NC7SZ34 TinyLogic® UHS Buffer Features Description Ultra-High Speed: tPD 2.4ns (Typical) into 50pF at 5V VCC High Output Drive: ±24mA at 3V VCC The NC7SZ34 is a single buffer from Fairchild’s UltraHigh Speed (UHS) series of TinyLogic®. The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive, while maintaining low static power dissipation over a broad VCC operating range of 1.65V to 5.5V VCC. The inputs and output are high-impedance when VCC is 0V. Inputs tolerate voltages up to 7V, independent of VCC operating voltage. Broad VCC Operating Range: 1.65V to 5.5V Matches Performance of LCX Operated at 3.3V VCC Power-Down High-Impedance Inputs / Outputs Proprietary Noise / EMI Reduction Circuitry WLCSP Package Related Resources AN-5055 — Portability and Ultra Low Power TinyLogic® MS-503 — Family Characteristics TinyLogic® HS/HST and UHS Series Ordering Information Part Number Top Mark NC7SZ34UCX KJ © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 Package 4-Lead, Wafer-Level Chip Scale 0.76x0.76x0.5mm Wafer-Level Chip-Scale Package (WLCSP) Packing Method 3000 Units on Tape & Reel www.fairchildsemi.com NC7SZ34 — TinyLogic® UHS Buffer February 2011 NC7SZ34 — TinyLogic® UHS Buffer Pin Configurations A1 A2 B1 B2 Figure 1. WLCSP (Top View) Pin Definitions WLCSP Name Description A1 A A2 VCC Power Supply Input B1 GND Ground B2 Y Output Function Table Y= A Inputs Output A Y LOW Logic Level LOW Logic Level HIGH Logic Level HIGH Logic Level © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 7.0 V VIN DC Input Voltage -0.5 7.0 V VOUT 7.0 V IIK DC Input Diode Current VIN < -0.5V -50 mA IOK DC Output Diode Current VOUT < -0.5V -50 mA IOUT DC Output Current ±50 mA ICC or IGND TSTG DC Output Voltage -0.5 DC VCC or Ground Current Storage Temperature Range -65 ±50 mA +150 °C °C TJ Junction Temperature Under Bias +150 TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C PD Power Dissipation at +85°C 200 mW Human Body Model, JEDEC:JESD22-A114 4000 Charge Device Model, JEDEC:JESD22-C101 2000 ESD NC7SZ34 — TinyLogic® UHS Buffer Absolute Maximum Ratings V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol VCC VIN VOUT TA tr, tf JA Parameter Conditions Min. Max. Supply Voltage Operating 1.65 5.50 Supply Voltage Data Retention 1.5 5.5 0 5.5 Input Voltage Output Voltage V V 0 VCC V -40 +85 °C VCC at 1.8V, 2.5V ±0.2V 0 20 VCC at 3.3V ±0.3V 0 10 VCC at 5.0V ±0.5V 0 5 Operating Temperature Input Rise and Fall Times Unit Thermal Resistance 80 ns/V °C/W Note: 1. Unused inputs must be held HIGH or LOW. They may not float. © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 www.fairchildsemi.com 3 Symbol Parameter VCC Conditions TA=25°C Min. Typ. TA=-40 to 85°C Max. Min. Max. VIH HIGH Level Input Voltage 1.65 to 1.95 0.65VCC 0.65VCC 2.30 to 5.50 0.70VCC 0.70VCC VIL LOW Level Input Voltage 1.65 to 1.95 0.35VCC 0.35VCC 2.30 to 5.50 0.30VCC 0.30VCC 1.65 1.55 1.65 1.80 1.70 1.80 1.70 2.20 2.30 2.20 3.00 2.90 3.00 2.90 4.50 4.40 4.50 4.40 2.30 VOH HIGH Level Output Voltage VIN=VIH, IOH= -100µA 1.65 IOH=-4mA 1.29 1.52 1.29 2.30 IOH=-8mA 1.90 2.15 1.90 3.00 IOH=-16mA 2.40 2.80 2.40 3.00 IOH=-24mA 2.30 2.68 2.30 4.50 IOH=-32mA 3.80 4.20 3.80 0.00 0.10 0.10 0.00 0.10 0.10 0.00 0.10 0.10 0.00 0.10 0.10 VIN=VIL, IOL=100µA IIN 4.50 0.00 0.10 0.10 1.65 IOL=4mA 0.08 0.24 0.24 2.30 IOL=8mA 0.10 0.30 0.30 3.00 IOL=16mA 0.15 0.40 0.40 3.00 IOL=24mA 0.22 0.55 0.55 4.50 IOL=32mA 0.22 0.55 0.55 0 to 5.5 0 VIN 5.5V ±1 ±10 µA 0 VIN or VOUT=5.5V 1 10 µA 1.65 to 5.50 VIN=5.5V, GND 1.0 10 µA LOW Level Output Voltage Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current V V 1.80 3.00 VOL V 1.65 2.30 Unit © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 NC7SZ34 — TinyLogic® UHS Buffer DC Electrical Characteristics V www.fairchildsemi.com 4 Symbol Parameter VCC Conditions Min. CPD Max. 2.0 5.3 11.4 2.0 12.0 1.80 2.0 4.4 9.5 2.0 10.0 0.8 2.9 6.5 0.8 7.0 3.3 ±0.3 0.5 2.1 4.5 0.5 4.7 5.0 ±0.5 0.5 1.8 3.9 0.5 4.1 3.3 ±0.3 1.5 2.9 5.0 1.5 5.2 0.8 2.4 4.3 0.8 4.5 5.0 ±0.5 CIN Typ. Max. Min. 1.65 2.5 ±0.2 tPLH, tPHL Propagation Delay TA=-40 to 85°C TA=25°C CL=15pF, RL=1M CL=50pF, RL=500 Input Capacitance 0.00 2.0 Power Dissipation (2) Capacitance 3.30 12.9 5.00 15.6 Unit s Figure ns Figure 2 Figure 3 pF pF NC7SZ34 — TinyLogic® UHS Buffer AC Electrical Characteristics Figure 4 Note: 2. CPD is defined as the value of the internal equivalent capacitance derived from dynamic operating current consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). Figure 2. AC Test Circuit Figure 3. AC Waveforms Figure 4. ICCD Test Circuit Note: 3. Input=AC Waveform; tr=tf=1.8ns; Frequency =10MHz; Duty Cycle =50%. © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 www.fairchildsemi.com 5 NC7SZ34 — TinyLogic® UHS Buffer Physical Dimensions F 0.03 C E 2X A 0.40 B Ø0.20 Cu Pad A1 0.40 D BALL A1 INDEX AREA Ø0.30 Solder Mask 0.03 C 2X TOP VIEW RECOMMENDED LAND PATTERN (NSMD PAD TYPE) 0.06 C 0.292±0.018 0.539 0.461 0.05 C C E 0.208±0.021 SEATING PLANE SIDE VIEWS D NOTES: A. NO JEDEC REGISTRATION APPLIES. 0.005 B. DIMENSIONS ARE IN MILLIMETERS. C A B Ø0.260±0.020 4X 0.40 B A 0.40 C. DIMENSIONS AND TOLERANCE PER ASME Y14.5M, 1994. (Y)±0.018 D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. F 1 2 E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS ±39 MICRONS (461-539 MICRONS). (X)±0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC004AFrev1. Figure 5. 4-Lead, Wafer-Level Chip Scale 0.76x0.76x0.5mm Wafer-Level Chip-Scale Package (WLCSP) Product D E X Y NC7SZ34UCX 0.76 +/-0.030 0.76 +/-0.030 0.18 0.18 Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf. Package Designator UCX © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 Tape Section Cavity Number Leader (Start End) 125 (Typical) Cavity Status Cover Type Status Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed www.fairchildsemi.com 6 NC7SZ34 — TinyLogic® UHS Buffer © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 www.fairchildsemi.com 7 NC7SZ34 — TinyLogic® UHS Buffer © 2010 Fairchild Semiconductor Corporation NC7SZ34 • Rev. 1.0.1 www.fairchildsemi.com 8