1.5A LED Camera Flash Driver with I2C Compatible Interface BD7710GWL ●General Description The BD7710GWL is 1.5A Flash LED Driver with Synchronous rectification step up DC/DC converter that can drive 3LED. It is possible to set by I2C interface. With synchronous rectification (no external schottky barrier diode required) and small package, they can save mount space. ●Key Specifications ■ VBAT Input voltage ■ Operating temperature range ■ Quiescent Current ■ LED Current ■ Switching frequency ●Features 1) Synchronous rectification step-up DC/DC converter.(no external S.B.D.) 2) 3 channel current driver (maximum total 1.6A) 3) It is possible to control register by I2C interface 4) Programmable lighting mode 5) Programmable LED current 6) Programmable Battery drop protection 7) Programmable Flash timer 8) Rich safety function Over Current Protection (OCP) Over Voltage Protection (OVP) VOUT Short Protection LED short/open Protection UVLO TSD Battery drop Protection LED Temperature Monitoring ●Packages ●Typical Application Circuits ●Pin Configuration CIN 4.7µF VBAT battery SW I2C I/F ●Applications ■ Single/Dual/Triple White LED Flash Supply for Cell Phones and Smart-Phones ■ DSC,DVC ■ Video Lighting for Digital Video Applications ■ Amusement accessory VOUT COUT 10µF RESETB 1.90 ㎜×2.10 ㎜×0.55 ㎜(MAX) UCSP50L2 L 2.2µH SW 2.7V to 5.5V -40℃ to +85℃ 3.0μA(MAX) 1.6A(MAX) 2MHz(typical) [Bottom View] E LED2 LED1 LED3 VBAT D PGND PGND STRB1 NC C SW SW TX_MASK TS B SDA SCL RESETB STRB0 A NC VOUT GND GND 2 3 4 SCL SDA LED1 STRB0 LED2 STRB1 LED3 TX_MASK NC NC PGND GND TS 1 Figure 2. Pin Configuration Figure 1. 1.5A application Block diagram ○Product structure：Silicon monolithic integrated circuit .www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・14・001 ○This product is not designed protection against radioactive rays 1/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Absolute Maximum Ratings (Ta=25 oC) Parameter Maximum voltage Power Dissipation (note1) Operating Temperature Range Storage Temperature Range Note1） Symbol VMAX Pd Topr Tstg Limits 7 820 -40 to +85 -55 to +150 Unit V mW ℃ ℃ Power dissipation deleting is 6.56 mW/ oC , when it’s used in over 25 oC. (ROHM’s standard board has been mounted.) The power dissipation of the IC has to be less than the one of the package. Operating conditions (Ta= -40 to 85 oC) Parameter VBAT input voltage Symbol VBAT Electrical characteristics o (Unless otherwise noted, Ta = 25 C, VBAT=3.6V) Parameter Symbol [Supply Current] Quiescent Current Iq Current Consumption Idd1 (Device not switching) UVLO Voltage VUVLO [Switching Regulator] SW NMOS on resistance Ronn SW PMOS on resistance Ronp Switching frequency Fsw Duty cycle limit Duty Output voltage range Vo FB Voltage1 VFBT FB Voltage2 VFBF Limits 2.7 to 5.5 Unit V Min. Typ. Max. Units - 0.5 3.0 μA 9.5 - mA 2.1 2.4 V 180 180 2 80 200 400 4.65 6.0 1.5 2.0 2.4 5.5 300 4.8 6.2 - mΩ mΩ MHz % V mV mV V V V A 1.8 Over voltage Protection VOVP VOUT Short Protection Over Current Protection [LED Temperature monitoring] TS Current source TS Resistance (Warning temperature) TS Resistance (Hot temperature) [Current Driver] Torch LED Current accuracy Flash LED Current accuracy [SDA, SCL] L level input voltage Vshto OCP 1.6 4.5 5.8 - Isource Lwarn Lhot - 25 42.0 13.8 - μA kΩ kΩ ITdiff IFdiff -10 -7.5 0 0 +10 +7.5 % % VILI -0.3 - V H level input voltage VIHI 1.4 - V L level output voltage [RESETB] VOLI 0 - 0.4 VBAT +0.3 0.3 L level input voltage VILR -0.3 - 0.3 V H level input voltage VIHR 1.0 - VBAT +0.3 V RPD - 400 - kΩ VILE -0.3 - 0.3 V V kΩ Pull-down resistance [STRB0 / STRB1 / TX_MASK] L level input voltage H level input voltage VIHE 1.0 - VBAT +0.3 Pull-down resistance RPD - 400 - V Condition At OFF VBAT falling edge In Boost On, Torch mode In Boost On, Flash mode 0000≦OVP[3:0] ≦0100 0101≦OVP[3:0] ≦1111 *1 ILIM[4]=1 LEDWARN bit = 1 LEDHOT bit = 1 ILED=100mA ILED= 400mA SDA Pin, IOL=3 mA *1 This parameter is tested with dc measurement. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Terminals ESD Diode For For Power GND No. Pin Name In/ Out Pin circuit diagram A1 NC - - - - Non connect pin A2 VOUT Out D - GND Output voltage. A3 GND - G VBAT - Ground A4 GND - G VBAT - Ground B1 SDA In/ Out I VBAT GND Serial interface address/data line. B2 SCL In H VBAT GND Serial interface clock line. B3 RESETB In A VBAT GND Master hardware reset input. B4 STRB0 In A VBAT GND LED 1/2/3 enable logic input. C1 SW In E - GND Inductor connection. C2 SW In E - GND Inductor connection. C3 TX_MASK In A VBAT GND LED Current control input with RF PA synchronization. C4 TS In B VBAT GND NTC resistor connection. D1 PGND - G VBAT - Power ground. D2 PGND - G VBAT - Power ground. D3 STRB1 In A VBAT GND D4 NC - - - - E1 LED2 In C - GND LED2 driver output. E2 LED1 In C - GND LED1 driver output. E3 LED3 In C - GND LED3 driver output. E4 VBAT In F - GND Battery connection. Description LED 1/2/3 enable logic input. Non connect pin Total 20 pin www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Pin Circuit diagram VBAT VBAT VBAT A PAD C B PAD PAD VBAT F PAD D PAD VBAT G PAD E VBAT PAD VBAT H PAD VBAT I PAD Figure 3. Pin circuit diagram ●Block Diagram RESETB B3 SCL B2 VBAT SW SW E4 C1 C2 A2 Logic + FAULT Detector + SDA B1 VOUT Output Short Protect Over Voltage Protect LED Terminal Open Protect + - Control Control Sense STRB0 B4 LED Terminal Short Protect ERRAMP PWM Comparator STRB1 D3 LED1 E2 - - LED Return select + + TX_MASK C3 + LED2 E1 Current Sense LED3 E3 + NC D4 OSC VBAT Low side Current Driver + HOT WARN + A1 NC A3 A4 GND GND D1 D2 C4 PGND PGND Figure 4. Block diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/36 TS TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Typical Characteristics (Reference Data) Y-axis Quiescent Current Current Consumption ILED(100mA) ILED(400mA) Efficiency UVLO Frequency Over Voltage Protection (OVP) VOUT Short Protection Over Current Protection (OCP) TS Current source TS Resistance (Warning temperature) TS Resistance (Hot temperature) X-axis VBAT VBAT VBAT VBAT VBAT Temperature VBAT VBAT VBAT VBAT Temperature Temperature Temperature Figure-No Figure5-1 Figure5-2 Figure5-3 Figure5-4 Figure5-5 Figure5-6 Figure5-7 Figure5-8 Figure5-9 Figure5-10 Figure5-11 Figure5-12 Figure5-13 12 3 11 10 Current Consumption [mA] Quiescent Current [μA] 2.5 85℃ 2 1.5 85℃ 25℃ 1 0.5 9 8 -40℃ 25℃ 7 6 5 4 3 2 1 -40℃ 0 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 VBAT [V] VBAT [V] Figure 5-1. Quiescent Current – VBAT www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 0 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 Figure 5-2. Current Consumption - VBAT 5/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 120 460 115 440 25℃ 105 25℃ ILED(400mA) [mA] ILED(100mA) [mA] 110 420 85℃ 85℃ 400 100 95 380 90 -40℃ 360 -40℃ 85 340 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 80 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 VBAT (V) VBAT (V) Figure 5-3. ILED(100mA) – VBAT Figure 5-4. ILED(400mA) - VBAT 3 90 85 2.5 Efficiency(%) UVLO Voltage (V) 80 75 70 2 1.5 65 25℃ ILED2=750mA 60 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 -20 0 20 40 60 80 100 Ta (℃) VBAT (V) Figure 5-5. Efficiency - VBAT www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1 -40 Figure 5-6. UVLO - Temperature 6/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 2.4 6.5 6.4 OVP (6.0V) Detect Voltage (V) 2.3 2.2 Frequency (MHz) 85℃ 2.1 2 25℃ 1.9 -40℃ 1.8 1.7 6.3 6.2 -40℃ 6.1 6 5.9 5.8 25℃ 85℃ 5.7 OVP[3:0]=”1111” (Typical 6.0V) 5.6 1.6 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 5.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 VBAT (V) VBAT (V) Figure 5-7. Frequency – VBAT Figure 5-8. Over Voltage Protection (OVP) - VBAT 1.8 2.3 VOUT short limit Detect Voltage (V) -40℃ 1.7 Over Current Protection (A) 2.2 2.1 1.6 25℃ 85℃ 1.5 2 25℃ 85℃ 1.9 1.4 -40℃ 1.8 1.3 ILIM[4]=”1” (Typical 2.0A) 1.2 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 VBAT (V) VBAT (V) Figure 5-9. VOUT Short Protection – VBAT www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 1.7 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5 Figure 5-10. Over Current Protection (OCP) – VBAT 7/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 29 TS Resistance (Warning temperature)[k Ω] 50 28 VBAT=5.5V VBAT=4.2V TS Current source (μA) 27 26 25 24 VBAT=3.6V 23 VBAT=2.7V 22 21 20 -40 -20 0 20 40 Ta (℃) 60 80 100 VBAT=2.7V 49 48 47 46 45 VBAT=3.6V 44 43 42 41 40 39 38 VBAT=4.2V 37 36 35 -40 VBAT=5.5V -20 0 20 40 60 80 100 Ta (℃) Figure 5-11. TS Current source – Temperature Figure 5-12. TS Resistance (Warning temperature) - Temperature 20 TS Resistance (Hot temperature) [k Ω] 19 18 17 VBAT=2.7V VBAT=3.6V 16 15 14 13 12 11 10 VBAT=4.2V VBAT=5.5V 9 8 7 -40 -20 0 20 40 60 80 100 Ta (℃) Figure 5-13. TS Resistance (Hot temperature) – Temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Serial interface 2 It can interface with I C BUS format compatible. (1) Slave address A7 0 A6 1 A5 1 A4 0 A3 0 A2 1 A1 1 R/W 0 (2) Bit Transfer SCL transfers 1-bit data during H. During H of SCL, SDA cannot be changed at the time of bit transfer. If SDA changes while SCL is H, START conditions or STOP conditions will occur and it will be interpreted as a control signal. SDA SCL SDA a state of stability： SDA It can change Data are effective Figure 6. Bit transfer (I2C format) (3) START and STOP condition When SDA and SCL are H, data is not transferred on the I2C- bus. This condition indicates, if SDA changes from H to L while SCL has been H, it will become START (S) conditions, and an access start, if SDA changes from L to H while SCL has been H, it will become STOP (P) conditions and an access end. SDA SCL S P STOP condition START condition Figure 7. START/STOP condition (I2C format) (4) Acknowledge It transfers data 8 bits each after the occurrence of START condition. A transmitter opens SDA after transfer 8bits data, and a receiver returns the acknowledge signal by setting SDA to L. DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL 1 2 8 9 S clock pulse for acknowledgement START condition 2 Figure 8. Acknowledge (I C format) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL (5) Writing protocol A register address is transferred by the next 1 byte that transferred the slave address and the write-in command. The 3rd byte writes data in the internal register written in by the 2nd byte, and after 4th byte or, the increment of register address is carried out automatically. However, when a register address turns into the last address (07h), it is set to 00h by the next transmission. After the transmission end, the increment of the address is carried out. *1 S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A D7 D6 D5 D4 D3 D2 D1 D0 A slave address register address *1 D7 D6 D5 D4 D3 D2 D1 D0 A P DATA DATA register address increment register address increment R/W=0(write) A=acknowledge(SDA LOW) A=not acknowledge(SDA HIGH) S=START condition P=STOP condition *1: Write Timing from master to slave from slave to master Figure 9. Writing protocol (6) Reading protocol It reads from the next byte after writing a slave address and R/W bit. The register to read considers as the following address accessed at the end, and the data of the address that carried out the increment is read after it. If an address turns into the last address, the next byte will read out 00h. After the transmission end, the increment of the address is carried out. S X X X X X X X 1 A D7 D6 D5 D4 D3 D2 D1 D0 A slave address D7 D6 D5 D4 D3 D2 D1 D0 A P DATA DATA register address increment R/W=1(read) register address increment A=acknowledge(SDA LOW) A=not acknowledge(SDA HIGH) S=START condition P=STOP condition from master to slave from slave to master Figure 10. Reading protocol (7) Multiple reading protocols After specifying an internal address, it reads by repeated START condition and changing the data transfer direction. The data of the address that carried out the increment is read after it. If an address turns into the last address, the next byte will read out 00h. After the transmission end, the increment of the address is carried out. S X X X X X X X 0 A A7 A6 A5 A4 A3 A2 A1 A0 A Sr X X X X X X X 1 A slave address slave address register address R/W=0(write) R/W=1(read) D7 D6 D5 D4D3D2 D1D0 A D7D6 D5D4D3D2D1 D0 A P DATA DATA register address increment register address increment A=acknowledge(SDA LOW) A=not acknowledge(SDA HIGH) S=START condition P=STOP condition Sr=repeated START condition from master to slave from slave to master Figure 11. Multiple reading protocols As for reading protocol and multiple reading protocols, please do A(not acknowledge) after doing the final reading operation. It stops with read when ending by A(acknowledge), and SDA stops in the state of Low when the reading data of that time is 0. However, this state returns usually when SCL is moved, data is read, and A(not acknowledge) is done. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL (8) Timing diagram SDA t BUF t SU;DAT t LOW t HD;STA SCL t HD;STA t SU;STO t SU;STA t HD;DAT S Sr t HIGH P S Figure 12. Timing diagram (I2C format) (9) Electrical Characteristics (Unless otherwise specified, Ta=25 oC, VBAT=3.6V) Standard-mode Parameter Symbol Min. Typ. Max. I2C BUS format (F/S-mode) SCL clock frequency FSCL 0 100 LOW period of the SCL clock tLOW 4.7 HIGH period of the SCL clock tHIGH 4.0 Hold time (repeated) START condition After this period, the first clock is generated Set-up time for a repeated START condition Data hold time Data set-up time Set-up time for STOP condition Bus free time between a STOP and START condition Parameter Min. Fast-mode Typ. Max. 0 1.3 0.6 - 400 - kHz μs μs Unit tHD;STA 4.0 - - 0.6 - - μs tSU;STA 4.7 - - 0.6 - - μs tHD;DAT tSU;DAT tSU;STO 0 250 4.0 - 3.45 - 0 100 0.6 - 0.9 - μs ns μs tBUF 4.7 - - 1.3 - - μs Min. Cb=400pF Typ. Max. 0 - 1.7 Symbol 2 Cb=100pF(max) Min. Typ. Max. Unit I C BUS format (Hs-mode) SCL (SCLH) clock frequency FSCL 0 LOW period of the SCL (SCLH) clock TLOW 160 - - 320 - - ns HIGH period of the SCL (SCLH) clock Hold time (repeated) START condition After this period, the first clock is generated Set-up time for a repeated START condition Data hold time Data set-up time Set-up time for STOP condition Capacitive load for each bus line [SDA (SDAH) and SCL (SCLH) lines] tHIGH 60 - - 120 - - ns tHD;STA 160 - - 320 - - ns tSU;STA 160 - - 320 - - ns tHD;DAT tSU;DAT tSU;STO 0 10 160 - 70 - 0 10 320 - 150 - ns ns ns Cb - - 100 - - 400 pF - 3.4 MHz (Note) For bus line loads Cb between 100 pF and 400 pF the timing parameters must be linearly interpolated www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Register List Register data Address Function R/W D7 D6 D5 D4 D3 D2 D1 D0 00h R/W SFTRST - TLED13(2) TLED13(1) TLED13(0) TLED2(2) TLED2(1) TLED2(0) Software Reset Torch LED current setting 01h R/W MODE(1) MODE(0) FLED2(5) FLED2(4) FLED2(3) FLED2(2) FLED2(1) FLED2(0) Mode control Flash LED current setting 02h R/W MODE(1) MODE(0) - FLED13(4) FLED13(3) FLED13(2) FLED13(1) FLED13(0) Mode control Flash LED current setting 03h R/W FTIM(2) FTIM(1) FTIM(0) HPLF SELFTIM TO STT SFT TXMASK 04h R/W - - ILIM - - - - 05h R/W - ENPSM - - ENLED3 ENLED2 ENLED1 LED Enable Over Voltage Protection setting LED Temperature Monitoring setting STSTRB1 06h R/W ENTS LEDHOT LEDWARN - OVP(3) OVP(2) OVP(1) OVP(0) 07h R/W ENBATDET BATDET(2) BATDET(1) BATDET(0) - - - - Flash timer setting Over Current Protection setting Battery drop Protection Input "0” for "-". A free address has the possibility to assign it to the register for the test. Access to the register for the test and the undefined register is prohibited. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Register Map Address 00h < Software Reset / Torch LED current setting > Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 00h R/W SFTRST - TLED13(2) TLED13(1) TLED13(0) TLED2(2) TLED2(1) TLED2(0) Initial Value 0Ah 0 - 0 0 1 0 1 0 Bit[2:0] : TLED2(2:0) LED2 Torch current setting “000” : 0mA “001” : 25mA “010” : 50mA *initial value “011” : 75mA “100” : 100mA “101” : 125mA “110” : 150mA “111” : 175mA Bit[5:3] : TLED13(2:0) LED1,3 Torch current setting “000” : 0mA “001” : 25mA *initial value “010” : 50mA “011” : 75mA “100” : 100mA “101” : 125mA “110” : 150mA “111” : 175mA Bit6 : (Not used) Bit7 : SFTRST Software Reset “0” : Reset cancel *initial value “1” : Reset(All register initializing) Refer to “Reset” for detail. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 01h < Mode control / Flash LED current setting > Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 01h R/W MODE(1) MODE(0) FLED2(5) FLED2(4) FLED2(3) FLED2(2) FLED2(1) FLED2(0) Initial Value 10h 0 0 0 1 0 0 0 0 Bit[5:0] : FLED2(5:0) LED2 Flash current setting “000000” : 0mA “000001” : 25mA “000010” : 50mA “000011” : 75mA “000100” : 100mA “000101” : 125mA “000110” : 150mA “000111” : 175mA “001000” : 200mA “001001” : 225mA “001010” : 250mA “001011” : 275mA “001100” : 300mA “001101” : 325mA “001110” : 350mA “001111” : 375mA “010000” : 400mA *initial value “010001” : 425mA “010010” : 450mA “010011” : 475mA “010100” : 500mA “010101” : 525mA “010110” : 550mA “010111” : 575mA “011000” : 600mA “011001” : 625mA “011010” : 650mA “011011” : 675mA “011100” : 700mA “011101” : 725mA “011110” : 750mA “011111” : 775mA “100000” : 800mA ・ ・ ・ “111111” : 800mA Bit[7:6] : MODE(1:0) control “00” : shutdown mode “01” : Torch mode “10” : Flash mode “11” : shutdown mode *initial value To avoid device shutdown by torch safety timeout, MODE(1:0) bits need to be refreshed within less than 13.0s. Writing to Address01h Bit[7:6] automatically updates Address 02h Bit[7:6]. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 02h < Mode control / Flash LED current setting > Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 02h R/W MODE(1) MODE(0) - FLED13(4) FLED13(3) FLED13(2) FLED13(1) FLED13(0) Initial Value 08h 0 0 - 0 1 0 0 0 Bit[4:0] : FLED13(4:0) LED1,3 Flash current setting “00000” : 0mA “00001” : 25mA “00010” : 50mA “00011” : 75mA “00100” : 100mA “00101” : 125mA “00110” : 150mA “00111” : 175mA “01000” : 200mA *initial value “01001” : 225mA “01010” : 250mA “01011” : 275mA “01100” : 300mA “01101” : 325mA “01110” : 350mA “01111” : 375mA “10000” : 400mA ・ ・ ・ “11111” : 400mA Bit5 : (Not used) Bit[7:6] : MODE(1:0) control “00” : shutdown mode “01” : Torch mode “10” : Flash mode “11” : shutdown mode *initial value To avoid device shutdown by torch safety timeout, MODE(1:0) bits need to be refreshed within less than 13.0s. Writing to Address02h Bit[7:6] automatically updates Address 01h Bit[7:6]. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 15/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 03h < Flash timer setting / TX_MASK setting> Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 03h R/W FTIM(2) FTIM(1) FTIM(0) HPLF SELFTIM TO STT SFT TXMASK Initial Value C1h 1 1 0 0 0 0 0 1 Bit0 : TXMASK TX_MASK pin function setting “0” : TX_MASK pin doesn’t affect for output current “1” : IF TX_MASK pin =H Flash current is reduced to Torch current. Bit1 : SFT Start/Flash Timer “0” : No change in the LED current “1” : LED current ramps to the Flash current level Bit2 : STT Safety Timer Trigger “0” : FLASH safety timer is level sensitive “1” : FLASH safety timer is rising edge sensitive Bit3 : SELFTIM Safety Timer Range Selection (write only) “0” : safety timer range 0 “1” : safety timer range 1 TO Time out flag (read only) “0” : No time-out event occurred “1” : Time-out event occurred Bit4 : HPLF LED failure flag (read only) “0” : Normal “1” : LED failed (open or shorted) Bit[7:5] : FTIM(2:0) Flash timer setting FTIM(2:0) RANGE0 RANGE1 000 68.2ms 5.3ms 001 102.2ms 10.7ms 010 136.3ms 16.0ms 011 170.4ms 21.3ms 100 204.5ms 26.6ms 101 340.8ms 32.0ms 110 579.3ms 37.3ms 111 852.0ms 71.5ms (RANGE0:SELFTIM=”0” / RANGE1:SELFTIM=”1”) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 04h < Over Current Protection setting> Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 04h R/W - - - ILIM - - - - Initial Value 01h - - - 1 - - - - Bit[3:0] : (Not used) Bit[4] : ILIM Over Current Protection setting “0” : 1.5A “1” : 2.0A Bit[7:5] : (Not used) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 05h < LED Enable> Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 05h R/W - ENPSM STSTRB1 - - ENLED3 ENLED2 ENLED1 Initial Value 62h - 1 1 - - 0 1 0 Bit0 : ENLED1 LED1 enable “0” : LED1 input is disabled “1” : LED1 input is enabled Bit1 : ENLED2 LED2 enable “0” : LED2 input is disabled “1” : LED2 input is enabled Bit2 : ENLED3 LED3 enable “0” : LED3 input is disabled “1” : LED3 input is enabled Bit[4:3] : (Not used) Bit5 : STSTRB1 Bit6 : ENPSM Enable Power-save mode “0”, “1” : Power-save mode is enabled Bit7 : (Not used) STRB1 Input Status bit (read only) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 06h < Over Voltage Protection setting, LED Temperature Monitoring setting> Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 06h R/W ENTS LEDHOT LEDWARN - OVP(3) OVP(2) OVP(1) OVP(0) Initial Value 09h 0 0 0 - 1 0 0 1 Bit[3:0] : OVP(3:0) Over Voltage Protect setting “0000” : 4.65V “0001” : 4.65V “0010” : 4.65V “0011” : 4.65V “0100” : 4.65V “0101” : 6.0V “0110” : 6.0V “0111” : 6.0V “1000” : 6.0V “1001” : 6.0V *initial value “1010” : 6.0V “1011” : 6.0V “1100” : 6.0V “1101” : 6.0V “1110” : 6.0V “1111” : 6.0V Bit4 (not used) Bit5 : LEDWARN LED Temperature Warning Flag *(read only) This flag is reset after readout. 0 : TS input voltage≧1.05V 1 : TS input voltage＜1.05V When Detection of “LED temperature Warning” was continued for 20μs at Torch / Flash mode, LEDWARN becomes to '1'. [NOTE] Even if this readout nothing, the detect operation of LEDWARN must be performed . Bit6 : LEDHOT LED Excessive Temperature Flag This bit can be reset by writing a logic level zero. 0 : TS input voltage≧0.345V 1 : TS input voltage＜0.345V When Detection of “LED temperature Hot" was continued for 20μs at Torch / Flash mode, LEDHOT becomes to '1'. And This IC goes automatically in shutdown mode to avoid damaging the LED. MODE[1:0] bits are reset. This status(bit=”1”) is latched until the LEDHOT flag gets cleared by software. Bit7 : ENTS LED Temperature Monitoring setting. 0: LED Temperature Monitoring disable 1: LED Temperature Monitoring enable www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Address 07h < Battery drop Protection > Address R/W Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 07h R/W ENBATDET BATDET(2) BATDET(1) BATDET(0) - - - - Initial Value 40h 0 1 0 0 - - - - Bit[3:0] : (Not used) Bit[6:4] : BATDET(2:0) Battery drop Protection “000” : 50mV “001” : 75mV “010” : 100mV “011” : 125mV “100” : 150mV *initial value “101” : 175mV “110” : 200mV “111” : 225mV Bit7 : ENBATDET Enable for Battery drop Protection “0” : Battery drop protection disable “1” : Battery drop protection enable www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Functional Description 1. Reset There are two kinds of reset, software reset and hardware reset (1) Software reset ・All the registers are initialized by SFTRST="1". ・SFTRST is an automatically returned to "0". (Auto Return 0). (2) Hardware reset ・It shifts to hardware reset by changing RESETB pin “H” → “L”. ・The condition of all the registers under hardware reset pin is returned to the Initial Value, and it stops accepting all address. All LED driver turn off. ・It’s possible to release from a state of hardware reset by changing RESETB pin “L” → “H”. (3) Reset sequence ・When software reset was done during hardware reset, software reset is canceled.(Because the Initial Value of software reset is “0”) 2. Shutdown Writing 00 to MODE[1:0] bits forces the device into shutdown. In the Shutdown state: ・The regulator stops switching. ・The high-side PMOS disconnects the load from the input. ・The LEDx pins are high impedance thus eliminating any DC conduction path (Current driver OFF) 3. Power up/down sequence Please take sufficient wait time for each Power/Control signal. However, If VBAT<2.6V or On TSD, the command input is not effective because of the protection operation. 