CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Low-Power SoC (System-on-Chip) with MCU, Memory,
2.4 GHz RF Transceiver, and USB Controller
Applications
• 2400 - 2483.5 MHz ISM/SRD
systems
• Consumer electronics
• Wireless keyboard and mouse
• Wireless voice-quality audio
band
•
•
•
•
RF enabled remote controls
Wireless sports and leisure equipment
Low power telemetry
CC2511Fx: USB dongles
Product Description
The CC2510Fx/CC2511Fx is a true low-cost 2.4
GHz system-on-chip (SoC) designed for lowpower
wireless
applications.
The
CC2510Fx/CC2511Fx combines the excellent
performance of the state-of-the-art RF
transceiver CC2500 with an industry-standard
enhanced 8051 MCU, up to 32 kB of in-system
programmable flash memory and 4 kB of
RAM, and many other powerful features. The
small 6x6 mm package makes it very suited
for applications with size limitations.
The CC2510Fx/CC2511Fx is highly suited for
systems where very low power consumption is
required. This is ensured by several advanced
low-power operating modes. The CC2511Fx
adds a full-speed USB controller to the feature
set of the CC2510Fx. Interfacing to a PC using
the USB interface is quick and easy, and the
high data rate (12 Mbps) of the USB interface
avoids the bottlenecks of RS-232 or low-speed
USB interfaces.
Key Features
• Radio
• MCU, Memory, and Peripherals
o High-performance RF transceiver based on
the market-leading CC2500
o Excellent receiver selectivity and blocking
performance
o High sensitivity (−103 dBm at 2.4 kBaud)
o Programmable data rate up to 500 kBaud
o Programmable output power up to 1 dBm for
all supported frequencies
o Frequency range: 2400 - 2483.5 MHz
o Digital RSSI / LQI support
o High performance and low power 8051
microcontroller core.
o 8/16/32 kB in-system programmable flash,
and 1/2/4 kB RAM
o Full-Speed USB Controller with 1 kB USB
FIFO (CC2511Fx )
2
o I S interface
o 7 - 12 bit ADC with up to eight inputs
o 128-bit AES security coprocessor
o Powerful DMA functionality
o Two USARTs
o 16-bit timer with DSM mode
o Three 8-bit timers
o Hardware debug support
o 21 (CC2510Fx ) or 19 (CC2511Fx ) GPIO pins
• Current Consumption
o Low current consumption (RX: 17.1 mA @
2.4 kBaud, TX: 16 mA @ −6 dBm output
power)
o 0.3 µA in PM3 (the operating mode with the
lowest power consumption)
• General
o Wide supply voltage range (2.0V - 3.6V)
o Green package: RoHS compliant and no
antimony or bromine, 6x6mm QFN 36
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CC2510Fx / CC2511Fx
Table of Contents
ABBREVIATIONS ................................................................................................................................................ 4
1
REGISTER CONVENTIONS .................................................................................................................. 5
2
KEY FEATURES (IN MORE DETAILS) .............................................................................................. 6
2.1
HIGH-PERFORMANCE AND LOW-POWER 8051-COMPATIBLE MICROCONTROLLER....................................... 6
2.2
8/16/32 KB NON-VOLATILE PROGRAM MEMORY AND 1/2/4 KB DATA MEMORY ......................................... 6
2.3
FULL-SPEED USB CONTROLLER (CC2511FX ) ............................................................................................... 6
2.4
I2S INTERFACE .............................................................................................................................................. 6
2.5
HARDWARE AES ENCRYPTION/DECRYPTION ............................................................................................... 6
2.6
PERIPHERAL FEATURES ................................................................................................................................ 6
2.7
LOW POWER ................................................................................................................................................. 6
2.8
2.4 GHZ RADIO WITH BASEBAND MODEM ................................................................................................... 7
3
ABSOLUTE MAXIMUM RATINGS ...................................................................................................... 8
4
OPERATING CONDITIONS .................................................................................................................. 9
4.1
CC2510FX OPERATING CONDITIONS .............................................................................................................. 9
4.2
CC2511FX OPERATING CONDITIONS .............................................................................................................. 9
5
GENERAL CHARACTERISTICS .......................................................................................................... 9
6
ELECTRICAL SPECIFICATIONS ...................................................................................................... 10
6.1
CURRENT CONSUMPTION ........................................................................................................................... 10
6.2
RF RECEIVE SECTION ................................................................................................................................. 13
6.3
RF TRANSMIT SECTION .............................................................................................................................. 15
6.4
CRYSTAL OSCILLATORS ............................................................................................................................. 16
6.5
32.768 KHZ CRYSTAL OSCILLATOR ........................................................................................................... 17
6.6
LOW POWER RC OSCILLATOR .................................................................................................................... 17
6.7
HIGH SPEED RC OSCILLATOR .................................................................................................................... 18
6.8
FREQUENCY SYNTHESIZER CHARACTERISTICS ........................................................................................... 18
6.9
ANALOG TEMPERATURE SENSOR ............................................................................................................... 19
6.10 7 - 12 BIT ADC ........................................................................................................................................... 20
6.11 CONTROL AC CHARACTERISTICS ............................................................................................................... 22
6.12 SPI AC CHARACTERISTICS ......................................................................................................................... 23
6.13 DEBUG INTERFACE AC CHARACTERISTICS ................................................................................................ 24
6.14 PORT OUTPUTS AC CHARACTERISTICS ...................................................................................................... 24
6.15 TIMER INPUTS AC CHARACTERISTICS ........................................................................................................ 25
6.16 DC CHARACTERISTICS ............................................................................................................................... 25
7
PIN AND I/O PORT CONFIGURATION ............................................................................................ 26
8
CIRCUIT DESCRIPTION ..................................................................................................................... 30
8.1
CPU AND PERIPHERALS ............................................................................................................................. 31
8.2
RADIO ........................................................................................................................................................ 33
9
APPLICATION CIRCUIT ..................................................................................................................... 33
9.1
BIAS RESISTOR ........................................................................................................................................... 33
9.2
BALUN AND RF MATCHING ........................................................................................................................ 33
9.3
CRYSTAL .................................................................................................................................................... 33
9.4
REFERENCE SIGNAL ................................................................................................................................... 34
9.5
USB (CC2511FX) ......................................................................................................................................... 34
9.6
POWER SUPPLY DECOUPLING ..................................................................................................................... 34
9.7
PCB LAYOUT RECOMMENDATIONS ............................................................................................................ 38
10
8051 CPU .................................................................................................................................................. 39
10.1 8051 INTRODUCTION .................................................................................................................................. 39
10.2 MEMORY .................................................................................................................................................... 39
10.3 CPU REGISTERS ......................................................................................................................................... 51
10.4 INSTRUCTION SET SUMMARY ..................................................................................................................... 53
10.5 INTERRUPTS................................................................................................................................................ 57
11
DEBUG INTERFACE............................................................................................................................. 68
11.1 DEBUG MODE ............................................................................................................................................. 68
11.2 DEBUG COMMUNICATION........................................................................................................................... 68
11.3 DEBUG LOCK BIT ....................................................................................................................................... 68
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
11.4
12
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
12.9
12.10
12.11
12.12
12.13
12.14
12.15
12.16
13
13.1
13.2
13.3
13.4
13.5
13.6
13.7
13.8
13.9
13.10
13.11
13.12
13.13
13.14
13.15
13.16
13.17
13.18
14
14.1
15
16
17
18
18.1
DEBUG COMMANDS.................................................................................................................................... 69
PERIPHERALS ....................................................................................................................................... 73
POWER MANAGEMENT AND CLOCKS.......................................................................................................... 73
RESET ......................................................................................................................................................... 80
FLASH CONTROLLER .................................................................................................................................. 81
I/O PORTS................................................................................................................................................... 87
DMA CONTROLLER ................................................................................................................................... 98
16-BIT TIMER, TIMER 1............................................................................................................................. 109
MAC TIMER (TIMER 2) ............................................................................................................................ 121
SLEEP TIMER ............................................................................................................................................ 123
8-BIT TIMERS, TIMER 3 AND TIMER 4 ....................................................................................................... 126
ADC ......................................................................................................................................................... 137
RANDOM NUMBER GENERATOR ............................................................................................................... 143
AES COPROCESSOR.................................................................................................................................. 144
WATCHDOG TIMER................................................................................................................................... 147
USART .................................................................................................................................................... 149
I2S ............................................................................................................................................................ 159
USB CONTROLLER ................................................................................................................................... 167
RADIO .................................................................................................................................................... 183
COMMAND STROBES ................................................................................................................................ 183
RADIO REGISTERS .................................................................................................................................... 185
INTERRUPTS.............................................................................................................................................. 185
TX/RX DATA TRANSFER ......................................................................................................................... 187
DATA RATE PROGRAMMING ..................................................................................................................... 188
RECEIVER CHANNEL FILTER BANDWIDTH ................................................................................................ 188
DEMODULATOR, SYMBOL SYNCHRONIZER, AND DATA DECISION ............................................................ 189
PACKET HANDLING HARDWARE SUPPORT ............................................................................................... 190
MODULATION FORMATS........................................................................................................................... 193
RECEIVED SIGNAL QUALIFIERS AND LINK QUALITY INFORMATION ......................................................... 194
FORWARD ERROR CORRECTION WITH INTERLEAVING .............................................................................. 197
RADIO CONTROL ...................................................................................................................................... 198
FREQUENCY PROGRAMMING .................................................................................................................... 201
VCO ......................................................................................................................................................... 202
OUTPUT POWER PROGRAMMING .............................................................................................................. 202
SELECTIVITY ............................................................................................................................................ 203
SYSTEM CONSIDERATIONS AND GUIDELINES ........................................................................................... 205
RADIO REGISTERS .................................................................................................................................... 208
VOLTAGE REGULATORS ................................................................................................................ 226
VOLTAGE REGULATOR POWER-ON ........................................................................................................... 226
RADIO TEST OUTPUT SIGNALS ..................................................................................................... 226
REGISTER OVERVIEW ..................................................................................................................... 228
REFERENCES ...................................................................................................................................... 232
GENERAL INFORMATION ............................................................................................................... 233
DOCUMENT HISTORY ............................................................................................................................... 233
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Abbreviations
∆Σ
Delta-Sigma
LNA
Low-Noise Amplifier
ADC
Analog to Digital Converter
LO
Local Oscillator
AES
Advanced Encryption Standard
LQI
Link Quality Indication
AGC
Automatic Gain Control
LSB
Least Significant Bit / Byte
ARIB
Association of Radio Industries and
Businesses
MAC
Medium Access Control
MCU
Microcontroller Unit
BCD
Binary Coded Decimal
MISO
Master In Slave Out
BER
Bit Error Rate
MOSI
Master Out Slave In
BOD
Brown Out Detector
MSB
Most Significant Bit / Byte
CBC
Cipher Block Chaining
NA
Not Applicable
CBCMAC
Cipher Block Chaining Message
Authentication Code
OFB
Output Feedback (encryption)
CCA
Clear Channel Assessment
PA
Power Amplifier
CCM
Counter mode + CBC-MAC
PCB
Printed Circuit Board
CFB
Cipher Feedback
PER
Packet Error Rate
CFR
Code of Federal Regulations
PLL
Phase Locked Loop
CMOS
Complementary Metal Oxide
Semiconductor
PM{0 - 3}
Power Mode 0 - 3
PMC
Power Management Controller
Central Processing Unit
POR
Power On Reset
Cyclic Redundancy Check
PWM
Pulse Width Modulator
CTR
Counter mode (encryption)
Px_n
DAC
Digital to Analog Converter
Port x pin n (x = 0, 1, or 2 and
n = 0, 1, 2, .., 7)
DMA
Direct Memory Access
QLP
Quad Leadless Package
DSM
Delta-Sigma Modulator
RAM
Random Access Memory
ECB
Electronic Code Book
RCOSC
RC Oscillator
EM
Evaluation Module
RF
Radio Frequency
ENOB
Effective Number of Bits
RoHS
Restriction on Hazardous Substances
EP{0 - 5}
USB Endpoints 0 - 5
RSSI
Receive Signal Strength Indicator
ESD
Electro Static Discharge
RX
Receive
ESR
Equivalent Series Resistance
SCK
Serial Clock
ETSI
European Telecommunications Standard
Institute
SFD
Start of Frame Delimiter
SFR
Special Function Register
SINAD
Signal-to-noise and distortion ratio
CPU
CRC
FCC
Federal Communications Commission
FIFO
First In First Out
GPIO
General Purpose Input / Output
SPI
Serial Peripheral Interface
High Speed Serial Debug
SRAM
Static Random Access Memory
Hardware
SW
Software
Inter-IC Sound
T/R
Transmit / Receive
Input / Output
TX
Transmit
I/Q
In-phase / Quadrature-phase
UART
IF
Intermediate Frequency
Universal Asynchronous
Receiver/Transmitter
IOC
I/O Controller
USART
Universal Synchronous/Asynchronous
Receiver/Transmitter
ISM
Industrial, Scientific and Medical
USB
Universal Serial Bus
ISR
Interrupt Service Routine
VCO
Voltage Controlled Oscillator
IV
Initialization Vector
VGA
Variable Gain Amplifier
JEDEC
Joint Electron Device Engineering Council
WDT
Watchdog Timer
kbps
kilo bits per second
XOSC
Crystal Oscillator
KB
Kilo Bytes (1024 bytes)
LFSR
Linear Feedback Shift Register
HSSD
HW
2
IS
I/O
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CC2510Fx / CC2511Fx
1
Register Conventions
Each SFR is described in a separate table. The table heading is given in the following format:
REGISTER NAME (SFR Address) - Register Description.
Each RF register is described in a separate table. The table heading is given in the following format:
XDATA Address: REGISTER NAME - Register Description
All register descriptions include a symbol denoted R/W describing the accessibility of each bit in the
register. The register values are always given in binary notation unless prefixed by ‘0x’, which
indicates hexadecimal notation.
Symbol
Access Mode
R/W
Read/write
R
Read only
R0
Read as 0
R1
Read as 1
W
Write only
W0
Write as 0
W1
Write as 1
H0
Hardware clear
H1
Hardware set
Table 1: Register Bit Conventions
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CC2510Fx / CC2511Fx
2
Key Features (in more details)
2.1
High-Performance and Low-Power
8051-Compatible Microcontroller
• Support for µ-law compression and
expansion
• Optimized 8051 core which typically
gives 8x the performance of a standard
8051
• Typically used to connect to external
DAC or ADC
• Two data pointers
2.5
• In-circuit interactive debugging is
supported by the IAR Embedded
Workbench through a simple two-wire
serial interface
• SW compatible with CC1110Fx/CC1111Fx
2.2
• 128-bit AES supported in hardware
coprocessor
2.6
• Power On Reset/Brown-Out Detection
• ADC with eight individual input
channels, single-ended or differential
(CC2511Fx has six channels) and
configurable resolution
• 8, 16, or 32 kB of non-volatile flash
memory,
in-system
programmable
through a simple two-wire interface or
by the 8051 core
• Programmable watchdog timer
endurance:
• Five timers: one general 16-bit timer
with DSM mode, two general 8-bit
timers, one MAC timer, and one sleep
timer
• Programmable read and write lock of
portions of flash memory for software
security
• Two
programmable
USARTs
for
master/slave SPI or UART operation
• 1, 2, or 4 kB of internal SRAM
2.3
• 21 configurable general-purpose digital
I/O-pins (CC2511Fx has 19)
Full-Speed USB Controller (CC2511Fx )
• Random number generator
• 5 bi-directional endpoints in addition to
control endpoint 0
2.7
• Full-Speed, 12 Mbps transfer rate
Low Power
and
• Four flexible power modes for reduced
power consumption
• 1024 bytes of dedicated endpoint FIFO
memory
• System can wake up on external
interrupt or when the Sleep Timer
expires
• Support for Bulk, Interrupt,
Isochronous endpoints
• 8 - 512 byte data packet size supported
• Configurable FIFO size for IN and OUT
direction of endpoint
2.4
Peripheral Features
• Powerful DMA Controller
8/16/32 kB Non-volatile Program
Memory and 1/2/4 kB Data Memory
• Minimum flash memory
1000 write/erase cycles
Hardware AES Encryption/Decryption
2
I S Interface
• Industry standard I S interface
transfer of digital audio data
2
for
• 0.5 µA current consumption in PM2,
where external interrupts or the Sleep
Timer can wake up the system
• 0.3 µA current consumption in PM3,
where external interrupts can wake up
the system
• Low-power fully static CMOS design
• Full duplex
• Mono and stereo support
• Configurable sample rate and sample
size
SWRS055G
• System clock source is either a high
speed crystal oscillator (24 - 27 MHz for
CC2510Fx and 48 MHz for CC2511Fx) or a
high speed RC oscillator (12 - 13.5 MHz
for CC2510Fx and 12 MHz for CC2511Fx).
Page 6 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
The high speed crystal oscillator must
be used when the radio is active.
• Clock source for ultra-low power
operation can be either a low-power RC
oscillator or an optional 32.768 kHz
crystal oscillator
• Very fast transition to active mode from
power modes enables ultra low average
power consumption in low duty-cycle
systems
2.8
2.4 GHz Radio with Baseband Modem
• Based on the industry leading CC2500
radio core
• Few external components: On-chip
frequency synthesizer, no external filters
or RF switch needed
• Flexible support for packet oriented
systems: On-chip support for sync word
detection, address check, flexible
packet length, and automatic CRC
handling
• 2-FSK, GFSK and MSK supported
• Optional automatic whitening and dewhitening of data
• Programmable
indicator
Carrier
Sense
(CS)
• Programmable
Preamble
Quality
Indicator for detecting preambles and
improved protection against sync word
detection in random noise
• Support for automatic Clear Channel
Assessment (CCA) before transmitting
(for listen-before-talk systems
• Support for per-package Link Quality
Indication (LQI)
• Suited for systems targeting compliance
with EN 300 328, EN 300 440, FCC
CFR47 Part 15 and ARIB STD-T-66
• When transmitting in band 2480 2483.5 MHz under FCC, duty-cycling or
reducing output power might be needed
• Supports use of DMA for both RX and
TX
resulting
in
minimal
CPU
intervention even on high data rates
• Programmable channel filter bandwidth
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
3
Absolute Maximum Ratings
Under no circumstances must the absolute maximum ratings given in Table 2 be violated. Stress
exceeding one or more of the limiting values may cause permanent damage to the device.
Parameter
Min
Max
Units
Supply voltage (VDD)
−0.3
3.9
V
Voltage on any digital pin
−0.3
VDD + 0.3,
max 3.9
V
Voltage on the pins RF_P, RF_N
and DCOUPL
−0.3
2.0
V
Voltage ramp-up rate
120
kV/µs
Input RF level
10
dBm
150
°C
Device not programmed
Solder reflow temperature
260
°C
According to IPC/JEDEC J-STD-020D
ESD CC2510Fx
750
V
According to JEDEC STD 22, method A114, Human
Body Model (HBM)
ESD CC2510Fx
500
V
According to JEDEC STD 22, C101C, Charged Device
Model (CDM)
ESD CC2511x
750
V
According to JEDEC STD 22, method A114, Human
Body Model (HBM)
ESD CC2511x
500
V
According to JEDEC STD 22, C101C, Charged Device
Model (CDM)
Storage temperature range
−50
Condition
All supply pins must have the same voltage
Table 2: Absolute Maximum Ratings
Caution!
ESD
sensitive
device.
Precaution should be used when handling
the device in order to prevent permanent
damage.
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CC2510Fx / CC2511Fx
4
Operating Conditions
4.1
CC2510Fx Operating Conditions
The operating conditions for CC2510Fx are listed in Table 3 below.
Parameter
Min
Max
Unit
Operating ambient temperature, TA
−40
85
°C
Operating supply voltage (VDD)
2.0
3.6
V
Condition
All supply pins must have the same voltage
Table 3: Operating Conditions for CC2510Fx
4.2
CC2511Fx Operating Conditions
The operating conditions for CC2511Fx are listed in Table 4 below.
Parameter
Operating ambient temperature, TA
Operating supply voltage (VDD)
Min
Max
Unit
0
85
°C
3.0
3.6
V
Condition
All supply pins must have the same voltage
Table 4: Operating Conditions for CC2511Fx
5
General Characteristics
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition/Note
2400
2483.5
MHz
There will be spurious signals at n/2·crystal oscillator
frequency (n is an integer number). RF frequencies at
n/2·crystal oscillator frequency should therefore be
avoided (e.g. 2405, 2418, 2431, 2444, 2457, 2470 and
2483 MHz when using a 26 MHz crystal).
1.2
500
kBaud
2-FSK
1.2
250
kBaud
GFSK
26
500
kBaud
(Shaped) MSK (also known as differential offset QPSK)
Radio part
Frequency range
Data rate
Optional Manchester encoding (the data rate in kbps will
be half the baud rate)
Wake-Up Timing
PM1 Active
Mode
4
µs
Digital regulator on. HS RCOSC and high speed crystal
oscillator off. 32.768 kHz XOSC or low power RCOSC
running.
SLEEP.OSC_PD=1 and CLKCON.OSC=1
PM2/3 Active
Mode
100
µs
Digital regulator off. HS RCOSC and high speed crystal
oscillator off. 32.768 kHz XOSC or low power RCOSC
running (PM2). No crystal oscillators or RC oscillators
are running in PM3.
SLEEP.OSC_PD=1 and CLKCON.OSC=1
Table 5: General Characteristics
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6
Electrical Specifications
6.1
Current Consumption
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference design ([1]).
Parameter
Active mode, full
speed (high speed
crystal oscillator) 1.
Min
Typ
Max
Unit
Condition
4.8
mA
System clock running at 26 MHz.
4.6
mA
System clock running at 24 MHz.
Digital regulator on. High speed crystal oscillator and low power
RCOSC running. No peripherals running.
Low CPU activity.
Low CPU activity: No flash access (i.e. only cache hit), no RAM
access
Active mode, full
speed (HS
RCOSC)1.
2.5
mA
System clock running at 13 MHz.
Digital regulator on. HS RCOSC and low power RCOSC running. No
peripherals running.
Low CPU activity.
Low CPU activity: No flash access (i.e. only cache hit), no RAM
access
Active mode with
radio in RX
Digital regulator on. High speed crystal oscillator and low power
RCOSC running. Radio in RX mode (sensitivity optimized
MDMCFG2.DEM_DCFILT_OFF=0)
19.8
mA
2.4 kBaud, input at sensitivity limit, system clock running at 26 MHz.
20.6
mA
2.4 kBaud, input at sensitivity limit, system clock running at 24 MHz.
17.1
mA
2.4 kBaud, input at sensitivity limit, system clock running at 203 kHz.
19.8
mA
2.4 kBaud, input well above sensitivity limit, system clock running at
26 MHz.
21.5
mA
10 kBaud, input at sensitivity limit, system clock running at 26 MHz.
22.1
mA
10 kBaud, input at sensitivity limit, system clock running at 24 MHz.
18.8
mA
10 kBaud, input at sensitivity limit, system clock running at 203 kHz.
19.0
mA
10 kBaud, input well above sensitivity limit, system clock running at
26 MHz.
22.9
mA
250 kBaud, input at sensitivity limit, system clock running at 26 MHz.
22.7
mA
250 kBaud, input at sensitivity limit, system clock running at 24 MHz.
20.5
mA
250 kBaud, input at sensitivity limit, system clock running at 1.625
MHz.
19.6
mA
250 kBaud, input well above sensitivity limit, system clock running at
26 MHz. See Figure 2 for typical variation over operating conditions
19.7
mA
500 kBaud, input at sensitivity limit, system clock running at 26 MHz.
20.8
mA
500 kBaud, input at sensitivity limit, system clock running at 24 MHz.
17.5
mA
500 kBaud, input at sensitivity limit, system clock running at 3.25
MHz.
16.7
mA
500 kBaud, input well above sensitivity limit
Digital regulator on. High speed crystal oscillator and low power
RCOSC running. Radio in RX mode (current optimized
MDMCFG2.DEM_DCFILT_OFF=1)
17.4
mA
2.4 kBaud, input at sensitivity limit, system clock running at 26 MHz.
14.7
mA
2.4 kBaud, input at sensitivity limit, system clock running at 203 kHz.
17.4
mA
2.4 kBaud, input well above sensitivity limit, system clock running at
26 MHz.
1
Note: In order to reduce the current consumption in active mode, the clock speed can be reduced by
setting CLKCON.CLKSPD≠000 (see section 13.1 for details). Figure 1 shows typical current
consumption in active mode for different clock speeds
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CC2510Fx / CC2511Fx
Parameter
Min
Typ
Max
Unit
Condition
19.4
mA
10 kBaud, input at sensitivity limit, system clock running at 26 MHz.
15.7
mA
10 kBaud, input at sensitivity limit, system clock running at 203 kHz.
16.9
mA
10 kBaud, input well above sensitivity limit, system clock running at
26 MHz.
System clock running at 26 MHz.
Active mode with
radio in TX
Digital regulator on. High speed crystal oscillator and low power
RCOSC running. Radio in TX mode
26
mA
0 dBm output power (PA_TABLE0=0xFE). See Table 7 for typical
variation over operating conditions
18.5
mA
−6 dBm output power (PA_TABLE0=0x7F)
15.5
mA
−12 dBm output power (PA_TABLE0=0x95)
26
mA
System clock running at 24 MHz.
Digital regulator on. High speed crystal oscillator and low power
RCOSC running. Radio in TX mode w/0 dBm output power
(PA_TABLE0=0xFE)
PM0
4.3
mA
Same as active mode, but the CPU is not running (see 12.1.2.2 for
details). System clock running at 26 MHz
PM1
220
µA
Digital regulator on. HS RCOSC and high speed crystal oscillator off.
32.768 kHz XOSC or low power RCOSC running (see 12.1.2.3 for
details)
PM2
0.5
1
µA
Digital regulator off. HS RCOSC and high speed crystal oscillator off.
Low power RCOSC running (see 12.1.2.4 for details)
PM3
0.3
1
µA
Digital regulator off. No crystal oscillators or RC oscillators are
running (see 12.1.2.5 for details)
Peripheral
Current
Consumption
Add to the figures above if the peripheral unit is activated
Timer 1
2.7
µA/MHz
When running
Timer 2
1.3
µA/MHz
When running
Timer 3
1.6
µA/MHz
When running
Timer 4
2
µA/MHz
When running
1.2
mA
ADC
During conversion
Table 6: Current Consumption
SWRS055G
Page 11 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Current Consumption Active Mode. No Peripherals Running.
fxosc = 26 MHz
6,0
Current [mA]
5,0
4,0
HS XOSC
3,0
HS RCOSC
2,0
1,0
0,0
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
Clock Speed [MHz]
Measurements done for all valid CLKCON.CLKSPD settings
(000 – 111 for HS XOSC, 001 – 111 for HS RCOSC)
Figure 1: Current Consumption (Active Mode) vs. Clock Speed
Typical Variation in RX Current Consumption over
Temperature and Input Power Level.
Data Rate = 250 kBaud
25.0
Current [mA]
23.0
21.0
-40 °C
+25 °C
19.0
+85 °C
17.0
15.0
-120
-100
-80
-60
-40
Input Power Level [dBm]
-20
0
Figure 2: Typical Variation in RX Current Consumption over Temperature and Input Power Level.
Data Rate = 250 kBaud.
Supply Voltage, VDD = 2 V
Supply Voltage, VDD = 3 V
Supply Voltage, VDD = 3.6 V
Temperature [°C]
−40
25
85
−40
25
85
−40
25
85
Current [mA]
26
25.6
26
26.3
26
26.3
26.5
26.2
26.6
Table 7: Typical Variation in TX Current Consumption over Temperature and Supply Voltage,
0 dBm Output Power
SWRS055G
Page 12 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.2
RF Receive Section
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference design ([1]).
Parameter
Min
Digital channel
filter bandwidth
58
Typ
Max
Unit
Condition/Note
812
kHz
User programmable (see Section 13.6). The bandwidth limits are
proportional to crystal frequency (given values assume a 26.0 MHz
crystal).
2.4 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 203 kHz digital channel filter bandwidth)
Receiver
sensitivity
−103
dBm
The RX current consumption can be reduced by approximately 2.4 mA
by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical sensitivity is then
−101 dBm.
The sensitivity can be improved to typically −105 dBm with
MDMCFG2.DEM_DCFILT_OFF=0 by changing registers TEST2 and
TEST1 (see Page 222). The temperature range is then from 0oC to 85oC.
Saturation
−10
dBm
Adjacent
channel
rejection
23
dB
Desired channel 3 dB above the sensitivity limit. 250 kHz channel
spacing
Alternate
channel
rejection
32
dB
Desired channel 3 dB above the sensitivity limit. 250 kHz channel
spacing
See Figure 55 for plot of selectivity versus frequency offset
Blocking
±10 MHz offset
64
dB
Wanted signal 3 dB above sensitivity level.
±20 MHz offset
70
dB
Compliant with ETSI EN 300 440 class 2 receiver requirements.
±50 MHz offset
71
dB
10 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(2-FSK, 1% packet error rate, 20 bytes packet length, 232 kHz digital channel filter bandwidth)
Receiver
sensitivity
−98
dBm
The RX current consumption can be reduced by approximately 2.2 mA
by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical sensitivity is then
−97 dBm.
The sensitivity can be improved to typically −100 dBm with
MDMCFG2.DEM_DCFILT_OFF=0 by changing registers TEST2 and
TEST1 (see Page 222). The temperature range is then from 0oC to 85oC.
Saturation
−9
dBm
Adjacent
channel
rejection
19
dB
Desired channel 3 dB above the sensitivity limit. 250 kHz channel
spacing
Alternate
channel
rejection
25
dB
Desired channel 3 dB above the sensitivity limit. 250 kHz channel
spacing
See Figure 56 for plot of selectivity versus frequency offset
Blocking
±10 MHz offset
59
dB
Wanted signal 3 dB above sensitivity level.
±20 MHz offset
65
dB
Compliant with ETSI EN 300 440 class 2 receiver requirements.
±50 MHz offset
66
dB
SWRS055G
Page 13 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Parameter
Min
Typ
Max
Unit
Condition/Note
250 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0
(MSK, 1% packet error rate, 20 bytes packet length, 540 kHz digital channel filter bandwidth)
Receiver
sensitivity
−90
Saturation
−11
dBm
Adjacent
channel
rejection
21
dB
Desired channel 3 dB above the sensitivity limit. 750 kHz channel
spacing
Alternate
channel
rejection
30
dB
Desired channel 3 dB above the sensitivity limit. 750 kHz channel
spacing
dBm
See Table 9 for typical variation over operating conditions
See Figure 57 for plot of selectivity versus frequency offset
Blocking
±10 MHz offset
46
dB
Wanted signal 3 dB above sensitivity level.
±20 MHz offset
53
dB
Compliant with ETSI EN 300 440 class 2 receiver requirements.
±50 MHz offset
55
dB
500 kBaud data rate, sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF=0 (MDMCFG2.DEM_DCFILT_OFF=1 cannot
be used for data rates >100 kBaud)
(MSK, 1% packet error rate, 20 bytes packet length, 812 kHz digital channel filter bandwidth)
Receiver
sensitivity
−82
dBm
Saturation
−15
dBm
Adjacent
channel
rejection
12
dB
Desired channel 3 dB above the sensitivity limit. 1 MHz channel spacing
Alternate
channel
rejection
23
dB
Desired channel 3 dB above the sensitivity limit. 1 MHz channel spacing
See Figure 59 for plot of selectivity versus frequency offset
General
Conducted measurement in a 50 Ω single ended load. Complies with EN
300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66.
Spurious
emissions
25 MHz 1 GHz
−57
dBm
Above 1 GHz
−47
dBm
Table 8: RF Receive Section
Supply Voltage, VDD = 2 V
Supply Voltage, VDD = 3 V
Supply Voltage, VDD = 3.6 V
Temperature [°C]
−40
25
85
−40
25
85
−40
25
85
Sensitivity [dBm]
−91.5
−90.3
−88.7
−90
−89.6
−88.1
−88.7
−89.3
−88.4
Table 9: Typical Variation in Sensitivity over Temperature and Supply Voltage @ 2.44 GHz and
250 kBaud Data Rate
SWRS055G
Page 14 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.3
RF Transmit Section
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Differential load
impedance
Output power, highest
setting
Typ
Max
Unit
80 + j74
Ω
1
dBm
Condition/Note
Differential impedance as seen from the RF-port (RF_P and
RF_N) towards the antenna. Follow the CC2510EM
reference design [1] available from TI’s website.
Output power is programmable and is available across the
entire frequency band. See Figure 3 typical variation over
operating conditions (output power is 0 dBm)
Delivered to a 50 Ω single-ended load via the CC2510EM
reference design [1] RF matching network.
Output power, lowest
setting
−30
dBm
Output power is programmable and is available across the
entire frequency band
Delivered to a 50 Ω single-ended load via the CC2510EM
reference design [1] RF matching network.
Occupied bandwidth
(99%)
−28
dBc
2.4 kBaud, 38.2 kHz deviation, 2-FSK, 250 kHz channel
spacing
−27
dBc
10 kBaud, 38.2 kHz deviation, 2-FSK, 250 kHz channel
spacing
−22
dBc
250 kBaud, MSK, 750 kHz channel spacing
−21
dBc
500 kBaud, MSK, 1 MHz channel spacing
Spurious emissions
0 dBm output power.
25 MHz - 1 GHz
−36
dBm
47 - 74, 87.5 - 118,
174 - 230, and
470 - 862 MHz
−54
dBm
1800 - 1900 MHz
−47
dBm
Restricted band in Europe
At 2∙RF and 3∙RF
−41
dBm
Restricted bands in USA
Otherwise above
1 GHz
−30
dBm
Table 10: RF Transmit Section
Output Power [dBm]
Typical Variation in Output Power (0 dBm) over Frequency and
Temperature
2
Avg -40°C
Avg +85°C
0
Avg +25°C
-2
-2
2400
2408
2416 2424 2432
2440 2448
2456 2464
2472 2480
Frequency [MHz]
Figure 3: Typical Variation in Output Power over Frequency and Temperature
(0 dBm output power)
SWRS055G
Page 15 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.4
6.4.1
Crystal Oscillators
CC2510Fx Crystal Oscillator
TA = 25°C, VDD = 3.0 V if nothing else is stated.
Parameter
Min
Typ
Max
Unit
Condition/Note
Crystal frequency
24
26
27
MHz
Referred to as fXOSC. For operation below 26 MHz, please refer to Table
4 for Operating Conditions.
ppm
This is the total tolerance including a) initial tolerance, b) crystal
loading, c) aging, and d) temperature dependence.
±40
Crystal frequency
accuracy
requirement
The acceptable crystal tolerance depends on RF frequency and
channel spacing / bandwidth.
C0
1
5
7
pF
Simulated over operating conditions
Load capacitance
10
13
20
pF
Simulated over operating conditions
100
Ω
Simulated over operating conditions
μs
fXOSC = 26 MHz
ESR
Start-up time
250
Note: A Ripple counter of 12 bit is included to ensure duty-cycle
requirements. Start-up time includes ripple counter delay until
SLEEP.XOSC_STB is asserted
Power Down
Guard Time
3
ms
The crystal oscillator must be in power down for a guard time before it
is used again. This requirement is valid for all modes of operation. The
need for power down guard time can vary with crystal type and load.
Minimum figure is valid for reference crystal NDK, AT-41CD2 and load
capacitance according to Table 29.
If power down guard time is violated, one of the consequences can be
increased PER when using the radio immediately after the crystal
oscillator has been reported stable.
Table 11: CC2510Fx Crystal Oscillator Parameters
6.4.2
CC2511Fx Crystal Oscillator
TA = 25°C, VDD = 3.0 V if nothing else is stated.
Parameter
Min
Typ
Max
Unit
Condition/Note
Crystal frequency
48
MHz
Referred to as fXOSC
Crystal frequency
accuracy
requirement
±40
ppm
This is the total tolerance including a) initial tolerance, b) crystal
loading, c) aging, and d) temperature dependence.
The acceptable crystal tolerance depends on RF frequency and
channel spacing / bandwidth.
C0
Fundamental
0.85
1
1.15
pF
3rd overtone
2
3
7
pF
Load capacitance
15
16
17
pF
Simulated over operating conditions
60
Ω
Simulated over operating conditions
ESR
Start-up time
Fundamental
rd
3 overtone
Simulated over operating conditions. Variation given by reference
crystal NX2520SA from NDK
Note: A Ripple counter of 14 bit is included to ensure duty-cycle
requirements. Start-up time includes ripple counter delay until
SLEEP.XOSC_STB is asserted
650
μs
3
ms
Simulated value
Table 12: CC2511Fx Crystal Oscillator Parameters
SWRS055G
Page 16 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.5
32.768 kHz Crystal Oscillator
TA = 25°C, VDD = 3.0V if nothing else is stated.
Parameter
Min
Crystal frequency
Typ
Max
32.768
Unit
Condition/Note
kHz
C0
0.9
2.0
pF
Simulated over operating conditions
Load capacitance
12
16
pF
Simulated over operating conditions
ESR
40
130
kΩ
Simulated over operating conditions
Start-up time
400
ms
Value is simulated
Table 13: 32.768 kHz Crystal Oscillator Parameters
6.6
Low Power RC Oscillator
TA = 25°C, VDD = 3.0 V if nothing else is stated.
Parameter
Calibrated frequency
2
Min
Typ
Max
Unit
Condition/Note
32.0
34.7
36.0
kHz
CC2510Fx
32.0
32.0
32.0
CC2511Fx
Calibrated low power RC oscillator frequency is
fRef / 750
Frequency accuracy after
calibration
Temperature coefficient
±1
%
+0.5
%/°C
Frequency drift when temperature changes after
calibration
Supply voltage coefficient
+3
%/V
Frequency drift when supply voltage changes after
calibration
Initial calibration time
2
ms
When the low power RC oscillator is enabled,
calibration is continuously done in the background
as long as the high speed crystal oscillator is
running.
Table 14: Low Power RC Oscillator Parameters
fRef = fXOSC for CC2510Fx and fRef = fXOSC /2 for CC2511Fx
For CC2510Fx Min figures are given using fXOSC = 24 MHz. Typ figures are given using fXOSC = 26 MHz,
and Max figures are given using fXOSC = 27 MHz. For CC2511Fx, fXOSC = 48 MHz
2
SWRS055G
Page 17 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.7
High Speed RC Oscillator
TA = 25°C, VDD = 3.0 V if nothing else is stated.
Parameter
2
Calibrated frequency
Min
Typ
Max
Unit
Condition/Note
12
13
13.5
MHz
Calibrated HS RCOSC frequency is fXOSC / 2
±15
Uncalibrated frequency
accuracy
%
Calibrated frequency
accuracy
±1
%
Start-up time
10
µs
−325
ppm/°C
Frequency drift when temperature changes after
calibration
28
ppm/V
Frequency drift when supply voltage changes after
calibration
Temperature coefficient
Supply voltage
coefficient
Calibration time
65
µs
The HS RCOSC will be calibrated once when the high
speed crystal oscillator is selected as system clock
source (CLKCON.OSC is set to 0), and also when the
system wakes up from PM{1 - 3} if CLKCON.OSC was
set to 0 when entering PM{1 - 3}. See 12.1.5.1 for
details).
Table 15: High Speed RC Oscillator Parameters
6.8
Frequency Synthesizer Characteristics
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Typ
Max
Unit
Programmed frequency
resolution 3
366
397
412
Hz
366
366
366
Condition/Note
CC2510Fx
CC2511Fx
Frequency resolution = fRef/ 216
Synthesizer frequency
tolerance
±40
ppm
Given by crystal used. Required accuracy (including
temperature and aging) depends on frequency band and
channel bandwidth / spacing.
RF carrier phase noise
−77
dBc/Hz
@ 50 kHz offset from carrier
RF carrier phase noise
−77
dBc/Hz
@ 100 kHz offset from carrier
RF carrier phase noise
−78
dBc/Hz
@ 200 kHz offset from carrier
RF carrier phase noise
−88
dBc/Hz
@ 500 kHz offset from carrier
RF carrier phase noise
−98
dBc/Hz
@ 1 MHz offset from carrier
RF carrier phase noise
−107
dBc/Hz
@ 2 MHz offset from carrier
RF carrier phase noise
−116
dBc/Hz
@ 5 MHz offset from carrier
RF carrier phase noise
−25
dBc/Hz
@ 10 MHz offset from carrier
fRef = fXOSC for CC2510Fx and fRef = fXOSC /2 for CC2511Fx
For CC2510Fx Min figures are given using fXOSC = 24 MHz. Typ figures are given using fXOSC = 26 MHz,
and Max figures are given using fXOSC = 27 MHz. For CC2511Fx, fXOSC = 48 MHz
3
SWRS055G
Page 18 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Parameter
Min
Typ
Max
Unit
PLL turn-on / hop time 4
72.4
75.2
81.4
µs
81.4
81.4
81.4
Condition/Note
CC2510Fx
CC2511Fx
Time from leaving the IDLE state until arriving in the RX,
FSTXON, or TX state, when not performing calibration.
Crystal oscillator running.
RX to TX switch 4
29.0
30.1
32.6
32.6
32.6
32.6
CC2510Fx
µs
CC2511Fx
Settling time for the 1∙IF frequency step from RX to TX
TX to RX switch 4
30.0
31.1
33.6
33.6
33.6
33.6
CC2510Fx
µs
CC2511Fx
Settling time for the 1∙IF frequency step from TX to RX
4
PLL calibration time
707
735
796
796
796
796
CC2510Fx
µs
CC2511Fx
Calibration can be initiated manually or automatically
before entering or after leaving RX/TX.
Note: This is the PLL calibration time given that
TEST0=0x0B and FSCAL3.CHP_CURR_CAL_EN=10
(max calibration time). Please see DN110 [11] for more
details
Table 16: Frequency Synthesizer Parameters
6.9
Analog Temperature Sensor
TA= 25°C, VDD = 3.0V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Typ
Max
Unit
Output voltage at −40°C
0.654
V
Output voltage at 0°C
0.750
V
Output voltage at 40°C
0.848
V
Output voltage at 80°C
0.946
V
Temperature coefficient
Error in calculated
temperature, calibrated
2.43
−2
*
0
mV/°C
2
*
°C
Condition/Note
Fitted from −20°C to 80°C
From −20°C to 80°C when using 2.43 mV/°C, after 1-point
calibration at room temperature
*
The indicated minimum and maximum error with 1-point
calibration is based on measured values for typical
process parameters
Current consumption
increase when enabled
0.3
mA
Table 17: Analog Temperature Sensor Parameters
fRef = fXOSC for CC2510Fx and fRef = f fXOSC xosc/2 for CC2511Fx
For CC2510Fx Min figures are given using fXOSC = 27 MHz. Typ figures are given using fXOSC = 26 MHz,
and Max figures are given using fXOSC = 24 MHz. For CC2511Fx, fXOSC = 48 MHz The system clock
frequency is equal to fRef and the data rate is 250 kBaud. See DN110 [11] for more details.
4
SWRS055G
Page 19 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.10 7 - 12 bit ADC
TA = 25°C, VDD = 3.0V if nothing else stated. The numbers given here are based on tests performed
in accordance with IEEE Std 1241-2000 [7]. The ADC data are from CC2430 characterization. As the
CC2510x/C2511Fx uses the same ADC, the numbers listed in Table 18 should be good indicators of the
performance to be expected from CC2510x and CC2511x. Note that these numbers will apply for 24 MHz
operated systems (like CC2510x using a 24 MHz crystal or CC2511x using a 48 MHz crystal).
Performance will be slightly different for other crystal frequencies (e.g. 26 MHz and 27 MHz).
Parameter
Min
Typ
Max
Unit
Condition/Note
Input voltage
0
VDD
V
VDD is the voltage on the AVDD pin (2.0 - 3.6 V)
External reference
voltage
0
VDD
V
VDD is the voltage on the AVDD pin (2.0 - 3.6 V)
External reference
voltage differential
0
VDD
V
VDD is the voltage on the AVDD pin (2.0 - 3.6 V)
Input resistance, signal
Full-Scale Signal
ENOB
5
5
Single ended input
197
kΩ
2.97
V
5.7
bits
7.5
Simulated using 4 MHz clock speed (see Section 12.10.2.7)
Peak-to-peak, defines 0 dBFS
7-bits setting
9-bits setting
9.3
10-bits setting
10.8
12-bits setting
ENOB5
6.5
Differential input
8.3
9-bits setting
10.0
10-bits setting
11.5
12-bits setting
Useful Power Bandwidth
bits
7-bits setting
0 - 20
kHz
7-bits setting, both single and differential
-Single ended input
−75.2
dB
12-bits setting, −6 dBFS
-Differential input
−86.6
5
THD
12-bits setting, −6 dBFS
Signal To Non-Harmonic
Ratio5
-Single ended input
70.2
-Differential input
79.3
dB
12-bits setting
12-bits setting
Spurious Free Dynamic
Range5
78.8
-Differential input
88.9
CMRR, differential input
<−84
dB
12- bit setting, 1 kHz Sine (0 dBFS), limited by ADC resolution
Crosstalk, single ended
input
<−84
dB
12- bit setting, 1 kHz Sine (0 dBFS), limited by ADC resolution
−3
mV
Mid. Scale
Gain error
0.68
%
5
0.05
LSB
Offset
DNL
dB
12-bits setting, −6 dBFS
0.9
5
INL
4.6
13.3
5
12-bits setting, −6 dBFS
-Single ended input
12-bits setting, mean
12-bits setting, max
LSB
12-bits setting, mean
12-bits setting, max
Measured with 300 Hz Sine input and VDD as reference
SWRS055G
Page 20 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Parameter
Min
Typ
Max
Unit
Condition/Note
SINAD5
35.4
Single ended input
46.8
9-bits setting
(−THD+N)
57.5
10-bits setting
66.6
12-bits setting
5
dB
SINAD
40.7
Differential input
51.6
9-bits setting
(−THD+N)
61.8
10-bits setting
70.8
12-bits setting
Conversion time
Current consumption
20
dB
7-bits setting
µs
7-bits setting
7-bits setting
36
9-bits setting
68
10-bits setting
132
12-bits setting
1.2
mA
Table 18: 7 - 12 bit ADC Characteristics
SWRS055G
Page 21 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.11 Control AC Characteristics
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Typ
Max
Unit
Condition/Note
CC2510Fx
System clock,
fSYSCLK
tSYSCLK= 1/ fSYSCLK
0.1875
26
27
MHz
High speed crystal oscillator used as source (HS XOSC)
0.1875
13
13.5
MHz
Calibrated HS RCOSC used as source.
HS
XOSC
HS
RCOSC
Min: fXOSC = 24 MHz, CLKCON.CLKSPD =
111
111
Typ: fXOSC = 26 MHz, CLKCON.CLKSPD =
000
001
Max: fXOSC = 27 MHz, CLKCON.CLKSPD =
000
001
HS
XOSC
HS
RCOSC
Min: fXOSC = 48 MHz, CLKCON.CLKSPD =
111
111
Typ: fXOSC = 48 MHz, CLKCON.CLKSPD =
000
001
Max: fXOSC = 48 MHz, CLKCON.CLKSPD =
000
001
CC2511Fx
RESET_N low
width
0.1875
24
24
MHz
High speed crystal oscillator used as source.
0.1875
12
12
MHz
HS RCOSC used as source.
250
ns
See item 1, Figure 4. This is the shortest pulse that is
guaranteed to be recognized as a reset pin request.
Note: Shorter pulses may be recognized but will not lead to
complete reset of all modules within the chip.
Interrupt pulse
width
tSYSCLK
See item 2, Figure 4. This is the shortest pulse that is
guaranteed to be recognized as an interrupt request. In PM2/3
the internal synchronizers are bypassed so this requirement
does not apply in PM2/3.
Table 19: Control Inputs AC Characteristics
1
RESET_N
Px_n
2
2
Px_n
Figure 4: Control Inputs AC Characteristics
SWRS055G
Page 22 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
6.11.1
Filtering of RESET_N pin
The RESET_N pin is sensitive to noise and can cause unintended reset of the chip. For a long reset
line add an external RC filter with values 1 nF and 2.7 kΩ close to the RESET_N pin. When doing
this, note that the RESET_N low width (the shortest pulse that is guaranteed to be recognized as a
reset pin request) is longer than stated in Table 19.
6.12 SPI AC Characteristics
TA = 25°C, VDD = 3.0V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
SCK period
Typ
Max
Unit
Condition/Note
See Section 12.14.3
ns
Master. See item 1, Figure 5
50
%
Master.
SCK duty cycle
SSN low to SCK
2∙tSYSCLK
SCK to SSN high
30
ns
See item 6, Figure 5
MISO setup
10
ns
Master. See item 2, Figure 5
MISO hold
10
ns
Master. See item 3, Figure 5
ns
Master. See item 4, Figure 5, load = 10 pF
ns
Slave. See item 1, Figure 5
%
Slave.
See item 5, Figure 5
SCK to MOSI
25
SCK period
100
SCK duty cycle
50
MOSI setup
10
ns
Slave. See item 2, Figure 5
MOSI hold
10
ns
Slave. See item 3, Figure 5
ns
Slave. See item 4, Figure 5, load = 10 pF
SCK to MISO
25
Table 20: SPI AC Characteristics
1
SCK
3
2
MISO/MOSI
4
MOSI/MISO
5
6
SSN
Figure 5: SPI AC Characteristics
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CC2510Fx / CC2511Fx
6.13 Debug Interface AC Characteristics
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Debug clock period
125
Typ
Max
Unit
ns
Condition/Note
See item 1, Figure 6
Note: CLKCON.CLKSPD must be 000 or 001 when using the
debug interface
Debug data setup
5
ns
See item 2, Figure 6
Debug data hold
5
ns
See item 3, Figure 6
ns
See item 4, Figure 6, load = 10 pF
ns
See item 5, Figure 6
Clock to data delay
10
RESET_N inactive
after P2_2 rising
10
Table 21: Debug Interface AC Characteristics
1
DEBUG CLK
P2_2
3
2
DEBUG DATA
P2_1
4
DEBUG DATA
P2_1
5
RESET_N
Figure 6: Debug Interface AC Characteristics
6.14 Port Outputs AC Characteristics
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Typ
Max
Unit
Condition/Note
P0_[0:7], P1_[2:7],
P2_[0:4] Port output
rise time
(IOCFG1.GDO_DS=0 /
IOCFG1.GDO_DS=1)
3.15 / 1.34
ns
Load = 10 pF
Timing is with respect to 10% VDD and 90% VDD levels.
Values are estimated
P0_[0:7], P1_[2:7],
P2_[0:4] Port output
fall time
(IOCFG1.GDO_DS=0 /
IOCFG1.GDO_DS=1)
3.2 / 1.44
ns
Load = 10 pF
Timing is with respect to 90% VDD and 10% VDD.
Values are estimated
Table 22: Port Outputs AC Characteristics
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CC2510Fx / CC2511Fx
6.15 Timer Inputs AC Characteristics
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Parameter
Min
Input capture pulse width
Typ
Max
Unit
tSYSCLK
Condition/Note
Synchronizers determine the shortest input pulse
that can be recognized. The synchronizers operate
from the current system clock rate (see Table 19)
Table 23: Timer Inputs AC Characteristics
6.16 DC Characteristics
The DC Characteristics of CC2510Fx/CC2511Fx are listed in Table 24 below.
TA = 25°C, VDD = 3.0 V if nothing else stated. All measurement results are obtained using the
CC2510EM reference designs ([1]).
Digital Inputs/Outputs
Min
Typ
Logic "0" input voltage
Logic "1" input voltage
70
Logic "0" input current per pin
NA
Logic "1" input current per pin
NA
Max
Unit
30
%
Of VDD supply (2.0 - 3.6 V)
%
Of VDD supply (2.0 - 3.6 V)
12
nA
Input equals 0 V
Input equals VDD
12
nA
Total logic “0” input current all pins
70
nA
Total logic “1” input current all pins
70
nA
I/O pin pull-up and pull-down resistor
20
Condition
kΩ
Table 24: DC Characteristics
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
7
Pin and I/O Port Configuration
GUARD
AVDD_DREG
DCOUPL
P1_7
RESET_N
P1_6
P1_5
P1_4
P1_3
The CC2510Fx pin-out is shown in Figure 7 and Table 25. See Section 12.4 for details on the I/O
configuration.
36 35 34 33 32 31 30 29 28
P1_2 1
27 RBIAS
DVDD 2
26 AVDD
P1_1 3
25 AVDD
P1_0 4
24 RF_N
P0_0 5
P0_1 6
23 RF_P
22 AVDD
P0_2 7
21 XOSC_Q1
P0_3 8
20 XOSC_Q2
P0_4 9
19 AVDD
10 11 12 13 14 15 16 17 18
P2_4/XOSC32_Q2
P2_3/XSOC32_Q1
P2_2
P2_1
P2_0
P0_7
P0_6
P0_5
DVDD
AGND
Exposed die
attached pad
Figure 7: CC2510Fx Pinout Top View
Note: The exposed die attach pad must be connected to a solid ground plane as this is the ground
connection for the chip.
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CC2510Fx / CC2511Fx
Pin
Pin Name
Pin Type
Description
-
AGND
Ground
The exposed die attach pad must be connected to a solid ground plane
1
P1_2
D I/O
Port 1.2
2
DVDD
Power (Digital)
2.0 V - 3.6 V digital power supply for digital I/O
3
P1_1
D I/O
Port 1.1
4
P1_0
D I/O
Port 1.0
5
P0_0
D I/O
Port 0.0
6
P0_1
D I/O
Port 0.1
7
P0_2
D I/O
Port 0.2
8
P0_3
D I/O
Port 0.3
9
P0_4
D I/O
Port 0.4
10
DVDD
Power (Digital)
2.0 V - 3.6 V digital power supply for digital I/O
11
P0_5
D I/O
Port 0.5
12
P0_6
D I/O
Port 0.6
13
P0_7
D I/O
Port 0.7
14
P2_0
D I/O
Port 2.0
15
P2_1
D I/O
Port 2.1
16
P2_2
D I/O
Port 2.2
17
P2_3/XOSC32_Q1
D I/O
Port 2.3/32.768 kHz crystal oscillator pin 1
18
P2_4/XOSC32_Q2
D I/O
Port 2.4/32.768 kHz crystal oscillator pin 2
19
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
20
XOSC_Q2
Analog I/O
Crystal oscillator pin 2
21
XOSC_Q1
Analog I/O
Crystal oscillator pin 1, or external clock input
22
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
23
RF_P
RF I/O
Positive RF input signal to LNA in receive mode
Positive RF output signal from PA in transmit mode
24
RF_N
RF I/O
Negative RF input signal to LNA in receive mode
Negative RF output signal from PA in transmit mode
25
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
26
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
27
RBIAS
Analog I/O
External precision bias resistor for reference current
28
GUARD
Power (Digital)
Power supply connection for digital noise isolation
29
AVDD_DREG
Power (Digital)
2.0 V - 3.6 V digital power supply for digital core voltage regulator
30
DCOUPL
Power
decoupling
1.8 V digital power supply decoupling
31
RESET_N
DI
Reset, active low
32
P1_7
D I/O
Port 1.7
33
P1_6
D I/O
Port 1.6
34
P1_5
D I/O
Port 1.5
35
P1_4
D I/O
Port 1.4
36
P1_3
D I/O
Port 1.3
Table 25: CC2510Fx Pin-out Overview
SWRS055G
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
GUARD
AVDD_DREG
DCOUPL
P1_7
RESET_N
P1_6
P1_5
P1_4
P1_3
The CC2511Fx pin-out is shown in Figure 8 and Table 26. See Section 12.4 for details on the I/O
configuration.
36 35 34 33 32 31 30 29 28
P1_2 1
27 R_BIAS
DVDD 2
26 AVDD
P1_1 3
25 AVDD
P1_0 4
24 RF_N
P0_0 5
P0_1 6
23 RF_P
22 AVDD
P0_2 7
21 XOSC_Q1
P0_3 8
20 XOSC_Q2
P0_4 9
19 AVDD
10 11 12 13 14 15 16 17 18
P2_4/XOSC32_Q2
P2_3/XSOC32_Q1
P2_2
P2_1
P2_0
P0_5
DVDD
DM
DP
AGND
Exposed die
attached pad
Figure 8: CC2511Fx Pin-out Top View
Note: The exposed die attach pad must be connected to a solid ground plane as this is the ground
connection for the chip.
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Pin
Pin Name
Pin Type
Description
-
AGND
Ground
The exposed die attach pad must be connected to a solid ground plane
1
P1_2
D I/O
Port 1.2
2
DVDD
Power (Digital)
2.0 V - 3.6 V digital power supply for digital I/O
3
P1_1
D I/O
Port 1.1
4
P1_0
D I/O
Port 1.0
5
P0_0
D I/O
Port 0.0
6
P0_1
D I/O
Port 0.1
7
P0_2
D I/O
Port 0.2
8
P0_3
D I/O
Port 0.3
9
P0_4
D I/O
Port 0.4
10
DP
USB I/O
USB Differential Data Bus Plus
11
DM
USB I/O
USB Differential Data Bus Minus
12
DVDD
Power (Digital)
2.0 V - 3.6 V digital power supply for digital I/O
13
P0_5
D I/O
Port 0.5
14
P2_0
D I/O
Port 2.0
15
P2_1
D I/O
Port 2.1
16
P2_2
D I/O
Port 2.2
17
P2_3/XOSC32_Q1
D I/O
Port 2.3/32.768 kHz crystal oscillator pin 1
18
P2_4/XOSC32_Q2
D I/O
Port 2.4/32.768 kHz crystal oscillator pin 2
19
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
20
XOSC_Q2
Analog I/O
Crystal oscillator pin 2
21
XOSC_Q1
Analog I/O
Crystal oscillator pin 1, or external clock input
22
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
23
RF_P
RF I/O
Positive RF input signal to LNA in receive mode
Positive RF output signal from PA in transmit mode
24
RF_N
RF I/O
Negative RF input signal to LNA in receive mode
Negative RF output signal from PA in transmit mode
25
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
26
AVDD
Power (Analog)
2.0 V - 3.6 V analog power supply connection
27
RBIAS
Analog I/O
External precision bias resistor for reference current
28
GUARD
Power (Digital)
Power supply connection for digital noise isolation
29
AVDD_DREG
Power (Digital)
2.0 V - 3.6 V digital power supply for digital core voltage regulator
30
DCOUPL
Power
decoupling
1.8 V digital power supply decoupling
31
RESET_N
DI
Reset, active low
32
P1_7
D I/O
Port 1.7
33
P1_6
D I/O
Port 1.6
34
P1_5
D I/O
Port 1.5
35
P1_4
D I/O
Port 1.4
36
P1_3
D I/O
Port 1.3
Table 26: CC2511Fx Pin-out Overview
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CC2510Fx / CC2511Fx
8
Circuit Description
Figure 9: C C2510Fx/CC2511Fx Block Diagram
A block diagram of CC2510Fx/CC2511Fx is shown
in Figure 9. The modules can be divided into
one out of three categories: CPU-related
modules, radio-related modules, and modules
related to power, test, and clock distribution. In
the following subsections, a short description
of each module that appears in Figure 9.
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CC2510Fx / CC2511Fx
8.1
CPU and Peripherals
The 8051 CPU core is a single-cycle 8051compatible core. It has three different memory
access
buses
(SFR,
DATA
and
CODE/XDATA), a debug interface, and an
extended interrupt unit servicing 18 interrupt
sources. See Section 10 for details on the
CPU.
all hardware peripherals, except USB, to the
memory arbitrator. The SFR bus also provides
2
access to the radio registers and I S registers
in the radio register bank even though these
are indeed mapped into XDATA memory
space.
The 1/2/4 KB SRAM maps to the DATA
memory space and part of the XDATA and
CODE memory spaces. The memory is an
ultra-low-power SRAM that retains its contents
even when the digital part is powered off (PM2
and PM3).
The memory crossbar/arbitrator is at the
heart of the system as it connects the CPU
and DMA controller with the physical
memories and all peripherals through the SFR
bus. The memory arbitrator has four memory
access points, access at which can map to
one of three physical memories on the
CC2510Fx and one of four physical memories
on the CC2511Fx: a 1/2/4 KB SRAM, 8/16/32 KB
2
flash memory, RF/I S registers, and USB
registers (CC2511Fx). The memory arbitrator is
responsible for performing arbitration and
sequencing between simultaneous memory
accesses to the same physical memory.
The 8/16/32 KB flash block provides in-circuit
programmable non-volatile program memory
for the device and maps into the CODE and
XDATA memory spaces. Table 27 shows the
available devices in the CC2510/CC2511
family. The available devices differ only in
flash memory size. Writing to the flash block is
performed through a Flash Controller that
allows page-wise (1024 byte) erasure and 2byte-wise reprogramming. See Section 12.3
for details.
The SFR bus is drawn conceptually in the
block diagram as a common bus that connects
Device
Flash [KB]
CC2510F8
8
CC2511F8
8
CC2510F16
16
CC2511F16
16
CC2510F32
32
CC2511F32
32
Table 27: CC2510/CC2511 Flash Memory Options
A versatile five-channel DMA controller is
available in the system. It accesses memory
using a unified memory space and has
therefore access to all physical memories.
Each channel is configured (trigger event,
priority, transfer mode, addressing mode,
source and destination pointers, and transfer
count) with DMA descriptors anywhere in
memory. Many of the hardware peripherals
rely on the DMA controller for efficient
operation (AES core, Flash Controller,
USARTs, Timers, and ADC interface) by
performing data transfers between a single
SFR address and flash/SRAM. See Section
12.5 for details.
The interrupt controller services 18 interrupt
sources, divided into six interrupt groups, each
of which is associated with one out of four
interrupt priorities. An interrupt request is
serviced even if the device is in PM1, PM2, or
PM3 by bringing the CC2510Fx/CC2511Fx back to
active mode.
The debug interface implements a proprietary
two-wire serial interface that is used for incircuit debugging. Through this debug
interface it is possible to perform an erasure of
the entire flash memory, control which
oscillators are enabled, stop and start
execution of the user program, execute
supplied instructions on the 8051 core, set
code breakpoints, and single step through
instructions in the code. Using these
techniques it is possible to perform in-circuit
debugging and external flash programming.
See Section 10 for details.
The I/O-controller is responsible for all
general-purpose I/O pins. The CPU can
configure whether peripheral modules control
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CC2510Fx / CC2511Fx
certain pins or if they are under software
control. In the latter case, each pin can be
configured as an input or output and it is also
possible to configure the input mode to be pullup, pull-down, or tristate. Each peripheral that
connects to the I/O-pins can choose between
two different I/O pin locations to ensure
flexibility in various applications. See Section
12.4 for details.
The Sleep Timer is an ultra-low power timer
which uses a 32.768 kHz crystal oscillator or a
low power RC oscillator as clock source. The
Sleep Timer runs continuously in all operating
modes except active mode and PM3 and is
typically used to get out of PM0, PM1, or PM2.
See Section 12.8 for details.
A
built-in
watchdog
timer
allows
the
CC2510Fx/CC2511Fx to reset itself in case the
firmware hangs. When enabled, the watchdog
timer must be cleared periodically, otherwise it
will reset the device when it times out. See
Section 12.13 for details.
Timer 1 is a 16-bit timer which supports typical
timer/counter functions such as input capture,
output compare, and PWM functions. The
timer has a programmable prescaler, a 16-bit
period value, and three independent
capture/compare channels. Each of the
channels can be used as PWM outputs or to
capture the timing of edges on input signals. A
second order Delta-Sigma noise shaper mode
is also supported for audio applications. See
Section 12.6 for details.
Timer 2 (MAC timer) is specially designed to
support time-slotted protocols in software. The
timer has a configurable timer period and a
programmable prescaler range. See Section
12.7 for details.
Timers 3 and Timer 4 are two 8-bit timers
which supports typical timer/counter functions
such as output compare and PWM functions.
They have a programmable prescaler, an 8-bit
period value, and two compare channels each,
which can be used as PWM outputs. See
Section 12.9 for details.
USART 0 and USART 1 are each
configurable as either an SPI master/slave or
a UART. They provide hardware flow-control
and double buffering on both RX and TX and
are thus well suited for high-throughput, fullduplex applications. Each has its own highprecision baud-rate generator, hence leaving
the ordinary timers free for other uses. When
configured as an SPI slave they sample the
input signal using SCK directly instead of
using some over-sampling scheme and are
therefore well-suited for high data rates. See
Section 12.14 for details.
The AES encryption/decryption core allows
the user to encrypt and decrypt data using the
AES algorithm with 128-bit keys. See Section
12.12 for details.
The ADC supports 7 to 12 bits of resolution in
a 30 kHz to 4 kHz bandwidth respectively. DC
and audio conversions with up to eight input
channels (P0) are possible (CC2511Fx is limited
to six channels). The inputs can be selected
as single ended or differential. The reference
voltage can be internal, VDD, or a single
ended or differential external signal. The ADC
also has a temperature sensor input channel.
The ADC can automate the process of
periodic sampling or conversion over a
sequence of channels. See Section 12.10 for
details.
The USB allows the CC2511Fx to implement a
Full-Speed USB 2.0 compatible device. The
USB has a dedicated 1 KB SRAM that is used
for the endpoint FIFOs. 5 endpoints are
available in addition to control endpoint 0.
Each of these endpoints must be configured
as Bulk/Interrupt or Isochronous and can be
used as IN, OUT or IN/OUT. Double buffering
of packets is also supported for endpoints 1 5. The maximum FIFO memory available for
each endpoint is as follows: 32 bytes for
endpoint 0, 32 bytes for endpoint 1, 64 bytes
for endpoint 2, 128 bytes for endpoint 3, 256
bytes for endpoint 4, and 512 bytes for
endpoint 5. When an endpoint is used as
IN/OUT, the FIFO memory available for the
endpoint can be distributed between IN and
OUT depending on the demands of the
application. The USB does not exist on the
CC2510Fx. See Section 12.16 for details.
2
The I S can be used to send/receive audio
samples to/from an external sound processor
or DAC and may operate at full or half duplex.
Samples of up to 16-bits resolution can be
2
used although the I S can be configured to
send more low order bits if necessary to be
compliant with the resolution of the receiver
(up to 32 bit). The maximum bit-rate supported
2
is 3.5 Mbps. The I S can be configured as a
master or slave device and supports both
mono and stereo. Automatic µ-Law expansion
and compression can also be configured. See
Section 12.15 for details.
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CC2510Fx / CC2511Fx
8.2
Radio
CC2510Fx/CC2511Fx features an RF transceiver
based on the industry-leading CC2500,
9
Application Circuit
Only a few external components are required
for using the CC2510Fx/CC2511Fx. The
recommended application circuit for CC2510Fx
is shown in Figure 10. The recommended
application circuits for CC2511Fx are shown in
Figure 11 and Figure 12. The first of the
9.1
requiring very few external components. See
Section 13 for details.
recommended CC2511Fx circuit uses a
rd
fundamental crystal and the second uses a 3
overtone crystal. The external components are
described in Table 28, and typical values are
given in Table 29.
Bias Resistor
The bias resistor R271 is used to set an
accurate bias current.
9.2
Balun and RF Matching
The
balanced
RF
input
and
output
of
CC2510Fx/CC2511Fx share two common pins and
are designed for a simple, low-cost matching
and balun network on the printed circuit board.
