OKI MSM14Q0000 0.35 î¼m sea of gates array Datasheet

DATA SHEET
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MSM13Q/14Q000
0.35 µm Sea of Gates Arrays
November 1999
■ ■ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Oki Semiconductor
MSM13Q0000/14Q0000
0.35 µm Sea of Gates Arrays
DESCRIPTION
Oki’s 0.3 5 µm ASIC products deliver ultra-high performance and high density at low power dissipation.
The MSM13Q0000/14Q0000 series devices (referred to as “MSM13Q/14Q”) are implemented with the
industry-standard Cell-Based Array (CBA) architecture in a Sea-of-Gates (SOG) structure. Built in a
0.35 µm drawn CMOS technology (with an L-Effective of 0.27 µm), these SOG devices are available in
three layers (MSM13Q) and four layers (MSM14Q) of metal. The semiconductor process is adapted from
Oki’s production-proven 64-Mbit DRAM manufacturing process.
The MSM13Q/14Q Series contains 6 arrays each, offering over 1 million raw gates and 352 I/O pads. Up
to 66% and 90% of the raw gates can be used for the 3-layer and 4-layer arrays, respectively. Oki’s 0.35
µm family is optimized for 3-V core operation with optimized 3-V I/O buffers and 5-V tolerant 3-V buffers. These SOG products are designed to fit the most popular plastic quad flat packs (QFPs), thin QFPs
(TQFPs) , and plastic ball grid array (PBGA) packages.
The MSM13Q/14Q Series uses the popular CBA architecture from Silicon Architects of Synopsys which
mixes two types of cells (8-transistor compute cells and 4-transistor drive cells) on the same die to deliver
high gate density and high drives. The CBA is supported by a rich macro library, optimized for synthesis.
Memory blocks are efficiently created by Oki’s memory compilers to generate single- and dual-port
RAM’s in high-density and low-power configurations with synchronous RAM options.
As such, the MSM13Q/14Q series is well suited to memory-intensive designs with high production volumes approaching the real estate and cost savings of standard cells. At the same time, its SOG architecture allows rapid prototyping turnaround times. Thus, Oki’s MSM13Q/14Q family offers the best of two
worlds: quick prototyping of a gate array and low production cost of a standard cell.
Oki’s 0.35 µm ASIC products are supported by leading-edge CAD tools including a synthesis-linked
floorplanner, motive static timing analyzer, and H-clock tree methodology. They are further supported
by specialized macrocells including phase-locked loop (PLL), pseudo-emitter coupled logic (PECL),
peripheral component interconnect (PCI), universal synchronous receiver/transmitter (UART) cells, and
ARM7TDMI RISC cores.
FEATURES
• 0.35 µm drawn 3- and 4-layer metal CMOS
• Optimized 3.3-V core
• Optimized 3-V I/O and 3-V I/O that is 5-V
tolerant
• CBA SOG architecture
• Over 1.0M raw gates and 352 pads
• User-configurable I/O with VSS, VDD, TTL, 3state, and 1- to 24-mA options
• Slew-rate-controlled outputs for low-radiated
noise
• H-clock tree cells which reduce the maximum
skew for clock signals
• User-configurable single and dual-port;
synchronous or asynchronous memories
• Specialized macrocells including PLL, PECL,
PCI, UART, and ARM7TDMI
• Floorplanning for front-end simulation, backend layout controls, and link to synthesis
• Joint Test Action Group (JTAG) boundary scan
and scan-path ATPG
• Support for popular CAE systems, including
Cadence, IKOS, Mentor Graphics, Synopsys,
Viewlogic, and Zycad
Oki Semiconductor
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
MSM13Q/14Q FAMILY LISTING
Raw Gate
MSM13Q/14Q
Series
PAD No.
Raw Gate
(Gates)
Usable Gate
M13Q(3LM)
Usable Gate
M14Q(4LM)
Row
Column
0150
144
157,192
105,319
143,045
196
802
0230
176
242,400
152,712
208,464
240
1,010
0340
208
346,176
204,244
276,941
288
1,202
0530
256
536,400
289,656
391,572
360
1,490
0840
320
847,048
415,054
567,522
452
1,874
1020
352
1,033,000
475,180
650,790
500
2,066
ARRAY ARCHITECTURE
The primary components of a 0.35 µm MSM13Q/14Q circuit include:
•
•
•
•
•
•
•
I/O base cells
Configurable I/O pads for VDD, VSS, or I/O (optimized 3-V I/O and 3-V I/O that is 5-V tolerant)
VDD and VSS pads dedicated to wafer probing
Separate power bus for output buffers
Separate power bus for internal core logic and input buffers
Core base modules containing three compute cells for each drive cell
Isolated gate structure for reduced input capacitance and increased routing flexibility
Each array has 24 dedicated corner pads for power and ground use during wafer probing, with 4 pads
per corner. The arrays also have separate power rings for the internal core functions (VDDC and VSSC)
and output drive transistors (VDDO and VSSO).
The array architecture uses optimally sized transistors to efficiently implement logic and memory in a
metal programmable technology. CBA uses two types of cells: compute cells and drive cells. The compute cell employs four PMOS and four NMOS trasnsistors whose sizes are optimized for logic and memory implementations as shown in Figure 1. The quantity and size of the transistors in a compute cell are
carefully selected to maximize the efficiency of most commonly used functions in VLSI design. The drive
cell consists of two large PMOS pull-up transistors and two large pull-down transistors. The compute
and drive cells are tiled to create a channelless core array, with three comput cells for each drive cell as
shown in Figure 2. The 3:1 ratio of compute to drive cells was selected for optimal implementation of
emerging applications. Macrocells are created using either compute cells, drive cells, or combinations of
compute and drive cells.
2
Oki Semiconductor
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
Compute Cell
Compute Cell
Compute Cell
Drive Cell
Figure 1. Base Cell Consisting of Three Compute Cells and One Drive Cell
Compute Cell
Drive Cell
Figure 2. Core Array with Base Cell Mirrored Horizontally and Vertically
Oki Semiconductor
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (VSS = 0 V, Tj = 25°C) [1]
Symbol
Rated Value
Unit
VDD
-0.3 to +4.6
V
Normal buffers
VI
-0.3 to VDD+0.3
5-V tolerant
VI
-0.3 to 6.0
Normal buffers
VO
-0.3 to VDD+0.3
5-V tolerant
VO
-0.3 to 6.0
Normal buffers
II
-10 to +10
5-V tolerant
II
-6 to +6
Parameter
Power supply voltage
Input voltage
Output voltage
Input current
Output current per I/O
Conditions
Normal buffers
IO
IO = 1, 2, 4, 6, 8, 12, 24 mA
-24 to +24
5-V tolerant
IO
IO = 2, 4, 6, 8, 12 mA
-8 to +8
Tstg
–
-65 to +150
Storage temperature
V
V
mA
mA
°C
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions
in the other specifications of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions (VSS = 0 V)
Symbol
Rated Value
Unit
Power supply voltage
VDD (3 V)
+3.0 to +3.6
V
Junction temperature
Tj
-40 to +85
°C
Parameter
4
Oki Semiconductor
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
DC Characteristics (VDD = 3.0 to 3.6 V, VSS = 0 V, Tj = -40°C to +85°C)
Rated Value
Parameter
