Features • High Performance, Low Power AVR® 8-Bit Microcontroller • Advanced RISC Architecture • • • • • • • • – 120 Powerful Instructions – Most Single Clock Cycle Execution – 32 x 8 General Purpose Working Registers – Fully Static Operation – Up to 20 MIPS Througput at 20 MHz High Endurance Non-volatile Memory segments – 1K Bytes of In-System Self-programmable Flash program memory – 64 Bytes EEPROM – 64 Bytes Internal SRAM – Write/Erase Cycles: 10,000 Flash/100,000 EEPROM – Data retention: 20 Years at 85°C/100 Years at 25°C (see page 6) – Programming Lock for Self-Programming Flash & EEPROM Data Security Peripheral Features – One 8-bit Timer/Counter with Prescaler and Two PWM Channels – 4-channel, 10-bit ADC with Internal Voltage Reference – Programmable Watchdog Timer with Separate On-chip Oscillator – On-chip Analog Comparator Special Microcontroller Features – debugWIRE On-chip Debug System – In-System Programmable via SPI Port – External and Internal Interrupt Sources – Low Power Idle, ADC Noise Reduction, and Power-down Modes – Enhanced Power-on Reset Circuit – Programmable Brown-out Detection Circuit with Software Disable Function – Internal Calibrated Oscillator I/O and Packages – 8-pin PDIP/SOIC: Six Programmable I/O Lines – 10-pad MLF: Six Programmable I/O Lines – 20-pad MLF: Six Programmable I/O Lines Operating Voltage: – 1.8 – 5.5V Speed Grade: – 0 – 4 MHz @ 1.8 – 5.5V – 0 – 10 MHz @ 2.7 – 5.5V – 0 – 20 MHz @ 4.5 – 5.5V Industrial Temperature Range Low Power Consumption – Active Mode: • 190 µA at 1.8 V and 1 MHz – Idle Mode: • 24 µA at 1.8 V and 1 MHz 8-bit Microcontroller with 1K Bytes In-System Programmable Flash ATtiny13A Summary Rev. 8126ES–AVR–07/10 1. Pin Configurations Figure 1-1. Pinout of ATtiny13A 8-PDIP/SOIC (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/CLKI/ADC3) PB3 (PCINT4/ADC2) PB4 GND 1 2 3 4 8 7 6 5 VCC PB2 (SCK/ADC1/T0/PCINT2) PB1 (MISO/AIN1/OC0B/INT0/PCINT1) PB0 (MOSI/AIN0/OC0A/PCINT0) 15 14 13 12 11 6 7 8 9 10 1 2 3 4 5 VCC PB2 (SCK/ADC1/T0/PCINT2) DNC PB1 (MISO/AIN1/OC0B/INT0/PCINT1) PB0 (MOSI/AIN0/OC0A/PCINT0) DNC DNC GND DNC DNC (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/CLKI/ADC3) PB3 DNC DNC (PCINT4/ADC2) PB4 20 19 18 17 16 DNC DNC DNC DNC DNC 20-QFN/MLF NOTE: Bottom pad should be soldered to ground. DNC: Do Not Connect 10-QFN/MLF (PCINT5/RESET/ADC0/dW) PB5 (PCINT3/CLKI/ADC3) PB3 DNC (PCINT4/ADC2) PB4 GND 1 2 3 4 5 10 9 8 7 6 VCC PB2 (SCK/ADC1/T0/PCINT2) DNC PB1 (MISO/AIN1/OC0B/INT0/PCINT1) PB0 (MOSI/AIN0/OC0A/PCINT0) NOTE: Bottom pad should be soldered to ground. DNC: Do Not Connect 2 ATtiny13A 8126ES–AVR–07/10 ATtiny13A 1.1 1.1.1 Pin Description VCC Supply voltage. 1.1.2 GND Ground. 1.1.3 Port B (PB5:PB0) Port B is a 6-bit bi-directional I/O port with internal pull-up resistors (selected for each bit). The Port B output buffers have symmetrical drive characteristics with both high sink and source capability. As inputs, Port B pins that are externally pulled low will source current if the pull-up resistors are activated. The Port B pins are tri-stated when a reset condition becomes active, even if the clock is not running. Port B also serves the functions of various special features of the ATtiny13A as listed on page 55. 1.1.4 RESET Reset input. A low level on this pin for longer than the minimum pulse length will generate a reset, even if the clock is not running and provided the reset pin has not been disabled. The minimum pulse length is given in Table 18-4 on page 120. Shorter pulses are not guaranteed to generate a reset. The reset pin can also be used as a (weak) I/O pin. 3 8126ES–AVR–07/10 2. Overview The ATtiny13A is a low-power CMOS 8-bit microcontroller based on the AVR enhanced RISC architecture. By executing powerful instructions in a single clock cycle, the ATtiny13A achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed. 2.1 Block Diagram Figure 2-1. Block Diagram 8-BIT DATABUS STACK POINTER SRAM VCC PROGRAM COUNTER GND PROGRAM FLASH WATCHDOG OSCILLATOR CALIBRATED INTERNAL OSCILLATOR WATCHDOG TIMER TIMING AND CONTROL MCU CONTROL REGISTER MCU STATUS REGISTER TIMER/ COUNTER0 INSTRUCTION REGISTER INSTRUCTION DECODER CONTROL LINES GENERAL PURPOSE REGISTERS INTERRUPT UNIT X Y Z PROGRAMMING LOGIC ALU DATA EEPROM STATUS REGISTER ADC / ANALOG COMPARATOR DATA REGISTER PORT B DATA DIR. REG.PORT B PORT B DRIVERS RESET CLKI PB[0:5] 4 ATtiny13A 8126ES–AVR–07/10 ATtiny13A The AVR core combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly connected to the Arithmetic Logic Unit (ALU), allowing two independent registers to be accessed in one single instruction executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs up to ten times faster than conventional CISC microcontrollers. The ATtiny13A provides the following features: 1K byte of In-System Programmable Flash, 64 bytes EEPROM, 64 bytes SRAM, 6 general purpose I/O lines, 32 general purpose working registers, one 8-bit Timer/Counter with compare modes, Internal and External Interrupts, a 4channel, 10-bit ADC, a programmable Watchdog Timer with internal Oscillator, and three software selectable power saving modes. The Idle mode stops the CPU while allowing the SRAM, Timer/Counter, ADC, Analog Comparator, and Interrupt system to continue functioning. The Power-down mode saves the register contents, disabling all chip functions until the next Interrupt or Hardware Reset. The ADC Noise Reduction mode stops the CPU and all I/O modules except ADC, to minimize switching noise during ADC conversions. The device is manufactured using Atmel’s high density non-volatile memory technology. The On-chip ISP Flash allows the Program memory to be re-programmed In-System through an SPI serial interface, by a conventional non-volatile memory programmer or by an On-chip boot code running on the AVR core. The ATtiny13A AVR is supported with a full suite of program and system development tools including: C Compilers, Macro Assemblers, Program Debugger/Simulators, and Evaluation kits. 5 8126ES–AVR–07/10 3. About 3.1 Resources A comprehensive set of drivers, application notes, data sheets and descriptions on development tools are available for download at http://www.atmel.com/avr. 3.2 Code Examples This documentation contains simple code examples that briefly show how to use various parts of the device. These code examples assume that the part specific header file is included before compilation. Be aware that not all C compiler vendors include bit definitions in the header files and interrupt handling in C is compiler dependent. Please confirm with the C compiler documentation for more details. 3.3 Data Retention Reliability Qualification results show that the projected data retention failure rate is much less than 1 PPM over 20 years at 85°C or 100 years at 25°C. 6 ATtiny13A 8126ES–AVR–07/10 ATtiny13A 4. Register Summary Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Page 0x3F SREG I T H S V N Z C page 9 0x3E Reserved – – – – – – – – – – – – – – – 0x3D SPL 0x3C Reserved – 0x3B GIMSK – INT0 PCIE – – – – – page 47 0x3A GIFR – INTF0 PCIF – – – – – page 48 0x39 TIMSK0 – – – – OCIE0B OCIE0A TOIE0 – page 75 0x38 TIFR0 – – – – OCF0B OCF0A TOV0 0x37 SPMCSR – – – CTPB RFLB PGWRT PGERS – SELFPR- page 98 – PUD SE SM1 0x36 OCR0A 0x35 MCUCR SP[7:0] page 11 Timer/Counter – Output Compare Register A page 76 page 75 SM0 – ISC01 ISC00 pages 33, 47, 57 0x34 MCUSR – – – – WDRF BORF EXTRF PORF page 42 0x33 TCCR0B FOC0A FOC0B – – WGM02 CS02 CS01 CS00 page 73 0x32 TCNT0 Timer/Counter (8-bit) 0x31 OSCCAL Oscillator Calibration Register 0x30 BODCR – – – – – – BODS BODSE page 33 0x2F TCCR0A COM0A1 COM0A0 COM0B1 COM0B0 – – WGM01 WGM00 page 70 0x2E DWDR DWDR[7:0] 0x2D Reserved – 0x2C Reserved – 0x2B Reserved – 0x2A Reserved – 0x29 OCR0B Timer/Counter – Output Compare Register B 0x28 GTCCR 0x27 Reserved 0x26 CLKPR CLKPCE – – 0x25 PRR – – – 0x24 Reserved – 0x23 Reserved – 0x22 Reserved 0x21 WDTCR 0x20 Reserved TSM – – – page 74 page 27 page 97 page 75 – – – PSR10 page 78 – CLKPS3 CLKPS2 CLKPS1 CLKPS0 page 28 – – – PRTIM0 PRADC page 34 WDE WDP2 WDP1 WDP0 page 42 – – WDTIF WDTIE WDP3 WDCE – – 0x1F Reserved 0x1E EEARL 0x1D EEDR 0x1C EECR 0x1B Reserved – 0x1A Reserved – 0x19 Reserved 0x18 PORTB – – PORTB5 0x17 DDRB – – 0x16 PINB – 0x15 PCMSK 0x14 DIDR0 – – EEPROM Address Register page 20 EEPROM Data Register – – EEPM1 EEPM0 page 20 EERIE EEMPE EEPE EERE page 21 PORTB4 PORTB3 PORTB2 PORTB1 PORTB0 page 57 DDB5 DDB4 DDB3 DDB2 DDB1 DDB0 page 57 – PINB5 PINB4 PINB3 PINB2 PINB1 PINB0 page 58 – – PCINT5 PCINT4 PCINT3 PCINT2 PCINT1 PCINT0 page 48 – – ADC0D ADC2D ADC3D ADC1D AIN1D AIN0D pages 81, 95 – 0x13 Reserved – 0x12 Reserved – 0x11 Reserved – 0x10 Reserved – 0x0F Reserved – 0x0E Reserved – 0x0D Reserved – 0x0C Reserved – 0x0B Reserved – 0x0A Reserved – 0x09 Reserved 0x08 ACSR ACD ACBG ACO ACI ACIE – ACIS1 ACIS0 page 80 0x07 ADMUX – REFS0 ADLAR – – – MUX1 MUX0 page 92 0x06 ADCSRA ADEN ADSC ADATE ADIF ADIE ADPS2 ADPS1 ADPS0 page 93 0x05 ADCH ADC Data Register High Byte 0x04 ADCL ADC Data Register Low Byte 0x03 ADCSRB 0x02 Reserved – 0x01 Reserved – 0x00 Reserved – – – ACME – – – page 94 page 94 ADTS2 ADTS1 ADTS0 pages 80, 95 7 8126ES–AVR–07/10 Notes: 1. For compatibility with future devices, reserved bits should be written to zero if accessed. Reserved I/O memory addresses should never be written. 