PolySwitch® PTC Devices Overcurrent Protection Device PRODUCT: microSMD350LR-2 DOCUMENT: SCD27892 REV LETTER: D REV DATE: JULY 26, 2016 PAGE NO.: 1 OF 3 Specification Status: Released Maximum Electrical Rating Voltage: 6.0VDC Short Circuit Current: 50A Notes: 1. Termination Finish: NiAu 2. Drawing not to scale 3. For battery application only Marking: P TABLE I. DIMENSIONS: mm: in: A B C D MIN MAX MIN MAX MIN MAX MIN MAX 3.00 3.43 0.50 1.00 2.35 2.80 0.25 0.75 (0.118) (0.135) (0.019) (0.039) (0.092) (0.110) (0.010) (0.030) TABLE II. PERFORMANCE RATINGS: CURRENT RATINGS** TIME TO TRIP** RESISTANCE VALUES AMPERES AMPERES AMPERES SECONDS OHMS AT 0°C AT 20°C AT 60°C AT 20°C, 9.5A AT 20°C HOLD TRIP HOLD TRIP HOLD TRIP MAX MIN MAX* 4.0 11.0 3.5 9.0 2.0 7.0 10.0 .0025 .011 TRIPPED-STATE POWER DISSIPATION** WATTS AT 20°C, 6.0V MAX 1.0 *Maximum resistance is measured 1 hour after reflow. **Values specified were determined using PCB’s with 0.025” x 2.0 ounce copper traces. Agency Recognition: Reference Document: Precedence: Effectivity: CAUTION: UL, CSA PS300 This specification takes precedence over documents referenced herein. Reference documents shall be the issue in effect on the date of invitation for bid. Operation beyond the rated voltage or current may result in rupture, electrical arcing or flame. Materials Information ROHS Compliant ELV Compliant Pb-Free Halogen Free* HF * Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm. © 2016 Littelfuse,Inc. Specifications are subject to change without notice. Revised July 26, 2016 littelfuse.com PolySwitch® PTC Devices Overcurrent Protection Device PRODUCT: microSMD350LR-2 DOCUMENT: SCD27892 REV LETTER: D REV DATE: JULY 26, 2016 PAGE NO.: 2 OF 3 Recommended pad layout (mm.) 2.00 2.65 1.10 1.10 Recommended reflow profile Profile Feature Average ramp up rate (Tsmax to Tp) Preheat • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (tsmin to tsmax) Time maintained above: • Temperature (TL) • Time (tL) Peak/Classification temperature (Tp) Time within 5°C of actual peak temperature (tp) Ramp down rate Time 25°C to peak temperature Pb-Free Assembly 3°C/s max. 150°C 200°C 60-120s 217°C 60-150s 260°C 30s max. 2°C/s max. 8 mins max. Note: All temperatures refer to top side of the package, measured on the package body surface. Solder reflow recommendation Recommended reflow methods: IR, hot air and Nitrogen Recommended maximum solder paste thickness: 0.25mm Recommended minimum stencil thickness: 0.1mm Devices can be cleaned using standard methods and aqueous solvents. Littelfuse believes the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device's termination. As such, we request that customers comply with our recommended solder pad layouts. Customer should validate that the solder paste amount and reflow recommendations meet its application. Littelfuse requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. © 2016 Littelfuse,Inc. Specifications are subject to change without notice. Revised July 26, 2016 littelfuse.com PolySwitch® PTC Devices Overcurrent Protection Device PRODUCT: microSMD350LR-2 DOCUMENT: SCD27892 REV LETTER: D REV DATE: JULY 26, 2016 PAGE NO.: 3 OF 3 Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, military, aerospace, medical, lifesaving, lifesustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse © 2016 Littelfuse,Inc. Specifications are subject to change without notice. Revised July 26, 2016 littelfuse.com