High-level input voltage
Low-level input voltage
TTL- level Schmitt trigger input
threshold voltage
Symbol
–
VDD + 0.3
5-V tolerant
VIH
2.0
–
5.5
0.8
Normal buffer
VIL
TTL input
-0.3
–
5-V tolerant
VIL
TTL input
-0.3
–
0.8
Normal buffer
Vt+
–
1.5
2.0
0.7
1.0
–
Vt-
Vt+
Normal buffer
TTL input
Vt+ - VtTTL 5-V tolerant input
∆Vt
Vt+ - Vt-
VOH
IOH = -100 µA
IOH = -1, -2, -4, -6, -8, -12, -24 mA
5-V tolerant
VOH
IOH = -100 µA
IOH = -1, -2, -4, -6, -8, -12 mA
Normal buffer
5-V tolerant
Normal buffer
5-V tolerant
Low-level input current
3-state output leakage current
Normal buffer
VOL
VOL
IIH
IIH
IIL
0.5
–
–
1.5
2.0
0.7
1.0
–
0.4
0.5
–
VDD - 0.2
–
–
2.4
–
–
VDD - 0.2
–
–
2.4
–
–
IOL = 100 µA
–
–
0.2
IOL = 1, 2, 4, 6, 8, 12, 24mA
–
–
0.4
IOL = 100 µA
–
–
0.2
IOL = 1, 2, 4, 6, 8, 12 mA
–
–
0.4
VIH = VDD
–
0.1
10
VIH = VDD (50-kΩ pull-down)
10
66
200
VIH = VDD
–
0.1
10
VIH = VDD (50-kΩ pull-down)
10
66
200
VIL = VSS
-10
-0.1
-
VIL = VSS (50-kΩ pull-up)
-200
-66
-10
V
µA
VIL = VSS (3-kΩ pull-up)
-3.3
-1.1
-0.3
mA
IIL
VIL = VSS
-10
-0.1
–
µA
Normal buffer
IOZH
VOH = VDD
–
0.1
10
VOH = VDD (50-kΩ pull-down)
10
-66
200
VOL = VSS
-10
-0.1
–
VOL = VSS (50-kΩ pull-up)
-200
-66
-10
VOL = VSS (3-kΩ pull-up)
5-V tolerant
Stand-by current
0.4
Unit
5-V tolerant
IOZL
[3]
Max.
2.0
Vt-
High-level input current
Typ
VIH
∆Vt
Low-level output voltage
Min.
Normal buffer
5-V tolerant
High-level output voltage
Conditions
[1]
[2]
-3.3
-1.1
-0.3
VOH = VDD
–
0.1
10
VOH = VDD (50-kΩ pull-down)
10
66
200
IOZL
VOL = VSS
-10
-0.1
–
IDDQ
Output open, VIH = VDD, VIL = VSS
IOZH
Design Dependent
µA
mA
µA
µA
1. JEDEC Compatible; JESD8-1A LVTTL.
2. Typical condition is VDD = 3.3 V and Tj = 25oC on a typical process.
3. RAM/ROM should be in powerdown mode.
Oki Semiconductor
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
AC Characteristics (VDD = 3.3 V, VSS = 0 V, Tj = 25°C)
Driving
Type
Parameter
Internal gate
propagation delay
Inverter
1X
2X
Conditions [1] [2]
Rated Value [3]
F/O = 2, L = 0 mm
VDD = 3.3 V
0.082
4X
0.062
1X
0.14
2X
0.13
2-input NOR
1X
0.16
Inverter
1X
2X
2-input NAND
2-input NOR
0.28
2X
0.20
1X
0.34
2X
0.24
Output buffer
propagation delay
Push-pull
Normal output
buffer
6
0.13
1X
TTL level normal input buffer
F/O= 1, L = 0 mm
1040
F/O = 2,L = 1 mm
0.35
TTL level 5-V tolerant buffer
4 mA
MHz
0.64
CL = 20pF
2.15
8 mA
CL= 50 pF
2.25
12 mA
CL = 100 pF
2.82
3-state
5-V tolerant
buffer
4 mA
CL = 20 pF
2.41
Push-pull
Normal output
buffer
12 mA
CL = 100 pF
4.68 (r)
3.48 (f)
3-state
5-V tolerant
buffer
4 mA
CL = 20 pF
3.53 (r)
3.24 (f)
Input transition time in 0.2 ns / 3.3 V.
Typical condition is VDD = 3.3 V and Tj = 25oC.
Rated value is calculated as an average of the L-H and H-L delay times of each macro type on a typical process.
Output rising and falling times are both specified over a 10 to 90% range.
Oki Semiconductor
ns
0.19
0.097
Input buffer
propagation delay
1.
2.
3.
4.
0.14
F/O = 2, L = 1 mm
VDD = 3.3 V
4X
Toggle frequency
Output buffer
transition times [4]
0.068
2-input NAND
2X
Unit
ns
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
MACRO LIBRARY
Oki Semiconductor supports a wide range of macrocells and macrofunctions, ranging from simple hard
macrocells for basic Boolean operations to large, user-parameterizable macrofunctions. The following
figure illustrates the main classes of macrocells and macrofunctions available.
