CPC1466 Broadband ADSL/VDSL DC Termination IC Features Description • Meets wetting (sealing) current requirements per ITU-T G.991.2 • Integrated bridge rectifier for polarity correction • Uses inexpensive opto-coupler for DC sealing current monitoring • Electronic inductor, breakover, and latch circuits • Current limiting and excess power protection circuits • ADSL/VDSL compatible with low-pass filter network • MLT and SARTS compatible • Compatible with portable test sets • Small SOIC or Micro-Leadframe Package (MLP) • MLP package 60 percent smaller than SOIC The CPC1466 is a DC Termination IC for broadband ADSL/VDSL applications. The high-voltage, monolithic device provides a path for DC wetting (sealing) current in customer premises equipment (CPE) to eliminate phone line corrosion on DSL twisted-pair copper lines without telephone voice services (i.e. only broadband services). PR EL IM IN AR Y Applications • • • • • Internally, a bridge rectifier provides a polarity-insensitive DC termination for DSL loop sealing current. The IC includes an electronic inductor, break-over and latch circuits, current limit and excess power protection. A sealing current detect output provides the means to monitor the loop for the presence of sealing current in the loop. ADSL/VDSL broadband modems Router and bridge customer premises equipment Leased line equipment Mechanized Loop Test (MLT) networks Switched Access Remote Test System (SARTS) networks The CPC1466 is manufactured in Clare’s high voltage BCDMOS process that is used extensively in telephony applications worldwide. Ordering Information Figure 1. CPC1466 Block Diagram Part Number Description DC Termination IC, 16-pin SOIC in tubes, 47/tube DC Termination IC, 16-pin SOIC tape and reel, CPC1466DTR 1000/reel DC Termination IC, 16-pin MLP in tubes, CPC1466M 52/tube DC Termination IC, 16-pin MLP tape and reel, CPC1466MTR 1000/reel CPC1466D 1 2 3 4 5 6 7 8 PR+ Electronic Inductor, Breakover, Latch, and Opto Driver NC TIP NC NC Bridge Rectifier RING NC PR- Current Limit and Excess Power Protection DS-CPC1466 - R00B TC 16 NC 15 NC 14 RS 13 NC 12 PD 11 NC 10 COM 9 www.clare.com 1 CPC1466 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4.1 DC Characteristics, Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4.2 AC Characteristics, Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4.3 Transition Characteristics, Normal Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Sealing Current Monitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5.1 LED Trigger Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 4 4 8 8 10 10 10 10 10 10 10 10 11 11 11 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.1 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1.2 MLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Printed Circuit Board Layout Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.1 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2.2 MLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3.1 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3.2 MLP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.1 Moisture Reflow Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4.2 Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Washing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 12 13 14 14 14 14 14 15 15 15 15 15 PR EL IM IN A RY 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 Surge Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 Bridge Rectifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4 State Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4.1 Activation - On-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4.2 Deactivation - Off-State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 Photo-Diode (PD) Output Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.6 On-State Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.6.1 Typical Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.6.2 Over-Voltage Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.clare.com R00B 1. Specifications 1.1 Package Pinout 1.2 Pin Description Pin Name 1 PR+ Protection resistor positive side PR+ 1 16 TC 2 NC No connection NC 2 15 NC 3 TIP Tip Lead TIP 3 14 NC 4 NC No connection 5 NC No connection NC 4 13 RS NC 5 12 NC RING 6 11 PD NC 7 10 NC PR- 8 9 COM 6 EL IM PR RING Ring lead NC No connection IN A RY 7 R00B Description 8 PR- Protection resistor negative side 9 COM Common 10 NC No connection 11 PD Photo-diode (LED input current) 12 NC No connection 13 RS Current limiting resistor 14 NC No connection 15 NC No connection 16 TC Timing capacitor 1.3 Absolute Maximum Ratings Parameter Minimum Maximum Unit Maximum Voltage (T to R, R to T)* - 300 V Power dissipation - 1 W -40 +85 °C 5 95 % -40 +125 °C Operating temperature Operating relative humidity Storage temperature Electrical absolute maximum ratings are at 25°C. Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. www.clare.com 3 CPC1466 1.4 Electrical Characteristics informational purposes only and are not part of the testing requirements. Unless otherwise specified, minimum and maximum values are guaranteed by production testing requirements. Typical values are characteristic of the device and are the result of engineering evaluations. In addition, typical values are provided for All electrical specifications are provided for TA=25°C 1.4.1 DC Characteristics, Normal Operation For operational templates: (see Figure 2 on page 5) and (see Figure 3 on page 5). Parameter Off State Breakover current - Symbol Minimum Typical Maximum Unit VAN 30.0 35.0 39.0 V IBO - 0.5 1 mA IN A RY Activate/Non-activate Voltage Conditions DC Voltage drop Active State, 1 mA ≤ ISL ≤ 20 mA VON - 12.5 15 V DC leakage current VOFF = 20 V ILKG - 1.5 5 µA Hold/Release current Active State IH/R 0.1 0.5 1.0 mA Minimum on current VON < 54 V IMIN1 20 38 - mA 54 V ≤ VON ≤ 100 V for 2 seconds, source resistance 200 Ω to 4 kΩ IMIN2 9.0 45 - mA VON > 100 V IMIN3 0 0.1 - mA IMAX1 - 38.4 70 mA IMAX2 - - V ON ---------1kΩ mA IPD 0.2 0.3 10 mA Maximum on current VON ≤ 70 V Photodiode drive current EL IM VON > 70 V Active State 1.4.2 AC Characteristics, Normal Operation For test conditions: (see Figure 4 on page 6). Conditions PR Parameter AC impedance 200 Hz to 50 kHz Linearity distortion ƒ = 200 Hz to 40 kHz, ISL = 1 mA to 20 mA, VAPP ≤ 12 VPP Symbol Minimum Typical Maximum Unit ZMT 10 38 - kΩ D 40 70 - dB 1.4.3 Transition Characteristics, Normal Operation For activation/deactivation test conditions: (see Figure 5 on page 7). Parameter Conditions Symbol Minimum Typical Maximum Unit Activate time (see Figure 6 on page 7) t1 3.0 13 50 ms Deactivate time (see Figure 7 on page 7) t2 3.0 - 100 ms 4 www.clare.com R00B Figure 2. I-V Requirements Template, 0 V to 50 V 1A IMAX1 100 mA VON IMIN1 On State VAN 1 mA Transition Region 100 µA IHR 10 µA 1 µA ILKG Off State 0 0 IBO IN A RY Current 10 mA 10 Transition Region 20 30 40 50 EL IM Absolute Voltage (V) Figure 3. I-V Requirements Template, 0 V to 250 V 1A 70 V, 70 mA IMAX1 100 mA 54 V, 9 mA PR 10 mA Current IMAX2 IMIN1 IMIN2 1 mA 100 µA 10 µA 1 µA 100 V, 0 mA 0 0 50 100 150 200 250 Absolute Voltage (V) R00B www.clare.com 5 CPC1466 Figure 4. Test Circuit for ac Impedance and Linearity 68 µF ISL VAPP ac generator DUT IN A RY Vmt 1 - 20 mA