NCP4632 3A, Low Voltage, Low Dropout Linear Voltage Regulator with Reverse Current Protection The NCP4632 is a CMOS Linear voltage regulator with high output current capability (up to 3 A). This device can provide output voltages as low as 0.8 V while maintaining a low dropout voltage of 510 mV typ. at full load. The NCP4632 is designed to draw only 350 mA of supply current and less than 1 mA in standby mode to minimize current consumption for battery operated applications. The device has a high accuracy output voltage of ±1% along with soft−start and reverse current protection circuits to protect the device and the application. The NCP4632 is available in a Pb−Free DPAK−5 package in both fixed and adjustable output voltage options. The output voltage for the fixed options can be modified in 0.1 V steps from 0.8 V to 4.2 V Please contact your sales office for any additional fixed voltage outputs to those already listed. Features • Operating Input Voltage Range: 1.6 V to 5.25 V • Output Voltage Range: 0.8 to 4.5 V (0.1 V steps for fixed options) • Supply current: Typical Operation Mode − 350.0 mA MARKING DIAGRAM E1Jxx1 yy zz DPAK−5 CASE 369AE 1 2 3 4 5 xx = Specific Device Code YY = B − Without Active Discharge = D − With Active Discharge zz = Lot Number − 1.0 mA Standby Mode • Dropout Voltage: • • • • • • www.onsemi.com ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. 150 mV Typ. at IOUT = 1 A, VOUT = 2.5 V 510 mV Typ. at IOUT = 3 A, VOUT = 2.5 V ±1% Output Voltage Accuracy Line Regulation 0.15%/V Typ. Current Fold Back Protection Typ. 220 mA Stable with Ceramic Capacitors Available in DPAK−5 Package (TO252−5) These are Pb−Free Devices Typical Applications • • • • Battery Powered Equipments Portable Communication Equipments Cameras, VCRs and Camcorders Home appliances NCP4632 (Fixed) VIN VIN VOUT VIN VOUT NCP4632 (Adj) VIN VOUT R1 C1 10m CE SENSE GND C2 10m C1 10m CE GND VADJ R2 VOUT C2 10m Figure 1. Typical Application Schematics © Semiconductor Components Industries, LLC, 2017 February, 2017 − Rev. 3 1 Publication Order Number: NCP4632/D NCP4632 VIN VIN VOUT VOUT SENSE/ ADJ SENSE/ADJ Vref CE Vref Current Limit Thermal Protection Current Limit Thermal Protection CE GND GND Reverse Detector Reverse Detector NCP4632B NCP4632D Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. TO252−5−P2 Pin Name 4 VOUT 2 VIN 3 GND (Note 1) 1 CE 5 SENSE / ADJ Description Output Voltage Pin Input Voltage Pin Ground Pin Chip Enable Pin, Active “H”, Connect to VIN pin if not used. Sense Pin on Fixed Options, ADJ for Adjustable 1. TAB is internally connected to pin 3 GND. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN 6.0 V Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE −0.3 to 6.0 V Vsense −0.3 to 6.0 V Input Voltage Sense Input Output Current IOUT 3000 mA PD(MAX) 3800 mW TSTG −55 to 125 °C Maximum Junction Temperature TJ(MAX) 125 °C ESD Capability, Human Body Model (Note 3) ESDHBM 2000 V ESD Capability, Machine Model (Note 3) ESDMM 200 V Power Dissipation (Note 2) Storage Temperature Range Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 2. JEDEC standard 76.2mm x 114.3 mm, FR4 Four−layers board 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. THERMAL CHARACTERISTICS Rating Thermal Characteristics, DPAK−5 Thermal Resistance, Junction−to−Air www.onsemi.com 2 Symbol Value Unit RqJA 53 °C/W NCP4632 ELECTRICAL CHARACTERISTICS −40°C ≤ TJ ≤ 85°C; VIN = VOUT(NOM) + 1 V; IOUT = 1 mA; CIN = COUT = 10 mF; unless otherwise noted. Typical values are at TJ = +25°C. Parameter Test Conditions Operating Input Voltage (Note 4) Output Voltage Symbol Min VIN VOUT 15 mV V VOUT ≤ 2 V −45 30 mV 0.808 V TJ = +25°C, IOUT = 5 mA VOUT = ADJ VADJ 0.792 3 1 mA ≤ IOUT < 300 mA LoadReg 1 mA ≤ IOUT < 3000 mA TJ = +25°C, IOUT = 1000 mA VOUT = 3.3 V IOUT = 3000 mA −15 2 20 −70 3 50 VDO 100 0.865 1.000 1.0 V ≤ VOUT < 1.1 V 0.810 0.950 0.755 0.895 VDO 0.720 0.840 1.5 V ≤ VOUT < 2.5 V 0.630 0.760 2.5 V ≤ VOUT < 3.3 V 0.510 0.600 3.3 V ≤ VOUT < 4.2 V 0.480 0.560 VOUT ≤ 1.5 V ISC 220 IQ 390 450 350 430 VOUT > 1.5 V IOUT = 3000 mA IGND VCE = 0 V, TJ = 25°C ISTB CE Input Voltage “H” VCEH CE Input Voltage “L” VCEL mV mV 0.9 V ≤ VOUT < 1.0 V CE Pull Down Current Reverse Current Limit %/V 1.110 VOUT = 0 V IOUT = 0 mA, VIN = 5.25 V A 0.15 0.910 1.2 V ≤ VOUT < 1.5 V Short Current Limit 0.8 0.8 V ≤ VOUT < 0.9 V 1.1 V ≤ VOUT < 1.2 V Auto Discharge Low Output Nch Tr. On Resistance V x1.02 Load Regulation Output Noise Voltage x1.01 −15 IOUT Power Supply Rejection Ratio x0.99 x0.97 LineReg CE Pin Threshold Voltage V VOUT > 2 V TJ = −40 to 85°C Standby Current 5.25 VOUT ≤ 1.5 V VIN = VOUT + 0.5 V to 5 V, IOUT = 1 mA VIN ≥ 1.6 V for NCP4632xDT08T5G, IOUT = 1 mA Supply Current 1.6 −40°C ≤ TJ ≤ 85°C, IOUT = 5 mA Line Regulation Quiescent Current Unit VOUT > 1.5 V Output Current Dropout Voltage Max TJ = +25°C, IOUT = 5 mA Output Voltage (Adjustable Option) Dropout Voltage Typ V mA 450 mA mA mA 1 V 1.0 0.4 0.6 mA ICEPD 0.3 VIN = VOUT + 1 V or 2.2 V whichever is higher, DVIN = 0.2 Vpk−pk, IOUT = 300 mA, f = 1 kHz PSRR 55 dB VOUT = 1.5 V, IOUT = 300 mA, f = 10 Hz to 100 kHz VN 60 mVrms VIN = 4 V, VCE = 0 V RLOW 30 W VOUT > 0.5 V, 0 V ≤ VIN < 5.25 V IREV 10 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. The maximum Input Voltage of the ELECTRICAL CHARACTERISTICS is 5.25 V. In case of exceeding this specification, the IC must be operated on condition that the Input Voltage is up to 5.5 V and the total operating time is within 500 hrs. www.onsemi.com 3 NCP4632 0.9 1.6 0.8 1.4 0.7 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) TYPICAL CHARACTERISTICS 0.6 1 mA 0.5 10 mA 0.4 100 mA 0.3 1A 0.2 2A 0.0 1A 0.8 0.6 100 mA 0.4 10 mA INPUT VOLTAGE (V) Figure 3. Output Voltage vs. Input Voltage at NCP4632xDT08 Figure 4. Output Voltage vs. Input Voltage at NCP4632xDT15 3.5 2.5 3.0 OUTPUT VOLTAGE (V) 3.0 2.0 2A 1.5 1A 1.0 100 mA 10 mA 1 mA 0.5 2.5 2.0 1.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 5. Output Voltage vs. Input Voltage at NCP4632xDT28 Figure 6. Output Voltage vs. Input Voltage at NCP4632xDT33 350 400 300 250 200 150 TJ = 25°C Iout = 0 Cin = Cout = 10 mF 0 100 mA 10 mA 1 mA 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 450 0 1A 1.0 400 50 2A 0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 100 1 mA INPUT VOLTAGE (V) QUIESCENT CURRENT (mA) OUTPUT VOLTAGE (V) 2A 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.0 3A 1.0 0.2 0.1 QUIESCENT CURRENT (mA) 1.2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 350 300 250 200 150 100 TJ = 25°C Iout = 0 Cin = Cout = 10 mF 50 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 7. Quiescent Current vs. Input Voltage at NCP4632xDT08 Figure 8. Quiescent Current vs. Input Voltage at NCP4632xDT15 www.onsemi.com 4 NCP4632 450 450 400 400 QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) TYPICAL CHARACTERISTICS 350 300 250 200 150 100 TJ = 25°C Iout = 0 Cin = Cout = 10 mF 50 0 0 250 200 150 100 TJ = 25°C Iout = 0 Cin = Cout = 10 mF 50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) INPUT VOLTAGE (V) Figure 9. Quiescent Current vs. Input Voltage at NCP4632xDT28 Figure 10. Quiescent Current vs. Input Voltage at NCP4632xDT33 1.6 0.8 1.4 Vin = 1.8 V 0.7 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 300 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.9 0.6 0.5 0.4 Vin = 3 V 0.3 0.2 Vin = 5.5 V TJ = 25°C Cin = Cout = 10 mF 0.1 1.2 Vin = 5.5 V 1 0.8 Vin = 2.5 V 0.6 0.4 Vin = 3.5 V 0.2 TJ = 25°C Cin = Cout = 10 mF 0 0 0 1 2 3 4 5 6 0 7 1 2 3 4 5 6 OUTPUT CURRENT (A) OUTPUT CURRENT (mA) Figure 11. Output Voltage vs. Output Current at NCP4632xDT08 Figure 12. Output Voltage vs. Output Current at NCP4632xDT15 4 7 0.6 DROPOUT VOLTAGE (V) 3.5 OUTPUT VOLTAGE (V) 350 3 2.5 2 Vin = 5.5 V 1.5 Vin = 5 V Vin = 4.3 V 1 0.5 TJ = 25°C Cin = Cout = 10 mF 0 0 1 2 3 4 5 6 7 0.5 0.4 25°C 0.3 85°C 0.2 −40°C 0.1 0 0 8 0.5 1 1.5 2 2.5 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 13. Output Voltage vs. Output Current at NCP4632xDT33 Figure 14. Dropout Voltage vs. Output Current at NCP4632xDT15 www.onsemi.com 5 3 NCP4632 0.4 0.4 0.35 0.35 0.3 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) TYPICAL CHARACTERISTICS 85°C 0.25 0.2 25°C 0.15 −40°C 0.1 85°C 0.25 25°C 0.2 0.15 −40°C 0.1 0.05 0.05 0 0 0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3 OUTPUT CURRENT (A) OUTPUT CURRENT (A) Figure 15. Dropout Voltage vs. Output Current at NCP4632xDT28 Figure 16. Dropout Voltage vs. Output Current at NCP4632xDT33 90 100 90 80 Iout = 1 mA 70 70 PSRR (dB) 50 40 30 60 Iout = 100 mA 50 40 30 Iout = 100 mA 20 10 0 0.1 Iout = 1 mA 80 60 PSRR (dB) 0.3 20 1 10 100 Iout = 1 A 10 Iout = 1 A 1000 0 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) Figure 17. PSRR vs. Frequency at NCP4632xDT08 Figure 18. PSRR vs. Frequency at NCP4632xDT15 1000 70 90 80 Iout = 1 mA 60 Iout = 1 mA 70 50 PSRR (dB) PSRR (dB) 60 50 40 30 Iout = 100 mA 20 1 10 Iout = 100 mA 30 20 Iout = 1 A 100 Iout = 1 A 10 10 0 0.1 40 1000 0 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) Figure 19. PSRR vs. Frequency at NCP4632xDT28 Figure 20. PSRR vs. Frequency at NCP4632xDT33 www.onsemi.com 6 1000 NCP4632 TYPICAL CHARACTERISTICS 4.5 Vin = 1.8 V Iout = 100 mA Cin = Cout = 10 mF 2.0 Vin = 2.5 V Iout = 100 mA Cin = Cout = 10 mF 4.0 NOISE DENSITY (mV/√HZ) NOISE DENSITY (mV/√HZ) 2.5 1.5 1.0 0.5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.01 0.1 1 10 100 0.0 0.01 1000 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 21. Output Noise Density vs. Frequency at NCP4632xDT08 Figure 22. Output Noise Density vs. Frequency at NCP4632xDT15 9 9 Vin = 3.8 V Iout = 100 mA Cin = Cout = 10 mF 7 Vin = 4.3 V Iout = 100 mA Cin = Cout = 10 mF 8 NOISE DENSITY (mV/√HZ) 8 6 5 4 3 2 7 6 5 4 3 2 1 1 0 0.01 0.1 1 10 100 0 0.01 1000 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 23. Output Noise Density vs. Frequency at NCP4632xDT28 Figure 24. Output Noise density vs. Frequency at NCP4632xDT33 4.0 3.0 1.0 0.810 0.0 0.805 0.800 Vin = 1.8 V to 2.8 V Iout = 50 mA Cin = 0, Cout = 10 mF 0.795 0.790 0 10 20 30 40 50 60 t (ms) Figure 25. Line Transient Response at NCP4632xDT08 www.onsemi.com 7 70 Vin (V) 2.0 Vout (V) NOISE DENSITY (mV/√HZ) 0.1 NCP4632 TYPICAL CHARACTERISTICS 6.0 3.310 4.0 3.305 3.0 Vin (V) Vout (V) 5.0 3.300 Vin = 4.3 V to 5.3 V Iout = 50 mA Cin = 0, Cout = 10 mF 3.295 3.290 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 t (ms) 600 500 400 300 200 100 0 0.82 0.81 0.80 0.79 0.78 0.77 0 10 20 30 Iout (mA) Vout (V) Figure 26. Line Transient Response at NCP4632xDT33 Vin = 1.8 V Iout = step 5 mA to 500 mA Cin = Cout = 10 mF 40 50 60 70 t (ms) 600 500 400 300 200 100 0 Vin = 5.3 V Iout = step 5 mA to 500 mA Cin = Cout = 10 mF 3.32 3.31 3.30 3.29 3.28 3.27 0 10 20 30 40 t (ms) 50 60 Figure 28. Load Transient Response at NCP4632xDT33 www.onsemi.com 8 70 Iout (mA) Vout (V) Figure 27. Load Transient Response at NCP4632xDT08 NCP4632 TYPICAL CHARACTERISTICS 4 3 2 1 0 Iout (A) Vout (V) Vin = 1.8 V Iout = step 1 mA to 3 A Slope 1 A/ms Cin = Cout = 10 mF 0.85 0.80 0.75 0.70 0.0 0.2 0.4 0.6 0.8 t (ms) 1.0 1.2 1.4 Figure 29. Load Transient Response at NCP4632xDT08 4 3 3.40 1 0 3.35 Iout (A) Vout (V) 2 Vin = 5.3 V Iout = step 1 mA to 3 A Slope 1 A/ms Cin = Cout = 10 mF 3.30 3.25 3.20 3.15 0.0 0.2 0.4 0.6 0.8 t (ms) 1.0 1.2 1.4 Figure 30. Load Transient Response at NCP4632xDT33 2 1.6 Vout (V) 0.8 0.4 CE Pin Voltage 0 Iout = 1 mA 0.8 Iout = 10 mA 0.6 Iout = 100 mA 0.4 0.2 0 0 10 20 30 40 t (ms) Figure 31. Turn Off with CE pin vs. Output Current at NCP4632BDT08 www.onsemi.com 9 50 CE PIN VOLTAGE (V) 1.2 NCP4632 TYPICAL CHARACTERISTICS 2 1.6 Vout (V) 0.8 0.4 CE Pin Voltage 0 Iout = 1 mA 0.8 Iout = 10 mA 0.6 Iout = 100 mA 0.4 CE PIN VOLTAGE (V) 1.2 0.2 0 0 3 6 9 12 15 t (ms) Figure 32. Turn Off with CE pin vs. Output Current at NCP4632DDT08 2 1.2 Vout (V) 0.8 0.4 CE Pin Voltage 0 0.8 NCP4632BDT08, Iout = 1 mA 0.6 0.4 NCP4632DDT08, Iout = 1 mA CE PIN VOLTAGE (V) 1.6 0.2 0 0 10 20 30 40 50 t (ms) Figure 33. Turn Off with CE pin at NCP4632xDT08, Iout = 1 mA 2 1 Vout (V) 0.5 Iout = 300 mA 0.8 0 Iout = 100 mA 0.6 0.4 Iout = 1 mA 0.2 0 0.0 0.1 0.2 0.3 0.4 t (ms) Figure 34. Turn On with CE pin at NCP4632xDT08 www.onsemi.com 10 0.5 CE PIN VOLTAGE (V) 1.5 CE Pin Voltage NCP4632 TYPICAL CHARACTERISTICS 3 1 Vout (V) Iout = 500 mA 1.6 0 1.2 Iout = 100 mA 0.8 CE PIN VOLTAGE (V) 2 CE Pin Voltage Iout = 1 mA 0.4 0 0.0 0.1 0.2 t (ms) 0.3 0.4 0.5 Figure 35. Turn On with CE Pin at NCP4632xDT15 5 CE Pin Voltage 4 Vout (V) Iout = 1000 mA 2 3 1 2.5 0 2 Iout = 100 mA 1.5 Iout = 1 mA 1 CE PIN VOLTAGE (V) 3 0.5 0 0.0 0.1 0.2 0.3 0.4 0.5 t (ms) Figure 36. Turn On with CE Pin at NCP4632xDT28 5 4 3 3.5 2 3 1 2.5 0 2 Iout = 1 mA 1.5 1 Iout = 100 mA 0.5 0 0.0 0.1 0.2 0.3 0.4 t (ms) Figure 37. Turn On with CE Pin at NCP4632xDT33 www.onsemi.com 11 0.5 CE PIN VOLTAGE (V) Vout (V) Iout = 1000 mA NCP4632 APPLICATION INFORMATION A typical application circuit for NCP4632 series is shown in Figure 38. NCP4632 (Fixed) VIN VIN V OUT + 0.8 CE VOUT SENSE GND I ADJ + V SET NCP4632 (Adj) VIN CE C1 10m GND VADJ R2 (eq. 1) R1 RADJ (eq. 2) ǒ1 ) R1Ǔ (eq. 3) R2 The resistor divider should be kept to values below 500 kW to ensure stability. VOUT R1 I ADJ By choosing R1 << RADJ (RADJ is typically around 1.6 MW), this value becomes very small in which case we can omit the term R1 x IADJ in Equation 1. The simplified equation for the output voltage calculation is shown in Equation 3. C2 10m V OUT + 0.8 VIN R2 The current consumption IADJ flowing into the ADJ pin can be described by Equation 2. VOUT R1 C1 10m ǒ1 ) R1Ǔ ) R1 VOUT C2 10m Figure 38. Typical Application Schematic Input Decoupling Capacitor (C1) VOUT A 10 mF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4632. Higher values and lower ESR improves line transient response. VSET Output Decoupling Capacitor (C2) A 10 mF ceramic output decoupling capacitor is sufficient to achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. Using multiple ceramic capacitors in parallel should be avoided if possible as this can lead to unstable operation. The Output capacitor should be connected as close as possible to the output and ground pin. Larger capacitance values and lower ESR improves dynamic parameters. Figure 39. Output Voltage Setting Output Discharger The D version includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Enable Operation Thermal The Enable pin (CE) may be used for turning the regulator on and off. The regulator is switched on when the CE pin voltage is above logic high level. The Enable pin has an internal pull down current source with a 300 nA current capability. If the enable function is not needed, connect CE pin to VIN pin. As power across the IC increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature rise for the part. That is to say, when the device has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. Output Voltage Setting For the Adjustable version of the NCP4632, the output voltage can be adjusted by using an external resister divider. The output voltage can be calculated using Equation 1. www.onsemi.com 12 NCP4632 PCB layout regulator off as soon as VIN drops to < 30 mV above VOUT. In this state, reverse current is restricted to less than 10 mA, which flows to ground. As VIN recovers, the power device is switched back on. In order to avoid unstable behavior, there is a 5 mV hysteresis incorporated in the design which will require the dropout to rise above 35 mV before the power device is switched on again. Therefore, the minimum voltage dropout of the device at small output current is limited to 35 mV. Figures 40 and 41 show the diagrams of both operating modes. Make VIN and GND line sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. Reverse Current Protection The NCP4632 device include a Reverse Current Protection Circuit, which stops a reverse current flowing from the VOUT pin to the VIN or GND pin when the voltage on VOUT becomes higher than VIN. The reverse current protection circuitry switches the output power device of the Vin Vin VOUT Vout SENSE SENSE Vref Vref Current Limit CE CE Current Limit Reverse Detector Reverse Detector GND GND Figure 40. Normal Operating Mode Figure 41. Reverse Operating Mode ORDERING INFORMATION Nominal Output Voltage Description Marking Package Shipping† Adj Adjustable, auto discharge E1J081D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632BDT08T5G 0.8 V W/O Auto discharge E1J081B DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT08T5G 0.8 V Auto discharge E1J081D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT15T5G 1.5 V Auto discharge E1J151D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT28T5G 2.8 V Auto discharge E1J281D DPAK−5 (Pb−Free) 3000 / Tape & Reel NCP4632DDT33T5G 3.3 V Auto discharge E1J331D DPAK−5 (Pb−Free) 3000 / Tape & Reel Device NCP4632DDTADJT5G NOTE: The Adjustable and the 0.8 V fixed voltage option devices are interchangeable and have the same device marking. Evaluation Boards are available for select devices. Consult our website for further details †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 13 NCP4632 PACKAGE DIMENSIONS DPAK−5 (TO−252, 5 LEAD) CASE 369AE ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. THERMAL PAD CONTOUR OPTIONAL, WITHIN DIMENSIONS SHOWN. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. C A E b2 A B c2 D1 D H DETAIL A 1 2 3 4 E1 5 DIM A A1 b b2 c c2 D D1 E E1 e H L L1 L2 c e SIDE VIEW b TOP VIEW 0.12 M BOTTOM VIEW C A B H C A1 L2 GUAGE PLANE 0.10 C L 5.04 REF 2.74 REF RECOMMENDED SOLDERING FOOTPRINT* L1 DETAIL A MILLIMETERS MIN MAX 2.10 2.50 0.00 0.13 0.40 0.60 5.14 5.54 0.40 0.60 0.40 0.60 5.40 6.30 4.80 5.10 6.35 6.80 4.75 5.05 1.27 BSC 9.50 10.20 1.39 1.78 2.50 2.90 0.51 BSC 5.70 BOTTOM VIEW ALTERNATE CONSTRUCTION 6.00 10.50 5X 2.10 5X 0.80 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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