Semikron C0BQ-3N2-10 Ceramic chip inductor Datasheet

CERAMIC CHIP INDUCTORS
C0BQ SERIES
1. PART NO. EXPRESSION :
(a) Series code
C 0 B Q - 1 N 0 S - □□
(a)
(c)
(b)
(d)
(b) Category Code
(e)
(c) Inductance code : 1N0 = 1.0nH
(d) Inductance Tolerence : B=± 0.1nH ,C=± 0.2nH ,S=± 0.3nH , H=± 3% ,J=± 5%
(e) 10: Standard
11 ~ 99 : Internal control number
2. C0NFIGURATION & DIMENSIONS :
A
D
B
C
L
H
G
Recommended PC Board Pattern
Unit:m/m
A
B
0.60± 0.03
C
L
D
0.30± 0.03 0.30± 0.03 0.10± 0.05
0.80 Ref.
G
H
0.20~0.30
0.25~0.40
3. SCHEMATIC :
4. MATERIALS :
b
a
Ag(100%)
Ni(100%)-1.5um(min.)
(a) Body : ceramic ( Pb Free )
(b) Termination : ( Pb Free )
Sn(100%)-3.0um(min.)
5. GENERAL SPECIFICATION :
a) Operating temp. : -40° C to +105° C ( including self-temperature. rise )
b) Storage condition (component in its packaging)
i) Temperature : -10 to 40° C
ii) Humidity : 60%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
CERAMIC CHIP INDUCTORS
C0BQ SERIES
6. ELECTRICAL CHARACTERISTICS :
Part Number
Inductance
(nH)
Test
Tolerance Frequency
( MHz )
Q
Min
Rated Current
Q(Typ.) Frequency(Hz)
500M
800M
1.8G
2.0G
2.4G
DCR
(Ω)
SRF
( MHz )
(mA) Max
Max.
Min.
10000
C0BQ-0N6□-10
0.6
B,C,S
500
14
>35
>47
>75
>80
>88
900
0.06
C0BQ-0N7□-10
0.7
B,C,S
500
14
>35
>47
>75
>80
>88
900
0.06
10000
C0BQ-0N8□-10
0.8
B,C,S
500
14
>35
>47
>75
>80
>88
900
0.06
10000
C0BQ-0N9□-10
0.9
B,C,S
500
14
>35
>47
>75
>80
>88
900
0.06
10000
C0BQ-1N0□-10
1.0
B,C,S
500
14
>35
>47
>75
>80
>88
850
0.07
10000
C0BQ-1N1□-10
1.1
B,C,S
500
14
>35
>47
>75
>80
>88
850
0.07
10000
C0BQ-1N2□-10
1.2
B,C,S
500
14
35
47
75
80
88
800
0.08
10000
C0BQ-1N3□-10
1.3
B,C,S
500
14
32
43
70
74
82
760
0.09
10000
C0BQ-1N4□-10
1.4
B,C,S
500
14
29
39
63
67
75
640
0.12
10000
C0BQ-1N5□-10
1.5
B,C,S
500
14
27
36
59
62
69
600
0.15
10000
C0BQ-1N6□-10
1.6
B,C,S
500
14
25
33
54
57
63
510
0.19
10000
C0BQ-1N7□-10
1.7
B,C,S
500
14
25
32
52
54
61
680
0.11
10000
C0BQ-1N8□-10
1.8
B,C,S
500
14
25
32
51
53
59
640
0.12
10000
C0BQ-1N9□-10
1.9
B,C,S
500
14
24
31
50
53
58
620
0.13
10000
C0BQ-2N0□-10
2.0
B,C,S
500
14
24
31
50
53
58
600
0.15
10000
24
31
50
53
58
550
0.16
10000
C0BQ-2N1□-10
2.1
B,C,S
500
14
C0BQ-2N2□-10
2.2
B,C,S
500
14
24
31
50
53
58
500
0.20
10000
C0BQ-2N3□-10
2.3
B,C,S
500
14
24
31
49
52
58
460
0.24
10000
C0BQ-2N4□-10
2.4
B,C,S
500
14
22
28
45
48
53
430
0.26
10000
C0BQ-2N5□-10
2.5
B,C,S
500
14
22
29
46
49
54
415
0.28
10000
C0BQ-2N6□-10
2.6
B,C,S
500
14
21
27
44
46
51
405
0.30
10000
C0BQ-2N7□-10
2.7
B,C,S
500
14
20
26
41
43
48
400
0.32
10000
20
26
41
43
47
500
0.20
9500
C0BQ-2N8□-10
2.8
B,C,S
500
14
C0BQ-2N9□-10
2.9
B,C,S
500
14
20
26
41
43
47
480
0.22
9300
C0BQ-3N0□-10
3.0
B,C,S
500
14
20
26
41
43
47
460
0.24
9100
C0BQ-3N1□-10
3.1
B,C,S
500
14
20
26
41
43
47
450
0.25
8900
C0BQ-3N2□-10
3.2
B,C,S
500
14
20
26
40
43
47
415
0.28
8700
C0BQ-3N3□-10
3.3
B,C,S
500
14
20
26
40
43
47
415
0.28
8600
C0BQ-3N4□-10
3.4
B,C,S
500
14
20
25
40
43
47
410
0.29
8400
C0BQ-3N5□-10
3.5
B,C,S
500
14
20
25
40
42
46
405
0.30
8200
19
25
40
42
46
400
0.32
8100
C0BQ-3N6□-10
3.6
B,C,S
500
14
C0BQ-3N7□-10
3.7
B,C,S
500
14
19
25
40
42
46
370
0.36
8000
C0BQ-3N8□-10
3.8
B,C,S
500
14
19
25
39
41
45
355
0.40
7800
C0BQ-3N9□-10
3.9
B,C,S
500
14
19
25
39
41
45
350
0.41
7700
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
CERAMIC CHIP INDUCTORS
Part Number
Inductance
(nH)
Test
Tolerance Frequency
( MHz )
Q
Min
C0BQ SERIES
Rated Current
Q(Typ.) Frequency(Hz)
500M
800M
1.8G
2.0G
2.4G
DCR
(Ω)
SRF
( MHz )
(mA) Max
Max.
Min.
7600
C0BQ-4N0□-10
4.0
B,C,S
500
14
18
25
39
41
45
335
0.44
C0BQ-4N1□-10
4.1
B,C,S
500
14
19
25
39
41
45
320
0.48
7500
C0BQ-4N2□-10
4.2
B,C,S
500
14
18
24
37
39
43
320
0.48
7300
C0BQ-4N3□-10
4.3
C,S
500
14
18
24
37
39
43
320
0.48
6500
C0BQ-4N6□-10
4.6
C,S
500
14
18
24
37
39
42
360
0.39
6500
C0BQ-4N7□-10
4.7
C,S
500
14
19
24
37
39
42
350
0.42
6400
C0BQ-5N0□-10
5.0
C,S
500
14
19
24
37
39
42
335
0.44
6200
C0BQ-5N1□-10
5.1
C,S
500
14
19
24
37
39
42
330
0.45
6100
C0BQ-5N4□-10
5.4
C,S
500
14
18
24
36
38
42
315
0.49
5900
C0BQ-5N6□-10
5.6
C,S
500
14
18
24
36
37
41
325
0.47
5500
C0BQ-5N9□-10
5.9
C,S
500
14
18
23
35
36
39
325
0.47
5500
C0BQ-6N2□-10
6.2
C,S
500
14
18
23
35
36
39
305
0.52
5100
C0BQ-6N5□-10
6.5
C,S
500
14
18
23
35
36
39
305
0.52
5100
C0BQ-6N8□-10
6.8
H,J
500
14
18
23
35
36
39
305
0.55
4800
C0BQ-7N1□-10
7.1
H,J
500
14
18
23
35
36
39
305
0.55
4800
18
23
34
35
38
305
0.55
4600
C0BQ-7N5□-10
7.5
H,J
500
14
C0BQ-7N8□-10
7.8
H,J
500
14
17
22
33
34
36
310
0.51
4600
C0BQ-8N2□-10
8.2
H,J
500
14
17
22
33
34
36
290
0.57
4300
C0BQ-8N5□-10
8.5
H,J
500
14
17
22
33
34
36
290
0.57
4300
C0BQ-9N1□-10
9.1
H,J
500
14
17
22
33
34
36
270
0.65
4000
C0BQ-9N4□-10
9.4
H,J
500
14
17
22
33
34
36
250
0.73
4000
C0BQ-10N□-10
10.0
H,J
500
14
17
22
33
34
36
230
0.85
3800
17
22
31
32
33
230
0.85
3300
C0BQ-12N□-10
12.0
H,J
500
14
C0BQ-15N□-10
15.0
H,J
500
14
17
21
28
29
29
220
0.89
2600
C0BQ-18N□-10
18.0
H,J
500
14
16
21
26
26
25
205
1.05
2300
C0BQ-22N□-10
22.0
H,J
500
14
16
21
26
26
24
190
1.29
1900
□ : Inductance Tolerence : B=±0.1nH ,C=±0.2nH ,S=±0.3nH , H=±3% ,J=±5%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
CERAMIC CHIP INDUCTORS
C0BQ SERIES
7. CHARACTERISTICS CURVES :
Impedance v.s. Frequency Characteristics
HCI0603BQ Z
10000
VS
Fr eq.
IMPEDANCE(Ohm)
1000
22n
10n
100
10
6.8n
3.3n
1
0. 1
1
10
100
1000
10000
FREQUENCY(MHz)
Inductance v.s. Frequency Characteristics
HCI0603BQ L VS Freq.
INDUCTANCE(nH)
1000
100
22n
10n
10
6.8n
3.3n
1
0. 1
1
10
100
1 000
10000
FREQUENCY(MHz)
Q v.s. Frequency Characteristics
HCI0603BQ Q VS Freq.
100
Q
3.3n
6.8n
10n
10
22n
1
1
10
100
1000
10000
FREQUENCY(MHz)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
CERAMIC CHIP INDUCTORS
C0BQ SERIES
8. SOLDERING AND MOUNTING :
8-1. Recommended PC Board Pattern
Unit:m/m
L
H
G
L
G
H
0.80
0.20~0.30
0.25~0.40
PC board should be designed so that products are not sufficient
under mechanical stress as warping the board.
Products shall be positioned in the sideway direction against
the mechanical stress to prevent failure.
8-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
8-2.1 Lead Free Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
8-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process Control limitations. In the event that
a soldering iron must be employed the following precautions are reCommended.
Note :
d) 1.0mm tip diameter (max)
a) Preheat circuit and products to 150° C.
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
b) 350° C tip temperature (max)
f) Limit soldering time to 4 ~ 5 secs.
c) Never Contact the ceramic with the iron tip
Soldering
Natural
Cooling
20~40s
TP(26 0° C/40 s max.)
217
200
150
60~150s
60~180s
25
4 80s max.
Preheating
TEMPERATURE ° C
TEMPERATURE ° C
Preheating
Soldering
Within 4~5s
Natural
Cooling
350
150
Time(sec.)
O ve r 1min.
Figure 1. Re-flow Soldering : 3 times max
G rad ual
C0oling
Figure 2. Hand Soldering : 1 times max
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
CERAMIC CHIP INDUCTORS
C0BQ SERIES
8-3. Solder Volume
Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume
may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3.
Minimum fillet height = soldering thickness + 25% product height
Upper limit
t
ReC0mmendable
Figure 3
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
CERAMIC CHIP INDUCTORS
C0BQ SERIES
9. PACKAGING INFORMATION :
9-1. Reel Dimension
A
2± 0.5
13.5± 0.5
R10.5
R0.5
C
D
B
R1.9
120°
7" x 8mm
Type
A(mm)
B(mm)
C(mm)
D(mm)
7" x 8mm
9.0± 0.5
60± 2
13.52± 0.5
178.0± 2.0
9-2 Tape Dimension / 8mm
Material : Paper
D:1.5+0.1-0.0
Po:4± 0.1
Bo
Ao
P
W:8.0± 0.3
E:1.75± 0.1
F:3.5± 0.05
t
Size
Bo(mm)
Ao(mm)
Ko(mm)
P(mm)
t(mm)
C0
0.70± 0.06
0.40± 0.06
0.45 max
2.0± 0.05
0.45 max
Ko
9-3. Packaging Quantity
Chip Size
C0
Chip / Reel
15000
Inner Box
75000
Middle Box
375000
Carton
750000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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PG. 7
CERAMIC CHIP INDUCTORS
C0BQ SERIES
9-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° C to 180° C
Top cover tape
Room Temp.
(° C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Recommended products should be used within 12 months from the time of delivery.
b) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
28.01.2015
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8