TI LMV7239M5X Lmv7235/lmv7239/lmv7239q 75 nsec, ultra low power, low voltage, rail-to-rail input comparator with open-drain/push-pull output Datasheet

LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
LMV7235/LMV7239/LMV7239Q 75 nsec, Ultra Low Power, Low Voltage, Rail-to-Rail Input
Comparator with Open-Drain/Push-Pull Output
Check for Samples: LMV7235, LMV7239
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
The LMV7235/LMV7239/LMV7239Q are ultra low
power, low voltage, 75 nsec comparators. They are
guaranteed to operate over the full supply voltage
range of 2.7V to 5.5V. These devices achieve a 75
nsec propagation delay while consuming only 65µA
of supply current at 5V.
1
2
•
•
(VS = 5V, TA = 25°C
Typical values unless otherwise specified)
Propagation delay 75 nsec
Low supply current 65µA
Rail-to-Rail input
Open drain and push-pull output
Ideal for 2.7V and 5V single supply
applications
Available in space saving packages
– 5-pin SOT-23
– 5-pin SC70
LMV7239Q is an automotive grade product
that is AECQ grade 1 qualified and is
manufactured on an automotive grade flow.
APPLICATIONS
•
•
•
•
•
•
•
•
Portable and battery powered systems
Scanners
Set top boxes
High speed differential line receiver
Window comparators
Zero-crossing detectors
High speed sampling circuits
Automotive
The LMV7235/LMV7239/LMV7239Q have a greater
than rail-to-rail common mode voltage range. The
input common mode voltage range extends 200mV
below ground and 200mV above supply, allowing
both ground and supply sensing.
The LMV7235 features an open drain output. By
connecting an external resistor, the output of the
comparator can be used as a level shifter.
The LMV7239/LMV7239Q features a push-pull output
stage. This feature allows operation without the need
of an external pull-up resistor.
The LMV7235/LMV7239/LMV7239Q are available in
the 5-Pin SC70 and 5-Pin SOT-23 packages, which
are ideal for systems where small size and low power
is critical.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LMV7235, LMV7239
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
www.ti.com
Typical Application
VCC
100K
Crystal
100K
VOUT
0.1uF
100K
Figure 1. Crystal Oscillator
Connection Diagram
1
5
VOUT
V-
Non-Inverting
Input
2
3
V+
SC70
SOT-23
4
Inverting
Input
Figure 2. 5-Pin SC70/SOT-23 (Top View)
Simplified Schematic
2
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
ESD Tolerance
(1) (2)
(3)
Human Model Body
1000V
Machine Body
100V
Differential Input Voltage
± Supply Voltage
(4)
Output Short Circuit Duration
Supply Voltage (V+ - V−)
6V
Soldering Information
Infrared or Convection (20 sec)
235°C
Wave Soldering (10 sec)
260°C (lead temp)
(V+) +0.3V, (V−) −0.3V
Voltage at Input/Output Pins
Current at Input Pin
(1)
(5)
±10mA
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely
affect reliability.
Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(2)
(3)
(4)
(5)
Operating Ratings
Supply Voltages (V+ - V−)
Temperature Range
2.7V to 5.5V
(1)
−40°C to +85°C
LMV7235/LMV7239
−40°C to +125°C
LMV7239Q
−65°C to +150°C
Storage Temperature Range
Package Thermal Resistance
5-Pin SC70
478°C/W
5-Pin SOT-23
265°C/W
(1)
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA) / θJA. All numbers apply for packages soldered directly onto a PC Board.
2.7V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TA = 25°C, VCM = V+/2, V+ = 2.7V, V− = 0V−. Boldface limits apply at the
temperature extremes.
Symbol
Parameter
VOS
Input Offset Voltage
IB
Input Bias Current
IOS
Input Offset Current
(1)
(2)
Conditions
Min
(1)
Typ
(2)
Max
(1)
Units
0.8
6
8
mV
30
400
600
nA
5
200
400
nA
All limits are guaranteed by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
Submit Documentation Feedback
3
LMV7235, LMV7239
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
www.ti.com
2.7V Electrical Characteristics (continued)
Unless otherwise specified, all limits guaranteed for TA = 25°C, VCM = V+/2, V+ = 2.7V, V− = 0V−. Boldface limits apply at the
temperature extremes.
Symbol
Parameter
Conditions
Min
(1)
Typ
(2)
Max
(1)
Units
CMRR
Common Mode Rejection Ratio
0V < VCM < 2.7V
PSRR
Power Supply Rejection Ratio
V+ = 2.7V to 5V
65
85
VCM
Input Common-Mode Voltage Range
CMRR > 50dB
V− −0.1V−
−0.2 to 2.9
IL = 4mA,
VID = 500mV
V+ −0.35
V+ −0.26
V
IL = 0.4mA,
VID = 500mV
V+ −0.02
V
IL = −4mA,
VID = −500mV
230
Output Swing High
(LMV7239 only)
VO
Output Swing Low
(LMV7235/LMV7239/LMV7239Q)
(3)
52
IL = −0.4mA,
VID = −500mV
Output Short Circuit Current
Supply Current
Propagation Delay
Propagation Delay Skew
(LMV7239 only)
mA
Sinking, VO = 2.7V
(LMV7235, RL = 10k)
20
mA
52
No load
Output Rise Time
Output Fall Time
ILEAKAGE
Output Leakage Current
(LMV7235 only)
(3)
(4)
(5)
(6)
4
µA
96
ns
Overdrive = 50mV
CLOAD = 15pF
87
ns
Overdrive = 100mV
CLOAD = 15pF
85
ns
2
ns
1.7
ns
LMV7235
10% to 90%
112
ns
90% to 10%
1.7
ns
3
nA
(5)
Overdrive = 20mV
(6)
(5)
tf
85
100
Overdrive = 20mV
CLOAD = 15pF
LMV7239/LMV7239Q
10% to 90%
tr
mV
15
(5)
tSKEW
350
450
V
Sourcing, VO = 0V
(LMV7239 only)
(5)
tPD
dB
V+ +0.1V+
mV
(4)
IS
dB
15
(4)
ISC
62
CMRR is not linear over the common mode range. Limits are guaranteed over the worst case from 0 to VCC/2 or VCC/2 to VCC.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely
affect reliability.
A 10k pull-up resistor was used when measuring the LMV7235. The rise time of the LMV7235 is a function of the R-C time constant.
Propagation Delay Skew is defined as the absolute value of the difference between tPDLH and tPDHL.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
5V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TA = 25°C, VCM = V+/2, V+ = 5V, V− = 0V. Boldface limits apply at the
temperature extremes.
Symbol
Parameter
Conditions
Min
(1)
Typ
30
400
600
nA
5
200
400
nA
Input Bias Current
IOS
Input Offset Current
CMRR
Common Mode Rejection Ratio
0V < VCM < 5V
52
67
PSRR
Power Supply Rejection Ratio
V+ = 2.7V to 5V
65
85
Input Common-Mode Voltage Range
CMRR > 50dB
IL = 4mA,
VID = 500mV
Output Swing High
(LMV7239 only)
VO
Output Swing Low
(LMV7235/LMV7239/LMV7239Q)
Output Short Circuit Current
Supply Current
V −0.25
IL = −4mA,
VID = −500mV
230
IL = −0.4mA,
VID = −500mV
10
Sourcing, VO = 0V
(LMV7239 only)
25
15
55
Sinking, VO = 5V
(LMV7235, RL = 10k)
30
20
60
Output Fall Time
ILEAKAGE
Output Leakeage Current
(LMV7235 only)
(1)
(2)
(3)
(4)
(5)
mA
mA
65
95
110
µA
Overdrive = 50mV
CLOAD = 15pF
82
ns
Overdrive = 100mV
CLOAD = 15pF
75
ns
1
ns
1.2
ns
LMV7235
10% to 90%
100
ns
90% to 10%
1.2
ns
3
nA
(5)
(4)
tf
mV
ns
Overdrive = 20mV
Output Rise Time
mV
89
LMV7239
10% to 90%
tr
350
450
Overdrive = 20mV
CLOAD = 15pF
(4)
Propagation Delay Skew
(LMV7239 only)
V
V
(4)
tSKEW
V +0.1V
+
V+ −0.01
No load
Propagation Delay
+
IL = 0.4mA,
VID = 500mV
(4)
tPD
−0.2 to 5.2
dB
+
V
(3)
IS
+
dB
V −0.15
(3)
ISC
V −0.1V
Units
mV
IB
VCM
(1)
6
8
Input Offset Voltage
−
Limits
1
VOS
−
(2)
All limits are guaranteed by testing or statistical analysis.
Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely
affect reliability.
A 10k pull-up resistor was used when measuring the LMV7235. The rise time of the LMV7235 is a function of the R-C time constant.
Propagation Delay Skew is defined as the absolute value of the difference between tPDLH and tPDHL.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
Submit Documentation Feedback
5
LMV7235, LMV7239
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
(Unless otherwise specified, VS = 5V, CL = 10pF, TA = 25°C).
Supply Current vs. Supply Voltage
Sourcing Current vs. Output Voltage
100
-40°C
25°C
85°C
125°C
100
VS = 5V
80
10
ISOURCE (mA)
SUPPLY CURRENT ( A)
120
60
40
1
20
0
0
1
2
3
4
SUPPLY VOLTAGE (V)
.1
.01
5
.1
+
OUTPUT VOLTAGE REFERENCED TO V (V)
Figure 3.
Figure 4.
Sourcing Current vs. Output Voltage
Sinking Current vs. Output Voltage
100
100
VS = 2.7V
VS = 5V
10
ISINK (mA)
ISOURCE (mA)
10
1
1
.1
.01
6
10
1
.1
1
10
.1
.01
.1
1
10
OUTPUT VOLTAGE REFERENCED TO V+ (V)
OUTPUT VOLTAGE REFERENCED TO GND (V)
Figure 5.
Figure 6.
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Unless otherwise specified, VS = 5V, CL = 10pF, TA = 25°C).
Sinking Current vs. Output Voltage
Input Bias Current vs. Input Voltage
50
100
40
INPUT BIAS CURRENT (nA)
VS = 2.7V
ISINK (mA)
10
1
VS = 5V
30
IBIAS+
20
10
0
-10
IBIAS-
-20
-30
-40
.1
.01
.1
1
-50
-0.2
10
2
1
OUTPUT VOLTAGE REFERENCED TO GND (V)
Figure 7.
Input Bias Current vs. Input Voltage
Propagation Delay vs. Temperature
160
VS = 2.7V
50
40
30
PROPAGATION DELAY (ns)
INPUT BIAS CURRENT (nA)
5
4
Figure 8.
70
60
IBIAS+
20
10
0
-10
-20
-30
-40
IBIAS-
-50
-60
VS=2.7V
VOD=20mV
CLOAD=15pF
150
140
130
Falling Edge
120
110
100
90
Rising Edge
80
0
2
1
2.7
-40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
VIN (V)
Figure 9.
Figure 10.
Propagation Delay vs. Temperature
Propagation Delay vs. Capacitive Load
106
VS=5V
VOD=20mV
CLOAD=15pF
130
120
Falling Edge
110
100
90
PROPAGATION DELAY (ns)
140
PROPAGATION DELAY (ns)
3
VIN (V)
VS= 2.7V
VOD=20mV
104
102
Falling Edge
100
98
96
Rising Edge
Rising Edge
80
94
-40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
0
Figure 11.
20
40
60
80
CAPACITANCE (pF)
100
Figure 12.
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
Submit Documentation Feedback
7
LMV7235, LMV7239
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(Unless otherwise specified, VS = 5V, CL = 10pF, TA = 25°C).
Propagation Delay vs. Capacitive Load
Propagation Delay vs. Input Overdrive
100
VS= 5V
VOD=20mV
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
96
94
Falling Edge
92
90
VS= 2.7V
CLOAD=15pF
95
Rising Edge
90
85
Rising Edge
Falling Edge
88
80
0
20
40
60
80
CAPACITANCE (pF)
100
20
Figure 13.
Figure 14.
Propagation Delay vs. Input Overdrive
Propagation Delay vs. Common Mode Voltage
90
120
VS= 5V
CLOAD=15pF
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
30 40 50 60 70 80 90 100
INPUT OVERDRIVE (mV)
85
Rising Edge
80
75
Falling Edge
70
VS= 2.7V
VOD=20mV
CLOAD=15pF
115
110
105
100
95
90
85
Rising Edge
Falling Edge
80
20
40
60
80
INPUT OVERDRIVE (mV)
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
INPUT COMMON MODE VOLTAGE (V)
Figure 15.
Figure 16.
Propagation Delay vs. Common Mode Voltage
PROPAGATION DELAY (ns)
110
VS= 5V
VOD=20mV
CLOAD=15pF
100
Falling Edge
Rising Edge
90
80
0
1
2
3
4
5
INPUT COMMON MODE VOLTAGE (V)
Figure 17.
8
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
APPLICATION INFORMATION
The LMV7235/LMV7239/LMV7239Q are single supply comparators with 75ns of propagation delay and only
65µA of supply current.
The LMV7235/LMV7239/LMV7239Q are rail-to-rail input and output. The typical input common mode voltage
range of −0.2V below the ground to 0.2V above the supply. The LMV7235/LMV7239/LMV7239Q use a
complimentary PNP and NPN input stage in which the PNP stage senses common mode voltage near V− and the
NPN stage senses common mode voltage near V+. If either of the input signals falls below the negative common
mode limit, the parasitic PN junction formed by the substrate and the base of the PNP will turn on resulting in an
increase of input bias current.
If one of the input goes above the positive common mode limit, the output will still maintain the correct logic level
as long as the other input stays within the common mode range. However, the propagation delay will increase.
When both inputs are outside the common mode voltage range, current saturation occurs in the input stage, and
the output becomes unpredictable.
The propagation delay does not increase significantly with large differential input voltages. However, large
differential voltages greater than the supply voltage should be avoided to prevent damage to the input stage.
The LMV7239 has a push-pull output. When the output switches, there is a direct path between VCC and ground,
causing high output sinking or sourcing current during the transition. After the transition, the output current
decreases and the supply current settles back to about 65µA at 5V, thus conserving power consumption.
The LMV7235 has an open drain that requires a pull-up resistor to a positive supply voltage for the output to
switch properly. When the internal output transistor is off, the output voltage will be pulled up to the external
positive voltage.
CIRCUIT LAYOUT AND BYPASSING
The LMV7235/LMV7239/LMV7239Q require high speed layout. Follow these layout guidelines:
1. Use printed circuit board with a good, unbroken low-inductance ground plane.
2. Place a decoupling capacitor (0.1µF ceramic surface mount capacitor) as close as possible to VCC pin.
3. On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback
around the comparator. Keep inputs away from output.
4. Solder the device directly to the printed circuit board rather than using a socket.
5. For slow moving input signals, take care to prevent parasitic feedback. A small capacitor (1000pF or less)
placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some
degradation to tPD when the source impedance is low.
6. The topside ground plane runs between the output and inputs.
7. Ground trace from the ground pin runs under the device up to the bypass capacitor, shielding the inputs from
the outputs.
COMPARATOR WITH HYSTERESIS
The basic comparator configuration may oscillate or produce a noisy output if the applied differential input
voltage is near the comparator's offset voltage. This usually happens when the input signal is moving very slowly
across the comparator's switching threshold. This problem can be prevented by the addition of hysteresis or
positive feedback.
INVERTING COMPARATOR WITH HYSTERESIS
The inverting comparator with hysteresis requires a three resistor network that is referenced to the supply voltage
VCC of the comparator, as shown in Figure 18. When VIN at the inverting input is less than VA, the voltage at the
non-inverting node of the comparator (VIN < VA), the output voltage is high (for simplicity assume VO switches as
high as VCC). The three network resistors can be represented as R1||R3 in series with R2. The lower input trip
voltage VA1 is defined as:
VA1 = VCCR2 / [(R1||R3) + R2]
(1)
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
Submit Documentation Feedback
9
LMV7235, LMV7239
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
www.ti.com
When VIN is greater than VA (VIN > VA), the output voltage is low, very close to ground. In this case the three
network resistors can be presented as R2 || R3 in series with R1. The upper trip voltage VA2 is defined as:
VA2 = VCC (R2||R3) / [(R1)+ (R2||R3)]
(2)
The total hysteresis provided by the network is defined as:
Delta VA = VA1- VA2
(3)
To assure that the comparator will always switch fully to VCC and not be pulled down by the load the resistors,
values should be chosen as follows:
RPULL-UP << RLOAD
(4)
Figure 18. Inverting Comparator with Hysteresis
NON-INVERTING COMPARATOR WITH HYSTERESIS
A non inverting comparator with hysteresis requires a two resistor network, and a voltage reference (VREF) at the
inverting input. When VIN is low, the output is also low. For the output to switch from low to high, VIN must rise up
to VIN1 where VIN1 is calculated by:
VIN1 = R1*(VREF / R2) + VREF
(5)
When VIN is high, the output is also high, to make the comparator switch back to it's low state, VIN must equal
VREF before VA will again equal VREF. VIN can be calculated by:
VIN2 = [VREF (R1+ R2) - VCC R1] / R2
(6)
The hysteresis of this circuit is the difference between VIN1 and VIN2.
Delta VIN = VCC R1 / R2
10
Submit Documentation Feedback
(7)
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
Figure 19. Non-Inverting Comparator with Hysteresis
ZERO-CROSSING DETECTOR
The inverting input is connected to ground and the non-inverting input is connected to 100mVp-p signal. As the
signal at the non-inverting input crosses 0V, the comparator's output changes state.
