MAAM26100 GaAs MMIC Power Amplifier 2.0 - 6.5 GHz Rev. V7 Die Features Saturated Power: 30.5 dBm Typical Gain: 19 dB Typical Power Added Efficiency: 30% On-Chip Bias Network DC Decoupled RF Input and Output RoHS* Compliant Description The MAAM26100 is a GaAs MMIC two stage high efficiency power amplifier. The MAAM26100 is a fully monolithic design which eliminates the need for external circuitry in 50-ohm systems. The MAAM26100 is ideally suited for driver amplifiers and transmitter outputs in UMTS applications, test equipment, electronic warfare jammers, missile subsystems and phased array radars. The MAAM26100 is fabricated using a mature 0.5-micron gate length GaAs process. The process features full passivation for increased performance reliability. Ordering Information Part Number Package MAAM26100 Die Absolute Maximum Ratings 1,2 Parameter Absolute Maximum VDD +9 V VG1, VG2 -2.5 V to -0.8 V VGG3 -6 V to -3 V RF Input Power +17 dBm Channel Temperature 150°C Storage Temperature -65°C to +150°C 1. Exceeding any one or combination of these limits may cause permanent damage to this device and will void product warranty. 2. M/A-COM does not recommend sustained operation near these survivability limits. 3. VGG rating applies when using the optional on-chip resistor network. 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM26100 GaAs MMIC Power Amplifier 2.0 - 6.5 GHz Rev. V7 Electrical Specifications: TA = 25°C, Z0 = 50 Ω, VDD = +8 V, VGG = -1.3 V nominal Parameter Test Conditions Units Min. Typ. Max. Small Signal Gain 2 - 6 GHz dB 15 19 — Input VSWR 2 - 6 GHz Ratio -— 2.0:1 — Output VSWR 2 - 6 GHz Ratio — 2.2:1 — Saturated Output Power Input Power +14 dBm, 2 - 6 GHz dBm 29 30.5 — Output Power at 1 dB Gain Compression 2 - 6 GHz dBm — 28 — Power Added Efficiency — % — 30 — Third Order Intercept 2 - 6 GHz dBm — 39 — Reverse Isolation 2 - 6 GHz dB — 30 — Bias Current No RF PIN = +14 dBm mA mA — — 390 475 — 650 Thermal Resistance 4 — °C/W — 14 — 4. Attachment method not included. Schematic VD1 VGG VG2 GND VD2 RF OUT RF IN VG1 E1 D1 C1 B1 A1 VG2 GND E2 D2 C2 B2 A2 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM26100 GaAs MMIC Power Amplifier 2.0 - 6.5 GHz Rev. V7 Typical Performance Curves Gain Input Return Loss 0 25 -5 20 -10 15 -15 10 -20 5 -25 1.5 2.5 3.5 4.5 5.5 6.5 7.5 0 1.5 2.5 50 34 40 32 30 30 20 28 10 26 2.5 3.5 4.5 5.5 Frequency (GHz) 4.5 5.5 6.5 7.5 6.5 7.5 Output Power @ PIN = +14 dBm Power Added Efficiency @ PIN = +14 dBm 0 1.5 3.5 Frequency (GHz) Frequency (GHz) 6.5 7.5 24 1.5 2.5 3.5 4.5 5.5 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM26100 GaAs MMIC Power Amplifier 2.0 - 6.5 GHz Handling Procedures Rev. V7 Typical Bias Configuration 5,6 Permanent damage to the MAAM26100 may occur if the following precautions are not adhered to: A. Cleanliness - The MAAM26100 should be handled in a clean environment. DO NOT attempt to clean assembly after the MAAM26100 is installed. B. Static Sensitivity - All die handling equipment and personnel should comply with DOD-STD1686 Class I. C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAM26100. Use shielded signal and bias cables to minimize inductive pick-up. D. General Handling - DO NOT touch the surface of the die. It is recommended that the MAAM26100 die be handled along the long side with a sharp pair of tweezers. Mounting The MAAM26100 is back-metallized with Pd/Ni/Au (100/1,000/30,000Å) metallization. It is recommended that the die be mounted with Au/Sn eutectic preforms. The attachment surface should be clean and flat. A. An 80/20 preform is recommended with a work surface temperature of approximately 255°C and a tool temperature of 265°C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be approximately 290°C. B. DO NOT expose the MAAM26100 to a temperature greater than 320°C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. VDD (VD1, VD2) 1000 pF minimum RF OUT RF IN VGG (VG1, VG2) 5. Nominal bias is obtained by first connecting -1.3 volts to pads VG1 and VG2 followed by connecting +8 volts to pads VD1 and VD2 (note sequence). 6. The recommended VDD range is +6 to +9 volts. Bonding Table7 Bin # Bond Pads 1 E1 to VG1, E2 to VG2 2 D1 to VG1, D2 to VG2 3 C1 to VG1, C2 to VG2 4 B1 to VG1, B2 to VG2 7. Optional on-chip resistor networks are used by connecting a nominal -5 volts to the pad VGG then connecting pads per the bonding table. Each gel pack is labeled with a CD # which corresponds to a Bin # in the bonding table. For example, CD1 on the gel pack corresponds to Bin 1, which means that pad E1 must be connected to pad VG1 and pad E2 must be connected to pad VG2. Bonding A. Ball or wedge bond with 1.0 mil diameter gold wire of 3.0 mil x 0.5 mil ribbon. Thermosonic bonding with a nominal stage temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to achieve reliable bonds. B. Bonds should be started on the die and terminated on the package. C. Bonding pads are 4.0 x 4.0 mils minimum. 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MAAM26100 GaAs MMIC Power Amplifier 2.0 - 6.5 GHz Rev. V7 Outline Drawing 3 4 5 6 7 28 9 27 10 22 24 23 21 20 26 13 14 19 12 15 11 16 17 Pad Configuration 8 Die Size: 2.342 x 1.802 x 0.102 mm (nominal) Pad No. X (mm) Y (mm) nominal nominal Pad Size (mm) Description Pad No. X (mm) Y (mm) nominal nominal Pad Size (mm) Description 3 0 0 .10 x .10 VD1 16 1.613 1.580 .10 x .10 A2 4 0.6435 0 .10 x .10 VGG 17 1.942 1.580 .10 x .10 GND 5 0.9235 0 .10 x .10 VG2 19 0.5525 1.580 .10 x .10 A1 6 1.0885 0 .15 x .10 GND 20 0.5025 1.420 .10 x .10 B1 7 1.954 0 .15 x .10 VD2 21 0.3525 1.380 .10 x .10 C1 9 1.979 0.640 .10 x .10 GND 22 0.2025 1.420 .10 x .10 D1 10 1.979 0.840 .10 x .20 RFOUT 23 0.1525 1.580 .10 x .10 E1 11 1.564 1.420 .10 x .10 B2 24 0.0025 1.580 .10 x .10 GND 12 1.413 1.380 .10 x .10 C2 26 0.3525 1.580 .10 x .10 VG1 13 1.263 1.420 .10 x .10 D2 27 -0.141 0.840 .10 x .20 RFIN 14 1.213 1.580 .15 x .10 E2 28 -0.141 0.640 .10 x .10 GND 15 1.413 1.580 .15 x .10 VG2 8. All X,Y locations are at pad center. 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 is considering for development. Performance is based on target specifications, simulated results, • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 and/or prototype measurements. Commitment to develop is not guaranteed. Visit www.macomtech.com for additional data sheets and product information. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice.