BC817 Rev.F Apr.-2017 描述 / DATA SHEET Descriptions SOT-23 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a SOT-23 Plastic Package. 特征 / Features IC 大，与 BC807 互补。 High IC ,complementary pair with BC807. 用途 / Applications 用于一般功率放大及开关电路。 Purpose: General power amplifier and switching application. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 3 1 2 PIN1：Base 放大及印章代码 PIN 2：Emitter PIN 3：Collector / hFE Classifications & Marking hFE Classifications Symbol hFE Range Marking http://www.fsbrec.com 16 25 40 100～250 160～400 250～600 H6A H6B H6C 1/6 BC817 Rev.F Apr.-2017 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 50 V Collector to Emitter Voltage VCEO 45 V Emitter to Base Voltage VEBO 5.0 V Collector Current - Continuous IC 500 mA Collector Current - peak collector current ICM 1.0 A Collector Power Dissipation PC 250 mW Junction Temperature Tj 150 ℃ Tstg -55～150 ℃ Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 符号 Parameter Symbol Collector to Base Breakdown VCBO Voltage Collector to Emitter Breakdown VCEO Voltage Emitter to Base Breakdown VEBO Voltage 测试条件 Test Conditions 最小值 Min 典型值 最大值 单位 Typ Max Unit IC=10μA IE=0 50 V IC=10mA IB=0 45 V IE=10μA Ic=0 5.0 V Collector Cut-Off Current ICBO VCB=20V IE=0 0.1 μA Emitter Cut-Off Current IEBO VEB=5.0V IE=0 0.1 μA hFE(1) VCE=1.0V IC=100mA 100 hFE(2) VCE=1.0V IC=500mA 40 VCE(sat) IC=500mA IB=50mA 0.7 V VBE VCE=1.0V IC=500mA 1.2 V fT VCE=5.0V VCB=10V f=1.0MHz IC=10mA IE=0 DC Current Gain Collector to Emitter Saturation Voltage Base to Emitter Voltage Transition Frequency Collector Output Capacitance http://www.fsbrec.com Cob 600 MHz 100 5.0 pF 2/6 BC817 Rev.F Apr.-2017 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/6 BC817 Rev.F Apr.-2017 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 BC817 Rev.F Apr.-2017 印章说明 / DATA SHEET Marking Instructions H6A 说明： H： 为公司代码 6A： 为型号代码 Note: H: Company Code 6A: Product Type Code http://www.fsbrec.com 5/6 BC817 Rev.F Apr.-2017 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOT-23 时间：10±1 sec. Units 包装数量 Dimension Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 3,000 10 30,000 6 180,000 包装尺寸 3 (unit：mm ) Reel Inner Box 盒 Outer Box 箱 7〞×8 180×120×180 390×385×205 / Notices http://www.fsbrec.com 6/6