LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 LMH6505 Wideband, Low Power, Linear-in-dB, Variable Gain Amplifier Check for Samples: LMH6505 • 2 • • • • • • • • • • • • VS = ±5V, TA = 25°C, RF = 1 kΩ, RG = 100Ω, RL = 100Ω, AV = AVMAX = 9.4 V/V, Typical Values Unless Specified. −3 dB BW 150 MHz Gain Control BW 100 MHz Adjustment Range (<10 MHz) 80 dB Gain Matching (Limit) ±0.50 dB Supply Voltage Range 7V to 12V Slew Rate (Inverting) 1500 V/μs Supply Current (No Load) 11 mA Linear Output Current ±60 mA Output Voltage Swing ±2.4V Input Noise Voltage 4.4 nV/√Hz Input Noise Current 2.6 pA/√Hz THD (20 MHz, RL = 100Ω, VO = 2 VPP) −45 dBc Near ideal input characteristics (i.e. low input bias current, low offset, low pin 3 resistance) enable the device to be easily configured as an inverting amplifier as well. To provide ease of use when working with a single supply, the VG range is set to be from 0V to +2V relative to the ground pin potential (pin 4). VG input impedance is high in order to ease drive requirement. In single supply operation, the ground pin is tied to a "virtual" half supply. The LMH6505’s gain control is linear in dB for a large portion of the total gain control range from 0 dB down to −85 dB at 25°C, as shown below. This makes the device suitable for AGC applications. For linear gain control applications, see the LMH6503 datasheet. The LMH6505 is available in either the 8-Pin SOIC or the 8-Pin VSSOP package. The combination of minimal external components and small outline packages allows the LMH6505 to be used in spaceconstrained applications. APPLICATIONS Variable Attenuator AGC Voltage Controlled Filter Video Imaging Processing DESCRIPTION The LMH6505 is a wideband DC coupled voltage controlled gain stage followed by a high speed current feedback operational amplifier which can directly drive a low impedance load. The gain adjustment range is 80 dB for up to 10 MHz which is accomplished by varying the gain control input voltage, VG. Maximum gain is set by external components, and the gain can be reduced all the way to cutoff. Power consumption is 110 mW with a speed of 150 MHz and a gain control bandwidth (BW) of 100 MHz. Output referred DC offset voltage is less than 55 mV over the entire gain control voltage range. Device-todevice gain matching is within ±0.5 dB at maximum gain. Furthermore, gain is tested and ensured over a wide range. The output current feedback op amp allows high frequency large signals (Slew Rate = 1500 V/μs) and can also drive a heavy load current (60 mA) ensured. 12 11 10 10 9 125°C -10 8 25°C -30 125°C -50 7 -55°C dB 6 5 V/V 4 25°C 3 -55°C 2 -70 1 -90 -0.5 0 0 0.5 1 1.5 2 VG (V) Figure 1. Gain vs. VG Typical Application VG 1 VIN 2 V + 8 6 3 7 RG 100: 4 5 V - RF 1 k: RL 100: Figure 2. AVMAX = 9.4 V/V 1 2 30 GAIN (dB) • • • • GAIN (V/V) FEATURES 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2013, Texas Instruments Incorporated LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) (3) ESD Tolerance Human Body Model 2000V Machine Model 200V Input Current Output Current ±10 mA (4) 120 mA Supply Voltages (V+ - V−) 12.6V + − Voltage at Input/ Output pins V +0.8V, V −0.8V Storage Temperature Range −65°C to 150°C Junction Temperature 150°C Soldering Information: (1) (2) (3) (4) Infrared or Convection (20 sec) 235°C Wave Soldering (10 sec) 260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). The maximum output current (IOUT) is determined by device power dissipation limitations or value specified, whichever is lower. Operating Ratings (1) Supply Voltages (V+ - V−) Temperature Range Thermal Resistance: (1) (2) 2 7V to 12V (2) −40°C to +85°C (θJC) (θJA) 8 -Pin SOIC 60 165 8-Pin VSSOP 65 235 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics. The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 Electrical Characteristics (1) Unless otherwise specified, all limits are ensured for TJ = 25°C, VS = ±5V, AVMAX = 9.4 V/V, RF = 1 kΩ, RG = 100Ω, VIN = ±0.1V, RL = 100Ω, VG = +2V. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (2) Typ (3) Max (2) Units Frequency Domain Response −3 dB Bandwidth BW VOUT < 1 VPP 150 VOUT < 4 VPP, AVMAX = 100 38 40 GF Gain Flatness VOUT < 1 VPP 0.9V ≤ VG ≤ 2V, ±0.2 dB Att Range Flat Band (Relative to Max Gain) Attenuation Range (4) ±0.2 dB Flatness, f < 30 MHz 26 ±0.1 dB Flatness, f < 30 MHz 9.5 BW Control Gain control Bandwidth VG = 1V CT (dB) Feed-through GR Gain Adjustment Range (5) MHz MHz dB 100 MHz VG = 0V, 30 MHz (Output/Input) −51 dB f < 10 MHz 80 f < 30 MHz 71 0.5V Step 2.1 ns 10 % dB Time Domain Response tr, tf Rise and Fall Time OS % Overshoot SR Slew Rate (1) (2) (3) (4) (5) (6) Non Inverting 900 Inverting 1500 V/μs Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No ensured specification of parametric performance is indicated in the Electrical Tables under conditions of internal self-heating where TJ > TA. Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using the Statistical Quality Control (SQC) method. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Flat Band Attenuation (Relative To Max Gain) Range Definition: Specified as the attenuation range from maximum which allows gain flatness specified (either ±0.2 dB or ±0.1 dB), relative to AVMAX gain. For example, for f < 30 MHz, here are the Flat Band Attenuation ranges: ±0.2 dB: 19.7 dB down to -6.3 dB = 26 dB range ±0.1 dB: 19.7 dB down to 10.2 dB = 9.5 dB range Gain control frequency response schematic: RF 1 k: +0.2 VDC +VIN LMH6505 PORT 2 - RL 50: VG RG 100: (6) +5V C1 0.01 PF RF IN PORT 1 ROUT 50: + R1 50: RT 50: RP1 10 k: 1V DC -5V Slew rate is the average of the rising and falling slew rates. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 3 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com Electrical Characteristics(1) (continued) Unless otherwise specified, all limits are ensured for TJ = 25°C, VS = ±5V, AVMAX = 9.4 V/V, RF = 1 kΩ, RG = 100Ω, VIN = ±0.1V, RL = 100Ω, VG = +2V. Boldface limits apply at the temperature extremes. Symbol Parameter Conditions Min (2) Typ (3) Max (2) Units Distortion & Noise Performance HD2 2nd Harmonic Distortion HD3 3rd Harmonic Distortion –61 THD Total Harmonic Distortion −45 En tot Total Equivalent Input Noise f > 1 MHz, RSOURCE = 50Ω 4.4 nV/√Hz IN Input Noise Current f > 1 MHz 2.6 pA/√Hz DG Differential Gain f = 4.43 MHz, RL = 100Ω 0.30 % DP Differential Phase 0.15 deg −47 2VPP, 20 MHz dBc DC & Miscellaneous Performance GACCU G Match Gain Accuracy (See Application Information) VG = 2.0V Gain Matching (See Application Information) VG = 2.0V — ±0.50 0.8V < VG < 2V — +4.2/−4.0 0.890 0.830 0.940 0.990 1.04 RG = 100Ω ±0.60 ±0.50 ±0.74 V ±6.0 ±5.0 ±7.4 mA K Gain Multiplier (See Application Information) VIN NL Input Voltage Range VIN L 0.8V < VG < 2V RG Open I RG_MAX RG Current Pin 3 IBIAS Bias Current Pin 2 (7) TC IBIAS Bias Current Drift Pin 2 (8) RIN Input Resistance Pin 2 CIN Input Capacitance Pin 2 IVG VG Bias Current Pin 1, VG = 2V TC IVG VG Bias Drift Pin 1 R VG VG Input Resistance Pin 1 C VG VG Input Capacitance Pin 1 VOUT L Output Voltage Range RL = 100Ω VOUT NL 0 ±0.50 +0.1/−0.53 +4.3/−3.9 −0.6 (7) (8) ±2.1 ±1.9 RL = Open µA nA/°C MΩ 2.8 pF 0.9 µA 10 pA/°C 25 MΩ 2.8 pF ±2.4 V ±3.1 0.12 Ω ±80 mA DC Output Current VOUT = ±4V from Rails VO Output Offset Voltage 0V < VG < 2V +PSRR +Power Supply Rejection Ratio Input Referred, 1V change, VG = 2.2V –65 –72 −PSRR −Power Supply Rejection Ratio (9) Input Referred, 1V change, VG = 2.2V –65 –75 IS Supply Current No Load 9.5 7.5 11 4 −2.5 −2.6 7 Output Impedance (7) (8) (9) V/V 1.28 IOUT (9) dB ±3 ROUT OFFSET dB ±60 ±40 ±10 ±55 ±70 mV dB dB 14 16 mA Positive current corresponds to current flowing into the device. Drift is determined by dividing the change in parameter distribution at temperature extremes by the total temperature change. +PSRR definition: [|ΔVOUT/ΔV+| / AV], −PSRR definition: [|ΔVOUT/ΔV−| / AV] with 0.1V input voltage. ΔVOUT is the change in output voltage with offset shift subtracted out. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 Connection Diagram VG 1 8 2 7 VIN + V I - X1 RG GND 3 4 6 + VOUT 5 V- Figure 3. 8-Pin SOIC/VSSOP Top View Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 5 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. Frequency Response Over Temperature 85°C GAIN 100 0 50 -1 0 -2 PHASE -3 -50 85°C -4 -100 25°C -150 -5 -40°C GAIN (dB) -40°C -2 PHASE (°) 25°C -1 GAIN (dB) 1 150 VG = 2V GAIN -3 -50 -100 -4 -5 -250 -7 -8 P = -22 dBm IN -300 -8 P = -22 dBm IN -9 1M -350 GAIN 1 0 0 -150 -1 PHASE -200 -2 -6 VG = 0.8V -250 PIN = 4 dBm VG = 2V 0 -40 -3 4 VPP -4 -240 -8 -400 -9 -280 4 VPP 2 VPP -320 1 VPP 0 f (50 MHz/DIV) -360 f (50 MHz/DIV) Figure 7. Frequency Response for Various VG (AVMAX = 100) (Large Signal) Frequency Response for Various Amplitudes 2 80 50 GAIN 0 -200 1 VPP PHASE -7 -350 -120 -160 -5 Gain/Phase normalized to low frequency value at each setting. Figure 6. 