BAS16HLP SURFACE MOUNT FAST SWITCHING DIODE Features Mechanical Data • • • • • • • • • Fast Switching Speed Ultra-Small Surface Mount Package For General Purpose Switching Applications High Breakdown Voltage Lead Free by Design/RoHS Compliant (Note 1) "Green" Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability • • • • Case: X1-DFN1006-2 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: See Marking Information Terminals: Finish - NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.001 grams (approximate) X1-DFN1006-2 Bottom View Ordering Information (Note 3) Part Number BAS16HLP-7 BAS16HLP-7B Notes: Case X1-DFN1006-2 X1-DFN1006-2 Packaging 3,000/Tape & Reel 10,000/Tape & Reel 1. No purposefully added lead. 2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information BAS16HLP-7 BAS16HLP-7B T9 T9 Top View Dot Denotes Cathode Side Top View Bar Denotes Cathode Side BAS16HLP Document number: DS31740 Rev. 3 - 2 1 of 5 www.diodes.com T9 = Product Type Marking Code April 2011 © Diodes Incorporated BAS16HLP Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Non-Repetitive Peak Reverse Voltage Symbol VRM VRRM VRWM VR VR(RMS) IFM Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current Non-Repetitive Peak Forward Surge Current @ t = 1.0μs @ t = 1.0ms @ t = 1.0s IFSM Value 125 Unit V 100 V 71 215 4 1 0.5 V mA Value 250 500 -65 to +150 Unit mW °C/W °C A Thermal Characteristics Characteristic Power Dissipation (Note 4) Thermal Resistance Junction to Ambient (Note 4) Operating and Storage Temperature Range Symbol PD RθJA TJ , TSTG Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 5) Symbol V(BR)R Min 100 Max ⎯ Unit V Forward Voltage VF ⎯ ⎯ ⎯ ⎯ 0.715 0.855 1.0 1.25 V Peak Reverse Current (Note 5) IR ⎯ 500 50 30 30 nA μA μA nA Total Capacitance CT ⎯ 1.5 pF Reverse Recovery Time trr ⎯ 4.0 ns Notes: Test Conditions IR = 100μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 80V VR = 80V, TJ = 150°C VR = 25V, TJ = 150°C VR = 25V VR = 0V, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com. 5. Short duration pulse test used to minimize self-heating effect. BAS16HLP Document number: DS31740 Rev. 3 - 2 2 of 5 www.diodes.com April 2011 © Diodes Incorporated IF, INSTANTANEOUS FORWARD CURRENT (mA) BAS16HLP 300 PD, POWER DISSIPATION (mW) 250 200 150 100 50 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve 0 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics 150 100 2.5 TA = 150ºC 10 trr, REVERSE RECOVERY TIME (nS) IR, INSTANTANEOUS REVERSE CURRENT (μ A) 0 T A = 125ºC 1 T A = 85ºC 0.1 TA = 25ºC 0.01 TA = 0ºC 0.001 2.0 1.5 1.0 0.5 TA = -55ºC 0.0001 10 30 40 50 60 20 70 80 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics 0 0 2 4 6 8 10 IF, FORWARD CURRENT (mA) Fig. 4 Reverse Recovery Time vs. Forward Current 0.60 CT, TOTAL CAPACITANCE (pF) f = 1MHz 0.55 0.50 0.45 0.40 0 10 20 30 40 VR, REVERSE VOLTAGE (V) Fig. 5 Typical Total Capacitance BAS16HLP Document number: DS31740 Rev. 3 - 2 50 3 of 5 www.diodes.com April 2011 © Diodes Incorporated BAS16HLP Package Outline Dimensions A A1 D R E b L X1-DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10 All Dimensions in mm e Suggested Pad Layout C Dimensions Value (in mm) Z 1.1 G 0.3 X 0.7 Y 0.4 C 0.7 X Y G Z BAS16HLP Document number: DS31740 Rev. 3 - 2 4 of 5 www.diodes.com April 2011 © Diodes Incorporated BAS16HLP IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2011, Diodes Incorporated www.diodes.com BAS16HLP Document number: DS31740 Rev. 3 - 2 5 of 5 www.diodes.com April 2011 © Diodes Incorporated