Fairchild NC7SZ34 Tinylogicâ® uhs buffer Datasheet

NC7SZ34
TinyLogic® UHS Buffer
Features
Description

Ultra-High Speed: tPD 2.4ns (Typical) into 50pF
at 5V VCC






High Output Drive: ±24mA at 3V VCC
The NC7SZ34 is a single buffer from Fairchild’s UltraHigh Speed (UHS) series of TinyLogic®. The device is
fabricated with advanced CMOS technology to achieve
ultra-high speed with high output drive, while
maintaining low static power dissipation over a broad
VCC operating range of 1.65V to 5.5V VCC. The inputs
and output are high-impedance when VCC is 0V. Inputs
tolerate voltages up to 7V, independent of VCC operating
voltage.
Broad VCC Operating Range: 1.65V to 5.5V
Matches Performance of LCX Operated at 3.3V VCC
Power-Down High-Impedance Inputs / Outputs
Proprietary Noise / EMI Reduction Circuitry
WLCSP Package
Related Resources

AN-5055 — Portability and Ultra Low Power
TinyLogic®

MS-503 — Family Characteristics TinyLogic®
HS/HST and UHS Series
Ordering Information
Part Number
Top Mark
NC7SZ34UCX
KJ
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
Package
4-Lead, Wafer-Level Chip Scale 0.76x0.76x0.5mm
Wafer-Level Chip-Scale Package (WLCSP)
Packing Method
3000 Units on
Tape & Reel
www.fairchildsemi.com
NC7SZ34 — TinyLogic® UHS Buffer
February 2011
NC7SZ34 — TinyLogic® UHS Buffer
Pin Configurations
A1
A2
B1
B2
Figure 1. WLCSP (Top View)
Pin Definitions
WLCSP
Name
Description
A1
A
A2
VCC
Power Supply
Input
B1
GND
Ground
B2
Y
Output
Function Table
Y= A
Inputs
Output
A
Y
LOW Logic Level
LOW Logic Level
HIGH Logic Level
HIGH Logic Level
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
www.fairchildsemi.com
2
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VCC
Supply Voltage
-0.5
7.0
V
VIN
DC Input Voltage
-0.5
7.0
V
VOUT
7.0
V
IIK
DC Input Diode Current
VIN < -0.5V
-50
mA
IOK
DC Output Diode Current
VOUT < -0.5V
-50
mA
IOUT
DC Output Current
±50
mA
ICC or IGND
TSTG
DC Output Voltage
-0.5
DC VCC or Ground Current
Storage Temperature Range
-65
±50
mA
+150
°C
°C
TJ
Junction Temperature Under Bias
+150
TL
Junction Lead Temperature (Soldering, 10 Seconds)
+260
°C
PD
Power Dissipation at +85°C
200
mW
Human Body Model, JEDEC:JESD22-A114
4000
Charge Device Model, JEDEC:JESD22-C101
2000
ESD
NC7SZ34 — TinyLogic® UHS Buffer
Absolute Maximum Ratings
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
VCC
VIN
VOUT
TA
tr, tf
JA
Parameter
Conditions
Min.
Max.
Supply Voltage Operating
1.65
5.50
Supply Voltage Data Retention
1.5
5.5
0
5.5
Input Voltage
Output Voltage
V
V
0
VCC
V
-40
+85
°C
VCC at 1.8V, 2.5V ±0.2V
0
20
VCC at 3.3V ±0.3V
0
10
VCC at 5.0V ±0.5V
0
5
Operating Temperature
Input Rise and Fall Times
Unit
Thermal Resistance
80
ns/V
°C/W
Note:
1. Unused inputs must be held HIGH or LOW. They may not float.
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
www.fairchildsemi.com
3
Symbol
Parameter
VCC
Conditions
TA=25°C
Min.
Typ.
TA=-40 to 85°C
Max.
Min.
Max.
VIH
HIGH Level
Input Voltage
1.65 to 1.95
0.65VCC
0.65VCC
2.30 to 5.50
0.70VCC
0.70VCC
VIL
LOW Level
Input Voltage
1.65 to 1.95
0.35VCC
0.35VCC
2.30 to 5.50
0.30VCC
0.30VCC
1.65
1.55
1.65
1.80
1.70
1.80
1.70
2.20
2.30
2.20
3.00
2.90
3.00
2.90
4.50
4.40
4.50
4.40
2.30
VOH
HIGH Level
Output Voltage
VIN=VIH, IOH=
-100µA
1.65
IOH=-4mA
1.29
1.52
1.29
2.30
IOH=-8mA
1.90
2.15
1.90
3.00
IOH=-16mA
2.40
2.80
2.40
3.00
IOH=-24mA
2.30
2.68
2.30
4.50
IOH=-32mA
3.80
4.20
3.80
0.00
0.10
0.10
0.00
0.10
0.10
0.00
0.10
0.10
0.00
0.10
0.10
VIN=VIL,
IOL=100µA
IIN
4.50
0.00
0.10
0.10
1.65
IOL=4mA
0.08
0.24
0.24
2.30
IOL=8mA
0.10
0.30
0.30
3.00
IOL=16mA
0.15
0.40
0.40
3.00
IOL=24mA
0.22
0.55
0.55
4.50
IOL=32mA
0.22
0.55
0.55
0 to 5.5
0 VIN 5.5V
±1
±10
µA
0
VIN or VOUT=5.5V
1
10
µA
1.65 to 5.50
VIN=5.5V, GND
1.0
10
µA
LOW Level
Output Voltage
Input Leakage
Current
IOFF
Power Off
Leakage
Current
ICC
Quiescent
Supply Current
V
V
1.80
3.00
VOL
V
1.65
2.30
Unit
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
NC7SZ34 — TinyLogic® UHS Buffer
DC Electrical Characteristics
V
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4
Symbol
Parameter
VCC
Conditions
Min.
CPD
Max.
2.0
5.3
11.4
2.0
12.0
1.80
2.0
4.4
9.5
2.0
10.0
0.8
2.9
6.5
0.8
7.0
3.3 ±0.3
0.5
2.1
4.5
0.5
4.7
5.0 ±0.5
0.5
1.8
3.9
0.5
4.1
3.3 ±0.3
1.5
2.9
5.0
1.5
5.2
0.8
2.4
4.3
0.8
4.5
5.0 ±0.5
CIN
Typ. Max. Min.
1.65
2.5 ±0.2
tPLH, tPHL Propagation Delay
TA=-40 to
85°C
TA=25°C
CL=15pF,
RL=1M
CL=50pF,
RL=500
Input Capacitance
0.00
2.0
Power Dissipation
(2)
Capacitance
3.30
12.9
5.00
15.6
Unit
s
Figure
ns
Figure 2
Figure 3
pF
pF
NC7SZ34 — TinyLogic® UHS Buffer
AC Electrical Characteristics
Figure 4
Note:
2. CPD is defined as the value of the internal equivalent capacitance derived from dynamic operating current
consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating
current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic).
Figure 2. AC Test Circuit
Figure 3. AC Waveforms
Figure 4. ICCD Test Circuit
Note:
3. Input=AC Waveform; tr=tf=1.8ns; Frequency =10MHz; Duty Cycle =50%.
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
www.fairchildsemi.com
5
NC7SZ34 — TinyLogic® UHS Buffer
Physical Dimensions
F
0.03 C
E
2X
A
0.40
B
Ø0.20
Cu Pad
A1
0.40
D
BALL A1
INDEX AREA
Ø0.30
Solder Mask
0.03 C
2X
TOP VIEW
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.292±0.018
0.539
0.461
0.05 C
C
E
0.208±0.021
SEATING PLANE
SIDE VIEWS
D
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
B. DIMENSIONS ARE IN MILLIMETERS.
C A B
Ø0.260±0.020
4X
0.40
B
A
0.40
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
(Y)±0.018
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
F
1 2
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
(X)±0.018
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
G. DRAWING FILNAME: MKT-UC004AFrev1.
Figure 5. 4-Lead, Wafer-Level Chip Scale 0.76x0.76x0.5mm Wafer-Level Chip-Scale Package (WLCSP)
Product
D
E
X
Y
NC7SZ34UCX
0.76 +/-0.030
0.76 +/-0.030
0.18
0.18
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specifications
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf.
Package Designator
UCX
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
Tape Section
Cavity Number
Leader (Start End)
125 (Typical)
Cavity Status Cover Type Status
Empty
Sealed
Carrier
3000
Filled
Sealed
Trailer (Hub End)
75 (Typical)
Empty
Sealed
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6
NC7SZ34 — TinyLogic® UHS Buffer
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
www.fairchildsemi.com
7
NC7SZ34 — TinyLogic® UHS Buffer
© 2010 Fairchild Semiconductor Corporation
NC7SZ34 • Rev. 1.0.1
www.fairchildsemi.com
8
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