+
OUT
-
Figure 20. Zero-Crossing Detector
THRESHOLD DETECTOR
Instead of tying the inverting input to 0V, the inverting input can be tied to a reference voltage. The non-inverting
input is connected to the input. As the input passes the VREF threshold, the comparator's output changes state.
Figure 21. Threshold Detector
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
Submit Documentation Feedback
11
LMV7235, LMV7239
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
www.ti.com
CRYSTAL OSCILLATOR
A simple crystal oscillator using the LMV7239 is shown below. Resistors R1 and R2 set the bias point at the
comparator's non-inverting input. Resistors R3, R4 and C1 sets the inverting input node at an appropriate DC
average level based on the output. The crystal's path provides resonant positive feedback and stable oscillation
occurs. The output duty cycle for this circuit is roughly 50%, but it is affected by resistor tolerances and to a
lesser extent by the comparator offset.
Figure 22. Crystal Oscillator
IR RECEIVER
The LMV7239 is an ideal candidate to be used as an infrared receiver. The infrared photo diode creates a
current relative to the amount of infrared light present. The current creates a voltage across RD. When this
voltage level cross the voltage applied by the voltage divider to the inverting input, the output transitions.
Figure 23. IR Receiver
12
Submit Documentation Feedback
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
LMV7235, LMV7239
www.ti.com
SNOS532M – SEPTEMBER 2000 – REVISED FEBRUARY 2013
REVISION HISTORY
Changes from Revision L (February 2013) to Revision M
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LMV7235 LMV7239
Submit Documentation Feedback
13
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV7235M5
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
C21A
LMV7235M5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C21A
LMV7235M5X
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 85
C21A
LMV7235M5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C21A
LMV7235M7
NRND
SC70
DCK
5
1000
TBD
Call TI
Call TI
-40 to 85
C21
LMV7235M7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C21
LMV7235M7X
NRND
SC70
DCK
5
3000
TBD
Call TI
Call TI
-40 to 85
C21
LMV7235M7X/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C21
LMV7239M5
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 85
C20A
LMV7239M5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C20A
LMV7239M5X
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 85
C20A
LMV7239M5X/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C20A
LMV7239M7
NRND
SC70
DCK
5
1000
TBD
Call TI
Call TI
-40 to 85
C20
LMV7239M7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C20
LMV7239M7X
NRND
SC70
DCK
5
3000
TBD
Call TI
Call TI
-40 to 85
C20
LMV7239M7X/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
C20
LMV7239QM7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C42
LMV7239QM7X/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
C42
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV7239, LMV7239-Q1 :
• Catalog: LMV7239
• Automotive: LMV7239-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LMV7235M5
SOT-23
DBV
5
1000
178.0
8.4
LMV7235M5/NOPB
SOT-23
DBV
5
1000
178.0
LMV7235M5X
SOT-23
DBV
5
3000
178.0
LMV7235M5X/NOPB
SOT-23
DBV
5
3000
LMV7235M7
SC70
DCK
5
LMV7235M7/NOPB
SC70
DCK
LMV7235M7X
SC70
DCK
LMV7235M7X/NOPB
SC70
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV7239M5
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV7239M5/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV7239M5X
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV7239M5X/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LMV7239M7
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV7239M7/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV7239M7X
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV7239M7X/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV7239QM7/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LMV7239QM7X/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV7235M5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV7235M5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV7235M5X
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMV7235M5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMV7235M7
SC70
DCK
5
1000
210.0
185.0
35.0
LMV7235M7/NOPB
SC70
DCK
5
1000
210.0
185.0
35.0
LMV7235M7X
SC70
DCK
5
3000
210.0
185.0
35.0
LMV7235M7X/NOPB
SC70
DCK
5
3000
210.0
185.0
35.0
LMV7239M5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV7239M5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LMV7239M5X
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMV7239M5X/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LMV7239M7
SC70
DCK
5
1000
210.0
185.0
35.0
LMV7239M7/NOPB
SC70
DCK
5
1000
210.0
185.0
35.0
LMV7239M7X
SC70
DCK
5
3000
210.0
185.0
35.0
LMV7239M7X/NOPB
SC70
DCK
5
3000
210.0
185.0
35.0
LMV7239QM7/NOPB
SC70
DCK
5
1000
210.0
185.0
35.0
LMV7239QM7X/NOPB
SC70
DCK
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages