CPC1786 1000V Single-Pole, Normally Open DC-Only Power Relay INTEGRATED CIRCUITS DIVISION Characteristics Description Parameter Blocking Voltage Rating Units 1000 VP IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of High Power Solid State Relays. As part of this new family, the CPC1786 single-pole normally open (1-Form-A) DC Solid State Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. Load Current, TA=25°C: With 5°C/W Heat Sink 1.75 No Heat Sink 0.65 On-Resistance (max) ADC 2 Thermal Resistance, Junction-to-Case, JC 0.35 °C/W Features • • • • • • • • • • 1.75ADC Load Current with 5°C/W Heat Sink Low 2 On-Resistance 1000VP Blocking Voltage 2500Vrms Input/Output Isolation Low Thermal Resistance: JC = 0.35 °C/W Isolated, Low Thermal Impedance Ceramic Pad for Heat Sink Applications Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Machine Insertable, Wave Solderable Applications • • • • Industrial Controls / Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications. The unique i4-PAC package pioneered by IXYS enables solid state relays to achieve the highest load current and power ratings. This package features an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal resistance (0.35°C/W). Ordering Information Part Description CPC1786J i4-PAC Package (25 per tube) Switching Characteristics Form-A Approvals • UL 508 Certified Component: File E69938 IF Pin Configuration 90% 10% ILOAD 1 2 + 3 - ton 4 - toff + e3 DS-CPC1786-R08 www.ixysic.com 1 CPC1786 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Absolute Maximum Ratings @ 25°C Symbol Blocking Voltage Ratings Units 1000 VP Reverse Input Voltage 5 V Input Control Current 100 mA 1 A 150 mW Peak (10ms) Input Power Dissipation Isolation Voltage, Input to Output 2500 Vrms Operational Temperature -40 to +85 °C Storage Temperature -40 to +125 °C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.2 Electrical Characteristics @ 25°C Parameter Conditions Symbol Minimum Typical Maximum Units 10 AP Output Characteristics Load Current 1 Peak Continuous Continuous Continuous 2 On-Resistance Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output t10ms No Heat Sink TC=25°C IL TC=99°C IL(99) IF=10mA, IL=1A RON - 1.5 2 VL=1000VP ILEAK - - 1 A ton - 1.9 20 toff - 0.08 5 VL=25V, f=1MHz Cout - 330 - pF IL=120mA IF - - 10 mA IF=5mA IF 0.6 - - mA VF 0.9 1.2 1.4 V VR=5V IR - - 10 A - CI/O - 1 - pF IF=20mA, VL=10V - - 0.65 6.9 ADC 0.8 ms 1 Higher load currents possible with proper heat sinking. Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (T > 60ºC) an LED drive current of 20mA is recommended. C 2 R08 www.ixysic.com 2 CPC1786 INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.35 °C/W Free Air JA 40 °C/W - TJ -40 to +100 °C Thermal Resistance (Junction to Case) Thermal Resistance (Junction to Ambient) Junction Temperature (Operating) 2.1 Thermal Management Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W. 2.2 Heat Sink Calculation Higher load currents are possible by using lower thermal resistance heat sink combinations. Heat Sink Rating θCA = (TJ - TA) IL(99)2 IL2 • PD(99) - θJC TJ = Junction Temperature (°C), TJ ≤ 100°C * TA = Ambient Temperature (°C) IL(99) = Load Current with Case Temperature @ 99°C (ADC) IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX) θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W) PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. 3 www.ixysic.com R08 CPC1786 INTEGRATED CIRCUITS DIVISION 3 Performance Data @ 25°C (Unless Otherwise Noted) 30 20 25 15 10 5 30 25 20 15 10 1.3275 1.3300 1.3325 1.4 1.3350 1.6 1.8 2.0 15 10 5 1.52 1.56 1.60 On-Resistance (Ω) IF=50mA IF=20mA IF=10mA 1.0 0.8 20 15 10 100 1090 1100 1110 1120 Blocking Voltage (VP) Typical Turn-Off Time vs. LED Forward Current (IL=0.5ADC) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 0 5 10 15 20 25 30 35 40 45 0 50 5 10 15 20 25 30 35 40 45 50 Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA) Typical IF for Switch Operation vs. Temperature (IL=0.5ADC) Typical Turn-On Time vs. Temperature (IF=10mA, IL=0.5ADC) Typical Turn-Off Time vs. Temperature (IF=10mA, IL=0.5ADC) Turn-On (ms) 7 5 3 1 -40 1080 Typical Turn-On Time vs. LED Forward Current (IL=0.5ADC) 18 16 14 12 10 8 6 4 2 1 0 120 1070 1.64 -20 0 20 40 60 Temperature (ºC) 80 100 10 9 8 7 6 5 4 3 2 1 0 0.14 0.12 Turn-Off (ms) 9 80 0.095 25 Turn-Off (ms) Turn-On (ms) LED Forward Voltage Drop (V) 1.4 60 0.090 0 1.48 1.6 40 0.085 5 1.8 20 0.080 30 Typical LED Forward Voltage Drop vs. Temperature 0 0.075 35 1.44 -20 0.070 Turn-Off (ms) 0 -40 2.4 Typical Blocking Voltage Distribution (N=50) Device Count (N) Device Count (N) 2.2 Typical On-Resistance Distribution (N=50, IF=10mA, IL=1ADC) 20 1.2 10 Turn-On (ms) LED Forward Voltage (V) 25 15 0 0 1.3250 20 5 5 0 LED Current (mA) Typical Turn-Off Time (N=50, IF=20mA, IL=1ADC) Typical Turn-On Time (N=50, IF=20mA, IL=1ADC) Device Count (N) 25 Device Count (N) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=10mA) 0.10 0.08 0.06 0.04 0.02 0 -40 -20 0 20 40 60 80 100 -40 Temperature (ºC) -20 0 20 40 60 80 100 Temperature (ºC) Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 4 CPC1786 INTEGRATED CIRCUITS DIVISION Typical Load Current vs. Load Voltage (IF=10mA) 4.5 Load Current (mA) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 Typical Leakage vs. Temperature Measured Across Pins 1&2 (VL=1000VP) 40 60 80 0 100 0.014 1160 0.012 1140 1120 1100 1080 1060 1040 0.25 1.25 -20 0 20 40 60 Temperature (ºC) 80 100 3.0 2.5 5ºC/W 2.0 10ºC/W 1.5 Free Air 1.0 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve Free Air, No Heat Sink 12 10 0.010 0.008 0.006 0.004 0 -40 0.0 1.5 8 6 4 2 0.002 1020 3.5 0.5 Typical Blocking Voltage vs. Temperature 20 1ºC/W 4.0 Temperature (ºC) 0 1180 1000 -40 4.5 0.75 0.5 1.0 Load Voltage (V) -20 Leakage (μA) Blocking Voltage (VP) -40 1000 900 800 700 600 500 400 300 200 100 0 Load Current (A) On-Resistance (Ω) 4.0 Maximum Load Current vs. Temperature with Heat Sink (IF=20mA) Load Current (ADC) Typical On-Resistance vs. Temperature (IL=Max Rated) -20 0 20 40 60 80 100 0 10µs 100µs 1ms 10ms 100ms Temperature (ºC) 1s 10s 100s Time Unless otherwise specified, all performance data was acquired without the use of a heat sink. The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R08 CPC1786 INTEGRATED CIRCUITS DIVISION 4 Manufacturing Information 4.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1786J MSL 1 4.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 4.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1786J 245°C for 30 seconds NOTE: The exposed surface of the DCB substrate is not to be soldered. 4.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. e3 R08 www.ixysic.com 6 CPC1786 INTEGRATED CIRCUITS DIVISION 4.5 Mechanical Dimensions 5.029 ± 0.127 (0.198 ± 0.005) 19.914 ± 0.254 (0.784 ± 0.010) 1.930 ± 0.381 (0.076 ± 0.015) 17.221 ± 0.254 (0.678 ± 0.010) 1.181 ± 0.076 (0.047 ± 0.003) 15.317 ± 0.254 (0.603 ± 0.010) 20.879 ± 0.254 (0.822 ± 0.010) DCB Substrate NOTE: Not to be soldered 2.362 ± 0.381 (0.093 ± 0.015) 20.396 ± 0.508 (0.803 ± 0.020) DIMENSIONS mm (inches) 3.810 ± 0.254 (0.150 ± 0.010) 15.240 ± 0.508 (0.600 ± 0.020) 0.635 ± 0.076 (0.025 ± 0.003) 1.270 TYP (0.050 TYP) 2.794 ± 0.127 (0.110 ± 0.005) NOTE: Metallized external surface of DCB substrate maintains 2500Vrms isolation to device internal structure and all external pins. For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1786-R08 ©Copyright 2015, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 3/9/2015 7 www.ixysic.com R08