The RX- and TX switching at the
CC2510Fx/CC2511Fx front-end are controlled by a
dedicated on-chip function, eliminating the
need for an external RX/TX-switch.
A few passive external components combined
with the internal RX/TX switch/termination
circuitry ensures match in both RX and TX
mode.
Although CC2510Fx/CC2511Fx has a balanced
RF input/output, the chip can be connected to
a single-ended antenna with few external low
cost capacitors and inductors.
The
passive
matching/filtering
network
connected to CC2510Fx/CC2511Fx should have
the following differential impedance as seen
from the RF-port (RF_P and RF_N) towards
the antenna:
Zout = 80 + j74 Ω
9.3
C232, C242, and two inductive transmission
PCB lines form the recommended balun that
converts the differential RF port on CC2510Fx to
a single-ended RF signal. For the CC2511Fx
balun, the inductive PCB lines are replaced by
L241 and L231. Note that either of the
solutions (PCB lines or discrete components)
can be used for both the chips. C241 and
C231 are needed for DC blocking. Together
with an appropriate LC filter network, the balun
components also transform the impedance to
match a 50 Ω antenna (or cable). Component
values for the RF balun and LC network are
found in the latest CC2510EM and
CC2511Dongle reference designs ([1] and [2]).
Suggested values are also listed in Table 29.
The balun and LC filter component values,
their placement and layout are important in
order to keep the performance of the
CC2510Fx/CC2511Fx optimized. It is highly
recommended to follow the CC2510EM /
CC2511Dongle reference designs. Gerber
files and schematics for the reference designs
are available for download from the TI website
Crystal
The crystal oscillator for the CC2510Fx uses an
external crystal X1, with two loading capacitors
(C201 and C211) (see Figure 10 and Table
28).
The CC2511Fx should use a 48 MHz
rd
fundamental (X3) or a 48 MHz 3 overtone low
cost external crystal (X4). Depending on the
option selected, different loading capacitors
(C203 and C214 or C202, C212, and C213)
must be used. When X4 is used, an inductor
(L281) must also be connected in series with
C212 (see Figure 11, Figure 12 and Table 28).
Note: The high speed crystal oscillator
must be stable (SLEEP.XOSC_STB=1)
before using the radio.
The recommended application circuits also
show the connections for an optional 32.768
kHz crystal oscillator with external crystal X2
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
and loading capacitors C181 and C171. This
crystal can be used by the Sleep Timer if more
accurate wake-up intervals are needed than
what the internal RC oscillator can provide.
When not using X2, P2_3 and P2_4 may be
used as general IO pins.
The loading capacitor values depend on the
total load capacitance, CL, specified for the
crystal. The total load capacitance seen
between the crystal terminals should equal CL
for the crystal to oscillate at the specified
frequency. For the CC2510Fx using the crystal
X1, the load capacitance CL is given as:
9.4
The parasitic capacitance is constituted by pin
input capacitance and PCB stray capacitance.
Total parasitic capacitance is typically 2.5 pF.
The crystal oscillator is amplitude regulated.
This means that a high current is used to start
up the oscillations. When the amplitude builds
up, the current is reduced to what is necessary
to maintain approximately 0.4 Vpp signal
swing. This ensures a fast start-up, and keeps
the drive level to a minimum. The ESR of the
crystal should be within the specification in
order to ensure a reliable start-up
connected to XOSC_Q1 using a serial
capacitor. When using a full-swing digital
signal this capacitor can be omitted. The
XOSC_Q2 line must be left un-connected. The
crystal loading capacitors and crystal inductor
(if using X4) can be omitted when using a
reference signal.
USB (CC2511Fx)
For the CC2511Fx, the DP and DM pins need
series resistors R262 and R263 for impedance
matching and the D+ line must have a pull-up
resistor, R264. The series resistors should
match the 90 Ω ±15% characteristic
impedance of the USB bus.
Notice that the pull-up resistor must be tied to
a voltage source between 3.0 and 3.6 V
(typically 3.3 V). The voltage source must be
9.6
1
+ C Parasitic
1
1
+
C 211 C 201
Reference Signal
The chip can alternatively be operated with a
reference signal from 24 to 27 MHz (CC2510Fx)
or 48 MHz (CC2511Fx) instead of a crystal. This
input clock can either be a full-swing digital
signal (0 V to VDD) or a sine wave of
maximum 1 V peak-peak amplitude. The
reference signal must be connected to the
XOSC_Q1 input. The sine wave must be
9.5
CL =
derived from or controlled by the VBUS power
supply provided by the USB cable. In this way,
the pull-up resistor does not provide current to
the D+ line when VBUS is removed. The pull-up
resistor may be connected directly between
VBUS and the D+ line. As an alternative, if the
CC2511Fx firmware needs the ability to
disconnect from the USB bus, an I/O pin on
the CC2511Fx can be used to control the pull-up
resistor.
Power Supply Decoupling
The power supply must be properly decoupled
close to the supply pins. Note that decoupling
capacitors are not shown in the application
circuit. The placement and the size of the
decoupling capacitors are very important to
achieve the optimum performance. TI provides
reference designs that should be followed
closely ([1] and [2]).
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Page 34 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
2.0V-3.6V power supply
RBIAS 27
AVDD_DREG 29
GUARD 28
R271
AVDD 26
AVDD 25
CC2510
RF_N 24
2,10 DVDD
RF_P 23
DIE ATTACH PAD:
21 XOSC_Q1
20 XOSC_Q2
17 XOSC32_Q1
18 XOSC32_Q2
AVDD 22
19 AVDD
30 DCOUPL
C301
Antenna
(50 Ohm)
PCB
inductor
C242
C241
PCB
inductor
C231
PCB
inductor
C232
C233
C234
Alternative:
Folded dipole PCB
antenna
Optional:
X2
C181
X1
C211
C201
C171
Figure 10: Application Circuit for CC2510Fx (excluding supply decoupling capacitors)
10 DP
11 DM
RBIAS 27
30 DCOUPL
17 XOSC32_Q1
C301
RF_N 24
RF_P 23
DIE ATTACH PAD:
18 XOSC32_Q2
R263
CC2511
20 XOSC_Q2
D-
L241
AVDD 25
AVDD 22
21 XOSC_Q1
2,12 DVDD
R262
D+
Antenna
(50 Ohm)
AVDD 26
19 AVDD
R264
R271
GUARD 28
4 P1_0
AVDD_DREG 29
3.0V-3.6V power supply
C242
C241
C231
L231
C232
L232
C233
C234
Alternative:
Folded dipole PCB
antenna
Optional:
C181
X3
X2
C171
C214
C203
Figure 11: Application Circuit for CC2511Fx with Fundamental Crystal (excluding supply decoupling
capacitors)
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
10 DP
D-
11 DM
RBIAS 27
CC2511
30 DCOUPL
20 XOSC_Q2
17 XOSC32_Q1
C301
C181
C231
RF_P 23
L231
C232
AVDD 22
Optional:
C242
C241
RF_N 24
DIE ATTACH PAD:
18 XOSC32_Q2
R263
L241
AVDD 25
21 XOSC_Q1
2,12 DVDD
R262
D+
Antenna
(50 Ohm)
AVDD 26
19 AVDD
R264
R271
GUARD 28
4 P1_0
AVDD_DREG 29
3.0V-3.6V power supply
L232
C233
C234
Alternative:
Folded dipole PCB
antenna
L281
X4
X2
C171
C213
C202
C212
Figure 12: Application Circuit for CC2511Fx with 3 Overtone Crystal (excluding supply decoupling
capacitors)
rd
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Page 36 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Component
Description
C301
Decoupling capacitor for on-chip voltage regulator to digital part
C203/C214
Crystal loading capacitors (X3)
C202/C212/C213
Crystal loading capacitors (X4)
C201/C211
Crystal loading capacitors (X1)
C231/C241
RF balun DC blocking capacitors
C232/C242
RF balun/matching capacitors
C233/C234
RF LC filter/matching capacitors
C181/C171
Crystal loading capacitors if X2 is used.
L231/L241
RF balun/matching inductors (inexpensive multi-layer type)
L232
RF LC filter inductor (inexpensive multi-layer type)
L281
Crystal inductor
R271
Resistor for internal bias current reference
R264
D+ Pull-up resistor
R262/R263
D+ / D− series resistors for impedance matching
X1
24 - 27 MHz crystal
X2
32.768 kHz crystal, optional
X3
48 MHz crystal (fundamental)
X4
48 MHz crystal (3rd overtone)
Table 28: Overview of External Components (excluding supply decoupling capacitors)
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Page 37 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Component
Value
Manufacturer
C301
1 µF ± 10%, 0402 X5R
Murata GRM1555C series
C203/C214
33 pF ± 5%, 0402 NP0
Murata GRM1555C series
C202
56 pF
C212
10 nF
C213
33 pF
C201/C211
27 pF ± 5%, 0402 NP0
Murata GRM1555C series
C231, C241
100 pF ± 5%, 0402 NP0
Murata GRM1555C series
C171, C181
15 pF ± 5%, 0402 NP0
Murata GRM1555C series
C232, C242
1.0 pF ± 0.25 pF, 0402 NP0
Murata GRM1555C series
C233
1.8 pF ± 0.25 pF, 0402 NP0
Murata GRM1555C series
C234
1.5 pF ± 0.25 pF, 0402 NP0
Murata GRM1555C series
L231, L232, L241
1.2 nH ± 0.3 nH, 0402 monolithic
Murata LQG-15 series
L281
470 nH ± 10%
Murata LQM18NNR47K00
R271
56 kΩ ± 1%, 0402
Koa RK73 series
R264
1.5 kΩ ± 1%
Koa RK73 series
R262/R263
33 Ω ± 2%
Koa RK73 series
X1
26.0 MHz surface mount crystal
NDK, AT-41CD2
X2
32.768 kHz surface mount crystal (optional)
Epson MC-306 Crystal Unit
X3
48.0 MHz surface mount crystal (fundamental)
Abracon ABM8 series
X4
rd
48.0 MHz surface mount crystal (3 overtone)
Table 29: Bill Of Materials for the CC2510Fx/CC2511Fx Application Circuits (subject to changes)
9.7
PCB Layout Recommendations
The top layer should be used for signal routing,
and the open areas should be filled with
metallization connected to ground using
several vias.
The area under the chip is used for grounding
and shall be connected to the bottom ground
plane with several vias for good thermal
performance and sufficiently low inductance to
ground. In the CC2510EM reference designs
[1] 9 vias are placed inside the exposed die
attached pad. These vias should be “tented”
(covered with solder mask) on the component
side of the PCB to avoid migration of solder
through the vias during the solder reflow
process.
The solder paste coverage should not be
100%. If it is, out gassing may occur during the
reflow process, which may cause defects
(splattering, solder balling). Using “tented” vias
reduces the solder paste coverage below
100%.
See Figure 13 for top solder resist and top
paste masks recommendations.
Each decoupling capacitor should be placed
as close as possible to the supply pin it is
supposed to decouple. The best routing is from
the power line to the decoupling capacitor and
then to the CC2510Fx supply pin. Supply power
filtering is very important.
Each decoupling capacitor ground pad should
be connected to the ground plane using a
separate via. Direct connections between
neighboring power pins will increase noise
coupling and should be avoided unless
absolutely necessary.
The external components should ideally be as
small as possible (0402 is recommended) and
surface
mount
devices
are
highly
recommended. Please note that components
smaller than those specified may have differing
characteristics.
Schematic, BOM, and layout Gerber files are
all available from the TI website for both the
CC2510EM reference design [1] and the
CC2511 USB Dongle reference design [2].
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Figure 13: Left: Top Solder Resist Mask (negative). Right: Top Paste Mask. Circles are Vias.
10
8051 CPU
This section describes the 8051 CPU core,
with interrupts, memory, and instruction set.
10.1 8051 Introduction
The CC2510Fx/CC2511Fx includes an 8-bit CPU
core which is an enhanced version of the
industry standard 8051 core.
The enhanced 8051 core uses the standard
8051 instruction set. Instructions execute
faster than the standard 8051 due to the
following:
• One clock per instruction cycle is used
as opposed to 12 clocks per instruction
cycle in the standard 8051.
• Wasted bus states are eliminated.
Since an instruction cycle is aligned with
memory fetch when possible, most of the
single byte instructions are performed in a
single clock cycle. In addition to the speed
improvement, the enhanced 8051 core also
includes architectural enhancements:
• A second data pointer
• Extended 18-source interrupt unit
The 8051 core is object code compatible with
the industry standard 8051 microcontroller.
That is, object code compiled with an industry
standard 8051 compiler or assembler
executes on the 8051 core and is functionally
equivalent. However, because the 8051 core
uses a different instruction-timing than many
other 8051 variants, existing code with timing
loops may require modification. Also because
the peripheral units such as timers and serial
ports differ from those on other 8051 cores,
code which includes instructions using the
peripheral units SFRs will not work correctly.
10.2 Memory
The 8051 CPU architecture has four different
memory spaces. The 8051 has separate
memory spaces for program memory and data
memory. The 8051 memory spaces are the
following (see Section 10.2.1 and 10.2.2 for
details):
CODE. A 16-bit read-only memory space for
program memory.
DATA. An 8-bit read/write data memory
space, which can be directly or indirectly,
accessed by a single cycle CPU instruction,
thus allowing fast access. The lower 128 bytes
of the DATA memory space can be addressed
either directly or indirectly, the upper 128 bytes
only indirectly.
XDATA. A 16-bit read/write data memory
space, which usually requires 4 - 5 CPU
instruction cycles to access, thus giving slow
access. XDATA assesses is also slower in
hardware than DATA accesses as the CODE
and XDATA memory spaces share a common
bus on the CPU core (instruction pre-fetch
from CODE can not be performed in parallel
with XDATA accesses).
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
SFR. A 7-bit read/write register memory
space, which can be directly accessed by a
single CPU instruction. For SFRs whose
address is divisible by eight, each bit is also
individually addressable.
The four different memory spaces are distinct
in the 8051 architecture, but are partly
overlapping in the CC2510Fx/CC2511Fx to ease
DMA transfers and hardware debugger
operation.
How the different memory spaces are mapped
onto the three physical memories (8/16/32 KB
flash program memory, 1/2/4 KB SRAM, and
2
hardware registers (SFR, radio, I S, and USB
(CC2511Fx)) is described in Section 10.2.1 and
Section 10.2.2.
10.2.1
Both the DATA and the SFR memory space is
mapped to the XDATA and CODE memory
space as shown in Figure 14, Figure 15, and
Figure 16 (the CODE and XDATA memory
spaces are mapped identically), and
CC2510FX/CC2511FX has what can be called a
unified memory space.
Mapping all the memory spaces to XDATA
allows the DMA controller access to all
physical memory and thus allows DMA
transfers between the different 8051 memory
spaces. This also means that any instruction
that read, write, or manipulate an XDATA
variable can be used on the entire unified
memory space, except writing to or changing
data in flash.
Mapping all memory spaces to the CODE
memory space is primarily done to allow
program execution out of the SRAM/XDATA.
Memory Map
This section gives an overview of the memory
map.
0xFF
DATA
Memory Space
0x00
0xFFFF
Fast Access RAM
0xFF00
0xFEFF
Unimplemented
0xF300
0xF2FF
0xF000
0xEFFF
0xFF
0x80
SFR Memory Space
0xE000
0xDFFF
0xDF80
0xDF00
0xDEFF
0xFFFF
Slow Access RAM /
Program Memory in RAM
1 KB SRAM
Unimplemented
Hardware SFR Registers
Hardware Registers
Unimplemented
0xDE40
0xDE3F
USB Register (CC2511F8)
0xDE00
0xDDFF
Hardware Radio Registers /
I2S Registers
USB Registers
(CC2511F8)
Unimplemented
XDATA
Memory Space
0x2000
0x1FFF
0x0000
Non-Volatile Program Memory
8 KB Flash
CC2510F8/CC2511F8 Unified
Memory Space
Physical Memory
0x0000
0xFFFF
CODE
Memory Space
0x0000
8051 Memory Spaces
Figure 14: CC2510F8/CC2511F8 Memory Mapping
SWRS055G
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xFF
DATA
Memory Space
0x00
0xFFFF
Fast Access RAM
0xFF00
0xFEFF
0xF700
0xF6FF
Unimplemented
Slow Access RAM /
Program Memory in RAM
0xF000
0xEFFF
0xFF
0x80
SFR Memory Space
0xE000
0xDFFF
0xDF80
0xDF00
0xDEFF
0xFFFF
2 KB SRAM
Unimplemented
Hardware SFR Registers
Hardware Registers
Unimplemented
0xDE40
0xDE3F
USB Register (CC2511F16)
0xDE00
0xDDFF
Hardware Radio Registers /
I2S Registers
USB Registers
(CC2511F16)
Unimplemented
XDATA
Memory Space
0x4000
0x3FFF
Non-Volatile Program Memory
16 KB Flash
CC2510F16/CC2511F16
Unified Memory Space
Physical Memory
0x0000
0x0000
0xFFFF
CODE
Memory Space
0x0000
8051 Memory Spaces
Figure 15: CC2510F16/CC2511F16 Memory Mapping
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xFF
0xFFFF
DATA
Memory Space
0x00
Fast Access RAM
0xFF00
0xFEFF
4 KB SRAM
Slow Access RAM /
Program Memory in RAM
0xF000
0xEFFF
0xFF
0x80
0xE000
0xDFFF
SFR Memory Space
0xDF80
0xDF00
0xDEFF
0xFFFF
Unimplemented
Hardware SFR Registers
Hardware Registers
Hardware Radio Registers /
I2S Registers
Unimplemented
0xDE40
0xDE3F
USB Registers
(CC2511F32)
USB Register (CC2511F32)
0xDE00
0xDDFF
Unimplemented
0x8000
0x7FFF
XDATA
Memory Space
Non-Volatile Program Memory
32 KB Flash
CC2510F32/CC2511F32
Unified Memory Space
Physical Memory
0x0000
0x0000
0xFFFF
CODE
Memory Space
0x0000
8051 Memory Spaces
Figure 16: CC2510F32/CC2511F32 Memory Mapping
Details about the mapping of all 8051 memory
spaces are given in the next section.
10.2.2
8051 Memory Space
This section describes the details of each
standard 8051 memory space. Any differences
between
the
standard
8051
and
CC2510Fx/CC2511Fx is described.
10.2.2.1
XDATA Memory Space
On a standard 8051 this memory space would
hold any extra RAM available.
consideration that the first address of usable
SRAM start at 0xF000 instead of 0x0000.
The 350 bytes of XDATA in location 0xFDA2 0xFEFF on CC2510F32 and CC2511F32 do not
retain data when power modes PM2 or PM3
are entered. Refer to Section 12.1.2 on Page
74 for a detailed description of power modes.
The 256 bytes from 0xFF00 to 0xFFFF are the
DATA memory space mapped to XDATA.
These bytes are also reached through the
DATA memory space.
In addition the following is mapped into the
XDATA memory space:
The 8, 16, and 32 KB flash program memory is
mapped into the address ranges 0x0000 0x1FFF, 0x0000 - 0x3FFF, and 0x0000 0x7FFF respectively.
The CC2510Fx/CC2511Fx has a total of 1, 2, or 4
KB SRAM, starting at address 0xF000.
Compilers/assemblers
must
take
into
SWRS055G
• Radio registers are mapped
address range 0xDF00 - 0xDF3D.
into
• I S registers are mapped into the
address range 0xDF40 - 0xDF48.
2
Page 42 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
• All SFR except the registers shown in
gray in Table 30 are mapped into
address range 0xDF80 - 0xDFFF.
• The USB registers are mapped into the
address range 0xDE00 - 0xDE3F on the
CC2511Fx, but are not implemented on
the CC2510Fx.
This memory mapping allows the DMA
controller (and the CPU) access to all the
physical memories in a single unified address
space.
Be aware that access to unimplemented areas
in the unified memory space will give an
undefined result.
10.2.2.2
CODE Memory Space
On a standard 8051 this memory space would
hold the program memory, where the MCU
reads the program/instructions.
All memory spaces are mapped into the CODE
memory space and the mapping is identical to
the XDATA memory space, hence the
CC2510Fx/CC2511Fx has what can be referred to
as a unified memory space.
Due to this, the CC2510Fx/CC2511Fx allows
execution of a program stored in SRAM. This
allows the program to be easily updated
without writing to flash (which have a limited
erase/write cycles) This is particularly useful
on the CC2511Fx, where parts of the firmware
can be downloaded from the windows USB
driver.
Executing a program from SRAM instead of
flash will also result in a lower power
consumption and may be interesting for battery
powered devices.
10.2.2.3
DATA Memory Space
The 8-bit address range of DATA memory
space is mapped into address 0xFF00 –
0xFFFF and is accessible through the unified
memory space. Just like on a standard 8051,
the upper 128 byte share address with the
SFR and can only be accessed indirectly, the
stack is normally located here. The lower 48
bytes are reserved, and hold 4 register banks
used by the MCU. The 16 bytes on addresses
0x20 to 0x2F are bit addressable.
The DATA memory will retain its contents in all
four power modes.
10.2.2.4
SFR Memory Space
The SFR memory space is identical to a
standard 8051.
The 128 hardware SFRs are accessed through
this memory space.
Unlike on a standard 8051, the SFRs are also
accessible through the XDATA and CODE
memory space at the address range 0xDF80 0xDFFF.
Some CPU-specific SFRs reside inside the
CPU core and can only be accessed using the
SFR memory space and not through the
duplicate mapping into XDATA/CODE memory
space. These registers are shown in gray in
Table 30. Be aware that these registers can
not be accessed using DMA.
10.2.3
10.2.3.1
Physical Memory
SRAM
The CC2510Fx/CC2511Fx contains static RAM. At
power-on the contents of RAM is undefined.
The RAM size is 1, 2, or 4 KB in total, mapped
to the memory range 0xF000 – 0xFFFF. In the
F8 version, memory range 0xF300 - 0xFEFF is
unimplemented while on the F16 version,
memory range 0xF700 - 0xFEFF is
unimplemented.
The memory locations 0xFDA2 - 0xFEFF on
the F32 version consist of 350 bytes in unified
memory space which do not retain data when
power modes PM2 or PM3 is entered. All other
RAM memory locations are retained in all
power modes.
10.2.3.2
Flash Memory
The on-chip flash memory consists of 8192,
16384, or 32768 bytes (F8, F16, and F32). The
flash memory is primarily intended to hold
program code. The flash memory has the
following features:
• Flash page erase time: 20 ms
• Flash chip (mass) erase time: 200 ms
• Flash write time (2 bytes): 20 µs
• Data retention (at room temperature):
100 years
• Program/erase
1,000 cycles
endurance:
Minimum
The flash memory consists of the Flash Main
Pages (up to 32 times 1 KB) which are where
the CPU reads program code and data. The
flash memory also contains a Flash
SWRS055G
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Information Page (1 KB) which contains the
Flash Lock Bits. The lock protect bits are
written as a normal flash write to FWDATA but
the Debug Interface needs to select the Flash
Information Page first instead of the Flash
Main Page. The Information Page is selected
through the Debug Configuration which is
written through the Debug Interface only. The
Flash Controller (see Section 12.3) is used to
write and erase the contents of the flash main
memory.
and/or peripherals. Many of the 8051 core
SFRs are identical to the standard 8051 SFRs.
However, there are additional SFRs that
control features that are not available in the
standard 8051. The additional SFRs are used
to interface with the peripheral units and RF
transceiver.
Table 30 shows the address to all SFRs in
CC2510Fx/CC2511Fx. The 8051 internal SFRs are
shown with grey background, while the other
SFRs are specific to CC2510Fx/CC2511Fx.
When the CPU reads instructions from flash
memory, it fetches the next instruction through
a cache. The instruction cache is provided
mainly to reduce power consumption by
reducing the amount of time the flash memory
itself is accessed. The use of the instruction
cache
may
be
disabled
with
the
MEMCTR.CACHDIS register bit, but doing so
will increase power consumption.
10.2.3.3
Note: All internal SFRs (shown with grey
background in Table 30, can only be accessed
through SFR memory space as these registers
are not mapped into XDATA memory space.
Table 31 lists the additional SFRs that are not
standard 8051 peripheral SFRs or CPUinternal SFRs. The additional SFRs are
described in the relevant sections for each
peripheral function.
Special Function Registers
The Special Function Registers (SFRs) control
several of the features of the 8051 CPU core
8 Bytes
80
P0
SP
DPL0
DPH0
DPL1
DPH1
88
TCON
P0IFG
P1IFG
P2IFG
PICTL
P1IEN
90
P1
RFIM
DPS
MPAGE
98
S0CON
IEN2
S1CON
T2CT
T2PR
T2CTL
9F
A0
P2
WORIRQ
WORCTRL
WOREVT0
WOREVT1
WORTIME0
WORTIME1
A7
A8
IEN0
IP0
FWT
FADDRL
FADDRH
FCTL
B0
U0CSR
PCON
87
P0INP
8F
ENDIAN
97
FWDATA
AF
ENCDI
ENCDO
ENCCS
ADCCON1
ADCCON2
ADCCON3
B7
ADCH
RNDL
RNDH
SLEEP
BF
U0UCR
U0GCR
CLKCON
MEMCTR
C7
B8
IEN1
IP1
ADCL
C0
IRCON
U0DBUF
U0BAUD
WDCTL
T3CNT
T3CTL
T3CCTL0
T3CC0
T3CCTL1
T3CC1
CF
C8
D0
PSW
DMAIRQ
DMA1CFGL
DMA1CFGH
DMA0CFGL
DMA0CFGH
DMAARM
DMAREQ
D7
D8
TIMIF
RFD
T1CC0L
T1CC0H
T1CC1L
T1CC1H
T1CC2L
T1CC2H
DF
E0
ACC
RFST
T1CNTL
T1CNTH
T1CTL
T1CCTL0
T1CCTL1
T1CCTL2
E7
E8
IRCON2
RFIF
T4CNT
T4CTL
T4CCTL0
T4CC0
T4CCTL1
T4CC1
EF
F0
B
PERCFG
ADCCFG
P0SEL
P1SEL
P2SEL
P1INP
P2INP
F7
F8
U1CSR
U1DBUF
U1BAUD
U1UCR
U1GCR
P0DIR
P1DIR
P2DIR
FF
Table 30: SFR Address Overview
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Register
Name
SFR
Address
Module
Description
Retention 6
ADCCON1
0xB4
ADC
ADC Control 1
Y
ADCCON2
0xB5
ADC
ADC Control 2
Y
ADCCON3
0xB6
ADC
ADC Control 3
Y
ADCL
0xBA
ADC
ADC Data Low
Y
ADCH
0xBB
ADC
ADC Data High
Y
RNDL
0xBC
ADC
Random Number Generator Data Low
Y
RNDH
0xBD
ADC
Random Number Generator Data High
Y
ENCDI
0xB1
AES
Encryption/Decryption Input Data
N
ENCDO
0xB2
AES
Encryption/Decryption Output Data
N
ENCCS
0xB3
AES
Encryption/Decryption Control and Status
N
DMAIRQ
0xD1
DMA
DMA Interrupt Flag
Y
DMA1CFGL
0xD2
DMA
DMA Channel 1 - 4 Configuration Address Low
Y
DMA1CFGH
0xD3
DMA
DMA Channel 1 - 4 Configuration Address High
Y
DMA0CFGL
0xD4
DMA
DMA Channel 0 Configuration Address Low
Y
DMA0CFGH
0xD5
DMA
DMA Channel 0 Configuration Address High
Y
DMAARM
0xD6
DMA
DMA Channel Arm
Y
DMAREQ
0xD7
DMA
DMA Channel Start Request and Status
Y
FWT
0xAB
FLASH
Flash Write Timing
Y
FADDRL
0xAC
FLASH
Flash Address Low
Y
FADDRH
0xAD
FLASH
Flash Address High
Y
FCTL
0xAE
FLASH
Flash Control
[7:1]Y, [1:0]N
FWDATA
0xAF
FLASH
Flash Write Data
Y
P0IFG
0x89
IOC
Port 0 Interrupt Status Flag
Y
P1IFG
0x8A
IOC
Port 1 Interrupt Status Flag
Y
P2IFG
0x8B
IOC
Port 2 Interrupt Status Flag
Y
PICTL
0x8C
IOC
Port Pins Interrupt Mask and Edge
Y
P1IEN
0x8D
IOC
Port 1 Interrupt Mask
Y
P0INP
0x8F
IOC
Port 0 Input Mode
Y
PERCFG
0xF1
IOC
Peripheral I/O Control
Y
ADCCFG
0xF2
IOC
ADC Input Configuration
Y
P0SEL
0xF3
IOC
Port 0 Function Select
Y
P1SEL
0xF4
IOC
Port 1 Function Select
Y
P2SEL
0xF5
IOC
Port 2 Function Select
Y
P1INP
0xF6
IOC
Port 1 Input Mode
Y
P2INP
0xF7
IOC
Port 2 Input Mode
Y
P0DIR
0xFD
IOC
Port 0 Direction
Y
P1DIR
0xFE
IOC
Port 1 Direction
Y
P2DIR
0xFF
IOC
Port 2 Direction
Y
MEMCTR
0xC7
MEMORY
Memory System Control
Y
SLEEP
0xBE
PMC
Sleep Mode Control
[6:2]Y, [7,1:0]N
6
Registers without retention are in their reset state after PM2 or PM3. This is only applicable for
registers / bits that are defined as R/W
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CC2510Fx / CC2511Fx
Register
Name
SFR
Address
Module
Description
Retention 6
CLKCON
0xC6
PMC
Clock Control
Y
RFIM
0x91
RF
RF Interrupt Mask
Y
RFD
0xD9
RF
RF Data
N
RFIF
0xE9
RF
RF Interrupt flags
Y
RFST
0xE1
RF
RF Strobe Commands
NA
WORIRQ
0xA1
Sleep Timer
Sleep Timer Interrupts
Y
WORCTRL
0xA2
Sleep Timer
Sleep Timer Control
Y
WOREVT0
0xA3
Sleep Timer
Sleep Timer Event 0 Timeout Low Byte
Y
WOREVT1
0xA5
Sleep Timer
Sleep Timer Event 0 Timeout High Byte
Y
WORTIME0
0xA4
Sleep Timer
Sleep Timer Low Byte
Y
WORTIME1
0xA6
Sleep Timer
Sleep Timer High Byte
Y
T1CC0L
0xDA
Timer1
Timer 1 Channel 0 Capture/Compare Value Low
Y
T1CC0H
0xDB
Timer1
Timer 1 Channel 0 Capture/Compare Value High
Y
T1CC1L
0xDC
Timer1
Timer 1 Channel 1 Capture/Compare Value Low
Y
T1CC1H
0xDD
Timer1
Timer 1 Channel 1 Capture/Compare Value High
Y
T1CC2L
0xDE
Timer1
Timer 1 Channel 2 Capture/Compare Value Low
Y
T1CC2H
0xDF
Timer1
Timer 1 Channel 2 Capture/Compare Value High
Y
T1CNTL
0xE2
Timer1
Timer 1 Counter Low
Y
T1CNTH
0xE3
Timer1
Timer 1 Counter High
Y
T1CTL
0xE4
Timer1
Timer 1 Control and Status
Y
T1CCTL0
0xE5
Timer1
Timer 1 Channel 0 Capture/Compare Control
Y
T1CCTL1
0xE6
Timer1
Timer 1 Channel 1 Capture/Compare Control
Y
T1CCTL2
0xE7
Timer1
Timer 1 Channel 2 Capture/Compare Control
Y
T2CT
0x9C
Timer2
Timer 2 Timer Count
N
T2PR
0x9D
Timer2
Timer 2 Prescaler
N
T2CTL
0x9E
Timer2
Timer 2 Control
N
T3CNT
0xCA
Timer3
Timer 3 Counter
Y
T3CTL
0xCB
Timer3
Timer 3 Control
Y,[2]N
T3CCTL0
0xCC
Timer3
Timer 3 Channel 0 Capture/Compare Control
Y
T3CC0
0xCD
Timer3
Timer 3 Channel 0 Capture/Compare Value
Y
T3CCTL1
0xCE
Timer3
Timer 3 Channel 1 Capture/Compare Control
Y
T3CC1
0xCF
Timer3
Timer 3 Channel 1 Capture/Compare Value
Y
T4CNT
0xEA
Timer4
Timer 4 Counter
Y
T4CTL
0xEB
Timer4
Timer 4 Control
Y,[2]N
T4CCTL0
0xEC
Timer4
Timer 4 Channel 0 Capture/Compare Control
Y
T4CC0
0xED
Timer4
Timer 4 Channel 0 Capture/Compare Value
Y
T4CCTL1
0xEE
Timer4
Timer 4 Channel 1 Capture/Compare Control
Y
T4CC1
0xEF
Timer4
Timer 4 Channel 1 Capture/Compare Value
Y
TIMIF
0xD8
TMINT
Timers 1/3/4 Joint Interrupt Mask/Flags
Y
U0CSR
0x86
USART0
USART 0 Control and Status
Y
U0DBUF
0xC1
USART0
USART 0 Receive/Transmit Data Buffer
Y
U0BAUD
0xC2
USART0
USART 0 Baud Rate Control
Y
U0UCR
0xC4
USART0
USART 0 UART Control
Y,[7]N
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CC2510Fx / CC2511Fx
Register
Name
SFR
Address
Module
Description
Retention 6
U0GCR
0xC5
USART0
USART 0 Generic Control
Y
U1CSR
0xF8
USART1
USART 1 Control and Status
Y
U1DBUF
0xF9
USART1
USART 1 Receive/Transmit Data Buffer
Y
U1BAUD
0xFA
USART1
USART 1 Baud Rate Control
Y
U1UCR
0xFB
USART1
USART 1 UART Control
Y,[7]N
U1GCR
0xFC
USART1
USART 1 Generic Control
Y
ENDIAN
0x95
MEMORY
USB Endianess Control (CC2511Fx)
Y
WDCTL
0xC9
WDT
Watchdog Timer Control
Y
Table 31: CC2510Fx/CC2511Fx Specific SFR Overview
10.2.3.4
Radio Registers
The radio registers are all related to Radio
configuration and control. The RF registers can
only be accessed through XDATA memory
space and reside in address range 0xDF00 0xDF3D.
Table 32 gives a descriptive overview of these
registers. Each register is described in detail in
Section 13.18, starting on Page 208.
XDATA
Address
Register
Description
Retention 7
0xDF00
SYNC1
Sync word, high byte
Y
0xDF01
SYNC0
Sync word, low byte
Y
0xDF02
PKTLEN
Packet length
Y
0xDF03
PKTCTRL1
Packet automation control
Y
0xDF04
PKTCTRL0
Packet automation control
Y
0xDF05
ADDR
Device address
Y
0xDF06
CHANNR
Channel number
Y
0xDF07
FSCTRL1
Frequency synthesizer control
Y
0xDF08
FSCTRL0
Frequency synthesizer control
Y
0xDF09
FREQ2
Frequency control word, high byte
Y
0xDF0A
FREQ1
Frequency control word, middle byte
Y
0xDF0B
FREQ0
Frequency control word, low byte
Y
0xDF0C
MDMCFG4
Modem configuration
Y
0xDF0D
MDMCFG3
Modem configuration
Y
0xDF0E
MDMCFG2
Modem configuration
Y
0xDF0F
MDMCFG1
Modem configuration
Y
0xDF10
MDMCFG0
Modem configuration
Y
0xDF11
DEVIATN
Modem deviation setting
Y
0xDF12
MCSM2
Main Radio Control State Machine configuration
Y
0xDF13
MCSM1
Main Radio Control State Machine configuration
Y
0xDF14
MCSM0
Main Radio Control State Machine configuration
Y
0xDF15
FOCCFG
Frequency Offset Compensation configuration
Y
7
Registers without retention are in their reset state after PM2 or PM3. This is only applicable for
registers / bits that are defined as R/W
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CC2510Fx / CC2511Fx
XDATA
Address
Register
Description
Retention 7
0xDF16
BSCFG
Bit Synchronization configuration
Y
0xDF17
AGCCTRL2
AGC control
Y
0xDF18
AGCCTRL1
AGC control
Y
0xDF19
AGCCTRL0
AGC control
Y
0xDF1A
FREND1
Front end RX configuration
Y
0xDF1B
FREND0
Front end TX configuration
Y
0xDF1C
FSCAL3
Frequency synthesizer calibration
N
0xDF1D
FSCAL2
Frequency synthesizer calibration
N
0xDF1E
FSCAL1
Frequency synthesizer calibration
N
0xDF1F
FSCAL0
Frequency synthesizer calibration
Y
Reserved
Y
0xDF20 0xDF22
0xDF23
TEST2
Various Test Settings
Y
0xDF24
TEST1
Various Test Settings
Y
0xDF25
TEST0
Various Test Settings
Y
Reserved
Y
0xDF27 0xDF2D
0xDF2E
PA_TABLE0
PA output power setting
Y
0xDF2F
IOCFG2
Radio test signal configuration (P1_7)
Y
0xDF30
IOCFG1
Radio test signal configuration (P1_6)
Y
0xDF31
IOCFG0
Radio test signal configuration (P1_5)
Y
0xDF36
PARTNUM
Chip ID[15:8]
NA
0xDF37
VERSION
Chip ID[7:0]
NA
0xDF38
FREQEST
Frequency Offset Estimate
NA
0xDF39
LQI
Link Quality Indicator
NA
0xDF3A
RSSI
Received Signal Strength Indication
NA
0xDF3B
MARCSTATE
Main Radio Control State
NA
0xDF3C
PKTSTATUS
Packet status
NA
0xDF3D
VCO_VC_DAC
PLL calibration current
NA
Table 32: Overview of RF Registers
10.2.3.5
2
2
I S Registers
2
The I S registers are all related to I S
2
configuration and control. The I S registers can
only be accessed through XDATA memory
space and reside in address range 0xDF40 -
0xDF48. Table 33 gives a descriptive overview
of these registers. Each register is described in
detail in Section 12.15.13, starting on Page
163.
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CC2510Fx / CC2511Fx
XDATA
Address
Register
Description
Retention 8
0xDF40
I2SCFG0
I2S Configuration Register 0
Y
0xDF41
0xDF42
I2SCFG1
2
Y
2
N
2
I S Configuration Register 1
I2SDATL
I S Data Low Byte
0xDF43
I2SDATH
I S Data High Byte
N
0xDF44
I2SWCNT
I2S Word Count Register
NA
0xDF45
0xDF46
0xDF47
0xDF48
I2SSTAT
2
NA
2
Y
2
Y
2
Y
I S Status Register
I2SCLKF0
I2SCLKF1
I2SCLKF2
I S Clock Configuration Register 0
I S Clock Configuration Register 1
I S Clock Configuration Register 2
2
Table 33: Overview of I S Registers
8
Registers without retention are in their reset state after PM2 or PM3. This is only applicable for
registers / bits that are defined as R/W
10.2.3.6
USB Registers
The USB registers are all related to USB
configuration and control. The USB registers
can only be accessed through XDATA
memory space and reside in address range
0xDE00 - 0xDE3F. These registers can be
divided into three groups: The Common USB
Registers (Table 34), The Indexed Endpoint
Registers (Table 35), and the Endpoint FIFO
XDATA
Address
Register
Description
0xDE00
USBADDR
Function Address
0xDE01
USBPOW
Power/Control Register
0xDE02
USBIIF
IN Endpoints and EP0 Interrupt Flags
0xDE03
0xDE04
Registers (Table 36). Each register is
described in detail in Section 12.16.11, starting
on Page 175. Notice that the upper register
addresses 0xDE2C – 0xDE3F are reserved.
Note: All USB registers lose data in PM2
and PM3, meaning that these power
modes cannot be used on the CC2511Fx
Reserved
USBOIF
0xDE05
OUT Endpoints Interrupt Flags
Reserved
0xDE06
USBCIF
Common USB Interrupt Flags
0xDE07
USBIIE
IN Endpoints and EP0 Interrupt Enable Mask
0xDE08
0xDE09
Reserved
USBOIE
0xDE0A
Out Endpoints Interrupt Enable Mask
Reserved
0xDE0B
USBCIE
Common USB Interrupt Enable Mask
0xDE0C
USBFRML
Current Frame Number (Low byte)
0xDE0D
USBFRMH
Current Frame Number (High byte)
0xDE0E
USBINDEX
Selects current endpoint. Make sure this register has the required value before any of the
registers in Table 35 are accessed. This register must be set to a value in the range 0 - 5.
Table 34: Overview of Common USB Registers
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CC2510Fx / CC2511Fx
XDATA
Address
Register
Description
Valid USBINDEX
Value(s)
0xDE10
USBMAXI
Max. packet size for IN endpoint
1-5
USBCS0
EP0 Control and Status (USBINDEX=0)
0
USBCSIL
IN EP{1 - 5} Control and Status Low
1-5
0xDE12
USBCSIH
IN EP{1 - 5} Control and Status High
1-5
0xDE13
USBMAXO
Max. packet size for OUT endpoint
1-5
0xDE14
USBCSOL
OUT EP{1 - 5} Control and Status Low
1-5
0xDE15
USBCSOH
OUT EP{1 - 5} Control and Status High
1-5
USBCNT0
Number of received bytes in EP0 FIFO (USBINDEX=0)
0
USBCNTL
Number of bytes in OUT FIFO Low
1-5
USBCNTH
Number of bytes in OUT FIFO High
1-5
0xDE11
0xDE16
0xDE17
Table 35: Overview of Indexed Endpoint Registers
XDATA
Address
Register
Description
0xDE20
USBF0
Endpoint 0 FIFO
0xDE22
USBF1
Endpoint 1 FIFO
0xDE24
USBF2
Endpoint 2 FIFO
0xDE26
USBF3
Endpoint 3 FIFO
0xDE28
USBF4
Endpoint 4 FIFO
0xDE2A
USBF5
Endpoint 5 FIFO
Table 36: Overview of Endpoint FIFO Registers
10.2.4
XDATA Memory Access
The CC2510Fx/CC2511Fx provides an additional
SFR named MPAGE. This register is used
during instructions MOVX A,@Ri and MOVX
@Ri,A. MPAGE gives the 8 most significant
address bits, while the register Ri gives the 8
least significant bits.
In some 8051 implementations, this type of
XDATA access is performed using P2 to give
the most significant address bits. Existing
software may therefore have to be adapted to
make use of MPAGE instead of P2.
MPAGE (0x93) - Memory Page Select
Bit
Field Name
Reset
R/W
Description
7:0
MPAGE[7:0]
0x00
R/W
Memory page, high-order bits of address in MOVX instruction
10.2.5
Memory Arbiter
The CC2510Fx/CC2511Fx includes a memory
arbiter which handles CPU and DMA access to
all memory space.
A control register MEMCTR is used to control
the flash cache. The MEMCTR register is
described below.
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CC2510Fx / CC2511Fx
MEMCTR (0xC7) - Memory Arbiter Control
Bit
Field Name
7:2
1
0
CACHDIS
PREFDIS
Reset
R/W
Description
0
R/W
Not used
0
R/W
Flash cache disable. Invalidates contents of instruction cache and forces all
instruction read accesses to read straight from flash memory. Disabling will
increase power consumption and is provided for debug purposes.
1
R/W
0
Cache enabled
1
Cache disabled
Flash prefetch disable. When set prefetch of flash data is disabled, when cleared
the next two bytes in flash are fetched when last byte in cache is read.
0
Prefetch enabled
1
Prefetch disabled
10.3 CPU Registers
This section describes the internal registers
found in the CPU.
10.3.1
Data Pointers
The CC2510Fx/CC2511Fx has two data pointers,
DPTR0 and DPTR1, to accelerate the
movement of data blocks to/from memory. The
data pointers are generally used to access
CODE or XDATA space e.g.
The data pointer select bit, bit 0 in the Data
Pointer Select register DPS, chooses which
data pointer to use during the execution of an
instruction that uses the data pointer, e.g. in
one of the above instructions.
The data pointers are two bytes
consisting of the following SFRs:
MOVC A,@A+DPTR
MOV A,@DPTR.
wide
• DPTR0 - DPH0:DPL0
• DPTR1 - DPH1:DPL1
DPH0 (0x83) - Data Pointer 0 High Byte
Bit
Field Name
Reset
R/W
Description
7:0
DPH0[7:0]
0
R/W
Data pointer 0, high byte
DPL0 (0x82) - Data Pointer 0 Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
DPL0[7:0]
0
R/W
Data pointer 0, low byte
DPH1 (0x85) - Data Pointer 1 High Byte
Bit
Field Name
Reset
R/W
Description
7:0
DPH1[7:0]
0
R/W
Data pointer 1, high byte
DPL1 (0x84) - Data Pointer 1 Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
DPL1[7:0]
0
R/W
Data pointer 1, low byte
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CC2510Fx / CC2511Fx
DPS (0x92) - Data Pointer Select
Bit
Field Name
7:1
0
DPS
10.3.2
Reset
R/W
Description
0
R/W
Not used
0
R/W
Data pointer select
0
DPTR0
1
DPTR1
Registers R0 - R7
10.3.3
The CC2510Fx/CC2511Fx provides four register
banks of eight registers each. These register
banks are in the DATA memory space at
addresses 0x00 - 0x07, 0x08 - 0x0F, 0x10 0x17 and 0x18 - 0x1F and are mapped to
address range 0xFF00 to 0xFF1F in the
unified memory space. Each register bank
contains the eight 8-bit register R0 - R7. The
register bank to be used is selected through
the Program Status Word PSW.RS[1:0].
Program Status Word
The Program Status Word (PSW) contains
several bits that show the current state of the
CPU. The Program Status Word is accessible
as an SFR and it is bit-addressable. The PSW
register contains the Carry flag, Auxiliary Carry
flag for BCD operations, Register Select bits,
Overflow flag, and Parity flag. Two bits in PSW
are uncommitted and can be used as userdefined status flags.
PSW (0xD0) - Program Status Word
Bit
Field Name
Reset
R/W
Description
7
CY
0
R/W
Carry flag. Set to 1 when the last arithmetic operation resulted in a carry (during
addition) or borrow (during subtraction), otherwise cleared to 0 by all arithmetic
operations.
6
AC
0
R/W
Auxiliary carry flag for BCD operations. Set to 1 when the last arithmetic
operation resulted in a carry into (during addition) or borrow from (during
subtraction) the high order nibble, otherwise cleared to 0 by all arithmetic
operations.
5
F0
0
R/W
User-defined, bit-addressable
4:3
RS[1:0]
00
R/W
Register bank select bits. Selects which set of R7 - R0 registers to use from four
possible register banks in DATA space.
00
Bank 0, 0x00 - 0x07
01
Bank 1, 0x08 - 0x0F
10
Bank 2, 0x10 - 0x17
11
Bank 3, 0x18 - 0x1F
2
OV
0
R/W
Overflow flag, set by arithmetic operations. Set to 1 when the last arithmetic
operation resulted in a carry (addition), borrow (subtraction), or overflow (multiply
or divide). Otherwise, the bit is cleared to 0 by all arithmetic operations.
1
F1
0
R/W
User-defined, bit-addressable
0
P
0
R/W
Parity flag, parity of accumulator set by hardware to 1 if it contains an odd
number of 1’s, otherwise it is cleared to 0
10.3.4
Accumulator
ACC is the accumulator. This is the source
and destination of most arithmetic instructions,
data transfer and other instructions. The
mnemonic for the accumulator (in instructions
involving the accumulator) refers to A instead
of ACC.
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CC2510Fx / CC2511Fx
ACC (0xE0) - Accumulator
Bit
Field Name
Reset
R/W
Description
7:0
ACC[7:0]
0x00
R/W
Accumulator
10.3.5
B Register
The B register is used as the second 8-bit
argument during execution of multiply and
divide instructions. When not used for these
purposes it may be used as a scratch-pad
register to hold temporary data.
B (0xF0) - B Register
Bit
Field Name
Reset
R/W
Description
7:0
B[7:0]
0x00
R/W
B register. Used in MUL and DIV instructions.
10.3.6
Stack Pointer
The stack resides in DATA memory space and
grows upwards. The PUSH instruction first
increments the Stack Pointer (SP) and then
copies the byte into the stack. The Stack
Pointer is initialized to 0x07 after a reset and it
is incremented once to start from location
0x08, which is the first register (R0) of the
second register bank. Thus, in order to use
more than one register bank, the SP should be
initialized to a different location not used for
data storage.
SP (0x81) - Stack Pointer
Bit
Field Name
Reset
R/W
Description
7:0
SP[7:0]
0x07
R/W
Stack Pointer
10.4 Instruction Set Summary
• addr16 - 16-bit destination address.
Used by LCALL and LJMP. A branch
can be anywhere within the 8/16/32 KB
CODE memory space.
The 8051 instruction set is summarized in
Table 37. All mnemonics copyrighted Intel
Corporation 1980.
The following conventions are used in the
instruction set summary:
• addr11 - 11-bit destination address.
Used by ACALL and AJMP. The branch
will be within the same 2 KB page of
program memory as the first byte of the
following instruction.
• Rn - Register R7 - R0 of the currently
selected register bank.
• direct - 8-bit internal data location’s
address. This can be DATA area (0x00 0x7F) or SFR area (0x80 - 0xFF).
• @Ri - 8-bit internal data location, DATA
area (0x00 - 0xFF) addressed indirectly
through register R1 or R0.
• rel - Signed (two’s complement) 8-bit
offset byte. Used by SJMP and all
conditional jumps. Range is –128 to
+127 bytes relative to first byte of the
following instruction.
• #data - 8-bit constant included in
instruction.
• bit - direct addressed bit in DATA area
or SFR.
• #data16 - 16-bit constant included in
instruction.
The instructions that affect CPU flag settings
located in PSW are listed in Table 38 on Page
57. Note that operations on the PSW register or
bits in PSW will also affect the flag settings.
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CC2510Fx / CC2511Fx
Mnemonic
Description
Hex Opcode
Bytes
Cycles
ADD A,Rn
Add register to accumulator
0x28 - 0x2F
1
1
ADD A,direct
Add direct byte to accumulator
0x25
2
2
ADD A,@Ri
Add indirect RAM to accumulator
0x26 - 0x27
1
2
ADD A,#data
Add immediate data to accumulator
0x24
2
2
ADDC A,Rn
Add register to accumulator with carry flag
0x38 - 0x3F
1
1
ADDC A,direct
Add direct byte to A with carry flag
0x35
2
2
ADDC A,@Ri
Add indirect RAM to A with carry flag
0x36 - 0x37
1
2
ADDC A,#data
Add immediate data to A with carry flag
0x34
2
2
SUBB A,Rn
Subtract register from A with borrow
0x98 - 0x9F
1
1
SUBB A,direct
Subtract direct byte from A with borrow
0x95
2
2
SUBB A,@Ri
Subtract indirect RAM from A with borrow
0x96 - 0x97
1
2
SUBB A,#data
Subtract immediate data from A with borrow
0x94
2
2
INC A
Increment accumulator
0x04
1
1
INC Rn
Increment register
0x08 - 0x0F
1
2
INC direct
Increment direct byte
0x05
2
3
INC @Ri
Increment indirect RAM
0x06 - 0x07
1
3
INC DPTR
Increment data pointer
0xA3
1
1
DEC A
Decrement accumulator
0x14
1
1
DEC Rn
Decrement register
0x18 - 0x1F
1
2
DEC direct
Decrement direct byte
0x15
2
3
DEC @Ri
Decrement indirect RAM
0x16 - 0x17
1
3
MUL AB
Multiply A and B
0xA4
1
5
DIV
Divide A by B
0x84
1
5
DA A
Decimal adjust accumulator
0xD4
1
1
ANL A,Rn
AND register to accumulator
0x58 - 0x5F
1
1
ANL A,direct
AND direct byte to accumulator
0x55
2
2
ANL A,@Ri
AND indirect RAM to accumulator
0x56 - 0x57
1
2
ANL A,#data
AND immediate data to accumulator
0x54
2
2
ANL direct,A
AND accumulator to direct byte
0x52
2
3
ANL direct,#data
AND immediate data to direct byte
0x53
3
4
ORL A,Rn
OR register to accumulator
0x48 - 0x4F
1
1
ORL A,direct
OR direct byte to accumulator
0x45
2
2
ORL A,@Ri
OR indirect RAM to accumulator
0x46 - 0x47
1
2
ORL A,#data
OR immediate data to accumulator
0x44
2
2
ORL direct,A
OR accumulator to direct byte
0x42
2
3
ORL direct,#data
OR immediate data to direct byte
0x43
3
4
XRL A,Rn
Exclusive OR register to accumulator
0x68 - 0x6F
1
1
XRL A,direct
Exclusive OR direct byte to accumulator
0x65
2
2
XRL A,@Ri
Exclusive OR indirect RAM to accumulator
0x66 - 0x67
1
2
XRL A,#data
Exclusive OR immediate data to accumulator
0x64
2
2
XRL direct,A
Exclusive OR accumulator to direct byte
0x62
2
3
Arithmetic Operations
Logical Operations
SWRS055G
Page 54 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Mnemonic
Description
Hex Opcode
Bytes
Cycles
XRL direct,#data
Exclusive OR immediate data to direct byte
0x63
3
4
CLR A
Clear accumulator
0xE4
1
1
CPL A
Complement accumulator
0xF4
1
1
RL A
Rotate accumulator left
0x23
1
1
RLC A
Rotate accumulator left through carry
0x33
1
1
RR A
Rotate accumulator right
0x03
1
1
RRC A
Rotate accumulator right through carry
0x13
1
1
SWAP A
Swap nibbles within the accumulator
0xC4
1
1
MOV A,Rn
Move register to accumulator
0xE8 - 0xEF
1
1
MOV A,direct
Move direct byte to accumulator
0xE5
2
2
MOV A,@Ri
Move indirect RAM to accumulator
0xE6 - 0xE7
1
2
MOV A,#data
Move immediate data to accumulator
0x74
2
2
MOV Rn,A
Move accumulator to register
0xF8 - 0xFF
1
2
MOV Rn,direct
Move direct byte to register
0xA8 - 0xAF
2
4
MOV Rn,#data
Move immediate data to register
0x78 - 0x7F
2
2
MOV direct,A
Move accumulator to direct byte
0xF5
2
3
MOV direct,Rn
Move register to direct byte
0x88 - 0x8F
2
3
MOV direct1,direct2
Move direct byte to direct byte
0x85
3
4
MOV direct,@Ri
Move indirect RAM to direct byte
0x86 - 0x87
2
4
MOV direct,#data
Move immediate data to direct byte
0x75
3
3
MOV @Ri,A
Move accumulator to indirect RAM
0xF6 - 0xF7
1
3
MOV @Ri,direct
Move direct byte to indirect RAM
0xA6 - 0xA7
2
5
MOV @Ri,#data
Move immediate data to indirect RAM
0x76 - 0x77
2
3
MOV DPTR,#data16
Load data pointer with a 16-bit constant
0x90
3
3
MOVC A,@A+DPTR
Move code byte relative to DPTR to accumulator
0x93
1
3
MOVC A,@A+PC
Move code byte relative to PC to accumulator
0x83
1
3
MOVX A,@Ri
Move external RAM (8-bit address) to A
0xE2 - 0xE3
1
3 - 10
MOVX A,@DPTR
Move external RAM (16-bit address) to A
0xE0
1
3 - 10
MOVX @Ri,A
Move A to external RAM (8-bit address)
0xF2 - 0xF3
1
4 - 11
MOVX @DPTR,A
Move A to external RAM (16-bit address)
0xF0
1
4 - 11
PUSH direct
Push direct byte onto stack
0xC0
2
4
POP direct
Pop direct byte from stack
0xD0
2
3
XCH A,Rn
Exchange register with accumulator
0xC8 - 0xCF
1
2
XCH A,direct
Exchange direct byte with accumulator
0xC5
2
3
XCH A,@Ri
Exchange indirect RAM with accumulator
0xC6 - 0xC7
1
3
XCHD A,@Ri
Exchange low-order nibble indirect. RAM with A
0xD6 - 0xD7
1
3
Data Transfers
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Mnemonic
Description
Hex Opcode
Bytes
Cycles
ACALL addr11
Absolute subroutine call
xxx11 9
2
6
LCALL addr16
Long subroutine call
0x12
3
6
RET
Return from subroutine
0x22
1
4
RETI
Return from interrupt
0x32
1
4
Program Branching
9
AJMP addr11
Absolute jump
xxx01
2
3
LJMP addr16
Long jump
0x02
3
4
SJMP rel
Short jump (relative address)
0x80
2
3
JMP @A+DPTR
Jump indirect relative to the DPTR
0x73
1
2
JZ rel
Jump if accumulator is zero
0x60
2
3
JNZ rel
Jump if accumulator is not zero
0x70
2
3
JC rel
Jump if carry flag is set to 1
0x40
2
3
JNC
Jump if carry flag is 0
0x50
2
3
JB bit,rel
Jump if direct bit is set to 1
0x20
3
4
JNB bit,rel
Jump if direct bit is 0
0x30
3
4
JBC bit,direct rel
Jump if direct bit is set to 1 and clear the bit to 0
0x10
3
4
CJNE A,direct rel
Compare direct byte to A and jump if not equal
0xB5
3
4
CJNE A,#data rel
Compare immediate to A and jump if not equal
0xB4
3
4
CJNE Rn,#data rel
Compare immediate to reg. and jump if not equal
0xB8 - 0xBF
3
4
CJNE @Ri,#data rel
Compare immediate to indirect and jump if not equal
0xB6 - 0xB7
3
4
DJNZ Rn,rel
Decrement register and jump if not zero
0xD8 - 0xDF
2
3
DJNZ direct,rel
Decrement direct byte and jump if not zero
0xD5
3
4
NOP
No operation
0x00
1
1
Boolean Variable Operations
CLR C
Clear carry flag
0xC3
1
1
CLR bit
Clear direct bit
0xC2
2
3
SETB C
Set carry flag to 1
0xD3
1
1
SETB bit
Set direct bit to 1
0xD2
2
3
CPL C
Complement carry flag
0xB3
1
1
CPL bit
Complement direct bit
0xB2
2
3
ANL C,bit
AND direct bit to carry flag
0x82
2
2
ANL C,/bit
AND complement of direct bit to carry
0xB0
2
2
ORL C,bit
OR direct bit to carry flag
0x72
2
2
ORL C,/bit
OR complement of direct bit to carry
0xA0
2
2
MOV C,bit
Move direct bit to carry flag
0xA2
2
2
MOV bit,C
Move carry flag to direct bit
0x92
2
3
Set SW breakpoint in debug mode
0xA5
1
1
Miscellaneous
TRAP
Table 37: Instruction Set Summary
9
addr11[10:8] is mapped into bits 7:5 of the first instruction byte (i.e. the opcode). addr11[7:0] is
mapped into the second instruction byte)
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Instruction
CY
OV
AC
ADD
x
x
x
ADDC
x
x
x
SUBB
x
x
x
MUL
0
x
-
DIV
0
x
-
DA
x
-
-
RRC
x
-
-
RLC
x
-
-
SETB C
1
-
-
CLR C
x
-
-
CPL C
x
-
-
ANL C,bit
x
-
-
ANL C,/bit
x
-
-
ORL C,bit
x
-
-
ORL C,/bit
x
-
-
MOV C,bit
x
-
-
CJNE
x
-
-
“0” = Clear to 0, “1” = Set to 1, “x” = Set to 1/Clear to 0, “-“ = Not affected
Table 38: Instructions that Affect Flag Settings
10.5 Interrupts
The CPU has 18 interrupt sources. Each
source has its own request flag located in a
set of Interrupt Flag SFRs. Each interrupt can
be individually enabled or disabled. The
definitions of the interrupt sources and the
interrupt vectors are given in
Table 39.
2
I S and USART1 share interrupts. On the
CC2511Fx USB shares interrupt with Port 2
2
inputs. The interrupt aliases for I S and USB
are listed in Table 40. However, in the
following sections the original interrupt names,
masks, and flags listed in Table 39 are the
ones used.
The interrupts are grouped into a set of priority
level groups with selectable priority levels.
Note that some peripherals have several
events that can generate the interrupt request
associated with that peripheral. This applies to
P0, P1, P2, DMA, Timer 1, Timer 2, Timer 3,
Timer 4, and Radio. These peripherals have
interrupt mask bits for each internal interrupt
source in the corresponding SFRs. Note that
2
I S has its own interrupt enable bits even if it
has only one event per interrupt. For the
peripherals that have their own mask bits, one
or more of these bits must be set for the
associated CPU interrupt flag to be asserted.
In order to use any of the interrupts in the
CC2510Fx/CC2511Fx the following steps must be
taken:
The interrupt enable registers are described in
Section 10.5.1 and the interrupt priority
settings are described in Section 10.5.2 on
Page 65.
10.5.1
Interrupt Masking
Each interrupt can be individually enabled or
disabled by the interrupt enable bits in the
Interrupt Enable SFRs IEN0, IEN1, and IEN2.
The Interrupt Enable SFRs are described
below and summarized in
Table 39.
SWRS055G
1. Clear interrupt
10.5.2)
flags
(see
Section
2. Set individual interrupt enable bit in the
peripherals SFR, if any
3. Set the corresponding individual,
interrupt enable bit in the IEN0, IEN1,
or IEN2 registers to 1
Page 57 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
4. Enable global interrupt by setting the
IEN0.EA=1
Note: An interrupt must not be enabled
without having proper code located at the
corresponding interrupt vector address
5. Begin the interrupt service routine at the
corresponding vector address of that
interrupt. See
Table
39
for
addresses
Interrupt
Number
Description
Interrupt
Name
Interrupt
Vector
CPU Interrupt
Mask
CPU Interrupt Flag
0
RF TX done / RX ready
RFTXRX
0x03
IEN0.RFTXRXIE
TCON.RFTXRXIF 10
1
ADC end of conversion
ADC
0x0B
IEN0.ADCIE
TCON.ADCIF10
2
USART0 RX complete
URX0
0x13
IEN0.URX0IE
TCON.URX0IF10
3
USART1 RX complete
URX1
0x1B
IEN0.URX1IE
TCON.URX1IF10
(Note: I2S RX complete, see Table
40)
4
AES encryption/decryption
complete
ENC
0x23
IEN0.ENCIE
S0CON.ENCIF
5
Sleep Timer compare
ST
0x2B
IEN0.STIE
IRCON.STIF 11
6
Port 2 inputs
P2INT
0x33
IEN2.P2IE
IRCON2.P2IF11
(Note: Also used for USB on
CC2511Fx,, see Table 40)
7
USART0 TX complete
UTX0
0x3B
IEN2.UTX0IE
IRCON2.UTX0IF
8
DMA transfer complete
DMA
0x43
IEN1.DMAIE
IRCON.DMAIF
9
Timer 1 (16-bit)
capture/Compare/overflow
T1
0x4B
IEN1.T1IE
IRCON.T1IF10,11
10
Timer 2 (MAC Timer) overflow
T2
0x53
IEN1.T2IE
IRCON.T2IF10,
11
11
Timer 3 (8-bit) compare/overflow
T3
0x5B
IEN1.T3IE
IRCON.T3IF10,
11
12
Timer 4 (8-bit) compare/overflow
T4
0x63
IEN1.T4IE
IRCON.T4IF10,
11
13
Port 0 inputs
11
P0INT
0x6B
IEN1.P0IE
IRCON.P0IF
UTX1
0x73
IEN2.UTX1IE
IRCON2.UTX1IF
(Note: P0_7 interrupt used for USB
Resume interrupt on CC2511Fx)
14
USART1 TX complete
(Note: I2S TX complete, see Table
40)
15
Port 1 inputs
P1INT
0x7B
IEN2.P1IE
IRCON2.P1IF11
16
RF general interrupts
RF
0x83
IEN2.RFIE
S1CON.RFIF11
17
Watchdog overflow in timer mode
WDT
0x8B
IEN2.WDTIE
IRCON2.WDTIF
Table 39: Interrupts Overview
10
Cleared by HW when the CPU vectors to the ISR
11
Additional interrupt mask bits and/or interrupt flags found in the peripheral’s SFRs
SWRS055G
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CC2510Fx / CC2511Fx
Interrupt
Number
Description
Interrupt
Name
Interrupt
Vector
CPU Interrupt
Mask Alias
CPU Interrupt Flag
Alias
3
I2S RX complete
URX1/
I2SRX
0x1B
IEN0.I2SRXIE
TCON.I2SRXIF 12
6
USB Interrupt pending (CC2511Fx )
P2INT/
USB
0x33
IEN2.USBIE
IRCON2.USBIF 13
13
USB resume interrupt (CC2511Fx ).
P0INT
0x6B
IEN1.P0IE
IRCON.P0IF
UTX1/
I2STX
0x73
IEN2.I2STXIE
IRCON2.I2STXIF12
P0_6 and P0_7 does not exist on
CC2510Fx. USB resume interrupt
configured like P0_7 interrupt on
CC2510Fx
I2S TX complete
14
2
Table 40: Shared Interrupt Vectors (I S and USB)
12
The I S module has its own interrupt enable bits and interrupt flags (no masking)
2
13
Additional interrupt mask bits and interrupt flags found in the peripheral’s SFRs
IEN0 (0xA8) - Interrupt Enable 0 Register
Bit
Field Name
Reset
R/W
Description
7
EA
0
R/W
Enable All
6
5
4
3
2
1
0
STIE
ENCIE
URX1IE /
I2SRXIE
URX0IE
ADCIE
RFTXRXIE
0
No interrupt will be acknowledged
1
Each interrupt source is individually enabled or disabled by setting its
corresponding enable bit
0
R/W
Not used
0
R/W
Sleep Timer interrupt enable
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
0
Interrupt disabled
1
Interrupt enabled
AES encryption/decryption interrupt enable
0
Interrupt disabled
1
Interrupt enabled
USART1 RX interrupt enable / I2S RX interrupt enable
0
Interrupt disabled
1
Interrupt enabled
USART0 RX interrupt enable
0
Interrupt disabled
1
Interrupt enabled
ADC interrupt enable
0
Interrupt disabled
1
Interrupt enabled
RF TX/RX done interrupt enable
0
Interrupt disabled
1
Interrupt enabled
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CC2510Fx / CC2511Fx
IEN1 (0xB8) - Interrupt Enable 1 Register
Bit
Reset
R/W
Description
7
0
R/W
Not used
6
-
R0
Not used
0
R/W
Port 0 interrupt enable
5
4
3
2
1
0
Field Name
P0IE
T4IE
T3IE
T2IE
T1IE
DMAIE
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
0
Interrupt disabled
1
Interrupt enabled
Timer 4 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Timer 3 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Timer 2 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Timer 1 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
DMA transfer interrupt enable
0
Interrupt disabled
1
Interrupt enabled
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
IEN2 (0x9A) - Interrupt Enable 2 Register
Bit
Field Name
7:6
5
4
3
2
1
0
10.5.2
WDTIE
P1IE
Reset
R/W
Description
0
R/W
Not used
0
R/W
Watchdog timer interrupt enable
0
UTX1IE /
I2STXIE
0
UTX0IE
0
P2IE /
USBIE
RFIE
0
0
R/W
R/W
R/W
R/W
R/W
0
Interrupt disabled
1
Interrupt enabled
Port 1 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
USART1 TX interrupt enable / I2S TX interrupt enable
0
Interrupt disabled
1
Interrupt enabled
USART0 TX interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Port 2 interrupt enable (Also used for USB interrupt enable on CC2511Fx)
0
Interrupt disabled
1
Interrupt enabled
RF general interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Interrupt Processing
When an interrupt occurs, the CPU will vector
to the interrupt vector address shown in Table
39, if this particular interrupt has been
enabled. Once an interrupt service has begun,
it can be interrupted only by a higher priority
interrupt. The interrupt service is terminated by
a RETI (return from interrupt) instruction.
When a RETI is performed, the CPU will return
to the instruction that would have been next
when the interrupt occurred.
When the interrupt condition occurs, an
interrupt flag bit will be set in one of the CPU
interrupt flag registers and in the peripherals
interrupt flag register, if this is available. These
bits are asserted regardless of whether the
interrupt is enabled or disabled. If the interrupt
is enabled when an interrupt flag is asserted,
then on the next instruction cycle the interrupt
will be acknowledged by hardware forcing an
LCALL to the appropriate vector address.
Interrupt response will require a varying
amount of time depending on the state of the
CPU when the interrupt occurs. If the CPU is
performing an interrupt service with equal or
greater priority, the new interrupt will be
pending until it becomes the interrupt with
highest priority. In other cases, the response
time depends on the current instruction. The
fastest possible response to an interrupt is
seven instruction cycles. This includes one
machine cycle for detecting the interrupt and
six cycles to perform the LCALL.
Clearing interrupt flags must be done correctly
to ensure that no interrupts are lost or
processed more than once. For pulsed or
edge shaped interrupt sources one should
clear the CPU interrupt flag prior to clearing
the module interrupt flag, if available, for flags
that are not automatically cleared. For level
triggered interrupts (port interrupts) one has to
clear the module interrupt flag prior to clearing
the CPU interrupt flag. When handling
interrupts where the CPU interrupt flag is
cleared by hardware, the software should only
clear the module interrupt flag. The following
interrupts are cleared by hardware:
• RFTXRX
•
T1
• ADC
•
T2
• URX0
•
T3
• URX1/I2SRX
•
T4
One or more module flags can be cleared at
once. However the safest approach is to only
handle one interrupt source each time the
interrupt is triggered, hence clearing only one
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
module flag. When any module flag is cleared
the chip will check if there are any module
interrupt flags left that are both enabled and
asserted, if so the CPU interrupt flag will be
asserted and a new interrupt triggered.
The following code example shows how only
one module flag is handled and cleared each
time the interrupt occurs:
#pragma vector = RF_VECTOR
__interrupt void rf_interrupt (void)
{
S1CON &= ~0x03;
// Clear CPU interrupt flag
if(RFIF & 0x80)
// TX underflow
{
irq_txunf();
// Handle TX underflow
RFIF &= ~0x80;
// Clear module interrupt flag
}
else if(RFIF & 0x40)
// RX overflow
{
irq_rxovf();
// Handle RX overflow
RFIF &= ~0x40;
// Clear module interrupt flag
}
// Use ”else if” to check and handle other RFIF flags
}
TCON (0x88) - CPU Interrupt Flag 1
Bit
7
Field Name
Reset
R/W
Description
URX1IF /
I2SRXIF
0
R/W
H0
USART1 RX interrupt flag / I2S RX interrupt flag
6
5
ADCIF
4
3
URX0IF
2
1
0
RFTXRXIF
Set to 1 when USART1 RX interrupt occurs and cleared when CPU vectors to
the interrupt service routine.
0
Interrupt not pending
1
Interrupt pending
0
R/W
Not used
0
R/W
H0
ADC interrupt flag. Set to 1 when ADC interrupt occurs and cleared when CPU
vectors to the interrupt service routine.
0
Interrupt not pending
1
Interrupt pending
0
R/W
Not used
0
R/W
H0
USART0 RX interrupt flag. Set to 1 when USART0 interrupt occurs and cleared
when CPU vectors to the interrupt service routine.
0
Interrupt not pending
1
Interrupt pending
1
R/W
Reserved. Must always be set to 1.
0
R/W
H0
RF TX/RX complete interrupt flag. Set to 1 when RFTXRX interrupt occurs and
cleared when CPU vectors to the interrupt service routine.
1
R/W
0
Interrupt not pending
1
Interrupt pending
Reserved. Must always be set to 1.
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CC2510Fx / CC2511Fx
S0CON (0x98) - CPU Interrupt Flag 2
Bit
Field Name
7:2
1
0
ENCIF_1
ENCIF_0
Reset
R/W
Description
0
R/W
Not used
0
R/W
AES interrupt. ENCIF has two interrupt flags, ENCIF_1 and ENCIF_0. Interrupt
source sets both ENCIF_1 and ENCIF_0, but setting one of these flags in SW will
generate an interrupt request. Both flags are set when the AES co-processor
requests the interrupt.
0
R/W
0
Interrupt not pending
1
Interrupt pending
AES interrupt. ENCIF has two interrupt flags, ENCIF_1 and ENCIF_0. Interrupt
source sets both ENCIF_1 and ENCIF_0, but setting one of these flags in SW will
generate an interrupt request. Both flags are set when the AES co-processor
requests the interrupt.
0
Interrupt not pending
1
Interrupt pending
S1CON (0x9B) - CPU Interrupt Flag 3
Bit
Field Name
7:6
1
0
RFIF_1
RFIF_0
Reset
R/W
Description
0
R/W
Not used
0
R/W
RF general interrupt. RFIF has two interrupt flags, RFIF_1 and RFIF_0. Interrupt
source sets both RFIF_1 and RFIF_0, but setting one of these flags in SW will
generate an interrupt request. Both flags are set when the radio requests the
interrupt.
0
R/W
0
Interrupt not pending
1
Interrupt pending
RF general interrupt. RFIF has two interrupt flags, RFIF_1 and RFIF_0. Interrupt
source sets both RFIF_1 and RFIF_0, but setting one of these flags in SW will
generate an interrupt request. Both flags are set when the radio requests the
interrupt.
0
Interrupt not pending
1
Interrupt pending
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
IRCON (0xC0) - CPU Interrupt Flag 4
Bit
Field Name
Reset
R/
W
Description
7
STIF
0
R/
W
Sleep Timer interrupt flag
0 Interrupt not pending
1 Interrupt pending
6
5
P0IF
0
R/
W
Reserved. Must always be set to 0. Failure to do so will lead to ISR toggling
(interrupt routine sustained)
0
R/
W
Port 0 interrupt flag
0 Interrupt not pending
1 Interrupt pending
4
T4IF
0
R/
W
H0
Timer 4 interrupt flag. Set to 1 when Timer 4 interrupt occurs and cleared when CPU
vectors to the interrupt service routine.
0 Interrupt not pending
1 Interrupt pending
3
T3IF
0
R/
W
H0
Timer 3 interrupt flag. Set to 1 when Timer 3 interrupt occurs and cleared when CPU
vectors to the interrupt service routine.
0 Interrupt not pending
1 Interrupt pending
2
T2IF
0
R/
W
H0
Timer 2 interrupt flag. Set to 1 when Timer 2 interrupt occurs and cleared when CPU
vectors to the interrupt service routine.
0 Interrupt not pending
1 Interrupt pending
1
T1IF
0
R/
W
H0
Timer 1 interrupt flag. Set to 1 when Timer 1 interrupt occurs and cleared when CPU
vectors to the interrupt service routine.
0 Interrupt not pending
1 Interrupt pending
0
DMAIF
0
R/
W
DMA complete interrupt flag.
0 Interrupt not pending
1 Interrupt pending
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IRCON2 (0xE8) - CPU Interrupt Flag 5
Bit
Field Name
7:5
4
3
2
1
0
10.5.3
WDTIF
P1IF
UTX1IF /
I2STXIF
UTX0IF
P2IF /
USBIF
Reset
R/W
Description
0
R/W
Not used
0
R/W
Watchdog timer interrupt flag
0
0
0
0
R/W
R/W
R/W
R/W
0
Interrupt not pending
1
Interrupt pending
Port 1 interrupt flag.
0
Interrupt not pending
1
Interrupt pending
USART1 TX interrupt flag / I2S TX interrupt flag
0
Interrupt not pending
1
Interrupt pending
USART0 TX interrupt flag
0
Interrupt not pending
1
Interrupt pending
Port2 interrupt flag / USB interrupt flag
0
Interrupt not pending
1
Interrupt pending
Interrupt Priority
The interrupts are grouped into six interrupt
priority groups and the priority for each group
is set by the registers IP0 and IP1. The
interrupt priority groups with assigned interrupt
sources are shown in Table 42. Each group is
assigned one of four priority levels, and by
default all six interrupt priority groups are
assign the lowest priority. In order to assign a
higher priority to an interrupt, i.e. to its interrupt
group, the corresponding bits in IP0 and IP1
must be set as shown in Table 41 on Page 66.
While an interrupt service request is in
progress, it cannot be interrupted by a lower or
same level interrupt. In the case when
interrupt requests of the same priority level are
received simultaneously, the polling sequence
shown in Table 43 is used to resolve the
priority of each requests.
IP1 (0xB9) - Interrupt Priority 1
Bit
Field Name
7:6
Reset
R/W
Description
0
R/W
Not used
5
IP1_IPG5
0
R/W
Interrupt group 5, priority control bit 1, refer to Table 41
4
IP1_IPG4
0
R/W
Interrupt group 4, priority control bit 1, refer to Table 41
3
IP1_IPG3
0
R/W
Interrupt group 3, priority control bit 1, refer to Table 41
2
IP1_IPG2
0
R/W
Interrupt group 2, priority control bit 1, refer to Table 41
1
IP1_IPG1
0
R/W
Interrupt group 1, priority control bit 1, refer to Table 41
0
IP1_IPG0
0
R/W
Interrupt group 0, priority control bit 1, refer to Table 41
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IP0 (0xA9) - Interrupt Priority 0
Bit
Field Name
7:6
Reset
R/W
Description
0
R/W
Not used
5
IP0_IPG5
0
R/W
Interrupt group 5, priority control bit 0, refer to Table 41
4
IP0_IPG4
0
R/W
Interrupt group 4, priority control bit 0, refer to Table 41
3
IP0_IPG3
0
R/W
Interrupt group 3, priority control bit 0, refer to Table 41
2
IP0_IPG2
0
R/W
Interrupt group 2, priority control bit 0, refer to Table 41
1
IP0_IPG1
0
R/W
Interrupt group 1, priority control bit 0, refer to Table 41
0
IP0_IPG0
0
R/W
Interrupt group 0, priority control bit 0, refer to Table 41
IP1_x
IP0_x
Priority Level
0
0
0 (lowest)
0
1
1
1
0
2
1
1
3 (highest)
Table 41: Priority Level Setting
Group
Interrupts
IPG0
RFTXRX
RF
DMA
IPG1
ADC
T1
P2INT / USB
IPG2
URX0
T2
UTX0
IPG3
URX1 / I2SRX
T3
UTX1 / I2STX
IPG4
ENC
T4
P1INT
IPG5
ST
P0INT (USB Resume)
WDT
Table 42: Interrupt Priority Groups
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Interrupt Number
Interrupt Name
0
RFTXRX
16
RF
8
DMA
1
ADC
9
T1
2
URX0
10
T2
3
URX1 / I2SRX
11
T3
4
ENC
12
T4
5
ST
13
P0INT / (USB Resume)
6
P2INT / USB
7
UTX0
14
URX1 / I2STX
15
P1INT
17
WDT
Polling sequence
Table 43: Interrupt Polling Sequence
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11
Debug Interface
The CC2510Fx/CC2511Fx includes an on-chip
debug module which communicates over a
two-wire interface. The debug interface allows
programming of the on-chip flash. It also
provides access to memory and registers
contents, and debug features such as
breakpoints, single-stepping, and register
modification.
The debug interface uses the I/O pins P2_1 as
Debug Data and P2_2 as Debug Clock during
Debug mode. These I/O pins can be used as
general purpose I/O only while the device is
not in Debug mode. Thus the debug interface
does not interfere with any peripheral I/O pins.
11.1 Debug Mode
Debug mode is entered by forcing two rising
edge transitions on pin P2_2 (Debug Clock)
while the RESET_N input is held low.
Note: Debugging of PM2 and PM3 is not
supported. Also note that CLKCON.CLKSPD
must be 000 or 001 when using the debug
interface
While in Debug mode pin P2_1 is the Debug
Data bi-directional pin and P2_2 is the Debug
Clock input pin.
11.2 Debug Communication
The debug interface uses an SPI-like two-wire
interface consisting of the P2_1 (Debug Data)
and P2_2 (Debug Clock) pins. Data is driven
on the bi-directional Debug Data pin at the
positive edge of Debug Clock and data is
sampled on the negative edge of this clock.
Debug commands are sent by an external host
and consist of 1 to 4 output bytes (including
command byte) from the host and an optional
input byte read by the host. Command and
data is transferred with MSB first. Figure 17
shows a timing diagram of data on the debug
interface.
P2_2
P2_1
command
first data byte
second data byte
host input byte
Figure 17: Debug Interface Timing Diagram
11.3 Debug Lock Bit
For software and/or access protection, a set of
lock bits can be written. This information is
contained in the Flash Information Page (see
Section 10.2.3.2), at location 0x000. The Flash
Information Page can only be accessed
through the debug interface. There are three
kinds of lock protect bits as described in this
section.
The lock size bits LSIZE[2:0] are used to
define which section of the flash memory
should be write protected, if any. The size of
the write protected area can be set to 0 (no
pages), 1, 2, 4, 8, 16, 24, or 32 KB (all pages),
starting from top of flash memory and defining
a section below this. Note that for CC2510F8,
CC2511F8, CC2510F16, and CC2511F16, the only
supported value for LSIZE[2:0]is 0 and 7
(all or no pages respectively).
The second type of lock protect bits is
BBLOCK, which is used to lock the boot sector
page (page 0 ranging from address 0x0000 to
0x03FF). When BBLOCK is set to 0, the boot
sector page is locked.
The third type of lock protect bit is DBGLOCK,
which is used to disable hardware debug
support through the Debug Interface. When
DBGLOCK is set to 0, almost all debug
commands are disabled.
When the Debug Lock bit, DBGLOCK, is set to
0 (see Table 44) all debug commands except
CHIP_ERASE,
READ_STATUS
and
GET_CHIP_ID are disabled and will not
function. The status of the Debug Lock bit can
be read using the READ_STATUS command
(see Section 11.4.2).
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Note that after the Debug Lock bit has
changed due to a Flash Information Page write
or a flash mass erase, a HALT, RESUME,
DEBUG_INSTR,
STEP_INSTR,
or
STEP_REPLACE command must be executed
so that the Debug Lock value returned by
READ_STATUS shows the updated Debug
Lock value. For example a dummy NOP
DEBUG_INSTR command could be executed.
The Debug Lock bit will also be updated after
a device reset so an alternative is to reset the
chip and reenter debug mode.
The CHIP_ERASE command will set all bits in
flash memory to 1. This means that after
issuing a CHIP_ERASE command the boot
sector will be writable, no pages will be writeprotected, and all debug commands are
enabled.
Bit
Field Name
7:5
4
3:1
0
The lock protect bits are written as a normal
flash write to FWDATA (see Section 12.3.2), but
the Debug Interface needs to select the Flash
Information Page first instead of the Flash
Main Page which is the default setting. The
Information Page is selected through the
Debug Configuration which is written through
the Debug Interface only. Refer to Section
11.4.1 and Table 46 for details on how the
Flash Information Page is selected using the
Debug Interface.
Table 44 defines the byte containing the flash
lock protection bits. Note that this is not an
SFR, but instead the byte stored at location
0x000 in Flash Information Page.
Description
Reserved, write as 0
BBLOCK
LSIZE[2:0]
DBGLOCK
Boot Block Lock
0
Page 0 is write protected
1
Page 0 is writeable, unless LSIZE is 000
Lock Size. Sets the size of the upper flash area which is write-protected. Byte sizes are listed below
000
32 KB (all pages)
001
24 KB
CC2510F32 and CC2511F32 only
010
16 KB
CC2510F32 and CC2511F32 only
011
8 KB
CC2510F32 and CC2511F32 only
100
4 KB
CC2510F32 and CC2511F32 only
101
2 KB
CC2510F32 and CC2511F32 only
110
1 KB
CC2510F32 and CC2511F32 only
111
0 bytes (no pages)
Debug lock bit
0
Disable debug commands
1
Enable debug commands
Table 44: Flash Lock Protection Bits Definition
11.4 Debug Commands
The debug commands are shown in Table 45.
Some of the debug commands are described
in further detail in the following sections
A debug status byte is read using the
READ_STATUS command. The format and
description of this debug status is shown in
Table 47.
11.4.1
The READ_STATUS command is used e.g.
for polling the status of flash chip erase after a
CHIP_ERASE command or oscillator stable
status required for debug commands HALT,
RESUME, DEBUG_INSTR, STEP_REPLACE,
and STEP_INSTR.
Debug Configuration
The
commands
WR_CONFIG
and
RD_CONFIG are used to access the debug
configuration data byte. The format and
description of this configuration data is shown
in Table 46
11.4.2
Debug Status
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11.4.3
Hardware Breakpoints
The debug command SET_HW_BRKPNT is
used to set a hardware breakpoint. The
CC2510Fx/CC2511Fx supports up to four
hardware breakpoints. When a hardware
breakpoint is enabled it will compare the CPU
address bus with the breakpoint. When a
match occurs, the CPU is halted.
Bit
Description
7:5
Unused
4:3
Breakpoint number; 0 - 3
2
Breakpoint enable
1:0
0
Disable
1
Enable
Reserved. Must be 00.
When issuing the SET_HW_BRKPNT debug
command, the external host must supply three
data bytes that define the hardware
breakpoint. The hardware breakpoint itself
consists of 18 bits while three bits are used for
control purposes. The format of the three data
bytes for the SET_HW_BRKPNT command is
as follows.
The second data byte consists of bits 15 - 8 of
the hardware breakpoint while the third data
byte consists of bits 7 - 0 of the hardware
breakpoint. This means that the second and
third data byte sets the CPU CODE address
where the CPU is halted.
The first data byte consists of the following:
11.4.4
Flash Programming
Programming of the on-chip flash is performed
via the debug interface. The external host
must initially send instructions using the
DEBUG_INSTR debug command to perform
the flash programming with the Flash
Controller as described in Section 12.3.
Command
Instruction Code
Description
CHIP_ERASE
0001 0100
Perform flash chip erase (mass erase). The debug interface will be enabled
and no parts of flash will be write-protected after issuing this command. Do not
use any other commands than READ_STATUS until mass erase has
completed. Return 1 status byte to host
WR_CONFIG
0001 1101
Write configuration data. Return 1 status byte to host. Refer to Table 46 for
details.
RD_CONFIG
0010 0100
Read configuration data. Return value set by WR_CONFIG command
GET_PC
0010 1000
Return value of 16-bit program counter
READ_STATUS
0011 0100
Read status byte. Refer to Table 47
SET_HW_BRKPNT
0011 1011
Set hardware breakpoint
HALT
0100 0100
Halt CPU operation. Return 1 status byte to host
RESUME
0100 1100
Resume CPU operation. To run this command, the CPU must have been
halted. Return 1 status byte to host
DEBUG_INSTR
0101 01yy
Run debug instruction. The supplied instruction will be executed by the CPU
without incrementing the program counter. To run this command, the CPU
must have been halted. Return 1 status byte to host.
yy: Number of bytes in the CPU instruction (see Table 37). Valid values are 01,
10, and 11
STEP_INSTR
0101 1100
Step CPU instruction. The CPU will execute the next instruction from program
memory and increment the program counter after execution. To run this
command, the CPU must have been halted. Return 1 status byte to host
STEP_REPLACE
0110 01 yy
Step and replace CPU instruction. The supplied instruction will be executed by
the CPU instead of the next instruction in program memory. The program
counter will be incremented after execution. To run this command, the CPU
must have been halted. Return 1 status byte to host.
yy: Number of bytes in the CPU instruction (see Table 37). Valid values are 01,
10, and 11
GET_CHIP_ID
0110 1000
Return value of 16-bit chip ID (PARTNUM:VERSION).
Table 45: Debug Commands
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Bit
Field Name
Description
7:4
3
2
1
0
Not used. Must be set to 0000
TIMERS_OFF
Disable timer operation (Timer 1/2/3/4). This overrides the
TIMER_SUSPEND bit and its function.
DMA_PAUSE
0
Do not disable timers
1
Disable timers
DMA pause
TIMER_SUSPEND
0
Enable DMA transfers
1
Pause all DMA transfers
Suspend timers (Timer 1/2/3/4). Timer operation is suspended for
debug instructions and if a step instruction is a branch. If not
suspended, these instructions would result an extra timer count
during the clock cycle in which the branch is executed
SEL_FLASH_INFO_PAGE
0
Do not suspend timers
1
Suspend timers
Select Flash Information Page in order to write flash lock bits (1 KB
lowest part of flash)
0
Select flash Main Page
1
Select Flash Information Page
Table 46: Debug Configuration
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Bit
Field Name
Description
7
CHIP_ERASE_DONE
Flash chip erase done
6
5
4
3
2
1
0
PCON_IDLE
CPU_HALTED
POWER_MODE_0
HALT_STATUS
DEBUG_LOCKED
OSCILLATOR_STABLE
STACK_OVERFLOW
0
Chip erase in progress
1
Chip erase done
PCON idle
0
CPU is running
1
CPU is idle (clock gated)
CPU halted
0
CPU running
1
CPU halted
Power Mode 0
0
Power Mode 1 - 3 selected
1
Power Mode 0 selected (active mode if the CPU is running)
Halt status. Returns cause of last CPU halt
0
CPU was halted by HALT debug command
1
CPU was halted by software or hardware breakpoint
Debug locked. Returns value of DBGLOCK bit
0
Debug interface is not locked
1
Debug interface is locked
Oscillators stable. This bit represents the status of the SLEEP.XSOC_STB
and SLEEP.HFRC_STB register bits.
0
Oscillators not stable
1
Oscillators stable
Stack overflow. This bit indicates when the CPU writes to DATA memory
space at address 0xFF, which is possibly a stack overflow
0
No stack overflow
1
Stack overflow
Table 47: Debug Status
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12
In
Peripherals
the
following
sub-sections,
each
CC2510Fx/CC2511Fx peripheral is described in
detail.
12.1 Power Management and Clocks
power supply to modules to avoid static
(leakage) power consumption and also by
using clock gating and turning off oscillators to
reduce dynamic power consumption.
This section describes the Power Management
Controller. The Power Management Controller
controls the use of active mode, power modes,
and clock control.
12.1.1
The CC2510Fx/CC2511Fx has one active mode
and four power modes, called PM0, PM1, PM2
and PM3, where PM3 has the lowest power
consumption. The different operating modes
are shown in Table 48.
Power Management Introduction
The CC2510Fx/CC2511Fx uses different operating
modes to allow low-power operation. Ultra-lowpower operation is obtained by turning off
Operating Mode
High-speed Oscillator
Low-speed Oscillator
Configuration
A
None
A
None
B
High speed
XOSC
B
Low power RCOSC
C
HS RCOSC
C
32.768 kHz XOSC
Digital Voltage
Regulator
CPU
Active
B and / or C
B or C
On
Running
PM0
B and / or C
B or C
On
Idle
PM1
A
B or C
On
Idle
PM2
A
B or C
Off
Idle
PM3
A
A
Off
Idle
Table 48: Operating Modes
Active mode: The full functional mode. The
voltage regulator to the digital core is on and
either the high speed RC oscillator or the high
speed crystal oscillator or both are running.
Either the low power RC oscillator or the
32.768 kHz crystal oscillator is running.
PM0: Same as active mode, but the CPU is
idle, meaning that no code is being executed.
PM1: The voltage regulator to the digital part is
on. Neither the high speed crystal oscillator nor
the high speed RC oscillator is running. Either
the low power RC oscillator or the 32.768 kHz
crystal oscillator is running. The system will go
to active mode on reset or an external interrupt
or when the Sleep Timer expires.
PM2: The voltage regulator to the digital core
is turned off. Neither the high speed crystal
oscillator nor the high speed RC oscillator is
running. Either the low power RC oscillator or
the 32.768 kHz crystal oscillator is running.
The system will go to active mode on reset or
an external interrupt or when the Sleep Timer
expires. The CC2511Fx will lose all USB state
information when PM2 is entered. Thus, PM2
should not be used with USB.
PM3: The voltage regulator to the digital core
is turned off. None of the oscillators are
running. The system will go to active mode on
reset or an external interrupt. The CC2511Fx will
lose all USB state information when PM3 is
entered. Thus, PM3 should not be used with
USB.
When an external interrupt occurs in PM1,
PM2, or PM3, or a Sleep Timer interrupt occur
in PM1 and PM2, active mode will be entered
and the code will start executing from where it
entered PM1/2/(3). Any enabled interrupt will
take the device from PM0 to active mode, and
also in this case the code will start executing
from where it entered PM0. A reset, however,
will take the chip from any of the four power
modes to active mode, but the code will start
executing from the start of the program.
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12.1.2
Active Mode and Power Modes
The different operating modes are described in
detail in the five following sections.
12.1.2.1
Active Mode
This is the full functional mode of operation
where the CPU, peripherals, and RF
transceiver are active. The voltage regulator to
the digital core is on and either the high speed
RC oscillator or the high speed crystal
oscillator or both are running together with
either the Low power RC oscillator or the
32.768 kHz crystal oscillator.
12.1.2.2
PM0
If the PCON.IDLE bit is set to 1 while in active
mode, the CPU will be idle (clock gated) until
any interrupt occur. All other peripherals will
function as normal while the CPU is halted.
12.1.2.3
PM1
In PM1, the high speed oscillators (high speed
XOSC and HS RCOSC) are powered down
thereby halting the CPU and peripherals. The
digital voltage regulator, the power-on reset,
external interrupts, the low power RC oscillator
or the 32.768 kHz crystal oscillator and Sleep
Timer peripherals are active. I/O pins retain the
I/O mode and output value set before entering
PM1. When PM1 is entered, a power down
sequence is run.
PM1 is used when the expected time until a
wakeup event is relatively short since PM1
uses a fast power down/up sequence.
12.1.2.4
This power mode is used to achieve the
operating mode with the lowest power
consumption. In PM3 all internal circuits that
are powered from internal voltage regulators
are turned off.
Reset (POR, or external) and external I/O port
interrupts are the only functions that are
operating in this mode. I/O pins retain the I/O
mode and output value set before entering
PM3. A reset or external interrupt condition will
wake the device and make it enter active
mode. The content of RAM and registers is
preserved in this mode. PM3 uses the same
power down/up sequence as PM2.
PM3 is used to achieve ultra low power
consumption when waiting for an external
event.
When entering active mode from PM1, PM2, or
PM3, the high-speed oscillators, which where
running when entering PM{1 - 3}, are started. If
the high speed crystal oscillator is selected as
source for the system clock (CLKCON.OSC=0),
the system clock will use the HS RCOSC as
clock source until the high speed crystal
oscillator is stable (SLEEP.XOSC_STB=1).
12.1.3
Power Management Control
The required power mode is selected by the
SLEEP.MODE setting. Setting the IDLE bit in
the PCON SFR after setting the MODE bits,
makes the CC2511Fx/CC2511Fx enter the
selected power mode. The following procedure
must be followed to be able to safely put the
device into one of the power modes PM{1 - 3}:
// Pseudo Code
PM2
SLEEP.MODE = PM{1-3}
PM2 has the second lowest power
consumption. In PM2, the power-on reset,
external interrupts, the low power RC oscillator
or the 32.768 kHz crystal oscillator and Sleep
Timer peripherals are active. I/O pins retain the
I/O mode and output value set before entering
PM2. The content of RAM and most registers
is preserved in this mode (see Table 31, Table
32, and Table 33). All other internal circuits are
powered down. When PM2 is entered, a power
down sequence is run.
PM2 is typically entered when using the Sleep
Timer as the wakeup event. Please see
Section 12.8.1 for minimum sleep time when
using the Sleep Timer.
12.1.2.5
PM3
In PM3 the internal voltage regulator and all
oscillators are turned off.
NOP();
NOP();
NOP();
If (SLEEP_MODE != 0)
PCON.IDLE = 1;
An interrupt from port pins or Sleep Timer (not
PM3), or a power-on reset will wake the device
and bring it into active mode by resetting the
MODE bits and clear the IDLE bit. Since an
interrupt can occur before the device has
actually entered PM{1 - 3}, it is necessary to
clear the MODE bits before returning from all
ISRs associated with interrupts that can be
used to wake the device from PM{1 - 3}. It
should be noted that all port interrupts and
Sleep Timer interrupt are blocked when
SLEEP.MODE is different from 00, thus the time
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between
setting
SLEEP.MODE≠00
and
asserting PCON.IDLE should be as short as
possible. The SLEEP.MODE will be cleared to
00 by HW when power mode is entered, thus
interrupts are enabled during power modes. All
interrupts not to be used to wake up from
power modes must be disabled before setting
SLEEP.MODE≠00.
selected as clock source for the system clock,
the time between succeeding PM{1 - 3} modes
(i.e. the time in active mode) must be larger
than the startup time for the HS XOSC (see
Table 11 and Table 12) plus the initial
calibration time for the low power RCOSC
(Table 14).
It should be noted that after enabling the HS
XOSC (CLKCON.OSC=0) one has to ensure
that
the
HS
XOSC
is
stable
(SLEEP.XOSC_STB=1)
before
entering
PM{1 - 3}.
12.1.4
Power Management Registers
This section describes the Power Management
registers. All register bits retain their previous
values when entering PM2 or PM3 unless
otherwise stated.
If the low power RCOSC is enabled
(CLKCON.OSC32K=1) and the HS XOSC is
PCON (0x87) - Power Mode Control
Bit
Reset
R/W
Description
7:2
0
R/W
Not used
1
0
R0/W1
Reserved. Must be set to 0. Failure to do so will stop CPU from operating.
0
R0/W1
H0
Power mode control. Writing a 1 to this bit forces CC2510Fx/CC2511Fx to enter the
power mode set by SLEEP.MODE. This bit is always read as 0.
0
Field Name
IDLE
All interrupt requests will clear this bit and CC2510Fx/CC2511Fx will reenter active
mode.
Note: See Section 12.1.3 for details on how this bit should be used.
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CC2510Fx / CC2511Fx
SLEEP (0xBE) - Sleep Mode Control
Bit
Field Name
Reset
R/W
Description
7
USB_EN
0
R/W
USB Enable (CC2511Fx). This bit is unused for CC2510Fx
0
Disable (Setting this bit to 0 will reset the USB controller)
1
Enable
This bit will be 0 when returning from PM2 and PM3
6
5
4:3
2
1:0
XOSC_STB
HFRC_STB
RST[1:0]
OSC_PD
MODE[1:0]
0
0
XX
1
00
R
R
R
R/W
H0
R/W
High speed crystal oscillator (fXOSC) stable status
0
Oscillator is not powered up or not yet stable
1
Oscillator is powered up and stable
High speed RC oscillator (HS RCOSC) stable status
0
Oscillator is not powered up or not yet stable
1
Oscillator is powered up and stable
Status bit indicating the cause of the last reset. If there are multiple resets, the
register will only contain the last event.
00
Power-on reset or Brown-out reset
01
External reset
10
Watchdog timer reset
High speed XOSC and HS RCOSC power down setting. The bit is cleared if the
CLKCON.OSC bit is toggled. If there is a calibration in progress (of the low power
RC oscillator and/or the HS RC oscillator) and one attempts to set this bit, the
oscillator not selected by the CLKCON.OSC bit will be powered down, and the bit
will be set, at the end of calibration.
0
Both oscillators powered up
1
Oscillator not selected by CLKCON.OSC bit powered down
Power mode setting
00
PM0
01
PM1
10
PM2
11
PM3
These bits will be set to 00 when entering PM{1 - 3}.
Note: It is necessary to clear the MODE bits before returning from all ISRs
associated with interrupts that can be used to wake the device from PM{1 - 3}.
See Section 12.1.3 for details
12.1.5
Oscillators and Clocks
The CC2510Fx/CC2511Fx has one internal
system clock. The source for the system clock
can be either a high speed RC oscillator or a
high speed crystal oscillator. The crystal
oscillator for CC2510Fx operates at 24 - 27 MHz
while the crystal oscillator for CC2511Fx
operates at 48 MHz. The 24 - 27 MHz clock is
used directly as the system clock for CC2510Fx.
On CC2511Fx, the 48 MHz clock is used by the
USB Controller only while a derived 24 MHz
clock is used as the system clock. The source
for the system clock is selected by the
CLKCON.OSC bit.
crystal oscillator. This is controlled by the
CLKCON.OSC32K bit.
The choice of oscillator allows a trade-off
between high-accuracy in the case of the
crystal oscillator and low power consumption
when the RC oscillator is used. Note that
operation of the RF transceiver requires that
the high speed crystal oscillator is used.
Note: The high speed crystal oscillator
must be stable (SLEEP.XOSC_STB=1)
before using the radio.
There is also one 32 kHz clock source that can
either be a low power RCOSC or a 32.768 kHz
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CC2510Fx / CC2511Fx
12.1.5.1
High Speed Oscillators
Two high speed oscillators are present in the
device:
• High speed crystal oscillator (24 - 27
MHz for CC2510Fx and 48 MHz for
CC2511Fx)
• High speed RC oscillator (12 - 13.5 MHz
for CC2510Fx and 12 MHz for CC2511Fx)
The high speed crystal oscillator startup time
may be too long for some applications, and the
device can therefore run on the high speed
RCOSC until the crystal oscillator is stable.
The HS RCOSC consumes less power than
the crystal oscillator, but since it is not as
accurate as the crystal oscillator it can not be
used for RF transceiver operation.
The CLKCON.OSC bit selects the source of the
system clock (high speed crystal oscillator or
high speed RC oscillator). The system clock
will not change clock source before the
selected clock source is stable (indicated by
SLEEP.XOSC_STB and SLEEP.HFRC_STB). It
should be noted that once the clock source
change has been initiated the clock source
should not be changed or updated again until
the clock source change has taken place.
Note: When changing system clock source
from HS XOSC to HS RCOSC, there might
be a delay from the assertion of
SLEEP.HFRC_STB until the actual change
of the system clock source (assertion of
CLKCON.OSC). This delay is present if the
HS RCOSC and/or low power RCOSC is
being calibrated when the system clock
source change is being initiated.
When SLEEP.OSC_PD is 0, both oscillators
are powered up and running. Be aware that
SLEEP.OSC_PD is cleared if the CLKCON.OSC
bit is toggled.
A calibration of the HS RCOSC will be initiated
by selecting the HS XOSC as system clock
source (CLKCON.OSC is set to 0). The
calibration will only be performed once. It is
not possible to enter PM{1 - 3}, change system
clock source back to HS RCOSC, or power
down the HS RCOSC before the calibration is
completed. Note that even if the calibration of
the HS RCOSC is completed, a calibration of
the low power RC oscillator might still be in
progress and changing system clock source
back to HS RCOSC will not be possible before
also this calibration has completed.
If SLEEP.OSC_PD=0, the HS RCOSC will run
on the calibrated value once the calibration is
completed (see Table 15 for calibration time).
If SLEEP.OSC_PD=1, the HS RCOSC will be
turned off after calibration, but the calibration
value will be stored and used when the HS
RCOSC is started again. In order to calibrate
the HS RCOSC regularly (if so found
necessary based on the drift parameters listed
in Table 15) one should switch between using
the HS RCOSC and the high speed crystal
oscillator as system clock source.
If CLKCON.OSC is set to 0 when entering
PM{1 - 3}, the HS RCOSC will be calibrated
once when returning to active mode (the
calibration will start once the HS XOSC is
stable and act as the clock source for the
system clock).
The oscillator not selected as the system clock
source will be set in power-down mode by
setting SLEEP.OSC_PD to 1 (the default state).
SLEEP.OSC_PD should not be set to 1 before
the oscillator selected as the system clock
source
is
reported
stable
(SLEEP.HFRC_STB=1
or
SLEEP.XOSC_STB=1). Please note the
minimum requirement on high speed crystal
oscillator power down guard time in all modes
of operation for CC2510Fx, see Table 11. The
HS RCOSC may be turned off when the high
speed crystal oscillator has been selected as
system clock source and vice versa.
Note: HS RCOSC calibration value gets
reset to its default value upon waking up
from PM{2 - 3}, meaning that any previous
calibration result is lost.
12.1.5.2
System Clock Speed and Radio
Operation of the RF transceiver requires that
the high speed crystal oscillator is used. The
CLKCON.CLKSPD setting will limit the
maximum data rate, as shown in Table 49.
Note
that
when
using
FEC
(MDMCFG1.FEC_EN=1)
CLKCON.CLKSPD
must be set to 000.
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CC2510Fx / CC2511Fx
32.768 kHz crystal oscillator. Refer to 6.5 and
6.6 for characteristics of these oscillators.
Maximum Data Rate [kBaud]
CLKCON.CLKSPD
MSK
GFSK
2-FSK
000
500
250
500
001
500
250
500
010
500
250
500
011
500
250
500
100
400
250
400
101
200
200
200
110
100
100
100
111
50
50
50
The CLKCON.OSC32K bit selects the source of
the 32 kHz clock. This bit must only be
changed while using the HS RCOSC as the
system clock source. If CLKCON.OSC32K=1,
changing the system clock source to the HS
XOSC will initiate the calibration of the low
power RC oscillator. The calibration of the low
power RC oscillator is continuously performed
as long as CLKCON.OSC=0 and the device is
in active mode or PM0. The result of the
calibration is a RC clock running at 32 - 36
kHz for CC2510Fx and 32 kHz for CC2511Fx.
Table 49: System Clock Speed vs. Data Rate
12.1.5.3
The low power RCOSC calibration takes
approximately 2 ms. Except for the initial
calibration (first calibration after the HS XOSC
was set as source for the system clock
(CLKCON.OSC=0)), a calibration will be
aborted if one of the following actions is
initiated by SW:
Low Speed Oscillators (32 kHz
clock source)
Two low speed oscillators are present in the
device:
• Low speed crystal oscillator (32.768
kHz)
a) Switching the clock source for the
system clock from HS XOSC to HS
RCOSC by setting CLKCON.OSC=1
• Low power RC oscillator (32 - 36 kHz
for CC2510Fx and 32 kHz for CC2511Fx)
b) Entering PM{1 - 3}.
The low speed crystal oscillator is designed to
operate at 32.768 kHz and provide a stable
clock signal for systems requiring time
accuracy. The low power RC oscillator run at
fXOSC / 750 for CC2510Fx and fXOSC / 1500 for
CC2511Fx, when calibrated. The calibration can
only take place when the low power RC
oscillator is running and the high speed crystal
oscillator is enabled and stable, and is initiated
by selecting the HS XOSC as the clock source
for the system clock (CLKCON.OSC=0). The
low power RC oscillator should be used to
reduce cost and power consumption
compared to the 32.768 kHz crystal oscillator
solution. The two low speed oscillators can not
be operated simultaneously.
If a) or b) is initiated during the initial
calibration, the calibration will complete before
a) or b) will take place (i.e., the HS XOSC will
continue as the clock source for the system
clock for up to 2 ms before the switching takes
place or PM{1 - 3} is entered). If a) or b) is
initiated after the initial calibration has
completed, there will be a delay of typically
130 µs from SW initiates a) or b), until the
calibration is being aborted and the system
clock source is changed or PM{1 - 3} is
entered (see Figure 18).
Note: During the initial calibration a) or b)
can only be initiated once.
After the initial calibration has completed
and a) or b) is initiated, one must not try to
initiate a) or b) again within the next 130
µs.
By default, after a reset, the low power RC
oscillator is enabled and selected as the 32
kHz clock source. The RC oscillator consumes
less power, but is less accurate than the
2 ms
a
HS XOSC selected as
clock source for the
a:
system clcok
b:
2 ms
b
a
2 ms
b
CLKCON.OSC=0
130 us
SW tries to switch the clock source for the system clock (CLKCON.OSC=1) or
enter PM{1 - 3}
System clock source is being switched or PM{1 - 3} is entered
Do not attempt to repeat a) and/or b) during this period
Figure 18: Low Power RCOSC Calibration
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CC2510Fx / CC2511Fx
CLKCON (0xC6) - Clock Control
Bit
Field Name
Reset
R/W
Description
7
OSC32K
1
R/W
32 kHz clock oscillator select. The HS RCOSC must be clock source for the
system clock (CLKCON.OSC=1) when this bit is to be changed.
0
32.768 kHz crystal oscillator
1
Low power RC oscillator (32 - 36 kHz for CC2510Fx and 32 kHz for
CC2511Fx)
Note: This bit is not retained in PM2 and PM3. After re-entry to active mode from
one of these power modes this bit will be at the reset value 1.
6
OSC
1
R/W
System clock oscillator select.
0
High speed crystal oscillator
1
HS RC oscillator
If the selected oscillator is not already powered up when this bit is set/cleared, it
will be powered up by selecting it.
This setting will only take effect when the selected oscillator is powered up and
stable and when the calibration of the HS RCOSC and initial calibration of the
low power RC oscillator is completed.
Note: It is not possible to change from high speed RC oscillator to high speed
crystal oscillator when SLEEP.MODE≠00
5:3
TICKSPD[2:0]
001
R/W
Timer tick speed setting. The value of TICKSPD cannot be higher than CLKSPD.
CLKCON.OSC=0
HS XOSC used as clock source
for system clock
CLKCON.OSC=1
Calibrated HS RCOSC used as
clock source for system clock
000
fRef
26 MHz
NA
NA
001
fRef /2
13 MHz
fRef /2
13 MHz
010
fRef /4
6.5 MHz
fRef /4
6.5 MHz
011
fRef /8
3.25 MHz
fRef /8
3.25 MHz
100
fRef /16
1.625 MHz
fRef /16
1.625 MHz
101
fRef /32
812.5 kHz
fRef /32
812.5 kHz
110
fRef /64
406.25 kHz
fRef /64
406.25 kHz
111
fRef /128
203.125 kHz
fRef /128
203.125 kHz
fRef = fxosc for CC2510Fx and fRef = fxosc/2 for CC2511Fx
Numbers above are for CC2510Fx with fxosc = 26 MHz
2:0
CLKSPD[2:0]
001
R/W
System clock speed setting. When a new CLKSPD value is written, the new
setting is read when the clock has changed.
CLKCON.OSC=0
HS XOSC used as clock source
for system clock
CLKCON.OSC=1
Calibrated HS RCOSC used as
clock source for system clock
000
fRef
26 MHz
NA
NA
001
fRef /2
13 MHz
fRef /2
13 MHz
010
fRef /4
6.5 MHz
fRef /4
6.5 MHz
011
fRef /8
3.25 MHz
fRef /8
3.25 MHz
100
fRef /16
1.625 MHz
fRef /16
1.625 MHz
101
fRef /32
812.5 kHz
fRef /32
812.5 kHz
110
fRef /64
406.25 kHz
fRef /64
406.25 kHz
111
fRef /128
203.125 kHz
fRef /128
203.125 kHz
fRef = fxosc for CC2510Fx and fRef = fxosc/2 for CC2511Fx
Numbers above are for CC2510Fx with fxosc = 26 MHz
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CC2510Fx / CC2511Fx
12.1.6
Timer Tick Generation
The power management controller generates
a tick or enable signal for the peripheral
timers, thus acting as a prescaler for the
timers. This is a global clock division for Timer
1, Timer 2, Timer 3, and Timer 4. The tick
speed is programmed from 0.203 to 26 MHz
for CC2510Fx assuming a 26 MHz crystal or
from 0.1875 to 24 MHz for CC2511Fx by setting
the CLKCON.TICKSPD register appropriately.
The XDATA memory locations 0xFDA2 0xFEFF (350 bytes) will lose all data when
PM2 or PM3 is entered. These locations will
contain undefined data when active mode is
re-entered.
The registers which retain their contents are
the CPU registers, peripheral registers and RF
registers, unless otherwise specified for a
given register bit field. Switching to power
modes PM2 and PM3 appears transparent to
software with the following exception:
Note: CLKCON.TICKSPD cannot be set
higher than CLKCON.CLKSPD.
12.1.7
• Watchdog timer 15-bit counter is reset
to 0x0000 when entering PM2 or PM3
• HS RCOSC calibration value gets reset
to its default value upon waking up from
PM2 and PM3.
Data Retention
In PM2 and PM3, power is removed from most
of the internal circuitry. However, parts of
SRAM will retain its contents. The content of
internal registers is also retained in PM2 and
PM3, with some exceptions (see Table 31,
Table 32, and Table 33).
The XDATA memory locations 0xF000 0xFFFF (4096 bytes) retain data in PM2 and
PM3. Please note the following exception:
12.1.8
I/O and Radio
I/O port pins P1_0 and P1_1 do not have
internal pull-up/pull-down resistors. These pins
should therefore be set as outputs or pulled
high/low externally to avoid leakage current.
To save power, the radio should be turned off
when it is not used.
12.2 Reset
The CC2510Fx/CC2511Fx has four reset sources.
The following events generate a reset:
• Forcing RESET_N input pin low
• A power-on reset condition
• A brown-out reset condition
• Watchdog timer reset condition
The initial conditions after a reset are as
follows:
• I/O pins are configured as inputs with
pull-up, except P1_0 and P1_1.
• CPU program counter is loaded with
0x0000 and program execution starts at
this address
• All peripheral registers are initialized to
their reset values (refer to register
descriptions)
• Watchdog timer is disabled
12.2.1 Power On Reset and Brown Out
Detector
The CC2510Fx/CC2511Fx includes a Power On
Reset (POR) providing correct initialization
during device power-on. Also included is a
Brown Out Detector (BOD) operating on the
regulated 1.8 V digital power supply only, The
BOD will protect the memory contents during
supply voltage variations which cause the
regulated 1.8 V power to drop below the
minimum level required by flash memory and
SRAM.
When
power
is
initially
applied
to
the
CC2510Fx/CC2511Fx the Power On Reset (POR)
and Brown Out Detector (BOD) will hold the
device in reset state until the supply voltage
reaches above the Power On Reset and
Brown Out voltages.
Figure 19 shows the POR/BOD operation with
the 1.8 V (typical) regulated supply voltage
together with the active low reset signals
BOD_RESET and POR_RESET shown in the
bottom of the figure (note that these signals
are not available but are included on the figure
for illustration purposes).
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
The cause of the last reset can read from the
register bits SLEEP.RST. It should be noted
that a BOD reset will be read as a POR reset.
1.8V REGULATED
VOLT
UNREGULATED
BOD RESET ASSERT
POR RESET DEASSERT RISING VDD
POR RESET ASSERT FALLING VDD
0
POR OUTPUT
BOD RESET
POR RESET
X
X
X
X
X
X
Figure 19: Power-On-Reset and Brown Out Detector Operation
12.3 Flash Controller
The CC2510Fx/CC2511Fx contains 8, 16 or 32 KB
flash memory for storage of program code.
The flash memory is programmable from the
user software and through the debug interface.
See Table 27 on Page 31 for flash memory
size options.
The Flash Controller handles writing to the
embedded flash memory and erasing of the
same memory. The embedded flash memory
consists of 8, 16, or 32 pages (each page is
1024 bytes) depending on the total flash size.
The Flash
features:
Controller
has
the
following
• 16-bit word programmable
When performing page erase operations, the
flash memory page to be erased is addressed
through the register bits FADDRH[5:1].
Note the difference in addressing the flash
memory; when accessed by the CPU to read
code or data, the flash memory is byteaddressable. When accessed by the Flash
Controller, the flash memory is wordaddressable, where a word consists of 16 bits.
The next sections describe the procedures for
flash write and flash page erase in detail.
• Page erase
• Lock bits for write-protection and code
security
• Flash page erase time: 20 ms
• Flash chip erase time: 200 ms
• Flash write time (2 bytes): 20 µs
• Auto power-down during low-frequency
CPU clock read access (divided clock
source, CLKCON.CLKSPD)
12.3.1
When performing write operations, the flash
memory is word-addressable using a 14-bit
address written to the address registers
FADDRH:FADDRL.
Flash Memory Organization
The flash memory is divided into 8, 16, or 32
flash pages consisting of 1 KB each. A flash
page is the smallest erasable unit in the
memory, while a 16-bit word is the smallest
writable unit that may be addressed through
the Flash Controller.
12.3.2
Flash Write
Data is written to the flash memory by using a
program command initiated by writing a 1 to
FCTL.WRITE. Flash write operations can
program any number of words in the flash
memory, single words or block of words in
sequence starting at the address set by
FADDRH:FADDRL. A bit in a word can be
changed from 1 to 0, but not from 0 - 1 (writing
a 1 to a bit that is 0 will be ignored). The only
way to change a 0 to a 1 is by doing a page
erase or chip erase through the debug
interface, as the erased bits are set to 1.
A write operation is performed using one out of
two methods;
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• Through DMA transfer
• Through CPU SFR access
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
The DMA transfer method is the preferred way
to write to the flash memory.
A write operation is initiated by writing a 1 to
FCTL.WRITE. The address to start writing at is
given by FADDRH:FADDRL. During each single
write operation FCTL.SWBSY is set high.
During a write operation, the data written to the
FWDATA register is forwarded to the flash
memory. The flash memory is 16-bit wordprogrammable, meaning data is written as 16bit words. The first byte written to FWDATA is
the LSB of the 16-bit word. The actual writing
to flash memory takes place each time two
bytes have been written to FWDATA, meaning
that the number of bytes written to flash must
be a multiple of two.
0x7FFE
PAGE 32
.
.
.
0x0BFF
.
.
.
PAGE 2
.
.
.
0x0800
0x0801
.
.
.
0x03FE
0x03FF
.
.
.
0x0000
PAGE 0
The FCTL.SWBSY bit must be 0 before
accessing the flash after a flash write,
otherwise an access violation occurs. This
means that FCTL.SWBSY must be 0 before
program execution can continue from a
location in flash memory.
DMA Flash Write
When using the DMA to write to flash, the data
to be written is stored in the XDATA memory
space (RAM or flash). A DMA channel should
be configured to have the location of the stored
data as source address and the Flash Write
Data register, FWDATA, as the destination
address. The DMA trigger event FLASH
should be selected (TRIG[4:0]=10010).
Please see Section 12.5 for more details
regarding DMA operation. Thus the Flash
Controller will trigger a DMA transfer when the
Flash Write Data register, FWDATA, is ready to
receive new data.
0x7C01
0x0BFE
When a flash write operation is executed from
RAM, the CPU continues to execute code from
the next instruction after initiation of the flash
write operation (FCTL.WRITE=1).
12.3.2.1
0x7FFF
0x7C00
program code must reside in the area starting
from address 0xF000 in CODE memory space
(unified) and not exceed maximum range for
the device in use (F8, F16, or F32). When using
the DMA to write to flash, the code can be
executed from within flash memory.
.
.
.
0x0001
Figure 20: Flash Address (in unified memory
space)
When accessed by the Flash Controller, the
flash memory is word-addressable. Each page
in flash consists of 512 words, addressed
through
FADDRH[0]:FADDRL[7:0].
FADDRH[5:1] is used to indicate the page
number. That means that if one wants to write
to the byte in flash mapped to address 0x0BFE
(see Figure 20), FADDRH:FADDRL should be
0x05FF (page 2, word 511).
The CPU will not be able to access the flash,
e.g. to read program code, while a flash write
operation is in progress. Therefore the
program code executing the flash write must
be executed from RAM, meaning that the
When the DMA channel is armed, starting a
flash write by setting FCTL.WRITE to 1 will
trigger the first DMA transfer.
Figure 21 shows an example on how a DMA
channel is configured and how a DMA transfer
is initiated to write a block of data from a
location in XDATA to flash memory.
The DMA channel should be configured to
operate in single transfer mode, the transfer
count should be equal the size of the data
block to be transferred (must be a multiple of
2), and each transfer should be a byte. Source
address should be incremented by one for
each transfer, while the destination address
should be fixed.
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CC2510Fx / CC2511Fx
Setup DMA channel:
SRCADDR=<XDATA location>
DESTADDRR=FWDATA
VLEN=0
LEN=<block size>
WORDSIZE=byte
TMODE=single mode
TRIG=FLASH
SRCINC=yes
DESTINC=no
IRQMASK=yes
M8=0
PRIORITY=high
Setup flash address
Arm DMA Channel
Start flash write
Figure 21: Flash Write using DMA
When performing DMA flash write while
executing code from within flash memory, the
instruction that triggers the first DMA trigger
event FLASH (TRIG[4:0]=10010) must be
aligned on a 2-byte boundary. Figure 22 shows
an example of code that correctly aligns the
instruction for triggering DMA (Note that this
code is IAR specific). The code below is
shown for CC2510Fx, but will also work for
CC2511Fx if the include file is being replaced by
ioCC2511.h
; Write flash and generate FLASH DMA trigger
; Code is executed from flash memory
;
#include “ioCC2510.h”
MODULE flashDmaTrigger.s51
RSEG RCODE (1)
PUBLIC halFlashDmaTrigger
FUNCTION halFlashDmaTrigger, 0203H
halFlashDmaTrigger:
ORL FCTL, #0x02;
RET;
END;
Figure 22: DMA Flash Write Executed from within Flash Memory
12.3.2.2
CPU Flash Write
The CPU can also write directly to the flash
when executing program code from RAM using
unified memory space. The CPU writes data to
the Flash Write Data register, FWDATA. The
flash memory is written each time two bytes
have been written to FWDATA, if a write has
been enabled by setting FCTL.WRITE to 1.
The CPU can poll the FCTL.SWBSY status to
determine when the flash is ready for two new
bytes to be written to FWDATA.
Note that there exist a timeout period of 40 μs
for writing one flash word to FWDATA, thus
writing two bytes to the FWDATA register has
to end within 40 μs after FCTL.SWBSY went
low and also within 40 μs after a write has
been initiated by writing a 1 to FCTL.WRITE
(see Figure 24). Failure to do so will clear the
FCTL.BUSY bit. FADDRH:FADDRL will contain
the address of the location where the write
operation failed. A new write operation can be
started by setting FCTL.WRITE to 1 again and
write two bytes to FWDATA. If one wants to do
the whole write operation over again and not
just start from where it failed, one has to erase
the page, writing the start address to
FADDRH:FADDRL, and setting FCTL.WRITE
to 1 (see Section 12.3.3).
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CC2510Fx / CC2511Fx
The steps required to start a CPU flash write
operation are shown in Figure 23. Note that
code must be run from RAM in unified memory
space.
Disable interrupts
YES
FCTL.BUSY=1?
NO
Setup FCTL, FWT,
FADDRH, FADDRL
Write two bytes to
FWDATA
NO
YES
FCTL.SWBSY=1?
Transfer
Completed?
NO
YES
Figure 23: CPU Flash Write Executed from RAM
FCTL.SWBSY
FCTL.BUSY
Write two bytes
to FWDATA
(D0 and D1)
Write two bytes
to FWDATA
40 µs
Set FCTL.WRITE = 1
FADDRH:FADDRL = n
Write two bytes
to FWDATA
40 µs
Write D0 and D1 to
flash addres n
40 µs
FADDRH:FADDRL = n + 1
Write D2 and D3 to
flash address n + 1
FADDRH:FADDRL = n + 2
Write D4 and D5 to
flash address n + 2
Write operation failed due
to a timeout.
Figure 24. Flash Write Timeout
12.3.3
Flash Page Erase
Note: If flash erase operations are
performed from within flash memory and
the watchdog timer is enabled, a watchdog
timer interval must be selected that is
longer than 20 ms, the duration of the flash
page erase operation, so that the CPU will
manage to clear the watchdog timer.
After a flash page erase, all bytes in the
erased page are set to 1.
A page erase is initiated by setting
FCTL.ERASE to 1. The page addressed by
FADDRH[5:1] is erased when a page erase is
initiated. Note that if a page erase is initiated
simultaneously with a page write, i.e.
FCTL.WRITE is set to 1, the page erase will be
performed before the page write operation.
The FCTL.BUSY bit can be polled to see when
the page erase has completed.
The steps required to perform a flash page
erase from within flash memory are outlined in
Figure 25.
Note that, while executing program code from
within flash memory, when a flash erase or
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CC2510Fx / CC2511Fx
write operation is initiated, program execution
will resume from the next instruction when the
Flash Controller has completed the operation.
The flash erase operation requires that the
instruction that starts the erase i.e. writing to
; Erase page
; Assumes 26
;
CLR
C1:
MOV
JB
MOV
MOV
MOV
NOP
RET
FCTL.ERASE is followed by a NOP instruction
as shown in the example code. Omitting the
NOP instruction after the flash erase operation
will lead to undefined behavior.
1 in flash memory
MHz system clock is used
EA
A,FCTL
ACC.7,C1
FADDRH,#02h
FWT,#2Ah
FCTL,#01h
; Mask interrupts
; Wait until flash controller is ready
;
;
;
;
;
Setup flash address (FADDRH[5:1]=1)
Setup flash timing
Erase page
Must always execute a NOP after erase
Continues here when flash is ready
Figure 25: Flash Page Erase Performed from Flash Memory
12.3.4
Flash DMA trigger
When the DMA channel is armed and the
FLASH trigger selected TRIG[4:0]=10010,
starting a flash write by setting FCTL.WRITE
to 1 will trigger the first DMA transfer. The
following DMA transfers will be triggered by
the Flash Controller when the Flash Write
Data register, FWDATA, is ready to receive new
data.
12.3.5
Flash Write Timing
The Flash Controller contains a timing
generator, which controls the timing sequence
of flash write and erase operations. The timing
generator uses the information set in the Flash
Write Timing register, FWT.FWT[5:0], to set
the internal timing. FWT.FWT[5:0] must be
set to a value according to the currently
selected system clock frequency.
The value used for FWT.FWT[5:0] is given by
the following equation:
FWT =
21000 ⋅ F
16 ⋅ 109
where F is the system clock frequency. The
initial value held in FWT.FWT[5:0] after a
reset is 0x11, which corresponds to 13 MHz
system clock frequency (calibrated HS
RCOSC frequency for CC2510Fx when using a
26 MHz XOSC).
12.3.6
Flash Controller Registers
The Flash Controller registers are described in
this section.
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CC2510Fx / CC2511Fx
FCTL (0xAE) - Flash Control
Bit
Field Name
Reset
R/W
Description
7
BUSY
0
R
Indicates that write or erase is in operation when set to 1
6
SWBSY
0
R
Indicates that a flash write is in progress. This byte is set to 1 after two bytes
has been written to FWDATA.
Do not write to FWDATA register while this bit is set.
5
4
CONTRD
3:2
1
WRITE
-
R0
Not used
R/W
0
Continuous read enable
0
Disable. To avoid wasting power, continuous read should only be enabled
when needed
1
Enable. Reduces internal switching of read enables, but greatly increases
power consumption.
-
R0
Not used
0
R0/
W
When set to 1, a program command used to write data to flash memory is
initiated.
If ERASE is set to 1at the same time as this bit is set to 1, a page erase of the
whole page addressed by FADDRH[6:1] is performed before the write.
This bit will be 0 when returning from PM2 and PM3
0
ERASE
0
R0/
W
Page Erase. Erase page given by FADDRH[5:1].
This bit will be 0 when returning from PM2 and PM3
FWDATA (0xAF) - Flash Write Data
Bit
Field Name
Reset
R/W
Description
7:0
FWDATA[7:0]
0x00
R/W
If FCTL.WRITE is set to 1, writing two bytes in a row to this register starts the
actual writing to flash memory. FCTL.SWBSY will be 1 during the actual flash
write
FADDRH (0xAD) - Flash Address High Byte
Bit
Field Name
7:6
5:0
FADDRH[5:0]
Reset
R/W
Description
0
R/W
Not used
000000
R/W
Page address / High byte of flash word address
Bits 5:1 will select which page to access.
FADDRL (0xAC) - Flash Address Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
FADDRL[7:0]
0x00
R/W
Low byte of flash address
FWT (0xAB) - Flash Write Timing
Bit
Field Name
7:6
5:0
FWT[5:0]
Reset
R/W
Description
0
R/W
Not used
0x11
R/W
Flash Write Timing. Controls flash timing generator.
FWT =
21000 ⋅ F , where F is the system clock frequency (see Section 12.3.5)
16 ⋅ 10 9
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CC2510Fx / CC2511Fx
12.4 I/O Ports
Note: P0_6 and P0_7 do not exist on CC2511Fx.
The CC2511Fx has 19 digital input/output pins
available and the ADC inputs A6 and A7 can
not be used. Apart from this, all information in
this section applies to both CC2511Fx and
CC2510Fx. For all registers in this section, an x
in the register name can be replaced by 0, 1,
or, 2, referring to the port number, if nothing
else is stated.
The CC2510Fx has 21 digital input/output pins
that can be configured as general purpose
digital I/O or as peripheral I/O signals
2
connected to the ADC, Timers, I S, or USART
peripherals. The usage of the I/O ports is fully
configurable from user software through a set
of configuration registers.
The I/O ports have the following key features:
• 21 digital input/output pins
• General purpose I/O or peripheral I/O
• Pull-up or pull-down capability on inputs,
except on P1_0 and P1_1.
• External interrupt capability
The external interrupt capability is available on
all 21 I/O pins. Thus, external devices may
generate interrupts if required. The external
interrupt feature can also be used to wake up
from all four power modes (PM{0 - 3}).
12.4.1
General Purpose I/O
When used as general purpose I/O, the pins
are organized as three 8-bit ports, port 0, 1,
and 2, denoted P0, P1, and P2. P0 and P1 are
complete 8-bit wide ports while P2 has only
five usable bits (P2_0 to P2_4). All ports are
both bit- and byte addressable through the
SFRs P0, P1 and P2. Each port pin can
individually be set to operate as a general
purpose I/O or as a peripheral I/O.
Note: P1_0 and P1_1 have LED driving
capabilities.
To use a port as a general purpose I/O pin the
pin must first be configured. The registers
PxSEL are used to configure each pin in a port
either as a general purpose I/O pin or as a
peripheral I/O signal. All digital input/output
pins are configured as general-purpose I/O
2
pins by default. Note that when the I S
interface is enabled (I2SCFG0.ENAB=1), the
2
I S interface will control its corresponding pins
even if these are selected to be general
purpose I/O pins in the PxSEL register.
By default, all general-purpose I/O pins are
configured as inputs. To change the direction
of a port pin, at any time, the registers PxDIR
are used to set each port pin to be either an
input or an output. Thus by setting the
appropriate bit within PxDIR
to 1, the
corresponding pin becomes an output.
When reading the port registers P0, P1, and
P2, the logic values on the input pins are
returned regardless of the pin configuration.
This does not apply during the execution of
read-modify-write instructions. The readmodify-write instructions are: ANL, ORL, XRL,
JBC, CPL, INC, DEC, DJNZ, and MOV, CLR,
or SETB. Operating on a port registers the
following is true: When the destination is an
individual bit in a port register P0, P1 or P2 the
value of the register, not the value on the pin,
is read, modified, and written back to the port
register.
When used as an input, the general purpose
I/O port pins can be configured to have a pullup, pull-down, or tri-state mode of operation.
By default, inputs are configured as inputs with
pull-up. To de-select the pull-up/pull-down
function on an input the appropriate bit within
the PxINP must be set to 1. The I/O port pins
P1_0 and P1_1 do not have pull-up/pull-down
capability.
In PM1, PM2, and PM3 the I/O pins retain the
I/O mode and output value (if applicable) that
was set when PM1/2/3 was entered.
12.4.2
Unused I/O Pins
Unused I/O pins should have a defined level
and not be left floating. One way to do this is
to leave the pin unconnected and configure
the pin as a general purpose I/O input with
pull-up resistor. This is the default state of all
pins after reset except for P1_0 and P1_1
which do not have pull-up/pull-down resistors
(note that only P2_2 has pull-up during reset).
Alternatively the pin can be configured as a
general purpose I/O output. In both cases the
pin should not be connected directly to VDD or
GND in order to avoid excessive power
consumption.
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CC2510Fx / CC2511Fx
12.4.3
• P1IEN: P1 interrupt enables
Low I/O Supply Voltage
• PICTL: P0/P2 interrupt enables and P0,
P1, and P2 edge configuration
In applications where the digital I/O power
supply voltage VDD on pin DVDD is below
2.6 V, the register bit IOCFG1.GDO_DS should
be set to 1.
• P0IFG: P0 interrupt status flags
• P1IFG: P1 interrupt status flags
12.4.4
General Purpose I/O Interrupts
• P2IFG: P2 interrupt status flags
General purpose I/O pins configured as inputs
can be used to generate interrupts. The
interrupts can be configured to trigger on
either a rising or falling edge of the external
signal. Each of the P0, P1 and P2 ports have
separate interrupt enable bits common for all
bits within the port located in the IENx
registers as follows:
• IEN1.P0IE : P0 interrupt enable
• IEN2.P1IE : P1 interrupt enable
• IEN2.P2IE : P2 interrupt enable
In addition to these common interrupt enables,
the bits within each port have interrupt enable
bits located in I/O port SFRs. Each bit within
P1 has an individual interrupt enable bit,
P1_xIEN, where x is 0 - 7, located in the
P1IEN register. For P0, the low-order nibble
and the high-order nibble have their individual
interrupt enables, P0IENL and P0IENH
respectively, found in the PICTL register. For
the P2_0 – P2_4 inputs there is a common
interrupt enable, P2IEN, in the PICTL
register.
When an interrupt condition occurs on one of
the
general
purpose
I/O
pins,
the
corresponding interrupt status flag in the P0 P2 interrupt status flag registers, P0IFG ,
P1IFG, or P2IFG will be set to 1. The
interrupt status flag is set regardless of
whether the pin has its interrupt enable set.
The CPU interrupt flags located in IRCON2 for
P1 and P2, and IRCON for P0, will only be
asserted if one or more of the interrupt enable
bits found in P1IEN (P1) and PICTL (P0 and
P2) are set to 1. Note that the module interrupt
flag needs to be cleared prior to clearing the
CPU interrupt flag.
Note: All port interrupts are blocked when
SLEEP.MODE≠00
12.4.5
General Purpose I/O DMA
When used as general purpose I/O pins, the
P0_1 and P1_3 pins are each associated with
one DMA trigger. These DMA triggers are
IOC_0 for P0_1 and IOC_1 for P1_3 as shown
in Table 51 on Page 104.
The IOC_0 DMA trigger is activated when
there
is
a
rising
edge
on
P0_1
(P0SEL.SELP0_1 and P0DIR.P0_1 must be
0) and IOC_1 is activated when there is a
falling edge on P1_3 (P1SEL.SELP1_3 and
P1DIR.P1_3 must be 0). Note that only input
transitions on pins configured as general
purpose I/O, inputs will produce a DMA trigger.
12.4.6
Peripheral I/O
This section describes how the digital
input/output pins are configured as peripheral
I/Os. For each peripheral unit that can
interface with an external system through the
digital input/output pins, a description of how
peripheral I/Os are configured is given in the
following sub-sections.
In general, setting the appropriate PxSEL bits
to 1 is required to select peripheral I/O function
on a digital I/O pin.
Note that peripheral units have two alternative
locations for their I/O pins. Please see Table
50.
The SFRs used for I/O interrupts are
described in Section 1.1 on Page 57. The
registers are the following:
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CC2510Fx / CC2511Fx
Periphery /
P0
P1
P2
Function
ADC
7 14
614
5
4
3
2
1
0
A7
A6
A5
A4
A3
A2
A1
A0
C
SS
M0
MI
USART0 Alt. 1
SPI
7
6
Alt. 2
USART0 Alt. 1
UART
RT
CT
TX
RX
MI
M0
C
SS
RX
TX
RT
CT
Alt. 2
USART1 Alt. 1
SPI
Alt. 2
USART1 Alt. 1
UART
Alt. 2
TIMER1 Alt. 1
2
1
5
4
3
2
MO
MI
C
SS
TX
RX
RT
CT
MI
M0
C
SS
RX
TX
RT
CT
1
0
1
2
1
0
4
2
1
0
TIMER3 Alt. 1
1
Alt. 2
1
0
0
TIMER4 Alt. 1
Alt. 2
1
Alt. 1
0
0
Alt. 2
I2S
3
CK
WS
RX
0
TX
Alt. 2
CK
32.768 kHz
XOSC
Q2
DEBUG
WS
RX
DC
DD
TX
Q1
Table 50: Peripheral I/O Pin Mapping
14
This pin is only found on CC2510Fx and does not exist on CC2511Fx.
12.4.6.1
USART0
The SFR bit PERCFG.U0CFG selects whether
to use alternative 1 or alternative 2 locations.
In Table 50, the USART0 signals are shown
as follows:
SPI:
• SCK: C
• SSN: SS
15
• MOSI: MO
• MISO: MI
UART:
• RXDATA: RX
• TXDATA: TX
• RTS: RT
• CTS: CT
15
SSN should only be configured as a
peripheral when using SPI slave mode
P2DIR.PRIP0
selects
the
order
of
precedence when assigning two peripherals to
the same pin location on P0. When set to 00,
USART0 has precedence if both USART0 and
USART1 are assigned to the same pins. Note
that if USART0 is configured to operate in
UART mode with hardware flow control
disabled, USART1 or timer 1 will have
precedence to use ports P0_4 and P0_5. It is
the user’s responsibility to not assign more
than two peripherals to the same pin locations,
as P2DIR.PRIP0 will not give a conclusive
order of precedence if more than two
peripherals are in conflict on a pin.
P2SEL.PRI3P1,
P2SEL.PRI2P1,
P2SEL.PRI1P1, and P2SEL.PRI0P1 select
the order of precedence when assigning two,
and in some cases three, peripherals to P1.
An example is if both the USARTs are assign
to P1 together with Timer 1 (channel 2, 1, and
0). By setting both PRI3P1 and PRI0P1 to 0,
USART0 will have precedence. Note that if
USART0 is configured to operate in UART
mode with hardware flow control disabled,
USART1 can still use P1_7 and P1_6, while
Timer 1 can use P1_2, P1_1, and P1_0. Also
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CC2510Fx / CC2511Fx
on P1 it is the user’s responsibility to make
sure that there is a conclusive order of
precedence based on the PERCFG and P2SEL
settings.
12.4.6.2
responsibility to avoid configurations where the
order of precedence is not conclusive.
12.4.6.3
PERCFG.T1CFG selects whether to
alternative 1 or alternative 2 locations.
USART1
The SFR bit PERCFG.U1CFG selects whether
to use alternative 1 or alternative 2 locations.
In Table 50, the USART1 signals are shown
as follows:
use
In Table 50, the Timer 1 signals are shown as
follows:
• Channel 0 capture/compare pin: 0
• Channel 1 capture/compare pin: 1
SPI:
• SCK: C
• SSN: SS
Timer 1
• Channel 2 capture/compare pin: 2
16
P2DIR.PRIP0
selects
the
order
of
precedence when assigning two peripherals to
the same pin location on P0. When set to 10
or 11, Timer 1 has precedence over USART1
and USART0 respectively. It is the user’s
responsibility to not assign more than two
peripherals to the same pin locations
• MOSI: MO
• MISO: MI
UART:
• RXDATA: RX
• TXDATA: TX
• RTS: RT
• CTS: CT
P2DIR.PRIP0
selects
the
order
of
precedence when assigning two peripherals to
the same pin location on P0. When set to 01,
USART1 has precedence if both USART0 and
USART1 are assigned to the same pins. Note
that if USART1 is configured to operate in
UART mode with hardware flow control
disabled, USART0 or timer 1 will have
precedence to use ports P0_3 and P0_2. It is
the user’s responsibility to not assign more
than two peripherals to the same pin locations,
as P2DIR.PRIP0 will not give a conclusive
order of precedence if more than two
peripherals are in conflict on a pin.
P2SEL.PRI3P1,
P2SEL.PRI2P1,
P2SEL.PRI1P1, and P2SEL.PRI0P1 select
the order of precedence when assigning two,
and in some cases three, peripherals to P1. By
setting PRI3P1 to 1 and PRI2P1 to 0,
USART1 will have precedence over both
USART0 and Timer 3. However, if USART1 is
configured to operate in UART mode with
hardware flow control disabled, there will be a
conflict on P1_4 between USART0 and Timer
3 (channel 1), which the P2SEL register
settings do not solve. It is the user’s
P2SEL.PRI3P1,
P2SEL.PRI2P1,
P2SEL.PRI1P1, and P2SEL.PRI0P1 select
the order of precedence when assigning two,
and in some cases three, peripherals to P1.
When
P2SEL.PRI1P1=0
and
P2SEL.PRI0P1=1, Timer 1 has precedence
over Timer 4 and USART0 respectively. It is
the user’s responsibility to avoid configurations
where the order of precedence is not
conclusive.
12.4.6.4
Timer 3
PERCFG.T3CFG selects whether to
alternative 1 or alternative 2 locations.
use
In Table 50, the Timer 3 signals are shown as
follows:
• Channel 0 compare pin: 0
• Channel 1 compare pin: 1
P2SEL.PRI3P1,
P2SEL.PRI2P1,
P2SEL.PRI1P1, and P2SEL.PRI0P1 select
the order of precedence when assigning two,
and in some cases three, peripherals to P1.
Setting P2SEL.PRI2P1=1 gives Timer 3
precedence over USART1. It is the user’s
responsibility to avoid configurations where the
order of precedence is not conclusive.
16
SSN should only be configured as a
peripheral when using SPI slave mode
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12.4.6.5
Timer 4
PERCFG.T4CFG selects whether to
alternative 1 or alternative 2 locations.
use
In Table 50, the Timer 4 signals are shown as
follows:
• Channel 0 compare pin: 0
• Channel 1 compare pin: 1
P2SEL.PRI3P1,
P2SEL.PRI2P1,
P2SEL.PRI1P1, and P2SEL.PRI0P1 select
the order of precedence when assigning two,
and in some cases three, peripherals to P1.
Setting P2SEL.PRI12P1=1 gives Timer 4
precedence over Timer 1. It is the user’s
responsibility to avoid configurations where the
order of precedence is not conclusive.
2
IS
12.4.6.6
2
The
IS
configuration
register
bit
I2SCFG1.IOLOC selects whether to use
alternative 1 or alternative 2 locations.
The settings in the ADCCFG register override
the settings in P0SEL (the register used to
select a pin to be either GPIO or to have a
peripheral function).
The ADC can be configured to use the
general-purpose I/O pin P2_0 as an external
trigger to start conversions. P2_0 must be
configured as a general-purpose I/O in input
mode, when being used for ADC external
trigger.
Refer to Section 12.10 on Page 137 for a
detailed description on how to use the ADC.
12.4.6.8
Debug Interface
Ports P2_1 and P2_2 are used for debug data
and clock signals, respectively. These are
shown as DD (debug data) and DC (debug
clock) in Table 50. The state of P2SEL is
overridden by the debug interface. Also,
P2DIR.DIRP2_1 and P2DIR.DIRP2_2 is
overridden when the chip changes the
direction to supply the external host with data.
2
In Table 50, the I S signals are shown as
follows:
• Continuous Serial Clock (SCK): CK
32.768 kHz XOSC Input
Ports P2_3 and P2_4 are used to connect to
an external 32.768 kHz crystal. These port
pins will be set in analog mode and used by
the 32.768 kHz crystal oscillator when
CLKCON.OSC32K is low, regardless of the
configurations of these pins.
• Word Select: WS
• Serial Data In: RX
• Serial Data Out: TX
2
If
the
IS
interface
is
enabled
2
(I2SCFG0_ENAB=1), the I S interface will
have precedence in cases where other
peripherals (except for the debug interface)
are configured to be on the same location.
This is the case even if the pins are configured
to be general purpose I/O pins.
12.4.6.7
12.4.6.9
ADC
When using the ADC in an application, some
or all of the P0 pins must be configured as
ADC inputs. The port pins are mapped to the
ADC inputs so that P0_7 – P0_0 corresponds
to AIN7 - AIN0. To configure a P0 pin to be
used as an ADC input the corresponding bit in
the ADCCFG register must be set to 1. The
default values in this register select the Port 0
pins
as
non-ADC
input
i.e.
digital
input/outputs.
12.4.6.10 Radio Test Output Signals
For debug and test purposes, a number of
internal status signals in the radio may be
output on the port pins P1_7 – P1_5. This
debug option is controlled through the RF
registers IOCFG2 - IOCFG0 (see Section 15
for more details).
Setting IOCFGx.GDOx_CFG to a value other
than 0 will override the P1SEL_SELP1_7,
P1SEL_SELP1_6,
and
P1SEL_SELP1_5
settings, and the pins will automatically
become outputs. These pins cannot be used
2
when the I S interface is enabled.
12.4.7
I/O Registers
The registers for the IO ports are described in
this section. The registers are:
Note: P0_6 and P0_7 do not exist on
CC2511Fx, hence six input channels are
available (AIN0 - AIN5)
• P0 Port 0
• P1 Port 1
• P2 Port 2
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CC2510Fx / CC2511Fx
• PERCFG Peripheral Control
• P0INP Port 0 Input Mode
• ADCCFG ADC Input Configuration
• P1INP Port 1 Input Mode
• P0SEL Port 0 Function Select
• P2INP Port 2 Input Mode
• P1SEL Port 1 Function Select
• P0IFG Port 0 Interrupt Status Flag
• P2SEL Port 2 Function Select
• P1IFG Port 1 Interrupt Status Flag
• P0DIR Port 0 Direction
• P2IFG Port 2 Interrupt Status Flag
• P1DIR Port 1 Direction
• PICTL Port Interrupt Control
• P2DIR Port 2 Direction
• P1IEN Port 1 Interrupt Mask
P0 (0x80) - Port 0
Bit
Field Name
Reset
R/W
Description
7:0
P0[7:0]
0xFF
R/W
Port 0. General purpose I/O port. Bit-addressable.
P1 (0x90) - Port 1
Bit
Field Name
Reset
R/W
Description
7:0
P1[7:0]
0xFF
R/W
Port 1. General purpose I/O port. Bit-addressable.
Reset
R/W
Description
111
R/W
Not used
11111
R/W
Port 2. General purpose I/O port. Bit-addressable.
P2 (0xA0) - Port 2
Bit
Field Name
7:5
4:0
P2[4:0]
PERCFG (0xF1) - Peripheral Control
Bit
Field Name
7
6
5
4
T1CFG
T3CFG
T4CFG
3:2
1
0
U1CFG
U0CFG
Reset
R/W
Description
-
R0
Not used
0
R/W
Timer 1 I/O location
0
0
R/W
R/W
0
Alternative 1 location
1
Alternative 2 location
Timer 3 I/O location
0
Alternative 1 location
1
Alternative 2 location
Timer 4 I/O location
0
Alternative 1 location
1
Alternative 2 location
-
R0
Not used
0
R/W
USART1 I/O location
0
R/W
0
Alternative 1 location
1
Alternative 2 location
USART0 I/O location
0
Alternative 1 location
1
Alternative 2 location
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ADCCFG (0xF2) - ADC Input Configuration
Bit
Field Name
Reset
R/W
Description
7:0
ADCCFG[7:0]
0x00
R/W
ADC input configuration. ADCCFG[7:0] select P0_7 - P0_0 as ADC inputs
AIN7 - AIN0
0
ADC input disabled
1
ADC input enabled
P0SEL (0xF3) - Port 0 Function Select
Bit
Field Name
Reset
R/W
Description
7:0
SELP0_[7:0]
0x00
R/W
P0_7 to P0_0 function select
0
General purpose I/O
1
Peripheral function
P1SEL (0xF4) - Port 1 Function Select
Bit
Field Name
Reset
R/W
Description
7:0
SELP1_[7:0]
0x00
R/W
P1_7 to P1_0 function select
0
General purpose I/O
1
Peripheral function
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P2SEL (0xF5) - Port 2 Function Select
Bit
Field Name
7
6
PRI3P1
Reset
R/W
Description
-
R0
Not used
0
R/W
Port 1 peripheral priority control. These bits shall determine the order of
precedence in the case when PERCFG assigns USART0 and USART1 to the same
pins.
0 USART0 has priority
1 USART1 has priority
5
PRI2P1
0
R/W
Port 1 peripheral priority control. These bits shall determine the order of
precedence in the case when PERCFG assigns USART1 and timer 3 to the same
pins.
0 USART1 has priority
1 Timer 3 has priority
4
PRI1P1
0
R/W
Port 1 peripheral priority control. These bits shall determine the order of
precedence in the case when PERCFG assigns timer 1 and timer 4 to the same
pins.
0 Timer 1 has priority
1 Timer 4 has priority
3
PRI0P1
0
R/W
Port 1 peripheral priority control. These bits shall determine the order of
precedence in the case when PERCFG assigns USART0 and timer 1 to the same
pins.
0 USART0 has priority
1 Timer 1 has priority
2
SELP2_4
0
R/W
P2_4 function select
0 General purpose I/O
1 Peripheral function
1
SELP2_3
0
R/W
P2_3 function select
0 General purpose I/O
1 Peripheral function
0
SELP2_0
0
R/W
P2_0 function select
0 General purpose I/O
1 Peripheral function
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P0DIR (0xFD) - Port 0 Direction
Bit
Field Name
Reset
R/W
7:0
DIRP0_[7:0]
0x00
R/W
Description
P0_7 to P0_0 I/O direction
0
Input
1
Output
P1DIR (0xFE) - Port 1 Direction
Bit
Field Name
Reset
R/W
Description
7:0
DIRP1_[7:0]
0x00
R/W
P1_7 to P1_0 I/O direction
0
Input
1
Output
P2DIR (0xFF) - Port 2 Direction
Bit
Field Name
Reset
R/W
Description
7:6
PRIP0[1:0]
00
R/W
Port 0 peripheral priority control. These bits shall determine the order of
precedence in the case when PERCFG assigns two peripherals to the same pins
5
4:0
DIRP2_[4:0]
00
USART0 - USART1
01
USART1 - USART0
10
Timer 1 channels 0 and 1 - USART1
11
Timer 1 channel 2 - USART0
-
R0
Not used
00000
R/W
P2_4 to P2_0 I/O direction
0
Input
1
Output
P0INP (0x8F) - Port 0 Input Mode
Bit
Field Name
Reset
R/W
Description
7:0
MDP0_[7:0]
0x00
R/W
P0_7 to P0_0 I/O input mode
0
Pull-up / pull-down
1
Tristate
P1INP (0xF6) - Port 1 Input Mode
Bit
Field Name
Reset
R/W
Description
7:2
MDP1_[7:2]
000000
R/W
P1_7 to P1_2 I/O input mode
1:0
-
R0
0
Pull-up / pull-down
1
Tristate
Not used
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P2INP (0xF7) - Port 2 Input Mode
Bit
Field Name
Reset
R/W
Description
7
PDUP2
0
R/W
Port 2 pull-up/down select. Selects function for all Port 2 pins configured as
pull-up/pull-down inputs.
6
5
4:0
PDUP1
PDUP0
MDP2_[4:0]
0
0
00000
R/W
R/W
R/W
0
Pull-up
1
Pull-down
Port 1 pull-up/down select. Selects function for all Port 1 pins configured as
pull-up/pull-down inputs, except for P1_0 and P1_1, which do not have pullup/down capability.
0
Pull-up
1
Pull-down
Port 0 pull-up/down select. Selects function for all Port 0 pins configured as
pull-up/pull-down inputs.
0
Pull-up
1
Pull-down
P2_4 to P2_0 I/O input mode
0
Pull-up / pull-down
1
Tristate
P0IFG (0x89) - Port 0 Interrupt Status Flag
CC2510Fx
Bit
Field Name
Reset
R/W
Description
7:0
P0IF[7:0]
0x00
R/W0
Port 0, inputs 7 to 0 interrupt status flags.
0
No interrupt pending
1
Interrupt pending
CC2511Fx
Bit
Field Name
Reset
R/W
Description
7
USB_RESUME
0
R/W0
USB resume detected during suspend mode
0
R/W0
Not used
0
R/W0
Port 0, inputs 5 to 0 interrupt status flags.
6
5:0
P0IF[5:0]
0
No interrupt pending
1
Interrupt pending
P1IFG (0x8A) - Port 1 Interrupt Status Flag
Bit
Field Name
Reset
R/W
Description
7:0
P1IF[7:0]
0x00
R/W0
Port 1, inputs 7 to 0 interrupt status flags.
0
No interrupt pending
1
Interrupt pending
P2IFG (0x8B) - Port 2 Interrupt Status Flag
Bit
Field Name
7:5
4:0
P2IF[4:0]
Reset
R/W
Description
-
R0
Not used
0
R/W0
Port 2, inputs 4 to 0 interrupt status flags.
0
No interrupt pending
1
Interrupt pending
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PICTL (0x8C) - Port Interrupt Control
Bit
Reset
R/W
7
-
R0
Not used
6
0
R/W
Not Used
0
R/W
Port 2, inputs 4 to 0 interrupt enable.
5
4
3
2
1
0
Field Name
P2IEN
P0IENH
P0IENL
P2ICON
P1ICON
P0ICON
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
Description
0
Interrupts are disabled
1
Interrupts are enabled
Port 0, inputs 7 to 4 interrupt enable.
0
Interrupts are disabled
1
Interrupts are enabled
Port 0, inputs 3 to 0 interrupt enable.
0
Interrupts are disabled
1
Interrupts are enabled
Port 2, inputs 4 to 0 interrupt configuration. This bit selects the interrupt request
condition for all port 2 inputs
0
Rising edge on input gives interrupt
1
Falling edge on input gives interrupt
Port 1, inputs 7 to 0 interrupt configuration. This bit selects the interrupt request
condition for all port 1 inputs
0
Rising edge on input gives interrupt
1
Falling edge on input gives interrupt
Port 0, inputs 7 to 0 interrupt configuration. This bit selects the interrupt request
condition for all port 0 inputs. For CC2511Fx, this bit must be set to 0 when USB is
used, since the internal USB resume interrupt mapped to P0[7] uses rising edge.
0
Rising edge on input gives interrupt
1
Falling edge on input gives interrupt
P1IEN (0x8D) - Port 1 Interrupt Mask
Bit
Field Name
Reset
R/W
Description
7:0
P1_[7:0]IEN
0x00
R/W
Port P1_7 to P1_0 interrupt enable
0
Interrupts are disabled
1
Interrupts are enabled
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CC2510Fx / CC2511Fx
12.5 DMA Controller
The CC2510Fx/CC2511Fx includes a direct
memory access (DMA) controller, which can
be used to relieve the 8051 CPU core of
handling data movement operations. Because
of this, the CC2510Fx/CC2511Fx can achieve high
overall performance with good power
efficiency. The DMA controller can move data
from a peripheral unit such as the ADC or RF
transceiver to memory with minimum CPU
intervention.
The DMA controller coordinates all DMA
transfers, ensuring that DMA requests are
prioritized appropriately relative to each other
and CPU memory access. The DMA controller
contains 5 programmable DMA channels for
data movement.
The DMA controller controls data movement
over the entire XDATA memory space. Since
most of the SFRs are mapped into the XDATA
memory space these flexible DMA channels
can be used to unburden the CPU in
2
innovative ways, e.g. feed a USART and I S
with data from memory, periodically transfer
samples between ADC and memory, transfer
data to and from USB FIFOs (CC2511Fx) etc.
Use of the DMA can also reduce system
power consumption by keeping the CPU idle
and not have it to wake up to move data to or
from a peripheral unit (see Section 12.1.2).
Note that Section 10.2.3.3 describes which
SFRs are not mapped into XDATA memory
space.
The main features of the DMA controller are
as follows:
• Five independent DMA channels
• Three configurable
channel priority
levels
of
DMA
• 30 configurable trigger events
• Independent control of source and
destination address
• Single, block, and repeated transfer
modes
• Supports variable transfer count length
by including the length field in the data
to be transferred
• Can operate in either word-size or bytesize mode
12.5.1
DMA Operation
There are five DMA channels available in the
DMA controller numbered channel 0 to
channel 4. Each DMA channel can move data
from one place within XDATA memory space
to another i.e. between XDATA locations.
Some CPU-specific SFRs reside inside the
CPU core and can only be accessed using the
SFR memory space and can therefore not be
accessed using DMA. These registers are
shown in gray in Table 30 on Page 44.
Note: In the following sections, an n in the
register name represent the channel
number 0, 1, 2, 3, or 4 if nothing else is
stated
In order to use a DMA channel it must first be
configured as described in Sections 0 and
Section 12.5.3.
Once a DMA channel has been configured it
must be armed before any transfers are
allowed to be initiated. A DMA channel is
armed by setting the appropriate bit DMAARMn
in the DMA Channel Arm register DMAARM.
When a DMA channel is armed it will start to
move data when the configured DMA trigger
event occurs. Note that it takes 9 system
clocks from the arm bit is set until the new
configuration is loaded. While the new
configuration is being loaded, the DMA
channel will be able to accept triggers. This
will, however, not be the trigger stored in the
configuration data that are currently loaded,
but the trigger last used with this channel (after
a reset this will be trigger number 0, manual
trigger using the DMAREQ.DMAREQn bit). If n
channels are armed at the same time, loading
the configuration takes n x 9 clock cycles.
Channel 1 will first be ready, then channel 2,
and finally channel 0. It can not be assumed
that channel 1 is ready after 9 clock cycles,
channel 2 after 18 clock cycles, etc. To avoid
having the DMA channels starting to move
data on unwanted triggers when changing
configuration, a dummy configuration should
be loaded in-between configuration changes,
setting TRIG to 0. Alternatively, abort the
currently armed DMA channel before rearming
it. There are 30 possible DMA trigger events,
e.g. UART transfer, Timer overflow etc. The
DMA trigger events are listed in Table 51.
Figure 26 shows a DMA operation flow chart.
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CC2510Fx / CC2511Fx
Initialization
Write DMA channel
configuration
Yes
No
Reconfigure?
DMA Channel Idle
No
Setting DMAARM.ABORT=1 will abort all
channels where the DMAARMn bit is set
simultaneously.
I.e., setting DMAARM=0x85 will abort
channel 0 and channel 2
DMAARM.DMAARMn=1?
Yes
DMA Channel Armed
Load DMA Channel
configuration
Trigger or
DMAREQ.DMAREQn=1?
No
Yes
Transfer one byte or word
when channel is granted
access
Modify source/destination
address
Yes
Reached transfer
count?
Yes
Set interrupt flag.
(IRCON.DMAIF=1
DMAIRQ.DMAIFn=1 if
IRQMASK=1)
Repetitive transfer
mode?
No
DMAARMn=0
No
Yes
Repetitive transfer
mode?
No
Figure 26: DMA Operation
12.5.2
DMA Configuration Parameters
Setup and control of the DMA operation is
performed by the user software. This section
describes the parameters which must be
configured before a DMA channel can be
used. Section 12.5.3 on Page 102 describes
how the parameters are set up in software and
passed to the DMA controller.
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The behavior of each of the five DMA
channels is configured with the following
parameters:
12.5.2.1
Note: For byte size transfers (see Section
12.5.2.4), n is defined as the first byte in
source data or the 7 LSB of the first byte in
source data, depending on the M8 setting
(see Section 12.5.2.9). For word size
transfers, n is the 13 LSB of the first word
in source data.
Source Address (SRCADDR)
The address of the location in XDATA memory
space where the DMA channel shall start to
read data.
There are four possible configurations:
1. VLEN=001
12.5.2.2
Destination Address (DESTADDR)
Transfer
number
of
commanded by n + 1
The address of the location in XDATA memory
space where the DMA channel will write the
data read from the source address. The user
must ensure that the destination is writable.
2. VLEN=010
12.5.2.3
3. VLEN=011
Transfer
number
commanded by n
Transfer Count
The number of bytes/words needed to be
moved from source to destination. When the
transfer count is reached, the DMA controller
rearms or disarms the DMA channel
(depending on transfer mode) and alert the
CPU by setting the DMAIRQ.DMAIFn bit to 1.
If IRQMASK=1, IRCON.DMAIF will also be set
and an interrupt request is generated if
IEN1.DMAIE=1. The transfer count can be of
fixed or variable length depending on how the
DMA channel is configured.
Fixed Length Transfer Count: When
VLEN=000 or VLEN=111, the transfer count is
set by the LEN setting.
Variable Length Transfer Count: When
VLEN≠000 and VLEN≠111, the transfer count
is given by the value of the first byte/word in
source data, n, + a constant given by the
VLEN setting. This allows for variable length
transfer count.
bytes/words
of
bytes/words
Transfer
number
of
commanded by n + 2
bytes/words
4. VLEN=100
Transfer
number
of
commanded by n + 3
bytes/words
For all of the above configurations, the transfer
count will be limited to LEN bytes/words when
n ≥ LEN. In cases where n < LEN, the transfer
count is given by the VLEN setting. This means
that when VLEN=010, LEN should be equal to
nmax, while in the other three cases, LEN
should be set to nmax + 1.
Note that the M8 bit is only used when byte
size transfers are chosen.
Figure 27 shows the different VLEN options.
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Byte/Word n+2
Byte/Word n+1
Byte/Word n+1
Byte/Word n+1
Byte/Word n+1
Byte/Word n
Byte/Word n
Byte/Word n
Byte/Word n
Byte/Word n-1
Byte/Word n-1
Byte/Word n-1
Byte/Word n-1
Byte/Word n-2
Byte/Word n-2
Byte/Word n-2
Byte/Word n-2
.
.
.
.
.
.
.
.
Byte/Word 2
Byte/Word 1
Byte/Word 2
Byte/Word 1
.
.
.
.
Byte/Word 3
Byte/Word 2
Byte/Word 1
Byte/Word 3
n < LEN
Byte/Word 3
n < LEN
n < LEN
Byte/Word 3
n < LEN
.
.
.
.
LEN = n + 1
Byte/Word n+3
Byte/Word n+2
LEN = n + 1
Byte/Word n+3
Byte/Word n+2
LEN = n + 1
Byte/Word n+3
Byte/Word n+2
LEN = n + 1
Byte/Word n+3
Byte/Word 2
Byte/Word 1
Length = n
Length = n
Length = n
Length = n
VLEN = 001
VLEN = 010
VLEN = 011
VLEN = 100
If n ≥ LEN, LEN bytes/words are
being transferred. The dotted line
shows the case where LEN = n + 1
Figure 27: Variable Length Transfer Count Options
12.5.2.4
Byte
or
(WORDSIZE)
Word
Transfers
Determines whether each transfer should be
8-bit (byte) or 16-bit (word).
12.5.2.5
Repeated block. On a trigger the number of
byte/word transfers specified by the transfer
count is performed as quickly as possible,
after
which
the
CPU
is
notified
(DMAIRQ.DMAIFn=1) and the DMA channel is
rearmed.
Transfer Mode (TMODE)
The transfer mode determines how the DMA
channel behaves when transferring data.
There are four different transfer modes.
Single. On a trigger a single byte/word
transfer occurs and the DMA channel awaits
the next trigger. After completing the number
of transfers specified by the transfer count, the
CPU is notified (DMAIRQ.DMAIFn=1) and the
DMA channel is disarmed.
Block. On a trigger the number of byte/word
transfers specified by the transfer count is
performed as quickly as possible, after which
the CPU is notified (DMAIRQ.DMAIFn=1) and
the DMA channel is disarmed.
Repeated single. On a trigger a single
byte/word transfer occurs and the DMA
channel awaits the next trigger. After
completing the number of transfers specified
by the transfer count, the CPU is notified
(DMAIRQ.DMAIFn=1) and the DMA channel is
rearmed.
12.5.2.6
Trigger Event (TRIG)
A DMA trigger event will initiate a single
byte/word transfer, a block transfer, or
repeated versions of these. Each DMA
channel can be set up to sense on a single
trigger. The TRIG field in the configuration
determines which trigger the DMA channel is
to use. In addition to the configured trigger, a
DMA channel can always be triggered by
setting its designated DMAREQ.DMAREQn flag.
The DMA trigger sources are described in
Table 51 on Page 104.
12.5.2.7
Source and Destination Increment
(SRCINC and DESTINC)
When the DMA channel is armed or rearmed,
the source and destination addresses are
transferred to internal address pointers. These
pointers, and hence the source and
destination addresses, can be controlled to
increment, decrement, or not change between
byte/word transfers in order to give good
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CC2510Fx / CC2511Fx
flexibility. The possibilities
increment/decrement are:
for
address
• Increment by zero. The address pointer
shall remain fixed after each byte/word
transfer.
• Increment by one. The address pointer
shall increment one count after each
byte/word transfer.
• Increment by two. The address pointer
shall increment two counts after each
byte/word transfer.
• Decrement by one. The address pointer
shall decrement one count after each
byte/word transfer.
12.5.2.8
Interrupt Mask (IRQMASK)
described in the previous section have to be
configured before a DMA channel can be
armed and activated. The parameters are not
configured directly through SFRs, but instead
they are written in a special DMA configuration
data structure in memory. Each DMA channel
in use requires its own DMA configuration data
structure. The DMA configuration data
structure consists of eight bytes and is
described in Table 52. A DMA configuration
data structure may reside at any location in
unified memory space decided upon by the
user software, and the address location is
passed to the DMA controller through a set of
SFRs DMAxCFGH:DMAxCFGL (x is 0 or 1).
Once a channel has been armed, the DMA
controller will read the configuration data
structure for that channel, given by the
address in DMAxCFGH:DMAxCFGL.
If this bit is set to 1, the CPU interrupt flag
IRCON.DMAIF will be asserted when the
transfer count is reached. An interrupt request
is being generated if IEN1.DMAIE=1.
It is important to note that the method for
specifying the start address for the DMA
configuration data structure differs between
DMA channel 0 and DMA channels 1 - 4 as
follows:
12.5.2.9
DMA0CFGH:DMA0CFGL gives the start address
for DMA channel 0 configuration data
structure.
Mode 8 Setting (M8)
When variable length transfer count is used
(VLEN≠000 and VLEN≠111) this field
determines whether to use seven or eight bits
of the first byte in source data to determine the
transfer count. This configuration is only
applicable when doing byte transfers.
12.5.2.10 DMA Priority (PRIORITY)
A DMA priority is associated with each DMA
channel. The DMA priority is used to
determine the winner in the case of multiple
simultaneous internal memory requests, and
whether the DMA memory access should have
priority or not over a simultaneous CPU
memory access. In case of an internal tie, a
round-robin scheme is used to ensure access
for all. There are three levels of DMA priority:
High: Highest internal priority. DMA access
will always prevail over CPU access.
Normal: Second highest internal priority.
Guarantees that DMA access prevails over
CPU on at least every second try.
Low: Lowest internal priority. DMA access will
always defer to a CPU access.
12.5.3
DMA Configuration Setup
The DMA channel parameters such as
address mode, transfer mode and priority
DMA1CFGH:DMA1CFGL gives the start address
for DMA channel 1 configuration data structure
followed by channel 2 - 4 configuration data
structures.
This means that the DMA controller expects
the DMA configuration data structures for DMA
channels 1 - 4 to lie in a contiguous area in
memory, starting at the address held in
DMA1CFGH:DMA1CFGL and consisting of 32
bytes.
12.5.4
Aborting Transfers
Ongoing byte/word transfers or armed DMA
channels will be aborted using the DMAARM
register to disarm the DMA channel.
One or more DMA channels are aborted by
writing a 1 to DMAARM.ABORT register bit, and
at the same time select which DMA channels
to abort by setting the corresponding,
DMAARM.DMAARMn bits to 1. When setting
DMAARM.ABORT to 1, the DMAARM.DMAARMn
bits for non-aborted channels must be written
as 0.
An example of DMA channel arm and disarm
is shown in Figure 28.
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CC2510Fx / CC2511Fx
MOV DMAARM, #0x03
MOV DMAARM, #0x81
; Arm DMA channel 0 and 1
; Disarm DMA channel 0, channel 1 is still armed
Figure 28: DMA Arm/Disarm Example
12.5.5
DMA Interrupts
12.5.6
Each DMA channel can be configured to
generate an interrupt to the CPU when the
transfer
count
is
reached.
This
is
accomplished by setting the IRQMASK bit in
the channel configuration to 1. When this bit is
set to 1, IRCON.DMAIF=1 will be set to 1
when reaching the transfer count. An interrupt
request is being generated if IEN1.DMAIE=1.
Regardless of the IRQMASK bit in the channel
configuration, DMAIRQ.DMAIFn will be set
upon DMA channel complete. Thus software
should always check (and clear) this register
when rearming a channel with a changed
IRQMASK setting. Failure to do so could
generate an interrupt based on the stored
interrupt flag.
DMA Memory Access
The byte/word transfer is affected by endian
convention. This as the memory system use
Big-Endian in XDATA memory, while LittleEndian is used in SFR memory. This must be
accounted for in compilers.
12.5.7
DMA USB Endianess (CC2511Fx)
When a USB FIFO is accessed using word
transfer, the endianess of the word
read/written can be controlled by setting the
ENDIAN.USBWLE
and
ENDIAN.USBRLE
configuration bits in the ENDIAN register. See
Section 12.16 for details.
DMA Trigger
Number
DMA Trigger
Name
Functional
Unit
Description
0
NONE
DMA
No trigger, setting DMAREQ.DMAREQx bit starts a single byte/word
transfer or a block transfer
1
PREV
DMA
DMA channel is triggered by completion of previous channel
2
T1_CH0
Timer 1
Timer 1, compare, channel 0
3
T1_CH1
Timer 1
Timer 1, compare, channel 1
4
T1_CH2
Timer 1
Timer 1, compare, channel 2
5
Not in use.
6
T2_OVFL
Timer 2
Timer 2, timer count reaches 0x00
7
T3_CH0
Timer 3
Timer 3, compare, channel 0
8
T3_CH1
Timer 3
Timer 3, compare, channel 1
9
T4_CH0
Timer 4
Timer 4, compare, channel 0
10
T4_CH1
Timer 4
Timer 4, compare, channel 1
11
Do not use
12
IOC_0
IO Controller
P0_1 input transition 17
13
IOC_1
IO Controller
P1_3 input transition 18
14
URX0
USART0
USART0 RX complete
15
UTX0
USART0
USART0 TX complete
16
URX1
USART1
USART1 RX complete
17
UTX1
USART1
USART1 TX complete
17
18
Trigger on rising edge. P0SEL.SELP0_1 and P0DIR.P0_1 must be 0
Trigger on falling edge. P1SEL.SELP1_3 and P1DIR.P1_3 must be 0
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DMA Trigger
Number
DMA Trigger
Name
Functional
Unit
Description
18
FLASH
Flash
Controller
Flash data write complete
19
RADIO
Radio
RF packet byte received/transmit
20
ADC_CHALL
ADC
ADC end of a conversion in a sequence, sample ready
21
ADC_CH0
ADC
ADC end of conversion (AIN0, single-ended or AIN0 - AIN1, differential).
Sample ready
22
ADC_CH1
ADC
ADC end of conversion (AIN1, single-ended or AIN0 - AIN1, differential).
Sample ready
23
ADC_CH2
ADC
ADC end of conversion (AIN2, single-ended or AIN2 - AIN3, differential).
Sample ready
24
ADC_CH3
ADC
ADC end of conversion (AIN3, single-ended or AIN2 - AIN3, differential).
Sample ready
25
ADC_CH4
ADC
ADC end of conversion (AIN4, single-ended or AIN4 - AIN5, differential).
Sample ready
26
ADC_CH5
ADC
ADC end of conversion (AIN5, single-ended or AIN4 - AIN5, differential).
Sample ready
ADC_CH6
ADC
ADC end of conversion (AIN6, single-ended or AIN6 - AIN7, differential).
Sample ready
I2SRX
I2S
I2S RX complete
ADC_CH7
ADC
ADC end of conversion (AIN7, single-ended or AIN6 - AIN7, differential).
Sample ready
I2STX
I2S
I2S TX complete
29
ENC_DW
AES
AES encryption processor requests download input data
30
ENC_UP
AES
AES encryption processor requests upload output data
27
28
Table 51: DMA Trigger Sources
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Byte
Offset
Bit
Field Name
Description
0
7:0
SRCADDR[15:8]
The DMA channel source address, high byte
1
7:0
SRCADDR[7:0]
The DMA channel source address, low byte
2
7:0
DESTADDR[15:8]
The DMA channel destination address, high byte.
Note that flash memory is not directly writeable.
3
7:0
DESTADDR[7:0]
The DMA channel destination address, low byte.
Note that flash memory is not directly writeable.
4
7:5
VLEN[2:0]
Transfer count mode.
000
Use LEN for transfer count
001
Transfer number of bytes/words commanded by n + 1
010
Transfer number of bytes/words commanded by n
011
Transfer number of bytes/words commanded by n + 2
100
Transfer number of bytes/words commanded by n + 3
101
Reserved
110
Reserved
111
Alternative for using LEN as transfer count
Note: For byte size transfers (see Section 12.5.2.4), n is defined as the first byte in
source data or the 7 LSB of the first byte in source data, depending on the M8
setting (see Section 12.5.2.9). For word size transfers, n is the 13 LSB of the first
word in source data.
4
4:0
LEN[12:8]
5
7:0
LEN[7:0]
This value is used as transfer count when VLEN=000 or VLEN=111 (fixed length
transfer count). For all cases where VLEN≠000 and VLEN≠111 (variable length
transfer count), the transfer count will be limited to LEN bytes/words when n ≥ LEN.
In cases where n < LEN, the transfer count is given by the VLEN setting.
6
7
WORDSIZE
Selects whether each transfer shall be 8-bit (0) or 16-bit (1).
6
6:5
TMODE[1:0]
Transfer mode:
6
7
7
4:0
7:6
5:4
TRIG[4:0]
SRCINC[1:0]
DESTINC[1:0]
00
Single
01
Block
10
Repeated single
11
Repeated block
Select DMA trigger
00000
No trigger (writing to DMAREQ is only trigger)
00001
The previous DMA channel finished
00010
11111
Selects one of the triggers shown in Table 51. The trigger is selected in the
order shown in the table.
Source address increment mode (after each transfer)
00
0 bytes/words
01
1 bytes/words
10
2 bytes/words
11
−1 bytes/words
Destination address increment mode (after each transfer)
00
0 bytes/words
01
1 bytes/words
10
2 bytes/words
11
−1 bytes/words
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Byte
Offset
Bit
Field Name
Description
7
3
IRQMASK
Interrupt Mask for this channel.
7
7
2
1:0
0
Disable interrupt generation
1
Enable interrupt generation upon reaching transfer count
When variable length transfer count is used (VLEN≠000 and VLEN≠111) this field
determines whether to use seven or eight bits of the first byte in source data to
determine the transfer count. Only applicable when WORDSIZE=0.
M8
PRIORITY[1:0]
0
Use all 8 bits
1
Use 7 LSB
The DMA channel priority:
00
Low, DMA access will always defer to a CPU access
01
Normal, guarantees that DMA access prevails over CPU on at least every
second try.
10
High, DMA access will always prevail over CPU access.
11
Reserved
Table 52: DMA Configuration Data Structure
12.5.8
DMA Registers
This section describes the SFRs associated
with the DMA Controller.
DMAARM (0xD6) - DMA Channel Arm
Bit
Field Name
Reset
R/W
Description
7
ABORT
0
R0/W
DMA abort. Ongoing byte/word transfers or armed DMA channels will be aborted
when writing a 1 to this bit, and at the same time select which DMA channels to
abort by setting the corresponding, DMAARM.DMAARMn bits to 1
6:5
4
DMAARM4
0
Normal operation
1
Abort channels all selected channels
-
R0
Not used
0
R/W
DMA arm channel 4
This bit must be set to 1 in order for any byte/word transfers to occur on the
channel. For non-repetitive transfer modes, the bit is automatically cleared when
the transfer count is reached
3
DMAARM3
0
R/W
DMA arm channel 3
This bit must be set to 1 in order for any byte/word transfers to occur on the
channel. For non-repetitive transfer modes, the bit is automatically cleared when
the transfer count is reached
2
DMAARM2
0
R/W
DMA arm channel 2
This bit must be set to 1 in order for any byte/word transfers to occur on the
channel. For non-repetitive transfer modes, the bit is automatically cleared when
the transfer count is reached
1
DMAARM1
0
R/W
DMA arm channel 1
This bit must be set to 1 in order for any byte/word transfers to occur on the
channel. For non-repetitive transfer modes, the bit is automatically cleared when
the transfer count is reached
0
DMAARM0
0
R/W
DMA arm channel 0
This bit must be set to 1 in order for any byte/word transfers to occur on the
channel. For non-repetitive transfer modes, the bit is automatically cleared when
the transfer count is reached
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DMAREQ (0xD7) - DMA Channel Start Request and Status
Bit
Field Name
7:5
4
3
2
1
0
DMAREQ4
DMAREQ3
DMAREQ2
DMAREQ1
DMAREQ0
Reset
R/W
Description
-
R0
Not used
0
R/W1
H0
DMA channel 4, manual trigger
0
0
0
0
Setting this bit to 1 will have the same effect as a single trigger event.
This bit is cleared when the DMA channel is granted access.
R/W1
H0
DMA channel 3, manual trigger
R/W1
H0
DMA channel 2, manual trigger
R/W1
H0
DMA channel 1, manual trigger
R/W1
H0
DMA channel 0, manual trigger
Setting this bit to 1 will have the same effect as a single trigger event.
This bit is cleared when the DMA channel is granted access.
Setting this bit to 1 will have the same effect as a single trigger event.
This bit is cleared when the DMA channel is granted access.
Setting this bit to 1 will have the same effect as a single trigger event.
This bit is cleared when the DMA channel is granted access.
Setting this bit to 1 will have the same effect as a single trigger event.
This bit is cleared when the DMA channel is granted access.
DMA0CFGH (0xD5) - DMA Channel 0 Configuration Address High Byte
Bit
Field Name
Reset
R/W
Description
7:0
DMA0CFG[15:8]
0x00
R/W
The DMA channel 0 configuration address, high byte
DMA0CFGL (0xD4) - DMA Channel 0 Configuration Address Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
DMA0CFG[7:0]
0x00
R/W
The DMA channel 0 configuration address, low byte
DMA1CFGH (0xD3) - DMA Channel 1 - 4 Configuration Address High Byte
Bit
Field Name
Reset
R/W
Description
7:0
DMA1CFG[15:8]
0x00
R/W
The DMA channel 1 - 4 configuration address, high byte
DMA1CFGL (0xD2) - DMA Channel 1 - 4 Configuration Address Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
DMA1CFG[7:0]
0x00
R/W
The DMA channel 1 - 4 configuration address, low byte
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DMAIRQ (0xD1) - DMA Interrupt Flag
Bit
Field Name
7:5
4
DMAIF4
Reset
R/W
Description
-
R0
Not used
0
R/W0
DMA channel 4 interrupt flag.
0 Transfer count not reached
1 Transfer count reached/interrupt pending
3
DMAIF3
0
R/W0
DMA channel 3 interrupt flag.
0 Transfer count not reached
1 Transfer count reached/interrupt pending
2
DMAIF2
0
R/W0
DMA channel 2 interrupt flag.
0 Transfer count not reached
1 Transfer count reached/interrupt pending
1
0
DMAIF1
DMAIF0
0
0
R/W0
R/W0
DMA channel 1 interrupt flag.
0
Transfer count not reached
1
Transfer count reached/interrupt pending
DMA channel 0 interrupt flag.
0
Transfer count not reached
1
Transfer count reached/interrupt pending
ENDIAN (0x95) - USB Endianess Control (CC2511Fx)
Bit
Field Name
7:2
1
0
USBWLE
USBRLE
Reset
R/W
Description
0
R/W
Not used
0
R/W
USB Write Endianess setting for DMA channel word transfers to USB.
0
R/W
0
Big Endian
1
Little Endian
USB Read Endianess setting for DMA channel word transfers from USB.
0
Big Endian
1
Little Endian
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12.6 16-bit Timer, Timer 1
Timer 1 is an independent 16-bit timer which
supports typical timer/counter functions such
as input capture, output compare, and PWM
functions. The timer has three independent
capture/compare channels and uses one I/O
pin per channel.
The features of Timer 1 are as follows:
• Three capture/compare channels
• Rising, falling, or any edge input capture
• Set, clear, or toggle output compare
• Free-running, modulo
counter operation
or
up/down
• Clock prescaler for divide by 1, 8, 32, or
128
• Interrupt
request
generation
on
capture/compare and when reaching the
terminal count value
• Capture triggered by radio
• DMA trigger function
• Delta-Sigma Modulator (DSM) mode
Note: In the following sections, an n in the
register name represent the channel
number 0, 1, or 2 if nothing else is stated
clock frequency used by Timer 1 is fXOSC/2 for
CC2510Fx and 12 MHz for CC2511Fx, given that
the HS RCOSC has been calibrated.
The counter operates as either a free-running
counter, a modulo counter, or as an up/down
counter for use in centre-aligned PWM. It can
also be used in DSM mode.
It is possible to read the 16-bit counter value
through the two 8-bit SFRs; T1CNTH and
T1CNTL, containing the high-order byte and
low-order byte respectively. When the T1CNTL
register is read, the high-order byte of the
counter at that instant is buffered in T1CNTH
so that the high-order byte can be read from
T1CNTH. Thus T1CNTL shall always be read
first before reading T1CNTH.
All write accesses to the T1CNTL register will
reset the 16-bit counter.
The counter may produce an interrupt request
when the terminal count value (overflow) is
reached (see Section 12.6.2.1 - 12.6.2.3). It is
possible to start and halt the counter with
T1CTL control register settings. The counter is
started when a value other than 00 is written to
T1CTL.MODE. If 00 is written to T1CTL.MODE
the counter halts at its present value.
12.6.2
12.6.1
16-bit Timer Counter
The timer consists of a 16-bit counter that
increments or decrements at each active clock
edge. The frequency of the active clock edges
is
given
by
CLKCON.TICKSPD
and
T1CTL.DIV. CLKCON.TICKSPD is used to set
the timer tick speed. The timer tick speed will
vary from 203.125 kHz to 26 MHz for CC2510Fx
and 187.5 kHz to 24 MHz for CC2511Fx (given
the use of a 26 MHz or 48 MHz crystal
respectively). Note that the clock speed of the
system clock is not affected by the TICKSPD
setting. The timer tick speed is further divided
in Timer 1 by the prescaler value set by
T1CTL.DIV. This prescaler value can be 1, 8,
32, or 128. Thus the lowest clock frequency
used by Timer 1 is 1.587 kHz and the highest
is 26 MHz when a 26 MHz crystal oscillator is
used as system clock source (CC2510Fx). The
lowest clock frequency used by Timer 1 is
1.465 kHz and the highest is 24 MHz for
CC2511Fx. When the high speed RC oscillator is
used as system clock source, the highest
Timer 1 Operation
In general, the control register T1CTL is used
to control the timer operation. The various
modes of operation are described in the
following three sections.
12.6.2.1
Free-running Mode
In free-running mode the counter starts from
0x0000 and increments at each active clock
edge. When the counter reaches the terminal
count value 0xFFFF (overflow), the counter is
loaded with 0x0000 on the next timer tick and
continues incrementing its value as shown in
Figure 29. When 0xFFFF is reached, the
T1CTL.OVFIF flag is set. The IRCON.T1IF
flag is only asserted if the corresponding
interrupt mask bit TIMIF.OVFIM is set. An
interrupt request is generated when both
TIMIF.OVFIM and IEN1.T1EN are set to 1.
The free-running mode can be used to
generate independent time intervals and
output signal frequencies.
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0xFFFF
0x0000
OVFIF = 1
OVFIF = 1
Figure 29: Free-running Mode
12.6.2.2
Modulo Mode
T1CTL.OVFIF flag is set. The IRCON.T1IF
flag is only asserted if the corresponding
interrupt mask bit TIMIF.OVFIM is set. An
interrupt request is generated when both
TIMIF.OVFIM and IEN1.T1EN are set to 1.
The modulo mode can be used for
applications where a period other than 0xFFFF
is required.
In modulo mode the counter starts from
0x0000 and increments at each active clock
edge. When the counter reaches the terminal
count value T1CC0 (overflow), held in the
registers T1CC0H:T1CC0L, the counter is
loaded with 0x0000 on the next timer tick and
continues incrementing its value as shown in
Figure 30. When T1CC0 is reached, the
T1CC0
0x0000
OVFIF = 1
OVFIF = 1
Figure 30: Modulo Mode
12.6.2.3
Up/Down Mode
flag is set. The IRCON.T1IF flag is only
asserted if the corresponding interrupt mask
bit TIMIF.OVFIM is set. An interrupt request
is generated when both TIMIF.OVFIM and
IEN1.T1EN are set to 1. The up/down mode
can be used when symmetrical output pulses
are required with a period other than 0xFFFF,
and therefore allows implementation of centrealigned PWM output applications.
In up/down mode the counter starts from
0x0000 and increments at each active clock
edge. When the counter value matches the
terminal count value T1CC0, held in the
registers T1CC0H:T1CC0L, the counter counts
down until 0x0000 is reached and it starts
counting up again as shown in Figure 31.
When 0x0000 is reached, the T1CTL.OVFIF
T1CC0
0x0000
OVFIF = 1
OVFIF = 1
Figure 31: Up/Down Mode
12.6.3
Channel Mode Control
The channel mode is set with each channel’s
control and status register T1CCTLn. The
settings include input capture and output
compare modes.
Note: Before an I/O pin can be used by the
timer, the required I/O pin must be configured
as a Timer 1 peripheral pin as described in
Section 12.4.6 on Page 88 .
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12.6.4
Input Capture Mode
When a channel is configured as an input
capture channel, the I/O pin associated with
that channel, is configured as an input. After
the timer has been started, a rising edge,
falling edge or any edge on the input pin will
trigger a capture of the 16-bit counter contents
into the associated capture register. Thus the
timer is able to capture the time when an
external event takes place.
The channel input pin is synchronized to the
internal system clock. Thus pulses on the input
pin must have a minimum duration greater
than the system clock period.
The contents of the 16-bit capture register can
be read from registers T1CCnH:T1CCnL.
When the capture takes place, the interrupt
flag
for
the
appropriate
channel
(T1CTL.CH0IF,
T1CTL.CH1IF,
or
T1CTL.CH2IF for channel 0, 1, and 2
respectively) is asserted. The IRCON.T1IF
flag is only asserted if the corresponding
interrupt mask bit T1CCTL0.IM, T1CCTL1.IM,
or T1CCTL2.IM is set to 1. An interrupt
request is generated if the corresponding
interrupt mask bit is set together with
IEN1.T1EN.
12.6.4.1
RF Event Capture
Each timer channel may be configured so that
the RF events associated with the RF interrupt
(interrupt #16) will trigger a capture instead of
the normal input pin capture. This is done by
setting
T1CCTLn.CPSEL=1. When
this
configuration is chosen, the RF event(s)
enabled by RFIM (see Section 13.3.1 on Page
185) will trigger a capture. This way the timer
can be used to capture a value when e.g. a
start of frame delimiter (SFD) is detected.
Note: When using an RF event to trigger a
capture, both CLKCON.CLKSPD and
CLKCON.TICKSPD must be set to 000.
12.6.5
Output Compare Mode
In output compare mode the I/O pin associated
with a channel is set as an output. After the
timer has been started, the contents of the
counter are compared with the contents of the
channel compare register T1CCnH:T1CCnL. If
the compare register equals the counter
contents, the output pin is set, reset, or toggled
according to the compare output mode setting
of T1CCTLn.CMP. Note that all edges on
output pins are glitch-free when operating in a
given output compare mode. Writing to the
compare register T1CCnL is buffered so that a
value written to T1CCnL does not take effect
until the corresponding high order register,
T1CCnH is written. For output compare modes
0 - 2, a new value written to the compare
register T1CCnH:T1CCnL takes effect after
the registers have been written. For other
output compare modes the new value written
to the compare register takes effect when the
timer reaches 0x0000.
Note that channel 0 has fewer output compare
modes than channel 1 and 2 because
T1CC0H:T1CC0L has a special function in
modes 5 and 6, meaning these modes would
not be useful for channel 0.
When a compare occurs, the interrupt flag for
the appropriate channel (T1CTL.CH0IF,
T1CTL.CH1IF, or T1CTL.CH2IF for channel
0, 1, and 2 respectively) is asserted. The
IRCON.T1IF flag is only asserted if the
corresponding interrupt mask bit T1CCTL0.IM,
T1CCTL1.IM, or T1CCTL2.IM is set to 1. An
interrupt request is generated if the
corresponding interrupt mask bit is set together
with IEN1.T1EN. When operating in up-down
mode, the interrupt flag for channel 0 is set
when the counter reaches 0x0000 instead of
when a compare occurs.
Examples of output compare modes in various
timer modes are given in Figure 32, Figure 33,
and Figure 34.
Edge-aligned: PWM output signals can be
generated using the timer modulo mode and
channels 1 and 2 in output compare mode 5 or
6 (defined by T1CCTLn.CMP bits, where n is 1
or 2) as shown in Figure 33. The period of the
PWM signal is determined by the setting in
T1CC0 and the duty cycle is determined by
T1CCn.
PWM output signals can also be generated
using the timer free-running mode and
channels 1 and 2 in output compare mode 5 or
6 as shown in Figure 32. In this case the
period of the PWM signal is determined by
CLKCON.TICKSPD and the prescaler divider
value in T1CTL.DIV and the duty cycle is
determined by T1CCn (n = 1 or 2).
The polarity of the PWM signal is determined
by whether output compare mode 5 or 6 is
used.
For both modulo mode and free-running mode
it is also possible to use compare mode 3 or 4
to generate a PWM output signal (see Figure
32 and Figure 33).
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The polarity of the PWM signal is determined
by whether output compare mode 3 or 4 is
used.
Centre-aligned: PWM outputs can be
generated when the timer up/down mode is
selected. The channel output compare mode 3
or 4 (defined by T1CCTLn.CMP bits, where n is
1 or 2) is selected depending on required
polarity of the PWM signal (see Figure 34).
The period of the PWM signal is determined by
T1CC0 and the duty cycle for the channel
output is determined by T1CCn (n = 1 or 2).
0xFFFF
T1CC0
T1CCn
0x0000
0: Set output on compare
1: Clear output on compare
2: Toggle output on compare
3: Set output on compare-up,
clear on 0
4: Clear output on compare-up,
set on 0
5: Set when T1CCn,
clear when T1CC0
6: Clear when T1CCn,
set when T1CC0
T1CCn
T1CC0
T1CCn
T1CC0
Figure 32: Output Compare Modes, Timer Free-running Mode
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T1CC0
T1CCn
0x0000
0: Set output on compare
1: Clear output on compare
2: Toggle output on compare
3: Set output on compare-up,
clear on 0
4: Clear output on compare-up,
set on 0
5: Set when T1CCn,
clear when T1CC0
6: Clear when T1CCn,
set when T1CC0
T1CCn
T1CC0
T1CCn
T1CC0
Figure 33: Output Compare Modes, Timer Modulo Mode
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T1CC0
T1CCn
0x0000
0: Set output on compare
1: Clear output on compare
2: Toggle output on compare
3: Set output on compare-up,
clear on compare down
4: Clear output on compare-up,
set on compare-down
5: Set when T1CCn,
clear when T1CC0
6: Clear when T1CCn,
set when T1CC0
T1CCn
T1CC0
T1CCn
T1CCn
T1CC0
T1CCn
Figure 34: Output Modes, Timer Up/Down Mode
12.6.6
Timer 1 Interrupts
There is one interrupt vector assigned to the
timer. This is T1 (Interrupt #9, see
Table
39). The following timer events may generate
an interrupt request:
• Counter reaches terminal count value
(overflow) or turns around on zero
• Input capture event
• Output compare event
The
register
bits
T1CTL.OVFIF,
T1CTL.CH0IF,
T1CTL.CH1IF,
and
T1CTL.CH2IF contains the interrupt flags for
the terminal count value event (overflow), and
the three channel compare/capture events,
respectively. These flags will be asserted
regardless off the channel n interrupt mask bit
(T1CCTLn.IM). The CPU interrupt flag,
IRCON.T1IF will only be asserted if one or
more of the channel n interrupt mask bits are
set to 1. An interrupt request is only generated
when the corresponding interrupt mask bit is
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set together with IEN1.T1EN. The interrupt
mask bits are T1CCTL0.IM, T1CCTL1.IM,
T1CCTL2.IM, and TIMIF.OVFIM. Note that
enabling an interrupt mask bit will generate a
new interrupt request if the corresponding
interrupt flag is set.
When the timer is used in Free-running Mode
or Modulo Mode the interrupt flags are set as
follows:
• T1CTL.CH0IF, T1CTL.CH1IF,
T1CTL.CH2IF
are
set
compare/capture event
and
on
• T1CTL.OVFIF is set when counter
reaches terminal count value (overflow)
When the timer is used in Up/Down Mode the
interrupt flags are set as follows:
In compare mode:
• T1CTL.CH0IF
and
T1CTL.OVFIF
are set when counter turns around on
zero
• T1CTL.CH1IF
and
T1CTL.CH2IF
are set on compare event
In capture mode:
• T1CTL.OVFIF is set when counter
turns around on zero
• T1CTL.CH0IF, T1CTL.CH1IF, and
T1CTL.CH2IF are set on capture event
I addition, the CPU interrupt flag, IRCON.T1IF
will be asserted if the channel n interrupt mask
bit (T1CCTLn.IM) is set to 1.
12.6.7
Timer 1 DMA Triggers
There are three DMA triggers associated with
Timer 1, one for each channel. These are DMA
triggers T1_CH0, T1_CH1 and T1_CH2, which
are generated on timer compare events as
follows:
• T1_CH0 - Channel 0 compare
• T1_CH1 - Channel 0 compare
• T1_CH2 - Channel 0 compare
12.6.8
DSM Mode
Timer 1 also contains a 1-bit Delta-Sigma
Modulator (DSM) of second order that can be
used to produce a mono audio output PWM
signal. The DSM removes the need for high
order external filtering required when using
regular PWM mode.
The DSM operates at a fixed speed of either
1/4 or 1/8 of the timer tick speed set by
CLKCON.TICKSPD. The DSM speed is set by
T1CCTL1.MODE. The input samples are
updated at a configurable sampling rate set by
the terminal count value T1CC0.
An interpolator is used to match the sampling
rate with the DSM update rate. This
interpolator is of first order with a scaling
compensation. The scaling compensation is
due to variable gain defined by the difference
in sampling speed and DSM speed. This
interpolation mechanism can be disabled by
setting
T1CCTL1.CAP=10
or
T1CCTL1.CAP=11, thus using a zeroth order
interpolator.
In addition to the interpolator, a shaper can be
used to account for differences in rise/fall times
in the output signal. Also the shaper is
enabled/disabled using the two CAP bits in the
T1CCTL1 register. This shaper ensures a
rising and a falling edge per bit and will thus
limit the output swing to 1/8 to 7/8 of I/O VDD
when the DSM operates at 1/8 of the timer tick
speed or 1/4 to 3/4 of I/O VDD when the DSM
operates at 1/4 of the timer tick speed.
The DSM is used as in PWM mode where the
terminal count value T1CC0 defines the
period/sampling rate. The DSM can not use
the Timer 1 prescaler to further slow down the
period.
Timer 1 must be configured to operate in
modulo mode (T1CTL.MODE=10) and channel
0 must be configured to compare mode
(T1CCTL0.MODE=1).
The terminal count
value T1CC0, held in the registers
T1CC0H:T1CC0L, defines the sample rate.
Table 53 shows some T1CC0 settings for
different
sample
rates
(CLKCON.TICKSPD=000).
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CC2510Fx / CC2511Fx
Sample Rate
T1CC0H
T1CC0L
8 kHz @ 24 MHz
0x0B
0xB7
8 kHz @ 26 MHz
0x0C
0xB1
16 kHz @ 24 MHz
0x05
0xDB
16 kHz @ 26 MHz
0x06
0x59
48 kHz @ 24 MHz
0x01
0xF3
48 kHz @ 26 MHz
0x02
0x1D
64 kHz @ 24 MHz
0x01
0x76
64 kHz @ 26 MHz
0x01
0x96
Table 53: Channel 0 Period Setting for some Sampling Rates (CLKCON.TICKSPD=000)
Since the DSM starts immediately after DSM
mode has been enabled by setting
T1CCTL1.CMP=111, all configuration should
have been performed prior to enabling DSM
mode. Also, the Timer 1 counter should be
cleared and started just before starting the
DSM operation (all write accesses to the
T1CNTL register will reset the 16-bit counter
while writing a value other than 00 to
T1CTL.MODE will start the counter). A simple
procedure for setting up DSM mode should
then be as follows:
On each Timer 1 IRQ or Timer 1 DMA trigger,
write a new sample to the T1CC1H:T1CC1L
registers. The least significant bits must be
written to T1CC1L before the most significant
bits are written to T1CC1H.
1. Suspend timer 1 (T1CTL.MODE=00)
This section describes the following Timer 1
registers:
2. Clear timer counter by writing any
value to T1CNTL, (CNT=0x0000)
The samples written must be signed 2’s
complement values. The 2 least significant bits
will always be treated as 0, thus the effective
sample size is 14 bits.
12.6.9
• T1CNTH – Timer 1 Counter High
• T1CNTL – Timer 1 Counter Low
3. Set the sample rate by writing to
T1CC0.
• T1CTL – Timer 1 Control and Status
4. Set Timer 1 channel 0 compare mode
(T1CCTL0.MODE=1)
• T1CCTLn – Timer 1
Capture/Compare Control
5. Load first sample if available (or zero if
no
sample
available)
into
T1CC1H:T1CC1L.
6. Set timer operation to modulo mode
(T1CTL.MODE=10)
7. Configure the DSM by setting the
MODE and CAP fields of the T1CCTL1
register.
8. Enable
DSM
(T1CCTL1.CMP=111)
Timer 1 Registers
Channel
n
• T1CCnH – Timer 1 Channel
Capture/Compare Value High
n
• T1CCnL
Timer
1
Channel
Capture/Compare Value Low
n
The TIMIF register is described in Section
12.9.7.
mode
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
T1CNTH (0xE3) - Timer 1 Counter High
Bit
Field Name
Reset
R/W
Description
7:0
CNT[15:8]
0x00
R
Timer count high order byte. Contains the high byte of the 16-bit timer counter
buffered at the time T1CNTL is read.
T1CNTL (0xE2) - Timer 1 Counter Low
Bit
Field Name
Reset
R/W
Description
7:0
CNT[7:0]
0x00
R/W
Timer count low order byte. Contains the low byte of the 16-bit timer counter.
Writing anything to this register results in the counter being cleared to 0x0000.
T1CTL (0xE4) - Timer 1 Control and Status
Bit
Field Name
Reset
R/W
Description
7
CH2IF
0
R/W0
Timer 1 channel 2 interrupt flag
6
5
4
3:2
CH1IF
CH0IF
OVFIF
DIV[1:0]
0
0
0
00
R/W0
R/W0
R/W0
R/W
0
No interrupt pending
1
Interrupt pending
Timer 1 channel 1 interrupt flag
0
No interrupt pending
1
Interrupt pending
Timer 1 channel 0 interrupt flag
0
No interrupt pending
1
Interrupt pending
Timer 1 counter overflow interrupt flag. Set when the counter reaches the
terminal count value in free-running or modulo mode or when counter turns
around on zero in up/down mode
0
No interrupt pending
1
Interrupt pending
Prescaler divider value. Generates the active clock edge used to update the
counter as follows:
00
Tick frequency/1
01
Tick frequency/8
10
Tick frequency/32
11
Tick frequency/128
Note: The prescaler counter is not reset when writing these bits, hence one
prescaler period may be needed before updated data is used.
1:0
MODE[1:0]
00
R/W
Timer 1 mode select. The timer operating mode is selected as follows:
00
Operation is suspended
01
Free-running, repeatedly count from 0x0000 to 0xFFFF
10
Modulo, repeatedly count from 0x0000 to T1CC0
11
Up/down, repeatedly count from 0x0000 to T1CC0 and from T1CC0 down
to 0x0000
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
T1CCTL0 (0xE5) - Timer 1 Channel 0 Capture/Compare Control
Bit
Field Name
Reset
R/W
Description
7
CPSEL
0
R/W
Timer 1 channel 0 capture select
6
5:3
2
1:0
IM
CMP[2:0]
MODE
CAP[1:0]
1
000
0
00
R/W
R/W
R/W
R/W
0
Use normal capture input
1
Use RF event(s) enabled in the RFIM register to trigger a capture
Channel 0 interrupt mask
0
Interrupt disabled
1
Interrupt enabled
Channel 0 compare mode select. Selects action on output when timer value equals
compare value in T1CC0
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Reserved
110
Reserved
111
Reserved
Mode. Select Timer 1 channel 0 capture or compare mode
0
Capture mode
1
Compare mode
Channel 0 capture mode select
00
No capture
01
Capture on rising edge
10
Capture on falling edge
11
Capture on both edges
T1CC0H (0xDB) - Timer 1 Channel 0 Capture/Compare Value High
Bit
Field Name
Reset
R/W
Description
7:0
T1CC0[15:8]
0x00
R/W
Timer 1 channel 0 capture/compare value, high order byte.
