ILSI ILCX05-GJ2318-20.000 4 pad ceramic package, 5.5 mm x 11.9 mm Datasheet

4 Pad Ceramic Package, 5.5 mm x 11.9 mm
Product Features:
ILCX05 Series
Applications:
SMD Package
Supplied in Tape and Reel
Compatible with Leadfree Processing
PCMCIA Cards
Storage
PC’s
Wireless Lan
11.9
4
3
1
2
1
2
4
3
5.5
Frequency
3.5 MHz to 70 MHz
ESR (Equivalent Series Resistance)
3.5 MHz – 4.4 MHz
4.5 MHz – 6.9 MHz
7 MHz – 13.9 MHz
14 MHz – 25 MHz
rd
30 MHz – 70 MHz (3 O.T.)
Shunt Capacitance (C0)
H
200 Ω Max.
100 Ω Max.
70 Ω Max.
50 Ω Max.
100 Ω Max.
7 pF Max.
Connection Diagram
Frequency Stability over
Temperature
±30 ppm Standard (see Part Number Guide for more
options)
±50 ppm Standard (see Part Number Guide for more
options)
Crystal Cut
AT Cut
Load Capacitance
18 pF Standard (see Part Number Guide for more options)
Drive Level
100 uW Max.
Aging
±5 ppm Max. / Year Standard
Frequency Tolerance @ 25° C
4
3
1
2
Recommended Pad Layout
2.4
4.3
2.1
Temperature
Operating
0° C to +70° C Standard (see Part Number Guide for more
options)
Storage
-40° C to +85° C Standard
Part Number Guide
Package
ILCX05 -
Sample Part Number:
5.1
Dimension Units: mm
ILCX05 - FB1F18 - 20.000
Tolerance
(ppm) at Room
Temperature
Stability
(ppm) over Operating
Temperature
Operating
Temperature Range
Mode
(overtone)
B = ±50 ppm
B = ±50 ppm
0 = 0°C to +50°C
F = Fundamental
F = ±30 ppm
F = ±30 ppm
1 = 0°C to +70°C
3 = 3rd overtone
G = ±25 ppm
G = ±25 ppm
2 = -10°C to +60°C
H = ±20 ppm
H = ±20 ppm
3 = -20°C to +70°C
I = ±15 ppm
I = ±15 ppm**
5 = -40°C to +85°C
J = ±10 ppm*
J = ±10 ppm**
9 = -10°C to +50°C
Load Capacitance
(pF)
18 pF Standard
Or Specify
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 1
Frequency
- 20.000 MHz
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
ILCX05 Series
Pb Free Solder Reflow Profile:
Typical Circuit:
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 2a
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
1000
24 +/-.3
12+/-.2
11.5 +/-.2
25 +/-1.5
80 / 100
330
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: ILSI, Date Code (YWW)
Line 2: Frequency
ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com
06/09_A
Specifications subject to change without notice
Page 2
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