Examples
Basic Macrocells
NANDs
NORs
Basic Macrocells
with Scan test
Flip-Flops
EXORs
Latches
Flip-Flops
Combinational Logic
Clock Tree Driver
Macrocells
Macrocells
3V, 5V Tolerant
Output Macrocells
MSI Macrocells
Mega/Special
Macrocells [1]
3-State Outputs
Push-Pull Outputs
PECL Outputs
Open Drain Outputs
Slew Rate Control Outputs
PCI Outputs
Counters
Shift Registers
UART
PLL
USB Controller
Ethernet Controller
Macro Library
3-V, 5-V Tolerant
Input Macrocells
3-V, 5-V Tolerant
Bi-Directional
Macrocells
Macrofunctions
Inputs
Inputs with Pull-Downs
Inputs with Pull-Ups PECL Inputs
I/O
PCI I/O
I/O with Pull-Downs
I/O with Pull-Ups
Oscillator
Macrocells
Gated Oscillators
Memory
Macrocells
CBA RAMs:
Single-Port RAMs (asynchronous or synchronous)
Dual-Port RAMs (asynchronous)
MSI
Macrofunctions
4-Bit Register/Latches
[1] Under development
Figure 3. Oki Macrocell and Macrofunction Library
Oki Semiconductor
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Macrocells for Driving Clock Trees
Oki offers H-clock-tree drivers that minimize clock skew. The advanced layout software uses dynamic
driver placement and sub-trunk allocation to optimize the clock-tree implementation for a particular circuit. Features of the H-clock-tree driver-macrocells include:
•
•
•
•
•
•
•
True RC back annotation of the clock network
Automatic fan-out balancing
Dynamic sub-trunk allocation
Single clock tree driver logic symbol
Automatic branch length minimization
Dynamic driver placement
Allows multiple clock trees
Clock
Figure 4. H-Clock-Tree Structure
8
Oki Semiconductor
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
OKI ADVANCED DESIGN CENTER CAD TOOLS
Oki’s advanced design center CAD tools include support for the following:
•
•
•
•
Floorplanning for front-end simulation, back-end layout control, and link to synthesis
Clock tree structures improve first-time silicon success by eliminating clock skew problems
JTAG Boundary scan support
Power calculation which predicts circuit power under simulation conditions to accurately model
package requirements (in development)
Table 1: CAD Design Tools
Platform
Operating System [1]
Vendor Software/Revision [1]
Description
Cadence
HP9000, 7xx
IBM RS6000
Sun® [2]
HP-UX
AIX
SunOS, Solaris
Composer™
Verilog™
Veritime™
Verifault™
Synergy™
Concept™ [3]
Leapfrog™
Design capture
Simulation
Timing analysis
Fault grading
Design synthesis
Design capture
VHDL simulation
IKOS
HP9000, 7xx,
Sun [2]
HP-UX, SunOS, Solaris
NSIM
Gemini/Voyager
Simulation
Mentor Graphics™
HP9000, 7xx
Sun [2]
HP-UX
SunOS, Solaris
IDEA™
QuickVHDL
QuickSim II™
QuickPath™
QuickFault™
QuickGrade™
AutoLogic™
DFT Advisor
Design capture
VHDL simulation
Logic simulation
Timing analysis
Fault grading
Fault grading
Design synthesis
Test synthesis
Synopsys
(Interface to Mentor
Graphics, VIEWLogic)
IBM RS6000
HP9000, 7xx
Sun [2]
AIX
HP-UX
SunOS, Solaris
Design Compiler™
HDL/VHDL Compiler™
Test Compiler™
VSS™
Compilation
Design synthesis
Test synthesis
VHDL simulation
Model Technology, Inc.
(MTI)
HP9000, 7xx
Sun [2]
PC
HP-UX
SunOS, Solaris.
Win95/NT™
V-System
VHDL Simulation
PC
Sun [2]
Windows™,
Windows NT™
SunOS, Solaris
Workview Office™
Powerview™
Vantage Optium
Motive
ViewSim™ with VSO
Design capture
Simulation
VHDL simulation
Timing analysis
Design synthesis
Simulation
Vendor
VIEWLogic
1. Contact Oki Application Engineering for current software versions.
2. Sun or Sun-compatible.
3. Sun and HP platform only.
Oki Semiconductor
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Design Process
The following figure illustrates the overall IC design process and shows the three main interface points
between external design houses and Oki ASIC Application Engineering.
Level 1 [5]
Schematics
VHDL/HDL Description
Test Vectors
Synthesis
CAE Front-End
LSF[2]
CDC [1]
Floorplanning
Floorplanning
Gate-Level Simulation
Level 2
Netlist Conversion
(EDIF 200)
Test Vector Conversion
(Oki TPL [4])
Scan Insertion (Optional)
TDC [3]
CDC [1]
Floorplanning
Pre-Layout Simulation
(Cadence Verilog)
Level 2.5 [5]
Fault Simulation [6]
( Zycad)
Layout
Oki Interface
Automatic Test
Pattern Generation
(Synopsys Test Compiler)
Verification
(Cadence DRACULA)
Post-Layout Simulation
(Cadence Verilog)
Level 3 [5]
Manufacturing
Prototype
Test Program
Conversion
[1]
[2]
[3]
[4]
[5]
[6]
Oki’s Circuit Data Check (CDC) program verifies logic design rules.
Oki’s Link to Synthesis Floorplanning (LSF) toolset transfers post-floorplanning timing for resynthesis.
Oki’s Test Data Check (TDC) program verifies test vector rules.
Oki’s Test Pattern Language (TPL).
Alternate Customer-Oki design interfaces available in addition to standard level 2.
Standard design process includes fault simulation.
Figure 5. Oki’s Design Process
10
Oki Semiconductor
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
Automatic Test Pattern Generation
Oki’s 0.35 µm ASIC technologies support Automatic Test Pattern Generation (ATPG) using full scanpath design techniques, including the following:
•
•
•
•
•
•
•
•
•
Increases fault coverage ≥95%
Uses Synopsys Test Compiler
Inserts scan structures automatically
Connects scan chains
Traces and reports scan chains
Checks for rule violations
Generates complete fault reports
Allows multiple scan chains
Supports vector compaction
ATPG methodology is described in detail in Oki’s 0.35 µm Scan Path Application Note.
Combinational Logic
A
FD1AS
Scan Data In
D
C
SD
SS
B
FD1AS
Q
QN
D
C
SD
SS
Q
Scan Data Out
QN
Scan Select
Figure 6. Full Scan Path Configuration
Floorplanning Design Flow
Oki offers three floorplanning tools for high-density ASIC design. The two main purposes for Oki’s floorplanning tool are to:
• Ensure conformance of critical circuit performance specifications
• Shorten overall design turnaround time (TAT)
The supported floorplanners are: Cadence DP3, Gambit GFP, and Oki’s internal floorplanner.
In a traditional design approach with synthesis tools, timing violations after prelayout simulation are
fixed by manual editing of the netlist. This process is difficult and time consuming. Also, there is no
physical cluster information provided in the synthesis tool, and so it is difficult to synthesize logic using
predicted interconnection delay due to wire length. Therefore, synthesis tools may create over-optimized
results.
To minimize these problems, Synopsys proposed a methodology called Links to Layout (LTL). Based on
this methodology, Oki developed an interface between Oki’s floorplanners and the Synopsys environment, called Link Synopsys to Floorplanner (LSF). Because not all Synopsys users have access to the Synopsys Floorplan Management tool, Oki developed the LSF system to support both users who can access
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
Synopsys Floorplan Management and users who do not have access to Synopsys Floorplan Management.
More information on OKI’s floorplanning capabilities is available in Oki’s Application Note, Using Oki’s
Floorplanner: Standalone Operation and Links to Synopsys.
Incremental
Optimization with
Physical Information
Initial Synthesis
HDL Entry
No
Constraints
Constraints Met?
Yes
Synthesis
Invoke Import on
Floorplanner
Constraints Met?
Gate Level
Netlist
(EDIF)
No
Incremental
Floorplan
Yes
Initial Floorplan
Oki RC
PDEF (Synopsys)
Wire Load Model (Synopsys)
Net Capacitance (Synopsys
Script (Synopsys)
Invoke Export on
Floorplanner
Invoke Delay
Delay
(SDF)
Load
Back-Annotation Files
Constraints Met?
No
= In Synopsys DC/DA
= In Floorplanner
Yes
Timing Optimization
To Simulation and P&R
Figure 7. LSF System Design Flow
12
Oki Semiconductor
PDEF
(Synopsis)
Gate Level
Netlist
(EDIF)
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
IEEE JTAG Boundary Scan Support
Boundary scan offers efficient board-level and chip-level testing capabilities. Benefits resulting from
incorporating boundary-scan logic into a design include:
•
•
•
•
•
•
Improved chip-level and board-level testing and failure diagnostic capabilities
Support for testing of components with limited probe access
Easy-to-maintain testability and system self-test capability with on-board software
Capability to fully isolate and test components on the scan path
Built-in test logic that can be activated and monitored
An optional Boundary Scan Identification (ID) Register
Oki’s boundary scan methodology meets the JTAG Boundary Scan standard, IEEE 1149.1-1990. Either the
customer or Oki can perform boundary-scan insertion. More information is available in Oki’s JTAG
Boundary Scan Application Note. (Contact the Oki Application Engineering Department for interface
options.)
Oki Semiconductor
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■ MSM13Q0000/14Q0000 ■ ––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––
PACKAGE OPTIONS
TQFP & LQFP Package Menu
Base Array
MSM...
TQFP
I/O Pads
[1]
LQFP
64
80
100
144
176
208
13Q/14Q0150
144
●
●
●
●
13Q/14Q0230
176
●
●
●
●
13Q/14Q0340
208
●
●
●
●
●
●
13Q/14Q0530
256
●
●
●
❍
●
13Q/14Q0840
320
13Q/14Q1020
352
●
●
❍
●
●
❍
●
●
Body Size (mm)
10 x 10
12 x 12
14 x 14
20 x 20
24 x 24
28 x 28
Lead Pitch (mm)
0.5
0.5
0.5
0.5
0.5
0.5
1. I/O Pads can be used for input, output, bi-directional, power, or ground.
● = Available now; ❍ = In development
PQFP Package Menu
Base Array
MSM...
PQFP (42 Alloy)
I/O Pads
[1]
128
PQFP (Cu-Alloy)
160
208
13Q/14Q0150
144
❍
13Q/14Q0230
176
❍
❍
13Q/14Q0340
208
●
●
13Q/14Q0530
256
●
●
●
13Q/14Q0840
320
●
●
●
13Q/14Q1020
352
240
❍
❍
●
●
❍
Body Size (mm)
28 x 28
28 x 28
28 x 28
32 x 32
Lead Pitch (mm)
0.80
0.65
0.50
0.50
1. I/O Pads can be used for input, output, bi-directional, power, or ground.
● = Available now; ❍ = In development
14
Oki Semiconductor
––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ■ MSM13Q0000/14Q0000 ■
BGA Package Menu
Base Array
MSM...
I/O Pads
[1]
256
352
13Q/14Q0150
144
13Q/14Q0230
176
●
13Q/14Q0340
208
●
13Q/14Q0530
256
●
13Q/14Q0840
320
●
●
13Q/14Q1020
352
●
●
Body Size (mm)
27 x 27
35 x 35
Ball Pitch (mm)
1.27
1.27
1. I/O Pads can be used for input, output, bi-directional, power, or ground.
● = Available now; ❍ = In development
Oki Semiconductor
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Oki Semiconductor
The information contained herein can change without notice owing to product and/or technical improvements.
Please make sure before using the product that the information you are referring to is up-to-date.
The outline of action and examples of application circuits described herein have been chosen as an explanation of the standard action
and performance of the product. When you actually plan to use the product, please ensure that the outside conditions are reflected in
the actual circuit and assembly designs.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect,
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When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges,
including but not limited to operating voltage, power dissipation, and operating temperature.
The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g.,office
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own expense, for export to another country.
Copyright 1999 Oki Semiconductor
Oki Semiconductor reserves the right to make changes in specifications at anytime and without notice. This information furnished by
Oki Semiconductor in this publication is believed to be accurate and reliable. However, no responsibility is assumed by Oki
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