TI CD74AC14M Hex schmitt-trigger inverter Datasheet

SCHS228B − SEPTEMBER 1998 − REVISED MARCH 2004
D AC Types Feature 1.5-V to 5.5-V Operation
D
D
D
D
D
D
D
E OR M PACKAGE
(TOP VIEW)
and Balanced Noise Immunity at 30% of the
Supply Voltage
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
Greater Noise Immunity Than Standard
Inverters
Operates With Much Slower Than Standard
Input Rise and Fall Slew Rates
Balanced Propagation Delays
±24-mA Output Drive Current
− Fanout to 15 F Devices
SCR Latchup-Resistant CMOS Process and
Circuit Design
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
1A
1Y
2A
2Y
3A
3Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
description/ordering information
The CD74AC14 contains six independent inverters. This device performs the Boolean function Y = A.
Each circuit functions as an independent inverter, but because of the Schmitt action, the inverters have different
input threshold levels for positive-going (VT+) and negative-going (VT−) signals.
ORDERING INFORMATION
PDIP − E
−55°C
125°C
−55
C to 125
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC − M
Tube
CD74AC14E
Tube
CD74AC14M
Tape and reel
CD74AC14M96
TOP-SIDE
MARKING
CD74AC14E
AC14M
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
logic diagram, each inverter (positive logic)
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
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&& *+' &! #", &" ""%+ %!&"
", %% #""'
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1
SCHS228B − SEPTEMBER 1998 − REVISED MARCH 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
TA = 25°C
MIN
−55°C to
125°C
MAX
MIN
−40°C to
85°C
MAX
MIN
UNIT
MAX
VCC
VI
Supply voltage
1.5
5.5
1.5
5.5
1.5
5.5
V
Input voltage
0
0
0
VCC
VCC
V
Output voltage
VCC
VCC
0
VO
IOH
VCC
VCC
0
0
V
High-level output current
VCC = 4.5 V to 5.5 V
−24
−24
−24
mA
IOL
Low-level output current
VCC = 4.5 V to 5.5 V
24
24
24
mA
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
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SCHS228B − SEPTEMBER 1998 − REVISED MARCH 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
−55°C to
125°C
TA = 25°C
VCC
−40°C to
85°C
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
VT+
Positive-going
threshold
5V
2.6
3.4
2.6
3.4
2.6
3.4
V
VT−
Negative-going
threshold
5V
1.6
2.4
1.6
2.4
1.6
2.4
V
∆VT
Hysteresis
(VT+ − VT−)
5V
0.5
0.5
0.5
1.5 V
1.4
1.4
1.4
3V
2.9
2.9
2.9
4.5 V
4.4
4.4
4.4
IOH = −50 µA
VOH
VI = VT+
IOH = −4 mA
IOH = −24 mA
IOH = −50 mA†
3V
2.58
2.4
2.48
4.5 V
3.94
3.7
3.8
IOH = −75 mA†
5.5 V
IOL = 50 µA
VOL
II
ICC
VI = VT−
VI = VCC or GND
VI = VCC or GND,
5.5 V
V
V
3.85
3.85
1.5 V
0.1
0.1
0.1
3V
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
IOL = 12 mA
IOL = 24 mA
IOL = 50 mA†
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
IOL = 75 mA†
5.5 V
IO = 0
5.5 V
V
1.65
1.65
5.5 V
±0.1
±1
±1
µA
5.5 V
4
80
40
µA
10
10
10
Ci
pF
† Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize
power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
FROM
(INPUT)
TO
(OUTPUT)
A
Y
−55°C TO
125°C
−40°C TO
85°C
MIN
MAX
MIN
MAX
2.6
10.5
2.7
9.5
2.6
10.5
2.7
9.5
UNIT
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TYP
Power dissipation capacitance
45
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UNIT
pF
3
SCHS228B − SEPTEMBER 1998 − REVISED MARCH 2004
PARAMETER MEASUREMENT INFORMATION
S1
R1 = 500 Ω†
From Output
Under Test
2 × VCC
Open
GND
CL = 50 pF
(see Note A)
R2 = 500 Ω†
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
tw
VCC
† When VCC = 1.5 V, R1 = R2 = 1 kΩ
Input
50% VCC
50% VCC
0V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATION
CLR
Input
VCC
Reference
Input
VCC
50% VCC
50% VCC
0V
0V
tsu
trec
Data
50%
Input 10%
VCC
50% VCC
CLK
90%
VOLTAGE WAVEFORMS
RECOVERY TIME
tf
VCC
50% VCC
50% VCC
tPLH
tPHL
50%
10%
90%
90%
tr
tPHL
Out-of-Phase
Output
VCC
50% VCC
10% 0 V
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
0V
In-Phase
Output
90%
tr
0V
Input
th
90%
VOH
50% VCC
10%
VOL
tf
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
50% VCC
10%
tf
50%
10%
90%
tr
VOH
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VCC
Output
Control
50% VCC
50% VCC
0V
tPLZ
tPZL
50% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
≈VCC
20% VCC
VOL
50% VCC
VOH
80% VCC
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
Phase relationships between waveforms are arbitrary.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time, with one input transition per measurement.
F. tPLH and tPHL are the same as tpd.
G. tPZL and tPZH are the same as ten.
H. tPLZ and tPHZ are the same as tdis.
Figure 1. Load Circuit and Voltage Waveforms
4
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD74AC14E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74AC14EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74AC14M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC14M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC14M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC14ME4
ACTIVE
SOIC
D
14
CU NIPDAU
Level-1-260C-UNLIM
50
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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