1 -80 2 VPP -6 -300 VG = 1V 0 GAIN -2 GAIN (dB) VG = 0.8V 40 -1 PHASE (°) GAIN (dB) 1 -100 0 RG = 510: 1G Inverting Frequency Response 50 VG = 2V -50 -5 -350 100M FREQUENCY (Hz) VG = 1V RF = 1 k: -300 Gain/Phase normalized to low frequency value at each setting. Figure 5. Frequency Response (AVMAX = 2) -4 -250 VG = 1V 10M FREQUENCY (Hz) -3 AVMAX = 2V/V -200 VG = 2V VG = 0.9V -9 1M Gain/Phase normalized to low frequency value at 25°C. Figure 4. 2 -150 VG = 0.7V -7 3 0 PHASE -6 1G 50 VG = 0.9V -200 100M 100 VG = 0.7V -6 10M VG = 1V PHASE (°) 0 Frequency Response for Various VG 150 PHASE (°) 1 GAIN 40 0 0 -2 -40 -4 1 VPP 0 0.8V -1 -50 -80 PHASE -4 -5 2V AVMAX = 100V/V RF = 2.32 k: -6 RG = 18: PIN = -24 dBm, -7 0 f (10 MHz/DIV) -120 -160 -150 -6 4 VPP -8 -200 -250 -10 2 VPP -200 -12 -240 -14 -300 -350 0 f (20 MHz/DIV) Gain/Phase normalized to low frequency value at each setting. Figure 8. 6 -100 PHASE PHASE (°) -3 GAIN (dB) -2 PHASE (°) GAIN (dB) 1V Gain/Phase normalized to low frequency value at each setting. Figure 9. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. Gain Control Frequency Response 10 80 5 40 40°C -80 25°C -120 85°C -20 -160 14 12 10 -200 6 -240 4 -35 VG = 0.98 AVERAGE -40 10M 100k 1M -280 2 -320 -30 VG (AC) = -13.7 dBm 25°C 8 VIN = 0.2V (DC) -25 RL = OPEN 16 85°C -40 -15 VG = VG_MIN 18 0 ANGLE -10 20 IS (mA) |S21| (dB) 85°C 25°C 0 -5 IS vs. VS 120 40°C MAGNITUDE ANGLE S21 (°) 15 -40°C 100M 0 1G 3 3.5 FREQUENCY (Hz) 4 4.5 5 5.5 6 ±SUPPLY VOTLAGE (V) See Electrical Characteristics Note (5). Figure 10. Figure 11. IS vs. VS Input Bias Current vs. VS -0.4 20 RL = OPEN 18 16 -0.5 85°C 85°C 12 10 IB (PA) IS (mA) 14 25°C 8 6 25°C -0.6 -0.7 -40°C 4 -40°C 2 -0.8 0 3 3.5 4 4.5 5 5.5 2 6 3 4 5 ±SUPPLY VOTLAGE (V) ±SUPPLY VOLTAGE (V) Figure 12. Figure 13. PSRR 0 6 AVMAX vs. Supply Voltage 12 -10 10 -30 AVMAX (V/V) PSRR (dB) -20 -PSRR -40 -50 8 85°C 6 25°C 4 -60 -40°C +PSRR 2 -70 -80 100 0 1k 10k 100k 1M 10M 100M FREQUENCY (Hz) 2.5 3 3.5 4 4.5 5 5.5 6 ±SUPPLY VOLTAGE See Electrical Characteristics Note (9) Figure 14. Figure 15. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 7 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. Feed through Isolation for Various AVMAX Gain Variation Over entire Temp Range vs. VG 100 60 TEMP RANGE: -55°C TO 125°C |GAIN(COLD) ± GAIN (HOT) OVER TEMP CHANGE (dB) 40 GAIN (dB) 20 0 -20 -40 AVMAX = 100 V/V AVMAX = 10 V/V AVMAX = 2 V/V -60 10 1 0.1 -80 0.01 -100 100k 1M 100M 10M 0 1G 0.5 1 FREQUENCY (Hz) Figure 16. 2 Figure 17. IRG vs. VIN -10 1.5 VG (V) Gain vs. VG 30 12 11 -8 10 125°C -10 GAIN (dB) IR G (mA) -4 -2 0 +2 10 9 8 25°C -55°C dB -30 125°C -50 7 6 5 V/V 4 25°C +4 GAIN (V/V) -6 3 -55°C 2 -70 +6 1 +8 -1.5 -1 -0.5 0 0.5 1 1.5 -90 -0.5 0 0 0.5 VIN (V) 1 1.5 2 VG (V) See Electrical Characteristics Note (7). Figure 18. Figure 19. Output Offset Voltage vs. VG (Typical Unit #1) Output Offset Voltage vs. VG (Typical Unit #2) 30 10 25°C -40°C 25 VO_OFFSET (mV) VO_OFFSET (mV) 5 0 25°C -5 85°C 20 15 10 85°C 85°C -10 5 -40°C 0 -15 0 0.5 1 1.5 2 2.5 VG (V) 0.5 1 1.5 2 2.5 VG (V) Figure 20. 8 0 Figure 21. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. Output Offset Voltage vs. VG (Typical Unit #3) Distribution of Output Offset Voltage 24 30 25°C 20 15 -40°C 10 22 20 RELATIVE FREQUENCY (%) VO_OFFSET (mV) 25 85°C 5 18 16 14 12 10 8 6 4 2 25°C 0 -55 -45 -35 -25 -15 -5 0 0 0.5 1 1.5 2 2.5 5 15 25 35 45 55 OFFSET VOLTAGE (mV) VG (V) Figure 22. Figure 23. Output Noise Density vs. Frequency Output Noise Density vs. Frequency 10000 100000 RSOURCE - 50: AVMAX = 100 RF = 2.4 k: RG = 22: VG_MAX 1000 eno (nV/ Hz) eno (nV/ Hz) 10000 VG_MID VG_MIN 100 VG_MAX RSOURCE = 50: VG_MID 1000 100 VG_MIN 10 1 10 10 1k 100 10k 100k 10M 1M 1 10 100 FREQUENCY (Hz) 1k 10k 100k 1M 10M FREQUENCY (Hz) Figure 24. Figure 25. Output Noise Density vs. Frequency Input Referred Noise Density vs. Frequency 10000 1000 1000 AVMAX = 2 RG = 510: VG_MID 100 100 100 Hz) VOLTAGE Ini (pA/ VG_MAX 1000 eni (nV/ Hz) eno (nV/ Hz) RSOURCE = 50: 10 10 VG_MIN CURRENT 10 1 1 10 100 1k 10k 100k 1M 10M 1 1 FREQUENCY (Hz) 10 100 1k 10k 100k 1M 10M FREQUENCY (Hz) Figure 26. Figure 27. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 9 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. Output Voltage vs. Output Current (Sinking) 5 Output Voltage vs. Output Current (Sourcing) 5 25°C 85°C -40°C -40°C 85°C 25°C + VOUT FROM V (V) 4 - VOUT FROM V (V) 4 3 -40°C 2 25°C 85°C 3 -40°C 2 85°C 1 1 0 0 20 0 40 60 80 100 120 20 0 80 Figure 28. Figure 29. Distortion vs. Frequency 100 120 HD vs. POUT -120 VG = VG_MAX VG = VGMAX -110 VOUT = 1 VPP HD3, 100 kHz -100 -50 HD2, 100 kHz -90 HD (dBc) HD (dBc) 60 IOUT (mA) -30 -40 40 IOUT (mA) -60 THD -70 HD2 HD3 -80 -80 -70 -60 -50 HD2, 20 MHz -40 -90 HD3, 20 MHz -30 -20 -100 100k 1M 10M -10 100M -5 0 FREQUENCY (Hz) 5 10 15 20 15 20 POUT (dBm) Figure 30. Figure 31. THD vs. POUT THD vs. POUT -70 -100 VG = VG_MAX -90 -60 -80 -50 -70 THD (dBc) THD (dBc) 1 MHz 100 kHz -60 -50 20 MHz -40 -30 -20 -40 20 MHz -10 -30 -20 -10 VG = VGMID = a1V 0 -5 0 5 10 15 20 -5 0 5 10 POUT (dBm) POUT (dBm) Figure 32. 10 -10 Figure 33. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. THD vs. Gain THD vs. Gain -90 VOUT = 0.25 VPP -80 -80 100 kHz 100 kHz VOUT = 1 VPP VG VARIED -70 VG VARIED 2 MHz -70 2 MHz -60 THD (dBc) THD (dBc) -60 -50 20 MHz -40 -30 -50 -40 -20 -20 -10 -10 0 -15 -10 -5 0 5 10 15 20 MHz -30 0 20 -5 0 5 GAIN (dB) Figure 34. 0.1 920 0.05 900 0 DG 0 -0.1 -1.4 -1 -0.6 -0.2 0.2 0.6 1 IG (nA) DG (%) DP 0.2 0.1 940 DP (°) RL = 100: VG = VGMAX 0.3 20 VG Bias Current vs. VG 0.15 f = 4.43 MHz 0.4 15 Figure 35. Differential Gain & Phase 0.5 10 GAIN (dB) 880 -0.05 860 -0.1 840 -0.15 1.4 820 0 VOUT DC (V) 0.5 1 1.5 2 3 VG (V) Figure 36. Figure 37. Step Response Plot Step Response Plot 0.5 VPP SMALL SIGNAL SS REF 2.5 0.5 VPP SMALL SIGNAL SS REF LS REF LS REF 4 VPP LARGE SIGNAL 4 VPP LARGE SIGNAL VG = VG_MID 5 ns/DIV 5 ns/DIV Figure 38. Figure 39. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 11 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified: VS = ±5V, TA = 25°C, VG = VGMAX, RF = 1 kΩ, RG = 100Ω, VIN = 0.1V, input terminated in 50Ω. RL = 100Ω, Typical values. Gain vs. VG Step 2.5 10 GAIN 2 8 7 6 1.5 5 1 4 GAIN (V/V) VG VG (V) 9 3 0.5 2 VIN = 0.3V 0 1 0 t (10 ns/DIV) Figure 40. 12 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 APPLICATION INFORMATION GENERAL DESCRIPTION The key features of the LMH6505 are: • Low power • Broad voltage controlled gain and attenuation range (from AVMAX down to complete cutoff) • Bandwidth independent, resistor programmable gain range (RG) • Broad signal and gain control bandwidths • Frequency response may be adjusted with RF • High impedance signal and gain control inputs The LMH6505 combines a closed loop input buffer (“X1” Block in Figure 41), a voltage controlled variable gain cell (“MULT” Block) and an output amplifier (“CFA” Block). The input buffer is a transconductance stage whose gain is set by the gain setting resistor, RG. The output amplifier is a current feedback op amp and is configured as a transimpedance stage whose gain is set by, and is equal to, the feedback resistor, RF. The maximum gain, AVMAX, of the LMH6505 is defined by the ratio: K · RF/RG where “K” is the gain multiplier with a nominal value of 0.940. As the gain control input (VG) changes over its 0 to 2V range, the gain is adjusted over a range of about 80 dB relative to the maximum set gain. INPUT SIGNAL GAIN CONTROL 5V +VCC VG MULT VIN RX 50: IX1 RIN 50: - RO OUTPUT 50: CFA GND 0.1 µF RF 1 k: VO RG + 6.8 µF -VCC + RG 100: 0.1 µF 6.8 µF + -5V Figure 41. LMH6505 Typical Application and Block Diagram SETTING THE LMH6505 MAXIMUM GAIN AVMAX = RF RG ·K (1) Although the LMH6505 is specified at AVMAX = 9.4 V/V, the recommended AVMAX varies between 2 and 100. Higher gains are possible but usually impractical due to output offsets, noise and distortion. When varying AVMAX several tradeoffs are made: RG: determines the input voltage range RF: determines overall bandwidth The amount of current which the input buffer can source/sink into RG is limited and is given in the IRG_MAX specification. This sets the maximum input voltage: VIN (MAX) = IR G MAX · RG (2) Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 13 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com As the IRG_MAX limit is approached with increasing the input voltage or with the lowering of RG, the device's harmonic distortion will increase. Changes in RF will have a dramatic effect on the small signal bandwidth. The output amplifier of the LMH6505 is a current feedback amplifier (CFA) and its bandwidth is determined by RF. As with any CFA, doubling the feedback resistor will roughly cut the bandwidth of the device in half. For more about CFAs, see the basic tutorial, OA-20, Current Feedback Myths Debunked, (literature number SNOA376), or a more rigorous analysis, OA-13, Current Feedback Amplifier Loop Gain Analysis and Performance Enhancements, (literature number SNOA366). OTHER CONFIGURATIONS 1. Single Supply Operation The LMH6505 can be configured for use in a single supply environment. Doing so requires the following: (a) Bias pin 4 and RG to a “virtual half supply” somewhere close to the middle of V+ and V− range. The other end of RG is tied to pin 3. The “virtual half supply” needs to be capable of sinking and sourcing the expected current flow through RG. (b) Ensure that VG can be adjusted from 0V to 2V above the “virtual half supply”. (c) Bias the input (pin 2) to make sure that it stays within the range of 2V above V− to 2V below V+. See the Input Voltage Range specification in the Electrical Characteristics table. This can be accomplished by either DC biasing the input and AC coupling the input signal, or alternatively, by direct coupling if the output of the driving stage is also biased to half supply. Arranged this way, the LMH6505 will respond to the current flowing through RG. The gain control relationship will be similar to the split supply arrangement with VG measured with reference to pin 4. Keep in mind that the circuit described above will also center the output voltage to the “virtual half supply voltage.” 2. Arbitrarily Referenced Input Signal Having a wide input voltage range on the input (pin 2) (±3V typical), the LMH6505 can be configured to control the gain on signals which are not referenced to ground (e.g. Half Supply biased circuits). This node will be called the “reference node”. In such cases, the other end of RG which is the side not tied to pin 3 can be tied to this reference node so that RG will “look at” the difference between the signal and this reference only. Keep in mind that the reference node needs to source and sink the current flowing through RG. GAIN ACCURACY Gain accuracy is defined as the actual gain compared against the theoretical gain at a certain VG, the results of which are expressed in dB. (See Figure 42). Theoretical gain is given by: A(V/V) = K x RF RG 1 N - VG x 1+e VC where • • K = 0.940 (nominal) N = 1.01V VC = 79 mV at room temperature (3) For a VG range, the value specified in the tables represents the worst case accuracy over the entire range. The "Typical" value would be the difference between the "Typical Gain" and the "Theoretical Gain." The "Max" value would be the worst case difference between the actual gain and the "Theoretical Gain" for the entire population. GAIN MATCHING As Figure 42 shows, gain matching is the limit on gain variation at a certain VG, expressed in dB, and is specified as "±Max" only. There is no "Typical." For a VG range, the value specified represents the worst case matching over the entire range. The "Max" value would be the worst case difference between the actual gain and the typical gain for the entire population. 14 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 MAX GAIN LIMIT THEORETICAL GAIN GAIN (dB) MIN GAIN LIMIT D TYPICAL GAIN C PARAMETER: B GAIN ACCURACY (TYPICAL) = B-C GAIN ACCURACY (+MAX) = D-C GAIN ACCURACY (-MAX) = A-C GAIN MATCHING (+MAX) = D-B GAIN MATCHING (-MAX) = A-B A VG (V) Figure 42. LMH6505 Gain Accuracy & Gain Matching Defined GAIN PARTITIONING If high levels of gain are needed, gain partitioning should be considered: VG VIN + 25: LMH6624 1 2 RC - LMH6505 3 6 VO 7 4 R2 RF RG R1 Figure 43. Gain Partitioning The maximum gain range for this circuit is given by the following equation: R2 MAXIMUM GAIN = 1+ R1 RF · RG ·K (4) The LMH6624 is a low noise wideband voltage feedback amplifier. Setting R2 at 909Ω and R1 at 100Ω produces a gain of 20 dB. Setting RF at 1000Ω as recommended and RG at 50Ω, produces a gain of about 26 dB in the LMH6505. The total gain of this circuit is therefore approximately 46 dB. It is important to understand that when partitioning to obtain high levels of gain, very small signal levels will drive the amplifiers to full scale output. For example, with 46 dB of gain, a 20 mV signal at the input will drive the output of the LMH6624 to 200 mV and the output of the LMH6505 to 4V. Accordingly, the designer must carefully consider the contributions of each stage to the overall characteristics. Through gain partitioning the designer is provided with an opportunity to optimize the frequency response, noise, distortion, settling time, and loading effects of each amplifier to achieve improved overall performance. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 15 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com LMH6505 GAIN CONTROL RANGE AND MINIMUM GAIN Before discussing Gain Control Range, it is important to understand the issues which limit it. The minimum gain of the LMH6505 is theoretically zero, but in practical circuits it is limited by the amount of feedthrough, here defined as the gain when VG = 0V. Capacitive coupling through the board and package, as well as coupling through the supplies, will determine the amount of feedthrough. Even at DC, the input signal will not be completely rejected. At high frequencies feedthrough will get worse because of its capacitive nature. At frequencies below 10 MHz, the feed through will be less than −60 dB and therefore, it can be said that with AVMAX = 20 dB, the gain control range is 80 dB. LMH6505 GAIN CONTROL FUNCTION In the plot, Gain vs. VG (Figure 19), we can see the gain as a function of the control voltage. The “Gain (V/V)” plot, sometimes referred to as the S-curve, is the linear (V/V) gain. This is a hyperbolic tangent relationship and is given by Equation 3. The “Gain (dB)” plots the gain in dB and is linear over a wide range of gains. Because of this, the LMH6505 gain control is referred to as “linear-in-dB.” For applications where the LMH6505 will be used at the heart of a closed loop AGC circuit, the S-curve control characteristic provides a broad linear (in dB) control range with soft limiting at the highest gains where large changes in control voltage result in small changes in gain. For applications requiring a fully linear (in dB) control characteristic, use the LMH6505 at half gain and below (VG ≤ 1V). GAIN STABILITY The LMH6505 architecture allows complete attenuation of the output signal from full gain to complete cutoff. This is achieved by having the gain control signal VG “throttle” the signal which gets through to the final stage and which results in the output signal. As a consequence, the RG pin's (pin 3) average current (DC current) influences the operating point of this “throttle” circuit and affects the LMH6505's gain slightly. Figure 44 below, shows this effect as a function of the gain set by VG. 4.5 4 DELTA AV (dB) 3.5 3 4.5 mA SOURCING 2.5 2 1.5 1 4.5 mA SINKING 0.5 0 -0.5 -80 -60 -40 -20 0 20 AV (dB) Figure 44. LMH6505 Gain Variation over RG DC Current Capability vs. Gain This plot shows the expected gain variation for the maximum RG DC current capability (±4.5 mA). For example, with gain (AV) set to −60 dB, if the RG pin DC current is increased to 4.5 mA sourcing, one would expect to see the gain increase by about 3 dB (to −57 dB). Conversely, 4.5 mA DC sinking current through RG would increase gain by 1.75 dB (to −58.25 dB). As you can see from Figure 44 above, the effect is most pronounced with reduced gain and is limited to less than 3.75 dB variation maximum. If the application is expected to experience RG DC current variation and the LMH6505 gain variation is beyond acceptable limits, please refer to the LMH6502 (Differential Linear in dB variable gain amplifier) datasheet instead at http://www.ti.com/lit/gpn/LMH6502. 16 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 AVOIDING OVERDRIVE OF THE LMH6505 GAIN CONTROL INPUT There is an additional requirement for the LMH6505 Gain Control Input (VG): VG must not exceed +2.3V (with ±5V supplies). The gain control circuitry may saturate and the gain may actually be reduced. In applications where VG is being driven from a DAC, this can easily be addressed in the software. If there is a linear loop driving VG, such as an AGC loop, other methods of limiting the input voltage should be implemented. One simple solution is to place a 2.2:1 resistive divider on the VG input. If the device driving this divider is operating off of ±5V supplies as well, its output will not exceed 5V and through the divider VG can not exceed 2.3V. IMPROVING THE LMH6505 LARGE SIGNAL PERFORMANCE Figure 45 illustrates an inverting gain scheme for the LMH6505. VG 1 2 LMH6505 25: 3 VIN 6 VO 7 4 RG RF Figure 45. Inverting Amplifier The input signal is applied through the RG resistor. The VIN pin should be grounded through a 25Ω resistor. The maximum gain range of this configuration is given in the following equation: AVMAX = - RF ·K RG (5) The inverting slew rate of the LMH6505 is much higher than that of the non-inverting slew rate. This ≈ 2X performance improvement comes about because in the non-inverting configuration the slew rate of the overall amplifier is limited by the input buffer. In the inverting circuit, the input buffer remains at a fixed voltage and does not affect slew rate. TRANSMISSION LINE MATCHING One method for matching the characteristic impedance of a transmission line is to place the appropriate resistor at the input or output of the amplifier. Figure 46 shows a typical circuit configuration for matching transmission lines. VG CO ZO 1 2 SIGNAL INPUT ZO 6 RS RI +- OUTPUT LMH6505 3 RO 7 RT 4 RG RF Figure 46. Transmission Line Matching Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 17 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com The resistors RS, RI, RO, and RT are equal to the characteristic impedance, ZO, of the transmission line or cable. Use CO to match the output transmission line over a greater frequency range. It compensates for the increase of the op amp’s output impedance with frequency. MINIMIZING PARASITIC EFFECTS ON SMALL SIGNAL BANDWIDTH The best way to minimize parasitic effects is to use surface mount components and to minimize lead lengths and component distance from the LMH6505. For designs utilizing through-hole components, specifically axial resistors, resistor self-capacitance should be considered. For example, the average magnitude of parasitic capacitance of RN55D 1% metal film resistors is about 0.15 pF with variations of as much as 0.1 pF between lots. Given the LMH6505’s extended bandwidth, these small parasitic reactance variations can cause measurable frequency response variations in the highest octave. We therefore recommend the use of surface mount resistors to minimize these parasitic reactance effects. RECOMMENDATIONS Here are some recommendations to avoid problems and to get the best performance: • Do not place a capacitor across RF. However, an appropriately chosen series RC combination can be used to shape the frequency response. • Keep traces connecting RF separated and as short as possible. • Place a small resistor (20-50Ω) between the output and CL. • Cut away the ground plane, if any, under RG. • Keep decoupling capacitors as close as possible to the LMH6505. • Connect pin 2 through a minimum resistance of 25Ω. ADJUSTING OFFSETS AND DC LEVEL SHIFTING Offsets can be broken into two parts: an input-referred term and an output-referred term. These errors can be trimmed using the circuit in Figure 47. First set VG to 0V and adjust the trim pot R4 to null the offset voltage at the output. This will eliminate the output stage offsets. Next set VG to 2V and adjust the trim pot R1 to null the offset voltage at the output. This will eliminate the input stage offsets. VG VIN 2 1 LMH6505 3 7 +5V R2 10 k: R1 10 k: 6 VO RF 4 RG +5V R3 10 k: R4 10 k: 0.1 µF 0.1 µF -5V -5V Figure 47. Offset Adjust Circuit DIGITAL GAIN CONTROL Digitally variable gain control can be easily realized by driving the LMH6505 gain control input with a digital-toanalog converter (DAC). Figure 48 illustrates such an application. This circuit employs TI’s eight-bit DAC0830, the LMC8101 MOS input op amp (Rail-to-Rail Input/Output), and the LMH6505 VGA. With VREF set to 2V, the circuit provides up to 80 dB of gain control in 256 steps with up to 0.05% full scale resolution. The maximum gain of this circuit is 20 dB. 18 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 DIGITAL INPUT RFB Io1 VREF LMC8101 DAC0830 Io2 + VIN 1 2 6 VO LMH6505 3 7 4 RG 100: RF 1 k: Figure 48. Digital Gain Control USING THE LMH6505 IN AGC APPLICATIONS In AGC applications, the control loop forces the LMH6505 to have a fixed output amplitude. The input amplitude will vary over a wide range and this can be the issue that limits dynamic range. At high input amplitudes, the distortion due to the input buffer driving RG may exceed that which is produced by the output amplifier driving the load. In the plot, THD vs. Gain, total harmonic distortion (THD) is plotted over a gain range of nearly 35 dB for a fixed output amplitude of 0.25 VPP in the specified configuration, RF = 1 kΩ, RG = 100Ω. When the gain is adjusted to −15 dB (i.e. 35 dB down from AVMAX), the input amplitude would be 1.41 VPP and we can see the distortion is at its worst at this gain. If the output amplitude of the AGC were to be raised above 0.25 VPP, the input amplitudes for gains 40 dB down from AVMAX would be even higher and the distortion would degrade further. It is for this reason that we recommend lower output amplitudes if wide gain ranges are desired. Using a post-amp like the LMH6714/LMH6720/LMH6722 family or the LMH6702 would be the best way to preserve dynamic range and yield output amplitudes much higher than 100 mVPP. Another way of addressing distortion performance and its limitations on dynamic range, would be to raise the value of RG. Just like any other highspeed amplifier, by increasing the load resistance, and therefore decreasing the demanded load current, the distortion performance will be improved in most cases. With an increased RG, RF will also have to be increased to keep the same AVMAX and this will decrease the overall bandwidth. It may be possible to insert a series RC combination across RF in order to counteract the negative effect on BW when a large RF is used. AUTOMATIC GAIN CONTROL (AGC) Fast Response AGC Loop The AGC circuit shown in Figure 49 will correct a 6 dB input amplitude step in 100 ns. The circuit includes a two op amp precision rectifier amplitude detector (U1 and U2), and an integrator (U3) to provide high loop gain at low frequencies. The output amplitude is set by R9. The following are some suggestions for building fast AGC loops: Precision rectifiers work best with large output signals. Accuracy is improved by blocking DC offsets, as shown in Figure 49. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 19 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com INCLUDES SCOPE PROBE CAPACITANCE C3 40 pF VIN 1 2 + U4 LMH6505 3 R10 500: RG 100: - OUTPUT 20 MHz, 6 0.1 VPP 7 4 C1 1.0 µF RF R1 20: C2 680 pF R8 500: R5 25: + - U2 LMH6714 U3 LMH6609 - + R4 300: R6 300: R9 4.22 k: - R7 300: -5V R3 300: 1N5712 SCHOTTKY U1 LMH6714 + R2 25: Figure 49. Automatic Gain Control Circuit Signal frequencies must not reach the gain control port of the LMH6505, or the output signal will be distorted (modulated by itself). A fast settling AGC needs additional filtering beyond the integrator stage to block signal frequencies. This is provided in Figure 49 by a simple R-C filter (R10 and C3); better distortion performance can be achieved with a more complex filter. These filters should be scaled with the input signal frequency. Loops with slower response time, which means longer integration time constants, may not need the R10 – C3 filter. Checking the loop stability can be done by monitoring the VG voltage while applying a step change in input signal amplitude. Changing the input signal amplitude can be easily done with an arbitrary waveform generator. 20 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 LMH6505 www.ti.com SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 CIRCUIT LAYOUT CONSIDERATIONS & EVALUATION BOARDS A good high frequency PCB layout including ground plane construction and power supply bypassing close to the package is critical to achieving full performance. The amplifier is sensitive to stray capacitance to ground at the Iinput (pin 7) so it is best to keep the node trace area small. Shunt capacitance across the feedback resistor should not be used to compensate for this effect. Capacitance to ground should be minimized by removing the ground plane from under the body of RG. Parasitic or load capacitance directly on the output (pin 6) degrades phase margin leading to frequency response peaking. The LMH6505 is fully stable when driving a 100Ω load. With reduced load (e.g. 1k.) there is a possibility of instability at very high frequencies beyond 400 MHz especially with a capacitive load. When the LMH6505 is connected to a light load as such, it is recommended to add a snubber network to the output (e.g. 100Ω and 39 pF in series tied between the LMH6505 output and ground). CL can also be isolated from the output by placing a small resistor in series with the output (pin 6). Component parasitics also influence high frequency results. Therefore it is recommended to use metal film resistors such as RN55D or leadless components such as surface mount devices. High profile sockets are not recommended. Texas Instruments suggests the following evaluation board as a guide for high frequency layout and as an aid in device testing and characterization: Device Package Evaluation Board Part Number LMH6505 SOIC LMH730066 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 21 LMH6505 SNOSAT4E – DECEMBER 2005 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E • 22 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 21 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LMH6505 PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LMH6505MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH65 05MA LMH6505MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LMH65 05MA LMH6505MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 AZ2A LMH6505MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 AZ2A (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMH6505MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LMH6505MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMH6505MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMH6505MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LMH6505MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LMH6505MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated