Seme LAB IRF9530S P-channel power mosfet for hi.rel application Datasheet

IRF9530SMD
MECHANICAL DATA
Dimensions in mm (inches)
3 .6 0 (0 .1 4 2 )
M a x .
!
VDSS
ID(cont)
RDS(on)
1 6 .0 2 (0 .6 3 1 )
1 5 .7 3 (0 .6 1 9 )
4 .1 4 (0 .1 6 3 )
3 .8 4 (0 .1 5 1 )
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
1 0 .6 9 (0 .4 2 1 )
1 0 .3 9 (0 .4 0 9 )
0 .7 6
(0 .0 3 0 )
m in .
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
0 .8 9
(0 .0 3 5 )
m in .
P–CHANNEL
POWER MOSFET
FOR HI–REL
APPLICATIONS
-100V
-8A
0.35W
FEATURES
9 .6 7 (0 .3 8 1 )
9 .3 8 (0 .3 6 9 )
0 .5 0 (0 .0 2 0 )
0 .2 6 (0 .0 1 0 )
1 1 .5 8 (0 .4 5 6 )
1 1 .2 8 (0 .4 4 4 )
• SIMPLE DRIVE REQUIREMENTS
• LIGHTWEIGHT
SMD 1
Pad 1 – Gate
• HERMETICALLY SEALED
Pad 2 – Drain
Pad 3 – Source
• SCREENING OPTIONS AVAILABLE
• ALL LEADS ISOLATED FROM CASE
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
±20V
VGS
Gate – Source Voltage
ID
Continuous Drain Current @ Tcase = 25°C
8A
ID
Continuous Drain Current @ Tcase = 100°C
5A
IDM
Pulsed Drain Current
40A
PD
Power Dissipation @ Tcase = 25°C
45W
Linear Derating Factor
0.36W/°C
TJ , Tstg
Operating and Storage Temperature Range
–55 to 150°C
RqJC
Thermal Resistance Junction to Case
2.8°C/W max.
Semelab plc.
Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612.
E-mail: [email protected]
Website http://www.semelab.co.uk
Prelim. 07/00
IRF9530SMD
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise stated)
Parameter
BVDSS
Test Conditions
STATIC ELECTRICAL RATINGS
Drain – Source Breakdown Voltage
DBVDSS Temperature Coefficient of
DTJ Breakdown Voltage
RDS(on)
VGS = 0
ID = 1mA
Min.
Typ.
Max.
100
Reference to 25°C
V
0.1
ID = 1mA
V / °C
Static Drain – Source On–State
VGS = 10V
ID = 5A
0.35
Resistance
VGS = 10V
ID = 8A
0.4
VDS = VGS
ID = 250mA
2
VDS ³ 15V
IDS = 5A
3
VGS = 0
VGS(th) Gate Threshold Voltage
V
(W)
S(W
VDS = 0.8BVDSS
25
TJ = 125°C
250
mA
Forward Transconductance
IDSS
Zero Gate Voltage Drain Current
IGSS
Forward Gate – Source Leakage
VGS = 20V
100
IGSS
Reverse Gate – Source Leakage
VGS = –20V
-100
Ciss
DYNAMIC CHARACTERISTICS
Input Capacitance
VGS = 0
860
Coss
Output Capacitance
VDS = 25V
350
Crss
Reverse Transfer Capacitance
f = 1MHz
125
Qg
Total Gate Charge
Qgs
Gate – Source Charge
ID = 8A
Qgd
Gate – Drain (“Miller”) Charge
VDS = 0.5BVDSS
td(on)
Turn–On Delay Time
tr
Rise Time
td(off)
Turn–Off Delay Time
tf
Fall Time
IS
SOURCE – DRAIN DIODE CHARACTERISTICS
Continuous Source Current
8
ISM
Pulse Source Current
32
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
IS = 8A
Qrr
Reverse Recovery Charge
di / dt £ 100A/ms VDD £ 50V
LD
PACKAGE CHARACTERISTICS
Internal Drain Inductance
LS
Internal Source Inductance
Semelab plc.
ID = 8A
VDS = 0.5BVDSS
nA
pF
12.5
29
1.0
6.3
2
27
nC
nC
60
VDD = 50V
140
ID = 8A
140
RG = 7.5W
IS = 8A
W
4
gfs
VGS = 10V
Unit
ns
140
TJ = 25°C
VGS = 0
TJ = 25°C
(from 6mm down drain lead pad to centre of die)
8.7
(from 6mm down source lead to centre of source bond pad)
8.7
Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612.
E-mail: [email protected]
Website http://www.semelab.co.uk
A
4.7
V
300
ns
3
mC
nH
Prelim. 07/00
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