEW PIN 1 CORNER TOP VIEW Ø0.05 M C Ø0.25 MØ0.05 CAB MC PIN 1 CORNER Ø0.25 M C A B Ø0.50 -0.06 (165X) PIN 1 CORNER 1 2 1 +0.14 4 2 5 3 6 4 7 5 8 6 9 7 10 11 8 9 11 10 11 10 9 11 8 10 7 9 6 8 5 7 Ø0.50 -0.06 (165X) 4 6 1 3 +0.14 2 5 4 3 2 1A B A C B C B D C D C E D F 1.00 A 1.00 B F E G F G F H G H G J H K J L K M L N M P N P N R P R P 7.00 7.00 14.00 D E 14.00 15.00±0.10 E 15.00±0.10 15.00±0.10 A 15.00±0.10 3 J H K J L K M L N M R R A A A 1.00 5.00 A 1.00 5.00 10.00 10.00 B B 13.00±0.10 B 13.00±0.10 B 13.00±0.10 13.00±0.10 SEATING PLANE NOTES : NOTES : SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD) PACKAGE WEIGHT SOLDER PAD: 0.475g TYPE : NON-SOLDER MASK DEFINED (NSMD) JEDEC REFERENCE : MO-216 / DESIGN 4.6C PACKAGE WEIGHT : 0.475g PACKAGE CODE : BB0AC : MO-216 / DESIGN 4.6C JEDEC REFERENCE PACKAGE CODE : BB0AC 51-85180-*A 0.35±0.06 C 0.35±0.06 0.36 0.36 SEATING PLANE C 0.15 C 1.40 MAX. 1.40 MAX. 0.15(4X) 0.15 C 0.53±0.05 0.53±0.05 0.25 C 0.25 C 0.15(4X) 51-85180-*A ZBT is a trademark of Integrated Device Technology, Inc. NoBL and No Bus Latency are trademarks of Cypress Semiconductor Corporation. All products and company names mentioned in this document may be the trademarks of their respective holders. Document #: 38-05555 Rev. *F Page 27 of 28 © Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. CY7C1370D CY7C1372D Document History Page Document Title: CY7C1372D/CY7C1370D 18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL™ Architecture Document Number: 38-05555 REV. ECN No. Issue Date Orig. of Change Description of Change ** 254509 See ECN RKF New data sheet *A 276690 See ECN VBL Changed TQFP pkg to Lead-free TQFP in Ordering Information section Added comment of Lead-free BG and BZ packages availability *B 288531 See ECN SYT Edited description under “IEEE 1149.1 Serial Boundary Scan (JTAG)” for non-compliance with 1149.1 Added lead-free information for 100-pin TQFP, 119 BGA and 165 FBGA Packages *C 326078 See ECN PCI Address expansion pins/balls in the pinouts for all packages are modified as per JEDEC standard Added description on EXTEST Output Bus Tri-State Changed description on the Tap Instruction Set Overview and Extest Changed ΘJA and ΘJC for TQFP Package from 31 and 6 °C/W to 28.66 and 4.08 °C/W respectively Changed ΘJA and ΘJC for BGA Package from 45 and 7 °C/W to 23.8 and 6.2 °C/W respectively Changed ΘJA and ΘJC for FBGA Package from 46 and 3 °C/W to 20.7 and 4.0 °C/W respectively Modified VOL, VOH test conditions Removed shading from AC/DC Table and Selection Guide Removed comment of ‘Lead-free BG packages availability’ below the Ordering Information Updated Ordering Information Table Changed from Preliminary to final *D 370734 See ECN PCI Modified test condition in note# 17 from VDDQ < VDD to VDDQ ≤ VDD *E 416321 See ECN NXR Converted from preliminary to final Changed address of Cypress Semiconductor Corporation on Page# 1 from “3901 North First Street” to “198 Champion Court” Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the Electrical Characteristics Table Changed three-state to tri-state Changed the IX current values of MODE on page # 18 from –5 µA and 30 µA to –30 µA and 5 µA Changed the IX current values of ZZ on page # 18 from –30 µA and 5 µA to –5 µA and 30 µA Changed VIH < VDD to VIH < VDDon page # 18 Replaced Package Name column with Package Diagram in the Ordering Information table Updated Ordering Information Table *F 475677 See ECN VKN Added the Maximum Rating for Supply Voltage on VDDQ Relative to GND Changed tTH, tTL from 25 ns to 20 ns and tTDOV from 5 ns to 10 ns in TAP AC Switching Characteristics table. Updated the Ordering Information table. Document #: 38-05555 Rev. *F Page 28 of 28