Infineon ESD8V0R1B-02EL Transient voltage suppressor diode Datasheet

TVS Diodes
Transient Voltage Suppressor Diodes
ESD8V0R1B Series
Bi-directional Low Capacitance TVS Diode
ESD8V0R1B-02EL
ESD8V0R1B-02ELS
Data Sheet
Revision 2.0, 2010-12-15
Final
Industrial and Multi-Market
Edition 2010-12-15
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2010 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
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and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
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Warnings
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ESD8V0R1B Series
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 1.0, 2010-10-20
Revision 2.0, 2010-12-15
Carrier Tape drawing for TSSLP-2-2 Package updated
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Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of
INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of
Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. Mifare™ of NXP.
MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
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Micro Devices, Inc. SIRIUS™ of Sirius Sattelite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2010-06-09
Final Data Sheet
3
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1
1.1
1.2
Bi-directional Low Capacitance TVS Diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
3.1
3.2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electrical Characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Typical Performance characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . 10
4
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6
6.1
6.2
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSLP-2-18 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSSLP-2-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Final Data Sheet
4
Revision 2.0, 2010-12-15
ESD8V0R1B Series
List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
a) Pin Configuration and b) Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Definitions of electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Non-repetitive peak pulse power: Ppk = f (tp) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power derating curve: Ppk = f (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Reverse characteristic, IR = (VR), TA = parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Line capacitance CL = f(VR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1 Line, bi-directional protection with ESD diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Ordering Information Scheme (examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
PG-TSLP-2-18: Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSLP-2-18: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSLP-2-18: Packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSLP-2-18: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PG-TSSLP-2-2: Package Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-2: Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-2: Packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PG-TSSLP-2-2: Marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Final Data Sheet
5
Revision 2.0, 2010-12-15
ESD8V0R1B Series
List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Rating at TA = 25 °C, unless otherwise specified. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD characteristics at TA = 25 °C, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Final Data Sheet
6
7
8
8
9
9
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Bi-directional Low Capacitance TVS Diode
1
Bi-directional Low Capacitance TVS Diode
1.1
Features
•
•
•
•
•
•
•
ESD / Transient protection of data lines in 3.3 / 5 / 12 V applications according to :
• IEC61000-4-2 (ESD) : ±20 kV (air) and ±18 kV (contact)
• IEC61000-4-4 (EFT) : 40 A (5/50ns)
Extremely small form factor down to 0.62 x 0.32 x 0.31 mm²
Maximum working voltage: VRWM = -8 / +14 V
Very low reverse current: IR < 1 nA (typical)
Very low series inducttance down to : LS = 0.2 nH (typical)
Low capacitance CL = 4 pF I/O to GND (typical)
Pb-free and Halogen-Free package (RoHS compliant)
1.2
•
•
•
Application Examples
Keypad, touchpad, buttons, convenience keys
LCD displays, Camera, audio lines, mobile communication, Consumer products (E-Book, MP3, DVD, DSC, ...)
Notebooks tablets and desktop computers and their peripherals
2
Product Description
Pin 1
Pin 2
Pin 2
TSLP-2
Pin 1
Pin 2
Pin 1
TSSLP -2
b) Schematic diagram
a) Pin configuration
Figure 1
a) Pin Configuration and b) Schematic Diagram
Table 1
Ordering information
Type
Package
Configuration
ESD8V0R1B-02EL
PG-TSLP-2-18
1 line, bi-directional
R
ESD8V0R1B-02ELS
PG-TSSLP-2-2
1 line, bi-directional
D
Final Data Sheet
7
Marking code
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Characteristics
3
Characteristics
Table 2
Maximum Rating at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
VESD
-20
–
20
kV
VESD
-18
–
18
kV
IPP
-1
–
1
A
Operating temperature
TOP
-55
–
150
°C
Storage temperage
1) VESD according to IEC61000-4-2
2) IPP according to IEC61000-4-5
Tstg
-65
–
150
°C
ESD air discharge
1)
ESD contact discharge
1)
Peak pulse current (tp = 8/20 µs)
3.1
2)
Electrical Characteristics at TA = 25 °C, unless otherwise specified
Rdyn … Differential series resistance
VBR … Breakdown voltage ( I BR = 1mA typ.)
I
VRWM … Reverse working voltage maximum
IPP
VCL … Clamping voltage
IPP … Peak pulse current (t P=8/20µs typ.)
Rdyn
IBR
VCL
V BR
IRWM
VRWM
VRWM
IRWM
IBR
VBR
VCL
V
Pin 2
Rdyn
IPP
V
I
Pin 1
Diode_Characteristic_Curve_bidirectional .vsd
Figure 2
Definitions of electrical characteristics
Table 3
DC characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Reverse working voltage VRWM
Breakdown voltage
VBR
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
-8
–
14
V
from Pin2 to Pin1
8.5
11
14
V
IR = 1 mA,
from Pin1 to Pin2
Breakdown voltage
VBR
14.5
17
20
V
IR = 1 mA,
from Pin2 to Pin1
Reverse current
Final Data Sheet
IR
–
<1
50
8
nA
VR = 3.3 V
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Characteristics
Table 4
RF characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
Line capacitance
CL
–
4
7
pF
VR = 0 V, f = 1 MHz,
I/O to GND
Serie inductance
LS
–
0.4
–
nH
ESD8V0R1B-02EL
LS
–
0.2
–
nH
ESD8V0R1B-02ELS
Unit
Note /
Test Condition
V
IPP = 1 A
Table 5
ESD characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
1)
Clamping voltage
VCL
Values
Min.
Typ.
Max.
–
17
22
from Pin1 to Pin2
VCL
–
23
28
V
IPP = 1 A
from Pin2 to Pin1
1) According to IEC61000-4-5 (tp : 8 / 20 µs)
Final Data Sheet
9
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Characteristics
Typical Performance characteristics at TA = 25 °C, unless otherwise specified
3.2
3
10
D=0
D=0.005
D=0.01
2
10
Ppk [W]
D=0.02
D=0.05
D=0.1
101
D=0.2
D=0.5
0
10
10-8 10-7 10-6 10-5 10-4 10-3 10-2 10-1
tp [s]
100
Non-repetitive peak pulse power: Ppk = f (tp)
Figure 3
110
100
90
Ppk or IPP [%]
80
70
60
50
40
30
20
10
0
0
Figure 4
25
50
75
TA [°C]
100
125
150
Power derating curve: Ppk = f (TA)
Final Data Sheet
10
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Characteristics
-8
10
TA=85°C
-9
IR [A]
10
TA=25°C
-10
10
10-11
0
Figure 5
2
4
6
8
VR [V]
10
12
14
Reverse characteristic, IR = (VR), TA = parameter
7
6
CL [pF]
5
4
3
2
1
0
0
Figure 6
2
4
6
8
VR [V]
10
12
14
Line capacitance CL = f(VR)
Final Data Sheet
11
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Application Information
Application Information
Connector
4
Protected data line with signal levels
-8V up to +14V (bi-directional )
I/ O
2
1
Figure 7
ESD
sensitive
device
The protection diode should be placed very
close to the location where the ESD or other
transients can occur to keep loops and
inductances as small as possible .
Pin 1 should be connected directly to a
ground plane on the board .
1 Line, bi-directional protection with ESD diode
Final Data Sheet
12
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Ordering information scheme
5
ESD
Ordering information scheme
0P1
RF
- XX YY
Package
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
For Radio Frequency Applications
Line Capacitance CL in pF: (i.e.: 0P1 = 0.1pF)
ESD 5V3 U n U - XX YY
Package or Application
XX = Pin number (i.e.: 02 = 2 pins; 03 = 3 pins)
YY = Package family:
LS = TSSLP
LRH = TSLP
S = SOT363
U = SC74
XX = Application family:
LC = Low Clamp
HDMI
Uni- / Bi-directional or Rail to Rail protection
Number of protected lines (i.e.: 1 = 1 line; 4 = 4 lines)
Capacitance: Standard (>10pF), Low (<10pF), Ultra-low (<1pF)
Maximum working voltage VRWM in V: (i.e.: 5V3 = 5.3V)
Figure 8
Ordering Information Scheme (examples)
Final Data Sheet
13
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Package Information
6
Package Information
6.1
PG-TSLP-2-18
Top view
Bottom view
0.31 +0.01
-0.02
0.6 ±0.05
0.05 MAX.
1±0.05
0.65 ±0.05
2
0.25 ±0.035 1)
1
0.5 ±0.035 1)
Cathode marking
1) Dimension applies to plated terminals
TSLP-2-18-PO V01
0.45
Copper
Solder mask
0.375
0.35
0.275
1
0.925
0.3
0.6
0.275
PG-TSLP-2-18: Package Overview
0.35
Figure 9
Stencil apertures
TSLP-2-18-FP V01
Figure 10
PG-TSLP-2-18: Footprint
0.4
8
1.16
4
0.76
Cathode marking
TSLP-2-18-TP V01
Figure 11
PG-TSLP-2-18: Packing
Type code
12
Cathode marking
TSLP-2-18-MK V01
Figure 12
PG-TSLP-2-18: Marking (example)
Final Data Sheet
14
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Package Information
PG-TSSLP-2-2
Top view
Bottom view
0.31 +0.01
-0.02
0.62 ±0.035
2
1
0.2 ±0.025 1)
0.355 ±0.025
0.32 ±0.035
0.26 ±0.025 1)
Cathode
marking
1) Dimension applies to plated terminal
TSSLP-2-1,-2-PO V05
PG-TSSLP-2-2: Package Overview
0.57
0.24
0.19
0.62
Copper
0.19
0.27
0.14
0.32
0.24
Figure 13
Solder mask
0.19
6.2
Stencil apertures
TSSLP-2-1,-2-FP V02
Figure 14
PG-TSSLP-2-2: Footprint
0.35
Tape type
Ex Ey
Punched Tape
0.43 0.73
Embossed Tape 0.37 0.67
8
Ey
4
Cathode
marking
Figure 15
Deliveries can be both tape types (no selection possible).
Specification allows identical processing (pick & place) by users.
Ex
TSSLP-2-1,-2-TP V03
PG-TSSLP-2-2: Packing
BAR95-02LS
Type code
Pin 1 marking
Laser marking
Figure 16
PG-TSSLP-2-2: Marking (example)
Final Data Sheet
15
Revision 2.0, 2010-12-15
ESD8V0R1B Series
Terminology
Terminology
CL
Line capacitance
DSC
Digital Still Camera
DVD
Digital Versatile Disc
EFT
Electrical Fast Transient
ESD
Electrostatic Discharge
IEC
International Electrotechnical Commission
IPP
Peak pulse current
IR
Reverse current
IRWM
Reverse working current maximum
LCD
Liquid Crystal Display
LS
Serial inductance
MP3
Moving Picture Experts Group III
RoHS
Restriction of Hazardous Substances Directive
TA
Ambient temperature
TOP
Operation temperature
tp
Pulse duration
Tstg
Storage temperature
VCL
Reverse clamping voltage
VESD
Electrostatic discharge voltage
VR
Reverse voltage
VRWM
Reverse working voltage maximum
Final Data Sheet
16
Revision 2.0, 2010-12-15
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