OPA 4364 ® OPA 436 4 OPA2 364 OPA2 363 OPA 363 OPA363 OPA2363 OPA364 OPA2364 OPA4364 SBOS259B – SEPTEMBER 2002 – REVISED FEBRUARY 2003 1.8V, 7MHz, 90dB CMRR, SINGLE-SUPPLY, RAIL-TO-RAIL I/O OPERATIONAL AMPLIFIER FEATURES DESCRIPTION ● 1.8V OPERATION ● MicroSIZE PACKAGES ● BANDWIDTH: 7MHz ● CMRR: 90dB (typical) ● SLEW RATE: 5V/µs ● LOW OFFSET: 500µV (max) ● QUIESCENT CURRENT: 750µA/Channel (max) ● SHUTDOWN MODE: < 1µA/Channel The OPA363 and OPA364 families are high-performance CMOS operational amplifiers optimized for very low voltage, single-supply operation. These miniature, low-cost amplifiers are designed to operate on single supplies from 1.8V (±0.9V) to 5.5V (±2.75V). Applications include sensor amplification and signal conditioning in battery-powered systems. The OPA363 and OPA364 families offer excellent CMRR without the crossover associated with traditional complimentary input stages. This results in excellent performance for driving Analog-to-Digital (A/D) converters without degradation of differential linearity and THD. The input commonmode range includes both the negative and positive supplies. The output voltage swing is within 10mV of the rails. APPLICATIONS ● ● ● ● ● The OPA363 family includes a shutdown mode. Under logic control, the amplifiers can be switched from normal operation to a standby current that is less than 1µA. SIGNAL CONDITIONING DATA ACQUISITION PROCESS CONTROL ACTIVE FILTERS TEST EQUIPMENT OPA363 SOT23-5 SOT23-6 OPA364 The single version is available in the MicroSIZE SOT23-5 (SOT23-6 for shutdown) and SO-8. The dual version is available in MSOP-8, MSOP-10, and SO-8 packages. Quad packages are available in TSSOP-14 and SO-14 packages. All versions are specified for operation from –40°C to +125°C. OPA2363 OPA2364 x x MSOP-8 x MSOP-10 SO-8 OPA4364 x x x x TSSOP-14 x SO-14 x Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright © 2002-2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY Supply Voltage ................................................................................. +5.5V Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V Current(2) .................................................. ±10mA Enable Input ............................................................... (V–) – 0.5V to 5.5V Output Short-Circuit(3) .............................................................. Continuous Operating Temperature .................................................. –40°C to +150°C Storage Temperature ..................................................... –65°C to +150°C Junction Temperature .................................................................... +150°C Lead Temperature (soldering, 10s) ............................................... +300°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be current limited to 10mA or less. (3) Short-circuit to ground one amplifier per package. PACKAGE/ORDERING INFORMATION PRODUCT OPA363I " OPA363I " OPA2363I " OPA364I " OPA364I " OPA2364I " OPA2364I " OPA363AI " OPA363AI " OPA2363AI " OPA364AI " OPA364AI " OPA2364AI " OPA2364AI " OPA4364AI " OPA4364AI " PACKAGE-LEAD PACKAGE DESIGNATOR(1) SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY SOT23-6 DBV –40°C to +125°C A40 " " " " OPA363IDBVT OPA363IDBVR Tape and Reel, 250 Tape and Reel, 3000 SO-8 D –40°C to +125°C OPA363 " " " " OPA363ID OPA363IDR Rails, 100 Tape and Reel, 2500 MSOP-10 DGS –40°C to +125°C BHK " " " " OPA2363IDGST OPA2363IDGSR Tape and Reel, 250 Tape and Reel, 2500 SOT23-5 DBV –40°C to +125°C A41 " " " " OPA364IDBVT OPA364IDBVR Tape and Reel, 250 Tape and Reel, 3000 SO-8 D –40°C to +125°C OPA364 " " " " OPA364ID OPA364IDR Rails, 100 Tape and Reel, 2500 MSOP-8 DGK –40°C to +125°C BHL " " " " OPA2364IDGKT OPA2364IDGKR Tape and Reel, 250 Tape and Reel, 2500 SO-8 D –40°C to +125°C OPA2364 " " " " OPA2364ID OPA2364IDR Rails, 100 Tape and Reel, 2500 SOT23-6 DBV –40°C to +125°C A40 " " " " OPA363AIDBVT OPA363AIDBVR Tape and Reel, 250 Tape and Reel, 3000 SO-8 D –40°C to +125°C OPA363A " " " " OPA363AID OPA363AIDR Rails, 100 Tape and Reel, 2500 MSOP-10 DGS –40°C to +125°C BHK " " " " OPA2363AIDGST OPA2363AIDGSR Tape and Reel, 250 Tape and Reel, 2500 SOT23-5 DBV –40°C to +125°C A41 " " " " OPA364AIDBVT OPA364AIDBVR Tape and Reel, 250 Tape and Reel, 3000 SO-8 D –40°C to +125°C OPA364A " " " " OPA364AID OPA364AIDR Rails, 100 Tape and Reel, 2500 SO-8 D –40°C to +125°C OPA2634A " " " " OPA2364AID OPA2364AIDR Rails, 100 Tape and Reel, 2500 MSOP-8 DGK –40°C to +125°C BHL " " " " OPA2364AIDGKT OPA2364AIDGKR Tape and Reel, 250 Tape and Reel, 2500 SO-14 D –40°C to +125°C OPA4364A " " " " OPA4364AID OPA4364AIDR Rails, 58 Tape and Reel, 2500 TSSOP-14 PW –40°C to +125°C OPA4364A " " " " OPA4364AIPWT OPA4364AIPWR Tape and Reel, 250 Tape and Reel, 2500 NOTES: (1) For the most current specifications and package information, refer to our web site at www.ti.com. 2 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B PIN CONFIGURATIONS Top View OPA363(1) V– 2 +In 3 6 V+ 5 Enable V– 2 4 –In +In 3 VOUT 1 SOT23-6 OPA364 5 V+ A41 A40 VOUT 1 OPA364(1) 4 –In NC 1 8 NC –In 2 7 V+ +In 3 6 VOUT V– 4 5 NC SOT23-5 SO-8 OPA4364 OPA2363 VOUT A 1 –In A 2 13 –In D 3 12 +In D V+ 4 11 V– +In B 5 10 +In C VOUT B –In A 2 8 –In B +In A 9 3 VOUT D 1 +V A +In A 14 VOUT A 10 A D B –V 4 7 +In B Enable A 5 6 Enable B B MSOP-10 C –In B 6 9 –In C VOUT B 7 8 VOUT C SO-14, TSSOP-14 OPA2364 OPA363 NC 1 8 Enable Out A 1 8 V+ –In 2 7 V+ –In A 2 7 Out B +In 3 6 VOUT +In A 3 6 –In B 5 NC(1) V– 4 5 +In B V– 4 SO-8 NOTE: (1) Orient according to marking. MSOP-8, SO-8 NC = No Internal Connection. OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 3 ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V Boldface limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to VS /2, and VOUT = VS /2, VCM = VS /2, unless otherwise noted. OPAx363, OPAx364 PARAMETER CONDITION OFFSET VOLTAGE Input Offset Voltage, OPA363I, OPA364I VOS OPA2363I, OPA2364I OPA363AI, OPA364AI, OPA2363AI, OPA2364AI, OPA4364AI Drift dVOS /dT vs Power Supply PSRR Channel Separation, dc INPUT BIAS CURRENT Input Bias Current over Temperature Input Offset Current NOISE Input Voltage Noise, f = 0.1Hz to 10Hz Input Voltage Noise Density, f = 10kHz Input Current Noise Density, f = 10kHz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio MIN VS = +5V 1 3 80 1 VS = 1.8V to 5.5V, VCM = 0 IOS en en in FREQUENCY RESPONSE Gain Bandwidth Product Slew Rate SR Settling Time, 0.1% 0.01% Overload Recovery Time Total Harmonic Distortion + Noise OUTPUT Voltage Output Swing from Rail over Temperature Short-Circuit Current Capacitive Load Drive (V–) – 0.1V < VCM < (V+) + 0.1V TEMPERATURE RANGE Specified Range Operating Range Storage Range Thermal Resistance SOT23-5, SOT23-6 MSOP-8, MSOP-10, SO-8 TSSOP-14, SO-14 500 900 2.5 µV µV mV µV/°C µV/V µV/V 330 pA pA µVp-p nV/√Hz fA/√Hz (V–) – 0.1 74 90 (V+) + 0.1 V dB 2 3 pF pF 100 dB dB dB 7 5 1 1.5 0.8 0.002 MHz V/µs µs µs µs % 10 mV mV mA 1 20 µs µs V V µA RL = 10kΩ, 100mV < VO < (V+) – 100mV AOL 94 90 86 VS = +1.8V to +5.5V CL = 100pF GBW tS THD+N G = +1 VS = +5V, 4V Step, G = +1 VS = +5V, 4V Step, G = +1 VIN • Gain > VS VS = +5V, G = +1, f = 20Hz to 20kHz RL = 10kΩ RL = 10kΩ ISC CLOAD SHUTDOWN (for OPAx363) tOFF tON(1) VL (shutdown) VH (amplifier is active) IQSD POWER SUPPLY Specified Voltage Range Operating Voltage Range Quiescent Current (per amplifier) UNITS 10 17 0.6 INPUT CAPACITANCE Differential Common-Mode OPEN-LOOP GAIN Open-Loop Voltage Gain OPA4364AI over Temperature MAX ±1 ±10 See Typical Characteristics ±1 ±10 IB VCM CMRR TYP 20 20 See Typical Characteristics See Typical Characteristics (V–) + 0.8 5.5 0.9 0.75 (V+) VS IQ 1.8 5.5 1.8 to 5.5 650 850 1.1 VS = +1.8V VS = +3.6V VS = +5.5V –40 –40 –65 θJA 200 150 100 750 1000 1.4 V V µA µA mA +125 +150 +150 °C °C °C °C/W °C/W °C/W NOTE: (1) Part is considered enabled when input offset voltage returns to specified range. 4 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B TYPICAL CHARACTERISTICS At TCASE = +25°C, RL = 10kΩ, and connected to VS /2, VOUT = VS/2, VCM = VS/2, unless otherwise noted. COMMON-MODE REJECTION RATIO vs FREQUENCY OPEN-LOOP GAIN/PHASE vs FREQUENCY 120 0 100 –30 80 –60 60 –90 40 –120 20 –150 0 –180 100 90 CMRR (dB) 70 Phase (°) Voltage Gain (dB) 80 60 50 40 30 20 10 –20 0 10 100 1k 10k 100k 1M 10M 10 100M 100 1k 10k 100k 1M 10M Frequency (Hz) Frequency (Hz) POWER-SUPPLY REJECTION RATIO vs FREQUENCY QUIESCENT CURRENT vs SUPPLY VOLTAGE 100 1.4 Per Amplifier Quiescent Current (mA) PSRR (dB) 80 60 40 20 0 1.0 0.8 0.6 0.4 1 10 100 1k 10k 100k 1M 10M 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Frequency (Hz) Supply Voltage (V) TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 6.0 1 VOUT = –10dBv G = 10, RL = 2kΩ VS = 1.8V 0.1 G = 10, RL = 2kΩ VS = 5V (VS = 5V, VOUT = 1Vrms) 0.1 G = 10, RL = 10kΩ VS = 1.8V, 5V 0.01 G = 1, RL = 2kΩ VS = 1.8V G = 1, RL = 2kΩ VS = 5V 0.0001 100 1k 0.01 G = 10, RL = 10kΩ 0.001 G = 1, RL = 10kΩ VS = 1.8V, 5V 0.001 10 G = 10, RL = 2kΩ THD+N (%) 1 THD+N (%) 1.2 G = 1, RL = 2kΩ 0.0001 10k 100k 10 100 1k 10k 100k Frequency (Hz) Frequency (Hz) OPA363, 2363, 364, 2364, 4364 SBOS259B G = 1, RL = 10kΩ www.ti.com 5 TYPICAL CHARACTERISTICS (Cont.) At TCASE = +25°C, RL = 10kΩ, and connected to VS /2, VOUT = VS/2, VCM = VS/2, unless otherwise noted. INPUT VOLTAGE NOISE SPECTRAL DENSITY vs FREQUENCY SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE 120 Short-Circuit Current (mA) Input Voltage Noise (nV/√Hz) 1000 100 +ISC 80 60 40 –ISC 20 0 10 10 3 100 1k 10k 1.5 100k 4.0 4.5 5.0 2 Input Bias Current (pA) VS = ±0.9V 0 –1 VS = ±2.5V ±10 ±20 5.5 4 VS = ±1.65V TA = –40°C TA = +25°C TA = +125°C VS = ±1.65V ±30 ±40 ±50 ±60 ±70 0 –2 VCM = +5.1V –4 –6 –8 –10 –0.5 ±80 ±90 ±100 VCM = –0.1V 0.5 1.5 2.5 3.5 4.5 5.5 Common-Mode Voltage (V) Output Current (mA) INPUT BIAS CURRENT vs TEMPERATURE INPUT OFFSET CURRENT vs TEMPERATURE 10k 10k Input Bias Current (pA) Input Offset Current (pA) 3.5 INPUT BIAS CURRENT vs INPUT COMMON-MODE VOLTAGE –2 1k 100 10 1 –50 –25 0 25 50 75 100 1k 100 10 1 –50 125 –25 0 25 50 75 100 125 Temperature (°C) Temperature (°C) 6 3.0 OUTPUT VOLTAGE SWING vs OUTPUT CURRENT 1 0 2.5 Supply Voltage (V) VS = ±2.5V –3 2.0 Frequency (Hz) 2 Output Voltage (V) 100 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B TYPICAL CHARACTERISTICS (Cont.) At TCASE = +25°C, RL = 10kΩ, and connected to VS /2, VOUT = VS/2, VCM = VS/2, unless otherwise noted. SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE SETTLING TIME vs CLOSED-LOOP GAIN 100 60 Settling Time (µs) Overshoot (%) 50 40 30 20 G = +1 0.01% 10 0.1% 1 10 G = +10 0.1 0 100 1k 1 10 Load Capacitance (pF) OFFSET VOLTAGE PRODUCTION DISTRIBUTION OFFSET DRIFT DISTRIBUTION 16 20 Typical Production Distribution of Packaged Units Percent of Amplifiers (%) 14 Percent of Amplifiers (%) 100 Closed-Loop Gain (V/V) 15 10 5 12 OPA36xAI 10 8 6 4 2 0 0 0 1 2 3 4 5 6 7 8 9 –2.5 > 10 –2.0 –1.0 0 1.0 2.0 2.5 Offset Voltage (mV) Offset Voltage Drift (µV/°C) OUTPUT ENABLE CHARACTERISTIC (VS = 5V, VOUT = 20kHz Sinusoid) CHANNEL SEPARATION vs FREQUENCY 130 VENABLE VOUT Channel Separation (dB) 120 110 100 90 80 70 60 50 40 50µs/div 10 100 1k 10k 100k 1M 10M Frequency (Hz) OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 7 TYPICAL CHARACTERISTICS (Cont.) At TCASE = +25°C, RL = 10kΩ, and connected to VS /2, VOUT = VS/2, VCM = VS/2, unless otherwise noted. SMALL-SIGNAL STEP RESPONSE (CL = 100pF) 1V/div 50mV/div LARGE-SIGNAL STEP RESPONSE (CL = 100pF) 250ns/div 1µs/div APPLICATIONS INFORMATION VS Regulated Charge Pump VOUT = VCC +1.8V The OPA363 and OPA364 series op amps are rail-to-rail operational amplifiers with excellent CMRR, low noise, low offset, and wide bandwidth on supply voltages as low as ±0.9V. The OPA363 features an additional pin for shutdown/ enable function. These families do not exhibit phase reversal and are unity-gain stable. Specified over the industrial temperature range of –40°C to +125°C, the OPA363 and OPA364 families offer precision performance for a wide range of applications. VCC + 1.8V IBIAS Patent Pending Very Low Ripple Topology IBIAS RAIL-TO-RAIL INPUT The OPA363 and OPA364 feature excellent rail-to-rail operation, with supply voltages as low as ±0.9V. The input common-mode voltage range of the OPA363 and OPA364 family extends 100mV beyond supply rails. The unique input topology of the OPA363 and OPA364 eliminates the input offset transition region typical of most rail-to-rail complimentary stage operational amplifiers, allowing the OPA363 and OPA364 to provide superior common-mode performance over the entire common-mode input range, as seen in Figure 1. This feature prevents degradation of the differential linearity error and THD when driving A/D converters. A simplified schematic of the OPA363 and OPA364 is shown in Figure 2. VOUT IBIAS VIN– VIN+ IBIAS 1.0 OPA363 and OPA364 0.5 FIGURE 2. Simplified Schematic. 0 VOS (mV) –0.5 –1.0 OPERATING VOLTAGE –1.5 The OPA363 and OPA364 series op amp parameters are fully specified from +1.8V to +5.5V. Single 0.1µF bypass capacitors should be placed across supply pins and as close to the part as possible. Supply voltages higher than 5.5V (absolute maximum) may cause permanent damage to the amplifier. Many specifications apply from –40°C to +125°C. Parameters that vary significantly with operating voltages or temperature are shown in the Typical Characteristics. –2.0 Competitors –2.5 –3.0 –3.5 –0.2 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Common-Mode Voltage (V) FIGURE 1. OPA363 and OPA364 have Linear Offset Over Entire Common-Mode Range. 8 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B ENABLE FUNCTION INPUT AND ESD PROTECTION The shutdown (enable) function of the OPA363 is referenced to the negative supply voltage of the operational amplifier. A logic level HIGH enables the op amp. A valid logic HIGH is defined as voltage > 75% of the positive supply applied to the enable pin. The valid logic HIGH signal can be as much as 5.5V above the negative supply, independent of the positive supply voltage. A valid logic LOW is defined as < 0.8V above the negative supply pin. If dual or split power supplies are used, care should be taken to ensure logic input signals are properly referred to the negative supply voltage. This pin should be connected to a valid high or low voltage or driven, not left open circuit. All OPA363 and OPA364 pins are static protected with internal ESD protection diodes tied to the supplies. These diodes will provide overdrive protection if the current is externally limited to 10mA, as stated in the absolute maximum ratings and shown in Figure 4. The logic input is a high-impedance CMOS input. Dual op amps are provided separate logic inputs. For battery-operated applications, this feature may be used to greatly reduce the average current and extend battery life. The enable time is 20µs; disable time is 1µs. When disabled, the output assumes a high-impedance state. This allows the OPA363 to be operated as a “gated” amplifier, or to have its output multiplexed onto a common analog output bus. CAPACITIVE LOAD The OPA363 and OPA364 series op amps can drive a wide range of capacitive loads. However, all op amps under certain conditions may become unstable. Op amp configuration, gain, and load value are just a few of the factors to consider when determining stability. An op amp in unity-gain configuration is the most susceptible to the effects of capacitive load. The capacitive load reacts with the output resistance of the op amp to create a pole in the small-signal response, which degrades the phase margin. In unity gain, the OPA363 and OPA364 series op amps perform well with a pure capacitive load up to approximately 1000pF. The ESR (Equivalent Series Resistance) of the loading capacitor may be sufficient to allow the OPA363 and OPA364 to directly drive very large capacitive loads (> 1µF). Increasing gain enhances the amplifier’s ability to drive more capacitance. See the typical characteristic “Small-Signal Overshoot vs Capacitive Load.” One method of improving capacitive load drive in the unitygain configuration is to insert a 10Ω to 20Ω resistor in series with the output, as shown in Figure 3. This significantly reduces ringing with large capacitive loads. However, if there is a resistive load in parallel with the capacitive load, it creates a voltage divider introducing a dc error at the output and slightly reduces output swing. This error may be insignificant. For instance, with RL = 10kΩ and RS = 20Ω, there is only about a 0.2% error at the output. V+ OPAx363 OPAx364 VIN RS VOUT 10Ω to 20Ω RL CL V+ IOVERLOAD 10mA max VOUT OPAx363 VIN 5kΩ FIGURE 4. Input Current Protection. ACHIEVING OUTPUT SWING TO THE OP AMP’S NEGATIVE RAIL Some applications require an accurate output voltage swing from 0V to a positive full-scale voltage. A good single supply op amp may be able to swing within a few mV of single supply ground, but as the output is driven toward 0V, the output stage of the amplifier will prevent the output from reaching the negative supply rail of the amplifier. The output of the OPA363 or OPA364 can be made to swing to ground, or slightly below, on a single supply power source. To do so requires use of another resistor and an additional, more negative power supply than the op amp’s negative supply. A pulldown resistor may be connected between the output and the additional negative supply to pull the output down below the value that the output would otherwise achieve as shown in Figure 5. V+ = +5V OPA363 OPA364 VOUT VIN 500µA Op Amp’s Negative Supply Grounded RP = 10kΩ –V = –5V (Additional Negative Supply) FIGURE 5. OPA363 and OPA364 Swing to Ground. This technique will not work with all op amps. The output stage of the OPA363 and OPA364 allows the output voltage to be pulled below that of most op amps, if approximately 500µA is maintained through the output stage. To calculate the appropriate value load resistor and negative supply, RL = –V/500µA. The OPA363 and OPA364 have been characterized to perform well under the described conditions, maintaining excellent accuracy down to 0V and as low as –10mV. Limiting and nonlinearity occur below –10mV, with linearity returning as the output is again driven above –10mV. FIGURE 3. Improving Capacitive Load Drive. OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 9 BUFFERED REFERENCE VOLTAGE Many single-supply applications require a mid-supply reference voltage. The OPA363 and OPA364 offer excellent capacitive load drive capability, and can be configured to provide a 0.9V reference voltage, as can be seen in Figure 6. For appropriate loading considerations, see the “Capacitive Load” section. V+ V+ R1 10kΩ V+ = 1.8V V+ = 1.8V 100Ω OPA363 OPA364 ADS8324 VIN 1nF FIGURE 7. The OPA363 and OPA364 Directly Drive the ADS8324. OPAx363 OPAx364 0.9V V+ CL = 1µF V+ R2 10kΩ 100Ω OPA363 OPA364 MSP430 VIN 1nF FIGURE 6. The OPA363 and OPA364 Provide a Stable Reference Voltage. DIRECTLY DRIVING THE ADS8324 AND THE MSP430 FIGURE 8. Driving the 12-Bit A/D Converter on the MSP430. The OPA363 and OPA364 series op amps are optimized for driving medium speed (up to 100kHz) sampling A/D converters. However, they also offer excellent performance for higher speed converters. The no crossover input stage of the OPA363 and OPA364 directly drive A/D converters without degradation of differential linearity and THD. They provide an effective