2. I/O Registers within the address range 0x00 - 0x1F are directly bit-accessible using the SBI and CBI instructions. In these registers, the value of single bits can be checked by using the SBIS and SBIC instructions.ome of the Status Flags are cleared by writing a logical one to them. Note that, unlike most other AVRs, the CBI and SBI instructions will only operation the specified bit, and can therefore be used on registers containing such Status Flags. The CBI and SBI instructions work with registers 0x00 to 0x1F only. 8 ATtiny13A 8126ES–AVR–07/10 ATtiny13A 5. Instruction Set Summary Mnemonics Operands Description Operation Flags #Clocks ARITHMETIC AND LOGIC INSTRUCTIONS ADD Rd, Rr Add two Registers Rd ← Rd + Rr Z,C,N,V,H 1 ADC Rd, Rr Add with Carry two Registers Rd ← Rd + Rr + C Z,C,N,V,H 1 ADIW Rdl,K Add Immediate to Word Rdh:Rdl ← Rdh:Rdl + K Z,C,N,V,S 2 SUB Rd, Rr Subtract two Registers Rd ← Rd - Rr Z,C,N,V,H 1 SUBI Rd, K Subtract Constant from Register Rd ← Rd - K Z,C,N,V,H 1 SBC Rd, Rr Subtract with Carry two Registers Rd ← Rd - Rr - C Z,C,N,V,H 1 SBCI Rd, K Subtract with Carry Constant from Reg. Rd ← Rd - K - C Z,C,N,V,H 1 SBIW Rdl,K Subtract Immediate from Word Rdh:Rdl ← Rdh:Rdl - K Z,C,N,V,S 2 AND Rd, Rr Logical AND Registers Rd ← Rd • Rr Z,N,V 1 ANDI Rd, K Logical AND Register and Constant Rd ← Rd • K Z,N,V 1 OR Rd, Rr Logical OR Registers Rd ← Rd v Rr Z,N,V 1 ORI Rd, K Logical OR Register and Constant Rd ← Rd v K Z,N,V 1 EOR Rd, Rr Exclusive OR Registers Rd ← Rd ⊕ Rr Z,N,V 1 COM Rd One’s Complement Rd ← 0xFF − Rd Z,C,N,V 1 NEG Rd Two’s Complement Rd ← 0x00 − Rd Z,C,N,V,H 1 SBR Rd,K Set Bit(s) in Register Rd ← Rd v K Z,N,V 1 CBR Rd,K Clear Bit(s) in Register Rd ← Rd • (0xFF - K) Z,N,V 1 INC Rd Increment Rd ← Rd + 1 Z,N,V 1 DEC Rd Decrement Rd ← Rd − 1 Z,N,V 1 TST Rd Test for Zero or Minus Rd ← Rd • Rd Z,N,V 1 CLR Rd Clear Register Rd ← Rd ⊕ Rd Z,N,V 1 SER Rd Set Register Rd ← 0xFF None 1 2 BRANCH INSTRUCTIONS RJMP k IJMP RCALL k Relative Jump PC ← PC + k + 1 None Indirect Jump to (Z) PC ← Z None 2 Relative Subroutine Call PC ← PC + k + 1 None 3 ICALL Indirect Call to (Z) PC ← Z None 3 RET Subroutine Return PC ← STACK None 4 RETI Interrupt Return PC ← STACK I 4 Compare, Skip if Equal if (Rd = Rr) PC ← PC + 2 or 3 None 1/2/3 CPSE Rd,Rr CP Rd,Rr Compare Rd − Rr Z, N,V,C,H 1 CPC Rd,Rr Compare with Carry Rd − Rr − C Z, N,V,C,H 1 CPI Rd,K Compare Register with Immediate Rd − K Z, N,V,C,H 1 SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBRS Rr, b Skip if Bit in Register is Set if (Rr(b)=1) PC ← PC + 2 or 3 None 1/2/3 SBIC P, b Skip if Bit in I/O Register Cleared if (P(b)=0) PC ← PC + 2 or 3 None 1/2/3 SBIS P, b Skip if Bit in I/O Register is Set if (P(b)=1) PC ← PC + 2 or 3 None 1/2/3 BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC←PC+k + 1 None 1/2 BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC←PC+k + 1 None 1/2 BREQ k Branch if Equal if (Z = 1) then PC ← PC + k + 1 None 1/2 BRNE k Branch if Not Equal if (Z = 0) then PC ← PC + k + 1 None 1/2 BRCS k Branch if Carry Set if (C = 1) then PC ← PC + k + 1 None 1/2 BRCC k Branch if Carry Cleared if (C = 0) then PC ← PC + k + 1 None 1/2 BRSH k Branch if Same or Higher if (C = 0) then PC ← PC + k + 1 None 1/2 BRLO k Branch if Lower if (C = 1) then PC ← PC + k + 1 None 1/2 BRMI k Branch if Minus if (N = 1) then PC ← PC + k + 1 None 1/2 BRPL k Branch if Plus if (N = 0) then PC ← PC + k + 1 None 1/2 BRGE k Branch if Greater or Equal, Signed if (N ⊕ V= 0) then PC ← PC + k + 1 None 1/2 BRLT k Branch if Less Than Zero, Signed if (N ⊕ V= 1) then PC ← PC + k + 1 None 1/2 BRHS k Branch if Half Carry Flag Set if (H = 1) then PC ← PC + k + 1 None 1/2 BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC ← PC + k + 1 None 1/2 BRTS k Branch if T Flag Set if (T = 1) then PC ← PC + k + 1 None 1/2 BRTC k Branch if T Flag Cleared if (T = 0) then PC ← PC + k + 1 None 1/2 BRVS k Branch if Overflow Flag is Set if (V = 1) then PC ← PC + k + 1 None 1/2 BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC ← PC + k + 1 None 1/2 BRIE k Branch if Interrupt Enabled if ( I = 1) then PC ← PC + k + 1 None 1/2 BRID k Branch if Interrupt Disabled if ( I = 0) then PC ← PC + k + 1 None 1/2 SBI P,b Set Bit in I/O Register I/O(P,b) ← 1 None 2 CBI P,b Clear Bit in I/O Register I/O(P,b) ← 0 None 2 LSL Rd Logical Shift Left Rd(n+1) ← Rd(n), Rd(0) ← 0 Z,C,N,V 1 LSR Rd Logical Shift Right Rd(n) ← Rd(n+1), Rd(7) ← 0 Z,C,N,V 1 ROL Rd Rotate Left Through Carry Rd(0)←C,Rd(n+1)← Rd(n),C←Rd(7) Z,C,N,V 1 BIT AND BIT-TEST INSTRUCTIONS 9 8126ES–AVR–07/10 Mnemonics Operands Description Operation Flags ROR Rd Rotate Right Through Carry Rd(7)←C,Rd(n)← Rd(n+1),C←Rd(0) Z,C,N,V #Clocks 1 ASR Rd Arithmetic Shift Right Rd(n) ← Rd(n+1), n=0..6 Z,C,N,V 1 SWAP Rd Swap Nibbles Rd(3..0)←Rd(7..4),Rd(7..4)←Rd(3..0) None 1 BSET s Flag Set SREG(s) ← 1 SREG(s) 1 BCLR s Flag Clear SREG(s) ← 0 SREG(s) 1 BST Rr, b Bit Store from Register to T T ← Rr(b) T 1 BLD Rd, b Bit load from T to Register Rd(b) ← T None 1 1 SEC Set Carry C←1 C CLC Clear Carry C←0 C 1 SEN Set Negative Flag N←1 N 1 CLN Clear Negative Flag N←0 N 1 SEZ Set Zero Flag Z←1 Z 1 CLZ Clear Zero Flag Z←0 Z 1 SEI Global Interrupt Enable I←1 I 1 CLI Global Interrupt Disable I←0 I 1 SES Set Signed Test Flag S←1 S 1 CLS Clear Signed Test Flag S←0 S 1 SEV Set Twos Complement Overflow. V←1 V 1 CLV Clear Twos Complement Overflow V←0 V 1 SET Set T in SREG T←1 T 1 CLT Clear T in SREG T←0 T 1 SEH CLH Set Half Carry Flag in SREG Clear Half Carry Flag in SREG H←1 H←0 H H 1 1 DATA TRANSFER INSTRUCTIONS MOV Rd, Rr Move Between Registers 1 Rd, Rr Copy Register Word Rd ← Rr Rd+1:Rd ← Rr+1:Rr None MOVW None 1 LDI Rd, K Load Immediate Rd ← K None 1 LD Rd, X Load Indirect Rd ← (X) None 2 LD Rd, X+ Load Indirect and Post-Inc. Rd ← (X), X ← X + 1 None 2 LD Rd, - X Load Indirect and Pre-Dec. X ← X - 1, Rd ← (X) None 2 LD Rd, Y Load Indirect Rd ← (Y) None 2 LD Rd, Y+ Load Indirect and Post-Inc. Rd ← (Y), Y ← Y + 1 None 2 LD Rd, - Y Load Indirect and Pre-Dec. Y ← Y - 1, Rd ← (Y) None 2 LDD Rd,Y+q Load Indirect with Displacement Rd ← (Y + q) None 2 LD Rd, Z Load Indirect Rd ← (Z) None 2 LD Rd, Z+ Load Indirect and Post-Inc. Rd ← (Z), Z ← Z+1 None 2 LD Rd, -Z Load Indirect and Pre-Dec. Z ← Z - 1, Rd ← (Z) None 2 LDD Rd, Z+q Load Indirect with Displacement Rd ← (Z + q) None 2 LDS Rd, k Load Direct from SRAM Rd ← (k) None 2 ST X, Rr Store Indirect (X) ← Rr None 2 ST X+, Rr Store Indirect and Post-Inc. (X) ← Rr, X ← X + 1 None 2 ST - X, Rr Store Indirect and Pre-Dec. X ← X - 1, (X) ← Rr None 2 ST Y, Rr Store Indirect (Y) ← Rr None 2 ST Y+, Rr Store Indirect and Post-Inc. (Y) ← Rr, Y ← Y + 1 None 2 2 ST - Y, Rr Store Indirect and Pre-Dec. Y ← Y - 1, (Y) ← Rr None STD Y+q,Rr Store Indirect with Displacement (Y + q) ← Rr None 2 ST Z, Rr Store Indirect (Z) ← Rr None 2 2 ST Z+, Rr Store Indirect and Post-Inc. (Z) ← Rr, Z ← Z + 1 None ST -Z, Rr Store Indirect and Pre-Dec. Z ← Z - 1, (Z) ← Rr None 2 STD Z+q,Rr Store Indirect with Displacement (Z + q) ← Rr None 2 STS k, Rr Store Direct to SRAM (k) ← Rr None 2 Load Program Memory R0 ← (Z) None 3 LPM LPM Rd, Z Load Program Memory Rd ← (Z) None 3 LPM Rd, Z+ Load Program Memory and Post-Inc Rd ← (Z), Z ← Z+1 None 3 Store Program Memory (z) ← R1:R0 None SPM IN Rd, P In Port Rd ← P None 1 OUT P, Rr Out Port P ← Rr None 1 PUSH Rr Push Register on Stack STACK ← Rr None 2 POP Rd Pop Register from Stack Rd ← STACK None 2 MCU CONTROL INSTRUCTIONS 10 NOP No Operation None 1 SLEEP Sleep (see specific descr. for Sleep function) None 1 WDR BREAK Watchdog Reset Break (see specific descr. for WDR/Timer) For On-chip Debug Only None None 1 N/A ATtiny13A 8126ES–AVR–07/10 ATtiny13A 6. Ordering Information Speed (MHz) 20 Notes: Power Supply (V) 1.8 - 5.5 Ordering Code(1) Package(2) Operation Range 8P3 8S2 8S2 8S2 8S1 8S1 8S1 20M1 20M1 10M1(3) 10M1(3) Industrial (-40°C to +85°C)(4) ATtiny13A-SN ATtiny13A-SNR ATtiny13A-SS7 ATtiny13A-SS7R 8S2 8S2 8S1 8S1 Industrial (-40°C to +105°C)(5) ATtiny13A-SF ATtiny13A-SFR 8S2 8S2 Industrial (-40°C to +125°C)(6) ATtiny13A-PU ATtiny13A-SU ATtiny13A-SH ATtiny13A-SHR ATtiny13A-SSU ATtiny13A-SSH ATtiny13A-SSHR ATtiny13A-MU ATtiny13A-MUR ATtiny13A-MMU(3) ATtiny13A-MMUR(3) 1. Code indicators: – H or 7: NiPdAu lead finish – U, N or F: matte tin – R: tape & reel 2. All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 3. Topside marking for ATtiny13A: – 1st Line: T13 – 2nd Line: Axx – 3rd Line: xxx 4. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities. 5. For typical and Electrical characteristics for this device please consult Appendix A, ATtiny13A Specification at 105°C. 6. For typical and Electrical characteristics for this device please consult Appendix B, ATtiny13A Specification at 125°C. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S2 8-lead, 0.209" Wide, Plastic Small Outline Package (EIAJ SOIC) 8S1 8-lead, 0.150" Wide, Plastic Gull-Wing Small Outline (JEDEC SOIC) 20M1 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF) 10M1 10-pad, 3 x 3 x 1 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF) 11 8126ES–AVR–07/10 7. Packaging Information 7.1 8P3 E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A SYMBOL MIN NOM A b2 b3 b 4 PLCS Side View L 0.210 NOTE 2 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 D1 0.005 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 0.100 BSC eA 0.300 BSC 0.115 3 3 e L Notes: MAX 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 12 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B ATtiny13A 8126ES–AVR–07/10 ATtiny13A 7.2 8S2 C 1 E E1 L N θ TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D SIDE VIEW MAX NOM NOTE A 1.70 A1 0.05 0.25 b 0.35 0.48 4 C 0.15 0.35 4 D 5.13 5.35 E1 5.18 5.40 E 7.70 8.26 L 0.51 0.85 θ 0° 8° e Notes: 1. 2. 3. 4. MIN 2.16 1.27 BSC 2 3 This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information. Mismatch of the upper and lower dies and resin burrs aren't included. Determines the true geometric position. Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm. Package Drawing Contact: [email protected] TITLE 8S2, 8-lead, 0.208” Body, Plastic Small Outline Package (EIAJ) GPC STN 4/15/08 DRAWING NO. REV. 8S2 F 13 8126ES–AVR–07/10 7.3 8S1 3 2 1 H N Top View e B A D COMMON DIMENSIONS (Unit of Measure = mm) Side View A2 C L SYMBOL MIN NOM MAX A – – 1.75 B – – 0.51 C – – 0.25 D – – 5.00 E – – 4.00 e E End View NOTE 1.27 BSC H – – 6.20 L – – 1.27 Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc. 10/10/01 R 14 2325 Orchard Parkway San Jose, CA 95131 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. REV. 8S1 A ATtiny13A 8126ES–AVR–07/10 ATtiny13A 7.4 20M1 D 1 Pin 1 ID 2 SIDE VIEW E 3 TOP VIEW A2 D2 A1 A 0.08 1 2 Pin #1 Notch (0.20 R) 3 COMMON DIMENSIONS (Unit of Measure = mm) E2 b L e BOTTOM VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 – 0.01 0.05 A2 b 0.18 D D2 E2 L 0.23 0.30 4.00 BSC 2.45 2.60 2.75 4.00 BSC 2.45 e Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5. NOTE 0.20 REF E Note: C 2.60 2.75 0.50 BSC 0.35 0.40 0.55 10/27/04 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, 2.6 mm Exposed Pad, Micro Lead Frame Package (MLF) DRAWING NO. 20M1 REV. A 15 8126ES–AVR–07/10 7.5 10M1 D y Pin 1 ID SIDE VIEW E TOP VIEW A1 A D1 K COMMON DIMENSIONS (Unit of Measure = mm) 1 2 b E1 e SYMBOL MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.02 0.05 b 0.18 0.25 0.30 D 2.90 3.00 3.10 D1 1.40 – 1.75 E 2.90 3.00 3.10 E1 2.20 – 2.70 e L BOTTOM VIEW NOTE 0.50 L 0.30 – 0.50 y – – 0.08 K 0.20 – – Notes: 1. This package conforms to JEDEC reference MO-229C, Variation VEED-5. 2. The terminal #1 ID is a Lasser-marked Feature. R 16 TITLE 2325 Orchard Parkway 10M1, 10-pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm, San Jose, CA 95131 1.64 x 2.60 mm Exposed Pad, Micro Lead Frame Package 7/7/06 DRAWING NO. REV. 10M1 A ATtiny13A 8126ES–AVR–07/10 ATtiny13A 8. Errata The revision letters in this section refer to the revision of the ATtiny13A device. 8.1 ATtiny13A Rev. G – H • EEPROM can not be written below 1.9 Volt 1. EEPROM can not be written below 1.9 Volt Writing the EEPROM at VCC below 1.9 volts might fail. Problem Fix/Workaround Do not write the EEPROM when VCC is below 1.9 volts. 8.2 ATtiny13A Rev. E – F These device revisions were not sampled. 