ON MC14520BDWR2G Dual up counter Datasheet

MC14518B, MC14520B
Dual Up Counters
The MC14518B dual BCD counter and the MC14520B dual binary
counter are constructed with MOS P−channel and N−channel
enhancement mode devices in a single monolithic structure. Each
consists of two identical, independent, internally synchronous 4−stage
counters. The counter stages are type D flip−flops, with interchangeable
Clock and Enable lines for incrementing on either the positive−going or
negative−going transition as required when cascading multiple stages.
Each counter can be cleared by applying a high level on the Reset line.
In addition, the MC14518B will count out of all undefined states within
two clock periods. These complementary MOS up counters find
primary use in multi−stage synchronous or ripple counting applications
requiring low power dissipation and/or high noise immunity.
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MARKING
DIAGRAMS
16
PDIP−16
P SUFFIX
CASE 648
Features
•
•
•
•
•
•
1
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Internally Synchronous for High Internal and External Speeds
Logic Edge−Clocked Design — Incremented on Positive Transition
of Clock or Negative Transition on Enable
Capable of Driving Two Low−power TTL Loads or One Low−power
Schottky TTL Load Over the Rated Temperature Range
Pb−Free Packages are Available*
16
SOIC−16
DW SUFFIX
CASE 751G
Value
Unit
−0.5 to +18.0
V
−0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
±10
mA
PD
Power Dissipation,
per Package (Note 2.)
500
mW
TA
Operating Temperature Range
−55 to +125
°C
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
VDD
Vin, Vout
Iin, Iout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
145xxB
AWLYYWWG
1
16
SOEIAJ−16
F SUFFIX
CASE 966
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 1.)
Symbol
MC145xxBCP
AWLYYWWG
MC145xxB
ALYWG
1
xx
A
WL, L
YY, Y
WW, W
G
= 18 or 20
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Maximum Ratings are those values beyond which damage to the device
may occur.
2. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 5
1
Publication Order Number:
MC14518B/D
MC14518B, MC14520B
PIN ASSIGNMENT
CA
1
16
VDD
EA
2
15
RB
Q0A
3
14
Q3B
Q1A
4
13
Q2B
Q2A
5
12
Q1B
Q3A
6
11
Q0B
RA
7
10
EB
VSS
8
9
CB
BLOCK DIAGRAM
CLOCK
1
Q0
Q1
Q2
C
2
ENABLE
R
3
4
Q3
5
6
Q0
11
Q1
Q2
Q3
12
7
CLOCK
9
C
10
ENABLE
R
15
13
14
VDD = PIN 16
VSS = PIN 8
TRUTH TABLE
Clock
Enable
Reset
Action
1
0
Increment Counter
0
Increment Counter
0
No Change
0
No Change
0
No Change
0
No Change
1
Q0 thru Q3 = 0
0
X
X
0
1
X
X
X = Don’t Care
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2
MC14518B, MC14520B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
− 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (3.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
μAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
μAdc
IT
5.0
10
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (4.) (5.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (0.6 μA/kHz) f + IDD
IT = (1.2 μA/kHz) f + IDD
IT = (1.7 μA/kHz) f + IDD
3. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
4. The formulas given are for the typical characteristics only at 25_C.
5. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in μA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
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3
μAdc
MC14518B, MC14520B
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (6.) (CL = 50 pF, TA = 25_C)
All Types
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q/Enable to Q
tPLH, tPHL = (1.7 ns/pF) CL + 215 ns
tPLH, tPHL = (0.66 ns/pF) CL + 97 ns
tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,
tPHL
Reset to Q
tPHL = (1.7 ns/pF) CL + 265 ns
tPHL = (0.66 ns/pF) CL + 117 ns
tPHL = (0.66 ns/pF) CL + 95 ns
tPHL
VDD
Min
Typ (7.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
—
—
—
280
115
80
560
230
160
5.0
10
15
—
—
—
330
130
90
650
230
170
tw(H)
tw(L)
5.0
10
15
200
100
70
100
50
35
—
—
—
ns
fcl
5.0
10
15
—
—
—
2.5
6.0
8.0
1.5
3.0
4.0
MHz
tTHL, tTLH
5.0
10
15
—
—
—
—
—
—
15
5
4
μs
Enable Pulse Width
tWH(E)
5.0
10
15
440
200
140
220
100
70
—
—
—
ns
Reset Pulse Width
tWH(R)
5.0
10
15
280
120
90
125
55
40
—
—
—
ns
trem
5.0
10
15
–5
15
20
– 45
– 15
–5
—
—
—
ns
Clock Pulse Width
Clock Pulse Frequency
Clock or Enable Rise and Fall Time
Reset Removal Time
ns
6. The formulas given are for the typical characteristics only at 25_C.
7. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
500 μF
PULSE
GENERATOR
ID
0.01 μF
CERAMIC
C Q0
Q1
Q2
E Q3
R
CL
CL
CL
CL
VSS
20 ns
20 ns
50%
90%
10%
VARIABLE
WIDTH
VSS
Figure 1. Power Dissipation Test Circuit and Waveform
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4
MC14518B, MC14520B
20 ns
VDD
PULSE
GENERATOR
C
Q0
E
R
Q2
Q3
20 ns
90%
50%
10%
CLOCK
INPUT
tWH
Q1
CL
CL
VSS
CL
CL
tPLH
Q
tr
1
2 3
4 5
6
7 8
9 10 11 12 13 14 15 16 17 18
1
2 3
4 5
6
7 8
9 0 1
6
7 8
9 0
1
2 3
4 5
6
7 8
9 10 11 12 13 14 15 0
1 2
3
RESET
2 3
4 5
Q0
Q1
Q2
Q0
MC14520B
Q1
Q2
Q3
Figure 3. Timing Diagram
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5
tPHL
50%
10%
tf
CLOCK
ENABLE
Q3
VSS
tWL
90%
Figure 2. Switching Time Test Circuit and Waveforms
MC14518B
VDD
4
MC14518B, MC14520B
Q0
D
C
R
Q1
Q
D
Q
C
R
Q2
Q
D
Q
C
R
Q3
Q
D
Q
C
Q
R
Q
RESET
ENABLE
CLOCK
Figure 4. Decade Counter (MC14518B) Logic Diagram
(1/2 of Device Shown)
Q0
D
C
R
Q1
Q
D
Q
C
R
Q2
Q
D
Q
C
R
Q
D
Q
C
RESET
ENABLE
CLOCK
Figure 5. Binary Counter (MC14520B) Logic Diagram
(1/2 of Device Shown)
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6
Q3
Q
R
Q
MC14518B, MC14520B
ORDERING INFORMATION
Package
Shipping†
MC14518BCP
PDIP−16
500 Units / Rail
MC14518BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14518BDW
SOIC−16
47 Units / Rail
MC14518BDWG
SOIC−16
(Pb−Free)
47 Units / Rail
MC14518BDWR2
SOIC−16
1000 Units / Tape & Reel
MC14518BDWR2G
SOIC−16
(Pb−Free)
1000 Units / Tape & Reel
MC14518BFEL
SOEIAJ−16
2000 Units / Tape & Reel
MC14518BFELG
SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
MC14520BCP
PDIP−16
500 Units / Rail
MC14520BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14520BDW
SOIC−16
47 Units / Rail
MC14520BDWG
SOIC−16
(Pb−Free)
47 Units / Rail
MC14520BDWR2
SOIC−16
1000 Units / Tape & Reel
MC14520BDWR2G
SOIC−16
(Pb−Free)
1000 Units / Tape & Reel
MC14520BFEL
SOEIAJ−16
2000 Units / Tape & Reel
MC14520BFELG
SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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7
MC14518B, MC14520B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
S
−T−
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC−16
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751G−03
ISSUE C
A
D
9
1
8
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
h X 45 _
E
0.25
16X
M
T A
S
B
S
14X
e
L
A
0.25
B
B
A1
H
8X
M
B
M
16
q
SEATING
PLANE
T
C
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8
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.25
0.35
0.49
0.23
0.32
10.15
10.45
7.40
7.60
1.27 BSC
10.05
10.55
0.25
0.75
0.50
0.90
0_
7_
MC14518B, MC14520B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966−01
ISSUE O
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
c
A1
b
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.031
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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9
For additional information, please contact your
local Sales Representative.
MC14518B/D