Set the DSM sample rate in DSM mode
T1CC0L (0xDA) - Timer 1 Channel 0 Capture/Compare Value Low
Bit
Field Name
Reset
R/W
Description
7:0
T1CC0[7:0]
0x00
R/W
Timer 1 channel 0 capture/compare value, low order byte
Set the DSM sample rate in DSM mode
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
T1CCTL1 (0xE6) - Timer 1 Channel 1 Capture/Compare Control
Bit
Field Name
Reset
R/W
Description
7
CPSEL
0
R/W
Timer 1 channel 1 capture select
6
5:3
2
1:0
IM
CMP[2:0]
MODE
CAP[1:0]
1
000
0
00
R/W
R/W
R/W
0
Use normal capture input
1
Use RF event(s) enabled in the RFIM register to trigger a capture
Channel 1 interrupt mask
0
Interrupt disabled
1
Interrupt enabled
Channel 1 compare mode select. Selects action on output when timer value equals
compare value in T1CC1
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Set when equal to T1CC1, clear when equal to T1CC0
110
Clear when equal to T1CC1, set when equal to T1CC0
111
DSM mode enable
CMP≠111
CMP=111
Select Timer 1 channel 1 capture
or compare mode
Set the DSM speed
0
Capture mode
1/8 of timer tick speed
1
Compare mode
1/4 of timer tick speed
Channel 1 capture mode
select (timer mode)
DSM interpolator and output shaping
configuration (DSM mode)
00
No capture
DSM interpolator and output shaping
enabled
01
Capture on rising edge
DSM interpolator enabled and output
shaping disabled
10
Capture on falling edge
DSM interpolator disabled and output
shaping enabled
11
Capture on both edges
DSM interpolator and output shaping
disabled
R/W
T1CC1H (0xDD) - Timer 1 Channel 1 Capture/Compare Value High
Bit
Field Name
Reset
R/W
7:0
T1CC1[15:8]
0x00
R/W
Description
Timer 1 channel 1 capture/compare value, high order byte
DSM data high order byte (DSM mode)
T1CC1L (0xDC) - Timer 1 Channel 1 Capture/Compare Value Low
Bit
Field Name
Reset
R/W
Description
7:0
T1CC1[7:0]
0x00
R/W
Timer 1 channel 1 capture/compare value, low order byte
DSM data low order byte. The two least significant bits are not used. (DSM mode)
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
T1CCTL2 (0xE7) - Timer 1 Channel 2 Capture/Compare Control
Bit
Field Name
Reset
R/W
Description
7
CPSEL
0
R/W
Timer 1 channel 2 capture select
6
5:3
2
1:0
IM
CMP[2:0]
MODE
CAP[1:0]
1
000
0
00
R/W
R/W
R/W
R/W
0
Use normal capture input
1
Use RF event(s) enabled in the RFIM register to trigger a capture
Channel 2 interrupt mask
0
Interrupt disabled
1
Interrupt enabled
Channel 2 compare mode select. Selects action on output when timer value equals
compare value in T1CC2
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Set when equal to T1CC2, clear when equal to T1CC0
110
Clear when equal to T1CC2, set when equal to T1CC0
111
Not used
Mode. Select Timer 1 channel 2 capture or compare mode
0
Capture mode
1
Compare mode
Channel 2 capture mode select
00
No capture
01
Capture on rising edge
10
Capture on falling edge
11
Capture on both edges
T1CC2H (0xDF) - Timer 1 Channel 2 Capture/Compare Value High
Bit
Field Name
Reset
R/W
Description
7:0
T1CC2[15:8]
0x00
R/W
Timer 1 channel 2 capture/compare value, high order byte
T1CC2L (0xDE) - Timer 1 Channel 2 Capture/Compare Value Low
Bit
Field Name
Reset
R/W
Description
7:0
T1CC2[7:0]
0x00
R/W
Timer 1 channel 2 capture/compare value, low order byte
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
12.7 MAC Timer (Timer 2)
The MAC timer is designed for slot timing
operations used by the MAC layer in an RF
protocol. The timer includes a highly tunable
prescaler allowing the user to select a timer
interval that equals, or is an integer fraction of,
a transmission slot.
prescaler value, T2PR, defines the 8 MSB of
the 18 bit counter and thus set the maximum
value.
The timer 2 interval / time slot, T, can be given
as:
• 8-bit timer
T = T2PR ∙ Val(T2CTL.TIP)/ timer tick speed,
• 18-bit tunable prescaler
where the function Val(x) is set by T2CTL.TIP
and defined as
12.7.1
Val(00) = 64
Timer Operation
This section describes the operation of the
timer.
Val(01) = 128
The timer count can be read from the T2CT
SFR. At each active clock edge, the timer
count is decremented by one. When the timer
count reaches 0x00, the register bit
T2CTL.TEX is set to 1. When T2CTL.TIG=0,
the timer will not wrap around when the timer
count reaches 0x00. When T2CTL.TIG=1,
timer count will wrap around and start counting
down from 0xFF.
Val(11) = 1024
If T2CTL.INT=1, IRCON.T2IF will also be
asserted when T2CTL.TEX is set to 1. An
interrupt request will be generated if both
T2CTL.INT and IEN1.T2IE are set to 1.
When a new value is written to the timer count
register, T2CT, this value is stored in the
counter immediately. If an active clock edge
and a write to T2CT occur at the same time,
the written value will be decremented before it
is stored.
The 18 bit prescaler is controlled by:
Val(10) = 256
Example:
T2PR = 0x09
T2CTL.TIP = 10
CLKCON.TICKSPD = 101 (812.5 kHz @ when
fxosc = 26 MHz)
T = 9 ∙ 256 / 812.5 kHz = 2.84 ∙10 s
-3
12.7.2
Timer 2 DMA Trigger
There is one DMA trigger associated with
Timer 2. This is the DMA trigger T2_OVFL,
which is generated when T2CTL.TEX is set to
1.
12.7.3
Timer 2 Registers
The SFRs associated with Timer 2 are listed in
this section. These registers are the following:
• Timer tick speed (CLKCON.TICKSPD)
• T2CTL – Timer 2 Control
• T2CTL.TIP
• T2PR – Timer 2 Prescaler
• Prescaler value (T2PR)
• T2CT – Timer 2 Count
All events in timer 2 are aligned to timer tick
speed
given
by
CLKCON.TICKSPD.
T2CTL.TIP defines how fast the prescaler
counter counts up towards its maximum value
where it is reset and starts over again. The
SWRS055G
Note: These registers will be in their reset
state when returning to active mode from
PM2 and PM3.
Page 121 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
T2CTL (0x9E) - Timer 2 Control
Bit
Field Name
7
6
TEX
5
4
INT
3
2
1:0
TIG
TIP[1:0]
Reset
R/W
Description
0
R/W
0
Reserved
0
R/W
0
This bit is set to 1 when the timer count reaches 0x00. Writing a 1 to this bit has no
effect
0
R/W
Reserved. Always set to 0.
0
R/W
Timer 2 Interrupt enable
0
Interrupt disable
1
Interrupt enable
0
R/W
Reserved. Always set to 0
0
R/W
Tick generator mode
00
R/W
0
Tick generator is running when T2CT not equal to 0x00. The tick generator
will always start running form its null state.
1
Tick generator is in free-running mode. If it is not already running it will start
from its null state when this bit is set to 1
This value is used to calculate the timer 2 interval / time slot, T
T = T2PR ∙ Val(T2CTL.TIP)/ timer tick speed,
00
64
01
128
10
256
11
1024
T2CT (0x9C) - Timer 2 Count
Bit
Field Name
Reset
R/W
Description
7:0
CNT[7:0]
0x00
R/W
Timer count. Contents of 8-bit counter.
T2PR (0x9D) - Timer 2 Prescaler
Bit
Field Name
Reset
R/W
Description
7:0
PR[7:0]
0x00
R/W
Timer prescaler multiplier. 0x00 is interpreted as 256
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
12.8 Sleep Timer
The Sleep Timer is used to control when the
CC2510Fx/CC2511Fx exits from PM{0 - 2} and
hence the Sleep Timer can be used to
implement a wake up functionality which
enables CC2510Fx/CC2511Fx to periodically wake
up to active mode and listen for incoming RF
packets.
Note: The Sleep timer should not be used
in active mode
12.8.1
given
by
WOREVT1.EVENT0
and
WOREVT0.EVENT0, and an exponent value set
by WORCTRL.WOR_RES. When using the low
power RC oscillator to clock the Sleep Timer,
tEvent0 is given by:
t Event 0 =
750
⋅ EVENT 0 ⋅ 25⋅WOR _ RES
f ref
If the 32.768 kHz crystal oscillator is used to
clock the Sleep Timer, tEvent0 is calculated as
follows:
Sleep Timer Operation
This section describes the operation of the
timer.
Note: In this section of the document, fRef is
used to denote the reference frequency for
the synthesizer.
For CC2510Fx f ref = f XOSC and for
CC2511Fx, f ref = f XOSC
2
t Event 0 =
1
⋅ EVENT 0 ⋅ 25⋅WOR _ RES
32768
The time from the CC2510Fx/CC2511Fx enters
PM2 until the next Event 0 is programmed to
appear (tSLEEPmin) should be larger than 11.08
ms when fref is 26 MHz and 12 ms when fref is
24 MHz (Sleep Timer clocked by the low
power RC oscillator).
t SLEEPmin =
When referring to the low power RCOSC,
calibrated values are assumed
The Sleep Timer consists of a 31-bit counter.
The appropriate bits of this counter are
selected according to a resolution setting
determined by the WORCTRL.WOR_RES
register bits. The Sleep Timer is either clocked
by the 32.768 kHz crystal oscillator or by the
low power RC oscillator (fref / 750). The timer
can only be used in PM0, PM1, and PM2.
The Sleep Timer has a programmable timing
event called Event 0. While in PM0, PM1, or
PM2, reaching Event 0 will make the
CC2510Fx/CC2511Fx enter active mode.
The time between two consecutive Event 0’s
(tEvent0) is programmed with a mantissa value
750
⋅ 384
f ref
When the Sleep Timer is clocked by the
32.768 kHz crystal oscillator, tSLEEPmin = 11.72
ms (384/32768).
12.8.2
Sleep Timer and Power Modes
Entering PM{0 - 2} and/or updating EVENT0
and has to be aligned to a positive edge on the
32 kHz clock source. The following code
examples should be used in order to update
EVENT0 and/or entering PM{0 - 2} correctly:
Please note that the update rate of the
WORTIME0 register will depend on the Sleep
Timer
resolution,
configured
through
WORCTRL.WOR_RES.
// Alignment of entering PM{0 – 2} to a positive edge on the 32 kHz clock source
char temp = WORTIME0;
while(temp == WORTIME0);
// Wait until a positive 32 kHz edge
PCON |= 0x01;
// Enter PM{0 – 2}
// Alignment of updating EVENT0 to a positive edge on the 32 kHz clock source
char temp = WORTIME0;
while(temp == WORTIME0);
// Wait until a positive 32 kHz edge
WOREVT1 = desired event0 >> 8;
// Set EVENT0, high byte
WOREVT0 = desired event0;
// Set EVENT0, low byte
// Alignment of both updating EVENT0
// on the 32 kHz clock source
char temp = WORTIME0;
while(temp == WORTIME0);
WOREVT1 = desired event0 >> 8;
WOREVT0 = desired event0;
PCON |= 0x01;
and entering PM{0 - 2}to a positive edge
//
//
//
//
Wait until a positive 32 kHz edge
Set EVENT0, high byte
Set EVENT0, low byte
Enter PM{0 – 2}
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
If EVENT0 is changed to a value lower than the
current counter value, WORCTRL.WOR_RESET
has to be asserted first to reset the timer. The
assertion of WORCTRL.WOR_RESET must be
// Reset timer and enter PM{0 – 2}
WORCTRL |= 0x04;
char temp = WORTIME0;
while(temp == WORTIME0);
temp = WORTIME0;
while(temp == WORTIME0);
PCON |= 0x01;
// Reset timer and update EVENT0
WORCTRL |= 0x04;
char temp = WORTIME0;
while(temp == WORTIME0);
temp = WORTIME0;
while(temp == WORTIME0);
WOREVT1 = desired event0 >> 8;
WOREVT0 = desired event0;
followed by two positive edges on the 32 kHz
clock source. The code below shows how to
reset the Sleep Timer in combination with
updating EVENT0 and/or entering PM{0 - 2}.
// Reset Sleep Timer
// Wait until a positive 32 kHz edge
// Wait until a positive 32 kHz edge
// Enter PM{0 – 2}
// Reset Sleep Timer
// Wait until a positive 32 kHz edge
// Wait until a positive 32 kHz edge
// Set EVENT0, high byte
// Set EVENT0, low byte
// Reset timer, update EVENT0, and enter PM{0 – 2}
WORCTRL |= 0x04;
// Reset Sleep Timer
char temp = WORTIME0;
while(temp == WORTIME0);
// Wait until a positive 32 kHz edge
temp = WORTIME0;
while(temp == WORTIME0);
// Wait until a positive 32 kHz edge
WOREVT1 = desired event0 >> 8;
// Set EVENT0, high byte
WOREVT0 = desired event0;
// Set EVENT0, low byte
PCON |= 0x01;
// Enter PM{0 – 2}
12.8.3
Low Power RC Oscillator and Timing
This section applies to using the low power RC
oscillator as clock source for the Sleep Timer.
The frequency of the low-power RC oscillator,
which can be used as clock source for the
Sleep Timer, varies with temperature and
supply voltage. In order to keep the frequency
as accurate as possible, the RC oscillator will
be calibrated whenever possible, which is
when the high speed crystal oscillator is
running and the chip is in active mode or PM0.
When the chip goes to PM1 or PM2, the RC
oscillator will use the last valid calibration
result. The frequency of the low power RC
oscillator is therefore locked to fref / 750.
12.8.4
Sleep Timer Interrupt
When
Event
0
occurs,
the
WORIRQ.EVENT0_FLAG bit will be asserted. If
the corresponding mask bit, EVENT0_MASK, is
set in the WORIRQ register, the CPU interrupt
flag IRCON.STIF will also be asserted in
addition to the interrupt flag in WORIRQ. If
IEN0.STIE=1
when
IRCON.STIF
is
asserted, and ST interrupt request will be
generated.
Note: The ST interrupt is blocked when
SLEEP.MODE≠00
12.8.5
Sleep Timer Registers
This section describes the SFRs associated
with the Sleep Timer.
WORTIME0 (0xA5) - Sleep Timer Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
WORTIME[7:0]
0x00
R
8 LSB of the16 bits selected from the 31-bit Sleep Timer according to the
setting of WORCTRL.WOR_RES[1:0]
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CC2510Fx / CC2511Fx
WORTIME1 (0xA6) - Sleep Timer High Byte
Bit
Name
Reset
R/W
Description
7:0
WORTIME[15:8]
0x00
R
8 MSB of the16 bits selected from the 31-bit Sleep Timer according to the
setting of WORCTRL.WOR_RES[1:0]
WOREVT1 (0xA4) - Sleep Timer Event0 Timeout High
Bit
Field Name
Reset
R/W
Description
7:0
EVENT0[15:8]
0x87
R/W
High byte of Event 0 timeout register
Sleep Timer clocked by low power
RCOSC
t Event 0 =
Sleep Timer clocked by 32.768 kHz
crystal oscillator
750
⋅ EVENT 0 ⋅ 25⋅WOR _ RES
f ref
t Event 0 =
1
⋅ EVENT 0 ⋅ 25⋅WOR _ RES
32768
WOREVT0 (0xA3) - Sleep Timer Event0 Timeout Low
Bit
Field Name
Reset
R/W
Description
7:0
EVENT0[7:0]
0x6B
R/W
Low byte of Event 0 timeout register
WORCTRL (0xA2) - Sleep Timer Control
Bit
Field Name
Reset
R/W
Description
7
-
R0
Not used
6:4
111
R/W
Reserved. Always write 000
3
-
R0
Not used
2
WOR_RESET
0
R0/W1
Reset timer. The timer will be reset to 4.
1:0
WOR_RES[1:0]
00
R/W
Sleep Timer resolution
Controls the resolution and maximum timeout for the Sleep Timer. Adjusting
the resolution does not affect the clock cycle counter:
Setting
Resolution (1 LSB)
Bits selected from the 31-bit Sleep Timer
00
1 period
15:0
5
01
2 periods
20:5
10
210 periods
25:10
15
11
2 periods
30:15
WORIRQ (0xA1) - Sleep Timer Interrupt Control
Bit
Reset
R/W
Description
7:6
-
R0
Not used
5
0
R/W
Reserved. Always write 0
0
R/W
Event 0 interrupt mask
4
Field Name
EVENT0_MASK
0
Interrupt is disabled
1
Interrupt is enabled
3:2
-
R0
Not used
1
0
R/W0
Reserved
0
R/W0
Event 0 interrupt flag
0
EVENT0_FLAG
0
No interrupt is pending
1
Interrupt is pending
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CC2510Fx / CC2511Fx
12.9 8-bit Timers, Timer 3 and Timer 4
Timer 3 and Timer 4 are two 8-bit timers which
supports typical timer/counter functions such
as output compare and PWM functions. The
timers have two independent compare
channels each and use one I/O pin per
channel.
highest is 24 MHz for CC2511Fx. When the high
speed RC oscillator is used as system clock
source, the highest clock frequency used by
Timer 3/4 is fXOSC/2 for CC2510Fx and 12 MHz
for CC2511Fx, given that the HS RCOSC has
been calibrated.
The features of Timer 3/4 are as follows:
The counter operates as either a free-running
counter, a modulo counter, a down counter, or
as an up/down counter for use in centrealigned PWM.
• Two compare channels
• Set, clear, or toggle output compare
• Free-running,
modulo,
down,
up/down counter operation
or
It is possible to read the 8-bit counter value
through the SFR TxCNT.
• Clock prescaler for divide by 1, 2, 4, 8,
16, 32, 64, 128
Writing a 1 to TxCTL.CLR will reset the 8-bit
counter.
• Interrupt request generation on compare
and when reaching the terminal count
value
The counter may produce an interrupt request
when the terminal count value (overflow) is
reached (see Section 12.9.2.1 – Section
12.9.2.4). It is possible to start and halt the
counter with the TxCTL.START bit. The
counter is started when a 1 is written to
TxCTL.START. If a 0 is written to
TxCTL.START, the counter halts at its
present value.
• DMA trigger function
Note: In the following sections, an n in the
register name represent the channel
number 0 or 1 if nothing else is stated. An
x in the register name refers to the timer
number, 3 or 4
12.9.2
12.9.1
8-bit Timer Counter
Both timers consist of an 8-bit counter that
increments or decrements at each active clock
edge. The frequency of the active clock edges
is
given
by
CLKCON.TICKSPD
and
TxCTL.DIV. CLKCON.TICKSPD is used to set
the timer tick speed. The timer tick speed will
vary from 203.125 kHz to 26 MHz for CC2510Fx
and 187.5 kHz to 24 MHz for CC2511Fx (given
the use of a 26 MHz or 48 MHz crystal
respectively). Note that the clock speed of the
system clock is not affected by the TICKSPD
setting. The timer tick speed is further divided
in Timer 3/4 by the prescaler value set by
TxCTL.DIV. This prescaler value can be 1,
2, 4, 8, 16, 32, 64, or 128. Thus the lowest
clock frequency used by Timer 3/4 is 1.587
kHz and the highest is 26 MHz when a 26
MHz crystal oscillator is used as system clock
source (CC2510Fx). The lowest clock frequency
used by Timer 3/4 is 1.465 kHz and the
Timer 3/4 Operation
In general, the control register TxCTL is used
to control the timer operation. The timer
modes are described in the following four
sections.
12.9.2.1
Free-running Mode
In free-running mode the counter starts from
0x00 and increments at each active clock
edge. When the counter reaches the terminal
count value 0xFF (overflow), the counter is
loaded with 0x00 on the next timer tick and
continues incrementing its value as shown in
Figure 35. When 0xFF is reached, the
TIMIF.TxOVFIF
flag
is
set.
The
IRCON.TxIF flag is only asserted if the
corresponding
interrupt
mask
bit
TxCTL.OVFIM is set. An interrupt request is
generated when both TxCTL.OVFIM and
IEN1.TxEN are set to 1. The free-running
mode can be used to generate independent
time intervals and output signal frequencies.
SWRS055G
Page 126 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xFF
0x00
OVFIF = 1
OVFIF = 1
Figure 35: Free-running Mode
12.9.2.2
Modulo Mode
TIMIF.TxOVFIF
flag
is
set.
The
IRCON.TxIF flag is only asserted if the
corresponding
interrupt
mask
bit
TxCTL.OVFIM is set. An interrupt request is
generated when both TxCTL.OVFIM and
IEN1.TxEN are set to 1. Modulo mode can be
used for applications where a period other
than 0xFF is required.
In modulo mode the counter starts from 0x00
and increments at each active clock edge.
When the counter reaches the terminal count
value TxCC0 (overflow), the counter is loaded
with 0x00 on the next timer tick and continues
incrementing its value as shown in Figure 36.
When
TxCC0
is
reached,
the
TxCC0
0x00
OVFIF = 1
OVFIF = 1
Figure 36: Modulo Mode
12.9.2.3
Down Mode
IRCON.TxIF
is only asserted if the
corresponding
interrupt
mask
bit
TxCTL.OVFIM is set. An interrupt request is
generated when both TxCTL.OVFIM and
IEN1.TxEN are set to 1. The timer down
mode can generally be used in applications
where an event timeout interval is required.
In down mode, after the timer has been
started, the counter is loaded with the contents
in TxCC0. The counter then counts down to
0x00 (terminal count value) and remains at
0x00 as shown in Figure 37. The flag
TIMIF.TxOVFIF is set when 0x00 is reached.
TxCC0
0x00
OVFIF = 1
Figure 37: Down Mode
12.9.2.4
Up/Down Mode
In up/down mode the counter starts from 0x00
and increments at each active clock edge.
When the counter value matches the terminal
count value TxCC0, the counter counts down
until 0x00 is reached and it starts counting up
again as shown in Figure 38. When 0x00 is
reached, the TIMIF.TxOVFIF flag is set. The
IRCON.TxIF flag is only asserted if the
corresponding
interrupt
mask
bit
TxCTL.OVFIM is set. An interrupt request is
generated when both TxCTL.OVFIM and
IEN1.TxEN are set to 1. The up/down mode
can be used when symmetrical output pulses
are required with a period other than 0xFF,
and therefore allows implementation of centrealigned PWM output applications.
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
TxCC0
0x00
OVFIF = 1
OVFIF = 1
Figure 38: Up/Down Mode
12.9.3
Channel Mode Control
12.9.5
The channel mode is set with each channel’s
control and status register TxCCTLn.
Note: before an I/O pin can be used by the
timer, the required I/O pin must be
configured as a Timer 3/4 peripheral pin as
described in section 12.4.6 on page 88.
12.9.4
Timer 3 and 4 Interrupts
There is one interrupt vector assigned to each
of the timers. These are T3 and T4 (interrupt
#11 and #12, see
Table
39).
The
following timer events may generate an
interrupt request:
• Counter reaches terminal count value
(overflow) or turns around on zero /
reach zero
• Output compare event
Output Compare Mode
In output compare mode the I/O pin
associated with a channel is set as an output.
After the timer has been started, the contents
of the counter are compared with the contents
of the channel compare register TxCCn. If the
compare register equals the counter contents,
the output pin is set, reset, or toggled
according to the compare output mode setting
of TxCCTLn.CMP. Note that all edges on
output pins are glitch-free when operating in a
given compare output mode. Writing to the
compare register TxCC0 does not take effect
on the output compare value until the counter
value is 0x00. Writing to the compare register
TxCC1 takes effect immediately.
When a compare occurs, the interrupt flag for
the appropriate channel (TIMIF.TxCHnIF) is
asserted. The IRCON.TxIF flag is only
asserted if the corresponding interrupt mask
bit TxCCTLn.IM is set to 1. An interrupt
request is generated if the corresponding
interrupt mask bit is set together with
IEN1.TxEN. When operating in up-down
mode, the interrupt flag for channel 0 is set
when the counter reaches 0x00 instead of
when a compare occurs.
The
register
bits
TIMIF.T3OVFIF,
TIMIF.T4OVFIF,
TIMIF.T3CH0IF,
TIMIF.T3CH1IF, TIMIF.T4CH0IF, and
TIMIF.T4CH1IF contains the interrupt flags
for the two terminal count value event
(overflow), and the four channel compare
events, respectively. These flags will be
asserted regardless off the channel n interrupt
mask bit (TxCCTLn.IM). The CPU interrupt
flag, IRCON.TxIF will only be asserted if one
or more of the channel n interrupt mask bits
are set to 1. An interrupt request is only
generated when the corresponding interrupt
mask bit is set together with IEN1.TxEN. The
interrupt mask bits are T3CCTL0.IM,
T3CCTL1.IM, T4CCTL0.IM, T4CCTL1.IM,
T3CTL.OVFIM, and T4CTL.OVFIM. Note that
enabling an interrupt mask bit will generate a
new interrupt request if the corresponding
interrupt flag is set.
When the timer is used in Free-running Mode
or Modulo Mode the interrupt flags are set as
follows:
For simple PWM use, output compare modes
3 and 4 are preferred.
SWRS055G
• TIMIF.TxCH0IF
and
TIMIF.TxCH1IF are set on compare
event
• TIMIF.TxOVFIF is set when counter
reaches terminal count value (overflow)
Page 128 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
• T3_CH0: Timer 3 channel 0 compare
When the timer is used in Down Mode the
interrupt flags are set as follows:
• T3_CH1: Timer 3 channel 1 compare
• TIMIF.TxCH0IF
and
TIMIF.TxCH1IF are set on compare
event
• TIMIF.TxOVFIF is set when counter
reaches zero
When the timer is used in Up/Down Mode the
interrupt flags are set as follows:
• T4_CH0: Timer 4 channel 0 compare
• T4_CH1: Timer 4 channel 1 compare
12.9.7
This section describes the following Timer 3
and Timer 4 registers:
• TIMIF.TxCH0IF
and
TIMIF.TxOVFIF are set when the
counter turns around on zero
• TIMIF.TxCH1IF
event
is set on compare
In addition, the CPU interrupt flag,
IRCON.TxIF will be asserted if the channel n
interrupt mask bit (TxCCTLn.IM) is set to 1.
12.9.6
Timer 3 and 4 Registers
• T3CNT - Timer 3 Counter
• T3CTL - Timer 3 Control
• T3CCTLn - Timer 3 Channel n Compare
Control
• T3CCn - Timer 3 Channel n Compare
Value
• T4CNT - Timer 4 Counter
• T4CTL - Timer 4 Control
Timer 3 and Timer 4 DMA Triggers
There are two DMA triggers associated with
Timer 3 and two DMA triggers associated with
Timer 4. These are DMA triggers T3_CH0,
T3_CH1, T4_CH0, and T4_CH1, which are
generated on timer compare events as follows:
• T4CCTLn - Timer 4 Channel n Compare
Control
• T4CCn - Timer 4 Channel n Compare
Value
• TIMIF - Timer 1/3/4 Interrupt Mask/Flag
T3CNT (0xCA) - Timer 3 Counter
Bit
Field Name
Reset
R/W
Description
7:0
CNT[7:0]
0x00
R
Timer count byte. Contains the current value of the 8-bit counter
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CC2510Fx / CC2511Fx
T3CTL (0xCB) - Timer 3 Control
Bit
Field Name
Reset
R/W
Description
7:5
DIV[2:0]
000
R/W
Prescaler divider value. Generates the active clock edge used to update the
counter as follows:
000
Tick frequency /1
001
Tick frequency /2
010
Tick frequency /4
011
Tick frequency /8
100
Tick frequency /16
101
Tick frequency /32
110
Tick frequency /64
111
Tick frequency /128
Note: Changes to these bits has immediate effect on the frequency of the active
clock edges.
4
3
2
START
OVFIM
CLR
0
1
0
R/W
R/W0
R0/W1
Start timer
0
Suspended
1
Normal operation
Overflow interrupt mask
0
Interrupt disabled
1
Interrupt enabled
Clear counter. Writing a 1 resets the counter to 0x00.
This bit will be 0 when returning from PM2 and PM3
1:0
MODE[1:0]
00
R/W
Timer 3 mode select. The timer operating mode is selected as follows:
00
Free running, repeatedly count from 0x00 to 0xFF
01
Down, count from T3CC0 to 0x00
10
Modulo, repeatedly count from 0x00 to T3CC0
11
Up/down, repeatedly count from 0x00 to T3CC0 and from T3CC0 down
to 0x00
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CC2510Fx / CC2511Fx
T3CCTL0 (0xCC) - Timer 3 Channel 0 Compare Control
Bit
Field Name
Reset
-
R0
Not used
IM
1
R/W
Channel 0 interrupt mask
7
6
5:3
2
CMP[2:0]
MODE
1:0
000
0
00
R/W
R/W
R/W
R/W
Description
0
Interrupt disabled
1
Interrupt enabled
Channel 0 compare output mode select. Specified action on output when timer
value equals compare value in T3CC0
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Set output on compare, clear on 0xFF
110
Clear output on compare, set on 0x00
111
Not used
Timer 3 channel 0 compare mode enable
0
Disable
1
Enable
Reserved. Always write 00
T3CC0 (0xCD) - Timer 3 Channel 0 Compare Value
Bit
Field Name
Reset
R/W
Description
7:0
VAL[7:0]
0x00
R/W
Timer 3 channel 0 compare value
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CC2510Fx / CC2511Fx
T3CCTL1 (0xCE) - Timer 3 Channel 1 Compare Control
Bit
Field Name
Reset
-
R0
Not used
IM
1
R/W
Channel 1 interrupt mask
7
6
5:3
2
CMP[2:0]
MODE
1:0
000
0
00
R/W
R/W
R/W
R/W
Description
0
Interrupt disabled
1
Interrupt enabled
Channel 1 compare output mode select. Specified action on output when timer
value equals compare value in T3CC1
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Set output on compare, clear on T3CC0
110
Clear output on compare, set on T3CC0
111
Not used
Timer 3 channel 1 compare mode enable
0
Disable
1
Enable
Reserved. Always write 00
T3CC1 (0xCF) - Timer 3 Channel 1 Compare Value
Bit
Field Name
Reset
R/W
Description
7:0
VAL[7:0]
0x00
R/W
Timer 3 channel 1 compare value
T4CNT (0xEA) - Timer 4 Counter
Bit
Field Name
Reset
R/W
Description
7:0
CNT[7:0]
0x00
R
Timer count byte. Contains the current value of the 8-bit counter
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CC2510Fx / CC2511Fx
T4CTL (0xEB) - Timer 4 Control
Bit
Field Name
Reset
R/W
Description
7:5
DIV[2:0]
000
R/W
Prescaler divider value. Generates the active clock edge used to update the
counter as follows:
000
Tick frequency /1
001
Tick frequency /2
010
Tick frequency /4
011
Tick frequency /8
100
Tick frequency /16
101
Tick frequency /32
110
Tick frequency /64
111
Tick frequency /128
Note: Changes to these bits has immediate effect on the frequency of the active
clock edges.
4
3
2
START
OVFIM
CLR
0
1
0
R/W
R/W0
R0/W1
Start timer
0
Suspended
1
Normal operation
Overflow interrupt mask
0
Interrupt disabled
1
Interrupt enabled
Clear counter. Writing a 1 resets the counter to 0x00.
This bit will be 0 when returning from PM2 and PM3
1:0
MODE[1:0]
00
R/W
Timer 4 mode select. The timer operating mode is selected as follows:
00
Free running, repeatedly count from 0x00 to 0xFF
01
Down, count from T4CC0 to 0x00
10
Modulo, repeatedly count from 0x00 to T4CC0
11
Up/down, repeatedly count from 0x00 to T4CC0 and from T4CC0 down to
0x00
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CC2510Fx / CC2511Fx
T4CCTL0 (0xEC) - Timer 4 Channel 0 Compare Control
Bit
Field Name
Reset
-
R0
Not used
IM
1
R/W
Channel 0 interrupt mask
7
6
5:3
2
CMP[2:0]
MODE
1:0
000
0
00
R/W
R/W
R/W
R/W
Description
0
Interrupt disabled
1
Interrupt enabled
Channel 0 compare output mode select. Specified action on output when timer
value equals compare value in T4CC0
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Set output on compare, clear on 0xFF
110
Clear output on compare, set on 0x00
111
Not used
Timer 4 channel 0 compare mode enable
0
Disable
1
Enable
Reserved. Always write 00
T4CC0 (0xED) - Timer 4 Channel 0 Compare Value
Bit
Field Name
Reset
R/W
Description
7:0
VAL[7:0]
0x00
R/W
Timer 4 channel 0 compare value
SWRS055G
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CC2510Fx / CC2511Fx
T4CCTL1 (0xEE) - Timer 4 Channel 1 Compare Control
Bit
Field Name
Reset
-
R0
Not used
IM
1
R/W
Channel 0 interrupt mask
7
6
5:3
2
CMP[2:0]
MODE
1:0
000
0
00
R/W
R/W
R/W
R/W
Description
0
Interrupt disabled
1
Interrupt enabled
Channel 0 compare output mode select. Specified action on output when timer
value equals compare value in T4CC0
000
Set output on compare
001
Clear output on compare
010
Toggle output on compare
011
Set output on compare-up, clear on 0 (clear on compare-down in up/down
mode)
100
Clear output on compare-up, set on 0 (set on compare-down in up/down
mode)
101
Set output on compare, clear on T4CC0
110
Clear output on compare, set on T4CC0
111
Not used
Timer 4 channel 1 compare mode enable
0
Disable
1
Enable
Reserved. Always write 00
T4CC1 (0xEF) - Timer 4 Channel 1 Compare Value
Bit
Field Name
Reset
R/W
Description
7:0
VAL[7:0]
0x00
R/W
Timer 4 channel 1 compare value
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CC2510Fx / CC2511Fx
TIMIF (0xD8) - Timers 1/3/4 Interrupt Mask/Flag
Bit
Field Name
Reset
-
R0
Not used
OVFIM
1
R/W
Timer 1 overflow interrupt mask
7
6
R/W
Description
0 Interrupt disabled
1 Interrupt enabled
5
T4CH1IF
0
R/W0
Timer 4 channel 1 interrupt flag. Writing a 1 has no effect
0 No interrupt is pending
1 Interrupt is pending
4
T4CH0IF
0
R/W0
Timer 4 channel 0 interrupt flag. Writing a 1 has no effect
0 No interrupt is pending
1 Interrupt is pending
3
T4OVFIF
0
R/W0
Timer 4 overflow interrupt flag. Writing a 1 has no effect
0 No interrupt is pending
1 Interrupt is pending
2
T3CH1IF
0
R/W0
Timer 3 channel 1 interrupt flag. Writing a 1 has no effect
0 No interrupt is pending
1 Interrupt is pending
1
T3CH0IF
0
R/W0
Timer 3 channel 0 interrupt flag. Writing a 1 has no effect
0 No interrupt is pending
1 Interrupt is pending
0
T3OVFIF
0
R/W0
Timer 3 overflow interrupt flag. Writing a 1 has no effect
0 No interrupt is pending
1 Interrupt is pending
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CC2510Fx / CC2511Fx
12.10
ADC
• Eight individual input channels, singleended or differential (CC2511Fx has only
six channels)
12.10.1 ADC Introduction
The ADC supports up to 12-bit analog-todigital conversion. The ADC includes an
analog multiplexer with up to eight individually
configurable channels, reference voltage
generator, and conversion results written to
memory through DMA. Several modes of
operation are available. All references to VDD
apply to voltage on the pin AVDD.
• Reference
voltage
selectable
as
internal, external single ended, external
differential, or VDD.
• Interrupt request generation
• DMA triggers at end of conversions
The main features of the ADC are as follows:
• Temperature sensor input
• Selectable decimation rates which also
sets the resolution (7 to 12 bits).
...
AIN0
• Battery measurement capability
AIN7
VDD/3
input
mux
Decimation
Filter
Delta-Sigma
Modulator
TMP_SENSOR
Int 1.25V
AIN7
AVDD
ref
mux
Clock Generation and
Control
AIN6-AIN7
Figure 39: ADC Block Diagram
12.10.2 ADC Operation
This section describes the general setup and
operation of the ADC and describes the usage
of the ADC control and status registers
accessed by the CPU.
12.10.2.1 ADC Core
The ADC is capable of converting an analog
input into a digital representation with up to 12
bits resolution. The ADC uses a selectable
positive reference voltage.
12.10.2.2 ADC Inputs
The signals on the P0 port pins can be used as
ADC inputs.
Note: P0_6 and P0_7 do not exist on
CC2511Fx, hence only six input channels are
available (AIN0 - AIN5)
To configure a P0 pin to be used as an ADC
input the corresponding bit in the ADCCFG
register must be set to 1. The default value in
this register disables the ADC inputs. Please
see Section 12.4.6.7 on Page 91 for more
details on how to configure the ADC input pins.
In the following these port pin will be referred
to as the AIN0 - AIN7 pins. The ADC can be
set up to automatically perform a sequence of
conversions and optionally perform an extra
conversion.
It is possible to configure the inputs as singleended or differential inputs. In the case where
differential inputs are selected, the differential
inputs consist of the input pairs AIN0 - AIN1,
AIN2 - AIN3, AIN4 - AIN5, and AIN6 - AIN7.
Note that neither a negative supply, nor a
supply larger than VDD (unregulated power)
can be applied to these pins. It is the
difference between the pairs that are
converted in differential mode.
In addition to the input pins AIN0 - AIN7, the
output of an on-chip temperature sensor can
be selected as an input to the ADC for
temperature measurements.
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CC2510Fx / CC2511Fx
It is also possible to select a voltage
corresponding to VDD/3 as an ADC input. This
input allows the implementation of e.g. a
battery monitor in applications where this
feature is required.
12.10.2.3 ADC Conversion Sequences
The ADC will perform a sequence of
conversions, and the results can be moved to
memory (through DMA) without any interaction
from the CPU.
The ADCCON2.SCH register bits are used to
define an ADC conversion sequence from the
ADC inputs. If some of the inputs in this
sequence are not configured to be analog
input signals in the ADCCFG register, these will
be skipped. For differential inputs both input
pins must be configured to be analog input
signals.
• 0000 ≤ ADCCON2.SCH ≤ 0111: Singleended inputs
• 1000 ≤ ADCCON2.SCH
Differential inputs
≤
1011:
• 1100 ≤ ADCCON2.SCH ≤ 1111: GND,
internal voltage reference, temp. sensor,
and VDD/3
When ADCCON2.SCH is set to a value less
than 1000 a conversion sequence will contain
a conversion from each ADC input, starting at
AIN0 and ending at the input programmed in
ADCCON2.SCH. When ADCCON2.SCH is set to
a value ranging from 1000 to 1011, the
sequence will start at the differential input pair
(AIN0 – AIN1) and stop at the input pair given
by ADCCON2.SCH. For even higher settings,
only single conversions are performed. In
addition to this sequence of conversions, the
ADC can be programmed to perform a single
conversion (see next section).
ADCCON1.STSEL=11, and no conversion is
currently running. When the sequence is
completed, this bit is automatically cleared.
The ADCCON1.STSEL bits select which event
that will start a new sequence of conversions.
The options which can be selected are rising
edge on external pin P2_0, end of previous
sequence, a Timer 1 channel 0 compare
event, or ADCCON1.ST is 1.
ADCCON2.SREF is used to select the reference
voltage. The reference voltage should only be
changed when no conversion is running.
The ADCCON2.SDIV bits select the decimation
rate (and thereby also the resolution and time
required to complete a conversion and sample
rate). The decimation rate should only be
changed when no conversion is running.
The ADCCON2.SCH register bits are used to
define an ADC conversion sequence.
The ADC can be programmed to perform a
single conversion (single-ended, differential,
GND, internal voltage reference, temperature
sensor, or VDD/3). This is called an extra
conversion and is controlled with the ADCCON3
register. This conversion is triggered by writing
to ADCCON3. If this register is written while the
ADC is running, the conversion will take place
as soon as the sequence has completed. If the
register is written while the ADC is not running,
the conversion will take place immediately
after the ADCCON3 register is updated.
The ADCCON3 register controls which input to
use, reference voltage, and decimation rate for
the extra conversion. The coding of the
register bits is exactly as for ADCCON2.
Note: If a sequence of conversions is
started without setting any of the P0 pins
as analog inputs, ADCCON2.SCH and
ADCCON1.EOC will still be updated, as if
the conversions had taken place.
12.10.2.4 ADC Operating Modes
This section describes the operating modes
and initialization of conversions.
The ADC has three control registers:
ADCCON1, ADCCON2, and ADCCON3. These
registers are used to configure the ADC and to
report status.
The ADCCON1.EOC bit is a status bit that is set
high when a conversion ends and cleared
when ADCH is read.
The ADCCON1.ST bit is used to start a
sequence of conversions. A sequence will start
when
this
bit
is
set
high,
12.10.2.5 ADC Reference Voltage
The positive reference voltage for analog-todigital conversions is selectable as either an
internally generated 1.25 V voltage, VDD on
the AVDD pin, an external voltage applied to
the AIN7 input pin, or a differential voltage
applied to the AIN6 - AIN7 inputs (AIN6 must
have the highest input voltage). It is possible to
select the reference voltage as the input to the
ADC in order to perform a conversion of the
reference voltage e.g. for calibration purposes.
Similarly, it is possible to select the ground
terminal GND as an input.
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the results, and conversion time. All data
presented within this data sheet assume the
use of the high speed crystal oscillator.
Note: P0_6 and P0_7 do not exist on
CC2511Fx, hence it is not possible to use
external voltage reference for the ADC on
the CC2511Fx.
12.10.2.6 ADC Conversion Results
The digital conversion result is represented in
two's complement form. For single ended
configurations the result is always positive (the
result is the difference between ground and the
input signal AINn, where n is 0, 1, 2, …, 7) and
will be a value between 0 and 2047. The
maximum value is reached when the input
amplitude is equal VREF, the selected voltage
reference. For differential configurations the
difference between two pin pairs are converted
and this difference can be negatively signed.
For 12-bit resolution the digital conversion
result is 2047 when the analog input is equal to
VREF, and the conversion result is −2048
when the analog input is equal to −VREF.
The digital conversion result is available in
ADCH and ADCL when ADCCON1.EOC is set to
1. Note that the conversion result always
resides in MSB section of ADCH:ADCL.
When reading the ADCCON2.SCH bits, the
number returned will indicate what the last
conversion was. Notice that when the value
written to ADCCON2.SCH is less than 1100, the
number returned will be the number written +
1.
For example, after a sequence of
conversions from AIN0 to AIN4 has completed,
ADCCON2.SCH will be read as 0101, while
after a single conversion of the temperature
sensor has completed, the register field will be
read as 1110 (same as the value written to it).
If an extra conversion has been initiated by
writing to ADCCON3.ECH, ADCCON2.SCH will
be updated, after the conversion has
completed, with the same value as written to
ADCCON3.ECH, even if this value was less
than 1100.
12.10.2.7 ADC Conversion Timing
The high speed crystal oscillator should be
selected as system clock when the ADC is
used and CLKCON.CLKSPD should be 000.
The ADC runs on a clock which is the system
clock divided by 6 to give a 4.33/4 MHz ADC
clock. Both the delta-sigma modulator and the
decimation filter use the ADC clock for their
calculations. Using other frequencies will affect
The time required to perform a conversion
depends on the selected decimation rate.
When, for instance, the decimation rate is set
to 128, the decimation filter uses exactly 128
ADC clock periods to calculate the result.
When a conversion is started, the input
multiplexer is allowed 16 ADC clock periods to
settle in case the channel has been changed
since the previous conversion. The 16 clock
cycles settling time applies to all decimation
rates. This means that the conversion time,
Tconv, is given by:
Tconv = (decimation rate + 16) x T where
0.22 μs ≤ T ≤ 0.23 μs for CC2510Fx, depending
on the frequency of the high speed crystal
oscillator
T = 0.25 μs for CC2511Fx
12.10.2.8 ADC Interrupts
The ADC will only generate an interrupt when
an extra conversion has completed.
12.10.2.9 ADC DMA Triggers
DMA triggers 20 - 28 are associated with
single-ended
or
differential
conversion
sequences (ADCCON2.SCH ≤ 1100). The ADC
will generate a DMA trigger event when a new
sample is ready from a conversion in the
sequence. The same is the case if a single
conversion is completed (ADCCON2.SCH ≥
1100). Be aware that DMA trigger number 27
2
and 28 are shared with the I S module.
In addition there is one DMA trigger,
ADC_CHALL, which is active when new data
is ready from any of the conversions in the
ADC conversion sequence and from the single
conversion defined by ADCCON2.SCH. A
completion of an extra conversion will not
generate a trigger event.
The DMA triggers are listed in Table 51 on
Page 104.
12.10.3 ADC Registers
This section describes the ADC registers.
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ADCL (0xBA) - ADC Data Low
Bit
Field Name
Reset
R/W
Description
7:4
ADC[3:0]
0000
R
Least significant part of ADC conversion result. The decimation rate configures
through ADCCON2.SDIV determines how many of these bits are relevant to use.
0000
R
3:0
ADCH (0xBB) - ADC Data High
Bit
Field Name
Reset
R/W
Description
7:0
ADC[11:4]
0x00
R
Most significant part of ADC conversion result. The decimation rate configures
through ADCCON2.SDIV determines how many of these bits are relevant to use.
ADCCON1 (0xB4) - ADC Control 1
Bit
Field Name
Reset
R/W
Description
7
EOC
0
R
H0
End of conversion. Cleared when ADCH has been read. If a new conversion is
completed before the previous data has been read, the EOC bit will remain high.
6
5:4
3:2
1:0
ST
STSEL[1:0]
RCTRL[1:0]
0
11
00
11
R/W1
R/W
R/W
R/W
0
Conversion not complete
1
Conversion completed
Start conversion. Read as 1 until conversion has completed
0
No conversion in progress
1
Start a conversion sequence if ADCCON1.STSEL=11 and no sequence is
running.
Start select. Selects which event that will start a new conversion sequence.
00
External trigger on P2_0 pin.
01
Full speed. Do not wait for triggers.
10
Timer 1 channel 0 compare event
11
ADCCON1.ST=1
Controls the 16 bit random generator. When set to 01, the setting will
automatically return to 00 when operation has completed.
00
Operation completed
01
Clock the LFSR once (13x unrolling)
10
Reserved
11
Reserved
Reserved. Always write 11
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ADCCON2 (0xB5) - ADC Control 2
Bit
Field Name
Reset
R/W
Description
7:6
SREF[1:0]
00
R/W
Selects reference voltage used for the sequence of conversions
5:4
3:0
SDIV[1:0]
SCH[3:0]
01
00
R/W
R/W
00
Internal 1.25 V reference
01
External reference on AIN7 pin (only CC2510Fx)
10
VDD on the AVDD pin
11
External reference on AIN6 - AIN7 differential input (only CC2510Fx)
Sets the decimation rate for channels included in the sequence of conversions.
The decimation rate also determines the resolution and time required to complete
a conversion.
00
64 dec rate (7 bits resolution)
01
128 dec rate (9 bits resolution)
10
256 dec rate (10 bits resolution)
11
512 dec rate (12 bits resolution)
Sequence Channel Select. Selects the end of the sequence.
SCH ≤ 0111: A conversion sequence will contain a conversion from each ADC
input, starting at AIN0 and ending at the input programmed in ADCCON2.SCH.
1000 ≤ SCH ≤ 1011: The sequence will start at the differential input pair (AIN0 AIN1) and stop at the input pair given by ADCCON2.SCH.
SCH ≥ 1100: Only single conversions are performed.
When reading the ADCCON2.SCH bits, the number returned will indicate what the
last conversion was. Please see Section 12.10.2.6 for details.
0000
AIN0
0001
AIN1
0010
AIN2
0011
AIN3
0100
AIN4
0101
AIN5
0110
AIN6
0111
AIN7
1000
AIN0 - AIN1
1001
AIN2 - AIN3
1010
AIN4 - AIN5
1011
AIN6 - AIN7
1100
GND
1101
Positive voltage reference
1110
Temperature sensor
1111
VDD/3
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ADCCON3 (0xB6) - ADC Control 3
Bit
Field Name
Reset
R/W
Description
7:6
EREF[1:0]
00
R/W
Selects reference voltage used for the extra conversion
5:4
3:0
EDIV[1:0]
ECH[3:0]
00
0000
R/W
R/W
00
Internal 1.25V reference
01
External reference on AIN7 pin (only CC2510Fx)
10
VDD on the AVDD pin
11
External reference on AIN6 - AIN7 differential input (only CC2510Fx)
Sets the decimation rate used for the extra conversion. The decimation rate also
determines the resolution and time required to complete the conversion.
00
64 dec rate (7 bits resolution)
01
128 dec rate (9 bits resolution)
10
256 dec rate (10 bits resolution)
11
512 dec rate (12 bits resolution)
Extra channel select. An extra conversion will be triggered by writing to these bits.
If they are written while the ADC is running, the conversion will take place as soon
as the sequence has completed. If the bits are written while the ADC is not
running, the conversion will take place immediately after this register has been
updated.
The bits are automatically cleared when the extra conversion has finished.
0000
AIN0
0001
AIN1
0010
AIN2
0011
AIN3
0100
AIN4
0101
AIN5
0110
AIN6
0111
AIN7
1000
AIN0 - AIN1
1001
AIN2 - AIN3
1010
AIN4 - AIN5
1011
AIN6 - AIN7
1100
GND
1101
Positive voltage reference
1110
Temperature sensor
1111
VDD/3
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CC2510Fx / CC2511Fx
12.11
Random Number Generator
12.11.1 Introduction
The random number
following features.
generator
has
The random number generator is a 16-bit
Linear Feedback Shift Register (LFSR) with
the
• Generate pseudo-random bytes which
can be read by the CPU.
polynomial X + X + X + 1 (i.e. CRC16).
It uses different levels of unrolling depending
on the operation it performs. The basic version
(no unrolling) is shown below.
• Calculate CRC16 of bytes that are
written to RNDH.
The random number generator is turned off
when ADCCON1.RCTRL=11.
16
15
2
• Seeded by value written to RNDL.
15
in_bit
+
14
13
12
11
10
9
8
7
6
5
4
3
2
+
1
0
+
Figure 40: Basic Structure of the Random Number Generator
12.11.2 Random
Operation
Number
Generator
The operation of the random number generator
is controlled by the ADCCON1.RCTRL bits. The
current value of the 16-bit shift register in the
LFSR can be read from the RNDH and RNDL
registers.
12.11.2.1 Semi Random Sequence
Generation
To
generate
pseudo-random
bytes,
ADCCON1.RCTRL should be set to 01. This will
clock the LFSR once (13x unrolling) and the
ADCCON1.RCTRL bits will automatically be
cleared when the operation has completed.
12.11.2.3 CRC16
The LFSR can also be used to calculate the
CRC value of a sequence of bytes. Writing to
the RNDH register will trigger a CRC
calculation. The new byte is processed from
the MSB end and an 8x unrolling is used, so
that a new byte can be written to RNDH every
clock cycle.
Note that the LFSR must be properly seeded
by writing to RNDL twice, before the CRC
calculations start. Usually the seed value
should be 0x0000 or 0xFFFF. Using 0xFFFF
as seed value will give the CRC used by the
radio.
For the following byte sequence:
0x03, 0x41, 0x42, 0x43
12.11.2.2 Seeding
The LFSR can be seeded by writing to the
RNDL register twice. Each time the RNDL
register is written, the 8 LSB of the LFSR is
copied to the 8 MSB and the 8 LSBs are
replaced with the new data byte that was
written to RNDL.
The CRC will be 0xB4BC when using 0xFFFF
as seed value.
12.11.3 Registers
The random number generator registers are
described in this section.
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RNDL (0xBC) - Random Number Generator Data Low Byte
Bit
Field Name
Reset
R/W
Description
[7:0]
RNDL[7:0]
0xFF
R/W
Random value/seed or CRC result, low byte
When used for random number generation writing this register twice will seed the
random number generator. Writing to this register copies the 8 LSBs of the LFSR
to the 8 MSBs and replaces the 8 LSBs with the data value written.
The value returned when reading from this register is the 8 LSBs of the LFSR.
When used for random number generation, reading this register returns the 8 LSBs
of the random number. When used for CRC calculations, reading this register
returns the 8 LSBs of the CRC result.
RNDH (0xBD) - Random Number Generator Data High Byte
Bit
Field Name
Reset
R/W
Description
[7:0]
RNDH[7:0]
0xFF
R/W
Random value or CRC result/input data, high byte
When written, a CRC16 calculation will be triggered, and the data value written is
processed starting with the MSB bit.
The value returned when reading from this register is the 8 MSBs of the LFSR.
When used for random number generation, reading this register returns the 8
MSBs of the random number. When used for CRC calculations, reading this
register returns the 8 MSBs of the CRC result.
12.12
AES Coprocessor
The CC2510Fx/CC2511Fx data encryption is
performed using a dedicated coprocessor
which supports the Advanced Encryption
Standard, AES. The coprocessor allows
encryption/decryption to be performed with
minimal CPU usage.
The coprocessor has the following features:
• ECB, CBC, CFB, OFB, CTR, and CBCMAC modes.
• Hardware support for CCM mode
• 128-bits key and IV/Nonce
12.12.2 Key and IV
Before a key or IV/nonce load starts, an
appropriate load key or IV/nonce command
must be issued to the coprocessor. When
loading the IV it is important to also set the
correct mode.
A key load or IV load operation aborts any
processing that could be running.
The key, once loaded, stays valid until a key
reload takes place.
The IV must be downloaded before the
beginning of each message (not block).
• DMA transfer trigger capability
Both key and IV are cleared by a reset of the
device and when PM2 or PM3 are entered.
12.12.1 AES Operation
To encrypt a message, the following procedure
must be followed:
• Load key
• Load initialization vector (IV)/nonce
• Download and upload
encryption/decryption.
data
for
The AES coprocessor works on blocks of 128
bits. A block of data is loaded into the
coprocessor, encryption is performed, and the
result must be read out before the next block
can be processed. Before each block load, a
dedicated start command must be sent to the
coprocessor.
12.12.3 Padding of Input Data
AES works on blocks of 128 bits. If a block
contains less than 128 bits, it must be padded
with zeros when written to the coprocessor.
12.12.4 Interface to CPU
The CPU communicates with the coprocessor
using three SFRs:
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• ENCCS, Encryption control and status
register
• ENCDI, Encryption input register
• ENCDO, Encryption output register
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CC2510Fx / CC2511Fx
Read/write to the control and status register is
done by the CPU, while read/write the
output/input registers is intended for use
together with direct memory access (DMA).
When using DMA, one channel is used for
input data and one for output data. The DMA
channels must be initialized before a start
command is written to the ENCCS. Writing a
start command generates a DMA trigger and
the transfer is started. After each block is
processed, the interrupt flag, S0CON.ENCIF, is
asserted, and an interrupt request generated if
IEN0.ENCIE is set to 1. The interrupt is used
to issue a new start command to the ENCCS.
downloaded to the coprocessor one 128 bits
block at a time, except for the last block.
Before the last block is loaded, the mode must
be changed to CBC. The last block is then
downloaded and the block uploaded will be the
MAC value. CBC-MAC decryption is similar to
encryption. The message MAC uploaded must
be compared with the MAC to be verified.
12.12.6 AES Interrupts
The AES interrupt flag, S0CON.ENCIF, is
asserted when encryption or decryption of a
block is completed. An interrupt request is
generated if IEN0.ENCIE is set to 1
12.12.5 Modes of Operation
12.12.7 AES DMA Triggers
ECB and CBC modes are performed as
described in Section 12.12.1
There are two DMA triggers associated with
the AES coprocessor. These are ENC_DW,
which is active when input data needs to be
downloaded to the ENCDI register, and
ENC_UP, which is active when output data
needs to be uploaded from the ENCDO register.
When using CFB, OFB, and CTR mode, the
128 bits blocks are divided into four 32 bit
blocks. 32 bits are loaded into the AES
coprocessor and the resulting 32 bits are read
out. This continues until all 128 bits have been
encrypted. The only time one has to consider
this is if data is loaded/read directly using the
CPU. When using DMA, this is handled
automatically by the DMA triggers generated
by the AES coprocessor, thus DMA is
preferred.
Both encryption and decryption are performed
similarly.
The CBC-MAC mode is a variant of the CBC
mode. When performing CBC-MAC, data is
The ENCDI and ENCDO registers should be set
as destination and source locations for DMA
channels used to transfer data to or from the
AES coprocessor.
12.12.8 AES Registers
This section describes the AES coprocessor
registers. These registers will be in their reset
state when returning to active mode from PM2
and PM3.
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ENCCS (0xB3) - Encryption Control and Status
Bit
Field Name
Reset
-
R0
Not used
MODE[2:0]
000
R/W
Encryption/decryption mode
7
6:4
3
2:1
0
RDY
CMD[1:0]
ST
1
0
0
R/W
R
R/W
R/W1
H0
Description
000
CBC
001
CFB
010
OFB
011
CTR
100
ECB
101
CBC MAC
110
Reserved
111
Reserved
Encryption/decryption ready status
0
Encryption/decryption in progress
1
Encryption/decryption is completed
Command to be performed when a 1 is written to ST.
00
Encrypt block
01
Decrypt block
10
Load key
11
Load IV/nonce
Start processing command set by CMD. Must be issued for each command or
128 bits block of data. Cleared by hardware
ENCDI (0xB1) - Encryption Input Data
Bit
Field Name
Reset
R/W
Description
7:0
DIN[7:0]
0x00
R/W
Encryption input data.
ENCDO (0xB2) - Encryption Output Data
Bit
Field Name
Reset
R/W
Description
7:0
DOUT[7:0]
0x00
R/W
Encryption output data.
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12.13
Watchdog Timer
The watchdog timer (WDT) is intended as a
recovery method in situations where the
software hangs. The WDT shall reset the
system when software fails to clear the WDT
within a selected time interval. The watchdog
can be used in applications where high
reliability is required. If the watchdog
function is not needed in an application, it is
possible to configure the watchdog timer to
be used as an interval timer that can be
used to generate interrupts at selected time
intervals.
The features of the watchdog timer are as
follows:
• Four selectable timer intervals
• Watchdog mode
• Timer mode
• Interrupt request generation in timer
mode
• Clock independent from system clock
The operation of the WDT module is
controlled by the WDCTL register. The
watchdog timer consists of a 15-bit counter
clocked by the one of the low speed
oscillators. Note that the content of the 15-bit
counter is not user-accessible. The content
of the 15-bit counter is reset to 0x0000 when
a PM2 or PM3 is entered.
12.13.1 Watchdog Mode
The watchdog timer is disabled after a
system reset. To set the WDT in watchdog
mode the WDCTL.MODE bit must be set to 0.
The watchdog timer counter starts
incrementing when the enable bit WDCTL.EN
is set to 1. When the timer is enabled in
watchdog mode it is not possible to disable
the timer. Therefore, writing a 0 to
WDCTL.EN has no effect if a 1 was already
written to this bit when WDCTL.MODE was 0.
The WDT operates with a watchdog timer
clock frequency of 32.768 kHz (low speed
crystal oscillator) or 32 - 36 kHz (calibrated
low power RC oscillator). The timer interval
depend on the count value settings (64, 512,
8192, and 32768 respectively) configured in
WDCTL.INT.
If the counter reaches the selected timer
interval value (watchdog timeout), the
watchdog timer generates a reset signal for
the system. If a watchdog clear sequence is
performed before the counter reaches the
selected timer interval value, the counter is
reset to 0x0000 and continues incrementing
its value. The watchdog clear sequence
consists
of
writing
1010
to
WDCTL.CLR[3:0] followed by writing 0101
to the same register bits within one half of a
watchdog clock period. If this complete
sequence is not performed, the watchdog
timer generates a reset signal for the
system. Note that as long as a correct
watchdog clear sequence begins within the
selected timer interval, the counter is reset
when the complete sequence has been
received.
When the watchdog timer has been enabled
in watchdog mode, it is not possible to
change the mode by writing to the
WDCTL.MODE bit. The timer interval value
can be changed by writing to the
WDCTL.INT[1:0] bits.
Note that a change in the timer interval
value should be followed by a clearing of
the watchdog timer to avoid an unwanted
watchdog reset.
In watchdog mode, the WDT does not
produce an interrupt request.
12.13.2 Timer Mode
To set the WDT in normal timer mode, the
WDCTL.MODE bit is set to 1. When register
bit WDCTL.EN is set to 1, the timer is started
and the counter starts incrementing. When
the counter reaches the selected interval
value, the IRCON2.WDTIF flag is asserted
and an interrupt request is generated if
watchdog timer interrupt is enabled
(IEN2.WDTIE=1).
In timer mode, it is possible to clear the timer
contents by writing a 1 to WDCTL.CLR[0].
When the timer is cleared the contents of the
counter is set to 0x0000. The timer is
stopped by setting WDCTL.EN=0 and
restarted
from
0x000
by
setting
WDCTL.EN=1.
The timer interval is set by the
WDCTL.INT[1:0] bits. In timer mode, a
reset will not be produced when the timer
interval value is reached.
12.13.3 Watchdog Mode and Power Modes
In active mode and PM0 the WDT runs and
resets the chip upon timeout. To avoid reset,
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CC2510Fx / CC2511Fx
the watchdog timer must be cleared before
the counter expires.
Power Mode
Comments
PM1
The WDT runs but does not reset the chip upon timeout. If active mode is entered just as the timer
expires, the chip will be reset immediately, hence the WDT needs to be cleared regularly (before
timeout) also when in PM1.
PM2 and PM3
The WDT is disabled and reset, and the configuration is retained. The counter will start from 0x0000
when active mode is entered from PM2 or PM3
Table 54: Watchdog Mode and Power Modes
12.13.4 Watchdog Timer Register
WDCTL (0xC9) - Watchdog Timer Control
Bit
Field
Name
Reset
R/W
Description
7:4
CLR[3:0]
0000
R/W
Clear timer. When 1010 followed by 0101 is written to these bits, the counter is reset
to 0x0000. Note that the watchdog will only be cleared when 0101 is written within 0.5
watchdog clock period after 1010 was written. Writing to these bits when EN is 0 has
no effect.
3
EN
0
R/W
Enable timer. When a 1 is written to this bit the timer is enabled and starts
incrementing. Writing a 0 to this bit in timer mode stops the timer. Writing a 0 to this
bit in watchdog mode has no effect.
2
1:0
MODE
INT[1:0]
0
00
R/W
R/W
0
Timer disabled
1
Timer enabled
Mode select.
0
Watchdog mode
1
Timer mode
Timer interval select. These bits select the timer interval defined as a given number
of low speed oscillator periods.
Timer interval
# of
periods
32.768 kHz crystal
oscillator
32 kHz RCOSC
34.667 kHz RCOSC
CC2511Fx)
(calibrated,
(calibrated, CC2510Fx
running @ 26 MHz)
00
32768
1s
1.024 s
0.945 s
01
8192
0.25 s
0.256 s
0.236 s
10
512
15.625 ms
16 ms
14.769 ms
11
64
1.953 ms
2 ms
1.846 ms
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12.14
USART
USART0
and
USART1
are
serial
communications interfaces that can be
operated separately in either asynchronous
UART mode or in synchronous SPI mode. The
two USARTs are identical in functionality but
are assigned to separate I/O pins. Refer to
Section 12.4 on Page 87 for I/O configuration.
12.14.1 UART Mode
For asynchronous serial interfaces, the UART
mode is provided. In UART mode the interface
uses a two-wire or four-wire interface
consisting of the pins RXD and TXD, and
optionally RTS and CTS. The UART mode
includes the following features:
• 8 or 9 data bits
• Odd, even, or no parity
• Configurable start and stop bit level
• Configurable LSB or MSB first transfer
• Independent
interrupts
receive
and
transmit
• Independent receive and transmit DMA
triggers
• Parity and framing error status
The UART mode provides full duplex
asynchronous
transfers
and
the
synchronization of bits in the receiver does not
interfere with the transmit function. A UART
byte transfer consists of a start bit, eight data
bits, an optional ninth data or parity bit, and
one or two stop bits. Note that the data
transferred is referred to as a byte, although
the data can actually consist of eight or nine
bits.
The UART operation is controlled by the
USART x Control and Status registers, UxCSR,
and the USART x UART Control register,
UxUCR, where x is the USART number, 0 or 1.
The UART mode is
UxCSR.MODE is set to 1.
selected
when
12.14.1.1 UART Transmit
A UART transmission is initiated when the
USART
Receive/Transmit
Data
Buffer,
UxDBUF register is written. The byte is
transmitted on the TXDx output pin. The
UxDBUF register is double-buffered.
The UxCSR.ACTIVE bit goes high when the
byte transmission starts and low when it ends.
When
the
transmission
ends,
the
UxCSR.TX_BYTE bit is set to 1. The USARTx
TX
complete
CPU
interrupt
flag
(IRCON2.UTXxIF) is asserted when the
UxDBUF register is ready to accept new
transmit data, and an interrupt request is
generated if IEN2.UTXxIE=1. This happens
immediately after the transmission has been
started, hence a new data byte value can be
loaded into the data buffer while the byte is
being transmitted.
12.14.1.2 UART Receive
Data reception on the UART is initiated when a
1 is written to the UxCSR.RE bit. The UART
will then search for a valid start bit on the
RXDx input pin and set the UxCSR.ACTIVE bit
high. When a valid start bit has been detected
the received byte is shifted into the receive
register. The UxCSR.RX_BYTE bit and the
CPU interrupt flag, TCON.URXxIF, is set to 1
when the operation has completed and an
interrupt
request
is
generated
if
IEN0.URXxIE=1.
At
the
same
time
UxCSR.ACTIVE will go low.
The received data byte is available through the
UxDBUF register. When UxDBUF is read,
UxCSR.RX_BYTE is cleared by hardware.
12.14.1.3 UART Hardware Flow Control
Hardware flow control is enabled when the
UxUCR.FLOW bit is set to 1. The RTS output
will then be driven low when the receive
register is empty and reception is enabled.
Transmission of a byte will not occur before
the CTS input go low.
12.14.1.4 UART Character Format
If the BIT9 and PARITY bits in register UxUCR
are set high, parity generation and detection is
enabled. The parity is computed and
transmitted as the ninth bit, and during
reception, the parity is computed and
compared to the received ninth bit. If there is a
parity error, the UxCSR.ERR bit is set high.
This bit is cleared when UxCSR is read.
The number of stop bits to be transmitted is set
to one or two bits determined by the register bit
UxUCR.SPB. The receiver will always check for
one stop bit. If the first stop bit received during
reception is not at the expected stop bit level, a
framing error is signaled by setting register bit
UxCSR.FE high. UxCSR.FE is cleared when
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UxCSR is read. The receiver will check both
stop bits when UxUCR.SPB=1. Note that the
USARTx RX complete CPU interrupt flag,
TCON.URXxIF, and the UxCSR.RX_BYTE bit
will be asserted when the first stop bit is
checked OK. If the second stop bit is not OK,
the framing error bit, UxCSR.FE, will be
asserted. This means that this bit is updated 1
bit duration later than the 2 other above
mentioned bits. The UxCSR.ACTIVE bit will be
de-asserted after the second stop bit (if
UxUCR.SPB=1).
12.14.2 SPI Mode
This section describes the SPI mode of
operation for synchronous communication. In
SPI mode, the USART communicates with an
external system through a 3-wire or 4-wire
interface. The interface consists of the pins
MOSI, MISO, SCK and SSN. Refer to Section
12.4 on Page 87 for I/O configuration.
The SPI mode includes the following features:
• 3-wire (master) and 4-wire SPI interface
• Master and slave modes
asserted and the received data byte is
available in UxDBUF. An interrupt request is
generated if IEN0.URXxIE=1
Since UxDBUF
is double-buffered, the
assertion of the USARTx TX complete CPU
interrupt flag (IRCON2.UTXxIF) happens just
after a transmission has been initiated, and is
therefore not safe to use. Instead, the
assertion of the UxCSR.TX_BYTE bit should be
used as an indication on when new data can
be written to UxDBUF. For DMA transfers this
is handled automatically, but with the limitation
that the UxGCR.CPHA bit must be set to zero.
For
systems
requiring
setting
UxGCR.CPHA=1, the DMA can not be used.
Also note that the USARTx TX complete
interrupt occurs approximately 1 byte period
prior to the USARTx RX complete interrupt.
In SPI master mode, only the MOSI, MISO,
and SCK should be configured as peripherals
(see Section 12.4.6.1 and Section 12.4.6.2). If
the external slave requires a slave select
signal (SSN) this can be implemented by using
a general-purpose I/O pin and control from
SW.
• Configurable SCK polarity and phase
12.14.2.2 SPI Slave Operation
• Configurable LSB or MSB first transfer
The SPI mode is selected when UxCSR.MODE
is set to 0.
In SPI mode, the USART can be configured to
operate either as an SPI master or as an SPI
slave by setting UxCSR.SLAVE to 0 or 1,
respectively.
12.14.2.1 SPI Master Operation
An SPI byte transfer in master mode is initiated
when the UxDBUF register is written. The
USART generates the SCK signal using the
baud rate generator (see Section 12.14.3) and
shifts the provided byte from the transmit
register onto the MOSI output. At the same
time the receive register shifts in the received
byte from the MISO input pin.
The polarity and clock phase of the serial clock
SCK is selected by UxGCR.CPOL and
UxGCR.CPHA. The order of the byte transfer is
selected by the UxGCR.ORDER bit.
The UxCSR.ACTIVE bit goes high when the
transfer starts and low when the transfer ends.
When the transfer ends, the UxCSR.TX_BYTE
bit is set to 1.
An SPI byte transfer in slave mode is
controlled by the external system. The data on
the MOSI input is shifted into the receive
register controlled by the serial clock SCK,
which is an input in slave mode. At the same
time the byte in the transmit register is shifted
out onto the MISO output.
The UxCSR.ACTIVE bit is set to 1 when SNN
is asserted and cleared when SNN is deasserted. The UxCSR.RX_BYTE bit is set to 1
when a byte transfer ends.
At the end of the transfer, the USARTx RX
complete CPU interrupt flag, TCON.URXxIF, is
asserted and the received data byte is
available in UxDBUF. An interrupt request is
generated if IEN0.URXxIE=1. The USARTx
TX
complete
CPU
interrupt
flag,
IRCON2.UTXxIF, is asserted at the start of
the operation and an interrupt request is
generated if IEN2.UTXxIE=1.
The expected polarity and clock phase of SCK
is selected by UxGCR.CPOL and UxGCR.CPHA
as shown in Figure 41. The expected order of
the byte transfer is selected by the
UxGCR.ORDER bit.
At the end of the transfer, the USARTx RX
complete CPU interrupt flag, TCON.URXxIF, is
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12.14.2.3 Slave Select pin (SSN)
When the USART is operating in SPI slave
mode, a 4-wire interface is used with the Slave
Select (SSN) pin as an input to the SPI (edge
controlled). The SPI slave becomes active
after a falling edge on SSN and will receive
data on the MOSI input and send data on the
MISO output. After a rising edge on SSN, the
SPI slave is inactive and will not receive data.
Note that the MISO output is not tri-stated
when the SPI slave is inactive. Also note that
the rising edge on SSN must be aligned to the
end of the byte sent / received. If this is not the
case, the next received byte will be corrupted.
If there is a rising edge on SSN in the middle
of a byte, this should be followed by a USART
flush to avoid corruption of the following byte.
In SPI master mode, the SSN pin is not used.
When the USART operates as an SPI master
and a slave select signal is needed by an
external SPI slave device, a general purpose
I/O pin should be used to implement the slave
select signal function in software.
Figure 41: SPI Dataflow
12.14.3 Baud Rate Generation
An internal baud rate generator set up the
UART baud rate when operating in UART
mode and the SPI master clock frequency
when operating in SPI mode.
The
UxBAUD.BAUD_M[7:0]
and
UxGCR.BAUD_E[4:0] registers define the
baud rate used for UART transfers and the
rate of the serial clock (SCK) for SPI transfers.
The baud rate is given by the following
equation:
Baudrate =
(256 + BAUD _ M ) ⋅ 2
2 28
BAUD _ E
⋅F
where F is the system clock frequency set by
the selected system clock source.
The register values required for standard baud
rates are shown in Table 55 (F = 26 MHz) and
Table 56 (24 MHz). The tables also give the
difference in actual baud rate to standard baud
rate value as a percentage error.
The maximum baud rate for UART mode is
F/16
(UxGCR.BAUD_E[4:0]=16
and
UxBAUD.BAUD_M[7:0]=0).
The maximum baud rate for SPI master mode
and
thus
SCK
frequency
is
F/8
(UxGCR.BAUD_E[4:0]=17
and
If SPI master
UxBAUD.BAUD_M[7:0]=0).
mode does not need to receive data, the
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maximum
SPI
rate
is
F/2
(UxGCR.BAUD_E[4:0]=19
and
UxBAUD.BAUD_M[7:0]=0). Setting higher
baud rates than this will give erroneous results.
For SPI slave mode the maximum baud rate is
always F/8.
Note that the baud rate must be configured
before any other UART or SPI operations take
place (the baud rate should never be changed
when UxCSR.ACTIVE is asserted).
Baud Rate [bps]
UxBAUD.BAUD_M
UxGCR.BAUD_E
Error (%)
2400
131
6
0.04
4800
131
7
0.04
9600
131
8
0.04
14400
34
9
0.13
19200
131
9
0.04
28800
34
10
0.13
38400
131
10
0.04
57600
34
11
0.13
76800
131
11
0.04
115200
34
12
0.13
230400
34
13
0.13
Table 55: Commonly used Baud Rate Settings for 26 MHz System Clock
Baud Rate [bps]
UxBAUD.BAUD_M
UxGCR.BAUD_E
Error (%)
2400
163
6
0.08
4800
163
7
0.08
9600
163
8
0.09
14400
59
9
0.13
19200
163
9
0.10
28800
59
10
0.14
38400
163
10
0.10
57600
59
11
0.14
76800
163
11
0.10
115200
59
12
0.14
230400
59
13
0.14
Table 56: Commonly used Baud Rate Settings for 24 MHz System Clock
12.14.4 USART Flushing
12.14.5 USART Interrupts
The current operation can be aborted
(operation stopped and all data buffers
cleared)
by
setting
UxUCR.FLUSH=1.Asserting the FLUSH bit
should either be aligned with USART interrupts
or a wait time of one bit duration (at current
baud rate) should be added after setting the bit
to 1 before accessing the USART registers.
Each USART has two interrupts. These are the
USART
x
RX
complete
interrupt
(TCON.URXxIF) and the USART x TX
complete interrupt (IRCON2.UTXxIF). The
interrupts
are
enabled
by
setting
IEN0.URXxIE=1
and
IEN2.UTXxIE=1,
respectively. Please see the previous sections
on how the interrupt flags are asserted in the
different modes of operation (UART RX, UART
TX, SPI master, and SPI Slave).
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The interrupt enables
summarized below.
and
flags
are
buffer, UxDBUF, as source or destination
address.
Interrupt enable bits:
Note: For systems requiring setting
UxGCR.CPHA=1, the DMA can not be
used.
• USART0 RX : IEN0.URX0IE
• USART1 RX : IEN0.URX1IE
Refer to Table 51 on Page 104 for an overview
of the DMA triggers.
• USART0 TX : IEN2.UTX0IE
• USART1 TX : IEN2.UTX1IE
12.14.7 USART Registers
Interrupt flags:
• USART0 RX : TCON.URX0IF
The registers for the USART are described in
this section. For each USART there are five
registers consisting of the following (x refers to
USART number i.e. 0 or 1):
• USART1 RX : TCON.URX1IF
• USART0 TX : IRCON2.UTX0IF
• UxCSR USART x Control and Status
• USART1 TX : IRCON2.UTX1IF
• UxUCR USART x UART Control
12.14.6 USART DMA Triggers
• UxGCR USART x Generic Control
There are two DMA triggers associated with
each USART (URX0, UTX0, URX1, and
UTX1). The DMA triggers are activated by RX
complete and TX complete events i.e. the
same events that might generate USART
interrupt requests. A DMA channel can be
configured using a USART Receive/transmit
• UxDBUF USART x Receive/Transmit
Data Buffer
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• UxBAUD USART x Baud Rate Control
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U0CSR (0x86) - USART 0 Control and Status
Bit
Field Name
Reset
R/W
Description
7
MODE
0
R/W
USART 0 mode select
6
5
4
RE
SLAVE
FE
0
0
0
R/W
R/W
R/W0
0
SPI mode
1
UART mode
UART 0 receiver enable
0
Receiver disabled
1
Receiver enabled
SPI 0 master or slave mode select
0
SPI master
1
SPI slave
UART 0 framing error status
0
No framing error detected
1
Byte received with incorrect stop bit level
Note: TCON.URX0IF and U0CSR.RX_BYTE bit will be asserted when the first
stop bit is checked OK, meaning that if two stop bits are sent and the second
stop bit is not OK, this bit is asserted 1 bit duration later than the 2 other above
mentioned bits.
3
2
1
0
ERR
RX_BYTE
TX_BYTE
ACTIVE
0
0
0
0
R/W0
R/W0
R/W0
R
UART 0 parity error status
0
No parity error detected
1
Byte received with parity error
Receive byte status
0
No byte received
1
Received byte ready
Transmit byte status
0
Byte not transmitted
1
Last byte written to Data Buffer register transmitted
USART 0 transmit/receive active status
0
USART 0 idle
1
USART 0 busy in transmit or receive mode
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U0UCR (0xC4) - USART 0 UART Control
Bit
Field Name
Reset
R/W
Description
7
FLUSH
0
R0/
W1
Flush unit. When set to 1, this event will immediately stop the current operation
and return the unit to idle state.
This bit will be 0 when returning from PM2 and PM3
6
FLOW
0
R/W
UART 0 hardware flow control enable. Selects use of hardware flow control with
RTS and CTS pins
0 Flow control disabled
1 Flow control enabled
5
D9
0
R/W
UART 0 data bit 9 contents. This value is used when 9 bit transfer is enabled.
When parity is disabled the value written to D9 is transmitted as the 9th bit when
BIT9=1.
If parity is enabled then this bit sets the parity level as follows.
0 Even parity
1 Odd parity
4
BIT9
0
R/W
UART 0 9-bit data enable
0 8 bits transfer
1 9 bits transfer (content of the 9th bit is given by D9 and PARITY.)
3
PARITY
0
R/W
UART 0 parity enable
0 Parity disabled
1 Parity enabled
2
SPB
0
R/W
UART 0 number of stop bits
0 1 stop bit
1 2 stop bits
1
STOP
1
R/W
UART 0 stop bit level
0 Low stop bit
1 High stop bit
0
START
0
R/W
UART 0 start bit level. The polarity of the idle line is assumed to be the opposite of
the selected start bit level.
0 Low start bit
1 High start bit
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U0GCR (0xC5) - USART 0 Generic Control
Bit
Field Name
Reset
R/W
Description
7
CPOL
0
R/W
SPI 0 clock polarity
6
5
4:0
CPHA
ORDER
BAUD_E[4:0]
0
0
00000
R/W
R/W
R/W
0
Negative clock polarity (SCK low when idle)
1
Positive clock polarity (SCK high when idle)
SPI 0 clock phase
0
Data centered on first edge of SCK period
1
Data centered on second edge of SCK period
Bit order for transfers
0
LSB first
1
MSB first
Baud rate exponent value. BAUD_E along with BAUD_M decides the UART 0
baud rate and the SPI 0 clock (SCK) frequency
U0DBUF (0xC1) - USART 0 Receive/Transmit Data Buffer
Bit
Field Name
Reset
R/W
Description
7:0
DATA[7:0]
0x00
R/W
USART 0 receive and transmit data buffer. Writing data to U0DBUF places the
data into the internal transmit buffer. Reading U0DBUF returns the contents of the
receive buffer.
U0BAUD (0xC2) - USART 0 Baud Rate Control
Bit
Field Name
Reset
R/W
Description
7:0
BAUD_M[7:0]
0x00
R/W
Baud rate mantissa value. BAUD_M along with BAUD_E decides the UART 0
baud rate and the SPI 0 clock (SCK) frequency
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U1CSR (0xF8) - USART 1 Control and Status
Bit
Field Name
Reset
R/W
Description
7
MODE
0
R/W
USART 1 mode select
0 SPI mode
1 UART mode
6
RE
0
R/W
UART 1 receiver enable
0 Receiver disabled
1 Receiver enabled
5
SLAVE
0
R/W
SPI 1 master or slave mode select
0 SPI master
1 SPI slave
4
FE
0
R/W
0
UART 1 framing error status
0 No framing error detected
1 Byte received with incorrect stop bit level
Note that TCON.URX1IF and U1CSR.RX_BYTE bit will be asserted when the
first stop bit is checked OK, meaning that if two stop bits are sent and the
second stop bit is not OK, this bit is asserted 1 bit duration later than the 2 other
above mentioned bits.
3
ERR
0
R/W
0
UART 1 parity error status
0 No parity error detected
1 Byte received with parity error
2
RX_BYTE
0
R/W
0
Receive byte status
0 No byte received
1 Received byte ready
1
TX_BYTE
0
R/W
0
Transmit byte status
0 Byte not transmitted
1 Last byte written to Data Buffer register transmitted
0
ACTIVE
0
R
USART 1 transmit/receive active status
0 USART 1 idle
1 USART 1 busy in transmit or receive mode
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U1UCR (0xFB) - USART 1 UART Control
Bit
Field Name
Reset
R/W
Description
7
FLUSH
0
R0/
W1
Flush unit. When set to 1, this event will immediately stop the current operation
and return the unit to idle state.
This bit will be 0 when returning from PM2 and PM3
6
5
FLOW
D9
0
0
R/W
R/W
UART 1 hardware flow control enable. Selects use of hardware flow control with
RTS and CTS pins
0
Flow control disabled
1
Flow control enabled
UART 1 data bit 9 contents. This value is used when 9 bit transfer is enabled.
When parity is disabled the value written to D9 is transmitted as the 9th bit when
BIT9=1.
If parity is enabled then this bit sets the parity level as follows.
4
3
2
1
0
BIT9
PARITY
SPB
STOP
START
0
0
0
1
0
R/W
R/W
R/W
R/W
R/W
0
Even parity
1
Odd parity
UART 1 9-bit data enable
0
8 bits transfer
1
9 bits transfer (content of the 9th bit is given by D9 and PARITY.)
UART 1 parity enable
0
Parity disabled
1
Parity enabled
UART 1 number of stop bits
0
1 stop bit
1
2 stop bits
UART 1 stop bit level
0
Low stop bit
1
High stop bit
UART 1 start bit level. The polarity of the idle line is assumed to be the opposite
of the selected start bit level.
0
Low start bit
1
High start bit
U1GCR (0xFC) - USART 1 Generic Control
Bit
Field Name
Reset
R/W
Description
7
CPOL
0
R/W
SPI 1 clock polarity
6
5
4:0
CPHA
ORDER
BAUD_E[4:0]
0
0
00000
R/W
R/W
R/W
0
Negative clock polarity (SCK low when idle)
1
Positive clock polarity (SCK high when idle)
SPI 1 clock phase
0
Data centered on first edge of SCK period
1
Data centered on second edge of SCK period
Bit order for transfers
0
LSB first
1
MSB first
Baud rate exponent value. BAUD_E along with BAUD_M decides the UART 1
baud rate and the SPI 1 clock (SCK) frequency
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U1DBUF (0xF9) - USART 1 Receive/Transmit Data Buffer
Bit
Field Name
Reset
R/W
Description
7:0
DATA[7:0]
0x00
R/W
USART 1 receive and transmit data buffer. Writing data to U1DBUF places the
data into the internal transmit buffer. Reading U1DBUF returns the contents of the
receive buffer.
U1BAUD (0xFA) - USART 1 Baud Rate Control
Bit
Field Name
Reset
R/W
Description
7:0
BAUD_M[7:0]
0x00
R/W
Baud rate mantissa value. BAUD_M along with BAUD_E decides the UART 1
baud rate and the SPI 1 clock (SCK) frequency
2
12.15 I S
The CC2510Fx/CC2511Fx provides an industry
2
2
standard I S interface. The I S interface can be
used to transfer digital audio samples between
the CC2510Fx/CC2511Fx and an external audio
device.
Please see Section 12.4.6.6 for details on I/O
2
pin mapping for the I S interface. When the
module is in master mode, it drives the SCK
2
and WS lines. When the I S interface is in slave
mode, these lines are driven by an external
master. The data on the serial data lines is
transferred one bit per SCK cycle, most
significant bit first. The WS signal selects the
channel of the current word transfer (left = 0,
right = 1). It also determines the length of each
word. There is a transition on the WS line one
bit time before the first word is transferred and
before the last bit of each word. Figure 42
2
shows the I S signaling. Only a single serial
data signal is shown in this figure. The SD
signal could be the RX or TX signal depending
on the direction of the data.
2
The I S interface can be configured to operate
as master or slave and may use mono as well
as stereo samples. When mono mode is
enabled, the same audio sample will be used
for both channels. Both full and half duplex is
supported and automatic µ-Law compression
and expansion can be used.
2
The I S interface consists of 4 signals:
• Continuous Serial Clock (SCK)
• Word Select (WS)
• Serial Data In (RX)
• Serial Data Out (TX)
SCK
WS
MSB
SD
SAMPLE n-1,
RIGHT CHANNEL
LSB
MSB
LSB
MSB
SAMPLE n+1,
RIGHT CHANNEL
SAMPLE n,
LEFT CHANNEL
2
Figure 42: I S Digital Audio Signaling
2
2
12.15.1 Enabling I S
12.15.2 I S Interrupts
The I2SCFG0.ENAB bit must be set to 1 to
2
enable the I S transmitter/receiver. However,
2
when I2SCFG0.ENAB is 0, the I S can still be
used
as
a
stand-alone
µ-Law
compression/expansion engine. Refer to
Section 12.15.12 on Page 162 for more details
about this.
The I S has two interrupts:
2
• I S RX complete interrupt (I2SRX)
2
• I S TX complete interrupt (I2STX)
2
2
The I S interrupt enable bits are found in the
I2SCFG0 register. The interrupt flags are
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located in the I2SSTAT register. The interrupt
enables and flags are summarized below.
Interrupt enable bits:
• I S RX: I2SCFG0.RXIEN
2
• I S TX: I2SCFG0.TXIEN
2
Interrupt flags:
• I S RX: I2SSTAT.RXIRQ
2
Notice that the DMA triggers I2SRX and
ADC_CH6 share the same DMA trigger
number (# 27) in the same way as I2STX and
ADC_CH7 share DMA trigger number 28. This
means that I2SRX can not be used together
with ADC_CH6 and I2STX can not be used
together with ADC_CH7. On the CC2511Fx ADC
channels 6 and 7 cannot be used since P0_6
and P0_7 I/O pins are not available.
Refer to Table 51 on Page 104 for an overview
of the DMA triggers.
• I S TX: I2SSTAT.TXIRQ
2
The TX interrupt flag I2SSTAT.TXIRQ is
asserted together with IRCON2.I2STXIF
when the internal TX buffer is empty and the
2
I S fetches the new data previously written to
the I2SDATH:I2SDATL registers. The TX
interrupt flag, I2SSTAT.TXIRQ, is cleared
when I2SDATH register is written. An interrupt
request
is
only
generated
when
I2SCFG0.TXIEN and IEN2.I2STXIE are
both set to 1.
The RX interrupt flag I2SSTAT.RXIRQ is
asserted together with TCON.I2SRXIF when
the internal RX buffer is full and the contents of
the RX buffer is copied to the pair of internal
data registers that can be read from the
I2SDATH:I2SDATL
registers.
The
RX
interrupt flag, I2SSTAT.RXIRQ, is cleared
when the I2SDATH register is read. An
interrupt request is only generated when
I2SCFG0.RXIEN and IEN0.I2SRXIE are
both set to 1.
Notice that interrupts will also be generated if
the corresponding RXIRQ or TXIRQ flags are
set from software, given that the interrupts are
enabled.
2
The I S shares interrupt vector with USART 1,
and the ISR must take this into account if both
modules are used. Refer to Section 1.1 on
Page 57 for more details about interrupts.
12.15.4 Underflow/Overflow
2
If the I S attempts to read from the internal TX
buffer when it is empty, an underflow condition
2
occurs. The I S will then continue to read from
the
data
in
the
TX
buffer,
and
I2SSTAT.TXUNF will be asserted.
2
If the I S attempts to write to the internal RX
buffer while it is full, an overflow condition
occurs. The contents of the RX buffer will be
overwritten and the I2SSTAT.RXOVF flag will
be asserted.
Thus, when debugging an application,
software may check for underflow/overflow
when an interrupt is generated or when the
application completes. The TXUNF / RXOVF
flags should be cleared in software.
12.15.5 Writing a Word (TX)
When each sample fits into a single byte or µLaw compressed samples (always 8 bits) are
written, i.e. µ-Law expansion is enabled
(I2SCFG0.ULAWE=1), only the I2SDATH
register needs to be written.
When each sample is more than 8 bits the low
byte must be written to the I2SDATL register
before the high byte is written to the I2SDATH
register, hence writing the I2SDATH register
indicates the completion of the write operation.
2
2
12.15.3 I S DMA Triggers
There are two DMA triggers associated with
2
the I S interface, I2SRX and I2STX. The DMA
triggers are activated by RX complete and TX
complete events, i.e. the same events that can
2
generated the I S interrupt requests. The DMA
triggers are not masked by the interrupt enable
bits, I2SCFG0.RXIEN and I2SCFG0.TXIEN,
hence a DMA channel can be configured to
2
use the I S receive/transmit data registers,
I2SDATH:I2SDATL, as source or destination
address and let RX and TX complete trigger
the DMA.
When the I S is configured to send stereo, i.e.
I2SCFG0.TXMONO is 0, the I2SSTAT.TXLR
flag can be used to determine whether the leftor right-channel sample is to be written to the
data registers.
12.15.6 Reading a Word (RX)
If each sample fits into a single byte or if µ-Law
compression is enabled (I2SCFG0.ULAWC=1),
only the I2SDATH register needs to be read.
When each sample is more than 8 bits the low
byte must be read from the I2SDATL register
before the high byte is being read from the
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I2SDATH register, hence reading from the
I2SDATH register indicates the completion of
the read operation.
and 9-bit denominator, DENOM, as shown in the
following formula:
Fsck =
2
When the I S is configured to receive stereo,
i.e.
I2SCFG0.RXMONO
is
0,
the
I2SSTAT.RXLR flag can be used to determine
whether the sample currently in the data
registers is a left- or right-channel sample.
Fclk
NUM
2(
)
DENOM
NUM
> 3.35
DENOM
where
Fclk is the system clock frequency and Fsck is the
2
I S SCK sample clock frequency.
12.15.7 Full vs. Half Duplex
2
The I S interface supports full duplex and half
duplex operation.
The value of the numerator is set in the
In full duplex both the RX and TX lines will be
used. Both the I2SCFG0.TXIEN and
I2SCFG0.RXIEN interrupt enable bits must be
set to 1 if interrupts are used and both DMA
triggers I2STX and I2SRX must be used.
registers and the denominator value is set in
I2SCLKF2.DENOM[8]:I2SCLKF0.DENOM[7:0].
When half duplex is used only one of the RX
and TX lines are typically connected. Only the
appropriate interrupt flag should be set and
only one of the DMA triggers should be used.
12.15.8 Master Mode
2
The I S is configured as a master device by
setting I2SCFG0.MASTER to 1. When the
module is in master mode, it drives the SCK
and WS lines.
12.15.8.1 Clock Generation
2
I2SCLKF2.NUM[14:8]:I2SCLKF1.NUM[7:0]
Please note that to stay within the timing
2
requirements of the I S specification [6], a
minimum value of 3.35 should be used for the
(NUM / DENOM) fraction.
The fractional divider is made such that most
normal sample rates should be supported for
most normal word sizes with a 24 MHz system
clock frequency (CC2511Fx). Examples of
supported configurations for a 24 MHz system
clock are given in Table 57. Table 58 shows the
configuration values for a 26 MHz system clock
2
frequency. Notice that the generated I S
frequency is not exact for the 44.1 kHz, 16 bits
word size configuration at 26 MHz. The
numbers are calculated using the following
formulas, where Fs is the sample rate and W is
the word size:
When the I S is configured as master, the
frequency of the SCK clock signal must be set
to match the sample rate. The clock frequency
must be set before master mode is enabled.
Fs =
CLKDIV =
SCK is generated by dividing the system clock
using a fractional clock divider. The amount of
division is given by the 15 bit numerator, NUM ,
Fsck
2 ⋅W
Fclk
NUM
=
DENOM 4 ⋅ W ⋅ Fs
Fs (kHz)
Word Size (W)
CLKDIV
I2SCLKF2
I2SCLKF1
I2SCLKF0
Exact
8
8
93.75
0x01
0x77
0x04
Yes
8
16
46.875
0x01
0x77
0x08
Yes
44.1
16
8.503401
0x04
0xE2
0x93
Yes
48
16
7.8125
0x00
0x7D
0x10
Yes
Table 57: Example I S Clock Configurations (CC2511Fx, 24 MHz)
2
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Fs (kHz)
Word Size (W)
CLKDIV
I2SCLKF2
I2SCLKF1
I2SCLKF0
Exact
8
8
101.5625
0x06
0x59
0x10
Yes
8
16
50.78125
0x06
0x59
0x20
Yes
44.1
16
9.21201
0x8A
0x2F
0x1B
No
48
16
8.46354
0x06
0x59
0xC0
Yes
Table 58: Example I S Clock Configurations (CC2510Fx, 26 MHz)
2
12.15.8.2 Word Size
The word size must be set before master
mode is enabled. The word size is the number
of bits used for each sample and can be set to
a value between 1 and 33. To set the word
size, write word size – 1 to the
I2SCFG1.WORDS[4:0] bits. Setting the word
2
size to a value of 17 or more causes the I S to
pad each word with 0’s in the least significant
bits since the data registers provide maximum
16 bits. This feature allows samples to be sent
2
to an I S device that takes a higher resolution
than 16 bits.
To send mono samples, I2SCFG0.TXMONO
should be set to 1. Each word will then be
repeated in both channels before a new word
is fetched from the data registers. This is to
enable sending a mono audio signal to a
stereo audio sink device.
12.15.11 Word Counter
2
If the size of the received samples exceeds 16
bits, only the 16 most significant bits will be put
in the data registers and the remaining low
order bits will be discarded.
The I S contains a 10-bit word counter, which
is counting transitions on the WS line. The
counter can be cleared by triggers or by writing
to the I2SWCNT register. When a trigger
occurs, or a value is written to I2SWCNT, the
current value of the word counter is copied into
the
I2SSTAT.WCNT[9:8]:I2SWCNT.WCNT[7:0]regi
sters and the word counter is cleared.
12.15.9 Slave Mode
Three triggers can be used to copy/clear the
word counter.
2
The I S is configured as a slave device by
setting I2SCFG0.MASTER to 0. When in slave
mode the SCK and WS signals are generated
2
by an external I S master and are inputs to the
2
I S interface.
12.15.9.1 Word Size
2
When the I S operates in slave mode, the word
size is determined by the master that
generates the WS signal.
2
• USB SOF: USB Start of Frame. Occurs
every ms (CC2511Fx only)
• T1_CH0: Timer 1, compare, channel 0
• IOC_1: IO pin input transition (P1_3)
Which trigger to use is configured through the
TRIGNUM field in the I2SCFG1 register. When
2
the I S is configured not to use any trigger
(I2SCFG1.TRIGNUM=0), the word counter can
only be copied/cleared from software.
The I S will provide bits from the internal 16-bit
buffer until the buffer is empty. If the buffer
becomes empty and the master still requests
2
more bits, the I S will send 0’s (low order bits).
The word counter will saturate if it reaches its
maximum value. Software should configure the
trigger-interval and sample-rate to ensure this
never happens.
If more than 16 bits are being received, the low
order bits are discarded.
CC2511Fx: The word counter is typically used to
calculate the average sample rate over a long
period of time (e.g. 1 second) needed by
adaptive isochronous USB endpoints. The
USB SOF event must then be used as trigger.
12.15.10 Mono
2
The I S also supports mono audio samples.
To receive mono samples, I2SCFG0.RXMONO
should be set to 1. Words from the right
channel will then not be read into the data
registers. This feature is included because
some mono devices repeat their audio data in
both channels and the left channel is the
default mono channel.
12.15.12 µ-Law Compression and Expansion
2
The I S interface can be configured to perform
μ-Law compression and expansion. µ-Law
compression is enabled by setting the
I2SCFG0.ULAWC bit to 1 and µ-Law
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expansion is enabled
I2SCFG0.ULAWE bit to 1.
by
setting
the
2
When the I S interface is enabled, i.e. the
I2SCFG0.ENAB bit is 1, and µ-Law expansion
is enabled, every byte of μ-Law compressed
data written to the I2SDATH register is
expanded to a 16-bit sample before being
2
transmitted. When the I S interface is enabled
and µ-Law compression is enabled each
sample received is compressed to an 8-bit μLaw sample and put in the I2SDATH register.
2
When the I S interface is disabled, i.e. the
I2SCFG0.ENAB bit is 0, it can still be used to
perform μ-Law compression/expansion for
other resources in the system. To perform an
expansion, I2SCFG0.ULAWE must be 1 and
I2SCFG0.ULAWC must be 0 before writing a
byte of compressed data to the I2SDATH
register. The expansion takes one clock cycle
to perform, and then the result can be read
from the I2SDATH:I2SDATL registers.
start the compression, an un-compressed 16bit sample should be written to the
I2SDATH:I2SDATL
registers.
The
compression takes one clock cycle to perform,
and then the result can be read from the
I2SDATH register.
Only one of the flags I2SCFG0.ULAWC and
I2SCFG0.ULAWE should be set to 1 when the
I2SCFG0.ENAB bit is 0.
2
12.15.13 I S Registers
This section describes all the registers used for
2
2
I S control and status. The I S registers reside
in XDATA memory space in the region 0xDF40
- 0xDF48. Table 33 on Page 49 gives an
overview of register addresses while the tables
in this section describe each register. Notice
that the reset values for the registers reflect a
configuration with 16-bit stereo samples and
2
44.1 kHz sample rate. The I S is not enabled at
reset.
To perform a compression I2SCFG0.ULAWE
must be 0 and I2SCFG0.ULAWC must be 1. To
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2
0xDF40: I2SCFG0 - I S Configuration Register 0
Bit
Field Name
Reset
R/W
Description
7
TXIEN
0
R/W
Transmit interrupt enable
0 Interrupt disabled
1 Interrupt enabled
6
RXIEN
0
R/W
Receive interrupt enable
0 Interrupt disabled
1 Interrupt enabled
5
ULAWE
0
R/W
µ-Law expansion enable
0 Expansion disabled
1 Expansion enabled
4
ULAWC
0
R/W
ENAB=0
Expand data written to I2SDATH
ENAB=1
Enable expansion of data to transmit
µ-Law compression enable
0 Compression disabled
1 Compression enabled
3
TXMONO
0
R/W
ENAB=0
Compress data written to I2SDATH:I2SDATL
ENAB=1
Enable compression of data received
TX mono enable
0 Stereo mode
1 Each sample of audio data will be repeated in both channels before a new sample is
fetched. This is to enable sending a mono signal to a stereo audio sink device.
2
RXMONO
0
R/W
RX mono enable
0 Stereo mode
1 Data from the right channel will be discarded, i.e. not be read into the data registers.
This feature is included because some mono devices repeat their audio data in both
channels and left is the default mono channel.
1
MASTER
0
R/W
Master mode enable
0 Slave (CLK and WS are read from the pads)
1 Master (generate the CLK and WS)
0
ENAB
0
R/W
I2S interface enable
0 Disable (I2S can be used as a µ-Law compression/expansion unit)
1 Enable
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2
0xDF41: I2SCFG1 - I S Configuration Register 1
Bit
Field Name
Reset
R/W
Description
7:3
WORDS[4:0]
01111
R/W
This field gives the word size – 1. The word size is the bit-length of one sample for
one channel. Used to generate the WS signal when in master mode.
Reset value 01111 corresponds to 16 bit samples.
2:1
0
TRIGNUM[1:0]
00
IOLOC
0
R/W
R/W
Word counter copy / clear trigger
00
No trigger. Counter copied / cleared by writing to the I2SWCNT register
01
USB SOF (CC2511Fx only)
10
IOC_1 (P1_3)
11
T1_CH0
The pin locations for the I2S signals. This bit selects between the two alternative pin
mapping alternatives. Refer to Table 50 on Page 89 for an overview of pin locations.
0
Alt. 1 in Table 50 is used
1
Alt. 2 in Table 50 is used
Note: If the I2S interface is enabled (I2SCFG0_ENAB=1), the I2S interface will have
precedence in cases where other peripherals (except for the debug interface) are
configured to be on the same location. This is the case even if the pins are configured
to be general purpose I/O pins.
2
0xDF42: I2SDATL - I S Data Low Byte
Bit
Field Name
Reset
R/W
7:0
I2SDAT[7:0]
0x00
R/W
Description
Data register low byte.
If this register is not written between two writes to the I2SDATH register, the low byte
of the TX register will be cleared.
Note: This register will be in its reset state when returning to active mode from PM2
and PM3.
2
0xDF43: I2SDATH - I S Data High Byte
Bit
Field Name
Reset
R/W
Description
7:0
I2SDAT[15:8]
0x00
R/W
Data register high byte.
When this register is read, I2SSTAT.RXIRQ is de-asserted and the RX buffer is
considered empty. When this register is written, I2SSTAT.TXIRQ is de-asserted and
the TX buffer is considered full.
Note: This register will be in its reset state when returning to active mode from PM2
and PM3.
2
0xDF44: I2SWCNT - I S Word Count Register
Bit
Field Name
Reset
R/W
Description
7:0
WCNT[7:0]
0x00
R/W
This register contains the 8 low order bits of the 10-bit internal word counter at the
time of the last trigger. If this register is written (any value),the value of the internal
word counter is copied into this register and I2SSTAT.WCNT[9:8], and the internal
word counter is cleared.
Refer to Section 12.15.11 for details about how to use this register.
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2
0xDF45: I2SSTAT - I S Status Register
Bit
Field Name
Reset
R/W
Description
7
TXUNF
0
R/W
TX buffer underflow. This bit must be cleared by software
6
RXOVF
0
R/W
Rx buffer overflow. This bit must be cleared by software
5
TXLR
0
R
0
Left channel should be placed in transmit buffer
1
Right channel should be placed in transmit buffer
0
Left channel currently in receive buffer
1
Right channel currently in receive buffer
4
3
2
1:0
RXLR
TXIRQ
RXIRQ
WCNT[9:8]
0
0
0
00
R
R/W1
H0
R/W1
H0
R
TX interrupt flag. This bit is cleared by hardware when the I2SDATH register is
written.
0
Interrupt not pending
1
Interrupt pending
RX Interrupt flag. This is cleared by hardware when the I2SDATH register is read.
0
Interrupt not pending
1
Interrupt pending
Upper 2 bits of the 10-bit internal word counter at the time of the last trigger
2
0xDF46: I2SCLKF0 - I S Clock Configuration Register 0
Bit
Field Name
Reset
R/W
Description
7:0
DENOM[7:0]
0x93
R/W
The clock division denominator low bits
2
0xDF47: I2SCLKF1 - I S Clock Configuration Register 1
Bit
Field Name
Reset
R/W
Description
7:0
NUM[7:0]
0xE2
R/W
Clock division numerator low bits
2
0xDF48: I2SCLKF2 - I S Clock Configuration Register 2
Bit
Field Name
Reset
R/W
Description
7
DENOM[8]
0
R/W
Clock division denominator high bits
6:0
NUM[14:8]
0x04
R/W
Clock division numerator high bits
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12.16 USB Controller
firmware. The firmware must be able to reply
correctly to all standard requests from the USB
host and work according to the protocol
implemented in the driver on the PC.
Note: The USB controller is only available
on the CC2511Fx.
The CC2511Fx contains a Full-Speed USB 2.0
compatible
USB
controller
for
serial
communication with a PC or other equipment
with USB host functionality.
The USB Controller has the following features:
• Full-Speed operation (up to 12 Mbps)
• 5 endpoints (in addition to endpoint 0)
that can be used as IN, OUT, or IN/OUT
and can be configured as bulk/interrupt
or isochronous.
Note: This section will focus on describing
the functionality of the USB controller, and
it is assumed that the reader has a good
understanding of USB and is familiar with
the terms and concepts used. Refer to the
Universal Serial Bus Specification for
details [5].
• 1 KB SRAM FIFO available for storing
USB packets
• Endpoints supporting packet sizes from
8 – 512 bytes
Standard USB nomenclature is used
regarding IN and OUT. I.e., IN is always
into the host (PC) and OUT is out of the
host (into the CC2511Fx)
• Support for double buffering of USB
packets
Figure 43 shows a block diagram of the USB
controller. The USB PHY is the physical
interface with input and output drivers. The
USB SIE is the Serial Interface Engine which
controls the packet transfer to/from the
endpoints. The USB controller is connected to
the rest of the system through the Memory
Arbiter.
The USB controller monitors the USB bus for
relevant activity and handles packet transfers.
The CC2511Fx will always operate as a slave on
the USB bus and responds only on requests
from the host (a packet can only be sent (or
received) when the USB host sends a request
in the form of a token).
Appropriate response to USB interrupts and
loading/unloading
of
packets
into/from
endpoint FIFOs is the responsibility of the
USB Controller
EP0
EP1
DP
EP2
USB SIE
USB PHY
Memory
Arbiter
EP3
DM
EP4
EP5
1 KB
SRAM
(FIFOs)
Figure 43: USB Controller Block Diagram
12.16.1 48 MHz Clock
A 48 MHz external crystal must be used for the
USB Controller to operate correctly. This 48
MHz clock is divided by two internally to
generate a maximum system clock frequency
of 24 MHz. It is important that the crystal
oscillator is stable before the USB Controller is
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accessed. See 12.1.5.1 for details on how to
set up the crystal oscillator.
SLEEP.USB_EN
controller.
12.16.2 USB Enable
12.16.3 USB Interrupts
The USB Controller must be enabled before it
is used. This is performed by setting the
SLEEP.USB_EN
bit
to
1.
Setting
There are 3 interrupt flag registers with
associated interrupt enable mask registers.
to 0 will reset the USB
Interrupt Flag
Description
Associated Interrupt
Enable Mask Register
USBCIF
Contains flags for common USB interrupts
USBCIE
USBIIF
Contains interrupt flags for endpoint 0 and all the IN
endpoints
USBIIE
USBOIF
Contains interrupt flags for all OUT endpoints
USBOIE
Note: All interrupts except SOF and suspend are initially enabled after reset
Table 59: USB Interrupt Flags Interrupt Enable Mask Registers
In addition to the interrupt flags in the registers
shown in Table 59, there are two CPU interrupt
flags associated with the USB controller;
IRCON2.USBIF and IRCON.P0IF. For an
interrupt request to be generated, IEN1.P0IE
and/or IEN2.USBIE must be set to 1 together
with the desired interrupt enable bits from the
USBCIE, USBIIE, and USBOIE registers.
When an interrupt request has been
generated, the CPU will start executing the
ISR if there are no higher priority interrupts
pending. The USB controller uses interrupt #6
for USB interrupts. This interrupt number is
shared with Port 2 inputs, hence the interrupt
routine must also handle Port 2 interrupts if
they are enabled. The interrupt routine should
read all the interrupt flag registers and take
action depending on the status of the flags.
The interrupt flag registers will be cleared
when they are read and the status of the
individual interrupt flags should therefore be
saved in memory (typically in a local variable
on the stack) to allow them to be accessed
multiple times.
At the end of the ISR, after the interrupt flags
have been read, the interrupt flags should be
cleared to allow for new USB/P2 interrupts to
be detected. The port 2 interrupt status flags in
the P2IFG register should be cleared prior to
clearing IRCON2.P2IF (see Section 10.5.2).
Refer to Table 39 and Table 40 for a complete
list of interrupts, and Section 1.1 for more
details about interrupts.
12.16.3.1 USB Resume Interrupt
P0_7 does not exist on the CC2511Fx, but the
corresponding interrupt is used for USB
resume interrupt. This means that to be able to
wake up the CC2511Fx from PM1/suspend when
resume signaling has been detected on the
USB bus, IEN1.P0IE must be set to 1
together
with
PICTL.P0IENH.
PICTL.P0ICON must be 0 to enable interrupts
on rising edge. The P0 ISR should check the
P0IFG.USB_RESUME, and resume if this bit is
set to 1. If PM1 is entered from within an ISR
due to a suspend interrupt, it is important that
the priority of the P0 interrupt is set higher than
the priority of the interrupt from which PM1
was entered. See Section 12.16.9 for more
details about suspend and resume.
12.16.4 Endpoint 0
Endpoint 0 (EP0) is a bi-directional control
endpoint and during the enumeration phase all
communication is performed across this
endpoint. Before the USBADDR register has
been set to a value other than 0, the USB
controller will only be able to communicate
through endpoint 0. Setting the USBADDR
register to a value between 1 and 127 will
bring the USB function out of the Default state
in the enumeration phase and into the Address
state. All configured endpoints will then be
available for the application.
The EP0 FIFO is only used as either IN or
OUT and double buffering is not provided for
endpoint 0. The maximum packet size for
endpoint 0 is fixed at 32 bytes.
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• The USB host tries to send a packet that
exceeds the maximum packet size
during the OUT Data stage
Endpoint 0 is controlled through the USBCS0
register by setting the USBINDEX register to 0.
The USBCNT0 register contains the number of
bytes received.
12.16.5 Endpoint 0 Interrupts
The following events may generate an EP0
interrupt request:
• A data packet has been received
(USBCS0.OUTPKT_RDY=1)
• A data packet that was loaded into the
EP0 FIFO has been sent to the USB
host (USBCS0.INPKT_RDY should be
set to 1 when a new packet is ready to
be transferred. This bit will be cleared by
HW when the data packet has been
sent)
• An IN transaction has been completed
(the interrupt is generated during the
Status stage of the transaction)
• A
STALL
has
been
(USBCS0.SENT_STALL=1)
sent
• A control transfer ends due to a
premature end of control transfer
(USBCS0.SETUP_END=1)
Any of these events will cause the
USBIIF.EP0IF to be asserted regardless of
the status of the EP0 interrupt mask bit
USBIIE.EP0IE. If the EP0 interrupt mask bit
is set to 1, the CPU interrupt flag
IRCON2.USBIF will also be asserted. An
interrupt request is only generated if
IEN2.USBIE and USBIIE.EP0IE are both
set to 1.
12.16.5.1 Error Conditions
When a protocol error occurs, the USB
controller sends a STALL handshake. The
USBCS0.SENT_STALL bit is asserted and an
interrupt request is generated if the endpoint 0
interrupt is properly enabled. A protocol error
can be any of the following:
• An OUT token is received after
USBCS0.DATA_END has been set to
complete the OUT Data stage (the host
tries to send more data than expected)
• An IN token is received after
USBCS0.DATA_END has been set to
complete the IN Data stage (the host
tries to receive more data than
expected)
• The size of the DATA1 packet received
during the Status stage is not 0
The firmware can also terminate the current
transaction
by
setting
the
USBCS0.SEND_STALL bit to 1. The USB
controller will then send a STALL handshake in
response to the next requests from the USB
host.
If an EP0 interrupt is caused by the assertion
of the USBCS0.SENT_STALL bit, this bit
should be de-asserted and firmware should
consider the transfer as aborted (free memory
buffers etc.).
If EP0 receives an unexpected token during
the Data stage, the USBCS0.SETUP_END bit
will be asserted and an EP0 interrupt will be
generated (if enabled properly). EP0 will then
switch to the IDLE state. Firmware should then
set the USBCS0.CLR_SETUP_END bit to 1 and
abort
the
current
transfer.
If
USBCS0.OUTPKT_RDY is asserted, this
indicates that another Setup Packet has been
received that firmware should process.
12.16.5.2 SETUP Transactions (IDLE State)
The control transfer consists of 2 - 3 stages of
transactions (Setup - Data - Status or Setup Status). The first transaction is a Setup
transaction. A successful Setup transaction
comprises three sequential packets (a token
packet, a data packet, and a handshake
packet), where the data field (payload) of the
data packet is exactly 8 bytes long and are
referred to as the Setup Packet. In the Setup
stage of a control transfer, EP0 will be in the
IDLE state. The USB controller will reject the
data packet if the Setup Packet is not 8 bytes.
Also, the USB controller will examine the
contents of the Setup Packet to determine
whether or not there is a Data stage in the
control transfer. If there is a Data stage, EP0
will switch state to TX (IN transaction) or RX
(OUT
transaction)
when
the
USBCS0.CLR_OUTPKT_RDY bit is set to 1 (if
USBCS0.DATA_END=0).
When
a
packet
is
received,
the
USBCS0.OUTPKT_RDY bit will be asserted and
an interrupt request is generated (EP0
interrupt) if the interrupt has been enabled.
Firmware should perform the following when a
Setup Packet has been received:
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1. Unload the Setup Packet from the EP0
FIFO
is working, but temporarily has no data to
send.
2. Examine the contents and perform the
appropriate operations
12.16.5.4 OUT Transactions (RX state)
3. Set the USBCS0.CLR_OUTPKT_RDY bit
to 1. This denotes the end of the Setup
stage. If the control transfer has no Data
stage, the USBCS0.DATA_END bit must
also be set. If there is no Data stage, the
USB Controller will stay in the IDLE
state.
12.16.5.3 IN Transactions (TX state)
If the control transfer requires data to be sent
to the host, the Setup stage will be followed by
one or more IN transactions in the Data stage.
In this case the USB controller will be in TX
state and only accept IN tokens. A successful
IN transaction comprises two or three
sequential packets (a token packet, a data
19
packet, and a handshake packet ). If more
than 32 bytes (maximum packet size) is to be
sent, the data must be split into a number of 32
byte packets followed by a residual packet. If
the number of bytes to send is a multiple of 32,
the residual packet will be a zero length data
packet, hence a packet size less than 32 bytes
denotes the end of the transfer.
Firmware should load the EP0 FIFO with the
first
data
packet
and
set
the
USBCS0.INPKT_RDY bit as soon as possible
after the USBCS0.CLR_OUTPKT_RDY bit has
been set. The USBCS0.INPKT_RDY will be
cleared and an EP0 interrupt will be generated
when the data packet has been sent. Firmware
might then load more data packets as
necessary. An EP0 interrupt will be generated
for each packet sent. Firmware must set
USBCS0.DATA_END
in
addition
to
USBCS0.INPKT_RDY when the last data
packet has been loaded. This will start the
Status stage of the control transfer.
EP0 will switch to the IDLE state when the
Status stage has completed. The Status stage
may fail if the USBCS0.SEND_STALL bit is set
to 1. The USBCS0.SENT_STALL bit will then
be asserted and an EP0 interrupt will be
generated as explained in Section 12.16.5.1.
If USBCS0.INPKT_RDY is not set when
receiving an IN token, the USB Controller will
reply with a NAK to indicate that the endpoint
If the control transfer requires data to be
received from the host, the Setup stage will be
followed by one or more OUT transactions in
the Data stage. In this case the USB controller
will be in RX state and only accept OUT
tokens. A successful OUT transaction
comprises two or three sequential packets (a
token packet, a data packet, and a handshake
20
packet ). If more than 32 bytes (maximum
packet size) is to be received, the data must
be split into a number of 32 byte packets
followed by a residual packet. If the number of
bytes to receive is a multiple of 32, the residual
packet will be a zero length data packet, hence
a data packet with payload less than 32 bytes
denotes the end of the transfer.
The USBCS0.OUTPKT_RDY bit will be set and
an EP0 interrupt will be generated when a data
packet has been received. The firmware
should set USBCS0.CLR_OUTPKT_RDY when
the data packet has been unloaded from the
EP0 FIFO. When the last data packet has
been received (packet size less than 32 bytes)
firmware
should
also
set
the
USBCS0.DATA_END bit. This will start the
Status stage of the control transfer. The size of
the data packet is kept in the USBCNT0
registers. Note that this value is only valid
when USBCS0.OUTPKT_RDY=1.
EP0 will switch to the IDLE state when the
Status stage has completed. The Status stage
may fail if the DATA1 packet received is not a
zero length data packet or if the
USBCS0.SEND_STALL bit is set to 1. The
USBCS0.SENT_STALL bit will then be
asserted and an EP0 interrupt will be
generated as explained in Section 12.16.5.1.
12.16.6 Endpoints 1 - 5
Each endpoint can be used as an IN only, an
OUT only, or IN/OUT. For an IN/OUT endpoint
there are basically two endpoints, an IN
endpoint and an OUT endpoint associated with
the endpoint number. Configuration and
control of IN endpoints is performed through
the USBCSIL and USBCSIH registers. The
USBCSOL and USBCSOH registers are used to
20
19
For isochronous transfers there would not be
a handshake packet from the host
For isochronous transfers there would not be
a handshake packet from the CC2511Fx
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configure and control OUT endpoints. Each IN
and OUT endpoint can be configured as either
Isochronous
(USBCSIH.ISO=1
and/or
USBCSOH.ISO=1)
or
Bulk/Interrupt
(USBCSIH.ISO=0
and/or
USBCSOH.ISO=0)
endpoints.
Bulk
and
Interrupt endpoints are handled identically by
the USB controller but will have different
properties from a firmware perspective.
The USBINDEX register must have the value of
the endpoint number before the Indexed
Endpoint Registers are accessed (see Table
35 on Page 50).
12.16.6.1 FIFO Management
Each endpoint has a certain number of FIFO
memory bytes available for incoming and
outgoing data packets. Table 60 shows the
FIFO size for endpoints 1 - 5. It is the firmware
that is responsible for setting the USBMAXI and
USBMAXO registers correctly for each endpoint
to prevent data from being overwritten.
the top of the endpoint memory region while
the OUT FIFO grows up from the bottom of the
endpoint memory region.
When the IN or OUT endpoint of an endpoint
number use double buffering, the sum of
USBMAXI and USBMAXO must not exceed half
the FIFO size for the endpoint. Figure 44 b)
illustrates the IN and OUT FIFO memory for an
endpoint that uses double buffering. Notice
that the second OUT buffer starts from the
middle of the memory region and grows
upwards. The second IN buffer also starts from
the middle of the memory region but grows
downwards.
To configure an endpoint as IN only, set
USBMAXO to 0 and to configure an endpoint as
OUT only, set USBMAXI to 0.
For unused endpoints, both USBMAXO and
USBMAXI should be set to 0.
When both the IN and the OUT endpoint of an
endpoint number do not use double buffering,
the sum of USBMAXI and USBMAXO must not
exceed the FIFO size for the endpoint. Figure
44 a) shows how the IN and OUT FIFO
memory for an endpoint is organized with
single buffering. The IN FIFO grows down from
EP Number
FIFO Size (in bytes)
1
32
2
64
3
128
4
256
5
512
Table 60: FIFO Sizes for EP 1 - 5
0
0
IN FIFO
(Buffer 1)
IN FIFO
USBMAXI - 1
USBMAX0 - 1
USBMAXI - 1
0
0
OUT FIFO
(Buffer 2)
IN FIFO
(Buffer 2)
USBMAXI - 1
USBMAX0 - 1
USBMAX0 - 1
OUT FIFO
0
0
OUT FIFO
(Buffer 1)
b)
a)
Figure 44: IN/OUT FIFOs, a) Single Buffering b) Double Buffering
12.16.6.2 Double Buffering
To enable faster transfer and reduce the need
for retransmissions, CC2511Fx implements
double buffering, allowing two packets to be
buffered in the FIFO in each direction. This is
highly
recommended
for
isochronous
endpoints, which are expected to transfer one
data packet every USB frame without any
retransmission. For isochronous endpoint one
data packet will be sent/received every USB
frame. However, the data packet may be
sent/received at any time during the USB
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frame period and there is a chance that two
data packets may be sent/received at a few
micro seconds interval. For isochronous
endpoints, an incoming packet will be lost if
there is no buffer available and a zero length
data packet will be sent if there is no data
packet ready for transmission when the USB
host requests data. Double buffering is not as
critical for bulk and interrupt endpoints as it is
for isochronous endpoint since packets will not
be lost. Double buffering, however, may
improve the effective data rate for bulk
endpoints.
To enable double buffering for an IN endpoint,
USBCSIH.IN_DBL_BUF must be set to 1. To
enable double buffering for an OUT endpoint,
set USBCSOH.OUT_DBL_BUF to 1.
12.16.6.3 FIFO Access
The endpoint FIFOs are accessed by reading
and writing to the registers in Table 36 on
Page 50. Writing to a register causes the byte
written to be inserted into the IN FIFO.
Reading a register causes the next byte in the
OUT FIFO to be extracted and the value of this
byte to be returned.
When a data packet has been written to an IN
FIFO, the USBCSIL.INPKT_RDY bit must be
set to 1. If double buffering is enabled, the
USBCSIL.INPKT_RDY bit will be cleared
immediately after it has been written and
another data packet can be loaded. This will
not generate an IN endpoint interrupt, since an
interrupt is only generated when a packet has
been sent. When double buffering is used
firmware should check the status of the
USBCSIL.PKT_PRESENT bit before writing to
the IN FIFO. If this bit is 0, two data packets
can be written. Double buffered isochronous
endpoints should only need to load two
packets the first time the IN FIFO is loaded.
After that, one packet is loaded for every USB
frame. To send a zero length data packet,
USBCSIL.INPKT_RDY should be set to 1
without loading a data packet into the IN FIFO.
A data packet can be read from the OUT FIFO
when the USBCSOL.OUTPKT_RDY bit is 1. An
interrupt will be generated when this occurs, if
enabled. The size of the data packet is kept in
the USBCNTH:USBCNTL registers. Note that
this
value
is
only
valid
when
USBCSOL.OUTPKT_RDY=1. When the data
packet has been read from the OUT FIFO, the
USBCSOL.OUTPKT_RDY bit must be cleared. If
double buffering is enabled there may be two
data packets in the FIFO. If another data
packet
is
ready
when
the
USBCSOL.OUTPKT_RDY bit is cleared the
USBCSOL.OUTPKT_RDY bit will be asserted
immediately and an interrupt will be generated
(if enabled) to signal that a new data packet
has
been
received.
The
USBCSOL.FIFO_FULL bit will be set when
there are two data packets in the OUT FIFO.
The AutoClear feature is supported for OUT
endpoints.
When
enabled,
the
USBCSOL.OUTPKT_RDY
bit
is
cleared
automatically when USBMAXO bytes have been
read from the OUT FIFO. The AutoClear
feature
is
enabled
by
setting
USBCSOH.AUTOCLEAR=1.
The
AutoClear
feature can be used to reduce the time the
data packet occupies the OUT FIFO buffer and
is typically used for bulk endpoints.
A complementary AutoSet feature is supported
for IN endpoints. When enabled, the
USBCSIL.INPKT_RDY bit is set automatically
when USBMAXI bytes have been written to the
IN FIFO. The AutoSet feature is enabled by
setting USBCSIH.AUTOSET=1. The AutoSet
feature can reduce the overall time it takes to
send a data packet and is typically used for
bulk endpoints.
12.16.6.4 Endpoint 1 - 5 Interrupts
The following events may generate an IN EPx
interrupt request (x indicates the endpoint
number):
• A data packet that was loaded into the
IN FIFO has been sent to the USB host
(USBCSIL.INPKT_RDY should be set to
1 when a new packet is ready to be
transferred. This bit will be cleared by
HW when the data packet has been
sent)
• A
STALL
has
been
sent
(USBCSIL.SENT_STALL=1).
Only
Bulk/Interrupt endpoints can be stalled
• The IN FIFO is flushed due to the
USBCSIH.FLUSH_PACKET bit being set
to 1
Any
of
these
events
will
cause
USBIIF.INEPxIF to be asserted regardless
of the status of the IN EPx interrupt mask bit
USBIIE.INEPxIE. If the IN EPx interrupt
mask bit is set to 1, the CPU interrupt flag
IRCON2.USBIF will also be asserted. An
interrupt request is only generated if
IEN2.USBIE and USBIIE.INEPxIE are both
set to 1. The x in the register names refer to
the endpoint number 1 - 5)
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The following events may generate an OUT
EPx interrupt request:
• A data packet has been received
(USBCSOL.OUTPKT_RDY=1)
• A
STALL
has
been
sent
(USBCSIL.SENT_STALL=1).
Only
Bulk/Interrupt endpoints can be stalled
Any
of
these
events
will
cause
USBOIF.OUTEPxIF
to
be
asserted
regardless of the status of the OUT EPx
interrupt mask bit USBOIE.OUTEPxIE. If the
OUT EPx interrupt mask bit is set to 1, the
CPU interrupt flag IRCON2.USBIF will also be
asserted. An interrupt request is only
generated
if
IEN2.USBIE
and
USBOIE.OUTEPxIE are both set to 1.
12.16.6.5 Bulk/Interrupt IN Endpoint
Interrupt IN transfers occur at regular intervals
while bulk IN transfers utilize available
bandwidth not allocated to isochronous,
interrupt, or control transfers.
Interrupt IN endpoints may set the
USBCSIH.FORCE_DATA_TOG bit. When this bit
is set the data toggle bit is continuously
toggled regardless of whether an ACK was
received or not. This feature is typically used
by interrupt IN endpoints that are used to
communicate rate feedback for Isochronous
endpoints.
A Bulk/Interrupt IN endpoint can be stalled by
setting the USBCSIL.SEND_STALL bit to 1.
When the endpoint is stalled, the USB
controller will respond with a STALL
handshake
to
IN
tokens.
The
USBCSIL.SENT_STALL bit will then be set
and an interrupt will be generated, if enabled.
A bulk transfer longer than the maximum
packet size is performed by splitting the
transfer into a number of data packets of
maximum size followed by a smaller data
packet containing the remaining bytes. If the
transfer length is a multiple of the maximum
packet size, a zero length data packet is sent
last. This means that a packet with a size less
than the maximum packet size denotes the
end of the transfer. The AutoSet feature can
be useful in this case, since many data
packets will be of maximum size.
12.16.6.6 Isochronous IN Endpoint
An Isochronous IN endpoint is used to transfer
periodic data from the USB controller to the
host (one data packet every USB frame).
If there is no data packet loaded in the IN FIFO
when the USB host requests data, the USB
controller sends a zero length data packet and
the USBCSIL.UNDERRUN bit will be asserted.
Double buffering requires that a data packet is
loaded into the IN FIFO during the frame
preceding the frame where it should be sent. If
the first data packet is loaded before an IN
token is received, the data packet will be sent
during the same frame as it was loaded and
hence violate the double buffering strategy.
Thus, when double buffering is used, the
USBPOW.ISO_WAIT_SOF bit should be set to
1 to avoid this. Setting this bit will ensure that a
loaded data packet is not sent until the next
SOF token has been received.
The AutoSet feature will typically not be used
for isochronous endpoints since the packet
size will increase or decrease from frame to
frame.
12.16.6.7 Bulk/Interrupt OUT Endpoint
Interrupt OUT transfers occur at regular
intervals while bulk OUT transfers utilize
available
bandwidth
not
allocated
to
isochronous, interrupt, or control transfers.
A Bulk/Interrupt OUT endpoint can be stalled
by setting the USBCSOL.SEND_STALL bit to
1. When the endpoint is stalled, the USB
controller will respond with a STALL
handshake when the host is done sending the
data packet. The data packet is discarded and
is not placed in the OUT FIFO. The USB
controller
will
assert
the
USBCSOL.SENT_STALL bit when the STALL
handshake is sent and generate an interrupt
request if the OUT endpoint interrupt is
enabled.
As the AutoSet feature is useful for bulk IN
endpoints, the AutoClear feature is useful for
OUT endpoints since many packets will be of
maximum size.
12.16.6.8 Isochronous OUT Endpoint
An Isochronous OUT endpoint is used to
transfer periodic data from the host to the USB
controller (one data packet every USB frame).
If there is no buffer available when a data
packet
is
being
received,
the
USBCSOL.OVERRUN bit will be asserted and
the packet data will be lost. Firmware can
reduce the chance for this to happen by using
double buffering and use DMA to effectively
unload data packets.
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An isochronous data packet in the OUT FIFO
may have bit errors. The hardware will detect
this condition and set USBCSOL.DATA_ERROR.
Firmware should therefore always check this
bit when unloading a data packet.
The word size can be byte (8 bits) or word (16
bits). When word size transfer is used the
ENDIAN register must be set correctly (see
Section 12.5.7). The ENDIAN.USBRLE bit
selects whether a word is read as little or big
endian from the OUT FIFOs and the
ENDIAN.USBWLE bit selects whether a word is
written as little or big endian to the IN FIFOs.
Writing and reading words for the different
settings is shown in Figure 45 and Figure 46
respectively. Notice that the setting for these
bits will be used for all endpoints.
Consequently, it is not possible to have
multiple DMA channels active at once that use
different endianess. The ENDIAN register must
be configured to use big endian for both read
and write for a word size transfer to produce
the same result as a byte size transfer of an
even number of bytes. Word size transfers are
slightly more efficient than byte transfers.
The AutoClear feature will typically not be used
for isochronous endpoints since the packet
size will increase or decrease from frame to
frame.
12.16.7 DMA
DMA should be used to fill the IN endpoint
FIFOs and empty the OUT endpoint FIFOs.
Using DMA will improve the read/write
performance significantly compared to using
the 8051 CPU. It is therefore highly
recommended to use DMA unless timing is not
critical or only a few bytes are to be
transferred.
Refer to Section
regarding DMA.
There are no DMA triggers for the USB
controller, meaning that DMA transfers must
be triggered by firmware.
MSB
12.5
for more
details
LSB
ENDIAN.USBWLE = 0
To Host
SYNC
PID
MSB
LSB
MSB
LSB
MSB
LSB
MSB
LSB
CRC16
EOP
LSB
MSB
CRC16
EOP
ENDIAN.USBWLE = 1
SYNC
To Host
PID
LSB
MSB
LSB
MSB
Figure 45: Writing Big/Little Endian
SYNC
PID
ENDIAN.USBRLE = 0
B0
B1
B0
B1
B2
B3
Bn-1
Bn
CRC16
EOP
From Host
ENDIAN.USBRLE = 1
B1
B0
Figure 46: Reading Big/Little Endian
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12.16.8 USB Reset
When reset signaling is detected on the bus,
the USBCIF.RSTIF flag will be asserted. If
USBCIE.RSTIE is enabled, IRCON2.USBIF
will also be asserted and an interrupt request
is generated if IEN2.USBIE=1. The firmware
should take appropriate action when a USB
reset occurs. A USB reset should place the
device in the Default state where it will only
respond to address 0 (the default address).
One or more resets will normally take place
during the enumeration phase right after the
USB cable is connected.
The following actions are performed by the
USB controller when a USB reset occurs:
• USBADDR is set to 0
• USBINDEX is set to 0
• All endpoint FIFOs are flushed
• USBCS0,
USBCSIL,
USBCSIH,
USBCSOL, USBCSOH are cleared.
• All interrupts, except SOF and suspend,
are enabled
• An interrupt request is generated (if
IEN2.USBIE=1
and
USBCIE.RSTIE=1)
Firmware should close all pipes and wait for a
new enumeration phase when USB reset is
detected.
12.16.9 Suspend and Resume
The
USB
controller
will
assert
USBCIF.SUSPENDIF and enter suspend
mode when the USB bus has been
continuously idle for 3 ms, provided that
USBPOW.SUSPEND_EN=1. IRCON2.USBIF will
be asserted if USBCIE.SUSPENDIE
is
enabled, and an interrupt request is generated
if IEN2.USBIE=1.
While in suspend mode, only limited current
can be sourced from the USB bus. See the
USB 2.0 Specification [5] for details about this.
To be able to meet the suspend-current
requirement, the CC2511Fx should be taken
down to PM1 when suspend is detected. The
CC2511Fx should not enter PM2 or PM3 since
this will reset the USB controller.
Any valid non-idle signaling on the USB bus
will cause the USBCIF.RESUMEIF to be
asserted and an interrupt request to be
generated and wake up the system if the USB
resume interrupt is configured correctly. Refer
to 12.16.3.1 for details about how to set up the
USB resume interrupt.
Any valid non-idle signaling on the USB bus
will cause the USBCIF.RESUMEIF to be
asserted and an interrupt request to be
generated and wake up the system if the USB
resume interrupt is configured correctly. Refer
to 12.16.3.1 for details about how to set up the
USB resume interrupt.
When the system wakes up (enters active
mode) from suspend, no USB registers must
be accessed before the 48 MHZ crystal
oscillator has stabilized.
A USB reset will also wake up the system from
suspend. A USB resume interrupt request will
be generated, if the interrupt is configured as
described
in
12.16.3.1,
but
the
USBCIF.RSTIF interrupt flag will be set
instead of the USBCIF.RESUMEIF interrupt
flag.
12.16.10 Remote Wakeup
The USB controller can resume from suspend
by signaling resume to the USB hub. Resume
is performed by setting USBPOW.RESUME to 1
for approximately 10 ms. According to the USB
2.0 Specification [5], the resume signaling
must be present for at least 1 ms and no more
than 15 ms. It is, however, recommended to
keep the resume signaling for approximately
10 ms. Notice that support for remote wakeup
must be declared in the USB descriptor, and
that the USB host must grant the device the
privilege to perform remote wakeup (through a
SET_FEATURE request).
12.16.11 USB Registers
This section describes all USB registers used
for control and status for the USB. The USB
registers reside in XDATA memory space in
the region 0xDE00 - 0xDE3F. These registers
can be divided into three groups: The Common
USB Registers, the Indexed Endpoint
Registers, and the Endpoint FIFO Registers.
Table 34, Table 35, and Table 36 give an
overview of the registers in the three groups
respectively, while the remaining of this section
will describe each register in detail. The
Indexed Endpoint Registers represent the
currently selected endpoint. The USBINDEX
register is used to select the endpoint.
Notice that the upper register addresses
0xDE2C – 0xDE3F are reserved.
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0xDE00: USBADDR - Function Address
Bit
Field Name
Reset
R/W
Description
7
UPDATE
0
R
This bit is set when the USBADDR register is written and cleared when the
address becomes effective.
6:0
USBADDR[6:0]
0000000
R/W
Device address
0xDE01: USBPOW - Power/Control Register
Bit
Field Name
Reset
R/W
Description
7
ISO_WAIT_SOF
0
R/W
When this bit is set to 1, the USB controller will send zero length data packets
from the time INPKT_RDY is asserted and until the first SOF token has been
received. This only applies to isochronous endpoints.
-
R0
Not used
6:4
3
RST
0
R
During reset signaling, this bit is set to1
2
RESUME
0
R/W
Drives resume signaling for remote wakeup. According to the USB
Specification the duration of driving resume must be at least 1 ms and no more
than 15 ms. It is recommended to keep this bit set for approximately 10 ms.
1
SUSPEND
0
R
Suspend mode entered. This bit will only be used when SUSPEND_EN=1.
Reading the USBCIF register or asserting RESUME will clear this bit.
0
SUSPEND_EN
0
R/W
Suspend Enable. When this bit is set to 1, suspend mode will be entered when
USB bus has been idle for 3 ms.
