CERAMIC CHIP INDUCTORS C2 SERIES 1. PART NO. EXPRESSION : C2-1N0S-10 (a) Series code (a) (b) Inductance code : 1N0 = 1.0nH (b) (c) (d) (d) 10 : Lead Free (c) Tolerance code : S = ±0.3nH, J = ±5% 2. CONFIGURATION & DIMENSIONS : A D C B Unit:m/m A B C D 1.6±0.15 0.8±0.15 0.8±0.15 0.2 ~ 0.6 3. GENERAL SPECIFICATION : a) Operating temp. : -40°C to +85°C b) Storage temp. : -10°C to +40°C c) Humdity range : 70% RH Max. d) Resistance to solder heat : 265°C.6secs NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 CERAMIC CHIP INDUCTORS C2 SERIES 6. ELECTRICAL CHARACTERISTICS : EIA Size Inductance ( nH ) Q Min. Test Frequency ( MHz ) SRF ( GHz ) Min. DCR (ȍ) Max. Rated Current ( mA ) Max. C2-1N0S-10 0603 1.0 8 100 10 0.05 300 C2-1N2S-10 0603 1.2 8 100 10 0.05 300 C2-1N5S-10 0603 1.5 8 100 6 0.10 300 C2-1N8S-10 0603 1.8 8 100 6 0.10 300 C2-2N2S-10 0603 2.2 8 100 6 0.10 300 C2-2N7S-10 0603 2.7 10 100 6 0.10 300 C2-3N3S-10 0603 3.3 10 100 6 0.12 300 C2-3N9S-10 0603 3.9 10 100 6 0.14 300 C2-4N7S-10 0603 4.7 10 100 4 0.16 300 C2-5N6S-10 0603 5.6 10 100 4 0.18 300 C2-6N8J-10 0603 6.8 10 100 4 0.22 300 C2-8N2J-10 0603 8.2 10 100 3.5 0.24 300 C2-10NJ-10 0603 10 12 100 3.4 0.26 300 C2-12NJ-10 0603 12 12 100 2.6 0.28 300 C2-15NJ-10 0603 15 12 100 2.3 0.32 300 C2-18NJ-10 0603 18 12 100 2.0 0.35 300 C2-22NJ-10 0603 22 12 100 1.6 0.40 300 C2-27NJ-10 0603 27 12 100 1.4 0.45 300 C2-33NJ-10 0603 33 12 100 1.2 0.55 300 C2-39NJ-10 0603 39 12 100 1.1 0.60 300 C2-47NJ-10 0603 47 12 100 0.9 0.70 300 C2-56NJ-10 0603 56 12 100 0.9 0.75 300 C2-68NJ-10 0603 68 12 100 0.7 0.85 300 C2-82NJ-10 0603 82 12 100 0.6 0.95 300 C2-R10J-10 0603 100 12 100 0.6 1.00 300 C2-R12J-10 0603 120 8 50 0.5 1.20 300 C2-R15J-10 0603 150 8 50 0.5 1.20 300 C2-R18J-10 0603 180 8 50 0.4 1.30 300 C2-R22J-10 0603 220 8 50 0.4 1.50 300 Part Number Tolerance code : S : ±0.3nH J : ±5% NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 CERAMIC CHIP INDUCTORS C2 SERIES 7. CHARACTERISTICS CURVES : Inductance vs. Frequency Q vs. Frequency NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 CERAMIC CHIP INDUCTORS C2 SERIES 8. RELIABILITY & TEST CONDITION : ITEM Solder Heat Resistance PERFORMANCE TEST CONDITION Appearance : Cracks should not be allowed. More than 75% of the terminal electrode should be covered with new solder. Preheat : 100~150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 265±3°C Flux : Rosin Dip Time : 6±1sec. Preheating Dipping 265°C 150°C Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 240±5°C Flux : Rosin Dip Time : 3±1sec. 240°C More than 90% of the terminal electrode should be covered with new solder. Solderability 150°C Terminal Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. 60 seconds 6±1 seconds Preheating Dipping 60 seconds Natural cooling Natural cooling 3±1.0 seconds For C Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 8 2.0 Time (sec) > 25 Solder a chip on a test substrate, bend the substrate by 3mm (0.118in) for 10secs and return. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 CERAMIC CHIP INDUCTORS C2 SERIES 8. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. 1.0(0.039) R0.5(0.02) Chip A High Temperature Resistance Appearance : No damage. Inductance : Within ±20% of initial value. Humidity : 90~95% RH. Temperature : 60±2°C Applied Current : rated current (max.) Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Humidity Resistance Thermal Shock Appearance : Cracking, chipping or any other defects that are harmful to the characteristics shall not be allowed. Inductance : Within ±20% of initial value. Low temperature storage test Temperature : 85±5°C Applied Current : rated current Duration : 1008±12hrs Measurement : After placing for at least 24hrs. Phase Temperature (°C) Times (min.) 1 -40±2°C 30 2 +85±5°C 30 Measured : 100 times For C Series : Condition for 1 cycle Step1 : -40±2°C 30 min. Step2 : +85±5°C 30 min. Number of cycles : 100 Measurement : After placing for at least 24hrs. Temperature : -40±2°C Duration : 1008±12hrs Measurement : After placing for at least 24hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 CERAMIC CHIP INDUCTORS C2 SERIES 9. SOLDERING : 9-1. Reflow soldering conditions Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150°C max. Also cooling into the solvent after soldering should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. A TEMPERATURE °C main heating 1 to 5 °C/sec Heat time 50 to 150 sec Heat temperature 120 to 180 °C C Slope of temp. rise 1 to 5 °C/sec D Time over 230°C 90 ~ 120 sec Peak temperature 255 ~ 260 °C Peak hold time 10 max. sec No. of mounting 3 times E 230°C B 180°C pre-heating 120°C normal temperature A B C E D TIME(sec.) Slope of temp. rise (Melting area of solder) 9-2. Soldering Iron Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip d) 3.0mm tip diameter (max) e) Use a 30 watt max. soldering iron with tip diameter of 3.0mm f) Limit soldering time to 3 secs. 9-3. Solder Volume : t Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side. Upper limit Recommendable NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 CERAMIC CHIP INDUCTORS C2 SERIES 10. PACKAGING INFORMATION : 10-1. Carrier Tape Packaging P0 D0 t B W F E P2 P1 A Ko Unreeling direction A(mm) B(mm) W(mm) F(mm) E(mm) P1(mm) P2(mm) P0(mm) 1.1±0.1 1.9±0.1 8±0.2 3.5±0.05 1.75±0.1 4±0.1 2±0.05 4±0.1 D0(mm) 1.5 +0.1 -0 Ko(mm) t(mm) 1.1±0.05 0.2±0.05 10-2. Leader And Trailer Tape 500 to 560mm Blank 10 to 20 pitches Blank 440mm Min. Components Leader End 110mm or more Unreeling direction 10-3. Configuration W t 2±0.5 ±0.8 A(mm) N(mm) W(mm) t(mm) Qty (pcs) 178±2.0 Ø60±2 10±1.5 2±0.5 4000/Reel A N 1 3 .0 ± 21 8 0. R1.0 NOTE : Specifications subject to change without notice. Please check our website for latest information. 26.09.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7