TI1 INA103KU/1K Low noise, low distortion instrumentation amplifier Datasheet

®
INA103
INA
103
INA
103
Low Noise, Low Distortion
INSTRUMENTATION AMPLIFIER
FEATURES
APPLICATIONS
● LOW NOISE: 1nV/√Hz
● LOW THD+N: 0.0009% at 1kHz, G = 100
● HIGH GBW: 100MHz at G = 1000
● HIGH QUALITY MICROPHONE PREAMPS
(REPLACES TRANSFORMERS)
● MOVING-COIL PREAMPLIFIERS
● WIDE SUPPLY RANGE: ±9V to ±25V
● HIGH CMRR: >100dB
● BUILT-IN GAIN SETTING RESISTORS:
G = 1, 100
● UPGRADES AD625
● DIFFERENTIAL RECEIVERS
● AMPLIFICATION OF SIGNALS FROM:
Strain Gages (Weigh Scale Applications)
Thermocouples
Bridge Transducers
DESCRIPTION
The INA103 is a very low noise, low distortion monolithic instrumentation amplifier. Its current-feedback
circuitry achieves very wide bandwidth and excellent
dynamic response. It is ideal for low-level audio
signals such as balanced low-impedance microphones.
The INA103 provides near-theoretical limit noise performance for 200Ω source impedances. Many industrial applications also benefit from its low noise and
wide bandwidth.
The INA103 is available in 16-pin plastic DIP and
SOL-16 surface-mount packages. Commercial and Industrial temperature range models are available.
Unique distortion cancellation circuitry reduces distortion to extremely low levels, even in high gain. Its
balanced input, low noise and low distortion provide
superior performance compared to transformer-coupled
microphone amplifiers used in professional audio
equipment.
The INA103’s wide supply voltage (±9 to ±25V) and
high output current drive allow its use in high-level
audio stages as well. A copper lead frame in the plastic
DIP assures excellent thermal performance.
–Gain Drive
12
–Input 16
–Gain Sense 15
Offset Offset
Null
Null
3
4
6kΩ
+
A1
–
3kΩ
6kΩ
11 Sense
–RG 13
–
60.6Ω
G = 100 14
+RG
6
+Gain Sense
2
+Input
1
+
3kΩ
6kΩ
–
A3
10
Output
7
Ref
6kΩ
A2
+
5
9
8
+Gain Drive
V+
V–
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
®
©
SBOS003
1990 Burr-Brown Corporation
PDS-1016H
1
INA103
Printed in U.S.A. March, 1998
SPECIFICATIONS
All specifications at TA = +25°C, VS = ±15V and RL = 2kΩ, unless otherwise noted.
INA103KP, KU
PARAMETER
CONDITIONS
GAIN
Range of Gain
Gain Equation (1)
Gain Error, DC G = 1
G = 100
Equation
Gain Temp. Co. G = 1
G = 100
Equation
Nonlinearity, DC G = 1
G = 100
OUTPUT
Voltage, RL = 600Ω
RL = 600Ω
Current
Short Circuit Current
Capacitive Load Stability
INPUT OFFSET VOLTAGE
Initial Offset RTI (3)
(KU Grade)
vs Temp G = 1 to 1000
G = 1000
vs Supply
INPUT BIAS CURRENT
Initial Bias Current
vs Temp
Initial Offset Current
vs Temp
MIN
1
G = 1 + 6kΩ/RG
0.005
0.07
0.05
10
25
25
0.0003
0.0006
±10V Output
±10V Output
±10V Output
±11.5
±20
±40
TA = TMIN to TMAX
VS = ±25, TA = 25°C
TA = TMIN to TMAX
INPUT NOISE
Voltage (5)
10Hz
100Hz
1kHz
Current, 1kHz
MAX
UNITS
1000
V/V
V/V
%
%
%
ppm/°C
ppm/°C
ppm/°C
% of FS(2)
% of FS
0.05
0.25
0.01
0.01
±12
±21
V
V
mA
mA
nF
±70
10
(30 + 1200/G)
(250+ 5000/G)
TA = TMIN to TMAX
TA = TMIN to T MAX
±9V to ±25V
1 + 20/G
TA = TMIN to TMAX
TA = TMIN to TMAX
INPUT IMPEDANCE
Differential Mode
Common-Mode
INPUT VOLTAGE RANGE
Common-Mode Range (4)
CMR
G=1
G = 100
TYP
0.2 + 8/G
4 + 60/G
2.5
15
0.04
0.5
12
1
µV
µV
µV/°C
µV/°C
µV/V
µA
nA/°C
µA
nA/°C
60 || 2
60 || 5
MΩ || pF
MΩ || pF
±11
±12
V
72
100
86
125
dB
dB
2
1.2
1
2
nV/√Hz
nV/√Hz
nV/√Hz
pA/√Hz
1kHz
20Hz-20kHz
65
–100
nV/√Hz
dBu
Small Signal
Small Signal
G=1
6
800
MHz
kHz
240
15
0.0009
kHz
V/µs
%
VO = 20V Step
1.7
1.5
µs
µs
VO = 20V Step
2
3.5
1
µs
µs
µs
DC to 60Hz
DC to 60Hz
RS = 0Ω
OUTPUT NOISE
Voltage
A Weighted, 20Hz-20kHz
DYNAMIC RESPONSE
–3dB Bandwidth: G = 1
G = 100
Full Power Bandwidth
VOUT = ±10V, RL = 600Ω
Slew Rate
THD + Noise
Settling Time 0.1%
G=1
G = 100
Settling Time 0.01%
G=1
G = 100
Overload Recovery (6)
G = 1 to 500
G = 100, f = 1kHz
50% Overdrive
NOTES: (1) Gains other than 1 and 100 can be set by adding an external resistor, RG between pins 2 and 15. Gain accuracy is a function of RG. (2) FS = Full Scale.
(3) Adjustable to zero. (4) VO = 0V, see Typical Curves for VCM vs VO. (5) VNOISE RTI = √V2N INPUT + (VN OUTPUT/Gain)2 + 4KTRG. See Typical Curves. (6) Time required
for output to return from saturation to linear operation following the removal of an input overdrive voltage.
®
INA103
2
SPECIFICATIONS
(CONT)
All specifications at TA = +25°C, VS = ±15V and RL = 2kΩ, unless otherwise noted.
INA103KP, KU
PARAMETER
CONDITIONS
MIN
POWER SUPPLY
Rated Voltage
Voltage Range
Quiescent Current
±9
TYP
±15
9
TEMPERATURE RANGE
Specification
Operation
Storage
Thermal Resistance, θJA
0
–40
–40
Top View
(1)
16
– Input
2
15
– Gain Sense
+ Offset Null
3
14
G = 100
– Offset Null
4
13
–RG
+ Gain Drive
5
12
– Gain Drive
+RG
6
11
Sense
Ref
7
10
Output
V–
8
9
V+
+ Gain Sense
±25
12.5
V
V
mA
+70
+85
+100
Any integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet
published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply Voltage ....................................................................... ±25V
Input Voltage Range, Continuous ....................................................... ±VS
Operating Temperature Range: ........................................ –40°C to +85°C
Storage Temperature Range: ........................................... –40°C to +85°C
Junction Temperature:
P, U Package .............................................................................. +125°C
Lead Temperature (soldering, 10s) ............................................... +300°C
Output Short Circuit to Common ............................................. Continuous
NOTE: (1) Pin 1 Marking—SOL-16 Package
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER(1)
INA103KP
INA103KU
Plastic DIP
SOL-16
180
211
°C
°C
°C
°C/W
ELECTROSTATIC
DISCHARGE SENSITIVITY
DIP or SOIC
1
UNITS
100
PIN CONFIGURATION
+ Input
MAX
TEMPERATURE
RANGE
0°C to +70°C
0°C to +70°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
3
INA103
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±15V, unless otherwise noted.
OUTPUT SWING vs SUPPLY
±25
±20
±20
Output Voltage (V)
Input Voltage Range (V)
INPUT VOLTAGE RANGE vs SUPPLY
±25
±15
±10
±15
±10
±5
±5
±5
±10
±15
±20
±25
±5
±10
Power Supply Voltage (V)
MAX COMMON-MODE VOLTAGE
vs OUTPUT VOLTAGE
±20
±25
OUTPUT SWING vs LOAD RESISTANCE
22
±16
16.5
V S = ±25V
Output Voltage (V)
Common-Mode Voltage (V)
±15
Power Supply Voltage (V)
11
V S = ±15V
5.5
±12
±8
±4
±0
0
5.5
11
16.5
22
0
200
Output Voltage (V)
400
600
800
1k
Load Resistance (Ω )
OFFSET VOLTAGE vs TIME FROM POWER UP
(G = 100)
INPUT BIAS CURRENT vs SUPPLY
2.60
20
Input Bias Current (µA)
Change In VOSI (µV)
2.55
10
0
–10
2.50
2.45
2.40
2.35
2.30
2.25
–20
0
1
2
3
4
5
9
Time (min)
15
20
Power Supply Voltage (±V)
®
INA103
10
4
25
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, unless otherwise noted.
SMALL SIGNAL TRANSIENT RESPONSE
(G = 1)
INPUT BIAS CURRENT vs TEMPERATURE
Output Voltage (V)
5
4
3
2
1
–55
0
50
100
Time (µs)
125
Temperature (°C)
LARGE SIGNAL TRANSIENT RESPONSE
(G = 1)
Output Voltage (V)
SMALL SIGNAL TRANSIENT RESPONSE
(G = 100)
Output Voltage (V)
Time (µs)
Time (µs)
SETTLING TIME vs GAIN
(0.1%, 20V STEP)
LARGE SIGNAL TRANSIENT RESPONSE
(G = 100)
10
Settling Time (µs)
8
Output Voltage (V)
Input Bias Current (µA)
6
6
4
2
0
1
Time (µs)
10
100
1000
Gain
®
5
INA103
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, unless otherwise noted.
SETTLING TIME vs GAIN
(0.01%, 20V STEP)
SMALL-SIGNAL FREQUENCY RESPONSE
70
60
8
50
40
6
30
20
10
Gain (dB)
Settling Time (µs)
10
4
G = 1000
G = 100
G = 10
0
–10
G=1
–20
–30
2
–40
–50
0
1
10
100
1000
10
100
1k
10k
Gain
NOISE VOLTAGE (RTI) vs FREQUENCY
10M
CMR vs FREQUENCY
100
Common-Mode Rejection (dB)
Noise (RTI) (nV/ √ Hz)
1M
140
1k
G=1
G = 10
10
G = 500 G = 1000
G = 100
120
G=
100
0
100
G=
80
G=
60
G=
40
G=
500
100
10
1
20
0
1
10
100
1k
10k
10
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
THD + N vs FREQUENCY
V+ POWER SUPPLY REJECTION
vs FREQUENCY
1M
140
1
120
G = 100
G = 10
100
G=1
Power Supply Rejection (dB)
VOUT = +18dBu
0.1
THD + N (%)
100k
Frequency (Hz)
G = 1000
0.010
G=1
0.001
G = 100
G = 10
0.0001
G = 1000
80
60
40
20
0
10
100
1k
10k 20k
1
Frequency (Hz)
100
1k
Frequency (Hz)
®
INA103
10
6
10k
100k
1M
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V, unless otherwise noted.
V– POWER SUPPLY REJECTION
vs FREQUENCY
THD + N vs LEVEL
1
G = 100, 1000
f = 1kHz
120
G = 10
100
0.1
G=1
THD + N (%)
Power Supply Rejection (dB)
140
80
60
0.010
40
G=1
20
0.001
0
0.0005
1
10
100
1k
10k
100k
1M
–60
–45
–30
Frequency (Hz)
15
5
G=1
V OUT = 20Vp-p
f = 1kHz
1
0.01
CCIF IMD (%)
THD + N (%)
0
CCIF IMD vs AMPLITUDE
THD + N vs LOAD
0.1
0.001
G = 1000
0.1
G = 100
0.010
G=1
G = 10
0.001
0.0001
0.0001
200
400
600
800
–60
1k
–50
–40
RLOAD (Ω )
–30
–20
–10
0
10
20
10
20
Output Amplitude (dBu)
CCIF IMD vs FREQUENCY
SMPTE IMD vs AMPLITUDE
5
5
1
1
SMPTE IMD (%)
CCIF IMD (%)
–15
Output Amplitude (dBu)
0.1
G = 1000
0.010
G = 1000
0.1
G = 100
G=1
0.010
G = 100
0.001
G = 10
G=1
2k
G = 10
0.001
0.0005
0.0001
10k
20k
–60
Frequency (Hz)
–50
–40
–30
–20
–10
0
Output Amplitude (dBu)
®
7
INA103
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±15V unless, otherwise noted.
CURRENT NOISE SPECTRAL DENSITY
SMPTE IMD vs FREQUENCY
100
Current Noise Density (pA/ Hz)
5
SMPTE IMD (%)
1
0.1
G = 1000
0.010
G = 100
G=1
G = 10
0.001
0.0005
10
1
2k
10k
1
20k
10
100
1k
10k
Frequency (Hz)
Frequency (Hz)
APPLICATIONS INFORMATION
useful if various input sources are connected to the INA103.
Although not shown in other figures, this network can be
used, if needed, with all applications shown.
Figure 1 shows the basic connections required for operation.
Power supplies should be bypassed with 1µF tantalum
capacitors near the device pins. The output Sense (pin 11)
and output Reference (pin 7) should be low impedance
connections. Resistance of a few ohms in series with these
connections will degrade the common-mode rejection of the
amplifier.
To avoid oscillations, make short, direct connection to the
gain set resistor and gain sense connections. Avoid running
output signals near these sensitive input nodes.
GAIN SELECTION
Gains of 1 or 100V/V can be set without external resistors.
For G = 1V/V (unity gain) leave pin 14 open (no connection)—see Figure 4. For G = 100V/V, connect pin 14 to pin
6—see Figure 5.
Gain can also be accurately set with a single external resistor
as shown in Figure 1. The two internal feedback resistors are
laser-trimmed to 3kΩ within approximately ±0.1%. The
temperature coefficient of these resistors is approximately
50ppm/˚C. Gain using an external RG resistor is—
6kΩ
G=1+
RG
INPUT CONSIDERATIONS
Certain source impedances can cause the INA103 to oscillate. This depends on circuit layout and source or cable
characteristics connected to the input. An input network
consisting of a small inductor and resistor (Figure 2) can
greatly reduce the tendancy to oscillate. This is especially
®
INA103
8
V+
1µF Tantalum
+
50Ω
9
16
16
1.2µH
15
–
V IN RG
+
13
11
INA103
14
VO = G • VIN
10
11
INA103
7
6
7
RL
VOUT
2
1.2µH
1
8
1
+
V–
NOTES: (1) No RG required for G = 1.
See gain-set connections in Figure 4.
(2) RG for G = 100 is internal. See
gain-set connection in Figure 5.
GAIN
GAIN (dB)
RG (Ω)
1
3.16
10
31.6
100
316
1000
0
10
20
30
40
50
60
Note 1
2774
667
196
60.6(2)
19
6
50Ω
FIGURE 2. Input Stabilization Network.
Offset voltage can be trimmed with the optional circuit
shown in Figure 3. This offset trim circuit primarily adjusts
the output stage offset, but also has a small effect on input
stage offset. For a 1mV adjustment of the output voltage, the
input stage offset is adjusted approximately 1µV. Use this
adjustment to null the INA103’s offset voltage with zero
differential input voltage. Do not use this adjustment to null
offset produced by a sensor, or offset produced by subsequent stages, since this will increase temperature drift.
FIGURE 1. Basic Circuit Configuration.
Accuracy and TCR of the external RG will also contribute to
gain error and temperature drift. These effects can be directly inferred from the gain equation.
Connections available on A1 and A2 allow external resistors
to be substituted for the internal 3kΩ feedback resistors. A
precision resistor network can be used for very accurate and
stable gains. To preserve the low noise of the INA103, the
value of external feedback resistors should be kept low.
Increasing the feedback resistors to 20kΩ would increase
noise of the INA103 to approximately 1.5nV/√Hz. Due to
the current-feedback input circuitry, bandwidth would also
be reduced.
To offset the output voltage without affecting drift, use the
circuit shown in Figure 4. The voltage applied to pin 7 is
summed at the output. The op amp connected as a buffer
provides a low impedance at pin 7 to assure good commonmode rejection.
Figure 5 shows a method to trim offset voltage in ACcoupled applications. A nearly constant and equal input bias
current of approximately 2.5µA flows into both input terminals. A variable input trim voltage is created by adjusting the
balance of the two input bias return resistances through
which the input bias currents must flow.
NOISE PERFORMANCE
The INA103 provides very low noise with low source
impedance. Its 1nV/√Hz voltage noise delivers near theoretical noise performance with a source impedance of 200Ω.
Relatively high input stage current is used to achieve this
low noise. This results in relatively high input bias current
and input current noise. As a result, the INA103 may not
provide best noise performance with source impedances
greater than 10kΩ. For source impedance greater than 10kΩ,
consider the INA114 (excellent for precise DC applications), or the INA111 FET-input IA for high speed applications.
V–
10kΩ
16
6kΩ
G = 1 + —–
RG
3
15
4
13
∆V IN RG
OFFSET ADJUSTMENT
Offset voltage of the INA103 has two components: input
stage offset voltage is produced by A1 and A2; and, output
stage offset is produced by A3. Both input and output stage
offset are laser trimmed and may not need adjustment in
many applications.
14
11 10
INA103
VOUT
7
6
2
1
Offset Adjust
Range = ±250mV. RTI
FIGURE 3. Offset Adjustment Circuit.
®
9
INA103
OUTPUT SENSE
An output sense terminal allows greater gain accuracy in
driving the load. By connecting the sense connection at the
load, I•R voltage loss to the load is included inside the
feedback loop. Current drive can be increased by connecting a current booster inside the feedback loop as shown in
Figure 11.
Figure 6 shows an active control loop that adjusts the output
offset voltage to zero. A2, R, and C form an integrator that
produces an offsetting voltage applied to one input of the
INA103. This produces a –6dB/octave low frequency rolloff like the capacitor input coupling in Figure 5.
COMMON-MODE INPUT RANGE
For proper operation, the combined differential input signal
and common-mode input voltage must not cause the input
amplifiers to exceed their output swing limits. The linear
input range is shown in the typical performance curve
“Maximum Common-Mode Voltage vs Output Voltage.”
For a given total gain, the input common-mode range can be
increased by reducing the input stage gain and increasing the
output stage gain with the circuit shown in Figure 7.
IB– ≈ IB+ ≈ 2.5µA
16
Gain = 1V/V
(0dB)
15
–In
13
11
INA103
∆ VIN 14
IB–
VOUT
10
Gain = 100V/V
(40dB)
16
15
11
13
V+
10
INA103
14
7
100µA(1)
6
VOUT
6
2
OPA27
1
–
2
IB+
150Ω
+
1
10kΩ
+In
(1)
50kΩ
150Ω
Offset Adjustment
Range = ±15mV
50kΩ
100µA(1)
100kΩ
FIGURE 4. Output Offsetting.
(1)
NOTE: (1) 50k Ω R, 100kΩ pot is
max recommended value. Use
smaller values in this ratio if possible.
FIGURE 5. Input Offset Adjustment for AC-Coupled Inputs.
Gain = 100V/V
(40dB)
16
–In
15
10
INA103
14
6
C
1µF
1
(1)
100kΩ
(1)
10kΩ
A2
2kΩ
–
+
1/2 OPA1013
NOTE: (1) 100kΩ is max recommended
value. Use smaller value if possible.
FIGURE 6. Automatic DC Restoration.
®
10
VOUT
R
100kΩ
7
2
+In
f–3dB =
11
13
INA103
(1)
V–
NOTE: (1) 1/2 REF200
100kΩ
7
Gain
12π RC
RF
16
R1
15
16
13
11
INA103
∆ VIN 14
R2
15
10
VOUT
7
6
∆V IN RG
11 10
INA103
14
7
R3
2
12
13
VOUT
6
5
1
2
G = 1+
1
Output Stage Gain =
OUTPUT STAGE
GAIN
R1 and R3
(kΩ)
R2
(Ω)
2
5
10
1k
1.2k
1.2k
2.4k
632Ω
273Ω
(R2 || 12k) + R1 + R3
(R2 || 12k)
2RF
RG
RF
RF > 10kΩ can increase noise and reduce bandwidth—see text.
NOTE: AD625 equivalent pinout.
FIGURE 7. Gain Adjustment of Output Stage.
FIGURE 8. Use of External Resistors for Gain Set.
(b) INA103 G = 1, VIN = ±15V, RL = 600Ω
(a) AD625 G = 1, VIN = ±15V, RL = 600Ω
A common problem with many IC op amps and instrumentation amplifiers is shown in (a). Here, the amplifier’s input is driven beyond its linear common-mode
range, forcing the output of the amplifier into the supply rails. The output then “folds back”, i.e., a more positive input voltage now causes the output of the amplifier
to go negative. The INA103 has protection circuitry to prevent fold-back, and as shown in (b), limits cleanly.
FIGURE 9. INA103 Overload Condition Performance.
Gain = 1V/V
(0dB)
16
V+
10Ω
15
16
15
13
∆ VIN 14
11
INA103
10
13
7
∆V IN RG
6
14
6
2
20Ω
1
MJ15011
CMR
Trim
2
1
Introduces
approximately
+0.2% Gain Error.
11
10
INA103
100Ω
VOUT
(To headphone
or speaker)
7
MJ15012
Buffer inside feedback loop
V–
FIGURE 10. Optional Circuit for Externally Trimming CMR.
FIGURE 11. Increasing Output Circuit Drive.
®
11
INA103
47µF/63V
16
+
6.8kΩ
+48V
15
2.2kΩ
20dB
Pad
1
Phantom
Power
240Ω
cm 3
2
6.8kΩ
10Ω
Gain
Adjust
47kΩ
13
1kΩ
11 10
INA103
14
V OUT
7
6
100kΩ
1µF
2
47µF/63V
1
+
–
2.2kΩ
20dB
Pad
OPA627
+
240Ω
Output offset voltage
control loop.
FIGURE 12. Microphone Preamplifier with Provision for Phantom Power Microphones.
16
15
10kΩ
12
13
INA103
14
∆V IN
10kΩ
11
10
VOUT
7
6
10kΩ
10kΩ
5
2
1
–
100Ω
+
Shield driver minimizes degradation of CMR due
to distributed capacitance on the input lines.
OPA602
FIGURE 13. Instrumentation Amplifier with Shield Driver.
–
+
16
OPA627
15
13
11
7
6
∆V IN
2
1
Gain = 100V/V
(40dB)
–
+
OPA627
FIGURE 14. Gain-of-100 INA103 with FET Buffers.
®
INA103
10
INA103
14
12
V OUT = 100 ∆V IN
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
INA103KP
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
INA103KP
INA103KPG4
ACTIVE
PDIP
N
16
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
INA103KP
INA103KU
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
INA103KU
INA103KU/1K
ACTIVE
SOIC
DW
16
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
INA103KU
INA103KU/1KE4
ACTIVE
SOIC
DW
16
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
INA103KU
INA103KUG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
INA103KU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
INA103KU/1K
Package Package Pins
Type Drawing
SOIC
DW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.7
2.7
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
INA103KU/1K
SOIC
DW
16
1000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages