NLX2G17 Dual Schmitt-Trigger Buffer The NLX2G17 MiniGatet is an advanced high-speed CMOS dual non-inverting Schmitt-trigger buffer in ultra-small footprint. The NLX2G17 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLX2G17 can be used to enhance noise immunity or to square up slowly changing waveforms. http://onsemi.com MARKING DIAGRAMS Features ULLGA6 1.2 x 1.0 CASE 613AE 1 ULLGA6 1.45 x 1.0 CASE 613AF OUT Y2 M K 6 1 M K 1 IN A1 ULLGA6 1.0 x 1.0 CASE 613AD K •High Speed: tPD = 3.1 ns (Typ) @ VCC = 5.0 V •Designed for 1.65 V to 5.5 V VCC Operation •Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •24 mA Balanced Output Source and Sink Capability •Balanced Propagation Delays •Overvoltage Tolerant (OVT) Input and Output Pins •Ultra-Small Packages •These are Pb-Free Devices M 1 GND 2 5 VCC IN A2 3 4 OUT Y1 K M PIN ASSIGNMENT 1 Figure 1. Pinout (Top View) IN A1 IN A2 1 1 = Device Marking = Date Code OUT Y2 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 OUT Y2 Figure 2. Logic Symbol FUNCTION TABLE A Y L H L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2008 March, 2008 - Rev. 0 1 Publication Order Number: NLX2G17/D NLX2G17 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -50 mA VOUT < GND -50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range -65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125 °C (Note 5) ±500 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/UESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V -55 +125 °C 0 0 0 No Limit No Limit No Limit ns/V VOUT TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V http://onsemi.com 2 NLX2G17 DC ELECTRICAL CHARACTERISTICS TA = 25 5C TA = +855C TA = -555C to +1255C VCC (V) Min Typ Max Min Max Min Max Unit Positive Threshold Voltage 1.65 2.3 2.7 3.0 4.5 5.5 0.6 1.0 1.2 1.3 1.9 2.2 1.0 1.5 1.7 1.9 2.7 3.3 1.4 1.8 2.0 2.2 3.1 3.6 0.6 1.0 1.2 1.3 1.9 2.2 1.4 1.8 2.0 2.2 3.1 3.6 0.6 1.0 1.2 1.3 1.9 2.2 1.4 1.8 2.0 2.2 3.1 3.6 V VT- Negative Threshold Voltage 1.65 2.3 2.7 3.0 4.5 5.5 0.2 0.4 0.5 0.6 1.0 1.2 0.5 0.75 0.87 1.0 1.5 1.9 0.8 1.15 1.4 1.5 2.0 2.3 0.2 0.4 0.5 0.6 1.0 1.2 0.8 1.15 1.4 1.5 2.0 2.3 0.2 0.4 0.5 0.6 1.0 1.2 0.8 1.15 1.4 1.5 2.0 2.3 V VH Low-Level Input Voltage 1.65 2.3 2.7 3.0 4.5 5.5 0.1 0.25 0.3 0.4 0.6 0.7 0.48 0.75 0.83 0.93 1.2 1.4 0.9 1.1 1.15 1.2 1.5 1.7 0.1 0.25 0.3 0.4 0.6 0.7 0.9 1.1 1.15 1.2 1.5 1.7 0.1 0.25 0.3 0.4 0.6 0.7 0.9 1.1 1.15 1.2 1.5 1.7 V 1.65 - 5.5 VCC 0.1 VCC VCC 0.1 VCC 0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.1 2.4 2.7 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 Symbol Parameter VT+ VOH VOL HighLevel Output Voltage Low-Level Output Voltage Conditions VIN w VT+MAX IOH = -100 mA VIN w VT+MAX IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA VIN v VT-MIN IOL = 100 mA VIN v VT-MIN IOH = 4 mA IOH = 8 mA IOH = 12 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA Input Leakage Current 0 v VIN v 5.5 V IOFF Power-Off Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current 0 v VIN v VCC IIN V V 1.65 - 5.5 0 0.1 0.1 0.1 1.65 2.3 2.7 3.0 3.0 4.5 0.08 0.2 0.22 0.28 0.38 0.42 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0 to 5.5 ±0.1 ±1.0 ±1.0 mA 0 1.0 10 10 mA 5.5 1.0 10 10 mA http://onsemi.com 3 NLX2G17 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) Symbol tPLH, tPHL Parameter Propagation Delay Input A to Output VCC (V) Test Condition 1.65 TA = -555C to +1255C TA = 25 5C Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 2.0 9.1 15 2.0 15.6 ns 1.8 RL = 1 MW, CL = 15 pF 2.0 7.6 12.5 2.0 13 2.3-2.7 RL = 1 MW, CL = 15 pF 1.0 5.0 9.0 1.0 9.5 3.0-3.6 RL = 1 MW, CL = 15 pF 1.0 3.7 6.3 1.0 6.5 RL = 500 W, CL = 50 pF 1.5 4.4 7.2 1.5 7.5 RL = 1 MW, CL = 15 pF 0.5 3.1 5.2 0.5 5.5 RL = 500 W, CL = 50 pF 0.8 3.7 5.9 0.8 6.2 4.5-5.5 CIN Input Capacitance 5.5 VIN = 0 V or VCC 7.0 pF CPD Power Dissipation Capacitance (Note 6) 3.3 5.5 10 MHz VIN = 0 V or VCC 9.0 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. VCC A or B 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 4 RL NLX2G17 VT, TYPICAL INPUT THRESHOLD VOLTAGE (V) 4 3 (VT+) 2 VHtyp (VT-) 1 2 2.5 3 3.5 3.6 VCC, POWER SUPPLY VOLTAGE (V) VHtyp = (VT + typ) - (VT - typ) Figure 5. Typical Input Threshold, VT+, VTversus Power Supply Voltage VH VCC VT+ VT- VIN VCC VH VT+ VT- VIN GND GND VOH VOH VOUT Vout VOL VOL (a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt-Trigger Offers Maximum Noise Immunity Figure 6. Typical Schmitt-Trigger Applications ORDERING INFORMATION Package Shipping† NLX2G17AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLX2G17BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLX2G17CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLX2G17 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 6X 0.22 e 5X L NOTE 4 3 1 1.18 L1 0.53 6 4 6X b 0.05 C 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 6 NLX2G17 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE-01 ISSUE A PIN ONE REFERENCE 0.10 C ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 e 5X L NOTE 4 3 1 6X 0.26 1.24 L1 0.53 6 4 6X b 0.05 C 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 PKG OUTLINE *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 7 NLX2G17 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF-01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉ ÉÉÉ ÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX --0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L 0.49 NOTE 4 3 1 6X 0.30 1.24 L1 0.53 6 4 BOTTOM VIEW 6X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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