CM1250-04QG Low Capacitance Transient Voltage Suppressors / ESD Protectors Features http://onsemi.com • Low I/O Capacitance at 5 pF at 0 V • In−System ESD Protection to ±8 kV Contact Discharge, • • • per the IEC 61000−4−2 International Standard Compact SMT Package Saves Board Space and Facilitates Layout in Space−Critical Applications Each I/O Pin Can Withstand over 1000 ESD Strikes* These Devices are Pb−Free and are RoHS Compliant UDFN−6 QG SUFFIX CASE 517BM BLOCK DIAGRAM CM1250−04QG VN 5 6 1 4 2 VN 3 MARKING DIAGRAM LS LS = CM1250−04QG ORDERING INFORMATION Device Package Shipping† CM1250−04QG UDFN6 (Pb−Free) 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *Standard test condition is IEC61000−4−2 level 4 test circuit with each pin subjected to ±8 kV contact discharge for 1000 pulses. Discharges are timed at 1 second intervals and all 1000 strikes are completed in one continuous test run. The part is then subjected to standard production test to verify that all of the tested parameters are within spec after the 1000 strikes. © Semiconductor Components Industries, LLC, 2011 March, 2011 − Rev. 4 1 Publication Order Number: CM1250−04QG/D CM1250−04QG PACKAGE / PINOUT DIAGRAM Top View CH1 (1) CH4 (6) VN (2) VN (5) CH2 (3) CH3 (4) 6−Lead uDFN (0.4mm) Table 1. PIN DESCRIPTIONS Pins Name (Refer to package / pinout diagram) CHx (Refer to package / pinout diagram) VN Description The cathode of the respective TVS diode, which should be connected to the node requiring transient voltage protection. The anode of the TVS diodes. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Rating Units −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Rating Units −40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol CIN Conditions Channel Input Capacitance Min Typ Max Units TA = 25°C, 0 VDC, 1 MHz; (Note 2) 5 7 pF TA = 25°C, 2.5 VDC, 1 MHz; (Note 2) 3 0.14 DCIN Differential Channel I/O to GND Capacitance TA = 25°C, 2.5 VDC, 1 MHz; (Note 2) ILEAK Leakage Current VIN = 3.5 VDC, TA = 25°C VSIG Small Signal Clamp Voltage Positive Clamp Negative Clamp I = 5 mA, TA = 25°C I = −5 mA, TA = 25°C 6.1 −1.5 VESD ESD Withstand Voltage Contact Discharge per IEC 61000−4−2 standard Human Body Model, MIL−STD−883, Method 3015 TA = 25°C; (Notes 2, 4 and 5) TA = 25°C; (Notes 2, 3 and 5) ±8 ±15 RD 1. 2. 3. 4. 5. Parameter Diode Dynamic Resistance Forward Conduction Reverse Conduction All parameters specified at TA = −40°C to +85°C unless otherwise noted. These parameters guaranteed by design and characterization. Human Body Model per MIL−STD−883, Method 3015, CDischarge = 100 pF, RDischarge = 1.5 KW, VN grounded. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 W, VN grounded. These measurements performed with no external capacitor on CHX. 2 pF 0.10 TA = 25°C (Note 2) http://onsemi.com pF 8.5 −0.4 mA V kV 0.7 2.1 W CM1250−04QG PERFORMANCE INFORMATION Diode Capacitance Typical diode capacitance with respect to positive TVS cathode voltage (reverse voltage across the diode) is given in Diode Capacitance vs. Reverse Voltage. Figure 1. Diode Capacitance vs. Reverse Voltage Typical High Current Diode Characteristics Measurements are made in pulsed mode with a nominal pulse width of 0.7 ms. Figure 2. Typical Input VI Characteristics (Pulse−mode Measurements, Pulse Width = 0.7 ms nominal) http://onsemi.com 3 CM1250−04QG PACKAGE DIMENSIONS UDFN6, 1.25x1, 0.4P CASE 517BM−01 ISSUE O PIN ONE REFERENCE 2X ÉÉ ÉÉ L1 E 0.10 C 2X DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS 0.10 C ÉÉÉ ÉÉÉ ÇÇÇ TOP VIEW EXPOSED Cu DETAIL B (A3) 0.10 C A1 SIDE VIEW DETAIL A C 6X 1 6 MOLD CMPD ÉÉ ÉÉ ÇÇ SEATING PLANE L MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.15 REF 0.15 0.25 1.25 BSC 1.00 BSC 0.40 BSC 0.20 0.40 −−− 0.15 RECOMMENDED SOLDERING FOOTPRINT* 6X 6X b e DIM A A1 A3 b D E e L L1 ALTERNATE CONSTRUCTIONS 3 4 A3 A1 DETAIL B A 0.08 C NOTE 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. L L A B D 6X 0.25 0.53 0.10 C A B 0.05 C 1.30 NOTE 3 BOTTOM VIEW PACKAGE OUTLINE 1 0.40 PITCH DIMENSION: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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