ATMEL ATTINY13A-MMU 8-bit microcontroller with 1k bytes in-system programmable flash Datasheet

Features
• High Performance, Low Power AVR® 8-Bit Microcontroller
• Advanced RISC Architecture
•
•
•
•
•
•
•
•
– 120 Powerful Instructions – Most Single Clock Cycle Execution
– 32 x 8 General Purpose Working Registers
– Fully Static Operation
– Up to 20 MIPS Througput at 20 MHz
High Endurance Non-volatile Memory segments
– 1K Bytes of In-System Self-programmable Flash program memory
– 64 Bytes EEPROM
– 64 Bytes Internal SRAM
– Write/Erase Cycles: 10,000 Flash/100,000 EEPROM
– Data retention: 20 Years at 85°C/100 Years at 25°C (see page 6)
– Programming Lock for Self-Programming Flash & EEPROM Data Security
Peripheral Features
– One 8-bit Timer/Counter with Prescaler and Two PWM Channels
– 4-channel, 10-bit ADC with Internal Voltage Reference
– Programmable Watchdog Timer with Separate On-chip Oscillator
– On-chip Analog Comparator
Special Microcontroller Features
– debugWIRE On-chip Debug System
– In-System Programmable via SPI Port
– External and Internal Interrupt Sources
– Low Power Idle, ADC Noise Reduction, and Power-down Modes
– Enhanced Power-on Reset Circuit
– Programmable Brown-out Detection Circuit with Software Disable Function
– Internal Calibrated Oscillator
I/O and Packages
– 8-pin PDIP/SOIC: Six Programmable I/O Lines
– 10-pad MLF: Six Programmable I/O Lines
– 20-pad MLF: Six Programmable I/O Lines
Operating Voltage:
– 1.8 – 5.5V
Speed Grade:
– 0 – 4 MHz @ 1.8 – 5.5V
– 0 – 10 MHz @ 2.7 – 5.5V
– 0 – 20 MHz @ 4.5 – 5.5V
Industrial Temperature Range
Low Power Consumption
– Active Mode:
• 190 µA at 1.8 V and 1 MHz
– Idle Mode:
• 24 µA at 1.8 V and 1 MHz
8-bit
Microcontroller
with 1K Bytes
In-System
Programmable
Flash
ATtiny13A
Summary
Rev. 8126ES–AVR–07/10
1. Pin Configurations
Figure 1-1.
Pinout of ATtiny13A
8-PDIP/SOIC
(PCINT5/RESET/ADC0/dW) PB5
(PCINT3/CLKI/ADC3) PB3
(PCINT4/ADC2) PB4
GND
1
2
3
4
8
7
6
5
VCC
PB2 (SCK/ADC1/T0/PCINT2)
PB1 (MISO/AIN1/OC0B/INT0/PCINT1)
PB0 (MOSI/AIN0/OC0A/PCINT0)
15
14
13
12
11
6
7
8
9
10
1
2
3
4
5
VCC
PB2 (SCK/ADC1/T0/PCINT2)
DNC
PB1 (MISO/AIN1/OC0B/INT0/PCINT1)
PB0 (MOSI/AIN0/OC0A/PCINT0)
DNC
DNC
GND
DNC
DNC
(PCINT5/RESET/ADC0/dW) PB5
(PCINT3/CLKI/ADC3) PB3
DNC
DNC
(PCINT4/ADC2) PB4
20
19
18
17
16
DNC
DNC
DNC
DNC
DNC
20-QFN/MLF
NOTE: Bottom pad should be soldered to ground.
DNC: Do Not Connect
10-QFN/MLF
(PCINT5/RESET/ADC0/dW) PB5
(PCINT3/CLKI/ADC3) PB3
DNC
(PCINT4/ADC2) PB4
GND
1
2
3
4
5
10
9
8
7
6
VCC
PB2 (SCK/ADC1/T0/PCINT2)
DNC
PB1 (MISO/AIN1/OC0B/INT0/PCINT1)
PB0 (MOSI/AIN0/OC0A/PCINT0)
NOTE: Bottom pad should be soldered to ground.
DNC: Do Not Connect
2
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
1.1
1.1.1
Pin Description
VCC
Supply voltage.
1.1.2
GND
Ground.
1.1.3
Port B (PB5:PB0)
Port B is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The
Port B output buffers have symmetrical drive characteristics with both high sink and source
capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up
resistors are activated. The Port B pins are tri-stated when a reset condition becomes active,
even if the clock is not running.
Port B also serves the functions of various special features of the ATtiny13A as listed on page
55.
1.1.4
RESET
Reset input. A low level on this pin for longer than the minimum pulse length will generate a
reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 18-4 on page 120. Shorter pulses are not guaranteed to
generate a reset.
The reset pin can also be used as a (weak) I/O pin.
3
8126ES–AVR–07/10
2. Overview
The ATtiny13A is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC
architecture. By executing powerful instructions in a single clock cycle, the ATtiny13A achieves
throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.
2.1
Block Diagram
Figure 2-1.
Block Diagram
8-BIT DATABUS
STACK
POINTER
SRAM
VCC
PROGRAM
COUNTER
GND
PROGRAM
FLASH
WATCHDOG
OSCILLATOR
CALIBRATED
INTERNAL
OSCILLATOR
WATCHDOG
TIMER
TIMING AND
CONTROL
MCU CONTROL
REGISTER
MCU STATUS
REGISTER
TIMER/
COUNTER0
INSTRUCTION
REGISTER
INSTRUCTION
DECODER
CONTROL
LINES
GENERAL
PURPOSE
REGISTERS
INTERRUPT
UNIT
X
Y
Z
PROGRAMMING
LOGIC
ALU
DATA
EEPROM
STATUS
REGISTER
ADC /
ANALOG COMPARATOR
DATA REGISTER
PORT B
DATA DIR.
REG.PORT B
PORT B DRIVERS
RESET
CLKI
PB[0:5]
4
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
The AVR core combines a rich instruction set with 32 general purpose working registers. All 32
registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent
registers to be accessed in one single instruction executed in one clock cycle. The resulting
architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers.
The ATtiny13A provides the following features: 1K byte of In-System Programmable Flash, 64
bytes EEPROM, 64 bytes SRAM, 6 general purpose I/O lines, 32 general purpose working registers, one 8-bit Timer/Counter with compare modes, Internal and External Interrupts, a 4channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, and three software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM,
Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. The
Power-down mode saves the register contents, disabling all chip functions until the next Interrupt or Hardware Reset. The ADC Noise Reduction mode stops the CPU and all I/O modules
except ADC, to minimize switching noise during ADC conversions.
The device is manufactured using Atmel’s high density non-volatile memory technology. The
On-chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI
serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code
running on the AVR core.
The ATtiny13A AVR is supported with a full suite of program and system development tools
including: C Compilers, Macro Assemblers, Program Debugger/Simulators, and Evaluation kits.
5
8126ES–AVR–07/10
3. About
3.1
Resources
A comprehensive set of drivers, application notes, data sheets and descriptions on development
tools are available for download at http://www.atmel.com/avr.
3.2
Code Examples
This documentation contains simple code examples that briefly show how to use various parts of
the device. These code examples assume that the part specific header file is included before
compilation. Be aware that not all C compiler vendors include bit definitions in the header files
and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details.
3.3
Data Retention
Reliability Qualification results show that the projected data retention failure rate is much less
than 1 PPM over 20 years at 85°C or 100 years at 25°C.
6
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
4. Register Summary
Address
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Page
0x3F
SREG
I
T
H
S
V
N
Z
C
page 9
0x3E
Reserved
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
0x3D
SPL
0x3C
Reserved
–
0x3B
GIMSK
–
INT0
PCIE
–
–
–
–
–
page 47
0x3A
GIFR
–
INTF0
PCIF
–
–
–
–
–
page 48
0x39
TIMSK0
–
–
–
–
OCIE0B
OCIE0A
TOIE0
–
page 75
0x38
TIFR0
–
–
–
–
OCF0B
OCF0A
TOV0
0x37
SPMCSR
–
–
–
CTPB
RFLB
PGWRT
PGERS
–
SELFPR-
page 98
–
PUD
SE
SM1
0x36
OCR0A
0x35
MCUCR
SP[7:0]
page 11
Timer/Counter – Output Compare Register A
page 76
page 75
SM0
–
ISC01
ISC00
pages 33, 47, 57
0x34
MCUSR
–
–
–
–
WDRF
BORF
EXTRF
PORF
page 42
0x33
TCCR0B
FOC0A
FOC0B
–
–
WGM02
CS02
CS01
CS00
page 73
0x32
TCNT0
Timer/Counter (8-bit)
0x31
OSCCAL
Oscillator Calibration Register
0x30
BODCR
–
–
–
–
–
–
BODS
BODSE
page 33
0x2F
TCCR0A
COM0A1
COM0A0
COM0B1
COM0B0
–
–
WGM01
WGM00
page 70
0x2E
DWDR
DWDR[7:0]
0x2D
Reserved
–
0x2C
Reserved
–
0x2B
Reserved
–
0x2A
Reserved
–
0x29
OCR0B
Timer/Counter – Output Compare Register B
0x28
GTCCR
0x27
Reserved
0x26
CLKPR
CLKPCE
–
–
0x25
PRR
–
–
–
0x24
Reserved
–
0x23
Reserved
–
0x22
Reserved
0x21
WDTCR
0x20
Reserved
TSM
–
–
–
page 74
page 27
page 97
page 75
–
–
–
PSR10
page 78
–
CLKPS3
CLKPS2
CLKPS1
CLKPS0
page 28
–
–
–
PRTIM0
PRADC
page 34
WDE
WDP2
WDP1
WDP0
page 42
–
–
WDTIF
WDTIE
WDP3
WDCE
–
–
0x1F
Reserved
0x1E
EEARL
0x1D
EEDR
0x1C
EECR
0x1B
Reserved
–
0x1A
Reserved
–
0x19
Reserved
0x18
PORTB
–
–
PORTB5
0x17
DDRB
–
–
0x16
PINB
–
0x15
PCMSK
0x14
DIDR0
–
–
EEPROM Address Register
page 20
EEPROM Data Register
–
–
EEPM1
EEPM0
page 20
EERIE
EEMPE
EEPE
EERE
page 21
PORTB4
PORTB3
PORTB2
PORTB1
PORTB0
page 57
DDB5
DDB4
DDB3
DDB2
DDB1
DDB0
page 57
–
PINB5
PINB4
PINB3
PINB2
PINB1
PINB0
page 58
–
–
PCINT5
PCINT4
PCINT3
PCINT2
PCINT1
PCINT0
page 48
–
–
ADC0D
ADC2D
ADC3D
ADC1D
AIN1D
AIN0D
pages 81, 95
–
0x13
Reserved
–
0x12
Reserved
–
0x11
Reserved
–
0x10
Reserved
–
0x0F
Reserved
–
0x0E
Reserved
–
0x0D
Reserved
–
0x0C
Reserved
–
0x0B
Reserved
–
0x0A
Reserved
–
0x09
Reserved
0x08
ACSR
ACD
ACBG
ACO
ACI
ACIE
–
ACIS1
ACIS0
page 80
0x07
ADMUX
–
REFS0
ADLAR
–
–
–
MUX1
MUX0
page 92
0x06
ADCSRA
ADEN
ADSC
ADATE
ADIF
ADIE
ADPS2
ADPS1
ADPS0
page 93
0x05
ADCH
ADC Data Register High Byte
0x04
ADCL
ADC Data Register Low Byte
0x03
ADCSRB
0x02
Reserved
–
0x01
Reserved
–
0x00
Reserved
–
–
–
ACME
–
–
–
page 94
page 94
ADTS2
ADTS1
ADTS0
pages 80, 95
7
8126ES–AVR–07/10
Notes:
1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses
should never be written.
2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these
registers, the value of single bits can be checked by using the SBIS and SBIC instructions.ome of the Status Flags are
cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation
the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work
with registers 0x00 to 0x1F only.
8
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
5. Instruction Set Summary
Mnemonics
Operands
Description
Operation
Flags
#Clocks
ARITHMETIC AND LOGIC INSTRUCTIONS
ADD
Rd, Rr
Add two Registers
Rd ← Rd + Rr
Z,C,N,V,H
1
ADC
Rd, Rr
Add with Carry two Registers
Rd ← Rd + Rr + C
Z,C,N,V,H
1
ADIW
Rdl,K
Add Immediate to Word
Rdh:Rdl ← Rdh:Rdl + K
Z,C,N,V,S
2
SUB
Rd, Rr
Subtract two Registers
Rd ← Rd - Rr
Z,C,N,V,H
1
SUBI
Rd, K
Subtract Constant from Register
Rd ← Rd - K
Z,C,N,V,H
1
SBC
Rd, Rr
Subtract with Carry two Registers
Rd ← Rd - Rr - C
Z,C,N,V,H
1
SBCI
Rd, K
Subtract with Carry Constant from Reg.
Rd ← Rd - K - C
Z,C,N,V,H
1
SBIW
Rdl,K
Subtract Immediate from Word
Rdh:Rdl ← Rdh:Rdl - K
Z,C,N,V,S
2
AND
Rd, Rr
Logical AND Registers
Rd ← Rd • Rr
Z,N,V
1
ANDI
Rd, K
Logical AND Register and Constant
Rd ← Rd • K
Z,N,V
1
OR
Rd, Rr
Logical OR Registers
Rd ← Rd v Rr
Z,N,V
1
ORI
Rd, K
Logical OR Register and Constant
Rd ← Rd v K
Z,N,V
1
EOR
Rd, Rr
Exclusive OR Registers
Rd ← Rd ⊕ Rr
Z,N,V
1
COM
Rd
One’s Complement
Rd ← 0xFF − Rd
Z,C,N,V
1
NEG
Rd
Two’s Complement
Rd ← 0x00 − Rd
Z,C,N,V,H
1
SBR
Rd,K
Set Bit(s) in Register
Rd ← Rd v K
Z,N,V
1
CBR
Rd,K
Clear Bit(s) in Register
Rd ← Rd • (0xFF - K)
Z,N,V
1
INC
Rd
Increment
Rd ← Rd + 1
Z,N,V
1
DEC
Rd
Decrement
Rd ← Rd − 1
Z,N,V
1
TST
Rd
Test for Zero or Minus
Rd ← Rd • Rd
Z,N,V
1
CLR
Rd
Clear Register
Rd ← Rd ⊕ Rd
Z,N,V
1
SER
Rd
Set Register
Rd ← 0xFF
None
1
2
BRANCH INSTRUCTIONS
RJMP
k
IJMP
RCALL
k
Relative Jump
PC ← PC + k + 1
None
Indirect Jump to (Z)
PC ← Z
None
2
Relative Subroutine Call
PC ← PC + k + 1
None
3
ICALL
Indirect Call to (Z)
PC ← Z
None
3
RET
Subroutine Return
PC ← STACK
None
4
RETI
Interrupt Return
PC ← STACK
I
4
Compare, Skip if Equal
if (Rd = Rr) PC ← PC + 2 or 3
None
1/2/3
CPSE
Rd,Rr
CP
Rd,Rr
Compare
Rd − Rr
Z, N,V,C,H
1
CPC
Rd,Rr
Compare with Carry
Rd − Rr − C
Z, N,V,C,H
1
CPI
Rd,K
Compare Register with Immediate
Rd − K
Z, N,V,C,H
1
SBRC
Rr, b
Skip if Bit in Register Cleared
if (Rr(b)=0) PC ← PC + 2 or 3
None
1/2/3
SBRS
Rr, b
Skip if Bit in Register is Set
if (Rr(b)=1) PC ← PC + 2 or 3
None
1/2/3
SBIC
P, b
Skip if Bit in I/O Register Cleared
if (P(b)=0) PC ← PC + 2 or 3
None
1/2/3
SBIS
P, b
Skip if Bit in I/O Register is Set
if (P(b)=1) PC ← PC + 2 or 3
None
1/2/3
BRBS
s, k
Branch if Status Flag Set
if (SREG(s) = 1) then PC←PC+k + 1
None
1/2
BRBC
s, k
Branch if Status Flag Cleared
if (SREG(s) = 0) then PC←PC+k + 1
None
1/2
BREQ
k
Branch if Equal
if (Z = 1) then PC ← PC + k + 1
None
1/2
BRNE
k
Branch if Not Equal
if (Z = 0) then PC ← PC + k + 1
None
1/2
BRCS
k
Branch if Carry Set
if (C = 1) then PC ← PC + k + 1
None
1/2
BRCC
k
Branch if Carry Cleared
if (C = 0) then PC ← PC + k + 1
None
1/2
BRSH
k
Branch if Same or Higher
if (C = 0) then PC ← PC + k + 1
None
1/2
BRLO
k
Branch if Lower
if (C = 1) then PC ← PC + k + 1
None
1/2
BRMI
k
Branch if Minus
if (N = 1) then PC ← PC + k + 1
None
1/2
BRPL
k
Branch if Plus
if (N = 0) then PC ← PC + k + 1
None
1/2
BRGE
k
Branch if Greater or Equal, Signed
if (N ⊕ V= 0) then PC ← PC + k + 1
None
1/2
BRLT
k
Branch if Less Than Zero, Signed
if (N ⊕ V= 1) then PC ← PC + k + 1
None
1/2
BRHS
k
Branch if Half Carry Flag Set
if (H = 1) then PC ← PC + k + 1
None
1/2
BRHC
k
Branch if Half Carry Flag Cleared
if (H = 0) then PC ← PC + k + 1
None
1/2
BRTS
k
Branch if T Flag Set
if (T = 1) then PC ← PC + k + 1
None
1/2
BRTC
k
Branch if T Flag Cleared
if (T = 0) then PC ← PC + k + 1
None
1/2
BRVS
k
Branch if Overflow Flag is Set
if (V = 1) then PC ← PC + k + 1
None
1/2
BRVC
k
Branch if Overflow Flag is Cleared
if (V = 0) then PC ← PC + k + 1
None
1/2
BRIE
k
Branch if Interrupt Enabled
if ( I = 1) then PC ← PC + k + 1
None
1/2
BRID
k
Branch if Interrupt Disabled
if ( I = 0) then PC ← PC + k + 1
None
1/2
SBI
P,b
Set Bit in I/O Register
I/O(P,b) ← 1
None
2
CBI
P,b
Clear Bit in I/O Register
I/O(P,b) ← 0
None
2
LSL
Rd
Logical Shift Left
Rd(n+1) ← Rd(n), Rd(0) ← 0
Z,C,N,V
1
LSR
Rd
Logical Shift Right
Rd(n) ← Rd(n+1), Rd(7) ← 0
Z,C,N,V
1
ROL
Rd
Rotate Left Through Carry
Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7)
Z,C,N,V
1
BIT AND BIT-TEST INSTRUCTIONS
9
8126ES–AVR–07/10
Mnemonics
Operands
Description
Operation
Flags
ROR
Rd
Rotate Right Through Carry
Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0)
Z,C,N,V
#Clocks
1
ASR
Rd
Arithmetic Shift Right
Rd(n) ← Rd(n+1), n=0..6
Z,C,N,V
1
SWAP
Rd
Swap Nibbles
Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0)
None
1
BSET
s
Flag Set
SREG(s) ← 1
SREG(s)
1
BCLR
s
Flag Clear
SREG(s) ← 0
SREG(s)
1
BST
Rr, b
Bit Store from Register to T
T ← Rr(b)
T
1
BLD
Rd, b
Bit load from T to Register
Rd(b) ← T
None
1
1
SEC
Set Carry
C←1
C
CLC
Clear Carry
C←0
C
1
SEN
Set Negative Flag
N←1
N
1
CLN
Clear Negative Flag
N←0
N
1
SEZ
Set Zero Flag
Z←1
Z
1
CLZ
Clear Zero Flag
Z←0
Z
1
SEI
Global Interrupt Enable
I←1
I
1
CLI
Global Interrupt Disable
I←0
I
1
SES
Set Signed Test Flag
S←1
S
1
CLS
Clear Signed Test Flag
S←0
S
1
SEV
Set Twos Complement Overflow.
V←1
V
1
CLV
Clear Twos Complement Overflow
V←0
V
1
SET
Set T in SREG
T←1
T
1
CLT
Clear T in SREG
T←0
T
1
SEH
CLH
Set Half Carry Flag in SREG
Clear Half Carry Flag in SREG
H←1
H←0
H
H
1
1
DATA TRANSFER INSTRUCTIONS
MOV
Rd, Rr
Move Between Registers
1
Rd, Rr
Copy Register Word
Rd ← Rr
Rd+1:Rd ← Rr+1:Rr
None
MOVW
None
1
LDI
Rd, K
Load Immediate
Rd ← K
None
1
LD
Rd, X
Load Indirect
Rd ← (X)
None
2
LD
Rd, X+
Load Indirect and Post-Inc.
Rd ← (X), X ← X + 1
None
2
LD
Rd, - X
Load Indirect and Pre-Dec.
X ← X - 1, Rd ← (X)
None
2
LD
Rd, Y
Load Indirect
Rd ← (Y)
None
2
LD
Rd, Y+
Load Indirect and Post-Inc.
Rd ← (Y), Y ← Y + 1
None
2
LD
Rd, - Y
Load Indirect and Pre-Dec.
Y ← Y - 1, Rd ← (Y)
None
2
LDD
Rd,Y+q
Load Indirect with Displacement
Rd ← (Y + q)
None
2
LD
Rd, Z
Load Indirect
Rd ← (Z)
None
2
LD
Rd, Z+
Load Indirect and Post-Inc.
Rd ← (Z), Z ← Z+1
None
2
LD
Rd, -Z
Load Indirect and Pre-Dec.
Z ← Z - 1, Rd ← (Z)
None
2
LDD
Rd, Z+q
Load Indirect with Displacement
Rd ← (Z + q)
None
2
LDS
Rd, k
Load Direct from SRAM
Rd ← (k)
None
2
ST
X, Rr
Store Indirect
(X) ← Rr
None
2
ST
X+, Rr
Store Indirect and Post-Inc.
(X) ← Rr, X ← X + 1
None
2
ST
- X, Rr
Store Indirect and Pre-Dec.
X ← X - 1, (X) ← Rr
None
2
ST
Y, Rr
Store Indirect
(Y) ← Rr
None
2
ST
Y+, Rr
Store Indirect and Post-Inc.
(Y) ← Rr, Y ← Y + 1
None
2
2
ST
- Y, Rr
Store Indirect and Pre-Dec.
Y ← Y - 1, (Y) ← Rr
None
STD
Y+q,Rr
Store Indirect with Displacement
(Y + q) ← Rr
None
2
ST
Z, Rr
Store Indirect
(Z) ← Rr
None
2
2
ST
Z+, Rr
Store Indirect and Post-Inc.
(Z) ← Rr, Z ← Z + 1
None
ST
-Z, Rr
Store Indirect and Pre-Dec.
Z ← Z - 1, (Z) ← Rr
None
2
STD
Z+q,Rr
Store Indirect with Displacement
(Z + q) ← Rr
None
2
STS
k, Rr
Store Direct to SRAM
(k) ← Rr
None
2
Load Program Memory
R0 ← (Z)
None
3
LPM
LPM
Rd, Z
Load Program Memory
Rd ← (Z)
None
3
LPM
Rd, Z+
Load Program Memory and Post-Inc
Rd ← (Z), Z ← Z+1
None
3
Store Program Memory
(z) ← R1:R0
None
SPM
IN
Rd, P
In Port
Rd ← P
None
1
OUT
P, Rr
Out Port
P ← Rr
None
1
PUSH
Rr
Push Register on Stack
STACK ← Rr
None
2
POP
Rd
Pop Register from Stack
Rd ← STACK
None
2
MCU CONTROL INSTRUCTIONS
10
NOP
No Operation
None
1
SLEEP
Sleep
(see specific descr. for Sleep function)
None
1
WDR
BREAK
Watchdog Reset
Break
(see specific descr. for WDR/Timer)
For On-chip Debug Only
None
None
1
N/A
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
6. Ordering Information
Speed (MHz)
20
Notes:
Power Supply (V)
1.8 - 5.5
Ordering Code(1)
Package(2)
Operation Range
8P3
8S2
8S2
8S2
8S1
8S1
8S1
20M1
20M1
10M1(3)
10M1(3)
Industrial
(-40°C to +85°C)(4)
ATtiny13A-SN
ATtiny13A-SNR
ATtiny13A-SS7
ATtiny13A-SS7R
8S2
8S2
8S1
8S1
Industrial
(-40°C to +105°C)(5)
ATtiny13A-SF
ATtiny13A-SFR
8S2
8S2
Industrial
(-40°C to +125°C)(6)
ATtiny13A-PU
ATtiny13A-SU
ATtiny13A-SH
ATtiny13A-SHR
ATtiny13A-SSU
ATtiny13A-SSH
ATtiny13A-SSHR
ATtiny13A-MU
ATtiny13A-MUR
ATtiny13A-MMU(3)
ATtiny13A-MMUR(3)
1. Code indicators:
– H or 7: NiPdAu lead finish
– U, N or F: matte tin
– R: tape & reel
2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS).
3. Topside marking for ATtiny13A:
– 1st Line: T13
– 2nd Line: Axx
– 3rd Line: xxx
4. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities.
5. For typical and Electrical characteristics for this device please consult Appendix A, ATtiny13A Specification at 105°C.
6. For typical and Electrical characteristics for this device please consult Appendix B, ATtiny13A Specification at 125°C.
Package Type
8P3
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S2
8-lead, 0.209" Wide, Plastic Small Outline Package (EIAJ SOIC)
8S1
8-lead, 0.150" Wide, Plastic Gull-Wing Small Outline (JEDEC SOIC)
20M1
20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF)
10M1
10-pad, 3 x 3 x 1 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF)
11
8126ES–AVR–07/10
7. Packaging Information
7.1
8P3
E
1
E1
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
D
e
D1
A2 A
SYMBOL
MIN
NOM
A
b2
b3
b
4 PLCS
Side View
L
0.210
NOTE
2
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
D1
0.005
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
0.100 BSC
eA
0.300 BSC
0.115
3
3
e
L
Notes:
MAX
0.130
4
0.150
2
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
R
12
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
DRAWING NO.
REV.
8P3
B
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
7.2
8S2
C
1
E
E1
L
N
θ
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
SYMBOL
A1
D
SIDE VIEW
MAX
NOM
NOTE
A
1.70
A1
0.05
0.25
b
0.35
0.48
4
C
0.15
0.35
4
D
5.13
5.35
E1
5.18
5.40
E
7.70
8.26
L
0.51
0.85
θ
0°
8°
e
Notes: 1.
2.
3.
4.
MIN
2.16
1.27 BSC
2
3
This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
Mismatch of the upper and lower dies and resin burrs aren't included.
Determines the true geometric position.
Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
Package Drawing Contact:
[email protected]
TITLE
8S2, 8-lead, 0.208” Body, Plastic Small
Outline Package (EIAJ)
GPC
STN
4/15/08
DRAWING NO. REV.
8S2
F
13
8126ES–AVR–07/10
7.3
8S1
3
2
1
H
N
Top View
e
B
A
D
COMMON DIMENSIONS
(Unit of Measure = mm)
Side View
A2
C
L
SYMBOL
MIN
NOM
MAX
A
–
–
1.75
B
–
–
0.51
C
–
–
0.25
D
–
–
5.00
E
–
–
4.00
e
E
End View
NOTE
1.27 BSC
H
–
–
6.20
L
–
–
1.27
Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.
10/10/01
R
14
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
REV.
8S1
A
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
7.4
20M1
D
1
Pin 1 ID
2
SIDE VIEW
E
3
TOP VIEW
A2
D2
A1
A
0.08
1
2
Pin #1
Notch
(0.20 R)
3
COMMON DIMENSIONS
(Unit of Measure = mm)
E2
b
L
e
BOTTOM VIEW
SYMBOL
MIN
NOM
MAX
A
0.70
0.75
0.80
A1
–
0.01
0.05
A2
b
0.18
D
D2
E2
L
0.23
0.30
4.00 BSC
2.45
2.60
2.75
4.00 BSC
2.45
e
Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.
NOTE
0.20 REF
E
Note:
C
2.60
2.75
0.50 BSC
0.35
0.40
0.55
10/27/04
R
2325 Orchard Parkway
San Jose, CA 95131
TITLE
20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm,
2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)
DRAWING NO.
20M1
REV.
A
15
8126ES–AVR–07/10
7.5
10M1
D
y
Pin 1 ID
SIDE VIEW
E
TOP VIEW
A1
A
D1
K
COMMON DIMENSIONS
(Unit of Measure = mm)
1
2
b
E1
e
SYMBOL
MIN
NOM
MAX
A
0.80
0.90
1.00
A1
0.00
0.02
0.05
b
0.18
0.25
0.30
D
2.90
3.00
3.10
D1
1.40
–
1.75
E
2.90
3.00
3.10
E1
2.20
–
2.70
e
L
BOTTOM VIEW
NOTE
0.50
L
0.30
–
0.50
y
–
–
0.08
K
0.20
–
–
Notes: 1. This package conforms to JEDEC reference MO-229C, Variation VEED-5.
2. The terminal #1 ID is a Lasser-marked Feature.
R
16
TITLE
2325 Orchard Parkway 10M1, 10-pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm,
San Jose, CA 95131
1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package
7/7/06
DRAWING NO.
REV.
10M1
A
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
8. Errata
The revision letters in this section refer to the revision of the ATtiny13A device.
8.1
ATtiny13A Rev. G – H
• EEPROM can not be written below 1.9 Volt
1. EEPROM can not be written below 1.9 Volt
Writing the EEPROM at VCC below 1.9 volts might fail.
Problem Fix/Workaround
Do not write the EEPROM when VCC is below 1.9 volts.
8.2
ATtiny13A Rev. E – F
These device revisions were not sampled.
8.3
ATtiny13 Rev. A – D
These device revisions were referred to as ATtiny13/ATtiny13V.
17
8126ES–AVR–07/10
9. Datasheet Revision History
Please note that page numbers in this section refer to the current version of this document and
may not apply to previous versions.
9.1
Rev. 8126E – 07/10
1. Updated description in Section 6.4.2 “CLKPR – Clock Prescale Register” on page 28.
2. Adjusted notes in Table 18-1, “DC Characteristics, TA = -40°C to +85°C,” on page 117.
3. Updated plot order in Section 19. “Typical Characteristics” on page 124, added some
plots, also some headers and figure titles adjusted.
4. Updated Section 6. “Ordering Information” on page 11, added extended temperature
part numbers, as well tape & reel part numbers. Notes adjusted.
5. Updated bit syntax throughout the datasheet, e.g. from CS02:0 to CS0[2:0].
9.2
Rev. 8126D – 11/09
1. Added note “If the RSTDISPL fuse is programmed...” in Startup-up Times Table 6-5
and Table 6-6 on page 26.
2. Added addresses in all Register Description tables and cross-references to Register
Summary.
3. Updated naming convention for -COM bits in tables from Table 11-2 on page 70 to
Table 11-7 on page 72.
4. Updated value for tWD_ERASE in Table 17-8, “Minimum Wait Delay Before Writing the Next
Flash or EEPROM Location,” on page 108.
5. Added NiPdAU note for -SH and -SSH in Section 6. “Ordering Information” on page 11.
9.3
Rev. 8126C – 09/09
1. Added EEPROM errata for rev. G - H on page 17.
2. Added a note about topside marking in Section 6. “Ordering Information” on page 11.
9.4
Rev. 8126B – 11/08
1. Updated order codes on page 11 to reflect changes in material composition.
2. Updated sections:
– “DIDR0 – Digital Input Disable Register 0” on page 81
– “DIDR0 – Digital Input Disable Register 0” on page 95
3. Updated “Register Summary” on page 7.
9.5
Rev. 8126A – 05/08
1. Initial revision, created from document 2535I – 04/08.
2. Updated characteristic plots of section “Typical Characteristics” , starting on page 124.
3. Updated “Ordering Information” on page 11.
4. Updated section:
– “Speed” on page 118
5. Update tables:
– “DC Characteristics, TA = -40°C to +85°C” on page 117
– “Calibration Accuracy of Internal RC Oscillator” on page 119
18
ATtiny13A
8126ES–AVR–07/10
ATtiny13A
– “Reset, Brown-out, and Internal Voltage Characteristics” on page 120
– “ADC Characteristics, Single Ended Channels. TA = -40°C to +85°C” on page 121
– “Serial Programming Characteristics, TA = -40°C to +85°C” on page 122
6. Added description of new function, “Power Reduction Register”:
– Added functional description on page 31
– Added bit description on page 34
– Added section “Supply Current of I/O Modules” on page 124
– Updated Register Summary on page 7
7. Added description of new function, “Software BOD Disable”:
– Added functional description on page 31
– Updated section on page 32
– Added register description on page 33
– Updated Register Summary on page 7
8. Added description of enhanced function, “Enhanced Power-On Reset”:
– Updated Table 18-4 on page 120, and Table 18-5 on page 120
19
8126ES–AVR–07/10
Headquarters
International
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131
USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
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Tel: (33) 1-30-60-70-00
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Tel: (81) 3-3523-3551
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Technical Support
[email protected]
Sales Contact
www.atmel.com/contacts
Product Contact
Web Site
www.atmel.com
Literature Requests
www.atmel.com/literature
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8126ES–AVR–07/10
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