dc current source 1k Ω EL IM Vsig 1000 × V mt Z mt = --------------------------V sig PR V mt 1000 Linearity = 20 log ---------------------------------------- + 20 log -----------V sig2ndHarmonic 67.5 6 www.clare.com R00B Figure 5. Test Circuit for Activate and Deactivate Times 1 µF Pulse generator DUT 85 mH IN A RY 85 Ω Figure 6. Applied Waveform for Activation Test 43.5 V 40 V Source Impedance 200 Ω to 4k Ω t1 30 V EL IM 20 V 500 ms 10 V Measure 0 PR Figure 7. Applied Waveform for Deactivation Test 2.0 mA Current source limited to 30 V Measure 1.5 mA 500 ms 1.0 mA 0.5 mA t2 0 R00B www.clare.com 7 CPC1466 1.5 Sealing Current Monitor Characteristics 1.5.1 LED Trigger Characteristics For test conditions: (see Figure 8 on page 8). Parameter Conditions Symbol Minimum Typical Maximum Unit Applied dc battery Voltage - - -43.5 - -56 VDC Frequency (pulses per second) - - 4 - 8 - Percent break - - 40 - 60 % Number of pulses - - 6 - 10 - Total Loop Resistance - - 200 - 4000 Ω Required opto-coupler response - - - 1 - - 10 - - ms 10 - - ms IN A RY Number of applied pulses per make/break Pulse width (opto on) (see Figure 8 on page 8) TON Pulse width (opto off) (see Figure 8 on page 8) TOFF Figure 8. Test Circuit for LED Operation RLOOP 200Ω - 4kΩ 900Ω - 4.5kΩ (MLT) EL IM Series rotary dial 25Ω 1µF + VBAT -43.5V to -56V 85Ω 85mH 25Ω RING Shunt rotary dial PR TIP PR+ TC 16 2 NC NC 15 TIP NC 14 NC RS 3 4 5 6 7 2.2kΩ 5% 4W 8 8 CPC1466 1 NC NC RING PD NC PR- 13 1µF 68.1Ω 1% 1/4 W 1 6 11 2 5 10 3 4 75kΩ NC COM VCC 5V 12 VOUT 9 www.clare.com R00B R00B RING TIP SP1 L2 L1 30 - 35mH with Loop Current SSR CPC1225N Solid State Relay C1 2.2k 5% 4W NC PR- 8 RING NC NC TIP Current Limit and Excess Power Protection Bridge Rectifier Electronic Inductor, Breakover, Latch, and Opto Driver CPC1466 COM NC PD NC RS NC NC TC 9 10 11 12 13 14 15 16 EL IM NC PR+ 7 6 5 4 3 2 1 PR www.clare.com 6 5 4 1 VCC 2 3 75k IN A RY 68 1% 1/4W 1µF DC Blocking Capacitor Digital Control Circuitry Transceiver Figure 9. Typical ADSL/VDSL Application Diagram 9 CPC1466 2. Functional Description 2.1 Introduction 2.4 State Transitions The CPC1466 can be used for a number of DSL designs requiring a dc hold circuit such as ADSL modem applications. Typical ADSL applications will use a filter circuit design similar to the one shown in Figure 9‚ “Typical ADSL/VDSL Application Diagram” on page 9. The dc tip to ring voltage-current characteristics of the CPC1466 are shown in Figure 2‚ “I-V Requirements Template, 0 V to 50 V”, and in Figure 3‚ “I-V Requirements Template, 0 V to 250 V” on page 5. 2.2 Surge Protection EL IM As can be seen in the application circuit in Figure 9 on page 9, CPC1466 designs require few external components. For the CPC1466, all that is needed is a circuit protector, two resistors and a capacitor. To ensure DSL signal integrity over a wide variety of conditions a POTS splitter type filter is recommended to isolate the DSL traffic from the termination. IN A RY The DC Termination IC performs two fundamental functions in an ADSL modem application; as an electronic inductor providing a low impedance dc termination with a high impedance ac termination and second as part of the sealing current detection system for automated line sensing. This function provides an excellent method to monitor for the presence of sealing current. Generally, loss of sealing current indicates loop loss. PR Although the CPC1466 self protects via current limiting, it requires over-voltage surge protection to protect against destructive over-voltage transients. Clare recommends the use of a crowbar-type surge protector to limit the surge voltage seen by the CPC1466 