2.6V TVBATON≧mim0.0ms VBAT TVBATOFF≧mim0.0ms RESETB TRSTBON≧mim0.1ms COMMAND Inhibit Possible TRSTBOFF≧mim0.0ms Inhibit Figure 13. Power up/down sequence www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 4. PWM current mode DC/DC converter While this IC is boosting, the lowest voltage of LED1, 2, 3 is detected, PWM duty is decided to be 0.2V (Torch mode) or 0.4V (Flash mode) and output voltage is kept invariably. As for the inputs of the PWM comparator as the feature of the PWM current mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into Slope waveform to prevent sub harmonic oscillation. This output controls internal Nch Tr via the RS latch. In the period where internal Nch Tr gate is ON, energy is accumulated in the external inductor, and in the period where internal Nch Tr gate is OFF, energy is transferred to the output capacitor via internal Pch Tr. This IC has many safety functions, and their detection signals stop switching operation at once. 5. Pulse skip control This IC regulates the output voltage using an improved pulse-skip. In “pulse-skip” mode the error amplifier disables “switching” of the power stages when it detects low output voltage and high input voltage. The oscillator halts and the controller skip switching cycles. The error amplifier reactivates the oscillator and starts switching of the power stages again when this IC detects low input voltage. The “pulse-skip” regulation minimizes the operating current because this IC does not switch continuously and hence the losses of the switching are reduced. When the error amplifier disables “switching”, the load is also isolated from the input. VOUT Pulse skip SW Figure 14. Pulse skip control www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 6.DC/DC Soft start function Soft start function will prevent IC from appearing the In-rush current. The detail of soft start is as following. Enable (internal signal) VOUT Iin ILED Soft Start Figure 15. Soft Start with enable signal 7. Flash / Torch mode control Register (I2C control) MODE(1) MODE(0) 0 1 0 1 0 1 1 0 External pin State of device behavior STRB0 STRB1 MODE * * shutdown Stand-by for Flash/Torch * * 0 0 1 1 0 1 0 1 0 1 Torch Torch with safety timer Torch without safety timer Stand-by for Flash/Torch Flash Flash Torch without safety timer Flash/Torch control can be done by I2C register and external pin. MODE[1:0]: Mode select “00” : shutdown mode “01” : Torch mode “10” : Flash mode “11” : shutdown mode For Torch mode, a watchdog timer is implemented; This must be refreshed within 13.0 seconds. This function can be disabled, as described below. MODE[1:0] = 01 : The STRB0, STRB1 inputs are disabled. The device regulates the LED current in torch mode(TLED bits) regardless of the STRB0, STRB1 inputs and the START_FLASH/TIMER (SFT) bit. To avoid device shutdown because of the torch safety timeout, MODE[1:0] must be refreshed within less than 13.0 seconds (STRB1=0). The torch watchdog timer can be disabled by pulling the STRB1 signal high. MODE[1:0] = 10 : The STRB0, STRB1 inputs are enabled. The flash pulse can be triggered by these synchronization signals, or by a software command (START_FLASH/TIMER (SFT) bit). The LEDs are enabled/disabled according to the STRB0, STRB1 input. The flash safety timer is activated, and the torch watchdog timer is disabled. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 23/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 8. LED Current Ramp-Up / Down (Flash mode) LED Current Ramp-Up LED Current Ramp-Down Istep = 25mA Trise = 12μs Istep = 25mA Tfall = 0.5μs LED Current Istep Time Tfall Trise Figure 16. Flash LED current Ramp-Up/Down www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 9. Example of Flash / Torch mode control <Torch control example> Ex1. Torch with safety timer MODE(1:0)=01 I2C (SCL, SDA) command (LOW) STRB1 Safety timer = 13.0s Torch current ILED(0mA) Figure 17. Torch with safety timer Ex2. Torch without safety timer MODE(1:0)=01 I2C (SCL, SDA) command STRB1 MODE(1:0)=00 (13.0s) Torch current ILED(0mA) Figure 18. Torch without safety timer <Flash control example> (Unless otherwise specified STRB1=0) Ex3. Flash synchronized with STRB0 TX_MASK (LOW) STRB0 FTIM(3:0) Flash current ILED (0mA) Figure 19. Flash synchronized with STRB0 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 25/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Ex4. Flash with safety timer TX_MASK (LOW) STRB0 FTIM(3:0) Flash current ILED(0mA) Figure 20. Flash with safety timer Ex5. Flash inhibit during safety timer TX_MASK STRB0 FTIM(3:0) Flash current ILED (0mA) Torch current Figure 21. Flash inhibit during safety timer Ex6. Flash mask by TX_MASK TX_MASK STRB0 ILED (0mA) Torch current Figure 22. Flash mask by TX_MASK Ex7. Flash mask by STRB1 TX_MASK (Don’t care) STRB1 STRB0 ILED (0mA) Torch current Figure 23. Flash mask by STRB1 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 26/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 10. Over Voltage Protection / LED open Protection At such an error of output open as the output DC/DC and the LED is not connected to IC, the DC/DC will boost too much and the VOUT terminal exceed the absolute maximum ratings, and may destruct the IC. Therefore, when VOUT becomes sensing voltage or higher, the over voltage limit works, and turns off the output Tr, and the pressure up made stop. And LED1 turns off by LED open Protection. At this moment, the IC changes from activation into non-activation, and the output voltage goes down slowly. And, when the Feedback of LED1 isn’t returned, so that Vout will return normal voltage. When all the LED terminals become open, DC/DC and Current Driver turned off. LED1 connection LED2 connection VOUT normal open normal Vout LED1 voltage LED1 LED2 FeedBack voltage LED1 LED2 LED1 current 400mA OFF LED2 current 400mA Figure 24. LED open Protection 11. VOUT Short Protection In the case of VOUT is shorted to GND, the coil or internal Tr may be destructed. Therefore, at such an error as VOUT becoming 1.5V or below, and turns off the output Tr, and prevents the coil and the IC from being destructed. And the IC goes automatically into shutdown, and current does not flow to the coil (0mA). 12. LED short Protection (LED1,2,3 – VOUT short) This IC has LED short protection. At start-up, each LED pin pull-down at 250kohm (typ.).At start-up, when it becomes to (Vout×0.8<VLED), it shut down the detected channels (LED Short Protection work).This IC monitors the voltage of each LED terminal after start-up.Then if the LEDs become short during operation, it turn off this IC. In the case of LED short, only the strings which short-circuited is turned off and LED current of other lines continue to turn on. This protection prevent from heat of IC. When all the LED terminals become short, DC/DC and Current Driver turned off. LED1 short LED1 0.4V(typ) VOUT LED2 0.4V(typ) LED1 LED2 LED1 current 400mA LED2 current 400mA OFF (400mA is initial value of Flash current) LED SHORT Detect with OUT×0.8V＜LED Figure 25. LED short Protection www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 27/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL 13. Thermal shutdown This IC has thermal shutdown function. The thermal shutdown works at 175°C or higher, and the IC goes automatically into shutdown. 14. Over Current Protection This IC has Over Current Protection (OCP). When the SW current flows detect resistor that is connected between internal NMOS SW and PGND, Once the inductor current exceeds the current limit, the internal SW switch turns off immediately until the next switching cycle, effectively limiting the peak inductor current each cycle. Because OCP shortens the duty cycle, the output voltage drops if the over-current condition occurs. 15. Under Voltage Lockout This IC has Under Voltage Lockout (UVLO). When VBAT voltage is less than 2.1V(typical), the IC turns off the output Tr, and prevents the coil and the IC from being destructed. And the IC goes automatically into shutdown. 16. Sensing the LED Temperature This IC requires a NTC(Negatire temperature coefficient) thermistor for sensing the LED temperature. Once the temperature monitoring feature is activated, a regulated bias current is driven out of the TS port to produce a voltage across the thermistor. If the temperature of the NTC-thermistor rises due to the heat dissipated by the LED, the voltage on the TS input pin decreases. When this voltage goes below the “warning threshold”, the LEDWARN bit in Address06h is set. This flag is cleared by reading the register. If the voltage on the TS input decreases further and falls below “hot threshold”, the LEDHOT bit in Address 06h is set and the device goes automatically into shutdown mode to avoid damaging the LED. This status is latched until the LEDHOT flag gets cleared by software. Programmed Flash ON duration LED Current TS Flash ON Flash OFF (Shutdown) TS LED1 LED2 LEDWARN : 1.05V LED3 LEDHOT : 0.345V Time Figure 26. Sensing the LED Temperature 17. Battery drop Protection The battery voltage may drop during a flash strobe. This IC has a function that detects battery voltage drop and stops LED current from ramping further. The limit of battery voltage drop can be set with register of address07h. If battery voltage drop exceeds set voltage, it stops LED current from ramping further and prevents battery voltage drop anymore. Target Flash Current Actual Flash Current LED current stopped from ramping further Flash Current VBAT Battery drop threshold exceeded Maximum allowed Battery drop (BATDET[2:0]) STRB0 Figure 27. Battery drop Protection www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 28/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Recommended Layout Pattern In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as efficiency, ripple and the likes change greatly with layout patterns, which please note carefully. 4-layer board is recommended for better radiation of heat. CIN 4.7µF VBAT battery L 2.2µH SW SW VOUT COUT 10µF RESETB I2C I/F SCL LED SDA LED1 LED2 LED3 STRB0 STRB1 TX_MASK NC NC PGND GND TS NTC Figure 28. Circuit example VBAT LED1 PGND / GND LED CIN L COUT LED LED NTC GND BD7710 Figure 29. Frontal surface (TOP VIEW) Figure 30. Middle surface1 (TOP VIEW) LED3 LED2 PGND / GND Figure 31. Middle surface2 (TOP VIEW) www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Figure 32. Rear surface (TOP VIEW) 29/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Selection of Components Externally Connected Coil(L) Size(mm) L W H DCR (ohm) VLF302512MT-2R2M 3.0 2.5 1.2 0.055 TDK VLF504012MT-2R2M 5.0 4.0 1.2 0.046 Vendor Parts number MURATA Value Vendor Parts number 2.2μH TDK 2.2μH Capacitor Value Size(mm) L W H GRM155R60J475ME47D 1.0 0.5 0.5 CIN 4.7μF COUT 10μF MURATA GRM188B30J106ME47D 1.6 0.8 0.8 22μF MURATA GRM188R60J226MEA0D 1.6 0.8 0.8 Value Vendor Parts number 220kΩ MURATA NCP18WM224J03RB NTC www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 30/36 Size(mm) L W H 1.6 0.8 0.8 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Power dissipation (On the ROHM’s standard board) 1.5 Power Dissipation Pd （W) 1.3 1.0 820mW 0.8 0.5 0.3 0.0 0 25 50 75 100 125 150 Ta（℃） Figure 33. Power dissipation Information of the ROHM’s standard board Material : glass-epoxy th Size : 50mm×58mm×1.75mm（8 layer） www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 31/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL Cautions on use ( 1 ) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Operating conditions These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are guaranteed under the conditions of each parameter. (3) Reverse connection of power supply connector The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal. (4) Power supply line Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) GND voltage Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric transient. (6) Short circuit between terminals and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal, the ICs can break down. (7) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (8) Inspection with set PCB On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set PCB. (9) Input terminals In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 32/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ( 10 ) Ground wiring pattern If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well. ( 11 ) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. ( 12 ) Thermal shutdown circuit (TSD) When junction temperatures become 175°C (typical) or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. ( 13 ) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. ( 14 ) Selection of coil Select the low DCR inductors to decrease power loss for DC/DC converter. www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 33/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Ordering Information B D 7 7 1 0 G W L Part Number - Package GWL: UCSP50L2 UCSP50L2 (BD7710GWL) E2 Packaging and forming specification E2: Embossed tape and reel -Packing specification- Tape Embossed carrier tape (heat sealing method) Quantity 3,000pcs/Reel Direction of feed E2 (See Fig. 2) 1234 1234 Reel 1234 1234 1234 1234 Direction of feed 1pin Figure 34. Typical Tape and Reel configuration ●Marking Diagram UCSP50L2 (TOP VIEW) 1PIN MARK Part Number Marking 7 7 1 0 LOT Number Figure 35. Marking Diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 34/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Package 20Pin UCSP50L2 CSP small package SIZE : 1.90mm x 2.10mm A ball pitch : 0.4mm Height : 0.55mm max (UNIT: mm) Figure 36. Package size www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 35/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet BD7710GWL ●Revision History Date Revision 5.December.2012 001 New Release 30.January.2013 002 20.May.2013 003 P22 Additional page about DC/DC operation P10,11,21,23,24,25,26,27,28,29,31,34,35 Figure Numbering is updated. P23,24,25,26,27,28 Title Numbering is updated. P1 Additional items about Key Specifications. P1 About General Description, explanation is updated. P2 About Storage Temperature Range: Value is changed. P2 Parameter name of Electrical characteristics is changed. P3 Terminals Description is updated. P5 Y-axis name of the table is updated P7 Figure name is updated. P12 Function explanation is updated. P17 Title is updated. P17 About bit[4] ILIM, explanation is updated. P18. Title modification. “Address 05” -> “Address 05h” About bit6 ENPSM, expression style is changed. P19 Title modification. About bit[3:0]OVP, explanation is updated. About bit5 LEDWARN, explanation is updated. About bit6 LEDHOT, explanation is updated. About bit7 ENTS, explanation is added. P20 Title modification. “Address 07” -> “Address 07h” P21 About “Reset sequence”, explanation is updated. P27 About “Over Current Protection”, explanation is updated. P27 About ”VOUT Short Protection”, title is changed. P28 About “Battery drop Protection”, Figure name is changed. P32 About Power supply line, explanation is updated. P4 Change Black Diagram www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Changes 36/36 TSZ02201-0F2F0C200010-1-2 20.May.2013 Rev.003 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice - GE © 2014 ROHM Co., Ltd. All rights reserved. Rev.002 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2014 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD7710GWL - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD7710GWL UCSP50L2 3000 3000 Taping inquiry Yes