AP2426GEY-HF Halogen-Free Product Advanced Power Electronics Corp. DUAL N-CHANNEL ENHANCEMENT MODE POWER MOSFET ▼ Capable of 2.5V Gate Drive D1/D2 ▼ Lower on-resistance G2 S2 G1 S1 ▼ Surface Mount Package ▼ RoHS Compliant & Halogen-Free 2928-8 BVDSS 20V RDS(ON) 26.5mΩ ID 6A Description D1 Advanced Power MOSFETs utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely efficient and cost-effectiveness device. The 2928-8 J-lead package provides good performance and space saving like TSOP-6. G1 D2 G2 on-resistance S1 S2 Absolute Maximum Ratings Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID@TA=25℃ ID@TA=70℃ Rating Units 20 V +10 V 3 6 A 3 4.8 A 36 A 1.39 W Continuous Drain Current Continuous Drain Current 1 IDM Pulsed Drain Current PD@TA=25℃ Total Power Dissipation TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ Thermal Data Symbol Rthj-a Parameter Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice 3 Value Unit 90 ℃/W 1 201201202 AP2426GEY-HF Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units 20 - - V BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA RDS(ON) Static Drain-Source On-Resistance2 VGS=4.5V, ID=5A - 23 26.5 mΩ VGS=2.5V, ID=3A - 30 38 mΩ 0.3 - 1.2 V VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA gfs Forward Transconductance VDS=10V, ID=5A - 15 - S IDSS Drain-Source Leakage Current VDS=16V, VGS=0V - - 10 uA IGSS Gate-Source Leakage VGS=+10V, VDS=0V - - +30 uA Qg Total Gate Charge ID=5A - 7.5 12 nC Qgs Gate-Source Charge VDS=10V - 1 - nC Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 3 - nC td(on) Turn-on Delay Time VDS=10V - 7 - ns tr Rise Time ID=1A - 8 - ns td(off) Turn-off Delay Time RG=3.3Ω - 15 - ns tf Fall Time VGS=5V - 3 - ns Ciss Input Capacitance VGS=0V - 435 700 pF Coss Output Capacitance VDS=10V - 65 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 55 - pF Min. Typ. Source-Drain Diode Symbol Parameter 2 Test Conditions Max. Units VSD Forward On Voltage IS=1.1A, VGS=0V - - 1.2 V trr Reverse Recovery Time IS=5A, VGS=0V, - 14 - ns Qrr Reverse Recovery Charge dI/dt=100A/µs - 5 - nC Notes: 1.Pulse width limited by Max. junction temperature. 2.Pulse test 3.Surface mounted on 1 in2 copper pad of FR4 board, t <10sec ; 210 oC/W when mounted on Min. copper pad. THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. 2 AP2426GEY-HF 20 20 T A =25 o C 5.0V 4.5V 3.5V 2.5V V G =2.0V 5.0V 4.5V 3.5V 2.5V V G =2.0V 3 4 16 ID , Drain Current (A) ID , Drain Current (A) 16 o T A = 150 C 12 8 4 12 8 4 0 0 0 1 2 3 4 0 1 2 5 V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics 40 1.8 I D =3A I D =5A V G =4.5V T A =25 o C Normalized RDS(ON) RDS(ON) (mΩ) 36 32 28 1.4 1.0 24 0.6 20 1 2 3 4 5 -50 6 0 V GS , Gate-to-Source Voltage (V) 50 100 150 o T j , Junction Temperature ( C) Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature 2.0 8 I D =250uA 1.6 T j =150 o C Normalized VGS(th) (V) IS(A) 6 T j =25 o C 4 1.2 0.8 2 0.4 0 0.0 0 0.2 0.4 0.6 0.8 1 1.2 V SD , Source-to-Drain Voltage (V) Fig 5. Forward Characteristic of Reverse Diode 1.4 -50 0 50 100 150 o T j , Junction Temperature ( C) Fig 6. Gate Threshold Voltage v.s. Junction Temperature 3 AP2426GEY-HF f=1.0MHz 800 8 600 6 C (pF) VGS , Gate to Source Voltage (V) ID=5A V DS =10V 4 400 2 200 C iss C oss C rss 0 0 0 2 4 6 8 10 1 12 5 9 Q G , Total Gate Charge (nC) Fig 7. Gate Charge Characteristics 17 21 25 Fig 8. Typical Capacitance Characteristics 100 Normalized Thermal Response (Rthja) 1 Operation in this area limited by RDS(ON) 10 100us ID (A) 13 V DS , Drain-to-Source Voltage (V) 1ms 1 10ms 100ms 0.1 1s DC T A =25 o C Single Pulse 0.01 Duty factor=0.5 0.2 0.1 0.1 0.05 PDM t 0.02 T 0.01 Duty factor = t/T Peak Tj = PDM x Rthja + T a Rthja=210 oC/W Single Pulse 0.01 0.01 0.1 1 10 100 0.0001 0.001 0.01 V DS , Drain-to-Source Voltage (V) 0.1 1 10 100 1000 t , Pulse Width (s) Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance 8 ID , Drain Current (A) VG 6 QG 4.5V QGS 4 QGD 2 Charge Q 0 25 50 75 100 125 150 T A , Ambient Temperature ( o C ) Fig 11. Maximum Continuous Drain Current v.s. Ambient Temperature Fig 12. Gate Charge Waveform 4