Datasheet CMOS LDO Regulators for Portable Equipments 1ch 500mA CMOS LDO Regulators BUxxSD5 series ●Key Specifications Input Power Supply Voltage Range: 1.7V to 6.0V Output Current Range: 0 to 500mA Operating Temperature Range: -40℃ to +105℃ Output Voltage Lineup: 3.3V Output Voltage Accuracy: ±2.0% Circuit Current: 33µA(Typ.) Standby Current: 0μA (Typ.) ●General Description BUxxSD5 series are high-performance CMOS LDO regulators with output current ability of up to 500mA. These devices have excellent noise and load response characteristics despite of its low circuit current consumption of 33µA. They are most appropriate for various applications such as power supplies for logic IC, RF, and camera modules. ●Package SSOP5 ●Features High Output Voltage Accuracy: ±2.0% (In all recommended conditions) High Ripple Rejection: 68 dB (Typ, 1 kHz,) Compatible with small ceramic capacitor (Cin=Cout=0.47 µF) Low Current Consumption: 33 µA Output Voltage ON/OFF control Built-in Over Current Protection Circuit (OCP) Built-in Thermal Shutdown Circuit (TSD) Package SSOP5 is similar to SOT23-5(JEDEC) W(Typ.) x D(Typ.) x H(Max.) 2.90mm x 2.80mm x 1.25mm ●Applications Portable devices Camera modules Other electronic devices using microcontrollers or logic circuits ●Typical Application Circuit Vin VOUT VIN Cin Vout Cout BUxxSD2MG-M BUxxSD5 On Off STBY GND Figure 1. Typical Application Circuit ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Pin Configuration VOUT N.C. Lot. No Marking VIN GND STBY ●Pin Description Pin No. Symbol Function 1 VIN Input Pin 2 GND GND Pin 3 STBY Output Control Pin (High:ON, Low:OFF) 4 N.C. No Connect 5 VOUT Output Pin ●Block Diagram VIN VIN 1 Cin VREF + 5 VOUT Cout OCP GND 2 VSTBY STBY 3 TSD STBY 4 N.C. Cin(min)=0.47µF (Ceramic) Cout(min)=0.47µF (Ceramic) Figure 2. Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Absolute Maximum Ratings Parameter Symbol Rating Unit VMAX -0.3 to +6.5 V Power Dissipation Pd 540(*1) mW Maximum Junction Temperature Tjmax +125 ℃ Operating Temperature Range Topr -40 to +105 ℃ Storage Temperature Range Tstg -55 to +125 ℃ Maximum Power Supply Voltage Range (*1) Derate by 5.6mW/℃ when operating above Ta=25℃.(When mounted on a board 70mm×70mm×1.6mm glass-epoxy board, two layer) ●Recommended Operating Ratings Parameter Symbol Limit Unit Input Power Supply Voltage Range VIN 1.7 to 6.0 V Maximum Output Current IMAX 500 mA ●Recommended Operating Conditions Parameter Symbol Input capacitor Output capacitor Rating Unit Conditions － µF A ceramic capacitor is recommended. － µF A ceramic capacitor is recommended. Min. Typ. Max. Cin 0.47(*2) 1.0 Cout 0.47(*2) 1.0 (*2) Set the value of the capacitor so that it does not fall below the minimum value. Take into consideration the temperature characteristics, characteristics, and degradation with time. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/13 DC device TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Electrical Characteristics (*3) (Unless otherwise noted, Ta=-40 to 105℃, VIN=VOUT+1.0V , VSTBY=1.5V, Cin=1μF, Cout=1μF.) Limit PARAMETER Symbol Unit Conditions MIN. TYP. MAX. Output Voltage VOUT Line Regulation VDLI VOUT ×0.98 - VOUT VOUT ×1.02 V 4 10 mV 6 15 mV Load Regulation1 VDLO1 - 0.5 5 mV Load Regulation2 VDLO2 Dropout Voltage VDROP Limit Current Short Current Circuit Current Circuit Current (STBY) Ripple Rejection Ratio ILMAX ISHORT IGND ICCST R.R. - 2.5 400 280 180 150 110 100 85 800 180 33 68 25 700 550 370 290 220 180 150 80 2.0 - mV mV mV mV mV mV mV mV mA mA µA µA dB Load Transient Response VLOT - ±65 - mV Output Noise Voltage VNOIS - 30 - Discharge Resistor RDSC 20 50 80 Ω VSTBH VSTBL 1.1 -0.2 - VIN 0.5 V V ISTBY - - 4.0 µA STBY Control Voltage ON OFF STBY Pin Current IOUT=1mA, VOUT≧2.5V, VIN=VOUT+0.5 to 6.0V VOUT＜2.5V, VIN=3.0 to 6.0V Ta=-40 to +105℃ (*4,5,6) IOUT=10mA VOUT≦2.5V, VIN=3.0 to 6.0V IOUT=10mA VOUT＞2.5V, VIN=VOUT+0.5 to 6.0V IOUT=1 to 100mA IOUT=1 to 500mA 1.0V≦VOUT＜1.2V, IOUT=100mA 1.2V≦VOUT＜1.5V, IOUT=100mA 1.5V≦VOUT＜1.7V, IOUT=100mA 1.7V≦VOUT＜2.1V, IOUT=100mA 2.1V≦VOUT＜2.5V, IOUT=100mA 2.5V≦VOUT＜2.8V, IOUT=100mA 2.8V≦VOUT, IOUT=100mA Vo=VOUT×0.98, Ta=25℃ Vo=0V, Ta=25℃ IOUT=0mA VSTBY=0V VRR=-20dBv,fRR=1kHz,IOUT=10mA IOUT=1 to 150mA,Trise=Tfall=1µs, VIN=VOUT+1.0V (*5) µVrms Bandwidth 10 to 100kHz VIN=4.0V, VSTBY=0V, VOUT=4.0V, Ta=25℃ Ta=25℃ (*3) VIN=3.5V for VOUT＜2.5V. (*4) Operating Conditions are limited by Pd. (*5) Typical values apply for Ta=25℃. (*6) VIN=3.0V to 6.0V for VOUT＜2.5V. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Reference data BU33SD5WG (Unless otherwise specified, Ta=25℃.) 3.5 3.35 IOUT=0m A IOUT=50m A IOUT=200m A 3.34 3.0 Output Voltage VOUT (V) Output Voltage VOUT (V) 3.33 2.5 2.0 1.5 IOUT=0m A IOUT=50m A IOUT=200m A 1.0 3.32 3.31 3.30 3.29 3.28 3.27 0.5 Ta=25℃ VIN=VSTBY Ta=25℃ VIN=VSTBY 3.26 0.0 3.25 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 0.0 Figure 3. Output Voltage vs. Input Voltage 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 6.0 Figure 4. Line Regulation 3.35 70 Ta=25 ℃ Ta=-40 ℃ Ta=105 ℃ 3.34 60 Ta=105 ℃ Ta=25 ℃ Ta=-40 ℃ 50 3.33 Output Voltage VOUT (V) Circuit Current IGND (μA) 5.0 40 30 20 3.32 3.31 3.30 3.29 3.28 VIN=4.3V VSTBY=1.5V 3.27 10 VIN=VSTBY IOUT=0mA 3.26 3.25 0 0.0 1.0 2.0 3.0 4.0 Input Voltage VIN (V) 5.0 6.0 50 100 150 200 Output Current IOUT (mA) Figure 5. Circuit Current vs. Input Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 Figure 6. Load Regulation 5/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Reference data BU33SD5WG (Unless otherwise specified, Ta=25℃.) 100 3.50 90 Ta=105 ℃ Ta=25 ℃ Ta=-40 ℃ 3.00 Output Voltage VOUT (V) Circuit Current IGND (μA) 80 70 60 50 40 30 VIN=4.3V VSTBY=1.5V 20 2.50 2.00 1.50 1.00 Ta=25℃ VIN=4.3V VSTBY=1.5V 0.50 10 0 0.00 0 50 100 150 Outut Current IOUT (mA) 200 0 200 3.35 100 3.34 90 3.33 80 3.32 3.31 3.30 3.29 VIN=4.3V VSTBY=1.5V IOUT=0.1mA 3.28 3.27 1000 Figure 8. OCP Threshold Circuit Current IGND (μA) Output Voltage VOUT (V) Figure 7. Circuit Current vs. Output Current 400 600 800 Output Current IOUT (mA) 70 60 50 40 30 VIN=4.3V VSTBY=1.5V IOUT=0.1mA 20 10 3.26 0 3.25 -40 -20 0 20 40 60 Temperature Ta (℃) 80 -40 100 Figure 9. Output Voltage vs. Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 10. Circuit Current vs. Temperature 6/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Reference data BU33SD5WG (Unless otherwise specified, Ta=25℃.) 3.5 100 90 Ta=105 ℃ Ta=25 ℃ Ta=-40 ℃ 2.5 Circuit Current at STBY ICCST (nA) Output Voltage VOUT (V) 3.0 2.0 1.5 1.0 0.5 VIN=3.5V IOUT=0.1mA 0.0 0.00 80 70 60 50 40 30 VIN=6.0V VSTBY=0V 20 10 0 0.25 0.50 0.75 1.00 1.25 STBY Pin Voltage VSTBY (V) 1.50 Figure 11. STBY Threshold -40 -20 0 20 40 60 Temperature Ta (℃) 80 100 Figure 12. Circuit Current ( at STBY) vs. Temperature 2.0 STBY Pin Current ISTBY (μA) 1.8 1.6 1.4 Ta=105 ℃ Ta=25 ℃ Ta=-40 ℃ 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 1.0 2.0 3.0 4.0 5.0 STBY Pin Voltage VSTBY (V) 6.0 Figure 13. STBY Pin Current vs. STBY Pin Voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Input/Output Capacitor Capacity value of ceramic capacitor - DC bias characteristics (Example) 10-V withstand voltage B1characteristics GRM188B11A105KA61D 10 0 -10 Capacitance Change [%] It is recommended that an input capacitor is placed near pins between the VCC pin and GND as well as an output capacitor between the output pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the best ceramic capacitor for your application 10-V withstand voltage B characteristics -20 6.3-V withstand voltage B characteristics -30 10-V withstand voltage F characteristics -40 -50 -60 4-V withstand voltage X6S characteristics 10-V withstand voltage F characteristics -70 -80 -90 -100 0 0.5 1 1.5 2 2.5 3 3.5 4 DC Bias Voltage [V] Figure 14. Capacity-bias characteristics Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the right. Since ceramic capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of the actual application. 100 Unstable region 10 ESR[Ω] ●Equivalent Series Resistance (ESR) of a Ceramic Capacitor Stable region Cin=Cout=0.47μF Ta=-40 to 105℃ 1 Stable region 0.1 0.01 0 50 100 IOUT[mA] 150 200 Figure 15. Stability area characteristics (Example) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Power Dissipation (Pd) As for power dissipation, an estimate of heat reduction characteristics and internal power consumption of IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original IC performance, such as causing the operation of the thermal shutdown circuit or reduction in current capability. Therefore, be sure to prepare sufficient margin within power dissipation for usage. Calculation of the maximum internal power consumption of IC (PMAX) Where : VIN=Input voltage VOUT= Output voltage IOMAX: Maximum output current) PMAX=(VIN-VOUT)×IOMAX ○Measurement conditions Standard ROHM Board Layout of Board for Measurement Top Layer (Top View) IC Implementation Position Bottom Layer (Top View) Measurement State With board implemented (Wind speed 0 m/s) Board Material Glass epoxy resin (Double-side board) Board Size Wiring Rate 70 mm x 70 mm x 1.6 mm Top layer Metal (GND) wiring rate: Approx. 0% Bottom layer Metal (GND) wiring rate: Approx. 50% Through Hole Diameter 0.5mm x 6 holes Power Dissipation 0.54W θja=185.2℃/W Thermal Resistance 0.6 0.54W 0.5 Standard ROHM board Pd (W) 0.4 0.3 * Please design the margin so that PMAX is less than Pd (PMAX<Pd) within the usage temperature range 0.2 0.1 0 0 25 50 75 100 105 125 Ta (℃) Figure 16. SSOP5 Power dissipation heat reduction characteristics (Reference) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●I/O Equivalence Circuits 5pin (VOUT) 2pin (GND) 3pin (STBY) 1pin (VIN) VIN VOUT Figure 17. Input / Output equivalent circuit www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Operational Notes 1) Absolute maximum ratings This product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. T h e r e f o r e , i t i s i m p o r t a n t t o c o n s i d e r c i r c u i t p r o t e c t i o n m e a s u r e s , l i k e a d d i n g a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. 2) GND Potential GND potential must be the lowest potential of all pins of the IC at all operating conditions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 3) Setting of Heat Carry out the heat design that have adequate margin considering Pd of actual working states. 4) Pin Short and Mistake Fitting When mounting the IC on the PCB, pay attention to the orientation of the IC. If there is mistake in the placement, the IC may be burned up. 5) Actions in Strong Magnetic Field Using the IC within a strong magnetic field may cause the IC to malfunction. 6) Mutual Impedance Use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. Use a capacitor to keep ripple to a minimum. 7) STBY Pin Voltage To enable standby mode for all channels, set the STBY pin to 0.5 V or less, and for normal operation, to 1.1 V or more. Setting STBY to a voltage between 0.5 and 1.1 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a minimum. Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in applications where these pins are shorted, the output should always be completely discharged before turning the IC on. 8) Over Current Protection Circuit Over current and short circuit protection is built-in at the output, and IC destruction is prevented at the time of load short circuit. These protection circuits are effective in the destructive prevention by sudden accidents, please avoid applications to where the over current protection circuit operates continuously. 9) Thermal Shutdown This IC has Thermal Shutdown Circuit (TSD Circuit). When the temperature of IC Chip is higher than 175℃, the output is turned off by TSD Circuit. TSD Circuit is only designed for protecting IC from thermal over load. Therefore it is not recommended that you design application where TSD will work in normal condition. 10) Actions under Strong light A strong light like a halogen lamp may be caused malfunction. In our testing, fluorescence light and white LED causes little effects for the IC, but infrared light causes strong effects on the IC. The IC should be shielded from light like sunrays or halogen lamps. 11) Output capacitor To prevent oscillation at output, it is recommended that the IC be operated at the stable region shown in Figure 15. It operates at the capacitance of more than 0.47μF. As capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Ordering Information B U ROHM Part No. x x S Output voltage xx=33:3.3V D 5 W Series name SD5W:High-speed load response G - Package G: SSOP5 T R Packaging and forming specifications TR:Embossed tape and reel (SSOP5) 500mA Low noise Shutdown SW ●Physical Dimension Tape and Reel Information SSOP5 5 4 1 2 0.2Min. +0.2 1.6 −0.1 2.8±0.2 <Tape and Reel information> +6° 4° −4° 2.9±0.2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 −0.03 1.25Max. ) 0.05±0.05 1.1±0.05 S +0.05 0.42 −0.04 0.95 0.1 S Direction of feed Reel (Unit : mm) ∗ Order quantity needs to be multiple of the minimum quantity. ●Marking Diagram SSOP5(TOP VIEW) Part Number Marking ｘ Output Voltage Marking 3.3V typ. RX ｘ xx 33 LOT Number www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet BUxxSD5 series ●Revision History Date Revision Changes 24.Dec.2013 001 New Release 24.Mar.2014 002 1) 2) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Moved the descriptions of Limit current and Short current from P11 to P4. Added the description of Discharge resistor to P4. 13/13 TSZ02201-0RBR0A300220-1-2 2014.03.24 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001