CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 1/1 Surface Mount Transient Voltage Suppressors Peak Pulse Power 350W ESRN03B01S2 Features • Bidirectional unit • 350W peak pulse power capability per line with a 8/20μs waveform • Protects one power or I/O port • Pb-free lead plating and halogen-free package • Transient protection for data line to IEC61000-4-2 (ESD) ±15kV(air) ±8kV (contact) • Replacement for MLV (0805) • Low clamping voltage • Ultra low capacitance • Low leakage current Mechanical Data • Case : SOD-323, Molded plastic • Terminals: Pure tin plated, solderable per MIL-STD-750 method 2026 • Mounting position : Any • Epoxy: UL 94V-0 rate flame retardant Equivalent Circuit Outline SOD-323 ESRN03B01S2 Ordering Information Device ESRN03B01S2-0-T1-G Package SOD-323 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name ESRN03B01S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 2/2 Maximum Ratings and Characteristics(TA=25°C, unless otherwise noted) Parameter Peak pulse power dissipation with a 8/20μs waveform (Note 1) ESD voltage (HBM waveform per IE C61000-4-2) Peak forward surge current, 8.3ms single half sine wave uni-directional only (Note 2) Typical thermal resistance, junction to ambient air (Note 3) Typical thermal resistance, junction to case Power dissipation Operating junction and storage temperature range Symbol PPP VESD Value 350 30 Unit W kV IFSM 6 A RthJA RthJC PD TJ;TSTG 500 300 0.25 -55 ~ +150 °C /W W °C Notes: 1. Non-repetitive current pulse, per Fig. 5 and derated above TA=25°C per Fig. 1. 2. Mounted on 8.3ms single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum. 3. Mounted on PCB with 10mm x 10 mm x 2mm Cu pads to each terminal. Electrical Characteristics Ratings at 25℃ Characteristic Reverse Stand-off Voltage Reverse Breakdown Voltage Reverse Leakage Current Symbol VRWM VBR IR Clamping Voltage VC Junction Capacitance Cj ambient temperature, unless otherwise noted. Condition IT=1mA VRWM=3V IPP=1A, tp=8/20μs IPP=3A, tp=8/20μs IPP=8A, tp=8/20μs VR=0V, f=1MHz Min. Typ Max. 3.3 - 3.8 1.6 3 4.5 1 6.5 8.5 13.9 3 Unit V μA V pF Recommended Footprint mm inch ESRN03B01S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 3/3 Typical Characteristics Typical Breakdown Voltage vs Temperature Typical Leakage Current vs Temperature 200 5 4.6 Leakage Current IR (uA) Breakdown Voltage VBR(V) 4.8 4.4 4.2 4 3.8 3.6 IT=1mA Pin1 to Pin 2 or Pin2 to Pin1 3.4 3.2 VR=3V Pin1 to Pin 2 or Pin2 to Pin1 150 100 50 0 3 -50 0 50 Temperature (℃ ) 100 -50 150 Typical Leakage Current vs Reverse Voltage 50 Temperature (℃ ) 100 150 Typical Capacitance vs Reverse Voltage 6000 40 TA =25 ℃ Pin1 to Pin 2 or Pin2 to Pin1 5000 4000 Capacitance (pF) Leakage Current IR (μ A) 0 3000 2000 TA =25 ℃ , f=1MHz Pin1 to Pin 2 or Pin2 to Pin1 30 20 10 1000 0 0 0 1 2 3 4 5 6 0 0.5 Reverse Voltage VR(V) Percentage of rated Power or IPP (%) Clamping Voltage-Vc(V) TA =25 ℃ Waveform Parameters tr=8 μs;td=20 μs 15 10 5 0 ESRN03B01S2 6 12 18 Peak Pulse Current-IPP(A) 2 2.5 3 Power Derating Curve 25 0 1.5 Reverse Voltage VR(V) Typical Clamping Voltage vs Peak Pulse Current 20 1 24 110 100 90 80 70 60 50 40 30 20 10 0 TA=25℃ Waveform Parameters tr=8 μs;td=20 μs 0 25 50 75 100 Ambient Temperature-TA(°C) 125 150 CYStek Product Specification Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 4/4 CYStech Electronics Corp. Typical Characteristics(Cont.) Non-repetitive Peak Pulse Power vs Pulse Time Non-repetitive Peak Pulse Power vs Pulse Time Percent of IPP (%) Peak Pulse Power-PPP (W) 10000 1000 100 10 0.1 ESRN03B01S2 1 10 Pulse Time-tP(μ s) 100 1000 110 100 90 80 70 60 50 40 30 20 10 0 Waveform parameters : tr=8μs, td=20μs e -t td=IPP/2 0 5 10 15 Time(μ s) 20 25 30 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 5/5 Reel Dimension Carrier Tape Dimension ESRN03B01S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 6/6 Recommended Wave Soldering Profile ESRN03B01S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 7/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. ESRN03B01S2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C182S2 Issued Date : 2016.07.29 Revised Date : Page No. : 8/8 SOD-323 Dimension Marking: 3C 2-Lead SOD-323 Plastic Surface Mounted Package, CYStek Package Code: S2 *: Typical Inches Min. Max. 0.0630 0.0709 0.0453 0.0531 0.0315 0.0394 0.0098 0.0157 DIM A B C D Millimeters Min. Max. 1.60 1.80 1.15 1.35 0.80 1.00 0.25 0.40 DIM E H J K Inches Min. Max. 0.0060 REF 0.0000 0.0040 0.0035 0.0070 0.0906 0.1063 Millimeters Min. Max. 0.15 REF 0.00 0.10 0.089 0.177 2.30 2.70 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. ESRN03B01S2 CYStek Product Specification