ON MBRM110ET3G Surface mount schottky power rectifier Datasheet

MBRM110E
Surface Mount
Schottky Power Rectifier
POWERMITE®
Power Surface Mount Package
The Schottky Powermite® employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite® has the same thermal performance as the SMA while
being 50% smaller in footprint area, and delivering one of the lowest
height profiles, < 1.1 mm in the industry. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are AC−DC and DC−DC
converters, reverse battery protection, and “ORing” of multiple supply
voltages and any other application where performance and size are
critical.
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SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES, 10 VOLTS
ANODE
CATHODE
POWERMITE
CASE 457
PLASTIC
Features
•
•
•
•
•
•
Low IR Extends Battery Life
Low Profile − Maximum Height of 1.1 mm
Small Footprint − Footprint Area of 8.45 mm2
150°C Operating Junction Temperature
Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
Pb−Free Packages are Available
MARKING DIAGRAM
M
1E1G
Mechanical Characteristics:
•
•
•
•
•
Powermite® is JEDEC Registered as D0−216AA
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 16.3 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
M
1E1
G
= Date Code
= Device Code
= Pb−Free Package
ORDERING INFORMATION
Device
MBRM110ET1
Package
Shipping†
POWERMITE 3000/Tape & Reel
MBRM110ET1G POWERMITE 3000/Tape & Reel
(Pb−Free)
MBRM110ET3
POWERMITE 12000/Tape & Reel
MBRM110ET3G POWERMITE 12000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
September, 2006 − Rev. 2
1
Publication Order Number:
MBRM110E/D
MBRM110E
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
10
V
IO
1.0
A
Non−Repetitive Peak Surge Current
(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)
IFSM
50
A
Storage Temperature
Tstg
−55 to +150
°C
TJ
−55 to +150
°C
dv/dt
10,000
V/ms
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current (TL = 100°C)
Operating Junction Temperature
Voltage Rate of Change (Rated VR, TJ = 25°C)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Rating
Thermal Resistance, Junction−to−Lead (Anode) (Note 1)
Thermal Resistance, Junction−to−Tab (Cathode) (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 1)
Symbol
Value
Unit
Rtjl
Rtjtab
Rtja
35
23
277
°C/W
Value
Unit
1. Mounted with minimum recommended pad size, PC Board FR4, See Figures 8 and 9.
ELECTRICAL CHARACTERISTICS
Rating
Symbol
Maximum Instantaneous Forward Voltage (Note 2)
(IF = 0.1 A)
(IF = 1.0 A)
(IF = 2.0 A)
Maximum Instantaneous Reverse Current (Note 2)
VF
TJ = 25°C
TJ = 100°C
V
VF
0.455
0.530
0.595
0.360
0.455
0.540
V
IR
TJ = 25°C
TJ = 100°C
mA
0.5
1.0
300
500
(VR = 5.0 V)
(VR = 10 V)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2%.
10
TJ = 150°C
TJ = 25°C
TJ = 100°C
TJ = -40°C
1.0
0.1
0.2
0.4
0.6
0.8
10
TJ = 150°C
TJ = 100°C
1.0
TJ = 25°C
0.1
0.2
0.4
0.6
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
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2
0.8
MBRM110E
100E-3
I R, MAXIMUM REVERSE CURRENT (AMPS)
IR, REVERSE CURRENT (AMPS)
100E-3
10E-3
1E-3
TJ = 150°C
100E-6
10E-6
1E-6
100E-9
1E-3
TJ = 100°C
10E-6
TJ = 25°C
1E-6
100E-9
TJ = 25°C
10E-9
10E-9
2.5
5
7.5
FREQ = 20 kHz
Ipk/Io = p
Ipk/Io = 5
0.6
Ipk/Io = 10
0.4
Ipk/Io = 20
0.2
0
65
85
105
10
125
145
165
0.7
dc
0.6
Ipk/Io = p
SQUARE
WAVE
0.5
Ipk/Io = 5
0.4
Ipk/Io = 10
0.3
Ipk/Io = 20
0.2
0.1
0
0
0.4
0.2
0.6
0.8
1.0
1.2
1.4
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
1000
C, CAPACITANCE (pF)
45
7.5
Figure 4. Maximum Reverse Current
SQUARE WAVE
0.8
5
Figure 3. Typical Reverse Current
1.4
1.0
2.5
VR, REVERSE VOLTAGE (VOLTS)
dc
1.2
0
VR, REVERSE VOLTAGE (VOLTS)
1.8
1.6
10
PFO , AVERAGE POWER DISSIPATION (WATTS)
0
I O , AVERAGE FORWARD CURRENT (AMPS)
TJ = 150°C
100E-6
TJ = 100°C
25
10E-3
TJ = 25°C
100
10
0
1
2
3
4
5
6
7
VR, REVERSE VOLTAGE (VOLTS)
Figure 7. Capacitance
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3
8
9
10
1.6
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
MBRM110E
1.0
50%
20%
0.1
10%
5.0%
0.01
2.0%
1.0%
Rtjl(t) = Rtjl*r(t)
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
100
T, TIME (s)
R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
Figure 8. Thermal Response Junction to Lead
1.0
50%
20%
0.1
10%
5.0%
0.01
2.0%
Rtjl(t) = Rtjl*r(t)
1.0%
0.001
0.00001
0.0001
0.001
0.01
0.1
1.0
T, TIME (s)
Figure 9. Thermal Response Junction to Ambient
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4
10
100
1,000
MBRM110E
PACKAGE DIMENSIONS
POWERMITE
CASE 457−04
ISSUE D
F
0.08 (0.003)
C
−A−
J
M
T B
S
C
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
TERM. 1
−B−
DIM
A
B
C
D
F
H
J
K
L
R
S
K
TERM. 2
R
L
J
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
1.75
2.05 0.069
0.081
1.75
2.18 0.069
0.086
0.85
1.15 0.033
0.045
0.40
0.69 0.016
0.027
0.70
1.00 0.028
0.039
-0.05
+0.10 -0.002 +0.004
0.10
0.25 0.004
0.010
3.60
3.90 0.142
0.154
0.50
0.80 0.020
0.031
1.20
1.50 0.047
0.059
0.50 REF
0.019 REF
D
H
−T−
0.08 (0.003)
M
T B
S
C
S
SOLDERING FOOTPRINT*
0.635
0.025
2.67
0.105
0.762
0.030
2.54
0.100
1.27
0.050
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
POWERMITE is a registered trademark of and used under a license from Microsemi Corporation.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
MBRM110E/D
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