ADS8364 ADS 836 ® 4 SBAS219C – JUNE 2002 – REVISED AUGUST 2006 250kSPS, 16-Bit, 6-Channel Simultaneous Sampling ANALOG-TO-DIGITAL CONVERTERS FEATURES DESCRIPTION ● ● ● ● ● ● ● ● The ADS8364 includes six, 16-bit, 250kSPS ADCs (Analogto- Digital converters) with 6 fully differential input channels grouped into two pairs for high-speed simultaneous signal acquisition. Inputs to the sample-and-hold amplifiers are fully differential and are maintained differential to the input of the ADC. This provides excellent common-mode rejection of 80dB at 50KHz that is important in high-noise environments. 6 INPUT CHANNELS FULLY DIFFERENTIAL INPUTS 6 INDEPENDENT 16-BIT ADC 4µs TOTAL THROUGHPUT PER CHANNEL TESTED NO MISSING CODES TO 14 BITS BUFFERED REFERENCE INPUTS LOW POWER: 450mW TQFP-64 PACKAGE The ADS8364 offers a flexible high-speed parallel interface with a direct address mode, a cycle, and a FIFO mode. The output data for each channel is available as a 16-bit word. APPLICATIONS ● MOTOR CONTROL ● MULTI-AXIS POSITIONING SYSTEMS ● 3-PHASE POWER CONTROL CH A0+ CH A0– CDAC S/H Amp Comp SAR HOLDA CH A1+ Interface CDAC A0 CH A1– S/H Amp A1 Comp A2 Conversion and Control CH B0+ CH B0– ADD RD CDAC WR S/H Amp CS Comp FD EOC CLK SAR CH B1+ CDAC S/H Amp Comp CH C0+ BYTE 16 CH B1– CH C0– RESET FIFO Register 6x HOLDB Data Input/Output CDAC S/H Amp Comp SAR HOLDC CH C1+ CDAC CH C1– S/H Amp Comp REFIN REFOUT Internal 2.5V Reference Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. Copyright © 2002-2006, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. www.ti.com ABSOLUTE MAXIMUM RATINGS ELECTROSTATIC DISCHARGE SENSITIVITY Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted)(1) Supply Voltage, AGND to AVDD ............................................................... –0.3V to 6V Supply Voltage, BGND to BVDD ............................................................... –0.3V to 6V Supply Voltage, DGND to DVDD .............................................................. –0.3V to 6V Analog Input Voltage Range ..................... AGND – 0.3V to AVDD + 0.3V Reference Input Voltage ........................... AGND – 0.3V to AVDD + 0.3V Digital Input Voltage Range ...................... BGND – 0.3V to BVDD + 0.3V Ground Voltage Differences, AGND to BGND/DGND ..................... ±0.3V Voltage Differences, BVDD, DVDD to AGND .......................... –0.3V to 6V Input Current ot Any Pin Except Supply ......................... –20mA to 20mA Power Dissipation ....................................... See Dissipation Rating Table Operating Virtual Junction Temperature Range, TJ ........ –40°C to 150°C Operating Free-Air Temperature Range, TA ...................... –40°C to 85°C Storage Temperature Range, TSTG .................................. –65°C to 150°C Lead Temperature 1.6mm (1/16 inch) from Case for 10sec ..................... 260°C This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. NOTE: (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions of extended periods may affect device reliability. PACKAGE/ORDERING INFORMATION(1) PRODUCT MAXIMUM INTEGRAL LINEARITY ERROR (LSB) NO MISSING CODES ERROR (LSB) ADS8364Y ±8 " " PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE 14 TQFP-64 PAG –40°C to +85°C " " " " ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS8364Y/250 Tape and Reel, 250 ADS8364Y/2K Tape and Reel, 2000 NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com. PACKAGE DISSIPATION RATING TABLE BOARD PACKAGE RθJC RθJA DERATING FACTOR ABOVE TA = +25°C Low-K(1) PAG PAG 8.6°C/W 8.6°C/W 68.5°C/W 42.8°C/W 14.598mW/°C 23.364mw/°C High-K(2) TA ≤ +25°C POWER RATING TA = +70°C POWER RATING TA = +85°C POWER RATING 1824mW 2920mW 1168mW 1869mW 949mW 1519mW NOTES: (1) The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top of the board. (2) The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on the top and bottom of the board. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT Supply Voltage, AGND to AVDD Supply Voltage, BGND to BVDD 4.75 2.7 4.5 4.75 –0.3 1.5 2.2 0 –40 5 5.25 3.6 5.5 5.25 0.3 2.6 2.8 ±VREF 125 V V V V V V V V °C Low-Voltage Levels 5V Logic Levels Supply Voltage, DGND to DVDD Difference AVDD to DVDD Reference Input Voltage Operating Common-Mode Signal Analog Inputs Operating Junction Temperature Range, TJ –IN +IN – (–IN) 5 5 0 2.5 2.5 EQUIVALENT INPUT CIRCUIT AVDD BVDD RON = 20Ω C(SAMPLE) = 20pF AIN DIN AGND Equivalent Analog Input Circuit 2 Diode Turn-on Voltage: 0.35V BGND Equivalent Digital Input Circuit ADS8364 www.ti.com SBAS219C ELECTRICAL CHARACTERISTICS Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = DVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, fSAMPLE = 250kSPS, unless otherwise noted. ADS8364Y PARAMETER CONDITIONS ANALOG INPUT Full-Scale Range Operating Common-Mode Signal Input Resistance Input Capacitance Input Leakage Current Differential Input Resistance Differential Input Capacitance Common-Mode Rejection Ratio (FSR) TYP(1) MAX UNITS ±VREF 2.8 20 25 ±1 40 50 84 80 300 V V Ω pF nA Ω pF dB dB MHz ±3 1.5 ±1.5 ±0.05 0.2 0.8 ±0.05 0.005 2 120 –87 Bits Bits LSB LSB LSB mV mV ppm/°C %FSR %FSR ppm/°C µVRMS dB +IN – (–IN) 2.2 (CMRR) Bandwith (BW) DC ACCURACY Resolution No Missing Codes Integral Linearity Error Integral Linearity Match Differential Nonlinearity Bipolar Offset Error Bipolar Offset Error Match Bipolar Offset Error Drift Gain Error Gain Error Match Gain Error Drift Noise Power-Supply Rejection Ratio –IN = VREF –IN = VREF –IN = VREF –IN = VREF –IN = VREF At DC VIN = ±1.25VPP at 50kHz FS Sinewave, –3dB 16 14 (NMC) (INL) (DNL) (VOS) Only pair wise matching Specified only for 14-Bit Only pair wise matching (TCVOS) (GERR) Referenced to VREF Only pair wise matching (TCGERR) SAMPLING DYNAMICS Conversion Time per ADC Acquisition Time Throughput Rate Aperture Delay Aperture Delay Matching Aperture Jitter Clock Frequncy (PSRR) 4.75V < AVDD < 5.25V (tCONV) (tAQ) 50kHz ≤ fCLK ≤ 5MHz fCLK = 5MHz 3.2 800 ±8 ±2 1 ±0.25 0.05 320 250 5 100 50 0.05 AC ACCURACY Total Harmonic Distortion Spurous-Free Dynamic Range Signal-to-Noise Ratio Signal-to-Noise Ratio + Distortion Channel-to-Channel Isolation Effective Number of Bits VOLTAGE REFERENCE OUTPUT Reference Voltage Output Initial Accuracy Output Voltage Temperature Drift Output Voltage Noise MIN (THD) (SFDR) (SNR) (SINAD) VIN = ±2.5VPP at 100kHz VIN = ±2.5VPP at 100kHz VIN = ±2.5VPP at 100kHz VIN = ±2.5VPP at 100kHz VIN = ±2.5VPP at 50kHz –92 93.5 83.2 82.5 95 13.3 (ENOB) (VOUT) 2.475 VOLTAGE REFERENCE INPUT Reference Voltage Input Reference Input Resistance Reference Input Capacitance Reference Input Current f = 0.1Hz to 10Hz, CL = 10µF f = 10Hz to 10kHz, CL = 10µF (PSRR) (IOUT) (ISC) to 0.1% at CL = 0 (VIN) 2.5 ±20 40 8 60 10 0.5 100 (dVOUT/dT) Power-Supply Refection Ratio Output Current Short-Circuit Current Turn-On Settling Time 5 1.5 100 2.5 µs ns kSPS ns ps ps MHz dB dB dB dB dB Bits 2.525 ±1 V % ppm/°C µVPP µVRMS dB µA mA µs 2.6 V MΩ pF µA 5 1 NOTE: (1) All values are at TA = +25°C. ADS8364 SBAS219C www.ti.com 3 ELECTRICAL CHARACTERISTICS (Cont.) Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = DVDD = 5V, VREF = internal +2.5V, fCLK = 5MHz, fSAMPLE = 250kSPS, unless otherwise noted. ADS8364Y PARAMETER CONDITIONS MIN TYP(1) MAX UNITS BVDD + 0.3 0.3 • BVDD ±50 V V nA pF INPUTS(2) DIGITAL Logic Family High-Level Input Voltage Low-Level Input Voltage Input Current Input Capacitance DIGITAL OUTPUTS(2) Logic Family High-Level Output Voltage Low-Level Output Voltage High-Impedance-State Output Current Output Capacitance Load Capacitance Data Format DIGITAL INPUTS(3) Logic Family High-Level Input Voltage Low-Level Input Voltage Input Current Input Capacitance DIGITAL OUTPUTS(3) Logic Family High-Level Output Voltage Low-Level Output Voltage High-Impedance-State Output Current Output Capacitance Load Capacitance Data Format CMOS (VIH) (VIL) (IIN) (CI) VI = BVDD or GND 5 CMOS (VOH) (VOL) (IOZ) (CO) (CL) BVDD = 4.5V, IOH = –100µA BVDD = 4.5V, IOL = 100µA CS = BVDD, VI = BVDD or GND 4.44 0.5 ±50 5 30 V V nA pF pF Binary Two's Complement LVCMOS (VIH) (VIL) (IIN) (CI) BVDD = 3.6V BVDD = 2.7V VI = BVDD or GND (VOH) (VOL) (IOZ) (CO) (CL) BVDD = 2.7V, IOH = –100µA BVDD = 2.7V, IOL = 100µA CS = BVDD, VI = BVDD or GND 2 –0.3 BVDD + 0.3 0.8 ±50 5 V V nA pF LVCMOS BVDD – 0.2 30 V V nA pF pF 5.25 3.6 5.5 5.25 90 300 300 4 470.9 471.5 V V V V mA µA µA mA mW mW 0.2 ±50 5 Binary Two's Complement POWER SUPPLY Analog Supply Voltage Buffer I/O Supply Voltage (AVDD) (BVDD) Digital Supply Voltage Analog Operating Supply Current Buffer I/O Operating Supply Current (DVDD) (AIDD) (BIDD) Digital Operating Supply Current Power Dissipation 0.7 • BVDD –0.3 Low-Voltage Levels 5V Logic Levels 4.75 2.7 4.5 4.75 80 BVDD = 3V BVDD = 5V (DIDD) BVDD = 3V BVDD = 5V 200 2.5 413.1 413.5 NOTES: (1) All values are at TA = +25°C. (2) Applies for 5.0V nominal Supply: BVDD (min) = 4.5V and BVDD (max) = 5.5V. (3) Applies for 3.0V nominal Supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V. 4 ADS8364 www.ti.com SBAS219C A2 ADD RESET 57 56 55 54 53 52 51 50 BGND A1 58 BVDD A0 AVDD 59 HOLD A 60 HOLD B 61 HOLD C 62 AGND 63 REFOUT CH A0+ 64 REFIN CH A0– PIN CONFIGURATION 49 CH A1– 1 48 D0 CH A1+ 2 47 D1 AVDD 3 46 D2 AGND 4 45 D3 SGND 5 44 D4 CH B0+ 6 43 D5 CH B0– 7 42 D6 AVDD 8 AGND 9 41 D7 ADS8364 40 D8 SGND 10 39 D9 CH B1– 11 38 D10 CH B1+ 12 37 D11 27 28 29 30 31 32 BGND BGND 26 CS 25 WR 24 RD 23 CLK 22 EOC 21 FD 20 BVDD 19 BYTE 18 DVDD 17 NC 33 D15 DGND 34 D14 CH C0+ 16 CH C1+ 35 D13 SGND 15 CH C1– 36 D12 CH C0– AVDD 13 AGND 14 PIN DESCRIPTIONS PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 NAME I/O DESCRIPTION CH A1– AI Inverting Input Channel A1 CH A1+ AI Noninverting Input channel A1 AVDD P Analog Power Supply AGND P Analog Ground SGND P Signal Ground CH B0+ AI Noninverting Input Channel B0 CH B0– AI Inverting Input Channel B0 AVDD P Analog Power Supply AGND P Analog Ground SGND P Signal Ground CH B1– AI Inverting Input Channel B1 CH B1+ AI Noninverting Input Channel B1 AVDD P Analog Power Supply AGND P Analog Ground SGND P Signal Ground CH C0+ AI Noninverting Input Channel C0 CH C0– AI Inverting Input Channel C0 CH C1– AI Inverting Input Channel C1 CH C1+ AI Noninverting Input Channel C1 NC – No Connection DGND P Digital ground connected to AGND. DVDD P +5V Power Supply for Digital Logic Connected to AVDD. BYTE DI 2 x 8 Output Capability. Active HIGH. BVDD P Power supply for digital interface from 3V to 5V. BGND P Buffer Digital Ground FD DO First Data, A0 Data EOC DO End of Conversion, Active LOW CLK DI An external CMOS compatible clock can be applied to the CLK input to synchronize the conversion process to an external source. RD DI Read, Active LOW WR DI Write, Active LOW CS DI Chip Select, Active LOW PIN NAME I/O DESCRIPTION 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 BGND DB15 DB14 DB13 DB12 DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 BGND BVDD RESET ADD A2 A1 A0 HOLDA HOLDB HOLDC AVDD AGND REFOUT REFIN CH A0+ CH A0– P DO DO DO DO DO DO DO DO DIO DIO DIO DIO DIO DIO DIO DIO P P DI DI DI DI DI DI DI DI P P AO AI AI AI Buffer Digital Ground Data Bit 15-MSB Data Bit 14 Data Bit 13 Data Bit 12 Data Bit 11 Data Bit 10 Data Bit 9 Data Bit 8 Data Bit 7, Software Input 7 Data Bit 6, Software Input 6 Data Bit 5, Software Input 5 Data Bit 4, Software Input 4 Data Bit 3, Software Input 3 Data Bit 2, Software Input 2 Data Bit 1, Software Input 1 Data Bit 0, Software Input 0 Buffer Digital Ground Power Supply for Digital Interface from 3V to 5V Global Reset, Active LOW Address Mode Select Address Line 3 Address Line 2 Address Line 1 Hold Command A Hold Command B Hold Command C Analog Power Supply Analog Ground Reference Output, attach 0.1µF and 10µF capacitors. Reference Input Noninverting Input Channel A0 Inverting Input Channel A0 NOTE: AI is Analog Input, AO is Analog Output, DI is Digital Input, DO is Digital Output, DIO is Digital Input/Output, P is Power Supply Connection. ADS8364 SBAS219C www.ti.com 5 TIMING CHARACTERISTICS tC1 CLK 1 tW1 2 16 17 18 tD1 19 20 1 2 ACQUISITION tACQ CONVERSION tCONV HOLDX tW3 tW2 EOC CS tD4 tD5 tW6 RD tW5 tD6 tD7 D15-D8 Bits 15-8 Bits 15-8 D7-D0 Bits 7-0 Bits 7-0 BYTE TIMING CHARACTERISTICS TABLE Timing Characteristics over recommended operating free-air temperature range TMIN to TMAX, AVDD = DVDD = 5V, REFIN = REFOUT internal reference +2.5V, fCLK = 5MHz, fSAMPLE = 250kSPS, BVDD = 2.7 ÷ 5V (unless otherwise noted). SPEC DESCRIPTION MIN tCONV tACQ tC1 tW1 tD1(5) tW2 Conversion Time Acquistion Time Cycle Time of CLK Pulse Width CLK HIGH Time or LOW Time. Delay Time of Rising Edge of Clock After Falling Edge of HOLD (A,B,C) Pulse Width of HOLDX HIGH Time to be Recognized again tW3 Pulse Width of HOLDX LOW Time tW4 Pulse Width of RESET tW5 Pulse Width of RD HIGH Time tD2 Delay Time of First Hold After RESET tD4 tD5 tW6 Delay Time of Falling Edge of RD After Falling Edge of CS Delay Time of Rising Edge of CS After Rising Edge of RD Pulse Width of RD and CS Both LOW Time tW7 Pulse Width of RD HIGH Time tD6 Delay Time of Data Valid After Falling Edge RD tD7 Delay Time of Data Hold From Rising Edge of RD tD8 Delay Time of RD HIGH After CS LOW tD9 Delay Time of RD Low After Address Setup BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD = = = = = = = = = = 5V 3V 5V 3V 5V 3V 5V 3V 5V 3V BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD BVDD = = = = = = = = = = = = 5V 3V 5V 3V 5V 3V 5V 3V 5V 3V 5V 3V 200 60 10 15 30 20 30 20 40 30 40 20 40 0 0 50 70 20 40 40 60 5 10 50 60 10 20 TYP(1) MAX UNITS 3.2 0.8 µs µs ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns NOTES: (1) Assured by design. (2) All input signals are specified with tr = tf = 5ns (10% to 90% of BVDD) and timed from a voltage level of (VIL + VIH)/2. (3) See timing diagram above. (4) BYTE is asynchronous; when BYTE is 0, bits 15 through 0 appear at DB15-DB0. When BYTE is 1, bits 15 through 8 appear on DB7-DB0. RD may remain LOW between changes in BYTE. (5) Only important when synchronization to clock is important. 6 ADS8364 www.ti.com SBAS219C TYPICAL CHARACTERISTICS At TA = +25°C, AVDD = DVDD = +5V, BVDD = 3V VREF = internal +2.5V and fCLK = 5MHz, fSAMPLE = 250kSPS, unless otherwise noted. INTEGRAL LINEARITY ERROR vs CODE 5 4 Typical curve for all six channels. 2 3 2 1 DNL (LSB) INL (LSB) DIFFERENTIAL LINEARITY ERROR vs CODE 3 Typical curve for all six channels 1 0 –1 0 –1 –2 –3 –2 –4 –5 0000H 8000H C000H –3 0000H FFFFH 4000H 8000H C000H FFFFH Output Code Output Code MINIMUM AND MAXIMUM INL OF ALL CHANNELS vs TEMPERATURE MINIMUM AND MAXIMUM DNL OF ALL CHANNELS vs TEMPERATURE 3 Minimum and Maximum DNL (LSB) Minimum and Maximum INL (LSB) 4 4000H 3 2 1 0 –1 –2 2 1 0 –1 –2 –3 –3 –50 3.0 –25 0 25 50 75 100 –50 –25 0 25 50 75 Temperature (°C) Temperature (°C) INTEGRAL LINEARITY MATCH OF CHANNELS A0 AND A1 vs CODE FREQUENCY SPECTRUM (4096 point FFT, FIN = 100kHz, –0.2dB) 100 0 –20 2.0 Amplitude (dB) INL Match (LSB) –40 1.0 0.0 –1.0 –60 –80 –100 –120 –2.0 –3.0 0000H –140 –160 4000H 8000H C000H FFFFH ADS8364 SBAS219C 0 31 62 93 125 Frequency (kHz) Output Code www.ti.com 7 TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, AVDD = DVDD = +5V, BVDD = 3V VREF = internal +2.5V and fCLK = 5MHz, fSAMPLE = 250kSPS, unless otherwise noted. SIGNAL-TO-NOISE RATIO AND SIGNAL-TO-NOISE + DISTORTION vs INPUT FREQUENCY 100 1.0 0.8 90 SNR and SINAD (dB) 95 SNR and SINAD (dB) DELTA OF SIGNAL-TO-NOISE RATIO AND SIGNAL-TO-NOISE + DISTORTION vs TEMPERATURE (ALL CH) SNR 85 80 SINAD 75 0.6 SNR 0.4 0.2 0.0 –0.2 –0.4 SINAD –0.6 70 –0.8 65 –1.0 100 125 10 –50 –25 Frequency (kHz) 25 50 75 100 Temperature (°C) SPURIOUS-FREE DYNAMIC RANGE AND TOTAL HARMONIC DISTORTION vs INPUT FREQUENCY (All CH) 110 0 DELTA OF SPURIOUS-FREE DYNAMIC RANGE AND TOTAL HARMOINC DISTORTION vs TEMPERATURE (ALL CH) –110 3 3 2 2 –100 THD 90 –90 THD SFDR (dB) SFR THD (dB) SFDR (dB) 100 1 1 0 0 –1 80 –1 –80 SFR –2 70 1 –70 100 125 10 –2 –3 –50 –25 Frequency (kHz) 0 50 –3 100 75 OFFSET MATCHING BETWEEN CHANNELS vs TEMPERATURE 0.40 0.35 Channel A Offset Matching (mV) 0.30 Offset (mV) 25 Temperature (°C) OFFSET OF ALL CHANNELS vs TEMPERATURE 0.40 THD (dB) 1 0.25 0.20 0.15 0.10 0.30 0.20 Channel B Channel C 0.10 0.05 0.00 0.00 –50 –25 0 25 50 75 –50 100 8 –25 0 25 50 75 100 Temperature (°C) Temperature (°C) ADS8364 www.ti.com SBAS219C TYPICAL CHARACTERISTICS (Cont.) At TA = +25°C, AVDD = DVDD = +5V, BVDD = 3V VREF = internal +2.5V and fCLK = 5MHz, fSAMPLE = 250kSPS, unless otherwise noted. POSITIVE GAIN MATCH OF ALL CHANNELS vs TEMPERATURE 0.0025 Channel B 0.0020 Channel A 0.0015 Channel C 0.0010 –50 –25 0 25 50 75 NEGATIVE GAIN MATCH OF ALL CHANNELS vs TEMPERATURE 0.0025 Negative Gain Match (%FSR) Positive Gain Match (%FSR) 0.0030 Channel C 0.0020 Channel A 0.0015 Channel B 0.0010 0.0005 0.0000 –50 100 –25 50 75 100 75 100 75 100 2.49600 Channel A Channel B Channel C 2.49400 Reference Voltages (V) 0.060 Gain Error (%FSR) 25 REFOUT vs TEMPERATURE GAIN ERROR OF CHANNELS vs TEMPERATURE 0.065 0 Temperature (°C) Temperature (°C) 0.055 0.050 0.045 0.040 2.49200 2.49000 2.48800 2.48600 0.035 2.48400 0.030 2.48200 –50 –25 0 25 50 Temperature (°C) 75 100 –50 0 25 50 Temperature (°C) CHANNEL-TO-CHANNEL ISOLATION –80 –25 IQ vs TEMPERATURE 83.0 82.0 81.0 80.0 –95 IQ (mV) Signal on Ch B1 (dB) –90 –100 79.0 78.0 77.0 76.0 –105 75.0 –110 74.0 0 10 20 30 40 50 AC Frequency on Ch B0 (kHz) –25 0 25 50 Temperature (°C) ADS8364 SBAS219C –50 www.ti.com 9 INTRODUCTION The ADS8364 is a high-speed, low-power, 6-channel simultaneous sampling and converting, 16-bit ADC that operates from a single +5V supply. The input channels are fully differential with a typical common-mode rejection of 80dB. The part contains six 4µs successive approximation ADCs, six differential sample-and-hold amplifiers, an internal +2.5V reference with REFIN and REFOUT pins and a high-speed parallel interface. There are six analog inputs that are grouped into three channel pairs (A, B, and C). There are six ADCs, one for each input that can be sampled and converted simultaneously, thus preserving the relative phase information of the signals on both analog inputs. Each pair of channels has a hold signal (HOLDA, HOLDB, and HOLDC) to allow simultaneous sampling on each channel pair, on four or on all six channels. The part accepts a differential analog input voltage in the range of –VREF to +VREF, centered on the common-mode voltage (see the Analog Input Section). The part will also accept bipolar input ranges when a level shift circuit is used at the front end (see Figure 6). A conversion is initiated on the ADS8364 by bringing the HOLDX pin LOW for a minimum of 20ns. HOLDX LOW places the sample-and-hold amplifiers of the X channels in the hold state simultaneously and the conversion process is started on each channel. The EOC output will go LOW for half a clock cycle when the conversion is latched into the output register. The data can be read from the parallel output bus following the conversion by bringing both RD and CS LOW. Conversion time for the ADS8364 is 3.2µs when a 5MHz external clock is used. The corresponding acquisition time is 0.8µs. To achieve the maximum output data rate (250kSPS), the read function can be performed during the next conversion. Note: This mode of operation is described in more detail in the Timing and Control section of this data sheet. 50ps (also known as aperture jitter). These specifications reflect the ability of the ADS8364 to capture AC input signals accurately at the exact same moment in time. REFERENCE Under normal operation, the REFOUT (pin 61) can directly be connected to the REFIN pin (pin 62) to provide an internal +2.5V reference to the ADS8364. The ADS8364 can operate, however, with an external reference in the range of 1.5V to 2.6V, for a corresponding full-scale range of 3.0V to 5.2V, as long as the input does not exceed the AVDD + 0.3V value. The reference of the ADS8364 is double-buffered. If the internal reference is used to drive an external load, a buffer is provided between the reference and the load applied to pin 61 (the internal reference can typically source 10µA of current—load capacitance should be 0.1µF and 10µF to minimize noise). If an external reference is used, the threesecond buffers provide isolation between the external reference and the CDACs. These buffers are also used to recharge all of the capacitors of all CDACs during conversion. ANALOG INPUT The analog input is bipolar and fully differential. There are two general methods of driving the analog input of the ADS8364: single-ended or differential, as shown in Figure 1 and Figure 2. When the input is single-ended, the –IN input is held at the common-mode voltage. The +IN input swings around the same common voltage and the peak-to-peak amplitude is the (common-mode + VREF) and the (common-mode – VREF). The value of VREF determines the range over which the common-mode voltage may vary (see Figure 3). –VREF to +VREF peak-to-peak SAMPLE-AND-HOLD SECTION The sample-and-hold amplifiers on the ADS8364 allow the ADCs to accurately convert an input sine wave of full-scale amplitude to 16-bit resolution. The input bandwidth of the sample-and-hold is greater than the Nyquist rate (Nyquist equals one-half of the sampling rate) of the ADC even when the ADC is operated at its maximum throughput rate of 250kSPS. The typical small-signal bandwidth of the sampleand-hold amplifiers is 300MHz. Typical aperture delay time or the time it takes for the ADS8364 to switch from the sample to the hold mode following the negative edge of HOLDX signal is 5ns. The average delta of repeated aperture delay values is typically 10 ADS8364 Common Voltage Single-Ended Input VREF peak-to-peak Common Voltage ADS8364 VREF peak-to-peak Differential Input FIGURE 1. Methods of Driving the ADS8364 Single-Ended or Differential. ADS8364 www.ti.com SBAS219C +IN CM + VREF +VREF CM Voltage –IN = CM Voltage –VREF t CM – VREF Single-Ended Inputs +IN CM + 1/2VREF +VREF CM Voltage –VREF –IN CM – 1/2VREF t Differential Inputs NOTES: Common-Mode Voltage (Differential Mode) = (+IN) + (–IN) , Common-Mode Voltage (Single-Ended Mode) = IN–. 2 The maximum differential voltage between +IN and –IN of the ADS8364 is VREF. See Figures 3 and 4 for a further explanation of the common voltage range for single-ended and differential inputs. FIGURE 2. Using the ADS8364 in the Single-Ended and Differential Input Modes. 5 5 AVDD = 5V 4.55 AVDD = 5V 3 2.7 Single-Ended Input 2.3 2 1 1.2 3 Differential Input 2 1.0 1 0.45 0 0 –1 –1 1.0 4.0 4 3.8 Common Voltage Range (V) Common Voltage Range (V) 4 1.5 2.0 2.5 2.6 1.0 3.0 1.5 2.0 2.5 2.6 3.0 VREF (V) VREF (V) FIGURE 3. Single-Ended Input: Common-Mode Voltage Range vs VREF. FIGURE 4. Differential Input: Common-Mode Voltage Range vs VREF. When the input is differential, the amplitude of the input is the difference between the +IN and –IN input, or: (+IN) – (–IN). The peak-to-peak amplitude of each input is ±1/2VREF around this common voltage. However, since the inputs are 180° out-of-phase, the peak-to-peak amplitude of the differential voltage is +VREF to –VREF. The value of VREF also determines the range of the voltage that may be common to both inputs, as shown in Figure 4. In each case, care should be taken to ensure that the output impedance of the sources driving the +IN and –IN inputs are matched. Often, a small capacitor (20pF) between the positive and negative input helps to match their impedance. Otherwise, this may result in offset error, which will change with both temperature and input voltage. The input current on the analog inputs depends on a number of factors as sample rate or input voltage. Essentially, the ADS8364 SBAS219C www.ti.com 11 current into the ADS8364 charges the internal capacitor array during the sampling period. After this capacitance has been fully charged, there is no further input current. The source of the analog input voltage must be able to charge the input capacitance (25pF) to a 16-bit settling level within 3 clock cycles if the minimum acquisition time is used. When the converter goes into the hold mode, the input impedance is greater than 1GΩ. R1 4kΩ 1.2kΩ 20kΩ –IN 1183 930 906 813 720 0 680 167 32803 32804 32805 32806 32807 32808 32809 32810 32811 67 0 32812 32813 ADS8364 R2 OPA227 TRANSITION NOISE 2726 1.2kΩ Bipolar Input Care must be taken regarding the absolute analog input voltage. The +IN and –IN inputs should always remain within the range of AGND – 0.3V to AVDD + 0.3V. The transition noise of the ADS8364 itself is low, as shown in Figure 5. These histograms were generated by applying a low-noise DC input and initiating 8000 conversions. The digital output of the ADC will vary in output code due to the internal noise of the ADS8364. This is true for all 16-bit, SAR-type ADCs. Using a histogram to plot the output codes, the distribution should appear bell-shaped with the peak of the bell curve representing the nominal code for the input value. The ±1σ, ±2σ, and ±3σ distributions will represent the 68.3%, 95.5%, and 99.7%, respectively, of all codes. The transition noise can be calculated by dividing the number of codes measured by 6 and this will yield the ±3σ distribution, or 99.7%, of all codes. Statistically, up to three codes could fall outside the distribution when executing 1000 conversions. Remember, to achieve this low-noise performance, the peakto-peak noise of the input signal and reference must be < 50µV. +IN OPA227 BIPOLAR INPUT R1 R2 ±10V ±5V ±2.5V 1kΩ 2kΩ 4kΩ 5kΩ 10kΩ 20kΩ REFOUT (pin 61) 2.5V FIGURE 6. Level Shift Circuit for Bipolar Input Ranges. TIMING AND CONTROL The ADS8364 uses an external clock (CLK, pin 28) which controls the conversion rate of the CDAC. With a 5MHz external clock, the ADC sampling rate is 250kSPS which corresponds to a 4µs maximum throughput time. Acquistion and conversion takes a total of 20 clock cycles. THEORY OF OPERATION The ADS8364 contains six 16-bit ADCs that can operate simultaneously in pairs. The three hold signals (HOLDA, HOLDB, and HOLDC) initiate the conversion on the specific channels. A simultaneous hold on all six channels can occur with all three hold signals strobe together. The converted values are saved in six registers. For each read operation, the ADS8364 outputs 16 bits of information (16 Data or 3 Channel Address, Data Valid, and some synchronization information). The Address/Mode signals (A0, A1, and A2) select how the data is read from the ADS8364. These Address/Mode signals can define a selection of a single channel, a cycle mode that cycles through all channels, or a FIFO mode that sequences the data determined by the order of the hold signals. The FIFO mode will allow the six registers to be used by a single-channel pair and, therefore, three locations for CH X0 and three locations for CH X1 can be updated before they are read from the part. Code EXPLANATION OF CLOCK, RESET , FD, AND EOC PINS FIGURE 5. 8000 Conversion Histogram of a DC Input. BIPOLAR INPUTS The differential inputs of the ADS8364 were designed to accept bipolar inputs (–VREF and +VREF) around the common-mode voltage (2.5V), which corresponds to a 0V to 5V input range with a 2.5V reference. By using a simple op amp circuit featuring four, high-precision external resistors, the ADS8364 can be configured to accept bipolar inputs. The conventional ±2.5V, ±5V, and ±10V input ranges could be interfaced to the ADS8364 using the resistor values shown in Figure 6. 12 Clock—An external clock has to be provided for the ADS8364. The maximum clock frequency is 5MHz. The minimum clock cycle is 200ns (Timing Diagram, tC1), and the clock has to remain HIGH (Timing Diagram, tW1) or LOW for at least 60ns. RESET —Bringing reset signal LOW will reset the ADS8364. It will clear all the output registers, stop any actual conversions, and will close the sampling switches. The reset signal has to stay LOW for at least 20ns (see Figure 7, tW4). The reset signal should be back HIGH for at least 20ns (see Figure 7, tD2), before starting the next conversion (negative hold edge). ADS8364 www.ti.com SBAS219C EOC—End of conversion goes low when new data of the internal ADC is latched into the output registers, which usually happens 16.5 clock cycles after hold initiated the conversion. It remains low for half a clock cycle. If more than one channel pair is converted simultaneously, the A-channels get stored to the registers first (16.5 clock cycles after hold), followed by the B-channels one clock cycle later, and finally the C-channels at another clock cycle later. If a reading (RD and CS are LOW) is in process, then the latch process is delayed until the read operation is finished. FD—First data or A0 data is HIGH if channel A0 is chosen to be read next. In the FIFO mode whatever channel X0 is written to the FIFO first is latched into the A0 register. So, for example, when the FIFO is empty, FD is 0. Then the first result is latched into the FIFO register A0 is, therefore, chosen to be read next, and FD rises. After the first channel is read (1-3 read cycles depending on BYTE and ADD) FD goes LOW again. The ADS8364 can also convert one channel continuously (see Figure 8). Therefore, HOLDA and HOLDC are kept HIGH all the time. To gain acquisition time, the falling edge of HOLDB takes place just before the rising edge of clock. One conversion requires 20 clock cycles. Here, data is read after the next conversion is initiated by HOLDB. To read data from channel B, A1 is set HIGH and A2 is LOW. As A0 is LOW during the first reading (A2 A1 A0 = 010) data B0 is put to the output. Before the second RD, A0 switches HIGH (A2 A1 A0 = 011) so data from channel B1 is read, as shown in Table II. However, reading data during the conversion or on a falling hold edge might cause a loss in performance. A2 A1 A0 0 0 0 CHA0 0 0 1 CHA1 0 1 0 CHB0 0 1 1 CHB1 1 0 0 CHC0 1 0 1 CHC1 1 1 0 Cycle mode reads registers START OF A CONVERSION AND READING DATA By bringing one, two, or all of the HOLDX signals LOW, the input data of the corresponding channel X is immediately placed in the hold mode (5ns). The conversion of this channel X follows with the next rising edge of clock. If it is important to detect a hold command during a certain clock-cycle, then the falling edge of the hold signal has to occur at least 10ns before the rising edge of clock, as shown in Figure 7, tD1. The hold signal can remain LOW without initiating a new conversion. The hold signal has to be HIGH for at least 15ns (as shown in Figure 7, tW2) before it is brought LOW again and hold has to stay LOW for at least 20ns (Figure 7, tW3). Once a particular hold signal goes low, further impulses of this hold signal are ignored until the conversion is finished or the part is reset. When the conversion is finished (after 16 clock cycles) the sampling switches will close and sample the selected channel. The start of the next conversion must be delayed to allow the input capacitor of the ADS8364 to be fully charged. This delay time depends on the driving amplifier, but should be at least 800ns. CHANNEL TO BE READ CHA0 through CHC1 on successive transitions of the read line. 1 1 1 FIFO Mode TABLE II. Address Control for RD Functions. Reading data (RD , CS )—In general, the channel/data outputs are in tri-state. Both CS and RD have to be LOW to enable these outputs. RD and CS have to stay LOW together for at least 40ns (see Timing Characteristics, tD6) before the output data is valid. RD has to remain HIGH for at least 30ns (see Timing Diagram, tW5) before bringing it back LOW for a subsequent read command. 16.5 clock-cycles after the start of a conversion (next rising edge of clock after the falling edge of HOLDX ), the new data is latched into its output register. Even if the ADS8364 is forced to wait until the read process is finished (RD signal going HIGH) before the new data gets latched into its output tC1 CLK tD1 tW1 HOLD A tW3 HOLD B tD2 tW2 HOLD C tW4 RESET FIGURE 7. Start of the Conversion. ADS8364 SBAS219C www.ti.com 13 CONVERSION CLK 1 2 ACQUISITION 16 17 18 19 20 1 2 HOLD B EOC CS RD A0 FIGURE 8. Timing of one Conversion Cycle. CLK 16 17 18 19 20 1 2 tD1 HOLD X tACQ EOC CS tD8 tW7 RD tD9 A0 FIGURE 9. Timing for Reading Data. register, the possibility still exists that the new data was latched to the output register just before the falling edge of RD. If a read process is initiated around 16.5 clock cycles after the conversion started, RD and CS should stay LOW for at least 50ns (see Timing Diagram, tW6) to get the new data stored to its register and switched to the output. CS being LOW tells the ADS8364 that the bus on the board is assigned to the ADS8364. If an ADC shares a bus with digital gates, there is a possibility that digital (high-frequency) noise will be coupled into the ADC. If the bus is just used by the ADS8364, CS can be hardwired to ground. Reading data at the falling edge of one of the HOLDX signals might cause noise. BYTE—If there is only an 8-bit bus available on a board, then BYTE can be set HIGH. (see Figure 11) In this case, the lower 8 bits can be read at the output pins D15 to D8 or D7 to D0 at the first RD signal and the higher bits after the second RD signal. If the ADS8364 is used in the cycle or the FIFO mode, then the address and a data valid information is added to the data if ADD is HIGH. In this case, the address will be read first, then the lower 8 bits, and finally the higher 8 bits. 14 If BYTE is LOW, then the ADS8364 operates in the 16-bit output mode. Here, data is read between the pins DB15 and DB0. As long as ADD is LOW, with every RD-impulse, data from a new channel is brought to the output. If ADD is HIGH, and the cycle or the FIFO mode is chosen; the first output word will contain the address, while the second output word contains the 16-bit data. ADD-Signal–In the cycle and the FIFO mode, it might be desirable to have address information with the 16-bit output data. Therefore, ADD can be set HIGH. In this case, two (or three readings if the part is operated with byte being HIGH) RD-signals are necessary to read data of one channel, while the ADS8364 provides channel information on the first RD signal (see Table III and Table IV). The signals ADD, A0, A1, A2, RESET, HOLDA, HOLDB, and HOLDC are accessible through the data bus and control word. All these pins are in OR configuration with hardware pins. When software configuration is used, the corresponding pins must be connected to ground or the power supply. When the MSB is HIGH, the device is in the configuration mode. MSB LOW will start conversion or reset the part. ADS8364 www.ti.com SBAS219C 0111111111111111 65535 0111111111111110 65534 0111111111111101 65533 0000000000000001 32769 0000000000000000 32768 1111111111111111 32767 1000000000000010 Step Digital Output Code Binary Two's Complement BTC 2 1000000000000001 1 1000000000000000 0 2.499962V VNFS = VCM – VREF = 0V 0.000038V 2.500038V VPFS = VCM + VREF = 5V VPFS – 1LSB = 4.999924V VBPZ = 2.5V 0.000076V 4.999848V Unipolar Analog Input Voltage 1LSB = 76µV 0.000152V VCM = 2.5V 16-BIT VREF = 2.5V Bipolar Input, Binary Two’s Complement Output: (BTC) Negative Full-Scale Code = VNFS = 8000H, Vcode = VCM – VREF Bipolar Zero Code = VBPZ = 0000H, Vcode = VCM Positive Full-Scale Code = VPFS = 7FFFH, Vcode = (VCM + VREF) – 1LSB FIGURE 10. Ideal Conversion Characteristics (Condition: Single-Ended, VCM = chXX– = 2.5V, VREF = 2.5V) CS RD BYTE D7 – D0 A0 A0 A1 A1 B0 B0 LOW HIGH LOW HIGH LOW HIGH B1 C0 C1 A0 FIGURE 11. Reading Data in Cycling Mode. ADS8364 SBAS219C www.ti.com 15 ADD = 0 BYTE = 0 BYTE = 1 A2 A1 A0 1st RD 2nd RD 1st RD 2nd RD 3rd RD 000 001 010 011 100 101 110 111 db15...db0 db15...db0 db15...db0 db15...db0 db15...db0 db15...db0 db15...db0 db15...db0 no 2nd RD no 2nd RD no 2nd RD no 2nd RD no 2nd RD no 2nd RD no 2nd RD no 2nd RD db7...db0 db7...db0 db7...db0 db7...db0 db7...db0 db7...db0 db7...db0 db7...db0 db15...db8 db15...db8 db15...db8 db15...db8 db15...db8 db15...db8 db15...db8 db15...db8 no 3rd RD no 3rd RD no 3rd RD no 3rd RD no 3rd RD no 3rd RD no 3rd RD no 3rd RD TABLE III. Overview of the Output Formats Depending on the Mode (Case ADD = 0). The HOLD signals will start conversion automatically on the next clock cycle. The format of the two words that can be writing to ADS8364 are shown in Table V. New data is always written into the next available register. At t0 (see Figure 12), the reset deletes all the existing data. At t1, the new data of the channels A0 and A1 are put into registers 0 and 1. At t2, the read process of channel A0 data is finished. Therefore, this data is dumped and A1 data is shifted to register 0. At t3, new data is available, this time from channels B0, B1, C0 and C1. This data is written into the next available registers (registers 1, 2, 3, and 4). On t4, the new read process of channel A1 data is finished. The new data of channel C0 and C1 at t5 is put on top (registers 4 and 5). GETTING DATA Flexible output modes: (A0, A1, A2) The ADS8364 has three different output modes that are selected with A2, A1, and A0. With (A2 A1 A0) = 000 to 101, a particular channel can directly be addressed (see Table II and Figure 9). The channel address should be set at least 10ns (see Figure 9, tD9) before the falling edge of RD and should not change as long as RD is LOW. In this standard address mode, ADD will be ignored, but should be connected to either ground or supply. With (A2 A1 A0) = 110, the interface is running in a cycle mode (see Figure 11). Here, data 7 down to 0 of channel A0 is read on the first RD-signal and 15 down to 8 on the second as BYTE is HIGH. Then A1 on the second, followed by B0, B1, C0, and finally, C1 before reading A0 again. Data from channel A0 is brought to the output first after a reset-signal or after powering the part up. The third mode is a FIFO mode that is addressed with (A2 A1 A0 = 111). Data of the channel that is converted first will be read first. So, if a particular channel pair is most interesting and is converted more frequently (e.g., to get a history of a particular channel pair) then there are three output registers per channel available to store data. ADD = 1 If all the output registers are filled up with unread data and new data from an additional conversion has to get latched in, then the oldest data gets thrown away. If a read process is going on (RD-signal LOW) and new data has to be stored, then the ADS8364 will wait until the read process is finished (RD-signal going HIGH) before the new data gets latched into its output register. Again, with the ADD signal, it can be chosen if the address should be added to the output data. In Cycle mode and in FIFO mode, the ADS8364 offers the ability to add the address of the channel to the output data. As there is just a 16-bit bus available (or 8-bit bus in the case byte is HIGH), an additional (RD-signal is necessary to get the information (see Table III and Table IV). The Output Code (DB15…DB0)–In the standard address mode (A2 A1 A0 = 000…101), the ADS8364 has a 16-bit output word on pins DB15…DB0 if BYTE = 0. If BYTE = 1 then two RD-impulses are necessary to first read the lower bits then the higher bits on either DB7…DB0 or DB15...DB8. The address of the channel (a2a1a0) and a data valid (dv) bit is added to the data if the ADS8364 is operated in the cycle or in the FIFO-mode and ADD is set HIGH. If BYTE = 0, then the data valid and the address of the channel is active during the first (RD-impulse (1000 0000 0000 dv a2 a1 a0). During the second (RD, the 16-bit data word can be read (db15…db0). If BYTE = 1, then three (RD-impulses are needed. On the first one, data valid, the three address bits and the data bits db3…db0 (dv, a2, a1, a0, db3, db2, db1, db0) are read, followed by the eight lower bits of the 16-bit data word BYTE = 0 BYTE = 1 A2A1A0 1st RD 2nd RD 1st RD 2nd RD 3rd RD 000 001 010 011 100 101 110 111 db15...db0 db15...db0 db15...db0 db15...db0 db15...db0 db15...db0 1000 0000 0000 dv a2 a1 a0 1000 0000 0000 dv a2 a1 a0 no 2nd RD no 2nd RD no 2nd RD no 2nd RD no 2nd RD no 2nd RD db15...db0 db15...db0 db7...db0 db7...db0 db7...db0 db7...db0 db7...db0 db7...db0 dv a2 a1 a0 db3 db2 db0 dv a2 a1 a0 db3 db2 db0 db15...db8 db15...db8 db15...db8 db15...db8 db15...db8 db15...db8 db7...db0 db7...db0 no 3rd RD no 3rd RD no 3rd RD no 3rd RD no 3rd RD no 3rd RD db15...db8 db15...db8 TABLE IV. Overview Over the Output formats Depending on the Mode in Case ADD = 1 DB7 (MSB) DB6 DB5 DB4 DB3 DB2 DB1 1 X X X ADD A2 A1 DB0 (LSB) A0 0 X X X RESET HOLDA HOLDB HOLDC TABLE V. Data Register Bits. 16 ADS8364 www.ti.com SBAS219C RESET EOC Conversion Channel A Conversion Channels B and C Conversion Channel C RD reg. 5 empty empty empty empty empty ch C1 reg. 4 empty empty empty ch C1 empty ch C0 reg. 3 empty empty empty ch C0 ch C1 ch C1 reg. 2 empty empty empty ch B1 ch C0 ch C0 reg. 1 empty ch A1 empty ch B0 ch B1 ch B1 reg. 0 empty ch A0 ch A1 ch A1 ch B0 ch B0 t1 t0 t2 t3 t4 t5 FIGURE 12. Functionality Diagram of FIFO Registers. (db7…db0) and finally the higher eight data bits (db15…db8). 1000 0000 0000 is added before the address in case BYTE = 0 and db3…db0 after the address if BYTE = 1. This provides the possibility to check if the counting of the RD signals inside the ADS8364 are still tracking with the external interface (see Table III and Table IV). The data valid bit is useful for the FIFO mode. Valid data can simply get read until dv turns 0. The three address bits are listed in Table VI. If the FIFO is empty, 16 zeroes are put to the output. a2 a1 a0 Data From Channel A0 0 0 0 Data From Channel A1 0 0 1 Data From Channel B0 0 1 0 Data From Channel B1 0 1 1 Data From Channel C0 1 0 0 Data From Channel C1 1 0 1 ing power supplies, nearby digital logic, or high-power devices. The degree of error in the digital output depends on the reference voltage, layout, and the exact timing of the external event. Their error can change if the external event changes in time with respect to the CLK input. With this in mind, power to the ADS8364 should be clean and well-bypassed. A 0.1µF ceramic bypass capacitor should be placed as close to the device as possible. In addition, a 1µF to 10µF capacitor is recommended. If needed, an even larger capacitor and a 5Ω or 10Ω series resistor may be used to lowpass filter a noisy supply. On average, the ADS8364 draws very little current from an external reference as the reference voltage is internally buffered. A bypass capacitor of 0.1µF and 10µF are suggested when using the internal reference (tie pin 61 directly to pin 62). GROUNDING TABLE VI. Address Bit in the Output Data. LAYOUT For optimum performance, care should be taken with the physical layout of the ADS8364 circuitry. This is particularly true if the CLK input is approaching the maximum throughput rate. The basic SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground connections, and digital inputs that occur just prior to latching the output of the analog comparator. Thus, driving any single conversion for an n-bit SAR converter, there are n windows in which large external transient voltages can affect the conversion result. Such glitches might originate from switch- The AGND and DGND pins should be connected to a clean ground point. In all cases, this should be the analog ground. Avoid connections that are too close to the grounding point of a microcontroller or digital signal processor. If required, run a ground trace directly from the converter to the powersupply entry point. The ideal layout will include an analog ground plane dedicated to the converter and associated analog circuitry. Three signal ground pins, SGND, are the input signal grounds which are on the same potential as analog ground. APPLICATION INFORMATION In Figures 13 through 18, different connection diagrams to DSPs or micro-controllers are shown. ADS8364 SBAS219C www.ti.com 17 3.3V ADS8364 DVDD BVDD BVDD HOLDA HOLDB 26 30 23 55 HOLDC FD WR A0 ADD A1 BYTE A2 CS 56 PWM1 57 PWM2 58 PWM3 54 EA0 53 EA1 52 EA2 EA3 31 8:1 OE RD EOC CLK RESET C28xx IS 29 RE 27 EXT_INT1 28 MCLKX 51 ADC_RST (MFSX) DATA [0] ... DATA [15] D0 ... D15 48 ... 33 VSS BGND FIGURE 13. Typical C28xx Connection (Hardware Control). BVDD 3.3V ADS8364 56 57 58 26 23 55 54 HOLDA BVDD C28xx DVDD HOLDB A2 HOLDC A1 FD 8:1 ADD BYTE CS A0 RD 31 OE 29 RE 30 53 A1 WR 52 A2 EOC CLK A0 IS WE 27 EXT_INT1 28 MCLKX DATA [0] ... DATA [15] 48 ... 33 D0 ... D15 VSS BGND FIGURE 14. Typical C28xx Connection (Software Control). 18 ADS8364 www.ti.com SBAS219C 3.3V ADS8364 DVDD BVDD BVDD HOLDA HOLDB 26 54 53 52 30 23 55 FD HOLDC 56 TOUT0 57 A2 58 A1 8:1 A0 CS A1 C54xx 31 A0 OE IS 29 A2 RD WR 30 27 ADD EOC BYTE CLK <1 I/OSTRB (1G32) 28 INT0 51 BCLKX1 RESET XF DATA [0] ... DATA [15] D0 ... D15 48 ... 33 VSS BGND FIGURE 15. Typical C54xx Connection (FIFO with Hardware Control). 3.3V ADS8364 BVDD BVDD HOLDA 30 53 52 23 54 WR HOLDB A1 HOLDC DVDD 56 TOUT1 57 A2 58 A1 8:1 A2 ADD A0 CS BYTE 31 OE 55 RE RD CLK RESET DATA [0] ... DATA [15] A0 IS BE0 29 EOC C67xx 27 INT0 28 TOUT0 51 DB_CNTL0 (ED27) 48 ... 33 D0 ... D15 VSS BGND FIGURE 16. Typical C67xx Connection (Cycle Mode – Hardware Control). ADS8364 SBAS219C www.ti.com 19 BVDD 3.3V ADS8364 56 57 58 26 23 55 54 HOLDA C67xx DVDD BVDD HOLDB HOLDC A2 A1 FD 8:1 ADD BYTE CS A0 RD 31 A0 IS OE 29 RE 30 53 A1 WR 52 A2 EOC CLK WE 27 INT0 28 TOUT0 DATA [0] ... DATA [15] D0 ... D15 48 ... 33 VSS BGND FIGURE 17. Typical C67xx Connection (Software Control). 3.3V ADS8364 BVDD DVDD BVDD HOLDA 30 52 54 53 23 55 29 WR HOLDB ADD HOLDC A1 A2 CS RESET BYTE EOC A0 CLK RD DATA [0] ... DATA [7] MSP430x1xx 56 TACLK (P1.0) 57 58 31 P1.1 51 P1.2 27 P1.3 (ADC_INT) 28 SMCLK (P1.4) 48 ... 41 P2.0 ... P2.7 VSS BGND FIGURE 18. Typical MSP430x1xx Connection (Cycle Mode – Hardware Control). 20 ADS8364 www.ti.com SBAS219C Revision History DATE REVISION PAGE 8/06 SECTION 1 — 2 Dissipation Ratings Table DESCRIPTION Changed Throughput Rate from 250kHz to 250kSPS throughout document. C Changed package from DGK to PAG. NOTE: Page numbers for previous revisions may differ from page numbers in the current version. ADS8364 SBAS219C www.ti.com 21 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) ADS8364Y/250 ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 ADS8364Y ADS8364Y/250G4 ACTIVE TQFP PAG 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 ADS8364Y ADS8364Y/2K ACTIVE TQFP PAG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 ADS8364Y ADS8364Y/2KG4 ACTIVE TQFP PAG 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 ADS8364Y (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ADS8364Y/250 TQFP PAG 64 250 180.0 24.4 13.0 13.0 1.5 16.0 24.0 Q2 ADS8364Y/2K TQFP PAG 64 2000 330.0 24.4 13.0 13.0 1.5 16.0 24.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS8364Y/250 TQFP PAG ADS8364Y/2K TQFP PAG 64 250 213.0 191.0 55.0 64 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996 PAG (S-PQFP-G64) PLASTIC QUAD FLATPACK 0,27 0,17 0,50 48 0,08 M 33 49 32 64 17 0,13 NOM 1 16 7,50 TYP Gage Plane 10,20 SQ 9,80 12,20 SQ 11,80 0,25 0,05 MIN 1,05 0,95 0°– 7° 0,75 0,45 Seating Plane 0,08 1,20 MAX 4040282 / C 11/96 NOTES: A. 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