8.3 ATtiny13 Rev. A – D These device revisions were referred to as ATtiny13/ATtiny13V. 17 8126ES–AVR–07/10 9. Datasheet Revision History Please note that page numbers in this section refer to the current version of this document and may not apply to previous versions. 9.1 Rev. 8126E – 07/10 1. Updated description in Section 6.4.2 “CLKPR – Clock Prescale Register” on page 28. 2. Adjusted notes in Table 18-1, “DC Characteristics, TA = -40°C to +85°C,” on page 117. 3. Updated plot order in Section 19. “Typical Characteristics” on page 124, added some plots, also some headers and figure titles adjusted. 4. Updated Section 6. “Ordering Information” on page 11, added extended temperature part numbers, as well tape & reel part numbers. Notes adjusted. 5. Updated bit syntax throughout the datasheet, e.g. from CS02:0 to CS0[2:0]. 9.2 Rev. 8126D – 11/09 1. Added note “If the RSTDISPL fuse is programmed...” in Startup-up Times Table 6-5 and Table 6-6 on page 26. 2. Added addresses in all Register Description tables and cross-references to Register Summary. 3. Updated naming convention for -COM bits in tables from Table 11-2 on page 70 to Table 11-7 on page 72. 4. Updated value for tWD_ERASE in Table 17-8, “Minimum Wait Delay Before Writing the Next Flash or EEPROM Location,” on page 108. 5. Added NiPdAU note for -SH and -SSH in Section 6. “Ordering Information” on page 11. 9.3 Rev. 8126C – 09/09 1. Added EEPROM errata for rev. G - H on page 17. 2. Added a note about topside marking in Section 6. “Ordering Information” on page 11. 9.4 Rev. 8126B – 11/08 1. Updated order codes on page 11 to reflect changes in material composition. 2. Updated sections: – “DIDR0 – Digital Input Disable Register 0” on page 81 – “DIDR0 – Digital Input Disable Register 0” on page 95 3. Updated “Register Summary” on page 7. 9.5 Rev. 8126A – 05/08 1. Initial revision, created from document 2535I – 04/08. 2. Updated characteristic plots of section “Typical Characteristics” , starting on page 124. 3. Updated “Ordering Information” on page 11. 4. Updated section: – “Speed” on page 118 5. Update tables: – “DC Characteristics, TA = -40°C to +85°C” on page 117 – “Calibration Accuracy of Internal RC Oscillator” on page 119 18 ATtiny13A 8126ES–AVR–07/10 ATtiny13A – “Reset, Brown-out, and Internal Voltage Characteristics” on page 120 – “ADC Characteristics, Single Ended Channels. TA = -40°C to +85°C” on page 121 – “Serial Programming Characteristics, TA = -40°C to +85°C” on page 122 6. Added description of new function, “Power Reduction Register”: – Added functional description on page 31 – Added bit description on page 34 – Added section “Supply Current of I/O Modules” on page 124 – Updated Register Summary on page 7 7. Added description of new function, “Software BOD Disable”: – Added functional description on page 31 – Updated section on page 32 – Added register description on page 33 – Updated Register Summary on page 7 8. Added description of enhanced function, “Enhanced Power-On Reset”: – Updated Table 18-4 on page 120, and Table 18-5 on page 120 19 8126ES–AVR–07/10 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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