AMI AMIS-30660 High speed can transceiver Datasheet

AMIS-30660 High Speed CAN Transceiver
Data Sheet
1.0 Key Features
• No disturbance of the bus lines with an unpowered node
• Transmit data (TXD) dominant time-out function
• Thermal protection
• Bus pins protected against transients in an automotive
environment
• Power down mode in which the transmitter is disabled
• Input levels compatible with 3.3V devices
• Short-circuit proof to supply voltage & ground
• Fully compatible with the “ISO 11898-2” standard
• Certified “Authentication on CAN Transceiver
Conformance (d1.1)”
• High speed (up to 1 Mbaud)
• Ideally suited for 12V and 24V industrial and automotive
applications
• Low Electromagnetic Emission (EME) common-modechoke is no longer required
• Differential receiver with wide common-mode range for
high Electro Magnetic Susceptibility (EMS) (+/- 35V)
2.0 General Description
controller. Due to the wide common mode voltage range of
the receiver inputs, the AMIS-30660 is able to reach
outstanding levels of electromagnetic susceptibility.
Similarly, extremely low electromagnetic emission is
achieved by the excellent matching of the output signals.
The AMIS-30660 CAN transceiver is the interface between a
Controller Area Network (CAN) protocol controller and the
physical bus and may be used in both 12V and 24V systems.
The transceiver provides differential transmit capability to
the bus and differential receive capability to the CAN
3.0 Important Characteristics
Symbol
VCANH
VCANL
Vi(dif)(bus_dom)
Tpd(rec-dom)
& Tpd(dom-rec)
CM-range
VCM-peak
VCM-step
Parameter
DC voltage at pin CANH
DC voltage at pin CANL
Differential bus output voltage
Propagation delay TxD to RxD
Conditions
0<VCC<5.25 V; no time limit
0<VCC<5.25 V; no time limit
Dominant 42.5 Ω <RLT<60 Ω
See Fig. 7
Min
-45*
-45*
1.5
70
Max
+45*
+45*
3
245
Unit
V
V
V
ns
Input common-mode range
for comparator
Common-mode peak
Common-mode step
Guaranteed differential receiver
threshold and leakage current -35
See Fig. 8 & Fig. 9 (Note)
-500
See Fig. 8 & Fig. 9 (Note)
-150
+35
500
150
V
mV
mV
Note : The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.
* -85V min & +60V max also possible, please contact your local sales representative for details.
4.0 Ordering Information
Part N° AMIS-30660
Package SO-8
Temp. Range -40°C…125°C
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AMIS-30660 High Speed CAN Transceiver
5.0 Block Diagram
Figure 1 – Block Diagram
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Data Sheet
AMIS-30660 High Speed CAN Transceiver
Data Sheet
6.0 Typical Application Schematic
6.1 Application schematic
AMIS-30660
CLT
(4.7 nF)
CLT
(4.7 nF)
Figure 2 – Application Diagram
6.2 Typical external components
Comp.
RLT
CLT
CD
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Function
Line termination resistor
Line termination capacitor
Decoupling capacitor
Value
60
47
100
Units
Ω
nF
nF
3
AMIS-30660 High Speed CAN Transceiver
6.3 Pin Description
6.3.1 Pin out (top view)
AMIS30660
Figure 3 – Pin configuration
6.3.2 Pin Description
Nr
Name
1
TXD
2
3
4
5
6
7
8
GND
VCC
RXD
Vref
CANL
CANH
S
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Type
Description
Transmit data input; low input => dominant driver;
internal pull-up current
Ground
Supply voltage
Receive data output; dominant transmitter => low output
Reference voltage output
LOW-level CAN bus line (low in dom. mode)
HIGH-level CAN bus line (high in dom. mode)
Select input for high-speed mode or silent mode (high in
silent mode); internal pull-down current
4
Data Sheet
AMIS-30660 High Speed CAN Transceiver
Data Sheet
7.0 Functional Description
The high-speed mode is the normal operating mode and is
selected by connecting pin S to ground. It is the default
mode if pin S is not connected.
The AMIS-30660 is the interface between the CAN protocol
controller and the physical bus. It is intended for use in
automotive and industrial applications requiring baud rates
up to 1 Mbaud. It provides differential transmit capability to
the bus and differential receiver capability to the CAN
protocol controller. It is fully compatible to the “ISO 118982” standard.
In the silent mode, the transmitter is disabled. All other IC
functions continue to operate. The silent mode is selected
by connecting pin S to VCC and can be used to prevent
network communication from being blocked, due to a CAN
controller which is out of control.
A current-limiting circuit protects the transmitter output
stage from damage caused by accidental short-circuit to
either positive or negative supply voltage, although power
dissipation increases during this fault condition.
A ‘TXD dominant time-out’ timer circuit prevents the bus
lines being driven to a permanent dominant state (blocking
all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD. If the duration of the LOW-level on pin
TXD exceeds the internal timer value, the transmitter is
disabled, driving the bus into a recessive state. The timer is
reset by a positive edge on pin TXD.
A thermal protection circuit protects the IC from damage
by switching off the transmitter if the junction temperature
exceeds a value of approximately 160°C. Because the
transmitter dissipates most of the power, the power
dissipation and temperature of the IC is reduced. All other
IC functions continue to operate. The transmitter off-state
resets when pin TXD goes HIGH. The thermal protection
circuit is particularly needed when a bus line short-circuits.
The pins CANH and CANL are protected from automotive
electrical transients (according to “ISO 7637”; see Fig.4).
Control pin S allows two operating modes to be selected:
high-speed mode or silent mode.
Table 1: Function table of the CAN transceiver; X = don’t care
VCC
TXD
S
CANH
CANL
BUS State
4.75 to 5.25V
4.75 to 5.25V
4.75 to 5.25V
VCC<PORL
(POR-level;
not powered)
PORL <VCC < 4.75V
0
X
1 (or floating)
0 (or floating)
1
X
HIGH
0.5VCC
0.5VCC
LOW
0.5VCC
0.5VCC
Dominant
Recessive
Recessive
0
1
1
X
>2V
X
X
0V < VCANH <VCC
0V < VCANH <VCC
0V <VCANL <VCC
0V <VCANL <VCC
Recessive
Recessive
1
1
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RXD
AMIS-30660 High Speed CAN Transceiver
Data Sheet
8.0 Electrical Characteristics
8.1 Definitions
All voltages are referenced to GND (pin 2).
Positive currents flow into the IC. Sinking current means
that the current is flowing into the pin. Sourcing current
means that the current is flowing out of the pin.
8.2 Absolute maximum ratings
Stresses above those listed in the following table may cause
permanent device failure. Exposure to absolute maximum
ratings for extended periods may effect device reliability.
Table 2 : Absolute maximum ratings
Symbol
VCC
VCANH
Parameter
Supply voltage
DC voltage at pin CANH
VCANL
DC voltage at pin CANL
VTXD
VRXD
Vref
VS
Vtran(CANH)
Vtran(CANL)
Vesd
DC voltage at pin TXD
DC voltage at pin RXD
DC voltage at pin Vref
DC voltage at pin S
Transient voltage at pin CANH
Transient voltage at pin CANL
Electrostatic discharge voltage
at all pins
Static latch-up at all pins
Storage temperature
Ambient temperature
Maximum junction temperature
Latch-up
Tstg
Tamb
Tjunc
Conditions
0 < VCC < 5.25V;
no time limit
0 < VCC < 5.25V;
no time limit
Note 1
Note 1
Note 2
Note 4
Note 3
Min
-0.3
-45*
Max
+7
+45*
Unit
V
V
-45*
+45*
V
-0.3
-0.3
-0.3
-0.3
-150
-150
-4000
-500
VCC+ 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
+150
+150
+4000
+500
100
+150
+125
°C
-55
-40
+150
-40
V
V
V
V
V
V
V
V
mA
°C
°C
* -85V min & +60V max also possible, please contact your local sales representative for details.
Notes
Note 1) Applied transient waveforms in accordance with “ISO 7637 part 3”, test pulses 1, 2, 3a and
3b (see Fig.4).
Note 2) Standardized Human Body Model ESD pulses in accordance to MIL883 method 3015.
Note 3) Static latch-up immunity: Static latch-up protection level when tested according to
EIA/JESD78.
Note 4) Standardized Charged Device Model ESD pulses when tested according to EOS/ESD
DS5.3-1993.
Thermal Characteristcs
Symbol
Rth(vj-a)
Rth(vj-s)
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Parameter
Thermal resistance from junction to
ambient in SO8 package (2 layer PCB)
Thermal resistance from junction to
substrate of bare die
Conditions
In free air
In free air
6
Value
150
Unit
K/W
45
K/W
AMIS-30660 High Speed CAN Transceiver
Data Sheet
Characteristics
VCC = 4.75 to 5.25 V; Tjunc = -40 to +150 °C; RLT =60Ω
unless specified otherwise.
Symbol
Supply (pin VCC)
ICC
Parameter
Conditions
Supply current
Dominant; VTXD =0V
Recessive; VTXD =VCC
Transmitter data input (pin TXD)
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IIH
HIGH-level input current
IIL
LOW-level input current
Ci
Input capacitance
Mode select input (pin S)
VIH
HIGH-level input voltage
VIL
LOW-level input voltage
IIH
HIGH-level input current
IIL
LOW-level input current
Receiver data output (pin RXD)
VOH
HIGH-level output voltage
VOL
LOW-level output voltage
Reference voltage output (pin Vref)
Vref
Reference output voltage
at pin Vref
Vref_CM
Reference output voltage at pin
Vref for full CM range
Bus lines (pins CANH and CANL)
Vo(reces)
Recessive bus voltage
(CANH)
at pin CANH
Vo(reces)
Recessive bus voltage
(CANL)
at pin CANL
Io(reces)
Recessive output current
(CANH)
at pin CANH
Io(reces)
Recessive output current
(CANL)
at pin CANL
Vo(dom)
Dominant output voltage
(CANH)
at pin CANH
Vo(dom)
Dominant output voltage
(CANL)
at pin CANL
Vi(dif) (bus)
Differential bus input
voltage (VCANH - VCANL)
Io(sc)
(CANH)
Io(sc)
(CANL)
Vi(dif)(th)
Short-circuit output current at
pin CANH
Short-circuit output current
at pin CANL
Differential receiver threshold
voltage
Vihcm(dif)(th)
Differential receiver threshold
voltage for high common-mode
Vi(dif)
(hys)
Differential receiver input
voltage hysteresis
Ri(cm)
(CANH)
Ri(cm)
(CANL)
Common mode input
resistance at pin CANH
Common mode input
resistance at pin CANL
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Min
Type
Max
Unit
44
5
65
8
mA
mA
Output recessive
Output dominant
VTXD =VCC
VTXD =0V
Not tested
2.0
-0.3
-5
-75
-
0
-200
5
VCC + 0.3
+0.8
+5
-350
10
V
V
µA
µA
pF
Silent mode
High-speed mode
VS = 2V
VS =0.8V
2.0
-0.3
20
15
30
30
VCC + 0.3
+0.8
50
45
V
V
µA
µA
IRXD = - 10mA
IRXD = 6mA
0.6
0.75
0.25
0.45
VCC
V
-50µA <IVref < +50µA
0.45
0.5
0.55
VCC
-35V < VCANH < +35V
-35V < VCANL < +35V
0.4
0.5
0.6
VCC
VTXD =VCC; no load
2.0
2.5
3.0
V
VTXD =VCC; no load
2.0
2.5
3.0
V
-35V <VCANH< +35V;
0 V <VCC < 5.25V
-35V <VCANL < +35V;
0 V <VCC < 5.25V
VTXD = 0V
-2.5
-
+2.5
mA
-2.5
-
+2.5
mA
3.0
3.6
4.25
V
VTXD = 0V
0. 5
1.4
1.75
V
VTXD = 0V; dominant;
42.5 Ω < RLT <60 Ω
VTXD =VCC; recessive;
no load
VCANH =0V;VTXD =0V
1.5
2.25
3.0
V
-120
0
+50
mV
-45
-70
-95
mA
45
70
120
mA
0.5
0.7
0.9
V
0.30
0.7
1.05
V
50
70
100
mV
15
25
37
KΩ
15
25
37
KΩ
VCANL =36V;
VTXD =0V
-5V <VCANL < +12V;
-5V <VCANH < +12V;
see Fig.5
-35V <VCANL < +35V;
-35V <VCANH < +35V;
see Fig.5
-5V <VCANL < +12V;
-5V <VCANH < +12V;
see Fig.5
7
AMIS-30660 High Speed CAN Transceiver
Symbol
Ri(cm)(m)
Ri(dif)
Ci(CANH)
Ci(CANL)
Ci(dif)
ILI(CANH)
ILI(CANL)
VCM-peak
VCM-step
Power On Reset
PORL
Parameter
Matching between
pin CANH and pin CANL
common mode input resistance
Differential input resistance
Input capacitance at
pin CANH
Input capacitance at
pin CANL
Differential input capacitance
Input leakage current at
pin CANH
Input leakage current at
pin CANL
Common-mode peak during
transition from dom ➔ rec or
rec ➔ dom
Difference in common-mode
between dom and
recessive state
Conditions
VCANH =VCANL
POR level
Thermal shutdown
Tj(sd)
Shutdown junction
temperature
Timing characteristics (see Figs.6 and 7)
td(TXD-BUSon)
Delay TXD to bus active
td(TXD-BUSoff)
Delay TXD to bus inactive
td(BUSon-RXD)
Delay bus active to RXD
td(BUSoff-RXD)
Delay bus inactive to RXD
tpd(rec-dom)
Propagation delay TXD to RXD
from recessive to dominant
td(dom-rec)
Propagation delay TXD to RXD
from dominant to recessive
Data Sheet
Min
-3
Type
0
Max
+3
Unit
%
25
VTXD =VCC; not tested
50
7.5
75
20
KΩ
pF
VTXD =VCC; not tested
7.5
20
pF
VTXD =VCC; not tested
VCC =0V; VCANH = 5V
10
3.75
170
10
250
pF
µA
VCC =0V; VCANL = 5V
10
170
250
µA
See Fig. 8 & Fig. 9
-500
500
mV
See Fig. 8 & Fig. 9
-150
150
mV
CANH, CANL, Vref in
tri-state below POR level
2.2
3.5
4.7
V
150
160
180
°C
VS = 0V
VS = 0V
VS = 0V
VS = 0V
VS = 0V
40
30
25
65
100
85
60
55
110
110
110
110
135
230
ns
ns
ns
ns
ns
VS = 0V
100
245
ns
AMIS30660
Hysteresis
Figure 4 – Test circuit for automotive transients
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Figure 5 – Hysteresis of the receiver
8
AMIS-30660 High Speed CAN Transceiver
AMIS30660
Figure 6 – Test circuit for timing characteristics
Figure 7 – Timing diagram for AC characteristics
AMIS30660
Figure 8 – Basic test set-up for electromagnetic measurement
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Data Sheet
AMIS-30660 High Speed CAN Transceiver
Data Sheet
Figure 9 – Common-mode voltage peaks (see measurement setup Fig. 8.)
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27mm, the footprint longitudinal axis
must be parallel to the transport direction of the printedcircuit board.The footprint must incorporate solder thieves
at the downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45º angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Soldering
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with high
population densities. In these situations reflow soldering is
often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine
solder particles, flux and binding agent) to be applied to the
printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive
is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250°C. A mildly-activated
flux will eliminate the need for removal of corrosive residues
in most applications.
Typical reflow peak temperatures range from 215 to 250°C.
The top-surface temperature of the packages should
preferably be kept below 230 °C.
Manual soldering
Fix the component by first soldering two diagonallyopposite end leads. Use a low voltage (24 V or less)
soldering iron applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320°C.
Wave soldering
Conventional single wave soldering is not recommended for
surface mount devices (SMDs) or printed-circuit boards with
a high component density, as solder bridging and nonwetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
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AMIS-30660 High Speed CAN Transceiver
Data Sheet
Suitability of surface mount IC packages for wave and reflow soldering methods
Package
BGA, SQFP
HLQFP, HSQFP,
HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Soldering Method
Wave
Not suitable
Not suitable (2)
Reflow (1)
Suitable
Suitable
Suitable
Not recommended (3)(4)
Not recommended (5)
Suitable
Suitable
Suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive.
Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the
package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them
(the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods”.
3. If wave soldering is considered, then the package must be
placed at a 45º angle to the solder wave direction. The
package footprint must incorporate solder thieves downstream
and at the side corners.
2. These packages are not suitable for wave soldering as a
solder joint between the printed-circuit board and heatsink (at
bottom version) can not be achieved, and as solder may stick
to the heatsink (on top version).
5. Wave soldering is only suitable for SSOP and TSSOP
packages with a pitch (e) equal to or larger than 0.65mm; it is
definitely not suitable for packages with a pitch (e) equal to
or smaller than 0.5mm.
Revision Number
Version 1
Revision 1.1
Revision 1.2
4. Wave soldering is only suitable for LQFP, TQFP and QFP
packages with a pitch (e) equal to or larger than 0.8mm; it is
definitely not suitable for packages with a pitch (e) equal to
or smaller than 0.65mm.
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