NCP4686 400 mA, High Accuracy, Low Input Voltage, Low Dropout Regulator The NCP4686 is CMOS Linear voltage regulators with 400 mA output current capability. The device has very high output voltage accuracy, low supply current and low ON−resistance transistor. The NCP4686 is easy to use and includes output current fold−back protection and a fully integrated constant slope circuit as a soft−start circuit. Due to it inrush current is minimized and no output voltage overshoots are there. A Chip Enable function is included to save power by lowering supply current. Features • • • • • • • • • • • • Operating Input Voltage Range: 1.0 V to 3.6 V Output Voltage Range: 0.7 V to 1.8 V (available in 0.1 V steps) Output Voltage Accuracy: ±0.8% (VOUT ≥ 1.0 V, TA = 25°C) Supply Current: 48 mA Dropout Voltage: 0.22 V (VOUT = 1.5 V) Line Regulation: 0.1%/V Typ. Ripple Rejection: Typ. 60 dB (f = 10 kHz) Stable with Ceramic Capacitors: 1 mF or more Current Fold Back Protection Build−in Constant Slope Circuit Available in XDFN6 1.2 x 1.2 mm, SC−70, SOT23 Packages These are Pb−Free Devices Typical Applications • • • • Battery−powered Equipment Networking and Communication Equipment Cameras, DVRs, STB and Camcorders Home Appliances VIN VOUT GND SC−70 CASE 419A SOT−23−5 CASE 1212 XDFN6 CASE 711AA XX, XXX, XXXX M, MM A Y W G XXX XMM XXX M XX MM = Specific Device Code = Date Code = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 14 of this data sheet. VOUT CE C1 1m MARKING DIAGRAMS (*Note: Microdot may be in either location) NCP4686x VIN http://onsemi.com C2 1m Figure 1. Typical Application Schematics © Semiconductor Components Industries, LLC, 2011 May, 2011 − Rev. 0 1 Publication Order Number: NCP4686/D NCP4686 VIN VOUT VIN VOUT Vref Vref Current Limit CE Current Limit CE GND GND NCP4686Hxxxx NCP4686Dxxxx Figure 2. Simplified Schematic Block Diagram PIN FUNCTION DESCRIPTION Pin No. XDFN6 Pin No. SC−70 Pin No. SOT23 Pin Name 6 4 5 VOUT Output pin 2 3 2 GND Ground 3 1 3 CE Chip enable pin (Active “H”) 4 5 1 VIN Input pin 1 2 4 NC No connection 5 − − NC No connection Description *Please refer to package dimensions section on Page 15 on this data sheet for pin numbers associated with different package. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN 4.0 V Output Voltage VOUT −0.3 to VIN + 0.3 V Chip Enable Input VCE −0.3 to 4.0 V Output Current IOUT 500 mA PD 400 mW Input Voltage (Note 1) Power Dissipation XDFN1212 Power Dissipation SC−70 380 Power Dissipation SOT23 420 Junction Temperature TJ −40 to 150 °C Storage Temperature TSTG −55 to 125 °C TA −40 to +85 °C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Operating Ambient Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. http://onsemi.com 2 NCP4686 THERMAL CHARACTERISTICS Symbol Value Unit Thermal Characteristics, XDFN6 1.2 x 1.2 mm Thermal Resistance, Junction−to−Air Rating RqJA 250 °C/W Thermal Characteristics, SOT23 Thermal Resistance, Junction−to−Air RqJA 238 °C/W Thermal Characteristics, SC−70 Thermal Resistance, Junction−to−Air RqJA 263 °C/W ELECTRICAL CHARACTERISTICS −40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 0.1 mF, unless otherwise noted. Typical values are at TA = +25°C. Parameter Test Conditions Operating Input Voltage Output Voltage TA = +25 °C VOUT ≥ 1.0 V −40°C ≤ TA ≤ 85°C Output Voltage Temp. Coefficient Symbol Min VIN VOUT Typ Max Unit 1.0 3.6 V x0.992 x1.008 V VOUT < 1.0 V −8 8 mV VOUT ≥ 1.0 V x0.983 x1.017 V VOUT < 1.0 V −17 17 mV −40°C ≤ TA ≤ 85°C ΔVOUT / ΔTA ±60 Line Regulation VOUT(NOM) + 0.5 V ≤ VIN ≤ 3.6 V, VIN ≥ 1.3 V LineReg 0.10 0.25 %/V Load Regulation IOUT = 1 mA to 400 mA LoadReg 25 45 mV VDO 0.48 0.62 V 0.8 V ≤ VOUT < 0.9 V 0.40 0.54 0.9 V ≤ VOUT < 1.0 V 0.36 0.47 1.0 V ≤ VOUT < 1.2 V 0.32 0.45 1.2 V ≤ VOUT < 1.5 V 0.28 0.38 0.22 0.31 Dropout Voltage IOUT = 400 mA 0.7 V ≤ VOUT < 0.8 V 1.5 V ≤ VOUT Output Current Short Current Limit IOUT VOUT = 0 V Quiescent Current IQ 48 75 mA 0.1 8.0 mA ISTB CE Pin Threshold Voltage CE Input Voltage “H” VCEH Low Output N−channel Tr. On Resistance mA 110 VCE = 0 V, TA = 25°C Output Noise Voltage 400 ISC Standby Current Power Supply Rejection Ratio ppm/°C mA 0.9 V CE Input Voltage “L” VCEL VIN = VOUT + 1.0 V, ΔVIN = 0.2 Vpk−pk, IOUT = 30 mA, f = 10 kHz PSRR 60 dB f = 10 Hz to 100 kHz, VOUT = 0.7 V, IOUT = 30 mA VN 30 mVrms VIN = 2 V, VCE = 0 V, NCP4686D only RLOW 43 W http://onsemi.com 3 0.4 NCP4686 TYPICAL CHARACTERISTICS 0.9 1.4 0.8 1.2 0.7 VIN = 1.1 V 1.0 VOUT (V) VOUT (V) 0.6 0.5 0.4 2.8 V 3.6 V 1.8 V 0.3 0.8 0.6 2.2 V 3.6 V 2.8 V 0.4 0.2 0.2 0.1 0 VIN = 1.5 V 0 100 200 300 400 500 IOUT (mA) 600 700 0 800 0 100 Figure 3. Output Voltage vs. Output Current 0.8 V Version (TJ = 255C) 200 300 400 500 IOUT (mA) 700 800 Figure 4. Output Voltage vs. Output Current 1.2 V Version (TJ = 255C) 2.0 0.50 1.8 VIN = 2.1 V 1.6 0.40 TJ = 85°C 1.2 2.8 V 1.0 VDO (V) 1.4 VOUT (V) 600 3.6 V 0.8 25°C 0.30 −40°C 0.20 0.6 0.4 0.10 0.2 0 0 100 200 300 400 500 IOUT (mA) 600 700 0 800 0 0.35 0.30 0.30 VDO (V) VDO (V) 25°C −40°C 0.20 0.10 0.05 0.05 50 100 150 200 250 250 300 350 400 300 350 0 400 IOUT (mA) TJ = 85°C 0.15 0.10 0 200 0.25 TJ = 85°C 0.15 0 150 Figure 6. Dropout Voltage vs. Output Current 0.8 V Version 0.35 0.20 100 IOUT (mA) Figure 5. Output Voltage vs. Output Current 1.8 V Version (TJ = 255C) 0.25 50 25°C −40°C 0 50 100 150 200 IOUT (mA) Figure 7. Dropout Voltage vs. Output Current 1.2 V Version 250 300 350 Figure 8. Dropout Voltage vs. Output Current 1.8 V Version http://onsemi.com 4 400 NCP4686 TYPICAL CHARACTERISTICS 0.85 0.83 1.23 0.82 1.22 0.81 1.21 0.80 0.79 1.19 1.18 0.77 1.17 0.76 1.16 −40 −20 0 20 40 60 1.15 −40 80 −20 0 20 40 60 80 TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C) Figure 9. Output Voltage vs. Temperature, 0.8 V Version Figure 10. Output Voltage vs. Temperature, 1.2 V Version 1.85 60 VIN = 2.8 V 1.84 50 1.83 1.82 40 1.81 IGND (mA) VOUT (V) 1.20 0.78 0.75 VIN = 2.2 V 1.24 VOUT (V) VOUT (V) 1.25 VIN = 1.8 V 0.84 1.80 1.79 30 20 1.78 1.77 10 1.76 1.75 −40 −20 0 20 40 60 0 80 0 0.6 1.2 1.8 2.4 3 TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 11. Output Voltage vs. Temperature, 2.8 V Version Figure 12. Supply Current vs. Input Voltage, 0.8 V Version 3.6 100 60 90 50 80 70 IGND (mA) IGND (mA) 40 30 20 60 50 40 30 20 10 10 0 0 0 0.6 1.2 1.8 2.4 3 3.6 0 0.6 1.2 1.8 2.4 3 VIN, INPUT VOLTAGE (V) VIN, INPUT VOLTAGE (V) Figure 13. Supply Current vs. Input Voltage, 1.2 V Version Figure 14. Supply Current vs. Input Voltage, 1.8 V Version http://onsemi.com 5 3.6 NCP4686 60 60 50 50 40 40 IGND (mA) IGND (mA) TYPICAL CHARACTERISTICS 30 20 20 10 10 0 −40 −20 0 20 40 60 0 −40 80 20 40 60 80 TJ, JUNCTION TEMPERATURE (°C) Figure 16. Supply Current vs. Temperature, 1.2 V Version 0.9 0.8 0.7 40 0.6 VOUT (V) IGND (mA) 0 TJ, JUNCTION TEMPERATURE (°C) 50 30 20 1 mA 0.5 30 mA 0.4 0.3 IOUT = 50 mA 0.2 10 0.1 0 −40 −20 0 20 40 60 0 80 0 0.6 1.2 1.8 2.4 3 TJ, JUNCTION TEMPERATURE (°C) VIN, INPUT VOLTAGE (V) Figure 17. Supply Current vs. Temperature, 1.8 V Version Figure 18. Output Voltage vs. Input Voltage, 0.8 V Version 3.6 2.0 1.4 1.8 1.2 1.6 1.0 VOUT (V) 1.4 0.8 1 mA 0.6 30 mA 0.4 1.2 1.0 1 mA 0.8 30 mA 0.6 0.4 0.2 0 −20 Figure 15. Supply Current vs. Temperature, 0.8 V Version 60 VOUT (V) 30 0.2 IOUT = 50 mA 0 0.6 1.2 1.8 2.4 VIN, INPUT VOLTAGE (V) 3 0 3.6 IOUT = 50 mA 0 Figure 19. Output Voltage vs. Input Voltage, 1.2 V Version 0.6 1.2 1.8 2.4 VIN, INPUT VOLTAGE (V) 3 Figure 20. Output Voltage vs. Input Voltage, 1.8 V Version http://onsemi.com 6 3.6 NCP4686 100 100 90 90 80 80 70 70 60 PSRR (dB) PSRR (dB) TYPICAL CHARACTERISTICS IOUT = 1 mA 50 40 30 mA 30 20 0 0.1 1 10 150 mA 10 100 1000 0 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) Figure 21. PSRR, 0.8 V Version, VIN = 1.8 V Figure 22. PSRR, 1.2 V Version, VIN = 2.2 V 1000 1.2 100 90 1.0 80 60 VN (mVrms/√Hz) 70 PSRR (dB) 30 mA 40 20 150 mA IOUT = 1 mA 50 30 10 IOUT = 1 mA 50 40 30 mA 30 20 0 0.1 1 10 0.8 0.6 0.4 0.2 150 mA 10 100 1000 0 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 23. PSRR, 1.8 V Version, VIN = 2.8 V Figure 24. Output Voltage Noise, 0.8 V Version, VIN = 1.8 V, IOUT = 30 mA 1.6 1.8 1.4 1.6 1.4 VN (mVrms/√Hz) 1.2 VN (mVrms/√Hz) 60 1.0 0.8 0.6 1.2 1.0 0.8 0.6 0.4 0.4 0.2 0.2 0 0.01 0.1 1 10 100 1000 0 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) FREQUENCY (kHz) Figure 25. Output Voltage Noise, 1.2 V Version, VIN = 2.2 V, IOUT = 30 mA Figure 26. Output Voltage Noise, 1.8 V Version, VIN = 2.8 V, IOUT = 30 mA http://onsemi.com 7 NCP4686 TYPICAL CHARACTERISTICS 3.3 2.8 2.3 VIN (V) VOUT (V) 1.8 0.815 0.810 0.805 0.800 0.795 0.790 0.785 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 27. Line Transients, 0.8 V Version, tR = tF = 5 ms, IOUT = 30 mA 3.7 3.2 2.7 VIN (V) VOUT (V) 2.2 1.215 1.210 1.205 1.200 1.195 1.190 1.185 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 28. Line Transients, 1.2 V Version, tR = tF = 5 ms, IOUT = 30 mA 4.3 3.8 3.3 1.815 VIN (V) VOUT (V) 2.8 1.810 1.805 1.800 1.795 1.790 1.785 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 29. Line Transients, 1.8 V Version, tR = tF = 5 ms, IOUT = 30 mA http://onsemi.com 8 NCP4686 TYPICAL CHARACTERISTICS 150 100 50 IOUT (mA) VOUT (V) 0 0.82 0.81 0.80 0.79 0.78 0.77 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 30. Load Transients, 0.8 V Version, IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 1.8 V 150 100 50 IOUT (mA) VOUT (V) 0 1.24 1.22 1.20 1.18 1.16 1.14 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 31. Load Transients, 1.2 V Version, IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 2.2 V 150 100 50 IOUT (mA) VOUT (V) 0 1.84 1.82 1.80 1.78 1.76 1.74 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 32. Load Transients, 1.8 V Version, IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 2.8 V http://onsemi.com 9 NCP4686 TYPICAL CHARACTERISTICS 600 400 200 IOUT (mA) VOUT (V) 0 0.90 0.85 0.80 0.75 0.70 0.65 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 33. Load Transients, 0.8 V Version, IOUT = 1 – 400 mA, tR = tF = 0.5 ms, VIN = 1.8 V 600 400 200 IOUT (mA) VOUT (V) 0 1.90 1.85 1.80 1.75 1.70 1.65 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 34. Load Transients, 1.8 V Version, IOUT = 1 – 400 mA, tR = tF = 0.5 ms, VIN = 2.8 V 600 400 200 IOUT (mA) VOUT (V) 0 1.30 1.25 1.20 1.15 1.10 1.05 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 35. Load transients, 1.2 V version, IOUT = 1 – 400 mA, tR = tF = 0.5 ms, VIN = 2.2 V http://onsemi.com 10 NCP4686 TYPICAL CHARACTERISTICS 45 30 15 IOUT (mA) VOUT (V) 0 0.84 0.82 0.80 0.78 0.76 0.74 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 36. Load Transients, 0.8 V Version, IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 1.8 V 45 30 15 IOUT (mA) VOUT (V) 0 1.24 1.22 1.20 1.18 1.16 1.14 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 37. Load Transients, 1.2 V Version, IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 2.2 V 45 30 15 IOUT (mA) VOUT (V) 0 1.84 1.82 1.80 1.78 1.76 1.74 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 38. Load Transients, 1.8 V Version, IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 2.8 V http://onsemi.com 11 NCP4686 TYPICAL CHARACTERISTICS Chip Enable 2.7 1.8 0.9 VCE (V) VOUT (V) 0 0.8 IOUT = 30 mA 0.6 0.4 IOUT = 1 mA IOUT = 400 mA 0.2 0 −0.2 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 39. Start−Up, 0.8 V Version, VIN = 1.8 V 3.3 Chip Enable 2.2 1.1 VCE (V) VOUT (V) 0 2.0 1.5 1.0 IOUT = 1 mA 0.5 IOUT = 30 mA IOUT = 400 mA 0 −0.5 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 40. Start−Up, 1.2 V Version, VIN = 2.2 V 3.3 Chip Enable 2.2 1.1 VCE (V) VOUT (V) 0 2.0 1.5 IOUT = 1 mA 1.0 IOUT = 30 mA 0.5 IOUT = 400 mA 0 −0.5 0 20 40 60 80 100 120 140 160 180 200 t (ms) Figure 41. Start−up, 1.8 V Version, VIN = 2.8 V http://onsemi.com 12 NCP4686 TYPICAL CHARACTERISTICS 2.7 1.8 0.9 0.8 0 VCE (V) VOUT (V) Chip Enable IOUT = 400 mA 0.6 IOUT = 30 mA 0.4 IOUT = 1 mA 0.2 0 −0.2 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 42. Shutdown, 0.8 V Version, VIN = 1.8 V 3.3 2.2 1.1 0 VCE (V) VOUT (V) Chip Enable 2.0 1.5 IOUT = 400 mA 1.0 IOUT = 30 mA 0.5 IOUT = 1 mA 0 −0.5 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 43. Shutdown, 1.2 V Version, VIN = 2.2 V 3.3 2.2 1.1 0 VCE (V) VOUT (V) Chip Enable 2.0 1.5 IOUT = 400 mA 1.0 IOUT = 30 mA 0.5 IOUT = 1 mA 0 −0.5 0 40 80 120 160 200 240 280 320 360 400 t (ms) Figure 44. Shutdown, 1.8 V Version, VIN = 2.8 V http://onsemi.com 13 NCP4686 APPLICATION INFORMATION A typical application circuits for NCP4686 series is shown in Figure 45. NCP4686x VIN VIN VOUT VOUT CE C1 1m also prevents overshoot of the output voltage at start up. The Constant slope circuit is fully built in and no external component is needed. Since the Start up time and output voltage slope is defined internally, there is no way to change it. Starting up into bigger output capacitors doesn’t cause problems due to the combination of the constant slope and current limit circuits. C2 1m GND Current Limit This regulator includes fold−back type current limit circuit. This type of protection doesn’t limit current up to current capability in normal operation, but when over current occurs, the output voltage and current decrease until the over current condition ends. Typical characteristics of this protection type can be observed in the Output Voltage versus Output Current graphs shown in the typical characteristics chapter of this datasheet. Figure 45. Typical Application Schematics Input Decoupling Capacitor (C1) A 1 mF ceramic input decoupling capacitor should be connected as close as possible to the input and ground pin of the NCP4686. Higher values and lower ESR improves line transient response. Output Discharger The NCP4686D version includes a transistor between VOUT and GND that is used for faster discharging of the output capacitor. This function is activated when the IC goes into disable mode. Output Decoupling Capacitor (C2) A 1 mF ceramic output decoupling capacitor is enough to achieve stable operation of the IC. If a tantalum capacitor is used, and its ESR is high, loop oscillation may result. The capacitors should be connected as close as possible to the output and ground pins. Larger values and lower ESR improves dynamic parameters. Thermal As power across the IC increase, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and also the ambient temperature affect the rate of temperature increase for the part. When the device has good thermal conductivity through the PCB the junction temperature will be relatively low in high power dissipation applications. Enable Operation The enable pin CE may be used for turning the regulator on and off. The IC is switched on when a high level voltage is applied to the CE pin. The enable pin has an internal pull down current source. If the enable function is not needed connect CE pin to VIN. PCB Layout Make the VIN and GND line as large as practical. If their impedance is high, noise pickup or unstable operation may result. Connect capacitors C1 and C2 as close as possible to the IC, and make wiring as short as possible. Constant Slope Circuit The constant slope circuit is used as a soft start circuit that allows the output voltage to start up slowly with a defined slope. This circuit minimizes inrush current at start up and ORDERING INFORMATION Device Nominal Output Voltage Description Marking Package Shipping† NCP4686DSN08T1G 0.8 V Auto discharge CAB SOT23−5 (Pb−Free) 3000 / Tape & Reel NCP4686DSN10T1G 1.0 V Auto discharge CAD SOT23−5 (Pb−Free) 3000 / Tape & Reel NCP4686DSN12T1G 1.2 V Auto discharge CAF SOT23−5 (Pb−Free) 3000 / Tape & Reel NCP4686DSN18T1G 1.8 V Auto discharge CAM SOT23−5 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *To order other package and voltage variants, please contact your ON Semiconductor sales representative. http://onsemi.com 14 NCP4686 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE K A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N J C H K http://onsemi.com 15 INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NCP4686 PACKAGE DIMENSIONS SOT−23 5−LEAD CASE 1212−01 ISSUE A A 5 E 1 L1 A1 4 2 L 3 5X e A2 0.05 S B D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSIONS: MILLIMETERS. 3. DATUM C IS THE SEATING PLANE. A E1 b 0.10 C M C B S A S C RECOMMENDED SOLDERING FOOTPRINT* 3.30 DIM A A1 A2 b c D E E1 e L L1 5X 0.85 5X 0.95 PITCH 0.56 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 16 MILLIMETERS MIN MAX --1.45 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.70 3.10 2.50 3.10 1.50 1.80 0.95 BSC 0.20 --0.45 0.75 NCP4686 PACKAGE DIMENSIONS XDFN6 1.2x1.2, 0.4P CASE 711AA−01 ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25mm FROM TERMINAL TIPS. 4. COPLANARITY APPLIES TO ALL OF THE TERMINALS. A B D ÍÍÍ ÍÍÍ ÍÍÍ E DIM A A1 b C D E e L 0.05 C 2X 2X 0.05 C TOP VIEW A 0.05 C 0.05 C A1 SIDE VIEW NOTE 4 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.13 0.23 0.20 0.30 1.20 BSC 1.20 BSC 0.40 BSC 0.37 0.48 RECOMMENDED MOUNTING FOOTPRINT* SEATING PLANE 6X 6X 0.22 0.66 PACKAGE OUTLINE e 1 3 1.50 C 6X L 0.40 PITCH DIMENSIONS: MILLIMETERS 6 4 6X b 0.05 BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. M C A B NOTE 3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 17 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NCP4686/D