means of buffering the A/D converters input capacitance and resulting charge injection while providing signal gain. Figure 7 and Figure 8 show the OPA363 and OPA364 configured to drive the ADS8324 and the 12-bit A/D converter on the MSP430. AUDIO APPLICATIONS The OPA363 and OPA364 op amp family has linear offset voltage over the entire input common-mode range. Combined with low-noise, this feature makes the OPA363 and OPA364 suitable for audio applications. Single supply 1.8V operation allows the OPA2363 and OPA2364 to be optimal candidates for dual stereo-headphone drivers and microphone pre-amplifiers in portable stereo equipment, see Figures 9 and 10. 20kΩ V+ 1µF 20kΩ One of Right or Left Channel 20kΩ 20kΩ 1/2 OPA2363 V+ 10kΩ V– 1/2 TPS6100 47pF 10kΩ One of Right or Left Headphone Out V– Internally Biased V– FIGURE 9. OPA2363 Configured as Half of a Dual Stereo Headphone Driver. 10 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B ACTIVE FILTERING Low harmonic distortion and noise specifications plus high gain and slew rate make the OPA363 and OPA364 optimal candidates for active filtering. Figure 11 shows the OPA2363 configured as a low-distortion, 3rd-order GIC (General Immittance Converter) filter. Figure 12 shows the implementation of a Sallen-Key, 3-pole, low-pass Bessel filter. 49kΩ Clean 3.3V Supply 3.3V 4kΩ OPAx363 OPAx364 Electret Microphone VOUT 5kΩ 6kΩ 1µF FIGURE 10. Microphone Preamplifier. VIN R1 R3 3.92kΩ 1.33kΩ 2 3 R11 3.92kΩ R12 3.92kΩ 7 1/2 OPA2363 2 6 VOUT C4 1000pF 3 6 OPA363 1/2 OPA2363 1 C13 1000pF 5 R14 3.48kΩ C15 1000pF FIGURE 11. The OPA2363 as a 3rd-Order, 40kHz, Low-Pass GIC Filter. 220pF 1.8kΩ 19.5kΩ 150kΩ VIN = 1Vrms 3.3nF 47pF OPA363 VOUT FIGURE 12. The OPA363 or OPA364 Configured as a 3-Pole, 20kHz, Sallen-Key Filter. OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 11 PACKAGE DRAWINGS DBV (R-PDSO-G6) PLASTIC SMALL-OUTLINE 0,95 6X 6 0,50 0,25 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0 –8 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-5/G 01/02 NOTES: A. B. C. D. 12 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Leads 1, 2, 3 may be wider than leads 4, 5, 6 for package orientation. OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B PACKAGE DRAWINGS (Cont.) D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 8 PINS SHOWN 0.020 (0,51) 0.014 (0,35) 0.050 (1,27) 8 0.010 (0,25) 5 0.008 (0,20) NOM 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) Gage Plane 1 4 0.010 (0,25) 0°– 8° A 0.044 (1,12) 0.016 (0,40) Seating Plane 0.010 (0,25) 0.004 (0,10) 0.069 (1,75) MAX PINS ** 0.004 (0,10) 8 14 16 A MAX 0.197 (5,00) 0.344 (8,75) 0.394 (10,00) A MIN 0.189 (4,80) 0.337 (8,55) 0.386 (9,80) DIM 4040047/E 09/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15). Falls within JEDEC MS-012 OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 13 PACKAGE DRAWINGS (Cont.) DGS (S-PDSO-G10) PLASTIC SMALL-OUTLINE PACKAGE 0,27 0,17 0,50 10 0,08 M 6 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°– 6° 5 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073272/B 08/01 NOTES: A. B. C. A. 14 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-187 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B PACKAGE DRAWINGS (Cont.) DBV (R-PDSO-G5) PLASTIC SMALL-OUTLINE 0,50 0,30 0,95 5 0,20 M 4 1,70 1,50 1 0,15 NOM 3,00 2,60 3 Gage Plane 3,00 2,80 0,25 0° – 8° 0,55 0,35 Seating Plane 1,45 0,95 0,05 MIN 0,10 4073253-4/G 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-178 OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 15 PACKAGE DRAWINGS (Cont.) DGK (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,38 0,25 0,65 8 0,08 M 5 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°– 6° 4 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073329/C 08/01 NOTES: A. B. C. D. 16 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC MO-187 OPA363, 2363, 364, 2364, 4364 www.ti.com SBOS259B PACKAGE DRAWINGS (Cont.) PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 OPA363, 2363, 364, 2364, 4364 SBOS259B www.ti.com 17 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty OPA2363AIDGSR ACTIVE MSOP DGS 10 2500 None CU NIPDAU Level-3-235C-168 HR OPA2363AIDGST ACTIVE MSOP DGS 10 250 None CU NIPDAU Level-3-235C-168 HR OPA2363IDGSR ACTIVE MSOP DGS 10 2500 None CU NIPDAU Level-3-235C-168 HR OPA2363IDGST ACTIVE MSOP DGS 10 250 None CU NIPDAU Level-3-235C-168 HR OPA2364AID ACTIVE SOIC D 8 100 None Call TI Level-3-235C-168 HR OPA2364AIDGKR ACTIVE MSOP DGK 8 2500 None CU NIPDAU Level-1-220C-UNLIM OPA2364AIDGKT ACTIVE MSOP DGK 8 250 None CU NIPDAU Level-1-220C-UNLIM OPA2364AIDR ACTIVE SOIC D 8 2500 None Call TI Level-3-235C-168 HR Lead/Ball Finish MSL Peak Temp (3) OPA2364ID ACTIVE SOIC D 8 100 None Call TI Level-1-220C-UNLIM OPA2364IDGKR ACTIVE MSOP DGK 8 2500 None CU NIPDAU Level-1-220C-UNLIM OPA2364IDGKT ACTIVE MSOP DGK 8 250 None CU NIPDAU Level-1-220C-UNLIM OPA2364IDR ACTIVE SOIC D 8 2500 None Call TI Level-1-220C-UNLIM OPA363AID ACTIVE SOIC D 8 100 None Call TI Level-3-235C-168 HR OPA363AIDBVR ACTIVE SOT-23 DBV 6 3000 None Call TI Level-3-250C-168 HR OPA363AIDBVT ACTIVE SOT-23 DBV 6 250 None Call TI Level-3-250C-168 HR OPA363AIDR ACTIVE SOIC D 8 2500 None Call TI Level-3-235C-168 HR OPA363ID ACTIVE SOIC D 8 100 None Call TI Level-3-235C-168 HR OPA363IDBVR ACTIVE SOT-23 DBV 6 3000 None Call TI Level-3-260C-168 HR OPA363IDBVT ACTIVE SOT-23 DBV 6 250 None Call TI Level-3-260C-168 HR OPA363IDR ACTIVE SOIC D 8 2500 None Call TI Level-1-220C-UNLIM OPA364AID ACTIVE SOIC D 8 100 None Call TI Level-3-235C-168 HR OPA364AIDBVR ACTIVE SOT-23 DBV 5 3000 None CU NIPDAU Level-3-220C-168 HR OPA364AIDBVT ACTIVE SOT-23 DBV 5 250 None CU NIPDAU Level-3-220C-168 HR OPA364AIDR ACTIVE SOIC D 8 2500 None Call TI Level-3-235C-168 HR OPA364ID ACTIVE SOIC D 8 100 None Call TI Level-3-235C-168 HR OPA364IDBVR ACTIVE SOT-23 DBV 5 3000 None CU NIPDAU Level-3-250C-168 HR OPA364IDBVT ACTIVE SOT-23 DBV 5 250 None CU NIPDAU Level-3-250C-168 HR OPA364IDR ACTIVE SOIC D 8 2500 None Call TI Level-3-235C-168 HR OPA4364AID ACTIVE SOIC D 14 58 None CU NIPDAU Level-1-220C-UNLIM OPA4364AIDR ACTIVE SOIC D 14 2500 None CU NIPDAU Level-1-220C-UNLIM OPA4364AIPWR ACTIVE TSSOP PW 14 2500 None CU NIPDAU Level-3-235C-168 HR OPA4364AIPWT ACTIVE TSSOP PW 14 250 None CU NIPDAU Level-3-235C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2005 at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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