0xDE02: USBIIF - IN Endpoints and EP0 Interrupt Flags
Bit
Field Name
7:6
Reset
R/W
Description
-
R0
Not used
5
INEP5IF
0
R
H0
Interrupt flag for IN endpoint 5. Cleared by HW when read
4
INEP4IF
0
R
H0
Interrupt flag for IN endpoint 4. Cleared by HW when read
3
INEP3IF
0
R
H0
Interrupt flag for IN endpoint 3. Cleared by HW when read
2
INEP2IF
0
R
H0
Interrupt flag for IN endpoint 2. Cleared by HW when read
1
INEP1IF
0
R
H0
Interrupt flag for IN endpoint 1. Cleared by HW when read
0
EP0IF
0
R
H0
Interrupt flag for endpoint 0. Cleared by HW when read
0xDE04: USBOIF - Out Endpoints Interrupt Flags
Bit
Field Name
7:6
Reset
R/W
Description
-
R0
Not used
5
OUTEP5IF
0
R
H0
Interrupt flag for OUT endpoint 5. Cleared by HW when read
4
OUTEP4IF
0
R
H0
Interrupt flag for OUT endpoint 4. Cleared by HW when read
3
OUTEP3IF
0
R
H0
Interrupt flag for OUT endpoint 3. Cleared by HW when read
2
OUTEP2IF
0
R
H0
Interrupt flag for OUT endpoint 2. Cleared by HW when read
1
OUTEP1IF
0
R
H0
Interrupt flag for OUT endpoint 1. Cleared by HW when read
-
R0
Not used
0
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0xDE06: USBCIF - Common USB Interrupt Flags
Bit
Field Name
7:4
Reset
R/W
Description
-
R0
Not used
3
SOFIF
0
R
H0
Start-Of-Frame interrupt flag. Cleared by HW when read
2
RSTIF
0
R
H0
Reset interrupt flag. Cleared by HW when read
1
RESUMEIF
0
R
H0
Resume interrupt flag. Cleared by HW when read
0
SUSPENDIF
0
R
H0
Suspend interrupt flag. Cleared by HW when read
0xDE07: USBIIE - IN Endpoints and EP0 Interrupt Enable Mask
Bit
Field Name
7:6
5
4
3
2
1
0
INEP5IE
INEP4IE
INEP3IE
INEP2IE
INEP1IE
EP0IE
Reset
R/W
Description
00
R/W
Reserved. Always write 00
1
R/W
IN endpoint 5 interrupt enable
1
1
1
1
1
R/W
R/W
R/W
R/W
R/W
0
Interrupt disabled
1
Interrupt enabled
IN endpoint 4 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
IN endpoint 3 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
IN endpoint 2 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
IN endpoint 1 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Endpoint 0 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
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CC2510Fx / CC2511Fx
0xDE09: USBOIE - Out Endpoints Interrupt Enable Mask
Bit
Field Name
7:6
5
4
3
2
1
OUTEP5IE
OUTEP4IE
OUTEP3IE
OUTEP2IE
OUTEP1IE
0
Reset
R/W
Description
00
R/W
Reserved. Always write 00
1
R/W
OUT endpoint 5 interrupt enable
1
1
1
1
-
R/W
R/W
R/W
R/W
R0
0
Interrupt disabled
1
Interrupt enabled
OUT endpoint 4 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
OUT endpoint 3 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
OUT endpoint 2 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
OUT endpoint 1 interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Not used
0xDE0B: USBCIE - Common USB Interrupt Enable Mask
Bit
Field Name
7:4
3
2
1
0
SOFIE
RSTIE
RESUMEIE
SUSPENDIE
Reset
R/W
Description
-
R0
Not used
0
R/W
Start-Of-Frame interrupt enable
1
1
0
R/W
R/W
R/W
0
Interrupt disabled
1
Interrupt enabled
Reset interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Resume interrupt enable
0
Interrupt disabled
1
Interrupt enabled
Suspend interrupt enable
0
Interrupt disabled
1
Interrupt enabled
0xDE0C: USBFRML - Current Frame Number (Low byte)
Bit
Field Name
Reset
R/W
Description
7:0
FRAME[7:0]
0x00
R
Low byte of 11-bit frame number
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0xDE0D: USBFRMH - Current Frame Number (High byte)
Bit
Field Name
7:3
2:0
FRAME[10:8]
Reset
R/W
Description
-
R0
Not used
000
R
3 MSB of 11-bit frame number
0xDE0E: USBINDEX - Current Endpoint Index Register
Bit
Field Name
7:4
3:0
USBINDEX[3:0]
Reset
R/W
Description
-
R0
Not used
0000
R/W
Endpoint selected. Must be set to value in the range 0 – 5
0xDE10: USBMAXI - Max. Packet Size for IN Endpoint{1 - 5}
Bit
Field Name
Reset
R/W
Description
7:0
USBMAXI[7:0]
0x00
R/W
Maximum packet size in units of 8 bytes for IN endpoint selected by
USBINDEX register. The value of this register should correspond to the
wMaxPacketSize field in the Standard Endpoint Descriptor for the endpoint.
This register must not be set to a value grater than the available FIFO
memory for the endpoint.
0xDE11: USBCS0 - EP0 Control and Status (USBINDEX=0)
Bit
Field Name
Reset
R/W
Description
7
CLR_SETUP_END
0
R/W
H0
Set this bit to 1 to de-assert the SETUP_END bit of this register. This bit will be
cleared automatically.
6
CLR_OUTPKT_RDY
0
R/W
H0
Set this bit to 1 to de-assert the OUTPKT_RDY bit of this register. This bit will
be cleared automatically.
5
SEND_STALL
0
R/W
H0
Set this bit to 1 to terminate the current transaction. The USB controller will
send the STALL handshake and this bit will be de-asserted.
4
SETUP_END
0
R
This bit is set if the control transfer ends due to a premature end of control
transfer. The FIFO will be flushed and an interrupt request (EP0) will be
generated if the interrupt is enabled. Setting CLR_SETUP_END=1 will deassert this bit
3
DATA_END
0
R/W
H0
This bit is used to signal the end of a data transfer and must be asserted in
the following three situations:
1
When the last data packet has been loaded and USBCS0.INPKT_RDY is
set to 1
2
When the last data packet has been unloaded and
USBCS0.CLR_OUTPKT_RDY is set to 1
3
When USBCS0.INPKT_RDY has been asserted without having loaded
the FIFO (for sending a zero length data packet).
The USB controller will clear this bit automatically
2
SENT_STALL
0
R/W
H1
This bit is set when a STALL handshake has been sent. An interrupt request
(EP0) will be generated if the interrupt is enabled This bit must be cleared
from firmware.
1
INPKT_RDY
0
R/W
H0
Set this bit when a data packet has been loaded into the EP0 FIFO to notify
the USB controller that a new data packet is ready to be transferred. When
the data packet has been sent, this bit is cleared and an interrupt request
(EP0) will be generated if the interrupt is enabled.
0
OUTPKT_RDY
0
R
Data packet received. This bit is set when an incoming data packet has been
placed in the OUT FIFO. An interrupt request (EP0) will be generated if the
interrupt is enabled. Set CLR_OUTPKT_RDY=1 to de-assert this bit.
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0xDE11: USBCSIL - IN EP{1 - 5} Control and Status Low
Bit
Field Name
7
Reset
R/W
Description
-
R0
Not used
6
CLR_DATA_TOG
0
R/W
H0
Setting this bit will reset the data toggle to 0. Thus, setting this bit will force
the next data packet to be a DATA0 packet. This bit is automatically
cleared.
5
SENT_STALL
0
R/W
This bit is set when a STALL handshake has been sent. The FIFO will be
flushed and the INPKT_RDY bit in this register will be de-asserted. An
interrupt request (IN EP{1 - 5}) will be generated if the interrupt is enabled.
This bit must be cleared from firmware.
4
SEND_STALL
0
R/W
Set this bit to 1 to make the USB controller reply with a STALL handshake
when receiving IN tokens. Firmware must clear this bit to end the STALL
condition. It is not possible to stall an isochronous endpoint, thus this bit will
only have effect if the IN endpoint is configured as bulk/interrupt.
3
FLUSH_PACKET
0
R/W
H0
Set to 1 to flush next packet that is ready to transfer from the IIN FIFO. The
INPKT_RDY bit in this register will be cleared. If there are two packets in
the IN FIFO due to double buffering, this bit must be set twice to completely
flush the IN FIFO. This bit is automatically cleared.
2
UNDERRUN
0
R/W
In isochronous mode, this bit is set if an IN token is received when
INPKT_RDY=0, and a zero length data packet is transmitted in response to
the IN token. In Bulk/Interrupt mode, this bit is set when a NAK is returned
in response to an IN token. Firmware should clear this bit.
1
PKT_PRESENT
0
R
This bit is 1 when there is at least one packet in the IN FIFO.
0
INPKT_RDY
0
R/W
H0
Set this bit when a data packet has been loaded into the IN FIFO to notify
the USB controller that a new data packet is ready to be transferred. When
the data packet has been sent, this bit is cleared and an interrupt request
(IN EP{1 - 5}) will be generated if the interrupt is enabled.
0xDE12: USBCSIH - IN EP{1 - 5} Control and Status High
Bit
Field Name
Reset
R/W
Description
7
AUTOSET
0
R/W
When this bit is 1, the USBCSIL.INPKT_RDY bit is automatically asserted
when a data packet of maximum size (specified by USBMAXI) has been
loaded into the IN FIFO.
6
ISO
0
R/W
Selects IN endpoint type
5:4
3
FORCE_DATA_TOG
2:1
0
IN_DBL_BUF
0
Bulk/Interrupt
1
Isochronous
10
R/W
Reserved. Always write 10
0
R/W
Setting this bit will force the IN endpoint data toggle to switch and the data
packet to be flushed from the IN FIFO even though an ACK was received.
This feature can be useful when reporting rate feedback for isochronous
endpoints.
-
R0
Not used
0
R/W
Double buffering enable (IN FIFO)
0
Double buffering disabled
1
Double buffering enabled
0xDE13: USBMAXO - Max. Packet Size for OUT{1 - 5} Endpoint
Bit
Field Name
Reset
R/W
Description
7:0
USBMAXO[7:0]
0x00
R/W
Maximum packet size in units of 8 bytes for OUT endpoint selected by
USBINDEX register. The value of this register should correspond to the
wMaxPacketSize field in the Standard Endpoint Descriptor for the endpoint.
This register must not be set to a value grater than the available FIFO
memory for the endpoint.
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CC2510Fx / CC2511Fx
0xDE14: USBCSOL - OUT EP{1 - 5} Control and Status Low
Bit
Field Name
Reset
R/W
Description
7
CLR_DATA_TOG
0
R/W
H0
Setting this bit will reset the data toggle to 0. Thus, setting this bit will force
the next data packet to be a DATA0 packet. This bit is automatically
cleared.
6
SENT_STALL
0
R/W
This bit is set when a STALL handshake has been sent. An interrupt
request (OUT EP{1 - 5}) will be generated if the interrupt is enabled. This
bit must be cleared from firmware
5
SEND_STALL
0
R/W
Set this bit to 1 to make the USB controller reply with a STALL handshake
when receiving OUT tokens. Firmware must clear this bit to end the STALL
condition. It is not possible to stall an isochronous endpoint, thus this bit will
only have effect if the IN endpoint is configured as bulk/interrupt.
4
FLUSH_PACKET
0
R/W
H0
Set to 1 to flush next packet that is to be read from the OUT FIFO. The
OUTPKT_RDY bit in this register will be cleared. If there are two packets in
the OUT FIFO due to double buffering, this bit must be set twice to
completely flush the OUT FIFO. This bit is automatically cleared.
3
DATA_ERROR
0
R
This bit is set if there is a CRC or bit-stuff error in the packet received.
Cleared when OUTPKT_RDY is cleared. This bit will only be valid if the
OUT endpoint is isochronous.
2
OVERRUN
0
R/W
This bit is set when an OUT packet cannot be loaded into the OUT FIFO.
Firmware should clear this bit. This bit is only valid in isochronous mode
1
FIFO_FULL
0
R
This bit is asserted when no more packets can be loaded into the OUT
FIFO full.
0
OUTPKT_RDY
0
R/W
This bit is set when a packet has been received and is ready to be read
from OUT FIFO. An interrupt request (OUT EP{1 - 5}) will be generated if
the interrupt is enabled. This bit should be cleared when the packet has
been unloaded from the FIFO.
0xDE15: USBCSOH - OUT EP{1 - 5} Control and Status High
Bit
Field Name
Reset
R/W
Description
7
AUTOCLEAR
0
R/W
When this bit is set to 1, the USBCSOL.OUTPKT_RDY bit is automatically
cleared when a data packet of maximum size (specified by USBMAXO) has
been unloaded to the OUT FIFO.
6
ISO
0
R/W
Selects OUT endpoint type
0 Bulk/Interrupt
1 Isochronous
5:4
00
R/W
Reserved. Always write 00
3:1
-
R0
Not used
0
R/W
Double buffering enable (OUT FIFO)
0
OUT_DBL_BUF
0 Double buffering disabled
1 Double buffering enabled
0xDE16: USBCNT0 - Number of Received Bytes in EP0 FIFO (USBINDEX=0)
Bit
Field Name
7:6
5:0
USBCNT0[5:0]
Reset
R/W
Description
-
R0
Not used
000000
R
Number of received bytes into EP 0 FIFO. Only valid when OUTPKT_RDY
is asserted
0xDE16: USBCNTL - Number of Bytes in EP{1 – 5} OUT FIFO Low
Bit
Field Name
Reset
R/W
Description
7:0
USBCNT[7:0]
0x00
R
8 LSB of number of received bytes into OUT FIFO selected by USBINDEX
register. Only valid when USBCSOL.OUTPKT_RDY is asserted.
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CC2510Fx / CC2511Fx
0xDE17: USBCNTH - Number of Bytes in EP{1 – 5} OUT FIFO High
Bit
Field Name
7:3
2:0
USBCNT[10:8]
Reset
R/W
Description
-
R0
Not used
000
R
3 MSB of number of received bytes into OUT FIFO selected by USBINDEX
register. Only valid when USBCSOL.OUTPKT_RDY is set
0xDE20: USBF0 - Endpoint 0 FIFO
Bit
Field Name
Reset
R/W
Description
7:0
USBF0[7:0]
0x00
R/W
Endpoint 0 FIFO. Reading this register unloads one byte from the EP0 FIFO.
Writing to this register loads one byte into the EP0 FIFO.
Note: The FIFO memory for EP0 is used for both incoming and outgoing data
packets.
0xDE22: USBF1 - Endpoint 1 FIFO
Bit
Field Name
Reset
R/W
Description
7:0
USBF1[7:0]
0x00
R/W
Endpoint 1 FIFO register. Reading this register unloads one byte from the EP1
OUT FIFO. Writing to this register loads one byte into the EP1 IN FIFO.
0xDE24: USBF2 - Endpoint 2 FIFO
Bit
Field Name
Reset
R/W
Description
7:0
USBF2[7:0]
0x00
R/W
See Endpoint 1 FIFO description.
0xDE26: USBF3 - Endpoint 3 FIFO
Bit
Field Name
Reset
R/W
Description
7:0
USBF3[7:0]
0x00
R/W
See Endpoint 1 FIFO description.
0xDE28: USBF4 - Endpoint 4 FIFO
Bit
Field Name
Reset
R/W
Description
7:0
USBF4[7:0]
0x00
R/W
See Endpoint 1 FIFO description.
0xDE2A: USBF5 - Endpoint 5 FIFO
Bit
Field Name
Reset
R/W
Description
7:0
USBF5[7:0]
0x00
R/W
See Endpoint 1 FIFO description.
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CC2510Fx / CC2511Fx
13
Radio
RF_P
FREQ
SYNTH
0
RF_N
MODULATOR
90
PA
CPU INTERFACE
ADC
PACKET HANDLER
LNA
FEC / INTERLEAVER
ADC
DEMODULATOR
RADIO CONTROL
Figure 47: CC2510Fx/CC2511Fx Radio Module
A simplified block diagram of the radio module
in the CC2510Fx/CC2511Fx is shown in Figure 47.
CC2510Fx/CC2511Fx features a low-IF receiver.
The received RF signal is amplified by the lownoise amplifier (LNA) and down-converted in
quadrature (I and Q) to the intermediate
frequency (IF). At IF, the I/Q signals are
digitized by the ADCs. Automatic gain control
(AGC), fine channel filtering, demodulation
bit/packet synchronization are performed
digitally.
The transmitter part of CC2510Fx/CC2511Fx is
based on direct synthesis of the RF frequency.
The frequency synthesizer includes a
completely on-chip LC VCO and a 90 degrees
phase shifter for generating the I and Q LO
signals to the down-conversion mixers in
receive mode.
The high speed crystal oscillator generates the
reference frequency for the synthesizer, as
well as clocks for the ADC and the digital part.
An SFR interface is used for data buffer
access from the CPU. Configuration and status
registers are accessed through registers
mapped to XDATA memory.
The digital baseband includes support for
channel configuration, packet handling, and
data buffering.
Note: In this section of the document, fRef is used to denote
the reference frequency for the synthesizer.
For CC2510Fx f ref = f XOSC and for CC2511Fx, f ref =
f XOSC
2
13.1 Command Strobes
The CPU uses a set of command strobes to
control operation of the radio.
Command strobes may be viewed as single
byte instructions which each start an internal
sequence in the radio. These command
strobes are used to enable the frequency
synthesizer, enable receive mode, enable
transmit mode, etc. (see Figure 48).
Note: An SIDLE strobe will clear all pending
command strobes until IDLE state is
reached. This means that if for example an
SIDLE strobe is issued while the radio is in
RX state, any other command strobes
issued before the radio reached IDLE state
will be ignored.
The 6 command strobes are listed in Table 61
on Page 185.
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CC2510Fx / CC2511Fx
SIDLE
Default state when the radio is not
receiving or transmitting..
Idle
SCAL
Used for calibrating frequency
synthesizer upfront (entering
Manual freq.
receive or transmit mode can
synth. calibration
then be done quicker).
Transitional state.
SRX or STX or SFSTXON
SFSTXON
Frequency synthesizer is on,
ready to start transmitting.
Transmission starts very
quickly after receiving the
STX command strobe.
Frequency
synthesizer startup,
optional calibration,
settling
Frequency synthesizer is turned on, can optionally be
calibrated, and then settles to the correct frequency.
Transitional state.
Frequency
synthesizer on
STX
SRX
STX
TXOFF_MODE=01
SFSTXON or RXOFF_MODE=01
STX or RXOFF_MODE=10
Transmit mode
Receive mode
SRX or TXOFF_MODE=11
TXOFF_MODE=00
RXOFF_MODE=00
Optional transitional state.
Transmission is
turned off and this
state is entered if
the RFD register
becomes empty in
the middle of a
packet.
TX Overflow
RX Overflow
Optional freq.
synth. calibration
SIDLE
Reception is turned
off and this state is
entered if the RFD
register overflows.
SIDLE
Idle
Figure 48: Simplified State Diagram
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CC2510Fx / CC2511Fx
RFST
Value
Command
Strobe
Name
Description
0x00
SFSTXON
Enable and calibrate frequency synthesizer (if MCSM0.FS_AUTOCAL=01). If in RX (with
CCA):
Go to a wait state where only the synthesizer is running (for quick RX / TX turnaround).
0x01
SCAL
Calibrate frequency synthesizer and turn it off. SCAL can be strobed from IDLE mode
without setting manual calibration mode (MCSM0.FS_AUTOCAL=00)
0x02
SRX
Enable RX. Perform calibration first if coming from IDLE and MCSM0.FS_AUTOCAL=01.
0x03
STX
In IDLE state: Enable TX. Perform calibration first if MCSM0.FS_AUTOCAL=01.
If in RX state and CCA is enabled: Only go to TX if channel is clear.
0x04
SIDLE
Enter IDLE state (frequency synthesizer turned off).
All
others
SNOP
No operation.
Table 61: Command Strobes
13.2 Radio Registers
The operation of the radio is configured
through a set of RF registers. These RF
registers are mapped to XDATA memory
space as shown in Figure 14 on Page 40 .
In addition to configuration registers, the RF
registers also provide status information from
the radio.
Section 10.2.3.4 on Page 47 gives a full
description of all RF registers.
13.3 Interrupts
There are two interrupt vector assigned to the
radio. These are the RFTXRX interrupt
(interrupt #0) and the RF interrupt (interrupt
#16):
• RFTXRX: RX data ready or TX data
complete (related to the RFD register)
issued, meaning that one can not write to the
RFD register before issuing an STX strobe.
For an interrupt request to be generated when
TCON.RFTXRXIF
is
asserted,
IEN0.RFTXRXIE must be 1.
Note: When append status is enabled,
PKTCTRL1.APPEND_STATUS=1, reading
status byte 1 (see Section 13.8) from the
RFD register will trigger the assertion of the
RFTXRXIF flag for status byte 2. If this flag
is cleared AFTER reading status byte 1,
the new flag will be cleared as well. One
RFTXRXIF assertion will therefore be
missed by software. After assertion of the
RFTXRXIF flag one should therefore clear
the flag BEFORE reading the RFD register.
• RF: All other general RF interrupts
The RF interrupt vector combines the
interrupts shown in the RFIM register shown
on Page 187. Note that these RF interrupts are
rising-edge triggered meaning that an interrupt
is generated when e.g. the SFD status flag
goes from 0 to 1.
The RF interrupt flags are described in the
next section.
13.3.1
13.3.1.1
Interrupt Registers
13.3.1.2
RFTXRX
The RFTXRX interrupt is related to the RFD
register. The CPU interrupt flag RFTXRXIF
found in the TCON register is asserted when
there are data in the RFD register ready to be
read (RX), and when a new byte can be written
(TX). In TX, the RFTXRXIF flag will not be
asserted before an STX strobe has been
RF
There are 8 different events that can generate
an RF interrupt request. These events are:
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• RX overflow
• RX timeout
Page 185 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
• Packet received/transmitted. Also used
to detect overflow/underflow conditions
• CS
• PQT reached
• CCA
• SFD
asserted when the event occurs. If the
corresponding mask bit is set in the RFIM
register, the CPU interrupt flag S1CON.RFIF
will also be asserted in addition to the interrupt
flag in RFIF. If IEN2.RFIE=1 when
S1CON.RFIF is asserted, and interrupt
request will be generated.
Refer to 1.1 for details about the interrupts.
Each of these events has a corresponding
interrupt flag in the RFIF register which is
RFIF (0xE9) - RF Interrupt Flags
Bit
Field Name
Reset
R/W
Description
7
IRQ_TXUNF
0
R/W0
TX underflow
6
5
4
3
2
1
0
IRQ_RXOVF
IRQ_TIMEOUT
IRQ_DONE
IRQ_CS
IRQ_PQT
IRQ_CCA
IRQ_SFD
0
0
0
0
0
0
0
R/W0
R/W0
R/W0
R/W0
R/W0
R/W0
R/W0
0
No interrupt pending
1
Interrupt pending
RX overflow
0
No interrupt pending
1
Interrupt pending
RX timeout, no packet has been received in the programmed period
0
No interrupt pending
1
Interrupt pending
Packet received/transmitted. Also used to detect underflow/overflow
conditions
0
No interrupt pending
1
Interrupt pending
Carrier sense
0
No interrupt pending
1
Interrupt pending
Preamble quality threshold reached
0
No interrupt pending
1
Interrupt pending
Clear Channel Assessment
0
No interrupt pending
1
Interrupt pending
Start of Frame Delimiter, sync word detected
0
No interrupt pending
1
Interrupt pending
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CC2510Fx / CC2511Fx
RFIM (0x91) - RF Interrupt Mask
Bit
Field aName
Reset
R/W
Description
7
IM_TXUNF
0
R/W
TX underflow
6
5
4
3
2
1
0
IM_RXOVF
IM_TIMEOUT
IM_DONE
IM_CS
IM_PQT
IM_CCA
IM_SFD
0
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
Interrupt disabled
1
Interrupt enabled
RX overflow
0
Interrupt disabled
1
Interrupt enabled
RX timeout, no packet has been received in the programmed period.
0
Interrupt disabled
1
Interrupt enabled
Packet received/transmitted. Also used to detect underflow/overflow conditions
0
Interrupt disabled
1
Interrupt enabled
Carrier sense
0
Interrupt disabled
1
Interrupt enabled
Preamble quality threshold reached.
0
Interrupt disabled
1
Interrupt enabled
Clear Channel Assessment
0
Interrupt disabled
1
Interrupt enabled
Start of Frame Delimiter, sync word detected
0
Interrupt disabled
1
Interrupt enabled
13.4 TX/RX Data Transfer
Data to transmit is written to the RF Data
register, RFD. Received data is read from the
same register. The RFD register can be viewed
as a 1 byte FIFO. That means that if a byte is
received in the RFD register, and it is not read
before the next byte is received, the radio will
enter RX_OVERFLOW state and the
RFIF.IRQ_RXOVF flag will be set together
with RFIF.IRQ_DONE. In TX, the radio will
enter
TX_UNDERFLOW
state
(RFIF.IRQ_TXUVF and RFIF.IRQ_DONE will
be asserted) if too few bytes are written to the
RFD register compared to what the radio
expect. Note that if an STX strobe is issued but
no data is written to the RFD register after the
following assertion of the RFTXRXIF flag, the
radio will start sending preamble without
entering TX_UNDERFLOW state.
To
exit
RX_OVERFLOW
and/or
TX_UNDERFLOW state, an SIDLE strobe
command should be issued.
Note: The RFD register content will not be
retained in PM2 and PM3
RX and TX FIFOs can be implemented in
memory and it is recommended to use the
DMA to transfer data between the FIFOs and
the RF Data register, RFD. The DMA channel
used to transfer received data to memory
when the radio is in RX mode would have RFD
as the source (SRCADDR[15:0]), the RX
FIFO
in
memory
as
destination
(DRSTADDR[15:0]), and RADIO as DMA
trigger (TRIG[4:0]). For description on the
usage of DMA, refer to Section 12.5 on Page
98.
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
A simple example of transmitting data is shown
in Figure 49. This example does not use DMA.
; Transmit the following data: 0x02, 0x12, 0x34
; (Assume that the radio has already been configured, the high speed
; crystal oscillator is selected as system clock, and CLKCON.CLKSPD=000)
C1:
C2:
C3:
MOV
JNB
CLR
MOV
JNB
CLR
MOV
JNB
CLR
MOV
RFST,#03H
RFTXRXIF,C1
RFTXRXIF
RFD,#02H
RFTXRXIF,C2
RFTXRXIF
RFD,#12H
RFTXRXIF,C3
RFTXRXIF
RFD,#34H
;
;
;
;
;
;
;
;
;
;
;
Start TX with STX command strobe
Wait for interrupt flag telling radio is
ready to accept data, then write first
data byte to radio (packet length = 2)
Wait for radio
Send first byte in payload
Wait for radio
Send second byte in payload
Done
Figure 49: Simple RF Transmit Example
13.5 Data Rate Programming
R
⋅ 2 20
DRATE _ E = log 2 DATA
f ref
28
RDATA ⋅ 2
DRATE _ M =
− 256
f ref ⋅ 2 DRATE _ E
The data rate used when transmitting, or the
data rate expected in receive is programmed
by
the
MDMCFG3.DRATE_M
and
the
MDMCFG4.DRATE_E configuration registers.
The data rate is given by the formula below.
RDATA
(256 + DRATE _ M ) ⋅ 2 DRATE _ E ⋅ f
=
2 28
If DRATE_M is rounded to the nearest integer
and becomes 256, increment DRATE_E and
use DRATE_M=0.
ref
The following approach can be used to find
suitable values for a given data rate:
Note that the maximum data rate will be limited
by the system clock speed. Please see
12.1.5.2 for more details.
13.6 Receiver Channel Filter Bandwidth
In order to meet different channel width
requirements, the receiver channel filter is
programmable. The MDMCFG4.CHANBW_E and
MDMCFG4.CHANBW_M configuration registers
control the receiver channel filter bandwidth.
The following formula gives the relation
between the register settings and the channel
filter bandwidth:
BWchannel =
f ref
8 ⋅ (4 + CHANBW _ M )·2CHANBW _ E
For best performance, the channel filter
bandwidth should be selected so that the
signal bandwidth occupies at most 80% of the
channel filter bandwidth. The channel centre
tolerance due to crystal accuracy should also
be subtracted from the signal bandwidth. The
following example illustrates this:
With the channel filter bandwidth set to 600
kHz, the signal should stay within 80% of 600
kHz, which is 480 kHz. Assuming 2.44 GHz
frequency and ±20 ppm frequency uncertainty
for both the transmitting device and the
receiving
device,
the
total
frequency
uncertainty is ±40 ppm of 2.44 GHz, which is
±98 kHz. If the whole transmitted signal
bandwidth is to be received within 480 kHz, the
transmitted signal bandwidth should be
maximum 480 kHz - 2·98 kHz, which is 284
kHz.
The CC2510Fx/CC2511Fx supports channel filter
bandwidths shown in Table 62 and Table 63
respectively.
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CC2510Fx / CC2511Fx
MDMCFG4.
MDMCFG4.CHANBW_E
MDMCFG4.
MDMCFG4.CHANBW_E
CHANBW_M
00
01
10
11
CHANBW_M
00
01
10
11
00
812
406
203
102
00
750
375
188
94
01
650
325
162
81
01
600
300
150
75
10
541
270
135
68
10
500
250
125
63
11
464
232
116
58
11
429
214
107
54
Table 62: Channel Filter Bandwidths [kHz]
(assuming fref = 26 MHz)
Table 63: Channel Filter Bandwidths [kHz]
(assuming fref = 24 MHz)
13.7 Demodulator, Symbol Synchronizer, and Data Decision
CC2510Fx/CC2511Fx contains an advanced and
highly configurable demodulator. Channel
filtering and frequency offset compensation is
performed digitally. To generate the RSSI level
(see Section 13.10.3 for more information) the
signal level in the channel is estimated. Data
filtering is also included for enhanced
performance.
13.7.2 Bit Synchronization
The bit synchronization algorithm extracts the
clock from the incoming symbols. The
algorithm requires that the expected data rate
is programmed as described in Section 1.1 on
Page 188. Re-synchronization is performed
continuously to adjust for error in the incoming
symbol rate.
13.7.1
13.7.3
Frequency Offset Compensation
When using 2-FSK, GFSK, or MSK
modulation, the demodulator will compensate
for the offset between the transmitter and
receiver frequency, within certain limits, by
estimating the centre of the received data.
This value is available in the FREQEST status
register. Writing the value from FREQEST into
FSCTRL0.FREQOFF
the
frequency
synthesizer
is
automatically
adjusted
according to the estimated frequency offset.
The tracking range of the algorithm is
selectable as fractions of the channel
bandwidth with the FOCCFG.FOC_LIMIT
configuration register.
If the FOCCFG.FOC_BS_CS_GATE bit is set,
the offset compensator will freeze until carrier
sense asserts. This may be useful when the
radio is in RX for long periods with no traffic,
since the algorithm may drift to the boundaries
when trying to track noise.
The tracking loop has two gain factors, which
affects the settling time and noise sensitivity of
the algorithm. FOCCFG.FOC_PRE_K sets the
gain before the sync word is detected, and
FOCCFG.FOC_POST_K selects the gain after
the sync word has been found.
Byte Synchronization
Byte synchronization is achieved by a
continuous sync word search. The sync word
is a 16 bit configurable field (can be repeated
to get a 32 bit) that is automatically inserted at
the start of the packet by the modulator in
transmit mode. The demodulator uses this
field to find the byte boundaries in the stream
of bits. The sync word will also function as a
system identifier since only packets with the
correct predefined sync word will be received if
the sync word detection in RX is enabled in
register MDMCFG2 (see Section 13.10.1). The
sync word detector correlates against the
user-configured 16 or 32 bit sync word. The
correlation threshold can be set to 15/16,
16/16, or 30/32 bits match. The sync word can
be further qualified using the preamble quality
indicator mechanism described below and/or a
carrier sense condition. The sync word is
configured through the SYNC1 and SYNC0
registers and is sent MSB first.
In order to make false detections of sync
words less likely, a mechanism called
preamble quality indication (PQI) can be used
to qualify the sync word. A threshold value for
the preamble quality must be exceeded in
order for a detected sync word to be accepted.
See Section 13.10.2 on Page 194 for more
details.
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CC2510Fx / CC2511Fx
13.8 Packet Handling Hardware Support
The CC2510Fx/CC2511Fx has built-in hardware
support for packet oriented radio protocols.
• Whitening of the data with a PN9
sequence.
In transmit mode, the packet handler can be
configured to add the following elements to the
packet:
• Forward error correction by the use of
interleaving and coding of the data
(convolutional coding).
• A programmable number of preamble
bytes
In receive mode, the packet handling support
will de-construct the data packet by
implementing the following (if enabled):
• A two byte synchronization (sync) word.
Can be duplicated to give a 4-byte sync
word (recommended). It is not possible
to only insert preamble or only insert a
sync word.
• Preamble detection
• Sync word detection
• CRC computation and CRC check
• A CRC checksum computed over the
data field
• One byte address check
• Packet length check (length byte
checked against a programmable
maximum length)
The recommended setting is 4-byte preamble
and 4-byte sync word, except for 500 kBaud
data rate where the recommended preamble
length is 8 bytes.
In addition, the following can be implemented
on the data field and the optional 2-byte CRC
checksum:
• De-whitening
• De-interleaving and decoding
Optionally, two status bytes (see Table 64 and
Table 65) with RSSI value, Link Quality
Indication, and CRC status can be appended
to the received packet.
Bit
Field Name
Description
7:0
RSSI
RSSI value
Table 64: Received Packet Status Byte 1
(first byte appended after the data)
Bit
Field name
Description
7
CRC_OK
1: CRC for received data OK (or
CRC disabled)
0: CRC error in received data
6:0
LQI
The
Link
Quality
Indicator
estimates how easily a received
signal can be demodulated
Table 65: Received Packet Status Byte 2
(second byte appended after the data)
Note that register fields that control the packet
handling features should only be altered when
CC2510Fx/CC2511Fx is in the IDLE state.
13.8.1
Data Whitening
From a radio perspective, the ideal over the air
data are random and DC free. This results in
the smoothest power distribution over the
occupied bandwidth. This also gives the
regulation loops in the receiver uniform
operation conditions (no data dependencies).
Real world data often contain long sequences
of zeros and ones. Performance can then be
improved by whitening the data before
transmitting, and de-whitening the data in the
receiver. With CC2510Fx/CC2511Fx, this can be
done
automatically
by
setting
PKTCTRL0.WHITE_DATA=1. All data, except
the preamble and the sync word, are then
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CC2510Fx / CC2511Fx
XOR-ed with a 9-bit pseudo-random (PN9)
sequence before being transmitted as shown
in Figure 50. At the receiver end, the data are
XOR-ed with the same pseudo-random
sequence. This way, the whitening is reversed,
8
TX_DATA
and the original data appear in the receiver.
The PN9 sequence is reset to all 1’s.
Data whitening can only be used when
PKTCTRL0.CC2400_EN=0 (default).
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
The first TX_DATA byte is shifted in before doing the XOR-operation providing the first TX_OUT[7:0] byte. The
second TX_DATA byte is then shifted in before doing the XOR-operation providing the second TX_OUT[7:0] byte.
TX_OUT[7:0]
Figure 50: Data Whitening in TX Mode
13.8.2
Packet Format
The format of the data packet can be
configured and consists of the following items:
• Length byte or constant programmable
packet length
• Optional Address byte
• Preamble
• Payload
• Synchronization word
• Optional 2 byte CRC
Data field
16/32 bits
8
bits
8
bits
8 x n bits
Legend:
Inserted automatically in TX,
processed and removed in RX.
CRC-16
Address field
8 x n bits
Length field
Preamble bits
(1010...1010)
Sync word
Optional data whitening
Optionally FEC encoded/decoded
Optional CRC-16 calculation
Optional user-provided fields processed in TX,
processed but not removed in RX.
Unprocessed user data (apart from FEC
and/or whitening)
16 bits
Figure 51: Packet Format
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CC2510Fx / CC2511Fx
The preamble pattern is an alternating
sequence of ones and zeros (101010101…).
The minimum length of the preamble is
programmable through the NUM_PREAMBLE
field in the MDMCFG1 register. When enabling
TX, the modulator will start transmitting the
preamble. When the programmed number of
preamble bytes have been transmitted, the
modulator will send the sync word, and then
data from the RFD register. If no data has been
written to the RFD register when the radio is
done transmitting the programmed number of
preamble bytes, the modulator will continue to
send preamble bytes until the first byte is
written to RFD. It will then send the sync word
followed by the data written to RFD.
the programmed node address in the ADDR
register and the 0x00 broadcast address when
PKTCTRL1.ADR_CHK=10 or both 0x00 and
0xFF
broadcast
addresses
when
PKTCTRL1.ADR_CHK=11. If the received
address matches a valid address, the packet
is accepted and the RFTXRXIF flag is asserted
and a DMA trigger is generated. If the address
match fails, the packet is discarded and
receive mode restarted (regardless of the
MCSM1.RXOFF_MODE
setting).
The
RFIF.IRQ_DONE flag will be asserted but the
DMA will not be triggered.
The synchronization word is a two-byte value
set in the SYNC1 and SYNC0 registers. The
sync word provides byte synchronization of the
incoming packet. A one-byte sync word can be
emulated by setting the SYNC1 value to the
preamble pattern. It is also possible to emulate
a
32
bit
sync
word
by
using
MDMCFG2.SYNC_MODE set to 3 or 7. The sync
word will then be repeated twice.
In
variable
packet
length
mode,
PKTCTRL0.LENGTH_CONFIG=1,
the
PKTLEN.PACKET_LENGTH register value is
used to set the maximum allowed packet
length. If the received length byte has a larger
value than this, the packet is discarded and
receive mode restarted (regardless of the
MCSM1.RXOFF_MODE
setting).
The
RFIF.IRQ_DONE flag will be asserted but the
DMA will not be triggered.
CC2510Fx/CC2511Fx supports both fixed packet
length protocols and variable packet length
protocols. Variable or fixed packet length
mode can be used for packets up to 255
bytes.
Fixed packet length mode is selected by
setting PKTCTRL0.LENGTH_CONFIG=0. The
desired packet length is set by the PKTLEN
register.
In
variable
packet
length
mode,
PKTCTRL0.LENGTH_CONFIG=1, the packet
length is configured by the first byte after the
sync word. The packet length is defined as the
payload data, excluding the length byte and
the optional CRC. The PKTLEN register is
used to set the maximum packet length
allowed in RX. Any packet received with a
length byte with a value greater than PKTLEN
will be discarded.
13.8.3
Packet Filtering in Receive Mode
CC2500 supports two different types of packetfiltering: address filtering and maximum length
filtering.
13.8.3.1
Address Filtering
Setting PKTCTRL1.ADR_CHK to any other
value than zero enables the packet address
filter. The packet handler engine will compare
the destination address byte in the packet with
13.8.3.2
13.8.4
Maximum Length Filtering
Packet Handling in Transmit Mode
The payload that is to be transmitted must be
written into RFD. The first byte written must be
the length byte when variable packet length is
enabled. The length byte has a value equal to
the payload of the packet (including the
optional address byte). If fixed packet length is
enabled, then the first byte written to RFD is
interpreted as the destination address, if this
feature is enabled in the device that receives
the packet.
The modulator will first send the programmed
number of preamble bytes. If data has been
written to RFD, the modulator will send the twobyte (optionally 4-byte) sync word and then the
content of the RFD register. If CRC is enabled,
the checksum is calculated over all the data
pulled from the RFD register and the result is
sent as two extra bytes following the payload
data. If fewer bytes are written to the RFD
registers than what the radio expects the radio
will enter TX_UNDERFLOW state and the
RFIF.IRQ_TXUNF flag will be set together
with RFIF.IRQ_DONE. An SIDLE strobe
needs to be issued to return to IDLE state.
If whitening is enabled, everything following
the sync words will be whitened. This is done
before the optional FEC/Interleaver stage.
Whitening
is
enabled
by
setting
PKTCTRL0.WHITE_DATA=1.
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
If FEC/Interleaving is enabled, everything
following the sync words will be scrambled by
the interleaver and FEC encoded before being
modulated. FEC is enabled by setting
MDMCFG1.FEC_EN=1.
13.8.5
Packet Handling in Receive Mode
In receive mode, the demodulator and packet
handler will search for a valid preamble and
the sync word. When found, the demodulator
has obtained both bit and byte synchronism
and will receive the first payload byte.
If FEC/Interleaving is enabled, the FEC
decoder will start to decode the first payload
byte. The interleaver will de-scramble the bits
before any other processing is done to the
data.
If whitening is enabled, the data will be dewhitened at this stage.
When variable packet length mode is enabled,
the first byte is the length byte. The packet
handler stores this value as the packet length
and receives the number of bytes indicated by
the length byte. If fixed packet length mode is
used, the packet handler will accept the
programmed number of bytes.
Next, the packet handler optionally checks the
address and only continues the reception if the
address matches. If automatic CRC check is
enabled, the packet handler computes CRC
and matches it with the appended CRC
checksum.
At the end of the payload, the packet handler
will optionally write two extra packet status
bytes that contain CRC status, link quality
indication and RSSI value.
If a byte is received in the RFD register, and it
is not read before the next byte is received,
the radio will enter RX_OVERFLOW state and
the RFIF.IRQ_RXOVF flag will be set together
with RFIF.IRQ_DONE. An SIDLE strobe
needs to be issued to return to IDLE state.
13.9 Modulation Formats
CC2510Fx/CC2511Fx supports frequency and
phase shift modulation formats. The desired
modulation
format
is
set
in
the
MDMCFG2.MOD_FORMAT register.
Optionally, the data stream can be Manchester
coded by the modulator and decoded by the
demodulator. This option is enabled by setting
MDMCFG2.MANCHESTER_EN=1.
Note: Manchester encoding is not
supported at the same time as using the
FEC/Interleaver option or when using MSK
modulation.
13.9.1
When FSK/GFSK modulation is used the
DEVIATN register specifies the expected
frequency deviation of incoming signal in RX
and should be the same as the TX deviation
for demodulation to be performed reliably and
robustly.
The frequency deviation is programmed with
the DEVIATION_M and DEVIATION_E values
in the DEVIATN register. The value has an
exponent/mantissa form, and the resultant
deviation is given by:
f dev =
f ref
17
2
⋅ (8 + DEVIATION _ M ) ⋅ 2 DEVIATION _ E
The symbol encoding is shown in Table 66.
Frequency Shift Keying
2-FSK can optionally be shaped by a
Gaussian filter with BT=1, producing a GFSK
modulated signal.
Format
Symbol
Coding
2-FSK/GFSK
‘0’
−Deviation
‘1’
+Deviation
Table 66: Symbol Encoding for 2-FSK/GFSK Modulation
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CC2510Fx / CC2511Fx
13.9.2
Minimum Shift Keying
21
When using MSK the complete transmission
(preamble, sync word, and payload) will be
MSK modulated.
Phase shifts are performed with a constant
transition time.
DEVIATN.DEVIATION_M setting. This is
equivalent to changing the shaping of the
symbol.
The MSK modulation format implemented in
CC2510Fx/CC2511Fx inverts the sync word and
data compared to e.g. signal generators.
The fraction of a symbol period used to change
the phase can be modified with the
Note: The DEVIATN register setting
has no effect in RX when using MSK. Also,
when
using
MSK
Manchester
encoding/decoding should be disabled
(MDMCFG2.MANCHESTER_EN=0)
21
Identical to offset QPSK with half-sine
shaping (data coding may differ)
13.10 Received Signal Qualifiers and Link Quality Information
CC2510Fx/CC2511Fx has several qualifiers
that can be used to increase the likelihood that
a valid sync word is detected.
13.10.1 Sync Word Qualifier
If sync word detection in RX is enabled in
register MDMCFG2 the CC2510Fx/CC2511Fx will
not start writing received data to the RFD
register and perform the packet filtering
described in Section 13.8.3 before a valid sync
word has been detected. The sync word
qualifier mode is set by MDMCFG2.SYNC_MODE
and is summarized in Table 67. Carrier sense
in Table 67 is described in Section 13.10.4.
MDMCFG2.
Sync Word Qualifier Mode
SYNC_MODE
000
No preamble/sync
001
15/16 sync word bits detected
010
16/16 sync word bits detected
011
30/32 sync word bits detected
100
No preamble/sync, carrier sense
above threshold
101
15/16 + carrier sense above threshold
110
16/16 + carrier sense above threshold
111
30/32 + carrier sense above threshold
timer. See Section 13.12.3 on Page 201 for
details.
The preamble quality estimator increases an
internal counter by one each time a bit is
received that is different from the previous bit,
and decreases the counter by 8 each time a bit
is received that is the same as the last bit. The
threshold is configured with the register field
PKTCTRL1.PQT. A threshold of 4∙PQT for this
counter is used to gate sync word detection.
By setting the value to zero, the preamble
quality qualifier of the sync word is disabled.
A “Preamble Quality Reached” signal can be
observed on P1_5, P1_6, or P1_7 by setting
IOCFGx.GDOx_CFG=1000. It is also possible
to determine if preamble quality is reached by
checking the PQT_REACHED bit in the
PKTSTATUS register. This signal / bit asserts
when the received signal exceeds the PQT.
13.10.3 RSSI
The RSSI value is an estimate of the signal
level in the chosen channel. This value is
based on the current gain setting in the RX
chain and the measured signal level in the
channel.
Table 67: Sync Word Qualifier mode
13.10.2 Preamble Quality Threshold (PQT)
The Preamble Quality Threshold (PQT) syncword qualifier adds the requirement that the
received sync word must be preceded with a
preamble with a quality above a programmed
threshold.
In RX mode, the RSSI value can be read
continuously from the RSSI status register until
the demodulator detects a sync word (when
sync word detection is enabled). At that point
the RSSI readout value is frozen until the next
time the chip enters the RX state.
Another use of the preamble quality threshold
is as a qualifier for the optional RX termination
SWRS055G
Note: It takes some time from the radio
enters RX mode until a valid RSSI value is
present in the RSSI register. Please see
DN505 [12] for details on how the RSSI
response time can be estimated.
Page 194 of 236
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CC2510Fx / CC2511Fx
The RSSI value is in dBm with ½ dB
resolution. The RSSI update rate, fRSSI,
depends on the receiver filter bandwidth
(BW channel defined in Section 13.6) and
AGCCTRL0.FILTER_LENGTH.
f RSSI =
2) Convert the reading from a hexadecimal
number
to
a
decimal
number
(RSSI_dec)
3) If RSSI_dec ≥ 128 then RSSI_dBm =
(RSSI_dec − 256)/2 – RSSI_offset
2 ⋅ BWchannel
8 ⋅ 2 FILTER _ LENGTH
4) Else if RSSI_dec < 128 then RSSI_dBm
= (RSSI_dec)/2 – RSSI_offset
Table 68 provides typical values for the
RSSI_offset.
If PKTCTRL1.APPEND_STATUS is enabled the
RSSI value at sync word detection is
automatically added to the first byte appended
after the data payload.
The RSSI value read from the RSSI status
register is a 2’s complement number. The
following procedure can be used to convert the
RSSI reading to an absolute power level
(RSSI_dBm).
Data Rate [kBaud]
RSSI_offset [dB]
2.4
74
10
74
250
71
500
72
Table 68: Typical RSSI_offset Values
1) Read the RSSI status register
Figure 52 shows typical plots of RSSI readings
as a function of input power level for different
data rates.
0.0
-10.0
-20.0
RSSI readout [dBm]
-30.0
-40.0
-50.0
-60.0
-70.0
-80.0
-90.0
-100.0
-110.0
-120.0
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
Input power [dBm]
2.4 kBaud
10 kBaud
250 kBaud
250 kBaud, reduced current
500 kBaud
Figure 52: Typical RSSI Value vs. Input Power Level for Some Typical Data Rates
13.10.4 Carrier Sense (CS)
of dB from one RSSI sample to the next,
and de-asserted when RSSI has
decreased with the same number of dB.
This setting is not dependent on the
absolute signal level and is thus useful
to detect signals in environments with a
time varying noise floor.
The Carrier Sense (CS) flag is used as a sync
word qualifier and for CCA. The CS flag can
be set based on two conditions, which can be
individually adjusted:
• CS is asserted when the RSSI is above
a programmable absolute threshold, and
de-asserted when RSSI is below the
same threshold (with hysteresis).
• CS is asserted when the RSSI has
increased with a programmable number
Carrier Sense can be used as a sync word
qualifier that requires the signal level to be
higher than the threshold for a sync word
search to be performed. The signal can also
be observed on P1_5, P1_6, or P1_7 by
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CC2510Fx / CC2511Fx
setting IOCFGx.GDOx_CFG=1110 and in the
status register bit PKTSTATUS.CS.
MAX_DVGA_GAIN[1:0]
MAX_LNA_GAIN[2:0]
Other uses of Carrier Sense include the TX-ifCCA function (see Section 13.10.7 on Page
197) and the optional fast RX termination (see
Section 13.12.3 on Page 201).
CS can be used to avoid interference from e.g.
WLAN.
13.10.5 CS Absolute Threshold
The absolute threshold related to the RSSI
value depends on the following register fields:
•
AGCCTRL2.MAX_LNA_GAIN
•
AGCCTRL2.MAX_DVGA_GAIN
•
AGCCTRL1.CARRIER_SENSE_ABS_THR
•
AGCCTRL2.MAGN_TARGET
00
01
10
11
000
−99
−93
−87
−81.5
001
−97
−90.5
−85
−78.5
010
−93.5
−87
−82
−76
011
−91.5
−86
−80
−74
100
−90.5
−84
−78
−72.5
101
−88
−82.5
−76
−70
110
−84.5
−78.5
−73
−67
111
−82.5
−76
−70
−64
Table 69: Typical RSSI Value in dBm at CS
Threshold with Default MAGN_TARGET at 2.4
kBaud
MAX_DVGA_GAIN[1:0]
The MAGN_TARGET setting is a compromise
between blocker tolerance/selectivity and
sensitivity. The value sets the desired signal
level in the channel into the demodulator.
Increasing this value reduces the headroom
for blockers, and therefore close-in selectivity.
®
It is strongly recommended to use SmartRF
Studio
[8]
to
generate
the
correct
MAGN_TARGET setting.
Table 69 and Table 70 show the typical RSSI
readout values at the CS threshold at 2.4
kBaud and 250 kBaud data rate respectively.
The default CARRIER_SENSE_ABS_THR=0 (0
dB) and MAGN_TARGET=11 (33 dB) have been
used.
For other data rates the user must generate
similar tables to find the CS absolute
threshold.
MAX_LNA_GAIN[2:0]
For a given AGCCTRL2.MAX_LNA_GAIN and
AGCCTRL2.MAX_DVGA_GAIN
setting the
absolute threshold can be adjusted ±7 dB in
steps
of
1
dB
using
CARRIER_SENSE_ABS_THR.
00
01
10
11
000
−96
−90
−84
−78.5
001
−94.5
−89
−83
−77.5
010
−92.5
−87
−81
−75
011
−91
−85
−78.5
−73
100
−87.5
−82
−76
−70
101
−85
−79.5
−73.5
−67.5
110
−83
−76.5
−70.5
−65
111
−78
−72
−66
−60
Table 70: Typical RSSI Value in dBm at CS
Threshold with Default MAGN_TARGET at 250
kBaud
If the threshold is set high, i.e. only strong
signals are wanted, the threshold should be
adjusted upwards by first reducing the
MAX_LNA_GAIN
value
and
then
the
MAX_DVGA_GAIN value. This will reduce
power consumption in the receiver front end,
since the highest gain settings are avoided.
13.10.6 CS Relative Threshold
The relative threshold detects sudden changes
in the measured signal level. This setting is not
dependent on the absolute signal level and is
thus useful to detect signals in environments
with a time varying noise floor. The register
field AGCCTRL1.CARRIER_SENSE_REL_THR
is used to enable/disable relative CS, and to
select threshold of 6 dB, 10 dB or 14 dB RSSI
change
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CC2510Fx / CC2511Fx
13.10.7 Clear Channel Assessment (CCA)
• Unless currently receiving a packet
The Clear Channel Assessment CCA) is used
to indicate if the current channel is free or
busy. The current CCA state is viewable on
P1_5,
P1_6,
or
P1_7
by
setting
IOCFGx.GDOx_CFG=1001.
• Both the above (RSSI below threshold
and not currently receiving a packet)
MCSM1.CCA_MODE selects the mode to use
when determining CCA.
When the STX or SFSTXON command strobe is
given while CC2510Fx/CC2511Fx is in the RX
state, the TX or FSTXON state is only entered
if the clear channel requirements are fulfilled.
The chip will otherwise remain in RX (if the
channel becomes available, the radio will not
enter TX or FSTXON state before a new
strobe command is being issued). This feature
is called TX-if-CCA.
Four CCA requirements can be programmed:
• Always (CCA disabled, always goes to
TX)
13.10.8 Link Quality Indicator (LQI)
The Link Quality Indicator is a metric of the
current quality of the received signal. If
PKTCTRL1.APPEND_STATUS is enabled, the
value is automatically added to the last byte
appended after the payload. The value can
also be read from the LQI status register. The
LQI gives an estimate of how easily a received
signal can be demodulated by accumulating
the magnitude of the error between ideal
constellations and the received signal over the
64 symbols immediately following the sync
word. LQI is best used as a relative
measurement of the link quality (a high value
indicates a better link than what a low value
does), since the value is dependent on the
modulation format.
• If RSSI is below threshold
13.11 Forward Error Correction with Interleaving
13.11.1 Forward Error Correction (FEC)
The
CC2510Fx/CC2511Fx has built in support for
Forward Error Correction (FEC). To enable
this option, set MDMCFG1.FEC_EN to 1. FEC is
only supported in fixed packet length mode
(PKTCTRL0.LENGTH_CONFIG=0). FEC is
employed on the data field and CRC word in
order to reduce the gross bit error rate when
operating
near
the
sensitivity
limit.
Redundancy is added to the transmitted data
in such a way that the receiver can restore the
original data in the presence of some bit
errors.
The use of FEC allows correct reception at a
lower SNR, thus extending communication
range. Alternatively, for a given SNR, using
FEC decreases the bit error rate (BER). As the
packet error rate (PER) is related to BER by:
FEC
scheme
adopted
for
CC2510Fx/CC2511Fx is convolutional coding, in
which n bits are generated based on k input
bits and the m most recent input bits, forming
a code stream able to withstand a certain
number of bit errors between each coding
state (the m-bit window).
The convolutional coder is a rate 1/2 code with
a constraint length of m=4. The coder codes
one input bit and produces two output bits;
hence, the effective data rate is halved. I.e. to
transmit at the same effective data rate when
using FEC, it is necessary to use twice as high
over-the-air data rate. This will require a higher
receiver bandwidth, and thus reduce
sensitivity. In other words, the improved
reception by using FEC and the degraded
sensitivity from a higher receiver bandwidth
will be counteracting factors.
PER = 1 − (1 − BER) packet _ length ,
a lower BER can be used to allow longer
packets, or a higher percentage of packets of
a given length, to be transmitted successfully.
Finally, in realistic ISM radio environments,
transient and time-varying phenomena will
produce occasional errors even in otherwise
good reception conditions. FEC will mask such
errors and, combined with interleaving of the
coded data, even correct relatively long
periods of faulty reception (burst errors).
13.11.2 Interleaving
Data received through radio channels will
often experience burst errors due to
interference and time-varying signal strengths.
In order to increase the robustness to errors
spanning multiple bits, interleaving is used
when FEC is enabled. After de-interleaving, a
continuous span of errors in the received
stream will become single errors spread apart.
SWRS055G
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CC2510Fx / CC2511Fx
CC2510Fx/CC2511Fx employs matrix interleaving,
The packet control hardware therefore
automatically inserts one or two extra bytes at
the end of the packet, so that the total length
of the data to be interleaved is an even
number. Note that these extra bytes are
invisible to the user, as they are removed
before the received packet enters the RFD
data register.
which is illustrated in Figure 53. The on-chip
interleaving and de-interleaving buffers are 4 x
4 matrices. In the transmitter, the data bits
from the rate ½ convolutional coder are written
into the rows of the matrix, whereas the bit
sequence to be transmitted is read from the
columns of the matrix. Conversely, in the
receiver, the received symbols are written into
the rows of the matrix, whereas the data
passed onto the convolutional decoder is read
from the columns of the matrix.
When FEC and interleaving is used the
minimum data payload is 2 bytes.
Note:
When
using
FEC
(MDMCFG1.FEC_EN=1), CLKCON.CLKSPD
must be set to 000.
When FEC and interleaving is used at least
one extra byte is required for trellis
termination. In addition, the amount of data
transmitted over the air must be a multiple of
the size of the interleaver buffer (two bytes).
Interleaver
Write buffer
Packet
Engine
Interleaver
Read buffer
FEC
Encoder
Modulator
Interleaver
Write buffer
Interleaver
Read buffer
FEC
Decoder
Demodulator
Packet
Engine
Figure 53: General Principle of Matrix Interleaving
13.12 Radio Control
CC2510Fx/CC2511Fx has a built-in state machine
that is used to switch between different
operation states (modes). The change of state
is done either by using command strobes or by
internal events such as TX FIFO underflow.
A simplified state diagram is shown in Figure
48 on Page 184. The complete radio control
state diagram is shown in Figure 54. The
numbers refer to the state number readable in
the MARCSTATE status register. This register is
primarily for test purposes.
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CC2510Fx / CC2511Fx
SIDLE
CAL_COMPLETE
MANCAL
3,4,5
IDLE
1
SCAL
SRX | STX | SFSTXON
FS_WAKEUP
6,7
FS_AUTOCAL = 01
&
SRX | STX | SFSTXON
FS_AUTOCAL = 00 | 10 | 11
&
SRX | STX | SFSTXON
CALIBRATE
8
CAL_COMPLETE
SETTLING
9,10,11
SFSTXON
FSTXON
18
STX
STX
TXOFF_MODE=01
SRX
SFSTXON | RXOFF_MODE = 01
SRX
STX | RXOFF_MODE = 10
TXOFF_MODE = 10
RXTX_SETTLING
21
TX
19,20
SRX | TXOFF_MODE = 11
( STX | SFSTXON ) & CCA
|
RXOFF_MODE = 01 | 10
RX
13,14,15
RXOFF_MODE = 11
TXRX_SETTLING
16
RXOFF_MODE = 00
&
FS_AUTOCAL = 10 | 11
TXOFF_MODE = 00
&
FS_AUTOCAL = 10 | 11
TXFIFO_UNDERFLOW
RXFIFO_OVERFLOW
TXOFF_MODE = 00
&
FS_AUTOCAL = 00 | 01
CALIBRATE
12
RXOFF_MODE = 00
&
FS_AUTOCAL = 00 | 01
RX_OVERFLOW
17
TX_UNDERFLOW
22
SIDLE
IDLE
1
SIDLE
Figure 54: Complete Radio Control State Diagram
SWRS055G
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CC2510Fx / CC2511Fx
13.12.1 Active Modes
Note: When MCSM1.RXOFF_MODE=11 and
a packet has been received, it will take
some time before a valid RSSI value is
present in the RSSI register again even if
the radio has never exited RX mode. This
time is the same as the RSSI response
time discussed in DN505 [12].
The radio has two active modes: receive and
transmit. These modes are activated directly
by writing the SRX and STX command strobes
to the RFST register.
The frequency synthesizer must be calibrated
regularly. CC2510Fx/CC2511Fx has one manual
calibration option (using the SCAL strobe), and
three automatic calibration options, controlled
by the MCSM0.FS_AUTOCAL setting:
• Calibrate when going from IDLE to
either RX or TX (or FSTXON)
• Calibrate when going from either RX or
TX to IDLE automatically
• Calibrate every fourth time when going
from either RX or TX to IDLE
automatically
If the radio goes from TX or RX to IDLE by
issuing an SIDLE strobe, calibration will not be
performed. See Table 71 for timing details
regarding calibration.
When RX is activated, the chip will remain in
receive mode until a packet is successfully
received or the RX termination timer expires
(see Section 13.12.3). Note: The probability
that a false sync word is detected can be
reduced by using PQT, CS, maximum sync
word length, and sync word qualifier mode as
describe in Section 13.10.1. After a packet is
successfully received the radio controller will
then go to the state indicated by the
MCSM1.RXOFF_MODE setting. The possible
destinations are:
• IDLE
• FSTXON: Frequency synthesizer on
and ready at the TX frequency. Activate
TX with STX.
• TX: Start sending preambles
• RX: Start search for a new packet
Similarly, when TX is active the chip will
remain in the TX state until the current packet
has been successfully transmitted. Then the
state will change as indicated by the
MCSM1.TXOFF_MODE setting. The possible
destinations are the same as for RX.
It is possible to change the state from RX to
TX and vice versa by using the command
strobes. If the radio controller is currently in
transmit and an SRX strobe is written to the
RFST register, the current transmission will be
ended and the transition to RX will be done.
If the radio controller is in RX when the STX or
SFSTXON command strobes are used and
MCSM1.CCA_MODE≠00, the TX-if-CCA function
will be used. If the channel is not clear, the
chip will remain in RX. For more details on
clear channel assessment, see Section
13.10.7 on Page 197.
The SIDLE command strobe can always be
used to force the radio controller to go to the
IDLE state.
13.12.2 Timing
The radio controller controls most timing in
CC2510Fx/CC2511Fx, such as synthesizer
calibration, PLL lock time, and RX/TX
turnaround times. Table 71 shows the timing
for key state transitions when the system clock
frequency is equal to fRef and the data rate is
250 kBaud. See DN110 [11] for more details
on how the state transition times changes
under other conditions.
Power on time and XOSC start-up times are
variable, but within the limits stated in Table 11
and Table 12
Note that in a frequency hopping spread
spectrum or a multi-channel protocol it is
possible to reduce the calibration time
significantly. This is explained in Section
13.17.2.
SWRS055G
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Transmission Time as a
function of fRef and/or fSymbol 22
Description
Transition Time [μs]
fRef = 26 MHz
fRef = 24 MHz
1953/fSys
75.1
81.4
20768/fSys
799
865
1954/fSys
75.2
81.4
Idle to TX/FSTXON, with calibration
20768/fSys
799
865
TX to RX switch
782/fSys + 0.25/fSymbol
31.1
33.6
RX to TX switch
782/fSys
30.1
32.6
~0.25/fSymbol
~1
~1
~0.25/fSymbol +18815/fSys
725
785
2/fSys
0.1
0.1
RX to IDLE, with calibration
18817/fSys
724
784
Manual calibration23
19098/fSys
735
796
Idle to RX, no calibration
Idle to RX, with calibration
23
Idle to TX/FSTXON, no calibration
23
TX to IDLE, no calibration
23
TX to IDLE, with calibration
RX to IDLE, no calibration
23
Table 71: State Transition Timing
• MCSM2.RX_TIME_QUAL=1:
Continue
receive if sync word has been found or
13.12.3 RX Termination Timer
CC2510Fx/CC2511Fx has optional functions for
automatic termination of RX after a
programmable time. The termination timer
starts when in RX state. The timeout is
programmable with the MCSM2.RX_TIME
setting. When the timer expires, the radio
controller will check the condition for staying in
RX; if the condition is not met, RX will
terminate.
The programmable conditions are:
• MCSM2.RX_TIME_QUAL=0:
Continue
receive if sync word has been found
preamble quality is above threshold
(PQT)
If the system can expect the transmission to
have started when enabling the receiver, the
MCSM2.RX_TIME_RSSI function can be used.
The radio controller will then terminate RX if
the first valid carrier sense sample indicates
no carrier (RSSI below threshold). See Section
13.10.4 on Page 195 for details on Carrier
Sense.
If RX terminates due to no carrier sense when
the MCSM2.RX_TIME_RSSI function is used,
or if no sync word was found when using the
MCSM2.RX_TIME timeout function, the chip
will always go back to IDLE.
13.13 Frequency Programming
The
frequency
programming
in
CC2510Fx/CC2511Fx is designed to minimize the
programming needed in a channel-oriented
system.
the
MDMCFG0.CHANSPC_M
and
MDMCFG1.CHANSPC_E registers. The channel
spacing registers are mantissa and exponent
respectively.
To set up a system with channel numbers, the
desired channel spacing is programmed with
∆f CHANNEL =
f ref
18
2
⋅ (256 + CHANSPC _ M ) ⋅ 2 CHANSPC _ E ⋅ CHAN
22
fSymbol is the symbol rate for the data transmission (in this case 250 kBaud). Please see DN110 [11]
for more details
23
This is the calibration time given that TEST0=0x0B and FSCAL3.CHP_CURR_CAL_EN=10 (max
calibration time). Please see DN110 [11] for more details
SWRS055G
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
The base or start frequency is set by the 24 bit
frequency word located in the FREQ2, FREQ1
and FREQ0 registers. This word will typically
be set to the centre of the lowest channel
frequency that is to be used.
f carrier =
f ref
16
2
(
(
⋅ FREQ + CHAN ⋅ (256 + CHANSPC _ M ) ⋅ 2CHANSPC _ E −2
With a reference frequency, fRef, equal to 26
MHz, the maximum channel spacing is 405
kHz. To get e.g. 1 MHz channel spacing one
solution is to use 333 kHz channel spacing
and
select
each
third
channel
in
CHANNR.CHAN.
The preferred IF frequency is programmed
with the FSCTRL1.FREQ_IF register. The IF
frequency is given by:
f IF =
f ref
210
anel number is programmed with the 8-bit
channel number register, CHANNR.CHAN,
which is multiplied by the channel offset. The
resultant carrier frequency is given by:
))
®
Note that the SmartRF Studio software [8]
automatically calculates the optimum register
setting based on channel spacing and channel
filter bandwidth.
If any frequency programming register is
altered when the frequency synthesizer is
running, the synthesizer may give an
undesired response. Hence, the frequency
programming should only be updated when
the radio is in the IDLE state.
⋅ FREQ _ IF
13.14 VCO
The VCO is completely integrated on-chip.
13.14.1 VCO and PLL Self-Calibration
The VCO characteristics will vary with
temperature and supply voltage changes, as
well as the desired operating frequency. In
order
to
ensure
reliable
operation,
CC2510Fx/CC2511Fx
includes
frequency
synthesizer self-calibration circuitry. This
calibration should be done regularly, and must
be performed after turning on power and
before using a new frequency (or channel).
The number of fRef periods for completing the
PLL calibration is given in Table 71 on Page
201.
The calibration can be initiated automatically or
manually.
The
synthesizer
can
be
automatically calibrated each time the
synthesizer is turned on, or each time the
synthesizer is turned off automatically. This is
configured with the MCSM0.FS_AUTOCAL
register setting. In manual mode, the
calibration is initiated when the SCAL
command strobe is activated in the IDLE
mode.
Note that the calibration values are maintained
in power-down modes PM1/2/3, so the
calibration is still valid after waking up from
these power-down modes (unless supply
voltage or temperature has changed
significantly).
13.15 Output Power Programming
The RF output power level from the device is
programmed through the PA_TABLE0 register.
Table 72 contains recommended PA_TABLE0
settings for various output levels and
frequency bands, together with current
consumption in the RF transceiver.
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CC2510Fx / CC2511Fx
Output Power [dBm]
Setting
Current Consumption, Typ. [mA]
(–55 or less)
0x00
12
–30
0x44
13
–28
0x41
13
–26
0x54
15
–24
0x53
14
–22
0x83
14
–20
0xC1
14
–18
0xC8
15
–16
0x87
14.5
–14
0x59
15
–12
0x95
15.5
–10
0xCB
16
–8
0x99
16.5
–6
0x7F
18.5
–4
0xAA
20
–2
0xBF
21.5
0
0xFE
26
1
0xFF
26.5
Typical 25ºC, 3.0 V
Table 72: Optimum PA_TABLE0 Settings for Various Output Power Levels (subject to changes)
13.16 Selectivity
Figure 55 to Figure 59 show the typical
selectivity performance (adjacent and alternate
rejection).
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CC2510Fx / CC2511Fx
50
40
Selectivity [dB]
30
20
10
0
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
-10
Frequency offset [MHz]
Figure 55: Typical Selectivity at 2.4 kBaud. IF Frequency is 273.9 kHz.
MDMCFG2.DEM_DCFILT_OFF=1
40
35
30
Selectivity [dB]
25
20
15
10
5
0
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
-5
-10
Frequency offset [MHz]
Figure 56: Typical Selectivity at 10 kBaud. IF Frequency is 273.9 kHz.
MDMCFG2.DEM_DCFILT_OFF=1
50
40
Selectivity [dB]
30
20
10
0
-3
-2
-1
0
1
2
3
-10
-20
Frequency offset [MHz]
Figure 57: Typical Selectivity at 250 kBaud. IF Frequency is 177.7 kHz.
MDMCFG2.DEM_DCFILT_OFF=0
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CC2510Fx / CC2511Fx
50
40
Selectivity [dB]
30
20
10
0
-3
-2
-1
0
1
2
3
-10
-20
Frequency offset [MHz]
Figure 58:Typical Selectivity at 250 kBaud. IF Frequency is 457 kHz.
MDMCFG2.DEM_DCFILT_OFF=1
35
30
25
20
Selectivity [dB]
15
10
5
0
-3
-2
-1
0
1
2
3
-5
-10
-15
-20
Frequency offset [MHz]
Figure 59: Typical Selectivity at 500 kBaud. IF Frequency is 307.4 kHz.
MDMCFG2.DEM_DCFILT_OFF=0
13.17 System Considerations and Guidelines
13.17.1 SRD Regulations
International regulations and national laws
regulate the use of radio receivers and
transmitters. The most important regulations
for the 2.4 GHz band are EN 300 440 and EN
300 328 (Europe), FCC CFR47 part 15.247
and 15.249 (USA), and ARIB STD-T66
(Japan). A summary of the most important
aspects of these regulations can be found in
AN032 [9].
Please note that compliance with regulations is
dependent on complete system performance.
It is the customer’s responsibility to ensure that
the system complies with regulations.
13.17.2 Frequency Hopping
Channel Systems
and
Multi-
The 2.400 – 2.4835 GHz band is shared by
many systems both in industrial, office and
home
environments.
It
is
therefore
recommended to use frequency hopping
spread spectrum (FHSS) or a multi-channel
protocol because the frequency diversity
makes the system more robust with respect to
interference from other systems operating in
the same frequency band. FHSS also combats
multipath fading.
Charge pump current, VCO current and VCO
capacitance array calibration data is required
for each frequency when implementing
frequency hopping for CC2510Fx/CC2511Fx.
There are 3 ways of obtaining the calibration
data from the chip:
1) Frequency hopping with calibration for each
hop. The PLL calibration time is approximately
24
735 µs and the blanking interval between
each frequency hop is then approximately
24
The system clock frequency is equal to fRef.
Max calibration time is used (TEST0=0x0B
and FSCAL3.CHP_CURR_CAL_EN=10) Please
see DN110 [11] for more details.
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
799 μs . When fRef is 24 MHz, these numbers
24
24
are 796 μs and 865 μs respectively.
24
2) Fast frequency hopping without calibration
for each hop can be done by calibrating each
frequency at startup and saving the resulting
FSCAL3, FSCAL2 and FSCAL1 register values
in memory. Between each frequency hop, the
calibration process can then be replaced by
writing the FSCAL3, FSCAL2 and FSCAL1
register values corresponding to the next RF
frequency. The PLL turn on time is
24
approximately 75 µs when fRef is 26 MHz and
24
81 µs when fRef is 24 MHz. The blanking
interval between each frequency hop is then
approximately equal to the PLL turn on time.
The VCO current calibration result is available
in FSCAL2 and is not dependent on the RF
frequency. Neither is the charge pump current
calibration result available in FSCAL3. The
same value can therefore be used for all
frequencies.
3) Run calibration on a single frequency at
startup. Next write 0 to FSCAL3[5:4] to
disable the charge pump calibration. After
writing to FSCAL3[5:4] strobe SRX (or STX)
with MCSM0.FS_AUTOCAL=01 for each new
frequency hop. That is, VCO current and VCO
capacitance calibration is done but not charge
pump current calibration. When charge pump
current calibration is disabled the calibration
24
25
time is reduced from 735 µs to 168 µs
24
when fRef is 26 MHz and from 799 µs to 182
25
µs when fRef is 24 MHz. The blanking interval
between each frequency hop is then 243 µs
and 263 µs respectively.
There is a trade off between blanking time and
memory space needed for storing calibration
data in non-volatile memory. Solution 2) above
gives the shortest blanking interval, but
requires more memory space to store
calibration values. Solution 3) gives 631 µs
smaller blanking interval than solution 1 when
fRef is 26 MHz and 683 µs smaller blanking
interval than solution 1 when fRef is 24 MHz).
addition, the peak power spectral density
conducted to the antenna shall not be greater
than 8 dBm in any 3 kHz band.
Operating at high data rates and high
frequency separation, the CC2510Fx/CC2511Fx is
suited for systems targeting compliance with
digital modulation systems as defined by FCC
part 15.247. An external power amplifier is
needed to increase the output above 1 dBm.
13.17.4 Data Burst Transmissions
The
high
maximum
data
rate
of
opens up for burst
transmissions. A low average data rate link
(e.g. 10 kBaud), can be realized using a higher
over-the-air data rate. Buffering the data and
transmitting in bursts at high data rate (e.g.
500 kBaud) will reduce the time in active
mode, and hence also reduce the average
current consumption significantly. Reducing
the time in active mode will reduce the
likelihood of collisions with other systems, e.g.
WLAN.
CC2510Fx/CC2511Fx
13.17.5 Crystal Drift Compensation
The CC2510Fx/CC2511Fx has a very fine
frequency resolution (see Table 16). This
feature can be used to compensate for
frequency offset and drift.
The frequency offset between an ‘external’
transmitter and the receiver is measured in the
CC2510Fx/CC2511Fx and can be read back from
the FREQEST status register as described in
Section 13.7.1. The measured frequency offset
can be used to calibrate the frequency using
the ‘external’ transmitter as the reference. That
is, the received signal of the device will match
the receiver’s channel filter better. In the same
way the centre frequency of the transmitted
signal will match the ‘external’ transmitter’s
signal.
13.17.6 Spectrum Efficient Modulation
13.17.3 Wideband Modulation
Spread Spectrum
not
Using
Digital modulation systems under FCC part
15.247 includes 2-FSK and GFSK modulation.
A maximum peak output power of 1 W (30
dBm) is allowed if the 6 dB bandwidth of the
modulated signal exceeds 500 kHz. In
25
TEST0=0x0B. Please see DN110 [11] for
more details.
CC2510Fx/CC2511Fx also has the possibility to
use Gaussian shaped 2-FSK (GFSK). This
spectrum-shaping feature improves adjacent
channel power (ACP) and occupied bandwidth.
In ‘true’ 2-FSK systems with abrupt frequency
shifting, the spectrum is inherently broad. By
making the frequency shift ‘softer’, the
spectrum can be made significantly narrower.
Thus, higher data rates can be transmitted in
the same bandwidth using GFSK.
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
13.17.7 Low Cost Systems
13.17.8 Battery Operated Systems
A differential antenna will eliminate the need
for a balun (see Figure 10, Figure 11, and
Figure 12). The CC25XX Folded Dipole
reference design [3] contains schematics and
layout files for a CC2500EM with a folded
dipole PCB antenna. This antenna design can
also be used by the CC2510Fx/CC2511Fx to
provide a low cost system. Please see DN004
[10] for more details on this design.
In low power applications, PM2 or PM3 should
be used when the CC2510Fx/CC2511Fx is not
active. The Sleep Timer can be used in PM2.
A HC-49 type SMD crystal is used in the
CC2510EM reference design [1]. Note that the
crystal package strongly influences the price.
In a size constrained PCB design a smaller,
but more expensive, crystal may be used.
13.17.9 Increasing Output Power
In some applications it may be necessary to
extend the link range. Adding an external
power amplifier is the most effective way of
doing this.
The power amplifier should be inserted
between the antenna and the balun, and two.
T/R switches are needed to disconnect the PA
in RX mode. See Figure 60
Antenna
Filter
PA
CC2510Fx /
Balun
T/R
switch
CC2511Fx
T/R
switch
Figure 60: Block Diagram of CC2510Fx/CC2511Fx Usage with External Power Amplifier
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
13.18 Radio Registers
This Section describes all RF registers used
for control and status for the radio.
0xDF2F: IOCFG2 - Radio Test Signal Configuration (P1_7)
Bit
Field Name
7
Reset
R/W
Description
-
R0
Not used
6
GDO2_INV
0
R/W
Invert output, i.e. select active low (1) / high (0)
5:0
GDO2_CFG[5:0]
000000
R/W
Debug output on P1_7 pin. See Table 73 for a description of internal
signals which can be output on this pin for debug purpose
0xDF30: IOCFG1 - Radio Test Signal Configuration (P1_6)
Bit
Field Name
Reset
R/W
Description
7
GDO_DS
0
R/W
Drive strength control for I/O pins in output mode. Selects output drive
capability to account for low I/O supply voltage VDD on pin DVDD
6
5:0
GDO1_INV
GDO1_CFG[5:0]
0
000000
R/W
R/W
0
Minimum drive capability. VDD equal or greater than 2.6 V
1
Maximum drive capability. VDD less than 2.6 V
Invert output
0
Active high
1
Active low
Debug output on P1_6 pin. See Table 73 for a description of internal
signals which can be output on this pin for debug purpose
0xDF31: IOCFG0 - Radio Test Signal Configuration (P1_5)
Bit
Field Name
7
Reset
R/W
Description
-
R0
Not used
6
GDO0_INV
0
R/W
Invert output, i.e. select active low (1) / high (0)
5:0
GDO0_CFG[5:0]
000000
R/W
Debug output on P1_5 pin. See Table 73 for a description of internal
signals which can be output on this pin for debug purpose.
0xDF00: SYNC1 - Sync Word, High Byte
Bit
Field Name
Reset
R/W
Description
7:0
SYNC[15:8]
0xD3
R/W
8 MSB of 16-bit sync word
0xDF01: SYNC0 - Sync Word, Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
SYNC[7:0]
0x91
R/W
8 LSB of 16-bit sync word
0xDF02: PKTLEN - Packet Length
Bit
Field Name
Reset
R/W
Description
7:0
PACKET_LENGTH
0xFF
R/W
Indicates the packet length when fixed length packets are enabled. If
variable length packets are used, this value indicates the maximum length
packets allowed
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF03: PKTCTRL1 - Packet Automation Control
Bit
Field Name
Reset
R/W
Description
7:5
PQT[2:0]
000
R/W
Preamble quality estimator threshold. The preamble quality estimator
increases an internal counter by one each time a bit is received that is
different from the previous bit, and decreases the counter by 8 each
time a bit is received that is the same as the last bit.
A threshold of 4∙PQT for this counter is used to gate sync word
detection. When PQT=0 a sync word is always accepted
4:3
-
R0
Not used
2
APPEND_STATUS
1
R/W
When enabled, two status bytes will be appended to the payload of the
packet. The status bytes contain RSSI and LQI values, as well as the
CRC OK flag
1:0
ADR_CHK[1:0]
00
R/W
Controls address check configuration of received packages.
00
No address check
01
Address check, no broadcast
10
Address check, 0 (0x00) broadcast
11
Address check, 0 (0x00) and 255 (0xFF) broadcast
0xDF04: PKTCTRL0 - Packet Automation Control
Bit
Field Name
7
6
5:4
3
2
1:0
WHITE_DATA
PKT_FORMAT[1:0]
CC2400_EN
CRC_EN
LENGTH_CONFIG[1:0]
Reset
R/W
Description
-
R0
Not used
1
R/W
Whitening enable. Data whitening can only be used when
PKTCTRL0.CC2400_EN=0 (default).
00
0
1
01
R/W
R/W
R/W
R/W
0
Disabled
1
Enabled
Packet format of RX and TX data
00
Normal mode
01
Reserved
10
Random TX mode; sends random data using PN9 generator.
Used for test.
Works as normal mode, setting 00, in RX.
11
Reserved
CC2400 support enable. Use same CRC implementation as CC2400.
The CC2400 CRC can only be used if PKTCTRL0.WHITE_DATA=0
0
Disable
1
Enable
CRC calculation in TX and CRC check in RX enable
0
Disable
1
Enable
Packet Length Configuration
00
Fixed packet length mode. Length configured in PKTLEN register
01
Variable packet length mode. Packet length configured by the
first byte after sync word
10
Reserved
11
Reserved
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF05: ADDR - Device Address
Bit
Field Name
Reset
R/W
Description
7:
0
DEVICE_ADDR[7:0]
0x00
R/W
Address used for packet filtration. Optional broadcast addresses are 0
(0x00) and 255 (0xFF).
0xDF06: CHANNR - Channel Number
Bit
Field Name
Reset
R/W
Description
7:
0
CHAN[7:0]
0x00
R/W
The 8-bit unsigned channel number, which is multiplied by the channel
spacing setting and added to the base frequency.
0xDF07: FSCTRL1 - Frequency Synthesizer Control
Bit
Reset
R/W
Description
7:
6
-
R0
Not used
5
0
R/W
Reserved
01111
R/W
The desired IF frequency to employ in RX. Subtracted from FS base
frequency in RX and controls the digital complex mixer in the
demodulator.
4:
0
Field Name
FREQ_IF[4:0]
f IF =
f ref
210
⋅ FREQ _ IF
The default value gives an IF frequency of 381 kHz when fRef = 26 MHz
and 352 kHz when fRef = 24 MHz.
0xDF08: FSCTRL0 - Frequency Synthesizer Control
Bit
Field Name
Reset
R/W
Description
7:
0
FREQOFF[7:0]
0x00
R/W
Frequency offset added to the base frequency before being used by the
FS. (2’s complement).
Resolution is fRef /214
Range is ±186 kHz to ±209 kHz for CC2510Fx and ±186 kHz for CC2511Fx
0xDF09: FREQ2 - Frequency Control Word, High Byte
Bit
Field Name
Reset
R/W
Description
7:6
FREQ[23:22]
01
R
FREQ[23:22]
5:0
FREQ[21:16]
011110
R/W
FREQ[23:0] is the base frequency for the frequency synthesizer in
increments of fRef /216.
f carrier =
f ref
216
⋅ FREQ[23 : 0]
0xDF0A: FREQ1 - Frequency Control Word, Middle Byte
Bit
Field Name
Reset
R/W
Description
7:0
FREQ[15:8]
11000100
R/W
Ref. FREQ2 register
0xDF0B: FREQ0 - Frequency Control Word, Low Byte
Bit
Field Name
Reset
R/W
Description
7:0
FREQ[7:0]
11101100
R/W
Ref. FREQ2 register
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF0C: MDMCFG4 - Modem configuration
Bit
Field Name
Reset
R/W
7:6
CHANBW_E[1:0]
10
R/W
5:4
CHANBW_M[1:0]
00
R/W
Description
Sets the decimation ratio for the delta-sigma ADC input stream and thus the
channel bandwidth.
BWchannel =
f ref
8 ⋅ (4 + CHANBW _ M )·2 CHANBW _ E
The default values give 203 kHz channel filter bandwidth when fRef = 26 MHz
and 188 kHz when fRef = 24 MHz.
3:0
DRATE_E[3:0]
1100
R/W
The exponent of the user specified symbol rate.
0xDF0D: MDMCFG3 - Modem Configuration
Bit
Field Name
Reset
R/W
Description
7:0
DRATE_M[7:0]
0x22
R/W
The mantissa of the user specified symbol rate. The symbol rate is configured
using an unsigned, floating-point number with 9-bit mantissa and 4-bit
exponent. The 9th bit is a hidden ‘1’. The resulting data rate is:
RDATA =
(256 + DRATE _ M ) ⋅ 2 DRATE _ E ⋅ f
2 28
ref
The default values give a data rate of 115.051 kBaud when fRef = 26 MHz and
106.201 kHz when fRef = 24 MHz.
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Page 211 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF0E: MDMCFG2 - Modem Configuration
Bit
Field Name
Reset
R/W
Description
7
DEM_DCFILT_OFF
0
R/W
Disable digital DC blocking filter before demodulator. The recommended IF
frequency changes when the DC blocking is disabled. Please use SmartRF
Studio [8] to calculate correct register setting.
6:4
MOD_FORMAT[2:0]
000
R/W
0
Enable
Better Sensitivity
1
Disable
Current optimized. Only for data rates ≤ 100 kBaud
The modulation format of the radio signal
000
2-FSK
001
GFSK
010
Reserved
011
Reserved
100
Reserved
101
Reserved
110
Reserved
111
MSK
Note that MSK is only supported for data rates above 26 kBaud and GFSK is
only supported for data rate up until 250 kBaud. MSK cannot be used if
Manchester encoding/decoding is enabled.
3
MANCHESTER_EN
0
R/W
Manchester encoding/decoding enable
0
Disable
1
Enable
Note that Manchester encoding/decoding cannot be used at the same time
as using the FEC/Interleaver option or when using MSK modulation.
2:0
SYNC_MODE[2:0]
010
R/W
Sync-word qualifier mode.
The values 000 and 100 disables preamble and sync word transmission in
TX and preamble and sync word detection in RX.
The values 001, 010, 101 and 110 enables 16-bit sync word transmission in
TX and 16-bits sync word detection in RX. Only 15 of 16 bits need to match
in RX when using setting 001 or 101. The values 011 and 111 enables
repeated sync word transmission in TX and 32-bits sync word detection in
RX (only 30 of 32 bits need to match).
000
No preamble/sync
001
15/16 sync word bits detected
010
16/16 sync word bits detected
011
30/32 sync word bits detected
100
No preamble/sync, carrier-sense above threshold
101
15/16 + carrier-sense above threshold
110
16/16 + carrier-sense above threshold
111
30/32 + carrier-sense above threshold
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF0F: MDMCFG1 - Modem Configuration
Bit
Field Name
Reset
R/W
Description
7
FEC_EN
0
R/W
Enable Forward Error Correction (FEC) with interleaving for packet
payload. FEC is only supported for fixed packet length mode, i.e.
PKTCTRL0.LENGTH_CONFIG=0
6:4
NUM_PREAMBLE[2:0]
3:2
1:0
CHANSPC_E[1:0]
010
R/W
0
Disable
1
Enable
Sets the minimum number of preamble bytes to be transmitted
000
2
001
3
010
4
011
6
100
8
101
12
110
16
111
24
-
R0
Not used
10
R/W
2 bit exponent of channel spacing
0xDF10: MDMCFG0 - Modem Configuration
Bit
Field Name
Reset
R/W
Description
7:0
CHANSPC_M[7:0]
0xF8
R/W
8-bit mantissa of channel spacing (initial 1 assumed). The channel
spacing is multiplied by the channel number CHAN and added to the base
frequency. It is unsigned and has the format:
∆f CHANNEL =
f ref
218
⋅ (256 + CHANSPC _ M ) ⋅ 2 CHANSPC _ E
The default values give 199.951 kHz channel spacing when fRef = 26
MHz and 184.570 kHz when fRef = 24 MHz.
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Page 213 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF11: DEVIATN - Modem Deviation Setting
Bit
Field Name
7
6:
4
DEVIATION_E[2:0]
3
2:
0
DEVIATION_M[2:0]
Reset
R/W
Description
-
R0
Not used
100
R/W
Deviation exponent
-
R0
Not used
111
R/W
TX
2-FSK/
GFSK
Specifies the nominal frequency deviation from the carrier
frequency for a ‘0’ (-DEVIATN) and a ‘1’ (+DEVIATN) in a
mantissa-exponent format. The resulting deviation is given by:
f dev =
f ref
217
⋅ (8 + DEVIATION _ M ) ⋅ 2 DEVIATION _ E
The default values give ±47.607 kHz deviation when
fRef = 26 MHz and 43.945 kHz when fRef = 24 MHz.
MSK
Specifies the fraction of a symbol period (1/8-8/8) during which a
phase change occurs (‘0’: +90deg, ‘1’: -90deg). Refer to the
SmartRF Studio software [8] for correct DEVIATN setting when
using MSK.
RX
2-FSK/
GFSK
Specifies the expected frequency deviation of incoming signal,
must be approximately right for demodulation to be performed
reliably and robustly
MSK
This settings has no effect
0xDF12: MCSM2 - Main Radio Control State Machine Configuration
Bit
Field Name
7:5
Reset
R/W
Description
-
R0
Not used
4
RX_TIME_RSSI
0
R/W
Direct RX termination based on RSSI measurement (carrier sense).
3
RX_TIME_QUAL
0
R/W
When the RX_TIME timer expires the chip stays in RX mode if sync word is
found when RX_TIME_QUAL=0, or either sync word is found or PQT is
reached when RX_TIME_QUAL=1.
2:0
RX_TIME[2:0]
111
R/W
Timeout for sync word search in RX. The timeout is relative to the
programmed tEvent0.
The RX timeout in µs is given by EVENT0·C(RX_TIME, WOR_RES) 26/X, where C is given by the table below and X is
the reference frequency (fRef) in MHz:
RX_TIME[2:0]
WOR_RES=0
WOR_RES=1
WOR_RES=2
WOR_RES=3
000
3.6058
18.0288
32.4519
46.8750
001
1.8029
9.0144
16.2260
23.4375
010
0.9014
4.5072
8.1130
11.7188
011
0.4507
2.2536
4.0565
5.8594
100
0.2254
1.1268
2.0282
2.9297
101
0.1127
0.5634
1.0141
1.4648
110
0.0563
0.2817
0.5071
0.7324
111
Until end of packet
As an example, EVENT0 = 34666, WOR_RES = 0 and RX_TIME = 6 corresponds to 1.96 ms RX timeout
SWRS055G
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CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF13: MCSM1 - Main Radio Control State Machine Configuration
Bit
Field Name
7:6
5:4
3:2
CCA_MODE[1:0]
RXOFF_MODE[1:0]
Reset
R/W
Description
-
R0
Not used
11
R/W
Selects CCA_MODE; Reflected in CCA signal
00
R/W
00
Always
01
If RSSI below threshold
10
Unless currently receiving a packet
11
If RSSI below threshold unless currently receiving a packet
Select what should happen (next state) when a packet has been received
00
IDLE
01
FSTXON
10
TX
11
Stay in RX
It is not possible to set RXOFF_MODE to be TX or FSTXON and at the same
time use CCA.
1:0
TXOFF_MODE[1:0]
00
R/W
Select what should happen (next state) when a packet has been sent (TX)
00
IDLE
01
FSTXON
10
Stay in TX (start sending preamble)
11
RX
0xDF14: MCSM0 - Main Radio Control State Machine Configuration
Bit
Field Name
7:6
5:4
3:0
FS_AUTOCAL[1:0]
Reset
R/W
Description
-
R0
Not used
00
R/W
Select calibration mode (when to calibrate)
0100
R/W
00
Never (manually calibrate using SCAL strobe)
01
When going from IDLE to RX or TX (or FSTXON)
10
When going from RX or TX back to IDLE automatically
11
Every 4th time when going from RX or TX to IDLE automatically
Reserved. Always set to 0100
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Page 215 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF15: FOCCFG - Frequency Offset Compensation Configuration
Bit
Field Name
Reset
R/W
Description
7
-
R0
Not used
6
1
R/W
Reserved. Always write 0
5
FOC_BS_CS_GATE
1
R/W
If set, the demodulator freezes the frequency offset compensation and
clock recovery feedback loops until the CARRIER_SENSE signal goes
high.
4:3
FOC_PRE_K[1:0]
10
R/W
The frequency compensation loop gain to be used before a sync word is
detected.
2
1:0
FOC_POST_K
FOC_LIMIT[1:0]
1
10
R/W
R/W
00
K
01
2K
10
3K
11
4K
The frequency compensation loop gain to be used after a sync word is
detected.
0
Same as FOC_PRE_K
1
K/2
The saturation point for the frequency offset compensation algorithm:
00
±0 (no frequency offset compensation)
01
±BWCHAN / 8
10
±BW CHAN / 4
11
±BW CHAN / 2
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Page 216 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF16: BSCFG - Bit Synchronization Configuration
Bit
Field Name
Reset
R/W
Description
7:6
BS_PRE_KI[1:0]
01
R/W
The clock recovery feedback loop integral gain to be used before a sync word
is detected (used to correct offsets in data rate):
5:4
3
2
1:0
BS_PRE_KP[1:0]
BS_POST_KI
BS_POST_KP
BS_LIMIT[1:0]
10
1
1
00
R/W
R/W
R/W
R/W
00
KI
01
2KI
10
3KI
11
4KI
The clock recovery feedback loop proportional gain to be used before a sync
word is detected
00
KP
01
2KP
10
3KP
11
4KP
The clock recovery feedback loop integral gain to be used after a sync word is
detected.
0
Same as BS_PRE_KI
1
KI /2
The clock recovery feedback loop proportional gain to be used after a sync
word is detected.
0
Same as BS_PRE_KP
1
KP
The saturation point for the data rate offset compensation algorithm:
00
±0 (No data rate offset compensation performed)
01
±3.125% data rate offset
10
±6.25% data rate offset
11
±12.5% data rate offset
SWRS055G
Page 217 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF17: AGCCTRL2 - AGC Control
Bit
Field Name
Reset
R/W
Description
7:6
MAX_DVGA_GAIN[1:0]
00
R/W
Reduces the maximum allowable DVGA gain.
5:3
2:0
MAX_LNA_GAIN[2:0]
MAGN_TARGET[2:0]
000
011
R/W
R/W
00
All gain settings can be used
01
The highest gain setting can not be used
10
The 2 highest gain settings can not be used
11
The 3 highest gain settings can not be used
Sets the maximum allowable LNA + LNA 2 gain relative to the
maximum possible gain.
000
Maximum possible LNA + LNA 2 gain
001
Approx. 2.6 dB below maximum possible gain
010
Approx. 6.1 dB below maximum possible gain
011
Approx. 7.4 dB below maximum possible gain
100
Approx. 9.2 dB below maximum possible gain
101
Approx. 11.5 dB below maximum possible gain
110
Approx. 14.6 dB below maximum possible gain
111
Approx. 17.1 dB below maximum possible gain
These bits set the target value for the averaged amplitude from the
digital channel filter (1 LSB = 0 dB).
000
24 dB
001
27 dB
010
30 dB
011
33 dB
100
36 dB
101
38 dB
110
40 dB
111
42 dB
SWRS055G
Page 218 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF18: AGCCTRL1 - AGC Control
Bit
Field Name
7
Reset
R/W
Description
-
R0
Not used
6
AGC_LNA_PRIORITY
1
R/W
Selects between two different strategies for LNA and LNA2
gain adjustment. When 1, the LNA gain is decreased first.
When 0, the LNA2 gain is decreased to minimum before
decreasing LNA gain.
5:4
CARRIER_SENSE_REL_THR[1:0]
00
R/W
Sets the relative change threshold for asserting carrier sense
3:0
CARRIER_SENSE_ABS_THR[3:0]
0000
R/W
00
Relative carrier sense threshold disabled
01
6 dB increase in RSSI value
10
10 dB increase in RSSI value
11
14 dB increase in RSSI value
Sets the absolute RSSI threshold for asserting carrier sense
(Equal to channel filter amplitude when AGC has not
decreased gain). The 2-complement signed threshold is
programmed in steps of 1 dB and is relative to the
MAGN_TARGET setting.
1000 (−8)
Absolute carrier sense threshold disabled
1001 (−7)
7 dB below MAGN_TARGET setting
…
…
1111 (−1)
1 dB below MAGN_TARGET setting
0000 (0)
At MAGN_TARGET setting
0001 (1)
1 dB above MAGN_TARGET setting
…
…
0111 (7)
7 dB above MAGN_TARGET setting
SWRS055G
Page 219 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF19: AGCCTRL0 - AGC Control
Bit
Field Name
Reset
R/W
Description
7:6
HYST_LEVEL[1:0]
10
R/W
Sets the level of hysteresis on the magnitude deviation
(internal AGC signal that determines gain changes).
5:4
3:2
1:0
WAIT_TIME[1:0]
AGC_FREEZE[1:0]
FILTER_LENGTH[1:0]
01
00
01
R/W
R/W
R/W
00
No hysteresis, small symmetric dead zone, high gain
01
Low hysteresis, small asymmetric dead zone, medium
gain
10
Medium hysteresis, medium asymmetric dead zone,
medium gain
11
Large hysteresis, large asymmetric dead zone, low gain
Sets the number of channel filter samples from a gain
adjustment has been made until the AGC algorithm starts
accumulating new samples.
00
8
01
16
10
24
11
32
Controls when the AGC gain should be frozen.
00
Normal operation. Always adjust gain when required.
01
The gain setting is frozen when a sync word has been
found.
10
Manually freeze the analog gain setting and continue to
adjust the digital gain.
11
Manually freezes both the analog and the digital gain
settings. Used for manually overriding the gain.
Sets the averaging length for the amplitude from the channel
filter. Please use the SmartRF Studio software [8] for
recommended settings.
00
8
01
16
10
32
11
64
0xDF1A: FREND1 - Front End RX Configuration
Bit
Field Name
Reset
R/W
Description
7:6
LNA_CURRENT[1:0]
01
R/W
Adjusts front-end LNA PTAT current output
5:4
LNA2MIX_CURRENT[1:0]
01
R/W
Adjusts front-end PTAT outputs
3:2
LODIV_BUF_CURRENT_RX[1:0]
01
R/W
Adjusts current in RX LO buffer (LO input to mixer)
1:0
MIX_CURRENT[1:0]
10
R/W
Adjusts current in mixer
SWRS055G
Page 220 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF1B: FREND0 - Front End TX Configuration
Bit
Field Name
Reset
R/W
Description
-
R0
Not used
01
R/W
Adjusts current TX LO buffer (input to PA). The value to use in
this field is given by the SmartRF Studio software [8].
3
-
R0
Not used
2:0
000
R/W
Reserved. Always set to 000
7:6
5:4
LODIV_BUF_CURRENT_TX[1:0]
0xDF1C: FSCAL3 - Frequency Synthesizer Calibration
Bit
Field Name
Reset
R/W
Description
7:6
FSCAL3[7:6]
10
R/W
Frequency synthesizer calibration configuration. The value to
write in this register before calibration is given by the
SmartRF Studio software [8].
5:4
CHP_CURR_CAL_EN[1:0]
10
R/W
Disable charge pump calibration stage when 0
3:0
FSCAL3[3:0]
1001
R/W
Frequency synthesizer calibration result register. Digital bit
vector defining the charge pump output current, on an
exponential scale: IOUT=I0·2FSCAL3[3:0]/4
Fast frequency hopping without calibration for each hop can be
done by calibrating upfront for each frequency and saving the
resulting FSCAL3, FSCAL2 and FSCAL1 register values.
Between each frequency hop, calibration can be replaced by
writing the FSCAL3, FSCAL2 and FSCAL1 register values
corresponding to the next RF frequency.
Note: This register will be in its reset state when returning to active mode from PM2 and PM3.
0xDF1D: FSCAL2 - Frequency Synthesizer Calibration
Bit
Field Name
7:6
5
4:0
VCO_CORE_H_EN
FSCAL2[4:0]
Reset
R/W
Description
-
R0
Not used
0
R/W
Select VCO
01010
R/W
0
Low.
1
High. Note that High VCO is not intended for use
Frequency synthesizer calibration result register. VCO current
calibration result and override value
Fast frequency hopping without calibration for each hop can be
done by calibrating upfront for each frequency and saving the
resulting FSCAL3, FSCAL2 and FSCAL1 register values.
Between each frequency hop, calibration can be replaced by
writing the FSCAL3, FSCAL2 and FSCAL1 register values
corresponding to the next RF frequency.
Note: This register will be in its reset state when returning to active mode from PM2 and PM3.
SWRS055G
Page 221 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF1E: FSCAL1 - Frequency Synthesizer Calibration
Bit
Field Name
7:6
5:0
FSCAL1[5:0]
Reset
R/W
Description
-
R0
Not used
100000
R/W
Frequency synthesizer calibration result register. Capacitor array setting
for VCO coarse tuning.
Fast frequency hopping without calibration for each hop can be done by
calibrating upfront for each frequency and saving the resulting FSCAL3,
FSCAL2 and FSCAL1 register values. Between each frequency hop,
calibration can be replaced by writing the FSCAL3, FSCAL2 and FSCAL1
register values corresponding to the next RF frequency.
Note: This register will be in its reset state when returning to active mode from PM2 and PM3.
0xDF1F: FSCAL0 - Frequency Synthesizer Calibration
Bit
Field Name
7
6:0
FSCAL0[6:0]
Reset
R/W
Description
-
R0
Not used
0001101
R/W
Frequency synthesizer calibration control. The value to use in this register
is given by the SmartRF Studio software [8].
0xDF23: TEST2 – Various Test Settings
Bit
Field Name
Reset
R/W
Description
7:0
TEST2[7:0]
0x88
R/W
For improved sensitivity at low data rates (≤100 kBaud) this register can be
written to 0x81. The temperature range is then from 0oC to 85oC.
0xDF24: TEST1 – Various Test Settings
Bit
Field Name
Reset
R/W
Description
7:0
TEST1[7:0]
0x11
R/W
Must be written to 0x31.
For improved sensitivity at low data rates (≤100 kbps) this register can be
written to 0x35.The temperature range is then from 0oC to 85oC.
0xDF25: TEST0 - Various Test Settings
Bit
Field Name
Reset
R/W
Description
7:2
TEST0[7:2]
000010
R/W
The value to use in this register is given by the SmartRF Studio software
[8].
1
VCO_SEL_CAL_EN
1
R/W
Enable VCO selection calibration stage when 1
0
TEST0[0]
1
R/W
The value to use in this register is given by the SmartRF Studio software
[8].
0xDF2E: PA_TABLE0 - PA Power Setting
Bit
Field Name
Reset
R/W
Description
7:0
PA_TABLE0[7:0]
0x00
R/W
Power amplifier output power setting
SWRS055G
Page 222 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF36: PARTNUM - Chip ID[15:8]
Bit
Field Name
Reset
R/W
Description
7:0
PARTNUM[7:0]
0x81 CC2510Fx
0x91 CC2511Fx
R
Chip part number
0xDF37: VERSION - Chip ID[7:0]
Bit
Field Name
Reset
R/W
Description
7:0
VERSION[7:0]
0x04
R
Chip version number.
0xDF38: FREQEST - Frequency Offset Estimate from Demodulator
Bit
Field Name
Reset
R/W
Description
7:0
FREQOFF_EST
0x00
R
The estimated frequency offset (2’s complement) of the carrier.
Resolution is fRef/214
Range is ±186 kHz to ±209 kHz for CC2510Fx and ±186 kHz for
CC2511Fx
0xDF39: LQI - Demodulator Estimate for Link Quality
Bit
Field Name
Reset
R/W
Description
7
CRC_OK
0
R
The last CRC comparison matched. Cleared when
entering/restarting RX mode. Only valid if
PKTCTRL0.CC2400_EN=1. This bit will be 1 if CRC check is
disabled (PKTCTRL0.CRC_EN=0)
6:0
LQI_EST[6:0]
0000000
R
The Link Quality Indicator estimates how easily a received signal can
be demodulated. Calculated over the 64 symbols following the sync
word.
0xDF3A: RSSI - Received Signal Strength Indication
Bit
Field Name
Reset
R/W
Description
7:0
RSSI
0x80
R
Received signal strength indicator
SWRS055G
Page 223 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF3B: MARCSTATE - Main Radio Control State Machine State
Bit
Field Name
7:5
4:0
MARC_STATE[4:0]
Reset
R/W
Description
-
R0
Not used
0001
R
Main Radio Control FSM State
Value
State Name
State (Figure 54, Page 199)
00000
SLEEP
SLEEP
00001
IDLE
IDLE
00010
Not Used
00011
VCOON_MC
MANCAL
00100
REGON_MC
MANCAL
00101
MANCAL
MANCAL
00110
VCOON
FS_WAKEUP
00111
REGON
FS_WAKEUP
01000
STARTCAL
CALIBRATE
01001
BWBOOST
SETTLING
01010
FS_LOCK
SETTLING
01011
IFADCON
SETTLING
01100
ENDCAL
CALIBRATE
01101
RX
RX
01110
RX_END
RX
01111
RX_RST
RX
10000
TXRX_SWITCH
TXRX_SETTLING
10001
RX_OVERFLOW
RX_OVERFLOW
10010
FSTXON
FSTXON
10011
TX
TX
10100
TX_END
TX
10101
RXTX_SWITCH
RXTX_SETTLING
10110
TX_UNDERFLOW
TX_UNDERFLOW
SWRS055G
Page 224 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF3C: PKTSTATUS - Packet Status
Bit
Field Name
Reset
R/W
Description
7
CRC_OK
0
R
The last CRC comparison matched. Cleared when entering/restarting RX
mode.
6
CS
0
R
Carrier sense
5
PQT_REACHED
0
R
Preamble Quality reached
4
CCA
0
R
Channel is clear
3
SFD
0
R
Asserted when sync word has been sent / received, and de-asserted at the
end of the packet. In RX, this bit will de-assert when the optional address
check fails or the radio enter RX_OVERFLOW state. In TX this bit will deassert if the radio enters TX_UNDERFLOW state.
-
R0
Not used
2:0
0xDF3D: VCO_VC_DAC - Current Setting from PLL Calibration Module
Bit
Field Name
Reset
R/W
Description
7:0
VCO_VC_DAC[7:0]
0x94
R
Status register for test only.
SWRS055G
Page 225 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
14
Voltage Regulators
The CC2510Fx/CC2511Fx includes a low drop-out
voltage regulator. This is used to provide a 1.8
V power supply to the CC2510Fx/CC2511Fx digital
power supply. The voltage regulator should not
be used to provide power to external circuits
because of limited power sourcing capability
and also due to noise considerations.
The voltage regulator input pin AVDD_DREG is
to be connected to the unregulated 2.0 V to 3.6
V power supply. The output of the digital
regulator is connected internally in the
CC2510Fx/CC2511Fx to the digital power supply.
The voltage regulator requires an external
decoupling capacitor connected to the DCOUPL
pin as described in Section 9 on Page 33.
14.1 Voltage Regulator Power-on
The voltage regulator is disabled when the
CC2510Fx/CC2511Fx is placed in power modes
PM2 or PM3 (see Section 12.1). When the
15
voltage regulator is disabled, register and RAM
contents will be retained while the unregulated
2.0 V - 3.6 V power supply is present.
Radio Test Output Signals
For debug and test purposes, a number of
internal status signals in the radio may be
output on the port pins P1_7 - P1_5. This
debug option is controlled through the RF
registers IOCFG2 - IOCFG0. Table 73 shows
the value written to IOCFGx.GDOx_CFG[5:0]
with the corresponding internal signals that will
be output in each case.
Setting IOCFGx.GDOx_CFG to a value other
than 0 will override the P1SEL_SELP1_7,
P1SEL_SELP1_6,
and
P1SEL_SELP1_5
settings, and the pins will automatically
become outputs.
SWRS055G
Page 226 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
GDO0_CFG[5:0]
GDO1_CFG[5:0]
GDO2_CFG[5:0]
Description
000000
The pin is configured according to the I/O registers. See 12.4.7
000001 - 000111
Reserved
001000
Preamble Quality Reached. Asserts when the PQI is above the programmed PQT value.
001001
Clear channel assessment. High when RSSI level is below threshold (dependent on the current
CCA_MODE setting)
001010 - 001101
Reserved
001110
Carrier sense. High if RSSI level is above threshold.
001111
CRC_OK. The last CRC comparison matched. Cleared when entering/restarting RX mode.
010000 - 010101
Reserved
010110
RX_HARD_DATA[1]. Can be used together with RX_SYMBOL_TICK for alternative serial RX output
010111
RX_HARD_DATA[0]. Can be used together with RX_SYMBOL_TICK for alternative serial RX output
011000 - 011010
Reserved
011011
PA_PD. Can be used to control an external PA or RX/TX switch. Signal is asserted when the radio
enters TX state and de-asserted when the radio exits TX state. The signal is active low
011100
LNA_PD. Can be used to control an external LNA or RX/TX switch. Signal is asserted when the radio
enters RX state and de-asserted when the radio exits RX state. The signal is active low
011101
RX_SYMBOL_TICK. Can be used together with RX_HARD_DATA for alternative serial RX output.
011110 - 101110
Reserved
101111
HW to 0 (HW1 achieved by setting GDOx_INV=1). Can be used to control an external LNA/PA or
RX/TX switch.
110000 - 111111
Reserved
Table 73: Radio Test Output Signals
SWRS055G
Page 227 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
16
Register Overview
MPAGE (0x93) - Memory Page Select ....................................................................................50
MEMCTR (0xC7) - Memory Arbiter Control..........................................................................51
DPH0 (0x83) - Data Pointer 0 High Byte ................................................................................51
DPL0 (0x82) - Data Pointer 0 Low Byte..................................................................................51
DPH1 (0x85) - Data Pointer 1 High Byte ................................................................................51
DPL1 (0x84) - Data Pointer 1 Low Byte..................................................................................51
DPS (0x92) - Data Pointer Select .............................................................................................52
PSW (0xD0) - Program Status Word .......................................................................................52
ACC (0xE0) - Accumulator .....................................................................................................53
B (0xF0) - B Register ...............................................................................................................53
SP (0x81) - Stack Pointer .........................................................................................................53
IEN1 (0xB8) - Interrupt Enable 1 Register ..............................................................................60
IEN2 (0x9A) - Interrupt Enable 2 Register ..............................................................................61
TCON (0x88) - CPU Interrupt Flag 1 ......................................................................................62
S0CON (0x98) - CPU Interrupt Flag 2.....................................................................................63
S1CON (0x9B) - CPU Interrupt Flag 3 ....................................................................................63
IRCON (0xC0) - CPU Interrupt Flag 4 ....................................................................................64
IRCON2 (0xE8) - CPU Interrupt Flag 5 ..................................................................................65
IP1 (0xB9) - Interrupt Priority 1...............................................................................................65
IP0 (0xA9) - Interrupt Priority 0 ..............................................................................................66
PCON (0x87) - Power Mode Control.......................................................................................75
SLEEP (0xBE) - Sleep Mode Control ......................................................................................76
CLKCON (0xC6) - Clock Control ...........................................................................................79
FCTL (0xAE) - Flash Control ..................................................................................................86
FWDATA (0xAF) - Flash Write Data .....................................................................................86
FADDRH (0xAD) - Flash Address High Byte.........................................................................86
FADDRL (0xAC) - Flash Address Low Byte ..........................................................................86
FWT (0xAB) - Flash Write Timing .........................................................................................86
P0 (0x80) - Port 0 .....................................................................................................................92
P1 (0x90) - Port 1 .....................................................................................................................92
P2 (0xA0) - Port 2 ....................................................................................................................92
PERCFG (0xF1) - Peripheral Control ......................................................................................92
ADCCFG (0xF2) - ADC Input Configuration .........................................................................93
P0SEL (0xF3) - Port 0 Function Select ....................................................................................93
P1SEL (0xF4) - Port 1 Function Select ....................................................................................93
P2SEL (0xF5) - Port 2 Function Select ....................................................................................94
P0DIR (0xFD) - Port 0 Direction .............................................................................................95
P1DIR (0xFE) - Port 1 Direction .............................................................................................95
P2DIR (0xFF) - Port 2 Direction ..............................................................................................95
P0INP (0x8F) - Port 0 Input Mode ...........................................................................................95
P1INP (0xF6) - Port 1 Input Mode ...........................................................................................95
P2INP (0xF7) - Port 2 Input Mode ...........................................................................................96
P0IFG (0x89) - Port 0 Interrupt Status Flag .............................................................................96
P1IFG (0x8A) - Port 1 Interrupt Status Flag ............................................................................96
P2IFG (0x8B) - Port 2 Interrupt Status Flag ............................................................................96
PICTL (0x8C) - Port Interrupt Control ....................................................................................97
P1IEN (0x8D) - Port 1 Interrupt Mask .....................................................................................97
DMAARM (0xD6) - DMA Channel Arm ..............................................................................106
DMAREQ (0xD7) - DMA Channel Start Request and Status ...............................................107
DMA0CFGH (0xD5) - DMA Channel 0 Configuration Address High Byte.........................107
DMA0CFGL (0xD4) - DMA Channel 0 Configuration Address Low Byte ..........................107
DMA1CFGH (0xD3) - DMA Channel 1 - 4 Configuration Address High Byte ...................107
SWRS055G
Page 228 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
DMA1CFGL (0xD2) - DMA Channel 1 - 4 Configuration Address Low Byte ....................107
DMAIRQ (0xD1) - DMA Interrupt Flag................................................................................108
ENDIAN (0x95) - USB Endianess Control (CC2511Fx) .........................................................108
T1CNTH (0xE3) - Timer 1 Counter High..............................................................................117
T1CNTL (0xE2) - Timer 1 Counter Low ...............................................................................117
T1CTL (0xE4) - Timer 1 Control and Status .........................................................................117
T1CCTL0 (0xE5) - Timer 1 Channel 0 Capture/Compare Control .......................................118
T1CC0H (0xDB) - Timer 1 Channel 0 Capture/Compare Value High ..................................118
T1CC0L (0xDA) - Timer 1 Channel 0 Capture/Compare Value Low ...................................118
T1CCTL1 (0xE6) - Timer 1 Channel 1 Capture/Compare Control .......................................119
T1CC1H (0xDD) - Timer 1 Channel 1 Capture/Compare Value High..................................119
T1CC1L (0xDC) - Timer 1 Channel 1 Capture/Compare Value Low ...................................119
T1CCTL2 (0xE7) - Timer 1 Channel 2 Capture/Compare Control .......................................120
T1CC2H (0xDF) - Timer 1 Channel 2 Capture/Compare Value High ..................................120
T1CC2L (0xDE) - Timer 1 Channel 2 Capture/Compare Value Low ...................................120
T2CTL (0x9E) - Timer 2 Control...........................................................................................122
T2CT (0x9C) - Timer 2 Count ...............................................................................................122
T2PR (0x9D) - Timer 2 Prescaler ..........................................................................................122
WORTIME0 (0xA5) - Sleep Timer Low Byte.......................................................................124
WORTIME1 (0xA6) - Sleep Timer High Byte ......................................................................125
WOREVT1 (0xA4) - Sleep Timer Event0 Timeout High......................................................125
WOREVT0 (0xA3) - Sleep Timer Event0 Timeout Low ......................................................125
WORCTRL (0xA2) - Sleep Timer Control ............................................................................125
WORIRQ (0xA1) - Sleep Timer Interrupt Control ................................................................125
T3CNT (0xCA) - Timer 3 Counter ........................................................................................129
T3CTL (0xCB) - Timer 3 Control ..........................................................................................130
T3CCTL0 (0xCC) - Timer 3 Channel 0 Compare Control ....................................................131
T3CC0 (0xCD) - Timer 3 Channel 0 Compare Value ...........................................................131
T3CCTL1 (0xCE) - Timer 3 Channel 1 Compare Control ....................................................132
T3CC1 (0xCF) - Timer 3 Channel 1 Compare Value ............................................................132
T4CNT (0xEA) - Timer 4 Counter.........................................................................................132
T4CTL (0xEB) - Timer 4 Control ..........................................................................................133
T4CCTL0 (0xEC) - Timer 4 Channel 0 Compare Control ....................................................134
T4CC0 (0xED) - Timer 4 Channel 0 Compare Value ............................................................134
T4CCTL1 (0xEE) - Timer 4 Channel 1 Compare Control.....................................................135
T4CC1 (0xEF) - Timer 4 Channel 1 Compare Value ............................................................135
TIMIF (0xD8) - Timers 1/3/4 Interrupt Mask/Flag ................................................................136
ADCL (0xBA) - ADC Data Low ...........................................................................................140
ADCH (0xBB) - ADC Data High ..........................................................................................140
ADCCON1 (0xB4) - ADC Control 1 .....................................................................................140
ADCCON2 (0xB5) - ADC Control 2 .....................................................................................141
ADCCON3 (0xB6) - ADC Control 3 .....................................................................................142
RNDL (0xBC) - Random Number Generator Data Low Byte ...............................................144
RNDH (0xBD) - Random Number Generator Data High Byte..............................................144
ENCCS (0xB3) - Encryption Control and Status ...................................................................146
ENCDI (0xB1) - Encryption Input Data ................................................................................146
ENCDO (0xB2) - Encryption Output Data ............................................................................146
WDCTL (0xC9) - Watchdog Timer Control ..........................................................................148
U0CSR (0x86) - USART 0 Control and Status ......................................................................154
U0UCR (0xC4) - USART 0 UART Control ..........................................................................155
U0GCR (0xC5) - USART 0 Generic Control ........................................................................156
U0DBUF (0xC1) - USART 0 Receive/Transmit Data Buffer ...............................................156
U0BAUD (0xC2) - USART 0 Baud Rate Control .................................................................156
U1CSR (0xF8) - USART 1 Control and Status......................................................................157
SWRS055G
Page 229 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
U1UCR (0xFB) - USART 1 UART Control ..........................................................................158
U1GCR (0xFC) - USART 1 Generic Control ........................................................................158
U1DBUF (0xF9) - USART 1 Receive/Transmit Data Buffer ................................................159
U1BAUD (0xFA) - USART 1 Baud Rate Control.................................................................159
0xDF40: I2SCFG0 - I2S Configuration Register 0.................................................................164
0xDF41: I2SCFG1 - I2S Configuration Register 1.................................................................165
0xDF42: I2SDATL - I2S Data Low Byte ...............................................................................165
0xDF43: I2SDATH - I2S Data High Byte ..............................................................................165
0xDF44: I2SWCNT - I2S Word Count Register ....................................................................165
0xDF45: I2SSTAT - I2S Status Register ................................................................................166
0xDF46: I2SCLKF0 - I2S Clock Configuration Register 0....................................................166
0xDF47: I2SCLKF1 - I2S Clock Configuration Register 1....................................................166
0xDF48: I2SCLKF2 - I2S Clock Configuration Register 2....................................................166
0xDE00: USBADDR - Function Address ..............................................................................176
0xDE01: USBPOW - Power/Control Register .......................................................................176
0xDE02: USBIIF - IN Endpoints and EP0 Interrupt Flags ....................................................176
0xDE04: USBOIF - Out Endpoints Interrupt Flags ...............................................................176
0xDE06: USBCIF - Common USB Interrupt Flags ...............................................................177
0xDE07: USBIIE - IN Endpoints and EP0 Interrupt Enable Mask........................................177
0xDE09: USBOIE - Out Endpoints Interrupt Enable Mask ...................................................178
0xDE0B: USBCIE - Common USB Interrupt Enable Mask ..................................................178
0xDE0C: USBFRML - Current Frame Number (Low byte)..................................................178
0xDE0D: USBFRMH - Current Frame Number (High byte) ................................................179
0xDE0E: USBINDEX - Current Endpoint Index Register ....................................................179
0xDE10: USBMAXI - Max. Packet Size for IN Endpoint{1 - 5} .........................................179
0xDE11: USBCS0 - EP0 Control and Status (USBINDEX=0)..............................................179
0xDE11: USBCSIL - IN EP{1 - 5} Control and Status Low .................................................180
0xDE12: USBCSIH - IN EP{1 - 5} Control and Status High ................................................180
0xDE13: USBMAXO - Max. Packet Size for OUT{1 - 5} Endpoint ....................................180
0xDE14: USBCSOL - OUT EP{1 - 5} Control and Status Low ...........................................181
0xDE15: USBCSOH - OUT EP{1 - 5} Control and Status High ..........................................181
0xDE16: USBCNT0 - Number of Received Bytes in EP0 FIFO (USBINDEX=0) ...............181
0xDE16: USBCNTL - Number of Bytes in EP{1 – 5} OUT FIFO Low ...............................181
0xDE17: USBCNTH - Number of Bytes in EP{1 – 5} OUT FIFO High ..............................182
0xDE20: USBF0 - Endpoint 0 FIFO ......................................................................................182
0xDE22: USBF1 - Endpoint 1 FIFO ......................................................................................182
0xDE24: USBF2 - Endpoint 2 FIFO ......................................................................................182
0xDE26: USBF3 - Endpoint 3 FIFO ......................................................................................182
0xDE28: USBF4 - Endpoint 4 FIFO ......................................................................................182
0xDE2A: USBF5 - Endpoint 5 FIFO .....................................................................................182
RFIF (0xE9) - RF Interrupt Flags...........................................................................................186
RFIM (0x91) - RF Interrupt Mask .........................................................................................187
0xDF2F: IOCFG2 - Radio Test Signal Configuration (P1_7) ...............................................208
0xDF30: IOCFG1 - Radio Test Signal Configuration (P1_6)................................................208
0xDF31: IOCFG0 - Radio Test Signal Configuration (P1_5)................................................208
0xDF00: SYNC1 - Sync Word, High Byte ............................................................................208
0xDF01: SYNC0 - Sync Word, Low Byte .............................................................................208
0xDF02: PKTLEN - Packet Length .......................................................................................208
0xDF03: PKTCTRL1 - Packet Automation Control ..............................................................209
0xDF04: PKTCTRL0 - Packet Automation Control ..............................................................209
0xDF05: ADDR - Device Address .........................................................................................210
0xDF06: CHANNR - Channel Number .................................................................................210
0xDF07: FSCTRL1 - Frequency Synthesizer Control ...........................................................210
0xDF08: FSCTRL0 - Frequency Synthesizer Control ...........................................................210
SWRS055G
Page 230 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
0xDF09: FREQ2 - Frequency Control Word, High Byte.......................................................210
0xDF0A: FREQ1 - Frequency Control Word, Middle Byte ..................................................210
0xDF0B: FREQ0 - Frequency Control Word, Low Byte.......................................................210
0xDF0C: MDMCFG4 - Modem configuration ......................................................................211
0xDF0D: MDMCFG3 - Modem Configuration .....................................................................211
0xDF0E: MDMCFG2 - Modem Configuration .....................................................................212
0xDF0F: MDMCFG1 - Modem Configuration......................................................................213
0xDF10: MDMCFG0 - Modem Configuration ......................................................................213
0xDF11: DEVIATN - Modem Deviation Setting ..................................................................214
0xDF12: MCSM2 - Main Radio Control State Machine Configuration ................................214
0xDF13: MCSM1 - Main Radio Control State Machine Configuration ................................215
0xDF14: MCSM0 - Main Radio Control State Machine Configuration ................................215
0xDF15: FOCCFG - Frequency Offset Compensation Configuration...................................216
0xDF16: BSCFG - Bit Synchronization Configuration .........................................................217
0xDF17: AGCCTRL2 - AGC Control ...................................................................................218
0xDF18: AGCCTRL1 - AGC Control ...................................................................................219
0xDF19: AGCCTRL0 - AGC Control ...................................................................................220
0xDF1A: FREND1 - Front End RX Configuration ...............................................................220
0xDF1B: FREND0 - Front End TX Configuration ................................................................221
0xDF1C: FSCAL3 - Frequency Synthesizer Calibration .......................................................221
0xDF1D: FSCAL2 - Frequency Synthesizer Calibration .......................................................221
0xDF1E: FSCAL1 - Frequency Synthesizer Calibration .......................................................222
0xDF1F: FSCAL0 - Frequency Synthesizer Calibration .......................................................222
0xDF23: TEST2 – Various Test Settings ...............................................................................222
0xDF24: TEST1 – Various Test Settings ...............................................................................222
0xDF25: TEST0 - Various Test Settings................................................................................222
0xDF2E: PA_TABLE0 - PA Power Setting ..........................................................................222
0xDF36: PARTNUM - Chip ID[15:8] ...................................................................................223
0xDF37: VERSION - Chip ID[7:0] .......................................................................................223
0xDF38: FREQEST - Frequency Offset Estimate from Demodulator...................................223
0xDF39: LQI - Demodulator Estimate for Link Quality........................................................223
0xDF3A: RSSI - Received Signal Strength Indication ..........................................................223
0xDF3B: MARCSTATE - Main Radio Control State Machine State....................................224
0xDF3C: PKTSTATUS - Packet Status .................................................................................225
0xDF3D: VCO_VC_DAC - Current Setting from PLL Calibration Module.........................225
SWRS055G
Page 231 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
17
References
[1]
CC2510EM Reference Design (swrr035.zip)
[2]
CC2511 USB-Dongle Reference Design (swrc062.zip)
[3]
CC25XX Folded Dipole Reference Design (swrc065.zip)
[4]
NIST FIPS Pub 197: Advanced Encryption Standard (AES), Federal Information
Processing Standards Publication 197, US Department of Commerce/N.I.S.T., November
26, 2001. Available from the NIST website.
http://csrc.nist.gov/publications/fips/fips197/fips-197.pdf
[5]
Universal Serial Bus Revision 2.0 Specification. Available from the USB Implementers
Forum website.
http://www.usb.org/developers/docs/
[6]
2
I S bus specification, Philips Semiconductors, Available from the Philips Semiconductors
website.
http://www.semiconductors.philips.com/acrobat_download/various/I2SBUS.pdf
[7]
IEEE Std 1241-2000, IEEE standard for terminology and test methods for analog-to-digital
converters.
[8]
SmartRF Studio (swrc046.zip)
[9]
AN032 2.4 GHz Regulations (swra060.pdf)
[10]
DN004 Folded Dipole Antenna for CCC25xx (swra118.pdf)
[11]
DN110 State Transition Times on CC111xFx and CC251xFx (swra191.pdf)
[12]
DN505 RSSI Interpretation and Timing (swra114.pdf)
®
SWRS055G
Page 232 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
18
General Information
18.1 Document History
Revision
Date
Description/Changes
1.0
2005.11.17
First release, preliminary
1.01
2006.05.11
Preliminary status updated
SWRS055
2006.05.30
CC2511Fx, CC2510F8 and CC2510F16 added to datasheet.
SWRS055A
2006.07.06
Changed recommended PCB layout for package (QFN 36)
SWRS055B
2007.09.14
First data sheet for released product.
Preliminary data sheets exist for engineering samples and pre-production
prototype devices, but these data sheets are not complete and may be incorrect in some
aspects compared with the released product.
SWRS055C
2007.09.19
- Removed CC2511 waiver information
- Changed layout on front page slightly and listing of abbreviations
- Changed register FREQEST and FSCTRL0 max range from ±20910 to ±209
- Removed ppm requirement in Table 13 on Page 17
- Added power numbers for RX (Table 6) when using other system clock speeds.
- Added Section 12.1.5.2, describing limitations in data rates and system clock speed
SWRS055D
2007.09.20
- Stated in Section 2.8 that duty-cycling or reduced output power might be needed at 2480 2483.5 MHz when operating under FCC
- Stated that High VCO is not intended for use in the FSCAL2 register
SWRS055G
Page 233 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Revision
Date
Description/Changes
SWRS055E
2007.11.23
- TX power consumption @ 2.4 kBaud, −6 dBm output power changed to 16 mA on front
page
- 2.1: Added info saying that CC2510Fx/CC2511Fx is SW compatible with CC1110Fx/CC1111Fx
- Table 11: Added Power Down Guard Time
- Made consistent use of VDD for power with reference to power pin if so needed
- Table 19: Corrected HS RCOSC settings for CC2511Fx
- Table 28: C241 replaced by C242
- Table 29: Added manufacturer. Changed R264 to 1.5 kΩ ± 1%
- Replaced Figure 14, Figure 15, and Figure 16 to correct error in address ranges
- Corrected unimplemented RAM range in Section 10.2.3.1
- Table 32: Changed name on registers from AGCTRLn to AGCCTRLn (n = 0, 1, 2), Changed
name on PKTSTATUS register and chip ID range
-Table 37: Added footer explaining opcode for ACALL and AJMP
- 10.5.1: Added note emphasizing that an interrupt must not be enabled without having proper
code located at the corresponding interrupt vector address.
- 10.5.2: Changes made to code example.
- Updated Sections 12.1.3, 12.1.5.1, and 12.1.5.3 with information about system clock source
change, and rewritten info about calibration in Section 12.1.5.3
- 12.1.5.1 and 12.1.7: Added info regarding retention of HS RCOSC calibration result.
- 12.1.5.2: Rewritten to improve readability
- CLKCON.OSC bit. Changed description. It is not longer necessary to set SLEEP.OSC_PD=0
to power up the HS crystal oscillator.
- Rewrote RAM range in Section 12.3.2
- Stated that P1_0 and P1_1 does not have pull capability in register P2INP
- 12.5: Chapter rewritten to be more consistent in the use of the terms “transfer” and “transfer
count”. Added new info regarding the LEN setting. Changes made to Figure 26 and Figure 27
- 12.6.2.1 and 12.6.2.2: Emphasized that the timer wraps around/is loaded with 0x0000 on the
next timer tick after the terminal count value is reached
- 12.8.2: Changed heading text and updated info about power modes. Changed code
examples.
- Fixed bit range for register FADDRH and stated that register WORTIME0 and WORTIME1
defines a combined 16 bit word (WORTIME)
- Replaced all occurrences of WORCTL with WORCTRL
- 12.8.4: Added more detailed info about interrupt and associated flag
12.9.2.1 and 12.9.2.2: Emphasized that the timer wraps around/is loaded with 0x00 on the
next timer tick after the terminal count value is reached
- USBCIF.RESUMIF changed to USBCIF.RESUMEIF several places in the document
Figure 49: Corrected code example
- 13.11.2: - Corrected received symbol write and read location. Added note saying that when
FEC is used, CLKCON.CLKSPD must be 000
- Added note in MDMCFG2 register saying that MSK is only supported for data rates above 26
kBaud and GFSK is only supported for data rate up until 250 kBaud.
SWRS055G
Page 234 of 236
CC2511F8 - Not Recommended for New Designs
CC2510Fx / CC2511Fx
Revision
Date
Description/Changes
SWRS055F
2008.07.11
- Changed description of T1CCTL1.MODE bit.
- UxGDR changed to UxGCR several places in the document
- Changed FREQ2.FREQ[21:16] reset value from 11110 to 011110
- Added changes to the DEVIATN register, and added also info regarding the same register to
section 13.9.1 and 13.9.2
- 12.14.2.2: Changed description of the UxCSR.ACTIVE bit
- 12.8: Added note stating that the Sleep timer should not be used in active mode. This info
has in earlier edition only been available in section 8.1
- Table 11: Text changed from “For operation in the range 24 - 26 MHz, please refer to Table
4 for Operating Conditions” to “For operation below 26 MHz, please refer to Table 4 for
Operating Conditions”
- Added section 9.4: Reference Signal
- Table 57 and Table 58: Fsck changed to Fs
- 12.8.1: WOREVT1 = desired event0; changed to WOREVT1 = desired event0 >> 8;
- Table 39: Added footnote saying that the Sleep Timer compare interrupt has additional
interrupt mask bits and interrupt flags found in its SFRs
- Updated Figure 26
- Changed the description of PKTSTATUS.SFD
- MCSM0.FS_AUTOCAL=1 changed to MCSM0.FS_AUTOCAL=01 and MCSM0.FS_AUTOCAL=0
changed to MCSM0.FS_AUTOCAL=00 throughout the document
- 13.1: Added note about SIDLE strobe
- Table 16, Table 71, and Section 13.17: Changed the state transition timing
- 13.10.3: Added reference to DN505 [12] regarding RSSI response time.
- Changes made to the description of I2SCFG0.ULAWE and I2SCFG0.ULAWC
- Section 13.9 and 13.9.2 and MDMCFG2 register: Added info saying that Manchester
encoding/decoding should not be used when using MSK modulation.
- Table 11: Changes done to the condition/note on Power Down Guard Time
- Added Section 6.11.1 (info regarding the RESET_N pin being sensitive to noise)
- Changes made to the ADCCON1 register.
- Changes made to Section 12.11.2.1 regarding how to generate pseudo-random bytes.
- Section 13.3.1.1: Added note explaining how the RFTXRXIF flag should be cleared when it
is not cleared by HW.
- The drive strength for I/O pins in output mode is not controlled by the PICTL register but by
IOCFG1.GDO_DS. This has been changes several places in the data sheet.
- Removed the Sleep Timer trigger for the DMA since the Sleep Timer should not be used in
active mode.
- Section 13.12.1: Added note regarding RSSI response time when using
MCSM1.RXOFF_MODE=11
- Changed the description of the T2CTL.INT field
- Several changes added throughout the document regarding calibration of the two RC
oscillators
- Added info several places in the document stating that the I2S interface will have
precedence in cases where other peripherals (except for the debug interface) are configured
to be on the same location even if the pins are configured to be general purpose I/O pins.
- QLP36 / QLP 36 replaced by QFN 36
- 12.8.2: Changes made to the description on how entering PM{0 - 2}, updating EVENT0, and
resetting the sleep timer should be done with respect to the 32 kHz clock source.
- Replaced Figure 6
SWRS055G
2013.02.20
Updated package and ordering information to RHH package.
SWRS055G
Page 235 of 236
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
CC2510F16RHH
ACTIVE
VQFN
RHH
36
CC2510F16RHHR
ACTIVE
VQFN
RHH
36
CC2510F16RHHT
ACTIVE
VQFN
RHH
CC2510F32RHH
ACTIVE
VQFN
CC2510F32RHHR
ACTIVE
CC2510F32RHHT
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F16
36
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F16
RHH
36
60
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F32
VQFN
RHH
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F32
ACTIVE
VQFN
RHH
36
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F32
CC2510F8RHH
ACTIVE
VQFN
RHH
36
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F8
CC2510F8RHHR
ACTIVE
VQFN
RHH
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F8
CC2510F8RHHT
ACTIVE
VQFN
RHH
36
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
CC2510
F8
CC2511F16RSP
ACTIVE
VQFN
RSP
36
490
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F16
CC2511F16RSPG3
ACTIVE
VQFN
RSP
36
490
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F16
CC2511F16RSPR
ACTIVE
VQFN
RSP
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F16
CC2511F16RSPRG3
ACTIVE
VQFN
RSP
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F16
CC2511F32RSP
ACTIVE
VQFN
RSP
36
490
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F32
CC2511F32RSPG3
ACTIVE
VQFN
RSP
36
490
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F32
CC2511F32RSPR
ACTIVE
VQFN
RSP
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F32
CC2511F8RSP
NRND
VQFN
RSP
36
490
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F8
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
26-Sep-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
CC2511F8RSPG3
NRND
VQFN
RSP
36
490
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F8
CC2511F8RSPR
NRND
VQFN
RSP
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F8
CC2511F8RSPRG3
NRND
VQFN
RSP
36
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
CC2511-F8
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
CC2510F16RHHR
VQFN
RHH
36
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC2510F16RHHT
VQFN
RHH
36
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC2510F32RHHR
VQFN
RHH
36
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC2510F32RHHT
VQFN
RHH
36
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC2510F8RHHR
VQFN
RHH
36
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC2510F8RHHT
VQFN
RHH
36
250
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
CC2511F16RSPR
VQFN
RSP
36
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CC2511F32RSPR
VQFN
RSP
36
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
CC2511F8RSPR
VQFN
RSP
36
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CC2510F16RHHR
VQFN
RHH
36
2500
336.6
336.6
28.6
CC2510F16RHHT
VQFN
RHH
36
250
336.6
336.6
28.6
CC2510F32RHHR
VQFN
RHH
36
2500
336.6
336.6
28.6
CC2510F32RHHT
VQFN
RHH
36
250
336.6
336.6
28.6
CC2510F8RHHR
VQFN
RHH
36
2500
336.6
336.6
28.6
CC2510F8RHHT
VQFN
RHH
36
250
336.6
336.6
28.6
CC2511F16RSPR
VQFN
RSP
36
2500
378.0
70.0
346.0
CC2511F32RSPR
VQFN
RSP
36
2500
378.0
70.0
346.0
CC2511F8RSPR
VQFN
RSP
36
2500
378.0
70.0
346.0
Pack Materials-Page 2
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