MBR735/MBRB735 MBR745/MBRB745 SANGDEST MICROELECTRONICS Technical Data Data Sheet N0720, Rev. - Green Products MBR735/MBR745/MBRB735/MBRB745 SCHOTTKY RECTIFIER Applications: • • • • • Switching power supply Converters Free-Wheeling diodes Reverse battery protection Center tap configuration Features: • • • • • • • • • 150 °C TJ operation Center tap configuration Low forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation Guard ring for enhanced ruggedness and long term reliability This is a Pb − Free Device All SMC parts are traceable to the wafer lot Additional testing can be offered upon request MBR… MBRB… D2PAK TO-220AC Mechanical Dimensions: In Inches / mm Symbol A A1 A2 b b1 c D D1 E E1 e1 H1 L L1 ΦP Q Θ1 Θ2 Θ3 Dimensions in millimeters Min. Typical Max. 4.55 1.17 2.59 0.71 0.36 14.64 8.55 10.01 9.98 6.04 13.00 3.74 2.54 4.70 1.27 2.69 0.81 1.27 0.38 14.94 8.07 10.16 10.18 5.08 6.24 13.86 3.80 3.84 2.74 5° 4° 4° 4.85 1.37 2.89 0.96 0.61 15.24 8.85 10.31 10.38 6.44 14.08 4.04 2.94 TO-220AC • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • MBR735/MBRB735 MBR745/MBRB745 SANGDEST MICROELECTRONICS Technical Data Data Sheet N0720, Rev. - Green Products Symbol A A1 A2 b b1 c c1 D D1 E E1 E2 e H L L1 L2 L3 e e1 e2 e3 Dimensions in millimeters Min. Typical Max. 4.55 0 2.59 0.71 0.36 1.17 8.55 6.40 10.01 7.6 9.98 14.6 2.00 1.17 0 4.70 0.10 2.69 0.81 1.27 0.38 1.27 8.70 4.85 0.25 2.89 0.96 0.61 1.37 8.85 10.16 10.31 10.08 2.54 15.1 2.30 1.27 10.18 15.6 2.70 1.40 2.20 0.25BSC 5° 4° 4° 8° D2PAK • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • MBR735/MBRB735 MBR745/MBRB745 SANGDEST MICROELECTRONICS Technical Data Data Sheet N0720, Rev. - Green Products Marking Diagram: Where XXXXX is YYWWL MBR B 7 35 SSG YY WW L MBR735 = Device Type = Package type = Forward Current (7A) = Reverse Voltage (35V) = SSG = Year = Week = Lot Number MBRB735 Cautions：Molding resin Epoxy resin UL:94V-0 Ordering Information: Device MBR735 MBRB735 Package Shipping TO-220AC(Pb-Free) 50pcs/ tube D²PAK (Pb-Free) 800pcs / reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification. Maximum Ratings: Characteristics Peak Inverse Voltage Max. Average Forward Current Max. Peak One Cycle NonRepetitive Surge Current Peak Repetitive Reverse Surge Current Symbol VRWM Condition - Max. 35(MBR.735) 45(MBR.745) 7.5 Units V IF(AV) @TC=131℃（Rated VR） IFSM 8.3 ms, half Sine pulse 150 A IRRM 2.0μsec 1.0KHz 1.0 A A • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • MBR735/MBRB735 MBR745/MBRB745 SANGDEST MICROELECTRONICS Technical Data Data Sheet N0720, Rev. - Green Products Electrical Characteristics: Characteristics Max. Forward Voltage Drop (per leg) * Max. Reverse Current (per leg) * Symbol VF1 VF2 IR1 IR2 Max. Junction Capacitance (per leg) Typical Series Inductance (per leg) Max. Voltage Rate of Change * CT LS dv/dt Condition @ 15A, Pulse, TJ = 25 °C @ 7.5A, Pulse, TJ = 125 °C @VR = rated VR Pulse TJ = 25 °C @VR = rated VR , Pulse TJ = 125 °C @VR = 5V, TC = 25 °C fSIG = 1MHz Measured lead to lead 5 mm from package body - Max. 0.84 0.57 0.1 Units V V mA 15.0 mA 400 pF 8.0 nH 10,00 V/μs Pulse Width < 300µs, Duty Cycle <2% Thermal-Mechanical Specifications: Characteristics Max. Junction Temperature Max. Storage Temperature Maximum Thermal Resistance Junction to Case Typical Thermal Resistance Case to Heat Sink Approximate Weight Case Style Symbol TJ Tstg RθJC RθCS wt Condition DC operation Mounting surface, smooth and greased (only for TO-220) TO-220AC/D²PAK Specification -55 to +150 -65 to +175 3.0 Units °C °C 0.50 °C/W 1.6/1.85 g °C/W • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • MBR735/MBRB735 MBR745/MBRB745 SANGDEST MICROELECTRONICS Technical Data Data Sheet N0720, Rev. - Green Products Typical Reverse Characteristics Instantaneous Reverse Current - IR (mA) Typical Forward Characteristics 101 125 癈 100 150 癈 101 125 癈 100 癈 100 75 癈 10-1 50 癈 10-2 25 癈 10-3 0 25 癈 Junction Capacitance - CT (pF) Instantaneous Forward Current - I F (A) 150 癈 102 10-1 0.0 0.2 0.4 0.6 Forward Voltage Drop - VF (V) 0.8 10 20 30 40 50 Reverse Voltage - VR (V) 60 Typical Junction Capacitance 800 700 600 500 400 300 200 0 10 20 30 40 50 Reverse Voltage - VR (V) 60 • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn • SANGDEST MICROELECTRONICS Technical Data Data Sheet N0720, Rev. - MBR735/MBRB735 MBR745/MBRB745 Green Products DISCLAIMER: 1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales department for the latest version of the datasheet(s). 2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement . 3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in the datasheets. 4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC - Sangdest Microelectronics (Nanjing) Co., Ltd. 7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations.. • Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •