LM113QML LM113QML Reference Diode Literature Number: SNVS367 LM113QML Reference Diode General Description Features The LM113 are temperature compensated, low voltage reference diodes. They feature extremely-tight regulation over a wide range of operating currents in addition to an unusuallylow breakdown voltage and good temperature stability. The diodes are synthesized using transistors and resistors in a monolithic integrated circuit. As such, they have the same low noise and long term stability as modern IC op amps. Further, output voltage of the reference depends only on highlypredictable properties of components in the IC; so they can be manufactured and supplied to tight tolerances. ■ Low breakdown voltage: 1.220V ■ Dynamic impedance of 0.3Ω from 500 μA to 20 mA ■ Temperature stability typically 1% over−55°C to 125°C range ■ Tight tolerance: ±5% or ±1% The characteristics of this reference recommend it for use in bias-regulation circuitry, in low-voltage power supplies or in battery powered equipment. The fact that the breakdown voltage is equal to a physical property of silicon —the energy-band gap voltage—makes it useful for many temperature-compensation and temperaturemeasurement functions. Ordering Information NS Part Number LM113H-SMD LM113-1H-SMD SMD Part Number NS Package Number 5962-8671101XA H02A 2LD Metal Can Package Description 5962-8671102XA H02A 2LD Metal Can LM113-1H-QMLV 5962-9684302VXA H02A 2LD Metal Can LM113WG-QMLV 5962-9684301VZA WG10A 10LD Ceramic SOIC LM113-1WG-QMLV 5962-9684302VZA WG10A 10LD Ceramic SOIC Connection Diagrams Metal Can Package (H) 20150021 See NS Package Number H02A © 2010 National Semiconductor Corporation 201500 Ceramic SOIC Package (WG) 20150001 See NS Package Number WG10A www.national.com LM113QML Reference Diode December 16, 2010 Schematic Diagram 20150020 www.national.com 2 Absolute Maximum Ratings (Note 1) Power Dissipation (Note 2) Reverse Current Forward Current Storage Temperature Range 100 mW 50 mA 50 mA −65°C ≤ TA ≤ +150°C 300°C +150°C Lead Temperature (Soldering, 10 seconds) Maximum Junction Temperature (TJmax) Operating Temperature Range −55°C ≤ TA ≤ +125°C Thermal Resistance θJA Metal Can (Still Air) Metal Can (500LF / Min Air Flow) Ceramic SOIC (Still Air) Ceramic SOIC (500LF / Min Air Flow) 440°C/W TBD 218°C/W 140°C/W θJC Metal Can Ceramic SOIC Package Weight Metal Can Ceramic SOIC ESD Tolerance (Note 3) 80°C/W 27°C/W 275mg 220mg 4000V Quality Conformance Mil-Std-883, Method 5005 - Group A Subgroup Description 1 Static tests at Temp (°C) +25 2 Static tests at +125 3 Static tests at -55 4 Dynamic tests at +25 5 Dynamic tests at +125 6 Dynamic tests at -55 7 Functional tests at +25 8A Functional tests at +125 8B Functional tests at -55 9 Switching tests at +25 10 Switching tests at +125 11 Switching tests at -55 12 Settling time at +25 13 Settling time at +125 14 Settling time at -55 3 www.national.com LM113 Electrical Characteristics DC Parameters Symbol Parameter VZR Zener Voltage ΔVZR Delta Zener Voltage VF Forward Voltage Drop RR Reverse Dynamic Impedance Conditions Notes IR = 1 mA Subgroups Min Max Unit 1.16 1.28 V 1 1.157 1.283 V 2, 3 0.5mA ≤ IR ≤ 20mA 15 mV 1 0.5mA ≤ IR ≤ 10mA 15 mV 2, 3 IF = 1mA 1.0 V 1, 2, 3 1.0 Ω 4 0.8 Ω 4 Min Max Unit Subgroups -0.02 0.02 V 1 Min Max Unit Subgroups IR = 1mA (Note 4) IR = 10mA DC Drift Parameters Delta Calculations performed on QMLV devices at Group B, Subgroup 5, only. Symbol VZR Parameter Zener Voltage Conditions Notes IR = 1mA LM113-1 Electrical Characteristics DC Parameters Symbol Parameter VZR Zener Voltage ΔVZR Delta Zener Voltage VF Forward Voltage Drop RR Reverse Dynamic Impedance Conditions Notes IR = 1 mA 1.210 1.232 V 1 1.206 1.234 V 2, 3 0.5mA ≤ IR ≤ 20mA 15 mV 1 0.5mA ≤ IR ≤ 10mA 15 mV 2, 3 IF = 1mA 1.0 V 1, 2, 3 IR = 1mA 1.0 Ω 4 0.8 Ω 4 Min Max Unit Subgroups -0.02 0.02 V 1 (Note 4) IR = 10mA DC Drift Parameters Delta Calculations performed on QMLV devices at Group B, Subgroup 5, only. Symbol VZR Parameter Zener Voltage Conditions IR = 1mA Notes Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower. Note 3: Human body model, 1.5KΩ in series with 100pF. Note 4: Guaranteed parameter, not tested. www.national.com 4 Typical Performance Characteristics Temperature Drift Reverse Dynamic Impedance 20150007 20150006 Reverse Characteristics Reverse Characteristics 20150008 20150009 Reverse Dynamic Impedance Noise Voltage 20150010 20150011 5 www.national.com Forward Characteristics Response Time 20150012 20150013 Maximum Shunt Capacitance 20150014 www.national.com 6 Typical Applications Amplifier Biasing for Constant Gain with Temperature Constant Current Source 20150018 20150017 Thermometer 20150019 Adjust for 0V at 0°C Adjust for 100 mV/°C Level Detector for Photodiode Low Voltage Regulator 20150015 20150016 †Solid tantalum. 7 www.national.com Revision History Released Revision 12/16/2010 A www.national.com Section Changes New release to corporate format 8 2 MDS data sheets converted into one Corp. data sheet format. MDSs MNLM113-X Rev 1C1 and MNLM113-1-X Rev. 2A1 will be archived. Physical Dimensions inches (millimeters) unless otherwise noted NS Package Number H02A NS Package Number WG10A 9 www.national.com LM113QML Reference Diode Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise® Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise® Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright© 2010 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: [email protected] Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Technical Support Center Email: [email protected] National Semiconductor Asia Pacific Technical Support Center Email: [email protected] National Semiconductor Japan Technical Support Center Email: [email protected] IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated