ON NL27WZ06DFT2G Dual inverter with open drain output Datasheet

NL27WZ06
Dual Inverter with Open
Drain Outputs
The NL27WZ06 is a high performance dual inverter with open drain
outputs operating from a 1.65 V to 5.5 V supply.
The internal circuit is composed of multiple stages, including an open
drain output which provides the capability to set output switching level.
This allows the NL27WZ06 to be used to interface 5 V circuits to circuits
of any voltage between VCC and 7 V using an external resistor and power
supply.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5 V TTL Logic
with VCC = 3 V
LVCMOS Compatible
24 mA Output Sink Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Chip Complexity: FET = 72; Equivalent Gate = 18
Pb−Free Packages are Available
IN A1
GND
IN A2
1
6
2
5
3
4
1
MF M G
G
1
6
TSOP−6
DT SUFFIX
CASE 318G
1
MF M G
G
1
MF = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
OUT Y1
VCC
M
•
•
•
•
6
SC−88
DF SUFFIX
CASE 419B
PIN ASSIGNMENT
1
IN A1
2
GND
3
IN A2
4
OUT Y2
5
VCC
6
OUT Y1
OUT Y2
FUNCTION TABLE
A Input
Figure 1. Pinout (Top View)
L
H
IN A1
1
OUT Y1
IN A2
1
OUT Y2
February, 2007 − Rev. 6
Z
L
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2007
Y Output
1
Publication Order Number:
NL27WZ06/D
NL27WZ06
MAXIMUM RATINGS
Symbol
VCC
Characteristics
Value
Unit
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
−0.5 ≤ VO ≤ 7.0
V
VI < GND
−50
mA
VO < GND
−50
mA
DC Supply Voltage
VI
DC Input Voltage
VO
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
Output in Z or LOW State (Note 1)
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current Per Supply Pin
±100
mA
IGND
DC Ground Current Per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SC−88, TSOP−6
200
mW
qJA
Thermal Resistance
SC−88, TSOP−6
333
°C/W
TL
Lead temperature, 1 mm from case for 10 s
260
°C
TJ
Junction temperature under bias
+150
°C
> 2000
> 200
N/A
V
±500
mA
VESD
ILatchup
ESD Withstand Voltage
Latchup Performance
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Above VCC and Below GND at 85°C (Note 5)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A
3. Tested to EIA/JESD22−A115−A
4. Tested to JESD22−C101−A
5. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
Operating
Data Retention Only
(Z or LOW State)
VCC = 2.5 V ±0.2 V
VCC =3.0 V ±0.3 V
VCC =5.0 V ±0.5 V
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2
Min
Max
Unit
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
−55
+125
°C
0
0
0
20
10
5
ns/V
NL27WZ06
DC ELECTRICAL CHARACTERISTICS
−40°C ≤ TA ≤ 85°C
TA = 25°C
VCC
(V)
Min
High−Level Input Voltage
1.65
2.3 to 5.5
0.75 VCC
0.70 VCC
VIL
Low−Level Input Voltage
1.65
2.3 to 5.5
0.25 VCC
0.30 VCC
0.25 VCC
0.30 VCC
V
ILKG
Z−State Output
Leakage Current
VIN = VIL
VOUT = VCC or GND
1.65 to 5.5
±5.0
±10.0
mA
VOL
Low−Level Output Voltage
VIN = VIH
IOL = 100 mA
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 3 mA
1.65
0.08
0.24
Symbol
Parameter
VIH
IIN
Input Leakage Current
IOFF
Power Off−Output
Leakage Current
ICC
Quiescent Supply Current
Condition
Typ
Max
Min
Max
0.75 VCC
0.70 VCC
Unit
V
IOL = 8 mA
2.3
0.22
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
VIN or VOUT = VCC or
GND
0 to 5.5
±0.1
±1.0
mA
VOUT = 5.5 V
0
1
10
mA
VIN = VCC or GND
5.5
1
10
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
−40°C ≤ TA ≤ 85°C
TA = 25°C
Symbol
tPZL
tPLZ
Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
RL = R1= 5000 W, CL = 15 pF
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
ns
RL = R1= 500 W, CL = 50 pF
2.5 ± 0.20
0.8
3.0
3.6
0.8
4.1
RL = R1= 500 W, CL = 50 pF
3.3 ± 0.30
0.8
2.4
3.2
0.8
3.7
RL = R1= 500 W, CL = 50 pF
5.0 ± 0.50
0.5
2.4
3.0
0.5
3.5
RL = R1= 5000 W, CL = 15 pF
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
RL = R1= 500 W, CL = 50 pF
2.5 ± 0.20
0.8
3.0
3.6
0.8
4.1
RL = R1= 500 W, CL = 50 pF
3.3 ± 0.30
0.8
2.1
3.2
0.8
3.7
RL = R1= 500 W, CL = 50 pF
5.0 ± 0.50
0.5
1.2
3.0
0.5
3.5
Parameter
Propagation Delay
(Figure 3 and 4)
Propagation Delay
(Figure 3 and 4)
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Input Capacitance
COUT
Output Capacitance
CPD
Power Dissipation Capacitance (Note 6)
Condition
Typical
Unit
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
VCC = 5.5 V, VI = 0 V or VCC
4
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ06
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
−55°C ≤ TA ≤ 125°C
TA = 25°C
VCC
(V)
Min
Typ
0.75 VCC
0.70 VCC
Max
Min
Max
High−Level Input Voltage
1.65
2.3 to 5.5
VIL
Low−Level Input Voltage
1.65
2.3 to 5.5
0.25 VCC
0.30 VCC
0.25 VCC
0.30 VCC
V
ILKG
Z−State Output
Leakage Current
VIN = VIL
VOUT = VCC or GND
1.65 to 5.5
±5.0
±10.0
mA
VOL
Low−Level Output Voltage
VIN = VIH
IOL = 100 mA
1.65 to 5.5
0.0
0.1
0.1
V
IOL = 3 mA
1.65
0.08
0.24
IIN
Input Leakage Current
IOFF
Power Off−Output
Leakage Current
ICC
Quiescent Supply Current
0.75 VCC
0.70 VCC
Unit
VIH
V
IOL = 8 mA
2.3
0.22
0.3
0.35
IOL = 12 mA
2.7
0.22
0.4
0.45
IOL = 16 mA
3.0
0.28
0.4
0.5
IOL = 24 mA
3.0
0.38
0.55
0.65
IOL = 32 mA
4.5
0.42
0.55
0.65
VIN or VOUT = VCC or
GND
0 to 5.5
±0.1
±1.0
mA
VOUT = 5.5 V
0
1
10
mA
VIN = VCC or GND
5.5
1
10
mA
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W
−55°C ≤ TA ≤ 125°C
TA = 25°C
Symbol
tPZL
tPLZ
Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
RL = R1= 5000 W, CL = 15 pF
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
ns
RL = R1= 500 W, CL = 50 pF
2.5 ± 0.20
0.8
3.0
3.6
0.8
4.1
RL = R1= 500 W, CL = 50 pF
3.3 ± 0.30
0.8
2.4
3.2
0.8
3.7
RL = R1= 500 W, CL = 50 pF
5.0 ± 0.50
0.5
2.4
3.0
0.5
3.5
RL = R1= 5000 W, CL = 15 pF
1.8 ± 0.15
2.0
5.7
10.5
2.0
11.0
RL = R1= 500 W, CL = 50 pF
2.5 ± 0.20
0.8
3.8
4.5
0.8
5.0
RL = R1= 500 W, CL = 50 pF
3.3 ± 0.30
0.8
2.9
3.2
0.8
3.7
RL = R1= 500 W, CL = 50 pF
5.0 ± 0.50
0.5
1.2
3.0
0.5
3.5
Parameter
Propagation Delay
(Figure 3 and 4)
Propagation Delay
(Figure 3 and 4)
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Input Capacitance
COUT
Output Capacitance
CPD
Power Dissipation Capacitance (Note 6)
Condition
Typical
Unit
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
VCC = 5.5 V, VI = 0 V or VCC
4
pF
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
4
pF
7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
NL27WZ06
VCC
A
50%
GND
tPZL
tPLZ
HIGH
IMPEDANCE
50% VCC
Y
VOL +0.3 V
Figure 3. Switching Waveforms
VCC
R1
PULSE
GENERATOR
VCC x 2
DUT
RT
CL
RL
RT = ZOUT of pulse generator (typically 50 W)
Figure 4. Test Circuit
ORDERING INFORMATION
Device
Package
NL27WZ06DFT2
NL27WZ06DFT2G
Shipping†
SC−88
SC−88
(Pb−Free)
3000 / Tape & Reel
NL27WZ06DTT1
NL27WZ06DTT1G
TSOP−6
TSOP−6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
NL27WZ06
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE W
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
D
e
6
5
4
1
2
3
HE
DIM
A
A1
A3
b
C
D
E
e
L
HE
−E−
b 6 PL
0.2 (0.008)
M
E
M
MILLIMETERS
MIN
NOM MAX
0.80
0.95
1.10
0.00
0.05
0.10
0.20 REF
0.10
0.21
0.30
0.10
0.14
0.25
1.80
2.00
2.20
1.15
1.25
1.35
0.65 BSC
0.10
0.20
0.30
2.00
2.10
2.20
A3
C
A
A1
L
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
INCHES
NOM MAX
0.037 0.043
0.002 0.004
0.008 REF
0.004 0.008 0.012
0.004 0.005 0.010
0.070 0.078 0.086
0.045 0.049 0.053
0.026 BSC
0.004 0.008 0.012
0.078 0.082 0.086
MIN
0.031
0.000
NL27WZ06
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
D
6
HE
1
5
4
2
3
E
b
DIM
A
A1
b
c
D
E
e
L
HE
q
e
q
c
A
0.05 (0.002)
L
A1
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.014
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.075
0.95
0.037
0.95
0.037
0.7
0.028
1.0
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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For additional information, please contact your local
Sales Representative
NL27WZ06/D
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