to less than 250 V. The protection device must be able to withstand the surge requirements specified by the appropriate governing agency in regions where the product will be deployed. Teccor, Inc. and Bourns, Inc. make suitable surge protectors for most applications. Devices such as Teccor’s P1800SD or P2000SD Sidactors and Bourns’ TISP4220H3BJ or TISP4240H3BJ thyristors should provide suitable protection. Transition timings are illustrated in Figure 6‚ “Applied Waveform for Activation Test”, and in Figure 7‚ “Applied Waveform for Deactivation Test”. The test configuration for these timings is given in Figure 5‚ “Test Circuit for Activate and Deactivate Times”. All timing figures are located on page 7. State transition timings are set by the 1 µF capacitor connected between the TC and COM pins. 2.4.1 Activation - On-State Application of battery voltage to the loop causes the CPC1466 to conduct whenever the voltage exceeds approximately 35 V. With application of sufficient voltage applied across the tip and ring terminals, the CPC1466 will initially conduct a nominal 150 µA of sealing current for approximately 20 ms prior to activation. Once activated, the CPC1466 will remain in the on state for as long as the loop current exceeds a nominal 0.5 mA. The CPC1466 turn-on timing circuit assures device activation will occur within 50 ms of an applied voltage greater than 43.5 V but not within the first 3 ms. 2.4.2 Deactivation - Off-State While the CPC1466 activation protocol is based on an initial minimum voltage level, deactivation is based on a diminished sealing current level. Deactivation occurs when the nominal sealing current level drops below 0.5 mA with guaranteed deactivation occurring for sealing current levels less than 0.1 mA The turn-off timing circuit deactivates the sealing current hold circuit when 1 mA of sealing current has been removed for 100 ms but ignores periods of loss up to 3 ms. 2.3 Bridge Rectifier The bridge rectifier in the CPC1466 ensures that the device is polarity insensitive and provides consistent operational characteristics if the tip to ring polarity is reversed. 2.5 Photo-Diode (PD) Output Behavior Output from the PD pin provides a minimum of 0.2 mA of photodiode drive current for an optocoupler’s LED anytime sealing current exceeds 1 mA. Because LED current is interrupted whenever loop current is interrupted, the optocoupler provides an 10 www.clare.com R00B excellent means of indicating loop availability for designs with a full time sealing current requirement. In addition, for pulsed sealing current loops, the status from this detector when used in conjuntion with the timing of modem retraining events can be used as an indicator to determine if the sealing current event is clearing line impairments. 2.6 On-State Behavior On-state sealing current levels are determined by the network’s power feed circuit and the loop’s dc impedance. To compensate for low loop resistance or very high loop voltage, the CPC1466 limits the maximum sealing current to 70 mA. The CPC1466 manages package power dissipation by shunting excess sealing current through the 2.2 kΩ 4W power resistor located between the PR+ and PRpins. 2.6.2 Over-Voltage Conditions PR EL IM Potentials in excess of 100 V applied to the tip and ring interface will cause the CPC1466 to disable the sealing current hold circuit and enter a standby state with very little current draw. Once the over-voltage condition is removed, the CPC1466 automatically resumes normal operation. IN A RY 2.6.1 Typical Conditions R00B www.clare.com 11 CPC1466 3. Manufacturing Information 3.1 Mechanical Dimensions 3.1.1 SOIC 0.400±0.015 (10.160±0.381) NOTES: 1. Coplanarity = 0.004 (0.1016) max. 2. Leadframe thickness does not include solder plating (1000 microinch maximum). 3. Sum of package height, standoff, and coplanarity does not exceed 0.083 (2.108). PIN 16 IN A RY 0.408±0.005 (10.363±0.127) 0.295±0.005 (7.493±0.127) PIN 1 0.050 TYP (1.270 TYP) 0.016 TYP (0.406 TYP.) 0.025 X 45˚ (0.635 X 45˚) EL IM 0.083 MAX (2.108 MAX.) SEE NOTE 3 0.350 TYP (8.890 TYP.) 0.010 ±0.0005 (0.254 ±0.0127) LEAD TO PACKAGE STANDOFF: MIN: 0.001 (0.0254) MAX: 0.004 (0.102) PR 0.020±0.004 (0.508±0.1016) 12 0.040 TYP (1.016 TYP) www.clare.com DIMENSIONS inches (mm) R00B 3.1.2 MLP 7.00 ± 0.25 (0.276 ± 0.01) 6.00 ± 0.25 (0.236 ± 0.01) INDEX AREA TOP VIEW 0.90 ± 0.10 (0.035 ± 0.004) SIDE VIEW 0.23 (0.009) IN A RY 0.02, + 0.03, - 0.02 (0.0008, + 0.0012, - 0.0008) 0.33, + 0.07, - 0.05 (0.013, + 0.003, - 0.002) 1 0.55 ± 0.10 (0.022 ± 0.004) SEATING PLANE 0.20 (0.008) EXPOSED METALLIC PAD 1.80 (0.071) 0.55 ± 0.10 (0.022 ± 0.004) 4.00 ± 0.05 (0.157 ± 0.002) 0.40 (0.016) 16 Terminal Tip 0.80 (0.032) 6.00 ± 0.05 (0.236 ± 0.002) 0.55 ± 0.10 (0.022 ± 0.004) BOTTOM VIEW PR EL IM Dimensions mm (inch) R00B www.clare.com 13 CPC1466 3.2 Printed Circuit Board Layout Pattern 3.2.1 SOIC 3.2.2 MLP 0.40 (0.016) 1.27 (0.050) 0.65 (0.026) 1.15 (0.045) 9.30 (0.366) 5.70 (0.224) 1.90 (0.075) 1.15 (0.045) IN A RY 0.43 (0.017) 0.40 (0.016) 0.60 (0.024) DIMENSIONS mm (inches) 0.80 (0.031) DIMENSIONS mm (inches) NOTE: As the metallic pad on the bottom of the MLP package is connected to the substrate of the die, Clare recommends that no printed circuit board traces or vias be placed under this area. 3.3.1 SOIC EL IM 3.3 Tape and Reel Packaging Tape and Reel Packaging for 16-Pin SOIC Package 330.2 Dia (13.00 Dia) B0=10.70 + 0.15 (0.421 + 0.01) PR Top Cover Tape Thickness 0.102 Max (0.004 Max) Embossed Carrier Embossment 14 W=16.00 + 0.30 (0.630 + 0.010) Top Cover Tape K0=3.20 + 0.15 (0.193 + 0.01) P=12.00 (0.47) K1=2.70 + 0.15 (0.106 + 0.01) User Direction of Feed A0=10.90 + 0.15 (0.429 + 0.010) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 www.clare.com R00B 3.3.2 MLP Tape and Reel Packaging for 6mm x 7mm 16-Pin MLP Package B0=7.24 + 0.10 (0.285 + 0.004) 330.2 Dia (13.00 Dia) Pin 1 Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 + 0.30 (0.630 + 0.012) Embossed Carrier A0=6.24 + 0.10 (0.246 + 0.004) IN A RY K0=1.61 + 0.10 (0.063 + 0.004) P=12.00 + 0.10 (0.472 + 0.004) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 Embossment 3.4 Soldering 3.4.2 Reflow Profile 3.4.1 Moisture Reflow Sensitivity For proper assembly, this component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. 3.5 Washing Clare does not recommend ultrasonic cleaning of this part. PR EL IM Clare has characterized the moisture reflow sensitivity for this product using IPC/JEDEC standard J-STD-020. Moisture uptake from atmospheric humidity occurs by diffusion. During the solder reflow process, in which the component is attached to the PCB, the whole body of the component is exposed to high process temperatures. The combination of moisture uptake and high reflow soldering temperatures may lead to moisture induced delamination and cracking of the component. To prevent this, this component must be handled in accordance with IPC/JEDEC standard J-STD-033 per the labeled moisture sensitivity level (MSL), level 1 for the SOIC package, and level 3 for the MLP package. For additional information please visit www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specifications: DS-CPC1466 - R00B © Copyright 2007, Clare, Inc. All rights reserved. Printed in USA. 6/29/2007 R00B www.clare.com 15